DE102004034076A1 - Production device for an image receiving system comprises a receiving unit for a circuit board and a unit for relatively moving the circuit board with respect to a fixed housing - Google Patents
Production device for an image receiving system comprises a receiving unit for a circuit board and a unit for relatively moving the circuit board with respect to a fixed housing Download PDFInfo
- Publication number
- DE102004034076A1 DE102004034076A1 DE200410034076 DE102004034076A DE102004034076A1 DE 102004034076 A1 DE102004034076 A1 DE 102004034076A1 DE 200410034076 DE200410034076 DE 200410034076 DE 102004034076 A DE102004034076 A DE 102004034076A DE 102004034076 A1 DE102004034076 A1 DE 102004034076A1
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- Germany
- Prior art keywords
- circuit board
- image sensor
- modules
- rotary
- manufacturing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
Abstract
Description
Die Erfindung betrifft eine Fertigungsvorrichtung für ein Bildaufnahmesystem nach dem Oberbegriff des Anspruchs 1. Weiterhin betrifft die Erfindung ein Verfahren zur Fertigung eines Bildaufnahmesystems nach dem Oberbegriff des Anspruchs 8. Ein Bildaufnahmesystem der in Rede stehenden Art wird vorzugsweise in Kraftfahrzeugen eingesetzt, um Bilder des Fahrzeugumfelds zu gewinnen und, in Verbindung mit Assistenzsystemen, dem Fahrer die Führung des Fahrzeugs zu erleichtern. Ein derartiges Bildaufnahmesystem umfasst wenigstens einen Bildsensor und ein diesem Bildsensor zugeordnetes optisches System, das ein Aufnahmefeld des Fahrzeugumfelds auf den Bildsensor abbildet. Um eine optimale Abbildungsqualität zu gewährleisten, müssen der Bildsensor und das optische System genauestens aufeinander justiert seinThe The invention relates to a manufacturing apparatus for an image pickup system according to The preamble of claim 1. Furthermore, the invention relates to a Method for producing an image recording system according to the preamble of claim 8. An image capture system of the type in question is preferably used in motor vehicles to take pictures of the vehicle environment to win and, in conjunction with assistance systems, to the driver the leadership of the vehicle. Such an image acquisition system comprises at least one image sensor and an optical associated with this image sensor System, which is a recording field of the vehicle environment on the image sensor maps. To ensure optimal image quality, the Image sensor and the optical system precisely adjusted to each other be
Aus
der
Vorteile der ErfindungAdvantages of invention
Die vorliegende Erfindung schlägt eine Fertigungsvorrichtung vor, mittels der eine preiswerte Großserienfertigung eines gattungsgemäßen Bildaufnahmesystems unter Einhaltung einer hohen Justagepräzision ermöglicht wird. Die Erfindung geht von der Erkenntnis aus, dass eine preisgünstige Massenfertigung optisch hochwertiger Bildaufnahmesysteme dadurch erreichbar ist, dass ein Bildsensor zunächst auf einem Träger, insbesondere auf einer Leiterplatte befestigt, dann in Bezug auf ein ortsfest angeordnetes Gehäuse in eine optisch optimale Lage bewegt und dann in dieser Lage dauerhaft fixiert wird.The present invention proposes a manufacturing device before, by means of an inexpensive mass production a generic image recording system is made possible while maintaining a high Justagepräzision. The invention starts from the realization that a low-cost mass production optically high-quality image acquisition systems is achievable by having a Image sensor first on a carrier, in particular mounted on a printed circuit board, then in relation to a fixedly arranged housing moved into an optically optimal position and then permanently in this position is fixed.
Vorteilhaft erfolgt dabei die Bewegung des Bildsensors in einer Fertigungsvorrichtung, die miteinander gekoppelte Rotations- und Linearmodule umfasst.Advantageous the movement of the image sensor takes place in a manufacturing device, comprising the coupled rotary and linear modules.
In einer besonders vorteilhaften Fertigungsvorrichtung sind drei Linearmodule vorgesehen, die eine Bewegung der Leiterplatte bzw. des Bildsensors in drei Achsen eines rechtwinkligen Koordinatensystems ermöglichen. Zusätzlich umfasst die Fertigungsvorrichtung mehrere Rotationsmodule, die eine Rotation des Bildsensors ermöglichen.In A particularly advantageous manufacturing device are three linear modules provided, which is a movement of the circuit board or the image sensor in allow three axes of a rectangular coordinate system. additionally For example, the manufacturing apparatus includes a plurality of rotary modules that rotate allow the image sensor.
Besonders vorteilhaft sind die Rotations- und Linearmodule von einem Steuergerät steuerbar, das die Ausgangssignale des Bildsensors erfasst.Especially Advantageously, the rotary and linear modules are controllable by a control unit, which detects the output signals of the image sensor.
Weitere Vorteile ergeben sich aus der nachfolgenden Beschreibung von Ausführungsbeispielen mit Bezug auf die Figuren und aus den abhängigen Patentansprüchen.Further Advantages will become apparent from the following description of exemplary embodiments Reference to the figures and from the dependent claims.
Zeichnungdrawing
Die Erfindung wird nachstehend anhand der in der Zeichnung dargestellten Ausführungsformen näher erläutert.The Invention will be described below with reference to the drawing Embodiments explained in more detail.
Es zeigen:It demonstrate:
Beschreibung der Ausführungsbeispieledescription the embodiments
Nachfolgend werden eine Fertigungsvorrichtung für ein Bildaufnahmesystem und ein Verfahren zur Herstellung eines Bildaufnahmesystems beschrieben. Bildaufnahmesysteme, die für den automobilen Einsatz vorgesehen sind, müssen einerseits sehr robust, zugleich aber auch sehr genau sein. Gleichzeitig ist ein weiteres Kriterium, dass die Bildaufnahmesysteme preiswert sind. Hohe Genauigkeiten der Bildaufnahmesysteme können beispielsweise durch zusätzlichen Aufwand in der Konstruktion erreicht werden, wobei Stifte Anschlagkanten mit hochgenauen Maßhaltigkeiten die wesentlichen Lösungsmöglichkeiten darstellen. Die beschriebenen Lösungsmöglichkeiten sind im Allgemeinen mit erhöhten Kosten verbunden. Diese Kosten sind für den Vorgang der Montage notwendig, nicht aber für den Gebrauch der Bildaufnahmesysteme.following be a manufacturing device for an image capture system and A method of manufacturing an image pickup system is described. Image acquisition systems used for are intended for automotive use, on the one hand very robust, but at the same time be very precise. At the same time is another Criterion that the image acquisition systems are inexpensive. High accuracies the image acquisition systems can for example, by additional Effort can be achieved in the design, with pins stop edges with highly accurate dimensional accuracy the essential solutions represent. The described solutions are generally elevated with Costs connected. These costs are necessary for the assembly process not for the use of image acquisition systems.
Eine
Fertigungsvorrichtung
In
einer besonders zweckmäßigen weiteren Ausführungsvariante
der Fertigungsvorrichtung kann das durch Belastung besonders störanfällige Linearmodul
In
einer weiteren Ausführungsvariante (
- 11
- Vorrichtungcontraption
- 22
- Rotationsmodulrotation module
- 33
- Rotationsmodulrotation module
- 44
- Rotationsmodulrotation module
- 55
- Linearmodullinear module
- 66
- Linearmodullinear module
- 77
- Linearmodullinear module
- 88th
- Keilwedge
- 99
- Keilwedge
- 1010
- Aufnahmeeinrichtungrecording device
- 1111
- Leiterplattecircuit board
- 1212
- Gehäusecasing
- 1313
- Targettarget
- 1414
- Steuergerätcontrol unit
- 3030
- Fertigungsvorrichtungmanufacturing device
- 3131
- Rotationsmodulrotation module
- 3232
- Rotationsmodulrotation module
- 3333
- Rotationsmodulrotation module
- 3434
- Rotationsmodulrotation module
- 3535
- Linearmodullinear module
- 3636
- Linearmodullinear module
- 4141
- Rotationsmodulrotation module
- 4242
- Rotationsmodulrotation module
- Θ1Θ1
- Drehwinkelangle of rotation
- Θ2Θ2
- Drehwinkelangle of rotation
- Θ3Θ3
- Drehwinkelangle of rotation
- Θ4Θ4
- Drehwinkelangle of rotation
- Θ5Θ5
- Drehwinkelangle of rotation
- Θ6Θ6
- Drehwinkelangle of rotation
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410034076 DE102004034076A1 (en) | 2004-07-15 | 2004-07-15 | Production device for an image receiving system comprises a receiving unit for a circuit board and a unit for relatively moving the circuit board with respect to a fixed housing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200410034076 DE102004034076A1 (en) | 2004-07-15 | 2004-07-15 | Production device for an image receiving system comprises a receiving unit for a circuit board and a unit for relatively moving the circuit board with respect to a fixed housing |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102004034076A1 true DE102004034076A1 (en) | 2006-02-02 |
Family
ID=35530150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200410034076 Withdrawn DE102004034076A1 (en) | 2004-07-15 | 2004-07-15 | Production device for an image receiving system comprises a receiving unit for a circuit board and a unit for relatively moving the circuit board with respect to a fixed housing |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102004034076A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007051461A1 (en) * | 2007-10-27 | 2009-04-30 | Adc Automotive Distance Control Systems Gmbh | Method and device for mounting and adjusting an imaging unit |
-
2004
- 2004-07-15 DE DE200410034076 patent/DE102004034076A1/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007051461A1 (en) * | 2007-10-27 | 2009-04-30 | Adc Automotive Distance Control Systems Gmbh | Method and device for mounting and adjusting an imaging unit |
DE112008001917B4 (en) | 2007-10-27 | 2021-09-23 | Adc Automotive Distance Control Systems Gmbh | Method and device for assembling and adjusting an image pickup unit |
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Legal Events
Date | Code | Title | Description |
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R012 | Request for examination validly filed |
Effective date: 20110407 |
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R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20150203 |