CN2572461Y - Pin fin type heat-pipe heat-sink - Google Patents
Pin fin type heat-pipe heat-sink Download PDFInfo
- Publication number
- CN2572461Y CN2572461Y CN 02276717 CN02276717U CN2572461Y CN 2572461 Y CN2572461 Y CN 2572461Y CN 02276717 CN02276717 CN 02276717 CN 02276717 U CN02276717 U CN 02276717U CN 2572461 Y CN2572461 Y CN 2572461Y
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- China
- Prior art keywords
- heat
- utility
- model
- tubesheet
- heat dissipating
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- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a needling type heat dissipating device with a heat pipe plate. The utility model is mainly composed of an installing plate on which a heat conducting bottom plate is inlaid and a heat pipe plate, on the wall of which a group of heat dissipating fin sheets are arranged in a lifting mode. A sealing cap fixedly connected with the top of the heat pipe panel is provided with a vacuum pumping nozzle, and heat conducting media arranged in a vacuum chamber rapidly sublimate after heated and are diffused in the vacuum chamber, so that the temperature difference of both ends of the heat pipe plate can be reduced farthest, and zero contact resistance with heat sources can be realized. With the integrative optimum design, the utility model can fully realize the heat dissipating effect of heat pipes and The has the advantages of simple structure, convenient installation and use, strong heat dissipating capacity, stable working performance and no mechanical vibration and noise pollution. The utility model is especially suitable for heat dissipating components of CPU chips of large and medium computer systems.
Description
Technical field:
The utility model relates to a kind of cooling heat radiator, specifically a kind of aculeus type heat tubesheet heat abstractor, and it is particularly suitable for the thermal component of computer system CPU chip, also can be applicable to make radiating appliance in the general heat-exchange device.
Background technology:
Computer system in the course of the work, its cpu chip can generate heat, when the temperature rise of cpu chip is too high, to influence computing machine normal and stable operation performance, also can cause the security incident that burns out computer equipment when serious, just present, be the serviceability of guaranteeing that computer system security is stable, to the cpu chip of heating is to adopt electric fan to force the processing of lowering the temperature of the mode of blowing cooling heat dissipation, though this mode also can be carried out radiating and cooling to cpu chip, but electric fan should consumed power in the course of work of blowing cooling heat dissipation, also can produce noise and vibration, the working environment of the computing machine that deteriorated significantly.Even more serious is, computing machine in the course of the work, if because certain imponderable factor generation cooling fan outage or physical damage are when quitting work, generally speaking, people also are difficult in time find, the temperature of the cpu chip of at this moment working can sharply rise, and the accident of scaling loss equipment can take place when serious.
Summary of the invention:
The utility model be propose on the basis of existing technology a kind of simple in structure, easy to install, strong and the stable work in work of heat-sinking capability, the aculeus type heat tubesheet heat abstractor that does not have machinery vibration and noise pollution during work, it mainly is made of installing plate and heat tubesheet, on the wall of heat tubesheet, gather to choose and be shaped on one group of aculeus type radiating fin, can increase the efficiently radiates heat area of heat tubesheet, it is characterized in that the conductive sole plate that is fixedly connected on the heat tubesheet bottom is flush-mounted in installing plate, the sealing cap that is fixedly connected on the heat tubesheet top has been done and has been vacuumized mouth, heat tubesheet is evacuated vacuumize mouth with silver-colored end socket behind the chamber and firmly seal, at the vacuum intracavitary unit heat-conducting medium is arranged, when installing and using, the conductive sole plate that is flush-mounted in installing plate is adjacent to cpu chip, the heat that is produced during cpu chip work is conducted to heat tubesheet by conductive sole plate, heat-conducting medium is heated and distils rapidly and fill the air in vacuum chamber, the heat that is produced in the time of cpu chip can being worked conducts to heat tubesheet top fast, can heat be distributed rapidly by one group of aculeus type radiating fin of the system of choosing of gathering on the whole tube sheet wall of heat tubesheet and take away.
Description of drawings:
Fig. 1 is a structural representation of the present utility model,
Fig. 2 is the A-A view of Fig. 1,
Fig. 3 is another embodiment of the present utility model,
Fig. 4 is the vertical view of Fig. 3.
Embodiment:
The aculeus type heat tubesheet heat abstractor that the utility model proposes, it mainly is made of installing plate 1 and heat tubesheet 4, on the wall of heat tubesheet 4, gather to choose and be shaped on one group of aculeus type radiating fin 8, the conductive sole plate 2 that is fixedly connected on heat tubesheet 4 bottoms is flush-mounted in installing plate 1, the sealing cap 5 that is fixedly connected on heat tubesheet 4 tops has been done and has been vacuumized mouth 7, heat tubesheet 4 and conductive sole plate 2 are to make with the high copper material of coefficient of heat conductivity or aluminium or stainless steel material, 3 backs, chamber that are evacuated in the heat tubesheet 4 will be vacuumized mouth 7 with silver-colored end socket 6 firmly seals, device has heat-conducting medium 9 in vacuum chamber 3, when installing and using, installing plate 1 is fixed on the body by hole 11 with screw, the conductive sole plate 2 that is flush-mounted in installing plate 1 is adjacent to cpu chip 10, the heat that is produced in cpu chip 10 courses of work is given heat tubesheet 4 by conductive sole plate 2 conduction, being installed on heat-conducting mediums 9 in the vacuum chamber 3 is heated and distils rapidly and fill the air in vacuum chamber 3, the heat that is produced in cpu chip 10 courses of work can be conducted to fast the top of heat tubesheet 4, can make the temperature difference of heat tubesheet 4 tops and bottom reach minimum value, can make the aculeus type radiating fin 8 on heat tubesheet 4 tops also have good heat-radiation effect, can heat be distributed rapidly by one group of aculeus type radiating fin 8 of the system of choosing of gathering on the whole tube sheet wall of heat tubesheet 4 and take away.The utility model can farthest reduce the temperature difference at heat tubesheet 4 two ends and realize and thermal source zero thermal contact resistance on structural design; this incorporate Optimal Structure Designing; can fully realize the heat pipe heat radiation effect; can guarantee that computing machine is under the situation of long time continuous working; the temperature stabilization of cpu chip 10 is below 40 ℃; have splendid cooling heat dissipation effect, be specially adapted in long-term non-stop-machine big-and-middle-sized computer system, install and use.
Claims (2)
1. aculeus type heat tubesheet heat abstractor, it mainly is made of installing plate (1) and heat tubesheet (4), on the wall of heat tubesheet (4), gather to choose and be shaped on one group of aculeus type radiating fin (8), the conductive sole plate (2) that it is characterized in that being fixedly connected on heat tubesheet (4) bottom is flush-mounted in installing plate (1), and the sealing cap (5) that is fixedly connected on heat tubesheet (4) top has been done and vacuumized mouth (7).
2. aculeus type heat tubesheet heat abstractor according to claim 1 is characterized in that device has heat-conducting medium (9) in the vacuum chamber (3) of heat tubesheet (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02276717 CN2572461Y (en) | 2002-10-08 | 2002-10-08 | Pin fin type heat-pipe heat-sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02276717 CN2572461Y (en) | 2002-10-08 | 2002-10-08 | Pin fin type heat-pipe heat-sink |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2572461Y true CN2572461Y (en) | 2003-09-10 |
Family
ID=33740517
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02276717 Expired - Fee Related CN2572461Y (en) | 2002-10-08 | 2002-10-08 | Pin fin type heat-pipe heat-sink |
Country Status (1)
Country | Link |
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CN (1) | CN2572461Y (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006122505A1 (en) * | 2005-05-18 | 2006-11-23 | Jen-Shyan Chen | Integrated circuit packaging and method of making the same |
US7948767B2 (en) | 2005-05-06 | 2011-05-24 | Neobulb Technologies, LLP. | Integrated circuit packaging structure and method of making the same |
CN102413662A (en) * | 2010-09-24 | 2012-04-11 | 富瑞精密组件(昆山)有限公司 | Heat sink for portable consumer electronic device |
CN103411458A (en) * | 2013-08-14 | 2013-11-27 | 特能传热科技(中山)有限公司 | Radiator with pulsating heat pipes |
-
2002
- 2002-10-08 CN CN 02276717 patent/CN2572461Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7948767B2 (en) | 2005-05-06 | 2011-05-24 | Neobulb Technologies, LLP. | Integrated circuit packaging structure and method of making the same |
WO2006122505A1 (en) * | 2005-05-18 | 2006-11-23 | Jen-Shyan Chen | Integrated circuit packaging and method of making the same |
JP2008541464A (en) * | 2005-05-18 | 2008-11-20 | ネオバルブ テクノロジーズ,インコーポレイテッド | Integrated circuit package structure and method of manufacturing the same |
CN102413662A (en) * | 2010-09-24 | 2012-04-11 | 富瑞精密组件(昆山)有限公司 | Heat sink for portable consumer electronic device |
CN102413662B (en) * | 2010-09-24 | 2015-12-16 | 富瑞精密组件(昆山)有限公司 | The heat abstractor of portable consumer electronic device |
CN103411458A (en) * | 2013-08-14 | 2013-11-27 | 特能传热科技(中山)有限公司 | Radiator with pulsating heat pipes |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |