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DE10125696A1 - Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections. - Google Patents

Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections.

Info

Publication number
DE10125696A1
DE10125696A1 DE10125696A DE10125696A DE10125696A1 DE 10125696 A1 DE10125696 A1 DE 10125696A1 DE 10125696 A DE10125696 A DE 10125696A DE 10125696 A DE10125696 A DE 10125696A DE 10125696 A1 DE10125696 A1 DE 10125696A1
Authority
DE
Germany
Prior art keywords
power semiconductor
semiconductor module
external electrical
external
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10125696A
Other languages
German (de)
Inventor
Roman Tschirbs
Manfred Loddenkoetter
Peter Wallmeier
Thilo Stolze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EUPEC GmbH
Original Assignee
EUPEC GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EUPEC GmbH filed Critical EUPEC GmbH
Priority to DE10125696A priority Critical patent/DE10125696A1/en
Publication of DE10125696A1 publication Critical patent/DE10125696A1/en
Ceased legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49175Parallel arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01068Erbium [Er]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1306Field-effect transistor [FET]
    • H01L2924/13091Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Several carrier elements (1-4) forming ceramic substrates support several semiconductor components (5-10) alongside logical components (12-14) all electrically interlinked via bonding wires (15). At right angles to the carrier elements there is a conductor board (20) and a board (21) supporting further electronic components (24,25). Strip conductors (35) run between internal (36) and external (38) sections of the conductor board.

Description

Die Erfindung liegt auf dem Gebiet der Leistungshalbleitermo­ dule, die meist mehrere verschaltete elektronische Bauelemen­ te, insbesondere aktive Leistungshalbleiterelemente, enthal­ ten. Die Erfindung betrifft ein Leistungshalbleitermodul mit mindestens einem aktiven Halbleiterbauelement und mit äußeren elektrischen Anschlüssen zur elektrischen Kontaktierung des Leistungshalbleitermoduls.The invention is in the field of power semiconductors dule, which is usually several interconnected electronic components te, in particular active power semiconductor elements, contain The invention relates to a power semiconductor module at least one active semiconductor component and with external electrical connections for electrical contacting of the Power semiconductor module.

Ein derartiges Leistungshalbleitermodul geht aus der DE 199 04 575 C1 hervor. Diese bekannte Leistungshalbleiter­ modul umfasst ein Halbleiterschaltelement, z. B. einen MOSFET. Das Halbleiterschaltelement und ggf. weitere Bauelemente, z. B. Steuerelemente oder Sensoren, sind mit Leitungen verbun­ den, die zum externen Anschluss des Moduls dienen und dazu Anschlusskontakte aufweisen.Such a power semiconductor module is based on the DE 199 04 575 C1. This well-known power semiconductor module comprises a semiconductor switching element, e.g. B. a MOSFET. The semiconductor switching element and possibly further components, z. B. controls or sensors are connected to lines those that are used for the external connection of the module and for this Have connection contacts.

Die externen Anschlüsse bzw. Anschlusskontakte bilden elekt­ rische Eingänge und Ausgänge, an die die zum Betrieb notwen­ digen Potentiale angelegt werden. An den Anschlusskontakten können Steuersignale, aber auch Nutzsignale mit hohen Leis­ tungen anliegen.The external connections or connection contacts form elect Inputs and outputs to which the necessary for operation potentials are created. At the connection contacts can control signals, but also useful signals with high leis concerns.

Als Anschlusskontakte werden üblicherweise metallische An­ schlüsse verwendet, die als Schraubverbindungen, Steckstift­ verbinder oder als Lötösen zum Einlöten ausgebildet sind. Diese Anschlussarten sind aufwendig.Metallic contacts are usually used as connection contacts conclusions used as screw connections, pin connector or are designed as solder lugs for soldering. These types of connections are complex.

Insbesondere bei sogenannten intelligenten Leistungshalblei­ termodulen ("Intelligent Power Modules"/IPM) sind ver­ gleichsweise viele externe Anschlüsse erforderlich. Diese müssen aber möglichst kompakt und kostengünstig realisiert werden.Especially in the case of so-called intelligent semi-power Term modules ("Intelligent Power Modules" / IPM) are ver  equally many external connections required. This but must be as compact and inexpensive as possible become.

Der vorliegenden Erfindung liegt daher die Aufgabe zugrunde, ein Leistungshalbleitermodul zu schaffen, das auch bei einer Vielzahl erforderlicher Anschlusskontakte kostengünstig her­ stellbar und einfach anschließbar ist.The present invention is therefore based on the object to create a power semiconductor module that also with a Large number of required connection contacts inexpensively is adjustable and easy to connect.

Diese Aufgabe wird erfindungsgemäß bei einem Halbleitermodul der eingangs genannten Art gelöst durch eine Leiterkarte, die mit einem internen Abschnitt innerhalb eines Modulgehäuses und mit einem externen Abschnitt außerhalb des Modulgehäuses verläuft und auf der sich Leiterbahnen befinden, die die äu­ ßeren elektrischen Anschlüsse bilden.This object is achieved according to the invention in a semiconductor module of the type mentioned solved by a circuit board that with an internal section within a module housing and with an external section outside the module housing runs and on which there are conductor tracks that the outer Make external electrical connections.

Ein erster wesentlicher Aspekt der vorliegenden Erfindung be­ steht damit darin, dass die elektrischen Anschlüsse als Lei­ terbahnen auf einer Leiterkarte oder Platine realisiert sind.A first essential aspect of the present invention be stands in that the electrical connections as Lei tracks on a printed circuit board or circuit board.

Der oben im Zusammenhang mit bekannten Leistungshalbleitermo­ dulen beschriebene Anschluss mittels Schraubverbindungen, Steckstiftverbindern oder Lötösen ist nicht mehr erforderlich und die Montage des Moduls damit wesentlich vereinfacht.The above in connection with known power semiconductors dulen described connection using screw connections, Pin connectors or solder lugs are no longer required and the assembly of the module is thus considerably simplified.

Der damit mögliche Verzicht auf derartige zusätzliche An­ schlusselemente reduziert die Kosten für das Leistungshalb­ leitermodul und verringert die Montagekosten sowie die Kosten für die zur Montage notwendigen Werkzeuge.The possible waiver of such additional contracts closing elements reduces the cost of performance module and reduces assembly costs and costs for the tools required for assembly.

Ein weiterer wesentlicher Vorteil der vorliegenden Erfindung besteht darin, dass die Leiterkarte eine sehr kompakte Bau­ weise bei dennoch hoher Anschlusskontaktdichte erlaubt. Another significant advantage of the present invention is that the circuit board is a very compact construction wisely allowed with a high connection contact density.  

Ferner kann eine notwendig werdende Änderung der Anschlussbe­ legung durch entsprechende Modifikation der Leiterbahnführung auf der Leiterkarte schnell und flexibel realisiert werden.Furthermore, a change in the connection through appropriate modification of the conductor track can be implemented quickly and flexibly on the circuit board.

Die Leiterbahnen bilden vorteilhafterweise mit ihren Enden auf dem externen Abschnitt die Anschlusskontakte. Der externe Abschnitt kann beim Anwender unmittelbar in die eigentliche Anwendungs- oder Systemplatine derart eingesteckt und/oder eingelötet werden, dass ein direkter Kontakt zwischen den leiterkartenseitigen Anschlusskontakten und den korrespondie­ renden Anschlüssen auf der Systemplatine entsteht.The conductor tracks advantageously form with their ends the connection contacts on the external section. The external The user can go straight to the actual section Application or system board plugged in and / or be soldered in that direct contact between the PCB-side connection contacts and the correspondie connections on the system board.

Die Anschlusskontaktdichte kann nach einer vorteilhaften Aus­ gestaltung der Erfindung dadurch weiter erhöht werden, dass die Leiterbahnen auf beiden Seiten der Leiterkarte ausgebil­ det sind. Ein weiterer Vorteil dieser Ausgestaltung der Er­ findung liegt darin, dass bei Verwendung beidseitig mit Lei­ terbahnen versehener Leiterkarten eine Potentialtrennung im Modulstecker realisierbar ist.The connection contact density can be according to an advantageous design of the invention can be further increased in that the conductor tracks on both sides of the circuit board det. Another advantage of this configuration of the Er is that when used on both sides with lei conductor tracks provided a potential separation in the Module connector is realizable.

Die Leiterkarte kann nach einer bevorzugten Weiterbildung der Erfindung in Doppelfunktion auch als Schaltungsträger zur in­ ternen Entflechtung von Leiterbahnen dienen, wenn der interne Abschnitt der Leiterkarte einen Entflechtungsbereich auf­ weist, in dem die Leiterbahnen entflochten sind.According to a preferred further development, the printed circuit board can Invention in double function as a circuit carrier for in internal unbundling of traces if the internal Section of the circuit board points in which the conductor tracks are unbundled.

Ein Ausführungsbeispiel der Erfindung wird nachfolgend anhand einer Zeichnung näher erläutert; es zeigen:An embodiment of the invention is described below a drawing explained in more detail; show it:

Fig. 1 ein Ausführungsbeispiel eines erfindungsgemäßen Leistungshalbleitermoduls ohne Gehäuse in perspek­ tivischer Ansicht und Fig. 1 shows an embodiment of a power semiconductor module according to the invention without a housing in a perspective view and

Fig. 2 ein komplettes Leistungshalbleitermodul in perspek­ tivischer Ansicht. Fig. 2 shows a complete power semiconductor module in perspective view.

Fig. 1 zeigt den inneren Aufbau mit wesentlichen Komponenten eines Leistungshalbleitermoduls, bevor die internen Komponen­ ten in einem weiteren Fertigungsschritt von einem Modulgehäu­ se umgeben worden sind (vgl. Fig. 2). Fig. 1 shows the internal structure with essential components of a power semiconductor module before the internal components have been surrounded by a module housing in a further manufacturing step (cf. FIG. 2).

Das Leistungshalbleitermodul umfasst mehrere Trägerelemente 1, 2, 3, 4, die aus Keramiksubstraten bestehen. Auf den Trä­ gerelementen sind mehrere Halbleiterbauelemente 5 bis 10 an­ geordnet. Daneben sind weitere, z. B. bei einem intelligenten Leistungshalbleitermodul ("Intelligent Power Modules"/IPM) erforderliche Logikbausteine 12, 13, 14 vorgesehen. Die Halb­ leiterbauelemente 5 bis 10 und die Logikbausteine 12, 13, 14 sind über nicht näher dargestellte Leiterbahnen und über Bonddrähte 15 untereinander elektrisch verbunden und ver­ schaltet.The power semiconductor module comprises a plurality of carrier elements 1 , 2 , 3 , 4 , which consist of ceramic substrates. On the Trä gerelemente several semiconductor devices 5 to 10 are arranged. In addition, other, e.g. B. in an intelligent power semiconductor module ("Intelligent Power Modules" / IPM) required logic modules 12 , 13 , 14 are provided. The semi-conductor components 5 to 10 and the logic modules 12 , 13 , 14 are electrically connected to one another via interconnects (not shown) and via bonding wires 15 and switches.

Rechtwinklig zu den Trägerelementen 1, 2, 3, 4 sind eine Lei­ terkarte 20 und eine Platine 21 angeordnet. Die Platine 21 trägt weitere elektronische Bauelemente 24, 25 und individu­ elle externe Anschlussstifte 26. Die Platine 21 ist über Bonddrähte 28 mit den Leiterbahnen auf den Trägerelementen 1, 2, 3, 4 verbunden.At right angles to the carrier elements 1 , 2 , 3 , 4 , a Lei terkarte 20 and a circuit board 21 are arranged. The circuit board 21 carries further electronic components 24 , 25 and individual external connecting pins 26 . The circuit board 21 is connected to the conductor tracks on the carrier elements 1 , 2 , 3 , 4 via bond wires 28 .

Die Leiterkarte 20 weist auf beiden Seiten 30, 31 nur andeu­ tungsweise dargestellte Leiterbahnen 35 auf. Die Leiterbahnen 35 verlaufen zwischen einem internen Abschnitt 36 und einem externen Abschnitt 38 der Leiterkarte 20. Die Leiterbahnen 35 enden im externen Abschnitt 38 an externen Anschlusskontakten 39. Im internen Abschnitt 36, der im fertiggestellten Halb­ leitermodul von einem Gehäuse umgeben ist, sind die Leiter­ bahnen 35 über Bonddrähte 40 mit den Halbleiterbauelementen 5 bis 10 bzw. den Leiterbahnen auf den Trägerelementen 1, 2, 3, 4 elektrisch verbunden. The printed circuit board 20 has on both sides 30, 31 only schematically illustrated conductor tracks 35 . The conductor tracks 35 run between an internal section 36 and an external section 38 of the printed circuit board 20 . The conductor tracks 35 end in the external section 38 at external connection contacts 39 . In the internal section 36 , which is surrounded by a housing in the finished semiconductor module, the conductor tracks 35 are electrically connected via bond wires 40 to the semiconductor components 5 to 10 or the conductor tracks on the carrier elements 1 , 2 , 3 , 4 .

Im internen Abschnitt 36 ist eine nicht näher dargestellte Entflechtungszone 42 vorgesehen, in der die Leiterbahnen so­ weit entflochten sind, dass eine gut separierte und dennoch möglichst dicht Führung der Leiterbahnen 35 zu dem externen Abschnitt 38 hin realisiert ist.Provided in the internal section 36 is an unbundling zone 42 ( not shown in more detail), in which the conductor tracks are braided to such an extent that the conductor tracks 35 are guided in a well-separated and yet as close a manner as possible to the external section 38 .

Fig. 2 zeigt ein komplettes erfindungsgemäßes Halbleitermo­ dul. Die in Fig. 1 im einzelnen dargestellten Komponenten sind unter Bildung eines Modulgehäuses 50 mit einem Kunst­ stoff umspritzt. Dabei ragen die individuellen externen An­ schlussstifte 26 und der externe Abschnitt 38 der Leiterkarte 20 senkrecht heraus. Der Abschnitt 38 mit den dort endenden externen Anschlusskontakten 39 kann beim Anwender unmittelbar in eine (hier nicht dargestellte) Anwendungs- oder Systempla­ tine derart eingesteckt und/oder eingelötet werden, dass ein direkter Kontakt zwischen den leiterkartenseitigen Anschluss­ kontakten und den korrespondierenden Anschlüssen auf der Sys­ templatine entsteht. Fig. 2 shows a complete semiconductor module according to the invention. The components shown in detail in FIG. 1 are molded with a plastic to form a module housing 50 . The individual external connection pins 26 and the external section 38 of the printed circuit board 20 protrude vertically. The section 38 with the external connection contacts 39 ending there can be plugged and / or soldered directly into an application or system board (not shown here) in such a way that a direct contact between the circuit card-side connection contacts and the corresponding connections on the sys templatine is created.

Mit Verwendung der Leiterkarte als externes Anschlusselement weist das Halbleitermodul eine kostengünstig herstellbare ex­ terne Kontaktierbarkeit auf, die einfach zu montieren ist und insbesondere eine hohe Anzahl von Anschlusskontakten und eine hohe Kontaktdichte realisiert. Using the circuit card as an external connection element the semiconductor module has an inexpensive to produce ex internal contactability, which is easy to assemble and especially a large number of connection contacts and one high contact density realized.  

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11

, .

22

, .

33

, .

44

Trägerelemente
support elements

55

, .

66

, .

77

, .

88th

, .

99

, .

1010

Halbleiterbauelemente
Semiconductor devices

1212

, .

1313

, .

1414

Logikbausteine
logic devices

1515

Bonddrähte
Bond wires

2020

Leiterkarte
PCB

2121

Platine
circuit board

2424

, .

2525

elektronische Bauelemente
Electronic Components

2626

Anschlussstifte
pins

2828

Bonddrähte
Bond wires

3030

, .

3131

Seiten
pages

3535

Leiterbahnen
conductor tracks

3636

interner Abschnitt
internal section

3838

externer Abschnitt
external section

3939

externe Anschlusskontakte
external connection contacts

4040

Bonddrähte
Bond wires

4242

Entflechtungszone
disengagement zone

5050

Modulgehäuse
module housing

Claims (4)

1. Leistungshalbleitermodul
mit mindestens einem aktiven Halbleiterbauelement (5 bis 10) und
mit äußeren elektrischen Anschlüssen zur elektrischen Kontaktierung des Leistungshalbleitermoduls,
gekennzeichnet durch
eine Leiterkarte (20),
die mit einem internen Abschnitt (36) innerhalb eines Modulgehäuses (50) und mit einem externen Abschnitt (38) außerhalb des Modulgehäuses (50) verläuft und
auf der sich Leiterbahnen (35) befinden, die die äußeren elektrischen Anschlüsse (39) bilden.
1. Power semiconductor module
with at least one active semiconductor component ( 5 to 10 ) and
with external electrical connections for electrical contacting of the power semiconductor module,
marked by
a printed circuit board ( 20 ),
which runs with an internal section ( 36 ) inside a module housing ( 50 ) and with an external section ( 38 ) outside the module housing ( 50 ) and
on which there are conductor tracks ( 35 ) which form the outer electrical connections ( 39 ).
2. Leistungshalbleitermodul nach Anspruch 1, dadurch gekennzeichnet, dass der externe Teil (38) der Leiterkarte (20) so ausge­ bildet ist, dass er in eine Systemplatine eingesteckt und/oder eingelötet werden kann.2. Power semiconductor module according to claim 1, characterized in that the external part ( 38 ) of the circuit board ( 20 ) is so formed that it can be inserted into a system board and / or soldered. 3. Leistungshalbleitermodul nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass Leiterbahnen (35) auf beiden Seiten (30, 31) der Leiterkarte (20) ausgebildet sind.3. Power semiconductor module according to claim 1 or 2, characterized in that conductor tracks ( 35 ) on both sides (30, 31) of the circuit card ( 20 ) are formed. 4. Leistungshalbleitermodul nach Anspruch 1, 2 oder 3, dadurch gekennzeichnet, der interne Abschnitt (36) der Leiterkarte (20) einen Ent­ flechtungsbereich (42) aufweist.4. Power semiconductor module according to claim 1, 2 or 3, characterized in that the internal section ( 36 ) of the circuit board ( 20 ) has a Ent braiding area ( 42 ).
DE10125696A 2001-05-25 2001-05-25 Power semiconductor module for making an external electrical connection has active semiconductor components and external electrical connections. Ceased DE10125696A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6802745B2 (en) * 2000-05-17 2004-10-12 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh & Co. Kg Housing for accomodating a power semiconductor module and contact element for use in the housing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19912441A1 (en) * 1999-03-19 2000-09-21 Elfo Ag Sachseln Sachseln Multi-chip module
DE19924994A1 (en) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Sandwich-structured intelligent power module for building into appliances includes a printed circuit board for a logical unit with a recess fitted with a power substrate on a cooling plate connected by a wire bonding technique.
DE19924991A1 (en) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Sandwich-structured intelligent power module for building into appliances includes a printed circuit board for a logical unit with a recess fitted with a power substrate on a cooling plate connected by a wire bonding technique.
DE19924993A1 (en) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Intelligent power module in sandwich construction

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19912441A1 (en) * 1999-03-19 2000-09-21 Elfo Ag Sachseln Sachseln Multi-chip module
DE19924994A1 (en) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Sandwich-structured intelligent power module for building into appliances includes a printed circuit board for a logical unit with a recess fitted with a power substrate on a cooling plate connected by a wire bonding technique.
DE19924991A1 (en) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Sandwich-structured intelligent power module for building into appliances includes a printed circuit board for a logical unit with a recess fitted with a power substrate on a cooling plate connected by a wire bonding technique.
DE19924993A1 (en) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Intelligent power module in sandwich construction

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6802745B2 (en) * 2000-05-17 2004-10-12 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh & Co. Kg Housing for accomodating a power semiconductor module and contact element for use in the housing

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