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DE102010030966B4 - Electrically conductive connection between two contact surfaces - Google Patents

Electrically conductive connection between two contact surfaces Download PDF

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Publication number
DE102010030966B4
DE102010030966B4 DE102010030966A DE102010030966A DE102010030966B4 DE 102010030966 B4 DE102010030966 B4 DE 102010030966B4 DE 102010030966 A DE102010030966 A DE 102010030966A DE 102010030966 A DE102010030966 A DE 102010030966A DE 102010030966 B4 DE102010030966 B4 DE 102010030966B4
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Prior art keywords
contact surfaces
electrically conductive
conductive connection
metal
bonding
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DE102010030966A
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DE102010030966A1 (en
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Hans Rappl
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Vitesco Technologies GmbH
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Continental Automotive GmbH
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Priority to DE102010030966A priority Critical patent/DE102010030966B4/en
Priority to PCT/EP2011/060031 priority patent/WO2012004106A1/en
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    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
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    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Die Erfindung betrifft eine elektrisch leitende Verbindung zwischen zwei Kontaktflachen (1, 2) mittels eines durch Bonden mit den Kontaktflächen (1, 2) verbundenen Metalldrahtes oder Metallbandchens (4), wobei zumindest eines der mit den Kontaktflächen (1, 2) durch Bonden verbundenen Enden des Metalldrahtes (4) oder Metallbändchens zusätzlich mit der Kontaktflache (2; 8) verschweißt (11) ist.The invention relates to an electrically conductive connection between two contact surfaces (1, 2) by means of a metal wire or metal strip (4) connected by bonding to the contact surfaces (1, 2), at least one of which is connected to the contact surfaces (1, 2) by bonding The ends of the metal wire (4) or metal ribbon are additionally welded (11) to the contact surface (2; 8).

Description

Die Erfindung betrifft eine elektrisch leitende Verbindung zwischen zwei Kontaktflächen mittels eines durch Banden mit den Kontaktflächen verbundenen Metalldrahtes oder Metallbändchens.The invention relates to an electrically conductive connection between two contact surfaces by means of a band connected to the contact surfaces metal wire or metal strip.

Eine solche elektrisch leitende Verbindung ist beispielsweise aus der DE 10 2006 025 870 A1 bekannt. Dort werden zwei Kontaktflächen mittels eines aus mehreren Schichten aufgebauten metallischen Bandbändchens durch Banden miteinander verbunden.Such an electrically conductive connection is for example from the DE 10 2006 025 870 A1 known. There, two contact surfaces are connected to each other by means of a built-up of several layers of metallic tape ribbon by gangs.

Auch die DE 10 2006 025 867 A1 offenbart eine Bandverbindung zwischen zwei Kontaktflachen mit mindestens zwei Banddrähten sowie ein Verfahren zur Herstellung einer derartigen Bandverbindung. Dort sind die Bonddrahte übereinander angeordnet und leitend miteinander verbunden.Also the DE 10 2006 025 867 A1 discloses a band connection between two contact surfaces with at least two band wires and a method for producing such a band connection. There, the bonding wires are arranged one above the other and conductively connected together.

Die DE 10 2007 046 021 A1 offenbart eine Halbleiteranordnung mit einem Siliziumkörper mit einer ersten Oberfläche und einer zweiten Oberfläche und einer auf mindestens einer Oberfläche des Siliziumkörpers angeordneten mindestens 10 Mikrometer dicken Metallschicht.The DE 10 2007 046 021 A1 discloses a semiconductor device comprising a silicon body having a first surface and a second surface and a metal layer disposed on at least one surface of the silicon body at least 10 micrometers thick.

Bonden ist dabei eine seit langem bekannte Verbindungstechnik, bei der ein metallischer Draht oder ein metallisches Bändchen mittels Druck und Temperatur und/oder Ultraschall mit einer metallischen Kantaktfläche verschweißt wird. Um eine gut leitende und mechanisch stabile Verbindung herzustellen, ist es jedoch erforderlich, einerseits zueinander passende Materialien auszuwählen und andererseits für eine ausreichende Sauberkeit der Oberflächen der Materialien zu sorgen. Dies ist bei der Verbindung von Halbleiterchips mit Kontaktflächen zumeist kein Problem, da diese Fertigung in Reinräumen statt findet. Bei der Fertigung von Bauteilen oder Geräten der Leistungselektronik erfolgen jedoch viele Fertigungsschritte außerhalb von Reinräumen, so dass Kontaktoberflächen bereits verunreinigt sein können. Vor allem wenn zwei Schaltungsträger miteinander verbunden werden sollen, kommt es häufig vor, dass die Kontaktflächen des einen nicht zuverlässig bondbar sind.Bonding is a long-known connection technique, in which a metallic wire or a metal ribbon is welded by means of pressure and temperature and / or ultrasound with a metallic Kantaktfläche. In order to produce a good conductive and mechanically stable connection, however, it is necessary on the one hand to select matching materials and on the other hand to ensure sufficient cleanliness of the surfaces of the materials. This is usually not a problem in the connection of semiconductor chips with contact surfaces, since this production takes place in clean rooms. In the manufacture of components or devices of power electronics, however, many manufacturing steps outside of clean rooms, so that contact surfaces may already be contaminated. Especially when two circuit carriers are to be connected to each other, it often happens that the contact surfaces of one are not reliably bondable.

Die Aufgabe der Erfindung ist es, eine elektrisch leitende Verbindung anzugeben, die die Verbindung unterschiedlicher Kontaktflächen erlaubt und dabei trotzdem automatisiert und damit kostengünstig herzustellen ist.The object of the invention is to provide an electrically conductive connection that allows the connection of different contact surfaces while still being automated and thus inexpensive to manufacture.

Die Aufgabe wird bei einer gattungsgemäßen elektrisch leitenden Verbindung dadurch gelost, dass zumindest eines der mit den Kontaktflachen durch Bonden verbundenen Enden des Metalldrahtes oder Metallbandchens zusatzlich mit der Kontaktflache verschweißt ist.The object is achieved in a generic electrically conductive connection characterized in that at least one of the contact surfaces connected by bonding ends of the metal wire or Metallbandchens is additionally welded to the contact surface.

Durch den vorherigen Bondvorgang wird aufgrund nicht zueinander passender Materialien oder verschmutzte Oberflachen nur ein „Anheften” des Metalldrahtes oder Metallbändchens auf der Kontaktflache erzielt; diese Verbindung konnte jedoch nicht dauerhaft belastet werden. Durch den erfindungsgemaßen zusatzlichen Schweißvorgang wird jedoch eine gute elektrische und auch mechanisch stabile Verbindung erzielt.Due to the previous bonding process, due to mismatching materials or soiled surfaces, only a "sticking" of the metal wire or metal strip on the contact surface is achieved; However, this connection could not be permanently charged. By the additional welding process according to the invention, however, a good electrical and mechanically stable connection is achieved.

Sollte die zu verschweißende Kontaktflache relativ dünn sein, beispielsweise eine Kupferleiterbahn auf einem Printed-Circuit-Board (PCB), wird in vorteilhafter Weise auf dieser Kontaktfläche ein Metallplättchen angebracht, beispielsweise verlotet, auf das dann das Ende des Metalldrahtes oder Metallbandchens zunachst gebondet und anschließend geschweißt wird. Auch dieser Vorgang ist leicht automatisierbar, da das Metallplattchen beispielsweise zusammen mit zu platzierenden Halbleiter- oder sonstigen Bauteilen aufgebracht und verlotet werden kann.If the contact surface to be welded is relatively thin, for example, a copper conductor on a printed circuit board (PCB), a metal plate is advantageously mounted on this contact surface, for example, drowned, then first bonded to the end of the metal wire or Metallbandchens and then is welded. Also, this process is easy to automate, since the metal plate can be applied and soldered, for example, together with semiconductor or other components to be placed.

In vorteilhafter Weise wird insbesondere fur elektrisch leitende Verbindungen, die hohe Strome tragen mussen, ein zumindest einseitig mit Aluminium beschichtetes Kupferbandchen verwendet.Advantageously, in particular for electrically conductive compounds which have to carry high currents, a copper strip coated on at least one side with aluminum is used.

Um bei sich überkreuzender Anordnung solcher Metallbändchen einen elektrischen Kontakt zu vermeiden, ist in vorteilhafter Weise in einer Weiterbildung der Erfindung die den Kontaktflachen abgewandte Seite der Metallbändchen mit einer isolierenden Schicht versehen.In order to avoid an electrical contact with intersecting arrangement of such metal bands, in an embodiment of the invention, the side facing away from the contact surfaces of the metal strip is provided with an insulating layer in an advantageous manner.

Die Erfindung wird nachfolgend anhand von Figuren mit Hilfe von Ausführungsbeispielen naher beschrieben. Dabei zeigen:The invention will be described in more detail below with reference to figures with the aid of exemplary embodiments. Showing:

1 Die grundsatzliche Anordnung einer elektrisch leitenden Verbindung zwischen zwei Schaltungsträgern mittels einer Bondverbindung, 1 The basic arrangement of an electrically conductive connection between two circuit carriers by means of a bond connection,

2 In einem Ausschnitt die erfindungsgemaße Schweißverbindung und 2 In a section of the inventive welded joint and

3 Die Anordnung eines Metallplattchens auf einer dunnen Kontaktfläche. 3 The arrangement of a metal plate on a thin contact surface.

Die 1 zeigt einen ersten Schaltungstrager 1, von dem zu einem zweiten Schaltungsträger 2 eine elektrisch leitende Verbindung hergestellt ist. Auf dem ersten Schaltungsträger 1 ist beispielsweise ein elektrisches Bauteil 3 angeordnet sowie eine erste Kontaktfläche 12 vorgesehen. Der zweite Schaltungstrager 2 ist im dargestellten Beispiel metallisch ausgebildet. Zur Verbindung dient ein Bondbändchen 4, das im dargestellten Beispiel aus zwei Schichten aufgebaut ist, die durch eine strichpunktierte Linie angedeutet sind. Dabei ist die erste Schicht 5 beispielsweise aus Kupfer und die zweite Schicht 7 aus Aluminium, so dass durch das Kupfer einerseits eine hohe Stromtragfahigkeit und durch das Aluminium eine gute Bondbarkeit gegeben ist. Das Bondbandchen kann dabei den heute ublichen rechteckigen Querschnitt haben, jedoch sind beliebige Querschnitte, wie sie beispielsweise in der DE 10 2006 025 868 A1 offenbart sind, moglich. Außerdem ist die Erfindung statt mit einem Bondbändchen auch mit einem Bonddraht mit rundem Querschnitt realisierbar.The 1 shows a first circuit carrier 1 from which to a second circuit carrier 2 an electrically conductive connection is made. On the first circuit carrier 1 is for example an electrical component 3 arranged as well as a first contact surface 12 intended. The second circuit carrier 2 is metallic in the example shown. To connect a bond ribbon is used 4 , which is constructed in the illustrated example of two layers, which are indicated by a dashed line. Here is the first layer 5 for example, copper and the second layer 7 made of aluminum, so that on the one hand by the copper high current carrying capacity and by the aluminum good bondability is given. The Bondbandchen can have the usual square cross section today, but are any cross-sections, as for example in the DE 10 2006 025 868 A1 are possible. In addition, the invention can be realized with a bonding wire with a round cross-section instead of a bonding tape.

In der Leistungselektronik, wo hohe Strome fließen, wird zumeist ein massives Kupferband mit Abmessungen von beispielsweise 2 mm × 0,2 mm verwendet, wobei dieses Kupferband ein- oder auch zweiseitig mit Aluminium mit einer Schichtdicke von zum Beispiel 20 μm bis 40 μm beschichtet sein kann. Diese Beschichtung kann zum Beispiel durch Zusammenwalzen erzeugt werden. Ein solches beschichtetes Band hat den Vorteil, dass es fur das Βonden auf den ersten Schaltungstrager 1 optimal geeignet ist. Fur die Erfindung konnen auch mehrlagige Bandchen in Sandwich-Aufbau verwendet werden. Es können auch Bandchen mit Oberflachen verwendet werden, die zum Beispiel galvanisch oder chemisch aufgebracht sind. Hier sind Oberflachenschichten im Bereich von einigen 100 nm bis zu einigen Mikrometern möglich.In power electronics, where high currents flow, a massive copper strip with dimensions of, for example, 2 mm × 0.2 mm is usually used, this copper strip being coated on one or two sides with aluminum having a layer thickness of, for example, 20 μm to 40 μm can. This coating can be produced by, for example, co-rolling. Such a coated tape has the advantage of being suitable for the first circuit carrier 1 is optimally suitable. For the invention, multi-layered coils can be used in sandwich construction. It is also possible to use strips with surfaces which are applied, for example, galvanically or chemically. Here, surface layers in the range of a few 100 nm to a few micrometers are possible.

Da der zweite Schaltungstrager 2 gemaß 1 keine mechanisch stabile Verbindung mittels Bonden erlaubt, ist das Ende des Bonddrahtes- oder bandchens 4 lediglich durch einen Bondvorgang „angeheftet” und wird gemaß 2 in erfindungsgemaßer Weise durch einen Schweißvorgang fest mit dem Schaltungsträger 2 verbunden. 2 zeigt dabei kurze Schweißnähte 11, die die Kupferschicht 5 des Bondbändchens 4 mit dem Metall des zweiten Schaltungstragers 2 verbinden. Die Aluminiumschicht 7 wird dabei uberbrückt. Statt den kurzen Schweißnähten kann auch eine durchgehende Schweißnaht um die Kontaktstelle herumgeführt werden. Der Schweißvorgang kann durch Widerstandschweißen, Spaltelektrodenschweißen oder auch andere Schweißverfahren hergestellt werden. Besonders geeignet ist das Laserschweißen, da dabei vollautomatisch Schweißnahte in angepasster Form hergestellt werden konnen.Because the second circuit carrier 2 according to 1 no mechanically stable connection by means of bonding is allowed, is the end of the bonding wire or strip 4 only "tacked" by a bonding process and is gemaß 2 in a manner according to the invention by a welding process fixed to the circuit carrier 2 connected. 2 shows short welds 11 containing the copper layer 5 of the bond ribbon 4 with the metal of the second circuit carrier 2 connect. The aluminum layer 7 is bridged. Instead of the short welds, a continuous weld seam can also be guided around the contact point. The welding process can be produced by resistance welding, gap electrode welding or other welding methods. Laser welding is particularly suitable since it allows the fully automatic production of welded seams in an adapted form.

Fur den Fall, dass der zweite Schaltungstrager 2 nicht aus massivem Metall sondern beispielsweise als Printed-Circuit-Board mit darauf aufgebrachten Kupferleiterbahnen 8 ausgebildet ist, besteht die Gefahr, dass diese dünnen Kupferbahnen 8 einer Verschweißung mit einem darauf gebondeten Ende eines Kupferdrahtes oder Kupferbandchens 4 nicht standhalten wurden. In vorteilhafter Weise wird daher zunachst ein Metallplattchen 9 elektrisch leitend und mechanisch stabil auf der Leiterbahn 8 aufgebracht, beispielsweise verlotet. Das Ende des Metalldrahtes oder Metallbändchens 4 wird dann auf dem Metallplattchen 9 zunachst gebondet und dann verschweißt.In the event that the second circuit carrier 2 not of solid metal but, for example, as a printed circuit board with copper conductor tracks applied thereon 8th is formed, there is a risk that these thin copper tracks 8th a weld with a bonded end of a copper wire or Kupferbandchens 4 could not withstand. Advantageously, therefore, first a metal plate 9 electrically conductive and mechanically stable on the conductor track 8th applied, for example, drowned. The end of the metal wire or metal ribbon 4 will then be on the metal plate 9 initially bonded and then welded.

Die erfindungsgemaße elektrisch leitende Verbindung zwischen zwei Kontaktflachen ist automatisierbar, so dass auch bei großer Stuckzahl eine wirtschaftliche Herstellung moglich ist. Dabei kann die Qualität der Verbindung durch bekannte automatisierte Ablaufe sichergestellt werden, wobei keine speziellen Fertigungsvorrichtungen erforderlich sind, sondern auf allgemein verfugbare Vorrichtungen zurückgegriffen werden kann.The inventive electrically conductive connection between two contact surfaces can be automated so that an economical production is possible even with a large number of pieces. In this case, the quality of the connection can be ensured by known automated processes, with no special manufacturing devices are required, but can be used on generally available devices.

Claims (4)

Elektrisch leitende Verbindung zwischen zwei Kontaktflachen (1, 2) mittels eines durch Bonden mit den Kontaktflächen (1, 2) verbundenen Metalldrahtes oder Metallbandchens (4), dadurch gekennzeichnet, dass zumindest eines der mit den Kontaktflachen (1, 2) durch Bonden verbundenen Enden des Metalldrahtes (4) oder Metallbändchens zusätzlich mit der Kontaktfläche (2; 8) verschweißt (11) ist.Electrically conductive connection between two contact surfaces ( 1 . 2 ) by means of a bonding with the contact surfaces ( 1 . 2 ) connected metal wire or Metallbandchens ( 4 ), characterized in that at least one of the contact surfaces ( 1 . 2 ) connected by bonding ends of the metal wire ( 4 ) or Metallbändchens additionally with the contact surface ( 2 ; 8th ) welded ( 11 ). Elektrisch leitende Verbindung nach Anspruch 1, dadurch gekennzeichnet, dass zwischen zumindest einem Ende des Metalldrahtes oder Metallbandchens (4) und der entsprechenden Kontaktfläche (2; 8) ein Metallplattchen (9) angebracht ist.Electrically conductive connection according to claim 1, characterized in that between at least one end of the metal wire or Metallbandchens ( 4 ) and the corresponding contact surface ( 2 ; 8th ) a metal plate ( 9 ) is attached. Elektrisch leitende Verbindung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Metalldraht oder das Metallbandchen (4) mit Aluminium beschichtetem Kupfer gebildet ist.Electrically conductive connection according to claim 1 or 2, characterized in that the metal wire or the metal strip ( 4 ) is formed with aluminum coated copper. Elektrisch leitende Verbindung nach einem der vorhergehenden Anspruche, dadurch gekennzeichnet, dass bei Verwendung eines Metallbandchens (4) dieses einseitig mit einer Isolierschicht versehen ist.Electrically conductive connection according to one of the preceding claims, characterized in that when using a Metallbandchens ( 4 ) This is provided on one side with an insulating layer.
DE102010030966A 2010-07-06 2010-07-06 Electrically conductive connection between two contact surfaces Active DE102010030966B4 (en)

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