CN221928217U

CN221928217U - Signal acquisition assembly, battery module and battery system

Info

Publication number: CN221928217U
Application number: CN202322845512.5U
Authority: CN
Inventors: 龚晓冬
Original assignee: Us Nagel Precision Machinery Technology Co ltd Suzhou
Current assignee: Us Nagel Precision Machinery Technology Co ltd Suzhou
Priority date: 2023-10-23
Filing date: 2023-10-23
Publication date: 2024-10-29
Anticipated expiration: 2033-10-23

Abstract

The application relates to the technical field of new energy, in particular to a signal acquisition assembly, a battery module and a battery system. The signal acquisition assembly includes: a PCB board including a third surface along one side of a thickness direction thereof, and first, second and third pads spaced apart from each other; the first bonding pad is used for welding a voltage acquisition line, and the second bonding pad and the third bonding pad are used for welding a temperature acquisition line; the temperature sensor is installed on the PCB in a heat conduction mode and is electrically connected between the second bonding pad and the third bonding pad in series; the conductive sheet comprises a first part and a second part, wherein the first part is fixed on the PCB and is electrically connected with the first bonding pad, the second part is used for being welded on a conductive bar electrically connected with an electrode terminal of a battery unit, the conductive bar is combined with the battery unit in a heat conduction way, and the conductive bar is provided with a first surface for the third surface to be in contact in an abutting mode.

Description

Signal acquisition assembly, battery module and battery system

Technical Field

The application relates to the technical field of new energy, in particular to a signal acquisition assembly, a battery module and a battery system.

Background

In order to monitor the working voltage and the working temperature of the battery cells in the battery PACK module, a voltage acquisition assembly and a temperature acquisition assembly are required to be installed on the battery module.

The related art proposes a temperature and voltage acquisition structure, its temperature acquisition subassembly includes the water droplet formula temperature sensor of being wrapped up by the temperature sampling nickel piece, and the voltage acquisition subassembly includes with the voltage sampling nickel piece that is independent of the temperature sampling nickel piece, temperature sampling nickel piece and voltage sampling nickel piece weld respectively to battery module's conducting bar on, temperature acquisition and voltage acquisition mutually independent. Thus, only one cell is monitored, two sample nickel plates need to be provided, and this approach has at least the following drawbacks:

1. The cost for realizing the full collection of the temperatures of all the battery monomers is high.

2. The temperature of the battery is required to be transited to a temperature sensor through secondary conduction of the sampling nickel sheet, heat loss easily occurs in the heat transfer process, the conduction speed is low, and the measurement deviation is large.

3. The double sampling nickel plate occupies large space position of the conductive bar, and has certain requirement on the surface area of the battery conductive bar.

Disclosure of Invention

In view of the above, in order to solve at least one of the above problems, a signal acquisition assembly, a battery module and a battery system are provided.

In a first aspect, the present application provides a signal acquisition assembly for acquiring voltage and temperature of a battery cell in a battery module, the signal acquisition assembly comprising:

A PCB board including a third surface along one side of a thickness direction thereof, and first, second and third pads spaced apart from each other; the first bonding pad is used for welding a voltage acquisition line, and the second bonding pad and the third bonding pad are used for welding a temperature acquisition line;

A temperature sensor thermally conductively mounted on the PCB board and electrically connected in series between the second pad and the third pad;

The conductive sheet comprises a first part and a second part, wherein the first part is fixed on the PCB and is electrically connected with the first bonding pad, the second part is used for being welded on a conductive bar electrically connected with an electrode terminal of the battery unit, the conductive bar is combined with the battery unit in a heat conduction mode, and the conductive bar is provided with a first surface for the third surface to be in close contact.

In some possible embodiments, the conductive sheet has an elastic force pressing the third surface toward the first surface in a state where the conductive sheet is mounted to the conductive bar.

In some possible embodiments, the conductive sheet includes a third portion connecting the first portion and the second portion, the third portion being in an elastically deformed state with the elastic force.

In some possible embodiments, the first surface and the third surface are both planar, and the second portion includes a second surface that is flat and that is abutted against and welded to the first surface;

Wherein, the conducting strip is arranged at an included angle between the third surface and the second surface in a natural state before being installed on the conducting strip;

When the conductive sheet is mounted to the conductive strip, the third portion is elastically deformed due to the reverse pressing of the first surface against the third surface, and thereby the third surface is caused to abut against the first surface in a manner of rotating around the third portion.

In some possible embodiments, the third portion is configured to at least one of:

The third portion has a thickness that is thinner than a thickness of each of the first portion and the second portion;

The third portion having a hole for facilitating elastic deformation of the third portion;

The third portion has a bending portion that makes the third portion easily elastically deformable.

In some possible embodiments, the temperature sensor, the PCB, the conductive bar, and the electrode terminal overlap each other as viewed in a thickness direction of the PCB with the conductive sheet mounted to the conductive bar, and the PCB, the conductive bar, and the electrode terminal are in contact with each other in order in the overlapping region.

In some possible embodiments, the second portion includes an elastically deformable snap-in protrusion, and the conductive strip has a snap-in groove into which the snap-in protrusion is elastically snapped.

In some possible embodiments, the snap-on protrusion is a bent portion integrally formed on the conductive sheet, the bent portion including a first bent arm and a second bent arm spaced apart from each other;

After the convex clamping groove is clamped in the clamping groove, the first folding arm and the second folding arm are extruded by the inner wall of the clamping groove to generate elastic deformation close to each other, and accordingly the first folding arm and the second folding arm are abutted against the inner wall of the clamping groove in a mode of being away from each other under the action of elastic restoring force.

In some possible embodiments, the bending portion is U-shaped and includes a third folding arm connecting the first folding arm and the second folding arm;

The clamping groove is provided with a bottom wall which is separated from the electrode terminal, and the third folding arm is contacted with the bottom wall; or the clamping groove is a through groove penetrating through the conducting bar and opposite to the electrode terminal, and the third folding arm is in contact with the electrode terminal at the through groove.

In some possible embodiments, the card protrusion protrudes from the second surface, the card slot is recessed from the first surface, and the card protrusion is in heat conductive contact with the card slot;

Preferably, the second folding arm is disposed at a tip of the conductive sheet, and the second folding arm is configured to extend only at one side of a plane in which the second surface is located;

preferably, in a natural state of the conductive sheet before being mounted to the conductive strip, all portions of the third surface extend only on the same side of the plane in which the second surface is located, and further preferably, the third surface extends from the plane in which the second surface is located to the same side;

Preferably, the first portion includes a first blocking portion and a second blocking portion spaced apart from each other, the temperature sensor is located between the first blocking portion and the second blocking portion, each of the first blocking portion and the second blocking portion is higher than the temperature sensor, and a cured insulating heat conductive resin wrapping the temperature sensor is filled between the first blocking portion and the second blocking portion;

Preferably, the bending portion has a recess defined by the first, second and third bending arms, and the card slot and the recess are filled with solder for connecting the card protrusion and the conductive bar to each other.

In a second aspect, the present application provides a battery module, comprising:

A battery cell having an electrode terminal;

The conductive bar is electrically connected with the electrode terminal, is in heat conduction contact with the battery cell and is provided with a first surface;

the battery module is characterized in that the battery module further comprises the signal acquisition assembly according to the first aspect, the second part is electrically connected to the electrode terminal in a manner of being welded to the conductive bar, and the third surface of the PCB is in abutting contact with the first surface.

In a third aspect, the present application provides a battery system comprising:

The battery module according to the second aspect;

a battery box for accommodating the battery module;

A battery management system BMS;

A voltage collection line having one end welded to the first pad and the other end connected to the BMS battery management system;

And one ends of the two temperature acquisition wires are welded to the second bonding pad and the third bonding pad respectively, and the other ends of the two temperature acquisition wires are connected to the battery management system BMS.

The signal acquisition assembly provided by the application is used for acquiring the voltage and the temperature of a battery cell in a battery module, and comprises the following components: a PCB board including a third surface along one side of a thickness direction thereof, and first, second and third pads spaced apart from each other; the first bonding pad is used for welding a voltage acquisition line, and the second bonding pad and the third bonding pad are used for welding a temperature acquisition line; a temperature sensor thermally conductively mounted on the PCB board and electrically connected in series between the second pad and the third pad; the conductive sheet comprises a first part and a second part, wherein the first part is fixed on the PCB and is electrically connected with the first bonding pad, the second part is used for being welded on a conductive bar electrically connected with an electrode terminal of the battery unit, the conductive bar is combined with the battery unit in a heat conduction mode, and the conductive bar is provided with a first surface for the third surface to be in close contact. Thus, after the signal acquisition component is assembled to the conductive strip, the conductive sheet can acquire a voltage signal of the battery and transmit the voltage signal to the first bonding pad for connecting the voltage acquisition line, and the temperature sensor can acquire heat from the PCB which is in close contact with the conductive strip and is connected with the conductive sheet, so that the current temperature of the battery cell is determined.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following brief description of the drawings of the embodiments will make it apparent that the drawings in the following description relate only to some embodiments of the present application and are not limiting of the present application.

Fig. 1 is a schematic front view of a signal acquisition assembly according to an embodiment of the present application.

Fig. 2 is a side view schematic of fig. 1.

Fig. 3 is an exploded view of the signal acquisition assembly of fig. 1.

Fig. 4 is a schematic view of the signal acquisition assembly of fig. 1 after being mounted to a battery module.

Fig. 5 is a schematic side sectional view of a signal acquisition assembly according to an embodiment of the present application before being mounted to a battery module.

Fig. 6 is a schematic structural view of a signal acquisition assembly according to an embodiment of the present application after the signal acquisition assembly is mounted to a battery module.

Fig. 7 is a schematic side sectional view of the signal acquisition assembly of fig. 6 prior to installation into a battery module.

Reference numerals illustrate:

1-a conductive sheet, 1A-a second surface, 11-a first portion, 12-a second portion, 13-a third portion;

111-first extension leg, 111A-first blocking portion;

112-second extension leg, 112A-second stop;

121-a snap-on tab, 121A-a first fold arm, 121B-a second fold arm, 121C-a third fold arm, 121D-a recess;

131-arc-shaped bending parts;

2-PCB board, 2A-third surface, 201-first conductive via, 202-second conductive via, 203-first pad, 204-second pad, 205-third pad, 206-fourth pad, 207-fifth pad, 208-sixth pad, 209-seventh pad, 210-eighth pad, 211-substrate layer, 212-conductive layer, 213-insulating layer, 214, 215, 216-printed wiring;

206A-body portion, 206B-first extension, 206C-second extension;

3-fuses;

4-a temperature sensor;

5-conducting bars, 5A-first surfaces and 51-clamping grooves;

6-battery cell, 61-electrode terminal.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present application. It will be apparent that the described embodiments are some, but not all, embodiments of the application. All other embodiments, which can be made by a person skilled in the art without creative efforts, based on the described embodiments of the present application fall within the protection scope of the present application. It is to be understood that some of the technical means of the various embodiments described herein may be interchanged or combined without conflict.

In the description of the present application, the terms "first," "second," and the like, if any, are used merely to distinguish between the described objects and do not have any sequential or technical meaning. Thus, an object defining "first," "second," etc. may explicitly or implicitly include one or more such objects. Also, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one, and "a plurality" of "are used to indicate no less than two.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise.

Fig. 1 to 3 show a specific embodiment of a signal acquisition assembly for acquiring temperature signals and voltage signals of battery cells 6 in a battery module, which includes a PCB board 2 (Printed Circuit Board ), a temperature sensor 4, a conductive sheet 1, and a fuse 3.

The PCB board 2 includes a base material layer 211, a conductive layer 212, and an insulating layer 213, which are sequentially stacked, and a first pad 203, a second pad 204, and a third pad 205, which are spaced apart from each other. The PCB board 2 is rectangular, having a width and a length greater than the width, and has a width of not more than 1.5cm and a length of not more than 2.0cm.

The material forming the substrate layer 211 may include a glass fiber reinforced thermosetting resin FR4 or FP5, and the substrate layer 211 has first and second sides opposite to each other in a thickness direction thereof (i.e., a direction perpendicular to the aforementioned width and length), and first and second conductive vias 201 and 202 extending from the first side to the second side and spaced apart from each other.

The conductive layer 212 is stacked on the second side of the substrate layer 211, and electrically connects the first conductive via 201 and the second conductive via 202. In this embodiment, the conductive layer 212 is a copper foil having high electrical conductivity and high thermal conductivity, and the copper foil substantially entirely covers the base material layer 211. The first conductive via 201 and the second conductive via 202 are metallized holes with high thermal conductivity.

The insulating layer 213 is laminated on a side of the conductive layer 212 facing away from the base material layer 211, and completely covers the conductive layer 212, thereby protecting the conductive layer 212 from contact with an external conductor. The insulating layer 213 may be a resin.

The first, second and third pads 203, 204 and 205 are disposed at the aforementioned first side of the substrate layer 211, spaced apart from each other. The first bonding pad 203 is used for being connected to a voltage collection line of the battery management system BMS in a welding mode so as to transmit voltage signals collected by the collection assembly to the battery management system BMS. The second and third pads 204 and 205 are used for solder connection to a temperature pickup line of the battery management system BMS to transfer a temperature signal picked up by the pickup assembly to the battery management system BMS.

The temperature sensor 4 is mounted on the PCB 2 in a thermally conductive manner, in particular the temperature sensor 4 is thermally conductively connected to the PCB 2 in a manner lying against a first side of the substrate layer 211. And the temperature sensor 4 is electrically connected in series between the second pad 204 and the third pad 205. The temperature sensor 4 may be an NTC thermistor, which in operation has a corresponding resistance value based on the temperature of the environment in which it is located, and the battery management system BMS may acquire the current resistance value of the NTC thermistor via the temperature acquisition lines welded to the second and third pads 204 and 205 and determine the NTC thermistor based on the current resistance value and thus the current temperature of the battery cell 6.

The conductive sheet 1 includes a first portion 11 and a second portion 12, wherein the first portion 11 is fixedly disposed on a first side of the substrate layer 211 and is electrically connected to the first conductive via 201, and the second portion 12 extends to the outside of the PCB 2 for being electrically connected to the electrode terminal 61 of the battery cell 6. Specifically, the PCB board 2 includes a fourth pad 206 electrically connected to the first conductive via 201 and located on the first side, and the first portion 11 of the conductive sheet 1 is electrically connected to the first conductive via 201 by being soldered to the fourth pad 206.

In fig. 1, the second pad 204, the first pad 203, and the third pad 205 are sequentially arranged at equal intervals along the width direction of the PCB board 2, and are each arranged near one width side (first width side) of the PCB board 2. In addition, the first, second and third pads 203, 204 and 205 are formed in a substantially rectangular shape, and the two outermost pads, i.e., the second and third pads 204 and 205, are disposed near two longitudinal sides of the PCB board 2, respectively. The number of the first conductive vias 201 is plural (20 in fig. 1), the plural first conductive vias 201 are arranged in two parallel columns, 10 first conductive vias 201 in each column are arranged at intervals along the length direction of the PCB board 2, 10 first conductive vias 201 in each column are arranged to a position close to the other width side (second width side) of the PCB board 2, and the two columns of first conductive vias 201 are respectively arranged close to the two length sides of the PCB board 2. The fourth pad 206 includes a body portion extending linearly along the width direction of the PCB 2, and a first extending portion and a second extending portion extending from both ends of the body portion in the same direction along the length direction of the PCB 2, wherein the first extending portion covers and is electrically connected to one of the two columns, and the second extending portion covers and is electrically connected to the other of the two columns. Correspondingly, the first portion 11 of the conductive sheet 1 includes a first extension leg 111 and a second extension leg 112 spaced apart from each other, the first extension leg 111 being welded to the first extension in a manner to entirely cover the first extension, and the second extension leg 112 being welded to the second extension in a manner to entirely cover the second extension. Further, the temperature sensor 4 is provided in a space between the first extension and the second extension. In this way, each device can be reasonably arranged by fully utilizing the limited area of the PCB 2, the connection strength of the conductive sheet 1 and the PCB 2 and the conductive area of the conductive sheet 1 and the PCB 2 can be ensured, and meanwhile, the welding of the signal acquisition line and the first bonding pad 203, the second bonding pad 204 and the third bonding pad 205 can be facilitated.

The conductive sheet 1 may be a nickel sheet.

The fuse 3 is disposed on a first side of the substrate layer 211 and electrically connected in series between the second conductive via 202 and the first pad 203. Specifically, the number of the second conductive vias 202 is also set to be plural, and the plurality of second conductive vias 202 are arranged in a matrix at a substantially middle position in the longitudinal direction of the PCB board 2, and the fifth pad 207 provided on the first side of the base material layer 211 is electrically connected to the second conductive vias 202 in a state of covering each of the second conductive vias 202. The sixth pad 208 disposed on the first side of the substrate layer 211 is electrically connected to the first pad 203 via the printed wiring 214, and the sixth pad 208 and the fifth pad 207 are aligned in the width direction of the PCB 2 in a spaced-apart manner, and the fuse 3 is soldered and electrically connected in series between the fifth pad 207 and the sixth pad 208. In addition, the fuse 3 may be a self-restoring fuse, and in practice, the voltage acquisition circuit including the fuse 3 may be used to perform a voltage equalization process on the battery (for example, a desired battery voltage may be obtained by charging or discharging the target battery cell 6), where a current flowing through the fuse 3 (and the conductive sheet 1 and the first pad) may be generated, and when the current is too large, the self-restoring fuse becomes a high-resistance state to protect the circuit.

The first extension leg 111 has a first blocking portion 111A protruding in the thickness direction of the PCB 2, the second extension leg 112 has a second blocking portion 112A protruding in the thickness direction of the PCB 2, the temperature sensor 4 is located between the first blocking portion 111A and the second blocking portion 112A, and both the first blocking portion 111A and the second blocking portion 112A are higher than the temperature sensor 4 in the thickness direction of the PCB 2, whereby it is possible to easily coat a large thickness of insulating heat conductive resin between the first blocking portion 111A and the second blocking portion 112A to entirely wrap and cure the temperature sensor 4 based on the blocking retaining effect of the first blocking portion 111A and the second blocking portion 112A on the flowing substance, thereby avoiding: the NTC thermistor as the temperature sensor 4 is accidentally contacted with an external conductor (for example, causes a short circuit of the NTC thermistor) to cause deviation of its operating resistance value, and thus causes an error in the measured temperature information. In addition, the insulating and heat conducting resin arranged in this way not only improves the heat conductivity of the PCB 2 and the temperature sensor 4, but also enables the heat absorbed by the conductive sheet 1 from the conductive strip 5 to be transferred to the temperature sensor 4 more rapidly. The insulating thermally conductive resin may be a transparent thermally conductive UV glue.

More specifically, the first side of the PCB board 2 is further provided with a seventh pad 209 and an eighth pad 210, wherein the seventh pad 209 is electrically connected to the second pad 204 via a printed circuit, the eighth pad 210 is electrically connected to the third pad 205 via a printed circuit, and the positive and negative electrode pins of the temperature sensor 4 are soldered on the aforementioned seventh pad 209 and eighth pad 210, respectively, thereby achieving an electrical series connection of the temperature sensor 4 between the second pad 204 and the third pad 205.

The PCB board 2 may further include another insulation shield layer laminated on the first side of the base material layer 211, the insulation shield layer having the aforementioned printed wiring 214, 215, 216 buried inside thereof, and the first, second, and third pads 203, 204, 205 exposed from the insulation shield layer.

Referring to fig. 1, when viewed facing the PCB 2, the conductive paths from the first conductive via 201 to the first pad 203, i.e., the first conductive path, and the conductive paths from the second pad 204 to the third pad 205, i.e., the second conductive path, are partially overlapped, and any two of the first conductive via 201, the second conductive hole 202, and the second conductive path are not overlapped with each other. In this way, the conductive area of the conductive sheet 1 to the first pad 203 can be set as large as possible, thereby reducing the conductive resistance of the conductive sheet 1 to the first pad 203, enhancing the current carrying capacity of the signal acquisition assembly, for example, when the battery module is subjected to voltage equalization processing, and better ensuring the insulation and isolation between the voltage acquisition circuit and the temperature acquisition circuit.

It will be appreciated that the first conductive path is a conductive path sequentially passing through the first conductive via 201, the conductive layer 212, the second conductive via 202, the seventh pad 209, the fuse 3, the eighth pad 210, the printed wiring 214, and the first pad 203, and the second conductive path is a conductive path sequentially passing through the second pad 204, the printed wiring 215, the seventh pad 209, the temperature sensor 4, the eighth pad 210, the printed wiring 216, and the third pad 205.

Referring back to fig. 1, when viewed facing the PCB 2, the fifth pad 207, the fuse 3, the sixth pad 208, the printed wiring 214, and the first pad 203 are located in the opening space defined by the aforementioned second conductive path, that is, in the aforementioned opening space surrounded by the second pad 204, the printed wiring 215, the seventh pad 209, the temperature sensor 4, the eighth pad 210, the printed wiring 216, and the third pad 205. In this way, in the case where the distance between the second pad 204 and the third pad 205 is increased, thereby improving the electrical insulation between the second pad 204 and the third pad 205, in particular, the electrical insulation between the pads of the two temperature pickup lines respectively soldered to the two pads, and thus enhancing the pickup accuracy of the temperature sensor 4, the limited mounting area of the PCB board 2 (in particular, the opening space theoretically defined by the second conductive path is sufficiently utilized, and the large distance between the second pad 204 and the third pad 205 brings about the aforementioned opening space of a large size) is sufficiently utilized to arrange the fuse 3, the first pad 203, and the like, and the conductive area of the second conductive via 202 to the first pad 203 can be easily increased.

According to the signal pickup assembly provided by the embodiment of the present application, the conductive path from the conductive sheet 1 to the first pad 203 is wound back to the first side of the base material layer 211 via the conductive layer on the second side of the base material layer 211, so that the first pad 203 for soldering the voltage pickup line can be skillfully and electrically insulated between the second pad 204 and the third pad 205 for soldering the temperature pickup line. In this way, on the one hand, the distance between the second pad 204 and the third pad 205 is facilitated to be increased, so that the electrical insulation between the second pad 204 and the third pad 205 is improved, and further, the acquisition accuracy of the temperature sensor 4 is enhanced, and on the other hand, the conductive area from the conductive sheet 1 to the first pad 203 can be easily increased, so that the conductive resistance from the conductive sheet 1 to the first pad 203 is reduced, and the current carrying capacity of the signal acquisition component is enhanced.

In addition, the embodiment of the application also provides a battery module provided with the signal acquisition assembly, the battery module comprises a plurality of battery cells 6 and a plurality of conductive bars 5, the conductive bars 5 are electrically connected with electrode terminals 61 of two adjacent battery cells 6, for example, one conductive bar 5 is electrically connected with a positive electrode terminal of a first battery cell and a negative electrode terminal of a second battery cell, and the other conductive bar 5 is electrically connected with a positive electrode terminal of the second battery cell and a negative electrode terminal of a third battery cell, so that the first battery cell is connected with the second battery cell in series, and the second battery cell is connected with the third battery cell in series. It is known that the voltage between the aforementioned two conductive bars 5 is equal to the terminal voltage of the aforementioned second battery cell, and therefore, the voltage between the two voltage acquisition lines respectively led out from the two conductive bars 5 (in more detail, the two signal acquisition components mounted to the two conductive bars 5) reflects the terminal voltage of the second battery cell. For convenience of description, fig. 4 only illustrates an assembly structure of one battery cell 6, one conductive bar 5 and one signal acquisition assembly in the battery module.

Referring to fig. 4, the second portion 12 of the conductive sheet 1 is electrically connected to the electrode terminal 61 of the battery cell 6 via a conductive strip 5, specifically, the conductive strip 5 is directly welded to the electrode terminal 61 of the battery cell 6, and the conductive strip 5 is in heat-conducting contact with the battery cell 6, and the second portion 12 of the conductive sheet 1 is directly welded to the conductive strip 5, thereby achieving the electrical connection between the second portion 12 of the conductive sheet 1 and the electrode terminal 61 of the battery cell 6. In some embodiments, the electrical conductor 5 is in thermally conductive contact (and welded) with only the electrode terminals 61 of the battery cells 6, while in other embodiments, the electrical conductor 5 is in thermally conductive contact (and welded) with not only the electrode terminals 61 of the battery cells 6, but also the housing of the battery cells 6.

The conductive bar 5 may be an aluminum bar or a copper bar having a flat first surface 5A. The second portion 12 of the conductive sheet 1 has a flat second surface 1A, the second surface 1A being attached to the first surface 5A and the two being welded. In this way, the conductive sheet 1 and the conductive bar 5 have a large conductive area, high connection strength, and small connection resistance therebetween.

Furthermore, the PCB board 2 has a flat third surface 2A adapted to abut against the aforementioned first surface 5A, which third surface 2A is coplanar with the aforementioned second surface 1A and is in abutment with the first surface 5A of the conductive bar 5 when the signal acquisition assembly is assembled to the battery module. The third surface 2A is defined by the aforementioned insulating layer 213, i.e. the third surface 2A is specifically the surface of the aforementioned insulating layer 213 facing away from the conductive layer 212, and the third surface 2A is also a surface of the PCB board 2 on one side in the thickness direction thereof. The third surface 2A coplanar with the aforementioned second surface 1A may be in contact with the first surface 5A of the conductive strip 5 in a large area in an abutting manner, so that the heat of the conductive strip 5 can be rapidly transferred to the PCB board 2, thereby enabling the temperature sensor 4 to accurately detect the conductive strip 5 in real time and thereby obtain the current temperature of the battery cell 6. In some embodiments, a heat conductive glue may be applied to further strengthen the bond of the PCB board 2 and the conductive bars 5.

In a state in which the conductive sheet 1 and the conductive bars 5 are mounted to each other as shown in fig. 4, the conductive sheet 1 may be in an elastically deformed state having an elastic restoring force (or elastic force), and thereby the conductive sheet 1, more specifically, the first portion 11 of the conductive sheet 1, is caused to apply an elastic pressing force toward the first surface 5A to the PCB board 2. In this way, the contact and heat transfer rate of the PCB board 2 and the conductive bars 5, in more detail, the third surface 2A and the second surface 1A, may be enhanced, thereby helping the temperature sensor 4 to accurately detect the current temperature of the battery cell 6.

As shown in fig. 5, when the signal acquisition component is not assembled to the conductive strip 5, the conductive sheet 1 is not in the aforementioned elastic deformation state, but is in a natural state, and at this time, an obtuse included angle, for example, 170 ° is formed between the second surface 1A of the conductive sheet 1 and the third surface 2A of the PCB board 2. When the conductive sheet 1 of the signal acquisition assembly is soldered against the first surface 5A of the conductive strip 5, the opposite pressing of the first surface 5A against the third surface 2A by the conductive strip 5 will be more detailed to the PCB board 2, causing the conductive sheet 1 to elastically deform and thereby making the second surface 1A of the conductive sheet 1 coplanar with the third surface 2A of the PCB board 2 (both arranged at 180 °), when the PCB board 2 and the conductive strip 5 are pressed against each other by the elastic restoring force of the conductive sheet 1, the third surface 2A and the first surface 5A are reliably in heat conductive contact. And further, when the conductive sheet 1 is in the aforementioned natural state of not being yet assembled to the conductive bar 5, all portions of the third surface 2A of the PCB board 2 extend only on the same side of the plane in which the second surface 1A is located (in fig. 5, the right side of the plane in which the second surface 1A is located), so that it can be easily ensured that substantially all of the third surface 2A is attached to the first surface 5A after the assembly is completed (more specifically, after the second portion 12 of the conductive sheet 1 and the conductive bar 5 are completely welded). Preferably, when the conductive sheet 1 is in the aforementioned natural state of not being yet assembled to the conductive strip 5, the third surface 2A of the PCB board 2 extends from the plane of the second surface 1A to the one side, for example, in fig. 5, the third surface 2A extends from the plane of the second surface 1A to the right lower side.

In detail, the conductive sheet 1 further includes a third portion 13 connecting the first portion 11 and the second portion 12, and since the third portion 13 has a bent design (as shown in fig. 4 and 5, the third portion 13 has two curved bent portions 131), and the first portion 11 and the second portion 12 are respectively bonded with related components (the PCB board 2 and the conductive bar 5), when the first surface 5A presses the third surface 2A in the opposite direction, the third portion 13 is easier to generate elastic deformation than the first portion 11 and the second portion 12, and in fig. 4, the third portion 13 is in an elastic deformation state and has an elastic restoring force, so that the first portion 11 of the conductive sheet 1 presses the PCB board 2 to the conductive bar 5. It will be appreciated that during assembly, the first surface 5A presses the third surface 2A in a reverse direction, so that the third surface 2A finally comes to rest entirely against the first surface 5A of the conductive strip 5 in a manner that rotates about the third portion 13.

In other embodiments, the third portion 13 may be thinned or perforated to make the thickness of the third portion 13 thinner than the thickness of each of the first portion 11 and the second portion 12, or the third portion 13 may have holes that facilitate elastic deformation (it will be appreciated that the perforation of the third portion 13 may reduce the deformation resistance of the third portion 13) such that the third portion 13 is more susceptible to elastic deformation (flexing) than the first portion 11 and the second portion 12 when the first surface 5A is pressed against the third surface 2A. In this way, since the deformation path of the third surface 5A (i.e., the rotation about the third portion 13) is known during the assembly, it is possible to easily dispose the relative position of the third surface 2A and the second surface 1A when the conductive sheet 2 is in the natural state, i.e., to more easily dispose the configuration of the conductive sheet 2 in the natural state.

In other embodiments, the PCB board 2 may not be in close abutting contact with the conductive bars 5 (i.e., the third surface 2A is not in close abutting contact with the first surface 5A). In this case, after the heat of the battery cell 6 is transferred to the conductive strip 5, the heat is transferred to the PCB board 2 through the conductive sheet 1, and then transferred to the temperature sensor 3 through the PCB board 2, i.e. the heat transfer path directly passing through the conductive strip 5 and the PCB board 2 to the temperature sensor 3 is removed. The heat transfer rate from the battery cell 6 to the temperature sensor 3 is reduced as soon as possible compared to the configuration shown in fig. 4, however, since the heat acquired from the battery cell 6 of the conductive sheet 1 can still be rapidly transferred to the PCB board 2, in particular, can be transferred to a copper foil conductive layer of a large area via metallized conductive vias (the first conductive via and the second conductive via are metallized holes) at a rate, a high sensitivity of the temperature sensor 3 to the temperature detection of the battery cell 6 can still be ensured.

Referring to fig. 2 again, in the present embodiment, the second portion 12 of the conductive sheet 1 includes an elastically deformable engaging protrusion 121, and the conductive strip 5 has an inwardly concave recess 121D from the first surface 5A thereof for the engaging protrusion 121 to be elastically engaged with the engaging groove 51. In this way, in the process of assembling the signal acquisition component to the conductive strip 5, the elastic clamping protrusion 121 of the conductive sheet 1 can be clamped into the clamping groove 51 of the conductive strip 5, and then the conductive sheet 1 and the conductive strip 5 can be welded. In this way, on the one hand, the pre-welding position of the conductive sheet 1 on the conductive strip 5 can be quickly found and fixed by means of the elastic clamping between the clamping protrusion 121 and the clamping groove 51, and accidental detachment of the conductive sheet 1 from the conductive strip 5 during subsequent welding operation of the conductive sheet 1 and the conductive strip 5 is prevented, on the other hand, the elastic clamping between the clamping protrusion 121 and the clamping groove 51 is also beneficial to increasing the conductive area of the conductive sheet 1 and the conductive strip 5, so that the connection resistance between the conductive sheet 1 and the conductive strip 5 is reduced, especially in the case that the surface of the clamping protrusion 121 and the wall surface of the clamping groove 51 are elastically abutted against each other in a large area.

The engaging protrusion 121 is a U-shaped bent portion formed by bending the conductive sheet 1, and the conductive sheet 1 having the engaging protrusion 121 is of an integral structure. The U-shaped bent portion, that is, the clamping protrusion 121 includes a first folding arm 121A and a second folding arm 121B spaced apart from each other, and a third folding arm 121C connecting the first folding arm 121A and the second folding arm 121B, and the first folding arm 121A, the third folding arm 121C, and the second folding arm 121B are sequentially terminated. Wherein the first and second folding arms 121A, 121B extend substantially perpendicular to the second surface 1A, and the third folding arm 121C extends substantially parallel to the second surface 1A. When the clamping protrusion 121 is clamped into the clamping groove 51 of the conductive strip 5, the first folding arm 121A and the second folding arm 121B are elastically deformed close to each other due to being pressed by the inner wall of the clamping groove 51, and therefore the first folding arm 121A and the second folding arm 121B are abutted against the inner wall of the clamping groove 51 in a manner away from each other under the action of elastic restoring force, namely, the clamping protrusion 121 is kept abutted against the clamping groove 51 by the elastic restoring force of the clamping protrusion 121.

In fig. 4, the locking groove 51 is a non-penetrating groove having a bottom wall that is spaced apart from the electrode terminal 61 by a certain distance and is located above the electrode terminal 61. The height of the card protrusion 121 and the depth of the card slot 51 may be configured to be equal, whereby the third folded arm 121C is in conductive contact with the bottom wall surface of the card slot 51 when the card protrusion 121 is snapped into the card slot 51 of the conductive bar 5.

The second folding arm 121B of the folded portion, that is, the latch 121 is located at the distal end of the conductive sheet 1. Also, in order to prevent "protruding" from being generated on the first surface 5A by the end portion of the second folding arm 121B protruding out of the card slot 51 after the card protrusion 121 is snapped into the card slot 51, in some embodiments, the second folding arm 121B of the distal end of the conductive sheet 1 is configured to extend only on the same side of the plane in which the second surface 1A is located (for example, on the right side of the plane in which the second surface 1A is located in fig. 2).

The convex portion 121 (U-shaped bent portion) formed by bending the conductive sheet 1 has a recess 121D, and the recess 121D is defined by a first folding arm 121A, a second folding arm 121B, and a third folding arm 121C. Based on the recess 121D, in some embodiments, after the card protrusion 121 is snapped into the card slot 51, the solder for connecting the conductive sheet 1 and the conductive bar 5 may be filled in the recess 121D and the card slot 51 to significantly improve the connection strength between the conductive sheet 1 and the conductive bar 5.

Referring to fig. 4, the temperature sensor 4, the PCB 2, the conductive bars 5, and the electrode terminals 61 overlap each other as viewed in the thickness direction of the PCB 2, and in this overlapping region, the temperature sensor 4, the PCB 2, the conductive bars 5, and the electrode terminals 61 are in contact in order. With this configuration, the heat transfer path of the battery cell 6, more specifically, the electrode terminal 61 to the temperature sensor 4 can be shortened, and the rate of heat transfer between the battery cell 6 and the temperature sensor 4 can be increased.

In other embodiments, as shown in fig. 6 and 7, the card groove 51 is a through groove penetrating the conductive strip 5 in the thickness direction of the conductive strip 5, the through groove being opposed to the electrode terminal 61 of the battery cell 6, and the card protrusion 121 of the conductive sheet 1 is abutted against the electrode terminal 61 via the through groove, specifically, the third folded arm 121C of the card protrusion 121 is abutted against the electrode terminal 61 at the through groove. In this way, the catching protrusion 121 of the conductive sheet 6 is in direct electrical and thermal conductive contact with the electrode terminal 61, thereby contributing to further reducing the connection resistance and thermal resistance of the electrode terminal 61 to the conductive sheet 6. And in such an embodiment, the third folded arm 121C may be directly welded to the electrode terminal 61.

In other embodiments, the protruding direction of the latch 121 is inclined to the second surface 1A when the signal acquisition assembly is not yet assembled to the conductive strip 5, more specifically, the protruding direction of the latch 121 forms an acute angle with the second surface 1A, and the latch groove 51 of the conductive strip 5 is perpendicular to the inward recess 121D of the first surface 5A. Thus, when the engaging protrusion 121 is engaged with the engaging groove 51, the second portion 12 of the conductive sheet 1 is elastically deformed by the pressing of the first surface 5a—the second surface 1A is elastically bent with respect to the engaging protrusion 121, whereby the second surface 1A of the conductive sheet 1 and the first surface 5A of the conductive bar 5 are pressed against each other to reliably contact under the elastic restoring force of the conductive sheet 1.

Referring to fig. 4, in the battery module provided by the embodiment of the application, the whole area of the PCB 2 and the conductive sheet 1 is covered on the conductive bars 5.

In addition, the embodiment of the application also provides a battery system which comprises the battery module with the structure, a battery box for accommodating the battery module, a battery management system BMS, a temperature acquisition line and a voltage acquisition line. The temperature pickup lines are provided in two, one ends of which are welded to the first and second pads 203 and 204, respectively, and the other ends of which are connected to the battery management system BMS. One end of the voltage collection line is soldered to the third pad 205, and the other end is connected to the battery management system BMS.

During operation, terminal voltage of the battery cell 6 is sequentially transmitted to the battery management system BMS through the conductive strip 5, the conductive sheet 1, the first conductive via hole 201, the conductive layer 212, the second conductive via hole 202, the fuse 3, the first welding pad and the voltage acquisition line, and the battery management system BMS determines the current temperature of the battery cell 6 by acquiring the resistance value of the NTC thermistor.

The embodiment of the application also provides a method for installing the signal acquisition component on the battery module, which comprises the following steps:

Step one: the clamping convex 121 is clamped into the clamping groove 51 in a state of generating elastic deformation;

Step two: the second portion 12 is welded to the conductive strip 5 in a state where the second surface 1A of the second portion 12 and the first surface 5A of the conductive strip 5 are abutted against each other, and the conductive sheet 1 is elastically deformed by the movement of the first portion 11 away from the first surface 5A under the reverse pressing of the conductive strip 5, and thereby the conductive sheet 1 is made to have an elastic restoring force pressing the third surface 2A against the first surface 5A.

In some embodiments, the method may further include step three: and coating heat-conducting glue on the PCB 2 to further strengthen the combination of the PCB 2 and the conductive bars 5.

Claims

1. A signal acquisition assembly for gather battery cell's voltage and temperature in the battery module, its characterized in that, signal acquisition assembly includes:

2. The signal acquisition assembly of claim 1, wherein the conductive sheet has an elastic force that presses the third surface against the first surface with the conductive sheet mounted to the conductive strip.

3. The signal acquisition assembly of claim 2, wherein the conductive sheet includes a third portion connecting the first portion and the second portion, the third portion being in an elastically deformed state with the elastic force.

4. A signal acquisition assembly as in claim 3 wherein the first and third surfaces are each planar and the second portion comprises a second surface that is flat and that is abutted against and welded to the first surface;

5. A signal acquisition assembly according to claim 3, wherein the third portion is configured to at least one of:

6. The signal acquisition assembly according to claim 1, wherein the temperature sensor, the PCB board, the conductive strip, and the electrode terminal overlap each other as viewed in a thickness direction of the PCB board with the conductive sheet attached to the conductive strip, and the PCB board, the conductive strip, and the electrode terminal are in contact in order in the overlapping region.

7. The signal acquisition assembly of claim 4, wherein the second portion includes an elastically deformable snap-in tab, the conductive strip having a snap-in slot into which the snap-in tab resiliently snaps.

8. The signal acquisition assembly of claim 7, wherein the catch is a bent portion integrally formed on the conductive sheet, the bent portion including a first bent arm and a second bent arm spaced apart from each other;

9. The signal acquisition assembly of claim 8, wherein the fold is U-shaped and includes a third fold arm connecting the first fold arm and the second fold arm;

10. The signal acquisition assembly of claim 9, wherein the detent projections protrude from the second surface, the detent recesses from the first surface, the detent projections in thermally conductive contact with the detent recesses.

11. The signal acquisition assembly of claim 10, wherein the second folding arm is disposed at a distal end of the conductive sheet and is configured to extend only on one side of a plane in which the second surface lies.

12. The signal acquisition assembly of claim 10, wherein all portions of the third surface extend only on the same side of the plane as the second surface in a natural state of the conductive sheet prior to installation to the conductive strip.

13. The signal acquisition assembly of claim 10, wherein the first portion includes a first barrier and a second barrier spaced apart from each other, the temperature sensor being located between the first barrier and the second barrier, each of the first barrier and the second barrier being higher than the temperature sensor, the first barrier and the second barrier being filled with a cured insulating thermally conductive resin encasing the temperature sensor therebetween.

14. The signal acquisition assembly of claim 10, wherein the bent portion has a recess defined by the first, second and third bent arms, the card slot and recess being filled with solder connecting the card tab and the conductive bar to each other.

15. A battery module, comprising:

A battery cell having an electrode terminal;

The battery module further comprising the signal acquisition assembly according to any one of claims 1 to 14, wherein the second portion is electrically connected to the electrode terminal in such a manner as to be welded to the conductive strip, and the third surface of the PCB board is in abutting contact with the first surface.

16. A battery system, comprising:

the battery module according to claim 15;

a battery box for accommodating the battery module;

A battery management system BMS;

A voltage collection line having one end welded to the first pad and the other end connected to the battery management system BMS;