CN221935803U - Clamp - Google Patents

Abstract

The present application provides a fixture for flip-chip bonding, comprising: the substrate comprises a bearing part and a limiting part, wherein the bearing part is used for placing a wafer, and a magnetic plate is buried in the bearing part; the first end of the limiting part is connected to the bearing part, and the limiting part is vertical to the surface of the bearing part; and the cover plate is detachably connected with the cover plate through the second end of the limiting part and is parallel to the bearing part, a plurality of openings matched with the size of the wafer are formed in the cover plate, the material of the cover plate comprises a magnetic conduction material, and the cover plate can move along the limiting part under the action of the magnetic force of the magnetic plate so as to clamp the wafer. The clamp provided by the application can clamp the wafer in flip-chip bonding, so that the problem of wafer warpage is avoided, and the occurrence of cold joint in bonding is avoided.

Description

Clamp

Technical Field

The application relates to the technical field of semiconductor manufacturing, in particular to a clamp.

Background

Referring to fig. 1 and 2, as the size of the Wafer 10 in flip Chip bonding (COW) is larger and larger, particularly when the package size (i.e., the size of the Wafer 10) exceeds 55x55mm, the Wafer 10 may have an edge warpage problem, which makes it impossible to contact the metal balls 30 (Bump) for bonding between the Wafer 10 and the Chip 20 with the wires (Pad) at the center of the Wafer 10 during high temperature reflow soldering, resulting in cold bonding.

The maximum package size of advanced package products is more than 102x102cm, and continues to increase, and at the same time, the number of layers of Ajinomoto enhancement film (ABF) on the surface of a large-sized wafer is generally more than ten, which further aggravates the warpage problem of the wafer.

Therefore, a fixture is needed that can clamp a wafer during flip-chip bonding to avoid wafer warpage.

Disclosure of utility model

The application aims to provide a clamp which can clamp a wafer in flip-chip bonding and avoid the problem of warping of the wafer.

An embodiment of the present application provides a fixture for flip-chip bonding, including: the substrate comprises a bearing part and a limiting part, wherein the bearing part is used for placing a wafer, and a magnetic plate is buried in the bearing part; the first end of the limiting part is connected to the bearing part, and the limiting part is vertical to the surface of the bearing part; and the cover plate is detachably connected with the cover plate through the second end of the limiting part and is parallel to the bearing part, a plurality of openings matched with the size of the wafer are formed in the cover plate, the material of the cover plate comprises a magnetic conduction material, and the cover plate can move along the limiting part under the action of the magnetic force of the magnetic plate so as to clamp the wafer.

In some embodiments, the cover plate is provided with a first through hole adapted to the limit portion.

In some embodiments, the magnetic induction intensity of the magnetic plate is greater than or equal to 0.7 to 1.0 dtex.

In some embodiments, the magnetic plate is provided with a second through hole penetrating the magnetic plate and matching the opening, and an area of the second through hole is less than or equal to an area of the opening.

In some embodiments, the material of the carrier includes at least one of stainless steel and stainless iron.

In some embodiments, the surface of the load bearing portion comprises a nickel coating.

In some embodiments, the number of the limiting parts is a plurality, and the plurality of the limiting parts are distributed in an array.

In some embodiments, the material of the cover plate comprises stainless iron.

In some embodiments, the opening is square in cross-section.

In some embodiments, the number of openings is a plurality, and the plurality of openings are distributed in a matrix.

The beneficial effects of the clamp provided by the embodiment of the application include but are not limited to the following:

The clamp provided by the embodiment of the application comprises the substrate and the cover plate, wherein the magnetic plate is embedded in the substrate, the cover plate is made of a magnetic conduction material, the cover plate and the substrate can clamp the edge of the wafer under the action of magnetic force, the phenomenon of edge tilting of the wafer is avoided, and therefore the phenomenon of cold joint in flip-chip welding of the wafer and the chip is avoided.

The size of the base plate and the size of the cover plate and the opening of the cover plate can be adapted according to the size and the number of the wafer, so that the welding of the polycrystalline wafer and the chip can be realized.

Drawings

The following drawings describe in detail exemplary embodiments disclosed in the present application. Wherein like reference numerals refer to like structure throughout the several views of the drawings. Those of ordinary skill in the art will understand that these embodiments are non-limiting, exemplary embodiments, and that the drawings are for illustration and description only and are not intended to limit the scope of the application, as other embodiments may equally well accomplish the inventive intent in this disclosure. It should be understood that the drawings are not to scale.

Wherein:

FIG. 1 is a schematic diagram of a flip-chip bonding configuration;

FIG. 2 is an enlarged view of the square frame area of FIG. 1;

FIG. 3 is a schematic illustration of a structure of a clamp according to some embodiments of the application;

FIG. 4 is a schematic view of a structure of a substrate according to some embodiments of the application;

FIG. 5 is a schematic view of a cover plate according to some embodiments of the application;

FIG. 6 is a schematic view of a clamp according to further embodiments of the present application;

FIG. 7 is a schematic view of a substrate according to other embodiments of the present application; and

Fig. 8 is a schematic structural view of a cover plate according to other embodiments of the present application.

Detailed Description

The following description provides specific applications and requirements of the application to enable any person skilled in the art to make and use the application. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the application. Thus, the present application is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the claims.

The present application provides a fixture for flip-chip bonding, comprising: the substrate comprises a bearing part and a limiting part, wherein the bearing part is used for placing a wafer, and a magnetic plate is buried in the bearing part; the first end of the limiting part is connected to the bearing part, and the limiting part is vertical to the surface of the bearing part; and the cover plate is detachably connected with the cover plate through the second end of the limiting part and is parallel to the bearing part, a plurality of openings matched with the size of the wafer are formed in the cover plate, the material of the cover plate comprises a magnetic conduction material, and the cover plate can move along the limiting part under the action of the magnetic force of the magnetic plate so as to clamp the wafer.

According to the clamp provided by the application, the wafer is arranged between the base and the cover plate, and the edge of the wafer is clamped through magnetic force, so that the phenomenon that the wafer is warped and the virtual welding between the wafer and the chip is influenced is avoided.

The jig provided by the present application will be described in detail with reference to the examples and drawings.

Referring to fig. 3 to 8, the present application provides a jig including a substrate 100 and a cover plate 200, the substrate 100 and the cover plate 200 being capable of clamping a wafer 10 disposed between the substrate 100 and the cover plate 200 by a magnetic force. Wherein, define X direction as length direction, Y direction is width direction; and the Z direction is the thickness direction.

In some embodiments, the substrate 100 includes a carrier 101, and the carrier 101 is used for placing the wafer 10.

In some embodiments, the material of the bearing part 101 may be at least one of stainless steel and stainless iron, and the material of the bearing part 101 may withstand the high temperature in flip-chip bonding.

In some embodiments, the surface of the carrier 101 includes a nickel coating to avoid oxidation of the surface of the carrier 101 during reverse welding.

In some embodiments, the bearing portion 101 is any one of a cuboid, a cube, a cylinder, or an irregular body. Preferably, the bearing portion 101 is a cuboid. The size of the carrying portion 101 is adapted to the size and number of the wafers 10. In some embodiments, the length of the bearing portion 101 is 60 mm or more; the width of the bearing part 101 is greater than or equal to 60 mm; and the thickness of the bearing part 101 is 5mm to 10mm. In some embodiments, the carrier 101 is 60 mm, 80 mm, 160 mm, or 320 mm in length. In some embodiments, the carrier 101 has a width of 60 mm, 75 mm, 80 mm, or 150 mm. In some embodiments, the thickness of the bearing portion 101 is 5mm to 10mm, and in some embodiments, the length of the bearing portion 101 is 320 mm; the width is 150 mm.

In some embodiments, a magnetic plate 102 is embedded in the carrier 101, and the magnetic plate 102 can move the cover plate 200 toward the substrate 100 by magnetic force, so as to clamp the wafer 10 disposed between the cover plate 200 and the substrate 100.

In some embodiments, the magnetic induction intensity of the magnetic plate 102 is greater than or equal to 0.7 to 1.0 dtex. To provide sufficient magnetic force to clamp the wafer 10.

In some embodiments, the material of the magnetic plate 102 includes alnico magnets. The alnico magnet has good high temperature resistance and can keep magnetism in the flip-chip welding process.

In some embodiments, the magnetic plate 102 is any one of a cuboid, a cube, a cylinder, or an irregularity. In some embodiments, the magnetic plate 102 is a cuboid. The size of the magnetic plates 102 is adapted to the size and number of the wafers 10. In some embodiments, the length of the magnetic plate 102 is 55 mm or more; the width of the magnetic plate 102 is 55 mm or more; and the thickness of the magnetic plate 102 is 5 to 10mm. In some embodiments, the magnetic plate 102 is 55 mm, 75 mm, 150 mm, or 300 mm long. In some embodiments, the magnetic plate 102 is 55 mm, 60 mm, 75 mm, or 140 mm long. In some embodiments, the magnetic plate 102 has a length of 55 mm and a width of 55 mm, which are the same as the length and width of the wafer 10.

In some embodiments, the distance between the top surface of the magnetic plate 102 and the top surface of the bearing portion 101 is 3-10 mm.

In some embodiments, the magnetic plate 102 is provided with a second through hole 102a penetrating the magnetic plate 102, the cross-sectional area of the second through hole 102a being smaller than the cross-sectional area of the wafer 10, such that the magnetic plate 102 is present below the edge region of the wafer 10.

The number of second through holes 102a is adapted to the number of wafers 10. In some embodiments, referring to fig. 4, the number of second through holes 102a is one. In some embodiments, the number of the second through holes 102a is plural, and the plural second through holes 102a are distributed in an array. In some embodiments, the number of second through holes 102a is 2, 4, 6, or 8. In some embodiments, referring to fig. 7, the number of second through holes 102a is 8.

In some embodiments, the cross-section of the second through hole 102a is circular, rectangular, or square. In some embodiments, the second through hole 102a is square in cross-section. In some embodiments, the second through hole 102a is 32 mm, 33 mm, 66 mm, or 99 mm long. In some embodiments, the second via 102a has a width of 32 mm, 33 mm, 66 mm, or 99 mm. In some embodiments, the second via 102a has a length of 33 mm and the second via 102a has a width of 33 mm.

The substrate 100 provided by the embodiment of the application further includes a limiting portion 103, wherein a first end of the limiting portion 103 is connected to the bearing portion 101, and the limiting portion 103 is perpendicular to the surface of the bearing portion 101. The limiting portion 103 may enable the cover plate 200 to cover the carrier 101 in parallel to the carrier 101, so as to clamp the wafer 10 disposed between the carrier 101 and the cover plate 200.

The number of the limiting parts 103 is not limited, and the cover 200 may be limited. In some embodiments, the number of the limiting parts 103 is one. In some embodiments, the number of the limiting portions 103 is a plurality, and a plurality of the limiting portions 103 are distributed in an array, and in some embodiments, the spacing between adjacent limiting portions 103 is 50 mm, 55.3 mm, 60 mm, or 63 mm. In some embodiments, the spacing between adjacent limit stops 103 is 55.3 mm.

The shape of the limiting portion 103 is not limited, and the cover 200 may be limited. In some embodiments, the limiting portion 103 may be a cylinder, a cuboid, a cube, or an irregular shape. In some embodiments, the limiting portion 103 is a cylinder, the diameter of the limiting portion 103 is 2-5 mm, and the width of the limiting portion 103 is 2-5 mm.

In some embodiments, the limiting portion 103 is integrally formed with the bearing portion 101.

The cover 200 provided in the embodiment of the present application is detachably connected to the cover 200 through the second end of the limiting portion 103 and parallel to the carrying portion 101, the material of the cover 200 includes a magnetically permeable material, and the cover 200 can move along the limiting portion 103 under the action of the magnetic force of the magnetic plate 102, so as to clamp the wafer 10.

In some embodiments, the material of the cover plate 200 includes stainless iron. The stainless iron has good magnetic permeability, so that the cover plate 200 can move along the limiting portion 103 under the magnetic force of the magnetic plate 102.

In some embodiments, the cover 200 has a plurality of openings 201 that are sized to fit the wafer 10. The shape of the opening 201 is not limited, and the cover 200 may cover the edge area of the wafer 10. In some embodiments, the opening 201 is circular, rectangular, or square in cross-section. In some embodiments, the cross-sectional area of the opening 201 is square.

In some embodiments, the cross-sectional area of the opening 201 is greater than or equal to the cross-sectional area of the chip 20, so that the chip 20 may contact the wafer 10. In some embodiments, the cross-sectional area of the opening 201 is greater than or equal to the cross-sectional area of the second through hole 102a, so that the magnetic plate 102 is disposed below the area of the cover plate 200 that contacts the wafer 10, so as to enhance the magnetic force between the cover plate 200 and the magnetic plate 102, enhance the clamping of the edge area of the wafer 10, and avoid edge warpage of the wafer 10.

In some embodiments, the opening 201 is 34 mm, 35 mm, 70 mm, or 100 mm long. In some embodiments, the opening 201 is 34 mm, 35 mm, 70 mm, or 100 mm long.

The number of openings 201 is adapted to the number of wafers 10. In some embodiments, referring to fig. 5, the number of openings 201 is one. In some embodiments, the number of the openings 201 is plural, and the plurality of the openings 201 are distributed in a matrix to realize simultaneous soldering of a plurality of wafers 10. In some embodiments, the number of openings 201 is 2, 4, or 8. In some embodiments, referring to fig. 8, the number of second through holes 102a is 8.

In some embodiments, the cover 200 is provided with a first through hole 202 adapted to the limit portion 103. By inserting the limiting portion 103 into the first through hole 202, the cover plate 200 may be disposed over the carrier 101 in parallel to the carrier 101, so as to clamp the wafer 10. In some embodiments, the first via 202 has a circular, rectangular, square, or irregular cross-section. In some embodiments, the inner diameter of the first through hole 202 is greater than or equal to the outer diameter of the limiting portion 103.

In some embodiments, the flip-chip bonding process of the wafer 10 and the chip 20 using the fixture provided in the embodiments of the present application is as follows, 8 wafers 10 with 55x55mm are placed in the areas corresponding to the surfaces of the carrying parts 101, the first through holes 202 on the cover 200 are aligned with the limiting parts 103 on the substrate 100, and the cover 200 moves downward along the limiting parts 103 under the action of magnetic force and gravity, so as to clamp the wafers 10 together with the carrying parts 101. 8 34x34 mm chips 20 are correspondingly placed on the surface of the wafer 10 exposed by the opening 201. And placing the clamp on an operation table, performing high-temperature reflow soldering on the wafer 10 and the chip 20, and after the soldering is finished, removing the cover plate 200 from the substrate 100, and removing the wafer 10 and the chip 20 which are soldered together.

The beneficial effects of the clamp provided by the embodiment of the application include but are not limited to the following:

The clamp provided by the embodiment of the application comprises the substrate and the cover plate, wherein the magnetic plate is embedded in the substrate, the cover plate is made of a magnetic conduction material, the cover plate and the substrate can clamp the edge of the wafer under the action of magnetic force, the phenomenon of edge tilting of the wafer is avoided, and therefore the phenomenon of cold joint in flip-chip welding of the wafer and the chip is avoided.

The size of the base plate and the size of the cover plate and the opening of the cover plate can be adapted according to the size and the number of the wafer, so that the welding of the polycrystalline wafer and the chip can be realized.

It is noted that the benefits that may be achieved by different embodiments may be different, and in different embodiments, the benefits that may be achieved may be any one or a combination of the above, or any other possible benefits.

While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing detailed disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements and adaptations of the application may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this specification, and are therefore within the spirit and scope of the exemplary embodiments of this application.

It should be noted that, in the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the device can be rotationally connected or slidingly connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art in combination with specific cases.

In addition, when terms such as "first", "second", "third", etc. are used in the present specification to describe various features, these terms are only used to distinguish between the features, and are not to be construed as indicating or implying any association, relative importance, or implicitly indicating the number of features indicated.

In addition, the present description describes example embodiments with reference to idealized example cross-sectional and/or plan and/or perspective views. Thus, differences from the illustrated shapes, due to, for example, manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

Meanwhile, the present application uses specific words to describe the embodiments of the present specification. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the application. Thus, it is emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the application may be combined as suitable.

Similarly, it should be noted that in order to simplify the description of the present disclosure and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure does not imply that the subject application requires more features than are set forth in the claims. Indeed, less than all of the features of a single embodiment disclosed above.

Finally, it should be understood that the embodiments described herein are merely illustrative of the principles of the embodiments of the present application. Other variations are also possible within the scope of the application. Thus, by way of example, and not limitation, alternative configurations of embodiments of the application may be considered in keeping with the teachings of the application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly described and depicted herein.

Claims (10)

1. A fixture for flip-chip bonding, comprising:

The substrate comprises a bearing part and a limiting part, wherein the bearing part is used for placing a wafer, and a magnetic plate is buried in the bearing part; the first end of the limiting part is connected to the bearing part, and the limiting part is vertical to the surface of the bearing part; and

The cover plate is detachably connected with the cover plate through the second end of the limiting part and is parallel to the bearing part, a plurality of openings matched with the size of the wafer are formed in the cover plate, the material of the cover plate comprises a magnetic conduction material, and the cover plate can move along the limiting part under the action of magnetic force of the magnetic plate so as to clamp the wafer.

2. The clamp according to claim 1, wherein the cover plate is provided with a first through hole adapted to the limit portion.

3. The jig according to claim 1, wherein the magnetic induction intensity of the magnetic plate is 0.7 to 1.0 dtex or more.

4. The jig according to claim 1, wherein the magnetic plate is provided with a second through hole penetrating the magnetic plate and matching the opening, and an area of the second through hole is equal to or smaller than an area of the opening.

5. The clamp of claim 1, wherein the material of the load bearing portion comprises at least one of stainless steel and stainless iron.

6. The clip of claim 5 wherein the surface of the carrier portion comprises a nickel coating.

7. The clamp of claim 1, wherein the number of limit portions is a plurality, and the plurality of limit portions are distributed in an array.

8. The fixture of claim 1, wherein the material of the cover plate comprises stainless iron.

9. The clamp of claim 1, wherein the opening is square in cross-section.

10. The fixture of claim 1, wherein the number of openings is a plurality, the plurality of openings being distributed in a matrix.