CN2519210Y

CN2519210Y - Semiconductor heat-exchanger

Info

Publication number: CN2519210Y
Application number: CN 01268637
Authority: CN
Inventors: 李洪
Original assignee: Individual
Current assignee: Individual
Priority date: 2001-11-27
Filing date: 2001-11-27
Publication date: 2002-10-30
Anticipated expiration: 2011-11-27

Abstract

The utility model which belongs to a combined device of heating and refrigeration equipment, in particular to an electricity-used refrigeration and heating equipment comprises a shell, semiconductor refrigeration reactors that the heating and refrigeration which id provided with semiconductor plates are respectively arranged at the same side, and the utility model is characterized in that more than one group of semiconductor refrigeration reactors are fixedly arranged in the shell side by side, and the opposite surface of the adjacent semiconductor refrigeration reactors is the same heat exchange surface, and two sides of each semiconductor refrigeration reactor is respectively provided with a heat exchange cavity with an input and output hole, and heat conduction plates are fixedly and staggeredly arranged in the heat exchange cavity, and the channels between the heat conduction plates are communicated with each other. The utility model has the advantages of high heat exchange efficiency and enabled long distance transportation.

Description

The semiconductor heat interchanger

Technical field the utility model belongs to the combined unit of heating and refrigeration plant, specifically is a kind of refrigeration, heating combined equipment of answering electricity consumption.

Background technology conventional semiconductor refrigerator, mostly be to discharge with radiator by the heat of heat transfer guide plate with the hot junction, cold junction directly discharges with blower fan, the patent No. as Patent Office of the People's Republic of China's bulletin on December 22nd, 1999 is 99230770.8, name is called the technology of electronics air-conditioner, it comprises casing, the air channel, it is characterized in that on the dividing plate at heat radiation air inlet place, road, setting up an air-blast device that links to each other with power supply and semiconductor refrigerator support, have additional 3～5 level semiconductor refrigerators on the support and link to each other with the cooling and warming circuit, its front is affixed on the support, the dividing plate in air channel is provided with 21 level semiconductor refrigerators and is unified into one group, semiconductor cooler group in respect of 3～7 groups, its front is affixed on the dividing plate and by the temperature conduction sheet and stretches in the air channel, the heat exchanger heat exchange area of this kind structure is limited, make conventional semiconductor refrigerator heat exchange efficiency low, be difficult to remote conveying.

A kind of semiconductor heat interchanger of summary of the invention, comprise by housing and by heating, freeze respectively that semiconductor chip constitutes at the semiconductor refrigerating heap of identical faces, it is characterized in that fixedly mounting side by side in the housing 1 group of above semiconductor refrigerating heap, adjacent semiconductor refrigerating heap opposite face is identical heat-transfer surface, the heat exchanging chamber that has manhole appendix is all installed in the both sides of every group of semiconductor refrigerating heap, the interior heat-conducting plate that fixedly is staggered of heat exchanging chamber, the passage that constitutes between the adjacent heat-conducting plate communicates.

Hard-wired side by side semiconductor refrigerating heap can be 2 groups, 3 groups, 4 groups or 5 groups in the described housing, also can increase arbitrarily according to actual needs or reduce.

It is low that this semiconductor heat interchanger has solved the heat exchange efficiency that exists in the prior art, and the problem that fed distance is short has the heat transfer rate height, can accumulation of energy and the advantage that can carry at a distance.

Description of drawings Fig. 1: the utility model example structure schematic diagram.

Fig. 2: semiconductor refrigerating pile structure schematic diagram.

The specific embodiment in use, semiconductor heat interchanger as shown in Figure 1 is connected in the heat-exchange system of prior art, after 4 energisings of semiconductor refrigerating heap, under the paltie effect effect, the face that heats 14 of semiconductor refrigerating

heap

4,10 temperature raise gradually, and its

opposite chill surface

9,11 temperature reduce gradually, because of

heating face

12,8 and

chill surface

9,11 the temperature difference can reach 70 ℃, so via through

holes

2,5 and 6 pass through flow through heat-conducting plate 3 in the heat exchanging chamber time, with semiconductor refrigerating heap 4 and heat-conducting plate 3 heat exchange takes place just, and from the through hole 13 of heat exchanging chamber opposite side, heating or cold heat transferring medium trickle respectively in 7 and 10, by pipeline these heat transferring mediums are transported to required place respectively again or equipment can use, so toward following multiple ring, promptly realized continuous refrigeration or heated, in addition, for strengthening the heat exchange effect of heat exchanger, also can be at the external coating heat-insulation layer 1 of heat exchanger.Be illustrated in figure 2 as semiconductor refrigerating pile structure schematic diagram, wherein between each semiconductor chip 14 by the insulation rubber cushion 15 of heat insulation and moisture-proof is installed closely, guarantee that with this semiconductor chip 14 can work normally, how much semiconductor refrigerating heap quantity is decided according to the actual requirements in the heat exchanger, can be 2 groups, 3 groups, 4 groups or 5 groups, also can be more groups.

Claims

1, a kind of semiconductor heat interchanger, comprise by housing and by heating, freeze respectively that semiconductor chip constitutes at the semiconductor refrigerating heap of identical faces, it is characterized in that fixedly mounting side by side in the housing 1 group of above semiconductor refrigerating heap, adjacent semiconductor refrigerating heap opposite face is identical heat-transfer surface, the heat exchanging chamber that has manhole appendix is all installed in the both sides of every group of semiconductor refrigerating heap, the interior heat-conducting plate that fixedly is staggered of heat exchanging chamber, the passage that constitutes between the adjacent heat-conducting plate communicates.

2, semiconductor heat interchanger according to claim 1 is characterized in that fixedly mounting side by side in the housing 2 groups semiconductor refrigerating heap.

3, semiconductor heat interchanger according to claim 1 is characterized in that fixedly mounting side by side in the housing 3 groups semiconductor refrigerating heap.

4, semiconductor heat interchanger according to claim 1 is characterized in that fixedly mounting side by side in the housing 4 groups semiconductor refrigerating heap.

5, semiconductor heat interchanger according to claim 1 is characterized in that fixedly mounting side by side in the housing 5 groups semiconductor refrigerating heap.