DE102016116565A1 - Electronic device and its circuit module - Google Patents
Electronic device and its circuit module Download PDFInfo
- Publication number
- DE102016116565A1 DE102016116565A1 DE102016116565.4A DE102016116565A DE102016116565A1 DE 102016116565 A1 DE102016116565 A1 DE 102016116565A1 DE 102016116565 A DE102016116565 A DE 102016116565A DE 102016116565 A1 DE102016116565 A1 DE 102016116565A1
- Authority
- DE
- Germany
- Prior art keywords
- zone
- light
- translucent
- circuit module
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000004922 lacquer Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 2
- 239000003973 paint Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09936—Marks, inscriptions, etc. for information
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Planar Illumination Modules (AREA)
Abstract
Die Erfindung betrifft ein Schaltungsmodul, das umfasst: einen Hauptkörper (10), der ein Substratelement (20) und einen Leuchtbereich (30) aufweist, wobei das Substratelement ein Substrat (23) und eine erste Lackschicht (21) besitzt, wobei das Substrat (23) eine lichtdurchlässige Zone (230) und eine erste Fläche (231) besitzt, wobei sich die erste Lackschicht (21) auf der ersten Fläche (231) befindet und für die lichtdurchlässiger Zone (230) eine Lichtaustrittszone (210) besitzt, wobei das Licht des Leuchtbereichs (30) durch die Lichtaustrittszone (210) aus dem Schaltungsmodul (1) ausgestrahlt werden kann; und einen PCIe-Bus (40), der am Substratelement (20) angeordnet ist. Die Erfindung betrifft weiter eine elektronische Vorrichtung, die ein Gehäuse (50) aufweist, das die beiden gegenüberliegenden Seiten des Schaltungsmoduls (1) und mindestens den Leuchtbereich (30) abdeckt und entsprechend der Lichtaustrittszone (210) eine lichtdurchlässige Zone (51) besitzt, wobei das Licht aus der Lichtaustrittszone (210) durch die lichtdurchlässige Zone (51) ausgestrahlt werden kann. The invention relates to a circuit module, comprising: a main body (10) having a substrate element (20) and a luminous area (30), the substrate element having a substrate (23) and a first resist layer (21), the substrate ( 23) has a translucent zone (230) and a first face (231), the first resist layer (21) being located on the first face (231) and having a light exit zone (210) for the translucent zone (230) Light of the illuminated area (30) through the light exit zone (210) from the circuit module (1) can be emitted; and a PCIe bus (40) disposed on the substrate member (20). The invention further relates to an electronic device having a housing (50) which covers the two opposite sides of the circuit module (1) and at least the luminous area (30) and corresponding to the light exit zone (210) has a light transmitting zone (51) the light from the light exit zone (210) through the translucent zone (51) can be emitted.
Description
Technisches Gebiet Technical area
Die Erfindung betrifft eine elektronische Vorrichtung und deren Schaltungsmodul. The invention relates to an electronic device and its circuit module.
Stand der Technik State of the art
Aus der taiwanesischen Schrift
Durch den Lichtleiter, der die Leuchtdiode abdeckt, wird die Dicke vergrößert. Zudem werden die Herstellungskosten erhört. Through the light guide, which covers the LED, the thickness is increased. In addition, the production costs are answered.
Daher zielt der Erfinder darauf ab, eine elektronische Vorrichtung und deren Schaltungsmodul anzubieten, die die obengenannten Probleme lösen kann. Therefore, the inventor aims to provide an electronic device and its circuit module which can solve the above-mentioned problems.
Aufgabe der Erfindung Object of the invention
Der Erfindung liegt die Aufgabe zugrunde, eine elektronische Vorrichtung und deren Schaltungsmodul zu schaffen, die einen Lichtleiter nicht benötigt, wobei das Licht durch das Substrat und die Lichtaustrittszone der Lackschicht ausgestrahlt wird, wodurch die Dicke und die Herstellungskosten reduziert werden. The invention has for its object to provide an electronic device and its circuit module, which does not require a light guide, wherein the light is emitted through the substrate and the light exit zone of the lacquer layer, whereby the thickness and the manufacturing cost can be reduced.
Diese Aufgabe wird durch das erfindungsgemäße Schaltungsmodul gelöst, das umfasst: einen Hauptkörper, der ein Substratelement und einen Leuchtbereich aufweist, wobei das Substratelement ein Substrat und eine erste Lackschicht besitzt, wobei das Substrat eine lichtdurchlässige Zone und eine erste Fläche besitzt, wobei sich die erste Lackschicht auf der ersten Fläche befindet und für die lichtdurchlässiger Zone eine Lichtaustrittszone besitzt, wobei das Licht des Leuchtbereichs durch die Lichtaustrittszone aus dem Schaltungsmodul ausgestrahlt werden kann; und einen PCIe-Bus, der am Substratelement angeordnet ist. This object is achieved by the circuit module according to the invention, comprising: a main body having a substrate element and a luminous area, wherein the substrate element has a substrate and a first resist layer, wherein the substrate has a translucent zone and a first surface, wherein the first Paint layer is located on the first surface and has a light exit zone for the light-transmissive zone, wherein the light of the luminous area can be emitted through the light exit zone from the circuit module; and a PCIe bus disposed on the substrate element.
Diese Aufgabe wird durch die erfindungsgemäße elektronische Vorrichtung mit dem obengenannten Schaltungsmodul gelöst, die ein Gehäuse aufweist, das die beiden gegenüberliegenden Seiten des Schaltungsmoduls und mindestens den Leuchtbereich abdeckt und entsprechend der Lichtaustrittszone eine lichtdurchlässige Zone besitzt, wobei das Licht aus der Lichtaustrittszone durch die lichtdurchlässige Zone ausgestrahlt werden kann. This object is achieved by the electronic device according to the invention with the above-mentioned circuit module, which has a housing which covers the two opposite sides of the circuit module and at least the luminous area and corresponding to the light exit zone has a translucent zone, the light from the light exit zone through the translucent zone can be broadcast.
Kurze Beschreibung der Zeichnungen Brief description of the drawings
Wege zur Ausführung der Erfindung Ways to carry out the invention
Weitere Einzelheiten, Merkmale und Vorteile der Erfindung ergeben sich aus der nachfolgenden detaillierten Beschreibung in Verbindung mit den beigefügten Zeichnungen. Further details, features and advantages of the invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings.
Die
Der Hauptkörper
Das Substratelement
Im vorliegenden Ausführungsbeispiel sind die erste Lackschicht
Genauer gesagt, der Leuchtbereich
Die elektronische Vorrichtung
Das Gehäuse
Vorzugsweise weist das Gehäuse
Zusammenfassend ist festzustellen, dass die elektronische Vorrichtung und deren Schaltungsmodul einen zusätzlichen Lichtleiter nicht benötigt, wobei das Licht durch das Substrat und die lichtdurchlässige Zone der Lackschicht ausgestrahlt wird, wodurch die Dicke und die Herstellungskosten reduziert werden. In summary, it should be noted that the electronic device and its circuit module does not require an additional light guide, wherein the light is radiated through the substrate and the transparent zone of the lacquer layer, whereby the thickness and the manufacturing costs are reduced.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
- 1 1
- Schaltungsmodul circuit module
- 10 10
- Hauptkörper main body
- 20 20
- Substratelement substrate member
- 21 21
- erste Lackschicht first varnish layer
- 210 210
- Lichtaustrittszone Light emission zone
- 22 22
- zweite Lackschicht second lacquer layer
- 220 220
- Lichteintrittszone Light entry zone
- 23 23
- Substrat substratum
- 230 230
- lichtdurchlässige Zone translucent zone
- 231 231
- erste Fläche first surface
- 232 232
- zweite Fläche second surface
- 233 233
- elektronische Einheit electronic unit
- 30 30
- Leuchtbereich light area
- 31 31
- Leuchtdiode led
- 40 40
- PCIe-Bus PCIe bus
- 50 50
- Gehäuse casing
- 51 51
- lichtdurchlässige Zone translucent zone
- 52 52
- Reflexionsstruktur reflective structure
- 100 100
- elektronische Vorrichtung electronic device
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- TW 448772 [0002] TW 448772 [0002]
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104136193A TWI557358B (en) | 2015-11-03 | 2015-11-03 | Electronic device and circuit module thereof |
TW104136193 | 2015-11-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102016116565A1 true DE102016116565A1 (en) | 2017-05-04 |
Family
ID=56084716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102016116565.4A Withdrawn DE102016116565A1 (en) | 2015-11-03 | 2016-09-05 | Electronic device and its circuit module |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE102016116565A1 (en) |
GB (1) | GB2544139A (en) |
NL (1) | NL1042101B1 (en) |
TW (1) | TWI557358B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI652002B (en) * | 2018-01-30 | 2019-02-21 | 技嘉科技股份有限公司 | Light guide heat dissipation module and electronic device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10253420A1 (en) * | 2002-11-15 | 2004-06-03 | Honeywell B.V. | Printed circuit board with display element |
US7498521B2 (en) * | 2005-06-30 | 2009-03-03 | Intel Corporation | Method and apparatus for marking a printed circuit board |
DE102010012064A1 (en) * | 2010-03-19 | 2011-09-22 | R. Stahl Schaltgeräte GmbH | LED arrangement used for e.g. signal transmitter, has LED arranged on circuit board, such that optical axis of LED is directed towards to circuit board |
TW201326977A (en) * | 2011-12-20 | 2013-07-01 | Global Lighting Technologies | Lighting emitting apparatus and manufacturing method thereof |
TWM429955U (en) * | 2012-01-20 | 2012-05-21 | Zhen-Rong Guo | Light-emitting nameplate |
TWM508053U (en) * | 2015-05-12 | 2015-09-01 | Avexir Technologies Corp | Electric circuit module |
CN204667882U (en) * | 2015-05-14 | 2015-09-23 | 宇帷国际股份有限公司 | Solid state hard disc |
CN204629173U (en) * | 2015-05-21 | 2015-09-09 | 宇帷国际股份有限公司 | Circuit module |
TWI541821B (en) * | 2015-11-03 | 2016-07-11 | 宇帷國際股份有限公司 | Electronic device and dynamic random access memory thereof |
CN205122185U (en) * | 2015-11-11 | 2016-03-30 | 宇帷国际股份有限公司 | Electron device and developments random access memory body thereof |
CN205124038U (en) * | 2015-11-11 | 2016-03-30 | 宇帷国际股份有限公司 | Electronic device and circuit module thereof |
-
2015
- 2015-11-03 TW TW104136193A patent/TWI557358B/en not_active IP Right Cessation
-
2016
- 2016-08-03 GB GB1613351.4A patent/GB2544139A/en not_active Withdrawn
- 2016-09-05 DE DE102016116565.4A patent/DE102016116565A1/en not_active Withdrawn
- 2016-10-14 NL NL1042101A patent/NL1042101B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2544139A (en) | 2017-05-10 |
TW201608169A (en) | 2016-03-01 |
TWI557358B (en) | 2016-11-11 |
NL1042101A (en) | 2017-05-23 |
GB201613351D0 (en) | 2016-09-14 |
NL1042101B1 (en) | 2017-12-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |