DE102017118945A1 - Arrangement for a label, system, method for producing an arrangement for a label and method for using such an arrangement - Google Patents

Abstract

An arrangement (1) for a label comprises a substrate layer (10) with a transponder and a carrier layer (30) which is designed to support the substrate layer (10). The assembly (1) further comprises a first adhesive layer (20) disposed between the substrate layer (10) and the carrier layer (30) such that the substrate layer (10) and the carrier layer (30) are adhesively coupled together. The assembly (1) further comprises a solvent-based second adhesive layer (40) disposed opposite to the first adhesive layer (20) on an underside (34) of the carrier layer (30) and by means of which the assembly (1) is coupleable to an article , The arrangement (1) further comprises a weakening structure (50), which is designed in a predetermined manner, so that an access (52) for a solvent to a predetermined region (32) of the carrier layer (30) is established so that the solvent is added to the carrier layer (30 ) and through the carrier layer (30) to the second adhesive layer (40), in order to alleviate an adhesive force of the second adhesive layer (40).

Description

The present invention relates to an arrangement for a label, which allows a simple and cost-effective manner easy detachment of an applied label. The present invention also relates to a system and method for making a label assembly and method of using such an assembly.

Labels offer in particular as a characterizing medium a variety of uses. For example, labels are used to identify vessels or documents to provide traceability and information about their contents. In the production of such a label cost-effective production and a simple way to handle and further processing are desirable.

It is therefore an object of the invention to provide an arrangement for a label that allows a simple and cost-effective manner easy detachment of an applied label.

The object is solved by the features of the independent claims. Advantageous embodiments are specified in the subclaims.

According to one embodiment of the invention, an arrangement for a label comprises a substrate layer which comprises a transponder which is arranged in or on the substrate layer and a carrier layer which is designed to carry the substrate layer. The assembly further comprises a first adhesive layer disposed between the substrate layer and the carrier layer such that the substrate layer and the carrier layer are adhesively coupled together. The assembly further comprises a solvent-based second adhesive layer disposed opposite to the first adhesive layer on an underside of the carrier layer and by means of which the device can be coupled to an article. Furthermore, the arrangement comprises a weakening structure, which is designed in a predetermined manner, so that an access for a solvent to a predetermined region of the carrier layer is established, so that the solvent can reach the carrier layer and through the carrier layer to the second adhesive layer, to provide an adhesive force pre-attenuate the second adhesive layer.

By means of the described arrangement, a label can be realized, which can be manufactured inexpensively and which allows a reliable hold on an object to be marked and easy detachment from this. Such an arrangement may, in particular, make it possible to form an easily removable archive label which, after being marked on or on a document, can be easily removed from it again with little residue, so that undesired damage or subsequent treatment of the pasted document can be avoided. In addition, such an arrangement can also be used in the field of vignette products.

Due to the established access of the predefined weakening structure, a solvent can reach the carrier layer and the second adhesive layer in a targeted manner in order to weaken the latter and to enable easy detachment of the label or the arrangement from an article adhered thereto.

A wetting of the second adhesive layer with a solvent takes place, in particular, from an upper side of the arrangement, which is remote from the adherend in relation to an applied state. For this purpose, the substrate layer and the first adhesive layer are permeable to the solvent due to the access of the weakening structure. Thus, by means of the described arrangement, it is not necessary to act on the second adhesive layer by lateral moistening or moistening from a lower side and thus by a part of the pasted article, and to allow detachment of the assembly from the article.

The second adhesive layer of the arrangement can be reactivated by wetting with a small amount of the solvent through the arrangement or the carrier layer so to speak from above, so that an undesired contact of the solvent with the pasted object is avoided or at least minimized. In this way, a gentle and rapid detachment of the arrangement can be realized and prevented, for example with respect to a paper-based document or a book, formation of an unsightly wavy structure of the document and / or further damage, such as cracking. In addition, due to the deliberately reduced adhesive force, less adhesive residues of the second adhesive layer remain on the previously marked article.

The solvent and the second adhesive layer are formed in particular coordinated with each other, so that a simple introduction of the solvent towards the second adhesive layer and a targeted weakening of the second adhesive layer are possible. The solvent may in particular be realized as water or comprise water as the primary solvent.

The substrate layer is formed, for example, as a continuous PET film, which comprises as a transponder a passive or active RFID chip with associated antenna, which allows easy reception and transmission of signals. Alternatively, the substrate layer may also be formed as an artificial paper element or the transponder comprising a chip and an associated antenna may be arranged directly on the carrier layer, so that according to such an embodiment no substrate layer would be required. Preferably, however, a substrate layer is provided on account of cost-effective and simple production, which is adhesively bonded permanently to the carrier layer by means of the first adhesive layer.

The carrier layer may in particular be formed as a paper element, which can be moistened by means of the predetermined solvent, so that it diffuses through the carrier layer to the second adhesive layer. In addition, the access of the weakening structure can also form a channel through the carrier layer in order to guide the solvent in targeted areas of the second adhesive layer. The second adhesive layer is solvent-based, so that it loses its adhesive force in contact with a suitable solvent or its adhesive force can be reduced specifically. In this case, the second adhesive layer may be formed so that it can be weakened controlled by means of a certain solvent or by means of various solvents in terms of their adhesive power.

The second adhesive layer is arranged, for example, over its entire surface on the underside of the carrier layer, which faces the adherend in relation to an applied state. The second adhesive layer can also be activated locally, so that, for example, by moistening a portion of the second adhesive layer, it is adhesively formed or activated, so that after application of the arrangement on an intended surface in the previously moistened portion forms a higher adhesive force than in adjacent not moistened areas. Advantageously, the access of the weakening structure is then adapted to the position of the portion which is likely to be adhesively activated to adhere the assembly. Alternatively, the second adhesive layer may be formed so that it only partially covers the underside of the carrier layer.

According to a particularly simple and inexpensive embodiment of the arrangement, the weakening structure comprises a recess of the first adhesive layer, which forms the access for the solvent to the carrier layer. Accordingly, the weakening structure can be realized by making the substrate layer and the first adhesive layer arranged on the carrier layer smaller, so that, for example, free, unhindered access to the carrier layer and the second adhesive layer is formed in an edge region. In other words, the carrier layer can be specifically designed to be larger in size in order to overhang in one or more predetermined sections over an edge of the substrate layer and the first adhesive layer and to form one or more accesses for the solvent.

In particular, the first adhesive layer may be applied or formed only partially underneath the substrate layer or above the carrier layer so that a free region is present on the top side of the carrier layer covered with the first adhesive layer. Such a free region can be realized, for example, by saving a strip of the first adhesive layer when the device or components for the device are produced, which in an applicatable state of the device at one edge of the upper side or centrally on the upper side of the carrier layer would be arranged.

The recess of the first adhesive layer, which forms the access of the weakening structure to the carrier layer, may be formed in an edge area of the arrangement or alternatively in an inner center area of the arrangement. In addition, the first adhesive layer may also have a plurality of recesses which form corresponding accesses to the carrier layer in the edge region and / or in the middle region of the arrangement for the solvent to be introduced.

According to a development of the arrangement, the recess of the first adhesive layer is covered by the substrate layer. For example, the recess in the edge region of the arrangement can be designed to be laterally exposed, so that the access to the carrier layer can be exposed by simply flipping or folding over an edge of the substrate layer. Alternatively or additionally, the recess may be formed in an inner central region and covered by the substrate layer. According to such an embodiment, the substrate layer can be selectively severed, for example slit, at the position covering the recess, and then partly folded away to release the access to the carrier layer for the solvent.

The substrate layer preferably has one or more perforations and / or crease lines in the one or more corresponding regions which are designed to release the access or access to the carrier layer. In this way, the corresponding sections of the substrate layer can be folded over easily and in a controlled manner, and a respective access can be reliably exposed.

According to one embodiment, the second adhesive layer is adapted to the solvent so that the adhesive force of the second adhesive layer can locally be attenuated by at least 50% by bringing the second adhesive layer into contact with the solvent. In this way, the adhesive force of the activated second adhesive layer can be substantially reduced in order to allow a simple, clean and low-resistance detachment of the label or the arrangement of the pasted article. In addition, a residue-free or at least a low-residue removal of the arrangement is thus contributed, so that no treatment of the article surface is required. The second adhesive layer may be weakened by the solvent depending on its adhesive force, so that the more solvent reactivates the second adhesive layer, the lower the adhesive force of the second adhesive layer and accordingly lighter and damage-free, the archive label or the arrangement again of the pasted article be solved.

According to a development of the arrangement, the access for the solvent extends through the substrate layer and through the first adhesive layer to the upper side of the carrier layer. In addition, the access may extend further through the carrier layer to or into the second adhesive layer. The access can thus be configured as a channel in order to guide the solvent controlled to a predetermined region of the carrier layer or the second adhesive layer. For example, such an access extends to the top of the carrier layer, so that the solvent can then moisten the carrier layer and diffuse through to the second adhesive layer.

According to a preferred development of the arrangement, the weakening structure has a punching or slitting which forms the access for the solvent to the carrier layer. Such a punching may extend in an edge and / or center region of the assembly through the substrate layer and the first adhesive layer to the carrier layer and allow for a simplified passage for the solvent. In particular, a plurality of punches or slits may be provided, which realize, for example, based on a plan view of the substrate layer, a lattice structure which extends through the respective layers.

Such an access or access structure, by means of which the solvent can reach the carrier layer and the second adhesive layer in a simplified manner, can be punctured, punched, perforated, cut and / or formed by means of path lasers.

According to a further development, the predetermined region of the carrier layer is preferably designed to be matched to an adhesively activatable region of the second adhesive layer, so that the solvent can be introduced in a targeted manner to the position or positions to the second adhesive layer, which are preferably activated to adhere the device.

A further aspect of the invention relates to a system comprising an article and an embodiment of the previously described arrangement for a label which is applied to a surface of the article by means of an adhesively activated region of the second adhesive layer. By means of the arrangement described in particular a label for use as an easily removable archive label can be realized, which is glued, for example, for identification on a file or a book cover. Due to the described easy detachability of the arrangement, such an archive label can be easily removed again from the file or the book and damage prevented or at least kept low.

Since the system comprises an applied embodiment of the arrangement described above, if applicable, properties and features described in connection with the arrangement are also disclosed for the system and vice versa.

A further aspect of the invention relates to a method for producing a device for a label, which comprises providing a substrate layer having a first adhesive layer and a transponder and providing a carrier layer, which is designed to support the substrate layer. The method further comprises arranging the substrate layer on an upper side of the carrier layer by means of the first adhesive layer such that the first adhesive layer is arranged between the substrate layer and the carrier layer and adhesively couples the substrate layer and the carrier layer to one another. The method further comprises providing a solvent-based second adhesive layer so that the second adhesive layer is disposed opposite to the first adhesive layer at a lower side of the carrier layer. In addition, the method includes forming a weakening structure and thereby establishing access for a solvent to a given area of the carrier layer so that the solvent can pass to the carrier layer and through the carrier layer to the second adhesive layer to pre-empt an adhesive force of the second adhesive layer ,

In particular, the method described realizes a corresponding manufacturing method of an embodiment of the arrangement described above, so that, if applicable, properties and features described in connection with the arrangement or the system are also disclosed for the method for producing the arrangement, and vice versa.

In the context of such a production method, the substrate layer and the first adhesive layer as well as the carrier layer and the second adhesive layer can be provided as prefabricated components of the arrangement and connected to one another in order to form a desired weakening structure in a targeted manner. In this case, the two components can be positioned relative to one another and arranged one above the other and optionally modified beforehand or subsequently in order to design one of the previously described embodiments of the arrangement. Alternatively, the described layers may be individually applied to each other and coupled together to realize a layered structure of the label assembly.

Forming the weakening structure may be performed in the context of providing the substrate layer with the first adhesive layer by forming or providing a recess of the first adhesive layer and thereby establishing access for the solvent to the carrier layer.

According to a development of the method, the formation of the attenuation structure is carried out subsequently to the respective provision of the substrate layer, the carrier layer and the second adhesive layer and subsequently to the arrangement of the substrate layer on the carrier layer and comprises forming a punching or slitting through the substrate layer and through the first Adhesive layer and thereby establishing an access for the solvent to the carrier layer. In this way, the layered structure of the arrangement arranged one on top of the other can be selectively severed in sections by means of punching and / or slitting in order to form one or more accesses for the solvent to the second adhesive layer.

In accordance with another aspect of the invention, a method of using any of the above described arrangements for a label applied to an article comprises providing a solvent for selectively attenuating an adhesive force of the second adhesive layer and introducing the solvent into the access of the weakening structure in that the solvent passes to the carrier layer and through the carrier layer to the second adhesive layer and attenuates the adhesive force of the second adhesive layer in a predetermined manner. As a result of the reduced adhesive force, the label or the arrangement can be detached in a low-resistance and controlled manner from the object provided with it.

In particular, the method described realizes a corresponding method of use of an embodiment of the arrangement described above, so that, if applicable, properties and features described in connection with the arrangement, the system or the manufacturing method are also disclosed for the method for using the arrangement, and vice versa.

According to a further development, the method for using one of the previously described arrangements prior to the introduction of the solvent into the access comprises exposing the access for the solvent by cutting through the substrate layer and / or folding over a portion of the substrate layer. In this way, an access covered by the substrate layer can be exposed in order to be able to introduce the solvent in a targeted manner. Such a procedure is particularly suitable for a partially formed first adhesive layer, which forms an access to the upper side of the carrier layer.

The severing or severing of the substrate layer can also be assisted by the fact that the substrate layer and the carrier layer are not glued to one another at a corner or edge area by means of the first adhesive layer, thereby realizing a kind of grip tab for simplified detachment of the label or the arrangement and Example of a use of tools to facilitate access with a scalpel.

A controlled release of an archive label with an embodiment of the assembly having a substrate covered with the access for the solvent can be carried out, for example, as follows: By means of a scalpel or a razor blade first the substrate layer can be separated in a predetermined or designated area and by then moistening the remaining archive label from the document pasted therewith. Here, the substrate layer with antenna and RFID chip is separated with the aim to expose the underlying support layer and form an easy access for the solvent.

In order not to damage the pasted document by an applied pull on the archive label, it may be beneficial to use the scalpel, the razor blade, a spatula or the carrier layer to hold another tool and to release the substrate layer from the carrier layer. After such a separation of the above-lying substrate layer, the remaining carrier layer is moistened from above, for example with a pipette. Subsequently, the applied solvent can be evenly distributed with a fine brush. In this case, for example, a relatively small amount of 0.25-0.5 ml is sufficient to achieve a sufficient weakening of the adhesive force of the second adhesive layer below the carrier layer.

The moisture permeates the remainder of the archive label or the carrier layer and reactivates the second adhesive layer on its underside. After a reaction time of, for example, 1-2 minutes, the remaining portion of the archive label can be carefully lifted off the document by means of a spatula or a similar instrument, so that a clean and damage-free final result can be achieved. Such a procedure represents a particularly gentle detachment method.

• 1A-1C ein Ausführungsbeispiel einer Anordnung für ein mehrlagiges Etikett,
• 2A-2C ein weiteres Ausführungsbeispiel der Anordnung für ein mehrlagiges Etikett,
• 3A-3D weitere Ausführungsbeispiele der Anordnung für ein mehrlagiges Etikett,
• 4A-4C ein weiteres Ausführungsbeispiel der Anordnung für ein mehrlagiges Etikett,
• 5 ein schematisches Ablaufdiagramm für ein Verfahren zum Herstellen der Anordnung für ein Etikett.

Embodiments of the invention are explained in more detail below with reference to the schematic drawings. Show it:

• 1A-1C an embodiment of an arrangement for a multilayer label,
• 2A-2C another embodiment of the arrangement for a multilayer label,
• 3A-3D further embodiments of the arrangement for a multilayer label,
• 4A-4C another embodiment of the arrangement for a multilayer label,
• 5 a schematic flow diagram of a method for producing the arrangement for a label.

Elements of the same construction or function are identified across the figures with the same reference numerals. For reasons of clarity, the illustrated elements may not be marked with reference numerals in all figures.

In the 1A to 1C is an embodiment of an arrangement 1 schematically illustrated for a multi-layer label, which is inexpensive to produce, can be reliably mounted on an object to be marked and also easy to remove again. For this purpose, the arrangement 1 a substrate layer 10 with a transponder and a carrier layer 30 on, to support the substrate layer 10 is trained. The transponder is designed, for example, as a passive or active RFID chip with an associated antenna structure, which in a substrate layer designed as a PET film 10 is arranged so that by means of the arrangement 1 an easily removable RFID tag is feasible.

The order 1 further comprises a first adhesive layer 20 between the substrate layer 10 and the carrier layer 30 is arranged so that the substrate layer 10 and the carrier layer 30 are adhesively coupled together. The order 1 also includes a solvent-based second adhesive layer 40 opposite to the first adhesive layer 20 at a bottom 34 the carrier layer 30 is arranged and by means of which the arrangement 1 can be coupled with an object. The order 1 further includes a weakening structure 50 , which is designed to give access 52 for a solvent to a given range 32 the carrier layer 30 is set so that the solvent to the carrier layer 30 and through the carrier layer 30 through to the second adhesive layer 40 can reach to an adhesive force of the second adhesive layer 40 to alleviate.

The weakening structure 50 is according to the in the 1A-1C illustrated embodiment of the arrangement 1 realized by that on the carrier layer 30 arranged substrate layer 10 and first adhesive layer 20 are designed smaller than the carrier layer with respect to a main extension plane 30 so that they extend over one edge of the substrate layer 10 and the first adhesive layer 20 extends beyond. Preferably, the layers described become 10 . 20 . 30 . 40 provided with corresponding geometries matched to each other, so that the arrangement 1 can be designed promptly and material-saving. Alternatively, the edge region of the carrier layer 30 be subsequently exposed, for example, predetermined portions of the substrate layer 10 and the first adhesive layer 20 be removed.

Due to the configuration of the arrangement 1 with the weakening structure 50 can be a solvent through the access 52 on a top 35 the carrier layer 30 be applied and through the carrier layer 30 to the second adhesive layer 40 diffuse and selectively weaken them in terms of their adhesive power (s. 1B) , For example, the adhesive force of the second adhesive layer 40 can be reduced by means of water as a solvent, which is applied in small quantities, the carrier layer 30 moistened and to the second layer of adhesive 40 arrives. The carrier layer 30 is formed in particular with respect to a controlled passage of the solvent and designed, for example, as a paper layer.

In particular, the one or more accesses 52 designed so that the solvent into a given area 32 the carrier layer 30 can reach which positionally preferred to activated areas 42 the second adhesive layer 40 arranged or formed. The second adhesive layer 40 is for example continuous at the bottom 34 trained and covered this completely. Alternatively, the second adhesive layer 40 the bottom 34 the carrier layer 30 even partially cover and be continuous or not continuous.

The activated areas 42 are for example for applying the arrangement 1 moistened with water on an object, so that they develop a higher adhesive force after application and drying than adjacent non-moistened areas. Thus, these portions are activated with respect to their adhesive force and can be reactivated by means of a suitable solvent, such as water. The second adhesive layer 40 Thus, it can be reactivated from above or, in other words, formulated from a direction that results in an applied state of the arrangement 1 turned away from the pasted object.

By means of the arrangement 1 For example, an easily removable archive label can be realized, which after marking on or on a document, such as a file or a book, easily and low residue of this is removable without causing unwanted moistening of the document and the associated damage or moistening as well as damage at least to keep low. Such an archive label can be easily and gently removed from the pasted object with a small amount of moisture of the solvent, so that formation of an undesirable wavy structure, which can be left behind, especially in paper-based articles in the use of too much moisture, is counteracted.

A lifting and detaching of the archive label can be done without additional aids, such as a spatula, and by the targeted weakening of the second layer of adhesive 40 before peeling off, it also contributes to less adhesive residue remaining on the pasted material. In addition, auxiliary tools, such as a brush, a spatula and / or a pair of tweezers can be advantageous for a particularly gentle detachment of the archive label, in order to be able to lift, grip and remove it with care. Thus, the use of the described arrangement allows 1 a simple, safe and quick detachment of a label from a pasted object and also prevents unwanted moisture from getting to the pasted object.

1C shows a plan view of the arrangement 1 according to the illustrated side views of the 1A and 1B and provides two accesses 52 to the carrier layer 30 in the form of a respective freely accessible strip. The substrate layer 10 and the underlying first adhesive layer 20 are designed smaller than the underlying carrier layer 30 , In other words, the carrier layer is formulated 30 predetermined larger or provided to at opposite edges over the substrate layer 10 and the first adhesive layer 20 extend out and two strip-shaped access 52 for the solvent form. Alternatively, the carrier layer 30 based on a rectangular structure only on one, on three or on all four sides with respect to the substrate layer 10 and the first adhesive layer 20 survive. In addition, the arrangement 1 also have a round or elliptical shape.

In the 2A-2C is another embodiment of a layer structure of the arrangement 1 shown in which the substrate layer 10 the first adhesive layer 20 covered. The opposite edges of the substrate layer 10 thus realize tack-free areas between the substrate layer 10 and the carrier layer 30 , According to such an embodiment, the substrate layer 10 for improved access to the solvent in the entrances 52 be folded up or folded at the appropriate positions. Optionally, the substrate layer 10 for a simplified folding away such sections at predetermined positions perforations or creases 12 on, which are configured adapted to the position of the transponder or the antenna structure and the RFID chip, in order not to adversely affect the corresponding signal functionality (s. 2C) , The folded edges of the substrate layer 10 Furthermore, each can serve as a grip tab, to further simplify the detachment of the bonded arrangement 1 contribute.

In the 3A-3D are further embodiments of the arrangement 1 in which the substrate layer 10 the first adhesive layer 20 covered and the first adhesive layer 20 Moreover, it is not continuous and only partially the top 35 the carrier layer 30 covered. The first adhesive layer 20 thus has a recess 22 which, for example, in the context of a manufacturing process is realized in that when applied to the first adhesive layer 20 associated adhesive is omitted a strip.

According to such an embodiment, the predetermined range 32 the carrier layer 30 covered for receiving the solvent and can by means of slitting the substrate layer 10 and folding away the separate ones Sections are exposed to access 52 release for the solvent (s. 3B) , The fold-up sections of the substrate layer 10 also form a respective tab, which leads to easier handling when detaching the bonded arrangement 1 contributes.

The default range 32 the carrier layer 30 and the recess 22 the first adhesive layer 20 are according to the embodiments in the 3A-3D formed on the inside and on the activated area 42 the second adhesive layer 40 Voted. The second adhesive layer 40 but can also be activated in outdoor areas. By means of the arrangement 1 Nevertheless, a targeted weakening of the adhesive force of the second adhesive layer 40 done to allow a much easier peeling off a pasted object.

3C illustrates a schematic plan view of the embodiment of the 3A and 3B and shows an inner area 16 the substrate layer 10 , which stripes between two outer areas 15 the substrate layer 10 is arranged. By cutting or cutting the inside area 16 can be the separate sections of the inner area 16 , for example along optionally provided fold lines 12 , be folded down, for easy and comfortable detachment of the label or the arrangement 1 prepare.

3D shows an alternative embodiment to that in 3C shown, in which the interior area 16 frame-like from the outer area 15 is surrounded. The interior area 16 has, for example, no antenna structure and an associated RFID chip and can be cut and unfolded in one or both longitudinal directions with respect to the illustrated rectangular configuration. Alternatively, the inner region may also have a round or elliptical shape. Are the lines 12 designed as perforations, the interior area 16 along the perforations 12 also pressed in and the remainder of the substrate layer 10 which is the outer area 15 forms, subtracted and removed, without the inner area 16 to cut or cut. The inner area 16 the substrate layer 10 or the recess 22 the first adhesive layer 20 thus realizes an internal tack-free area between the substrate layer 10 and the carrier layer 30 ,

In the 4A-4C is another embodiment of the arrangement 1 shown in which the substrate layer 10 , the first adhesive layer 20 , the backing layer 30 and the second adhesive layer 40 are formed continuously and each cover adjacent layers. The weakening structure 50 has according to such an embodiment of the arrangement 1 Punches, slits and / or perforations 18 on, each one access 52 or an access structure for the solvent to the second adhesive layer 40 form. Die cuts 18 can only through the substrate layer 10 and the first adhesive layer 20 be formed so that the solvent through the accesses 52 to the carrier layer 30 and through the carrier layer 30 to the second adhesive layer 40 can get. Alternatively, the punches can 18 as shown, also through the carrier layer 30 into the second adhesive layer 40 extend.

4C shows in a plan a possible embodiment of the punches or slits 18 , which in the form of a grid pattern as an internal punching surface in the inner area 16 are formed. Alternatively or additionally, also in the outer area 15 Punches or slits may be provided. In addition, the punches or slits 18 be formed with other punching or slot geometries, so that the substrate layer 10 and the first adhesive layer 20 permeable to the solvent to be introduced and at least one point of attack or access to the carrier layer 30 enable.

Due to such a weakening structure 50 with punches 18 that have one or more accesses 52 for the solvent to the second adhesive layer 40 can form the backing layer 30 also as a water- or solvent-impermeable layer, for example as a plastic film, be formed. The solvent then does not pass through the carrier layer by means of moisture 30 but is through the trained by punching or slitting access 52 to the second adhesive layer 40 guided.

The substrate layer 10 may be formed in particular as a PET film with a chip or transponder inlay, which by means of the first adhesive layer 20 permanently on the designed as a paper layer carrier layer 30 is glued. On the bottom 34 the paper layer 30 is the solvent-based second adhesive layer 40 applied, which for sticking the arrangement 1 can be activated on an object locally or over the entire surface. For easy removal, a suitable solvent is through the access 52 in the given area 32 the paper layer 30 introduced and diffused due to the paper layer 30 through and reactivates the activated areas 42 the second adhesive layer 40 ,

5 shows a schematic flow diagram for a method of manufacturing the device 1 , In a first step S1 become the substrate layer 10 with the transponder and the first layer of adhesive 20 provided. The first adhesive layer 20 has a given geometry optionally with a recess 22 on and together with the substrate layer 10 or later on an underside of the substrate layer 10 be applied. Alternatively, the first adhesive layer 20 on the top 35 the carrier layer 30 applied and then with the substrate layer 10 concealed.

In a further step S3 becomes the carrier layer 30 provided for supporting the substrate layer 10 is trained. In this case, the solvent-based second adhesive layer 40 together with the carrier layer 30 or later at the bottom 34 the carrier layer 30 be applied.

In a further step S5 the substrate layer is arranged 10 on the top 35 the carrier layer 30 by means of the first adhesive layer 20 so that the first layer of adhesive 20 between the substrate layer 10 and the carrier layer 30 is arranged and the substrate layer 10 and the carrier layer 30 glued together.

In a further step S7 becomes the weakening structure 50 trained and the one or more accesses 52 for the solvent to a given range 34 the carrier layer 30 set up so that the solvent to the carrier layer 30 and through the carrier layer 30 through to the second adhesive layer 40 can reach to an adhesive force of the second adhesive layer 40 to alleviate.

According to the embodiments according to 1A-3D can the weakening structure 50 in providing and / or arranging the layers 10 . 20 . 30 . 40 be formed on each other already predetermined, so that the step S7 does not necessarily represent its own separate process step, which is subsequently performed.

However, it is beneficial to have a separate, subsequent step S7 for forming the weakening structure 50 to carry out the embodiment according to the 4A-4C embody. For example, after the layers 10 . 20 . 30 . 40 , In each case individually or component-wise arranged on each other and were coupled to each other, by punching and / or slitting in a predetermined area a punching, slotting and / or perforation 18 through the respective layers 10 . 20 . 30 trained and thereby one or more accesses 52 for the solvent to the second adhesive layer 40 set up.

Alternatively, forming a punch 18 also in the context of providing the substrate layer 10 and the first adhesive layer 20 be performed, or these layers 10 . 20 already have such a punching or slotting 18 which can be used as an access structure for a suitable solvent. An additional punching of the carrier layer 30 and / or the second adhesive layer 40 can be made optional.

The order 1 is particularly suitable for the realization of an RFID tag in the execution of an easily removable archive label for archiving documents, such as books in a library. Such an RFID label has recesses in the center of the label, for example designed as punched holes 18 or perforations, on which a water access to the underside of the label towards the water-soluble second adhesive layer 40 facilitate and thus cause less destruction on a document pasted when removing the RFID tag.

LIST OF REFERENCE NUMBERS

1

arrangement

10

substrate layer

12

Fold line / perforation of the substrate layer

15

outer region of the substrate layer

16

inner region of the substrate layer

18

Punching / slitting the arrangement

20

first adhesive layer

22

Recess of the first adhesive layer

30

backing

32

predetermined area of the carrier layer

34

Bottom of the carrier layer

35

Top of the carrier layer

40

second adhesive layer

42

activated region of the second adhesive layer

50

weakening structure

52

Access of the weakening structure

S (i)

Steps of a method of making an arrangement for a label

Claims (16)

Arrangement (1) for a label, comprising: - a substrate layer (10) comprising a transponder disposed in or on the substrate layer (10), a carrier layer (30) adapted to support the substrate layer (10), a first adhesive layer (20) between the substrate layer (10) and the carrier layer (30), so that the substrate layer (10) and the carrier layer (30) are adhesively coupled to one another, - a solvent-based second adhesive layer (40) which is opposite to the first adhesive layer (20) is arranged on a lower side (34) of the carrier layer (30) and by means of which the arrangement (1) can be coupled to an object, and - a weakening structure (50) which is designed in a predetermined manner, so that an access (52) for a solvent a predetermined area (32) of the carrier layer (30) is set up so that the solvent can reach the carrier layer (30) and through the carrier layer (30) to the second adhesive layer (40), in order to alleviate an adhesive force of the second adhesive layer (40). Arrangement (1) according to Claim 1 in that the weakening structure (50) comprises a recess (22) of the first adhesive layer (20) which forms the access (52) for the solvent to the carrier layer (30). Arrangement (1) according to Claim 2 in which the recess (22) of the first adhesive layer (20) is formed in an edge region of the arrangement (1). Arrangement (1) according to Claim 2 or 3 in which the recess (22) of the first adhesive layer (20) is formed in a central region of the assembly (1). Arrangement (1) according to one of Claims 2 to 4 in which the recess (22) of the first adhesive layer (20) is covered by the substrate layer (10). Arrangement (1) according to one of Claims 1 to 5 in which the substrate layer (10) has one or more fold lines, punches and / or perforations (12) for releasing the access (52). Arrangement (1) according to one of Claims 1 to 6 in which the second adhesive layer (40) is adapted to the solvent such that the adhesive force of the second adhesive layer (40) can locally be attenuated by at least 50% by bringing the second adhesive layer (40) into contact with the solvent. Arrangement (1) according to one of Claims 1 to 7 in that the solvent access (52) extends through the substrate layer (10), through the first adhesive layer (20) and through the carrier layer (30) to the second adhesive layer (40). Arrangement (1) according to one of Claims 1 to 8th in that the weakening structure (50) comprises a punch or slot (18) forming the solvent access (52) to the carrier layer (30). Arrangement (1) according to one of Claims 1 to 9 in which the predetermined region (32) of the carrier layer (30) is designed in a coordinated manner to an adhesively activatable region (42) of the second adhesive layer (40). A system comprising: - an article, and - an assembly (1) for a label according to any one of Claims 1 to 10 which is applied by means of an adhesively activated region (42) of the second adhesive layer (40) on a surface of the article. A method of making a label assembly (1) comprising: Providing a substrate layer (10) with a first adhesive layer (20) and a transponder disposed in or on the substrate layer (10), Providing a carrier layer (30), which is designed to carry the substrate layer (10), - Arranging the substrate layer (10) on an upper side (35) of the carrier layer (30) by means of the first adhesive layer (20), so that the first adhesive layer (20) between the substrate layer (10) and the carrier layer (30) is arranged and the substrate layer (10) and the carrier layer (30) adhesively coupled together, - Providing a solvent-based second adhesive layer (40), so that the second adhesive layer (40) opposite to the first adhesive layer (20) on an underside (34) of the carrier layer (30) is arranged, and Forming a weakening structure (50) and thereby establishing a solvent access (52) to a predetermined region (32) of the carrier layer (30) such that the solvent reaches the carrier layer (30) and through the carrier layer (30) second adhesive layer (40) can pass, in order to alleviate an adhesive force of the second adhesive layer (40) predetermined. Method according to Claim 12 in which the forming of the weakening structure (50) is performed in the course of providing the substrate layer (10) with the first adhesive layer (20) and comprising: forming a recess (22) of the first adhesive layer (20) and thereby establishing the access (52 ) for the solvent to the carrier layer (30). Method according to Claim 12 or 13 in which forming the weakening structure (50) following the provision of the substrate layer (10), providing the carrier layer (30), arranging the substrate layer (10) on the carrier layer (30) and providing the second adhesive layer (40) and comprising: forming a punch or slot (18) through the substrate layer (10) and through the first adhesive layer (20), thereby establishing a solvent access (52) to the carrier layer (30). Method for using a device (1) for a label according to one of the Claims 1 to 10 applied to an article, comprising: providing a solvent for predetermined weakening of an adhesive force of the second adhesive layer (40), introducing the solvent into the access (52) of the weakening structure (50) so that the solvent is added to the carrier layer ( 30) and passes through the carrier layer (30) to the second adhesive layer (40), and thereby weakening the adhesive force of the second adhesive layer (40), and - detaching and removing the assembly (1) from the article. Method according to Claim 15 preceding the introduction of the solvent into the access (52), exposing the solvent access (52) by severing the substrate layer (10) and / or folding over a portion of the substrate layer (10).

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