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DE102004031888A1 - Semiconductor component with outer contacts (1) in the form of solder beads useful in semiconductor technology, e.g. for BGA-housings (ball-grid arrays) or as LBGA) housings (large small grid arrays) - Google Patents

Semiconductor component with outer contacts (1) in the form of solder beads useful in semiconductor technology, e.g. for BGA-housings (ball-grid arrays) or as LBGA) housings (large small grid arrays) Download PDF

Info

Publication number
DE102004031888A1
DE102004031888A1 DE102004031888A DE102004031888A DE102004031888A1 DE 102004031888 A1 DE102004031888 A1 DE 102004031888A1 DE 102004031888 A DE102004031888 A DE 102004031888A DE 102004031888 A DE102004031888 A DE 102004031888A DE 102004031888 A1 DE102004031888 A1 DE 102004031888A1
Authority
DE
Germany
Prior art keywords
housings
grid arrays
solder beads
lbga
bga
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102004031888A
Other languages
German (de)
Inventor
Manuel Carmona
Anton Legen
Ingo Wennemuth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE102004031888A priority Critical patent/DE102004031888A1/en
Publication of DE102004031888A1 publication Critical patent/DE102004031888A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09109—Locally detached layers, e.g. in multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

Semiconductor component with outer contacts (1) in the form of solder beads (2) including a housing with a semiconductor chip (3) and a wiring substrate (8), with the chip on its upper side and the solder beads on its lower side, where at least one of the solder beads is fixed to a flexible membrane (3), which covers an opening (4) with a suspended membrane region (5) and the flat extent of membrane region (5) is greater than the diameter of the solder bead fixed on it. An independent claim is included for production of the component as described above.
DE102004031888A 2004-06-30 2004-06-30 Semiconductor component with outer contacts (1) in the form of solder beads useful in semiconductor technology, e.g. for BGA-housings (ball-grid arrays) or as LBGA) housings (large small grid arrays) Ceased DE102004031888A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102004031888A DE102004031888A1 (en) 2004-06-30 2004-06-30 Semiconductor component with outer contacts (1) in the form of solder beads useful in semiconductor technology, e.g. for BGA-housings (ball-grid arrays) or as LBGA) housings (large small grid arrays)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004031888A DE102004031888A1 (en) 2004-06-30 2004-06-30 Semiconductor component with outer contacts (1) in the form of solder beads useful in semiconductor technology, e.g. for BGA-housings (ball-grid arrays) or as LBGA) housings (large small grid arrays)

Publications (1)

Publication Number Publication Date
DE102004031888A1 true DE102004031888A1 (en) 2005-10-20

Family

ID=35034189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004031888A Ceased DE102004031888A1 (en) 2004-06-30 2004-06-30 Semiconductor component with outer contacts (1) in the form of solder beads useful in semiconductor technology, e.g. for BGA-housings (ball-grid arrays) or as LBGA) housings (large small grid arrays)

Country Status (1)

Country Link
DE (1) DE102004031888A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009060029A1 (en) * 2007-11-08 2009-05-14 Commissariat A L'energie Atomique Electronic component with mechanically decoupled ball-type connections
EP2778119A3 (en) * 2013-03-12 2014-09-24 Robert Bosch Gmbh Sensor and method for the production of a flexible soldered joint between a sensor and a printed circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6050832A (en) * 1998-08-07 2000-04-18 Fujitsu Limited Chip and board stress relief interposer
US20020030288A1 (en) * 1998-03-23 2002-03-14 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020030288A1 (en) * 1998-03-23 2002-03-14 Seiko Epson Corporation Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
US6050832A (en) * 1998-08-07 2000-04-18 Fujitsu Limited Chip and board stress relief interposer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009060029A1 (en) * 2007-11-08 2009-05-14 Commissariat A L'energie Atomique Electronic component with mechanically decoupled ball-type connections
FR2923650A1 (en) * 2007-11-08 2009-05-15 Commissariat Energie Atomique ELECTRONIC COMPONENT WITH MECHANICALLY DECOUPLED BALL CONNECTIONS.
US8324695B2 (en) 2007-11-08 2012-12-04 Commissariat A L'energie Atomique Et Aux Energies Alternatives Electronic component with mechanically decoupled ball connections
EP2778119A3 (en) * 2013-03-12 2014-09-24 Robert Bosch Gmbh Sensor and method for the production of a flexible soldered joint between a sensor and a printed circuit board

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Legal Events

Date Code Title Description
OAV Applicant agreed to the publication of the unexamined application as to paragraph 31 lit. 2 z1
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection