CN221916361U

CN221916361U - Magazine loading device for semiconductor substrate and apparatus therefor

Info

Publication number: CN221916361U
Application number: CN202420172546.4U
Authority: CN
Inventors: 白树旺; 郝卫斌; 孔德光
Original assignee: Huizhou Huayu Technology Co ltd
Current assignee: Huizhou Huayu Technology Co ltd
Priority date: 2024-01-23
Filing date: 2024-01-23
Publication date: 2024-10-29
Anticipated expiration: 2034-01-23

Abstract

The present disclosure provides a magazine loading attachment and equipment for semiconductor substrates. The magazine is conveyed to the conveying channel of the conveying frame through the feeding hole, the conveying driving piece is controlled to drive the magazine pushing piece to move, so that the magazine is conveyed on the conveying channel through the pushing end of the magazine pushing piece, and the magazine is close to the magazine clamping groove. Meanwhile, the moving end of the transverse moving piece drives the longitudinal moving piece to approach the conveying frame, and the moving end of the longitudinal moving piece drives the clamping frame to longitudinally move, so that the other end of the conveying channel is communicated with the magazine clamping groove, namely, the pushing end of the magazine pushing piece pushes the magazine from the conveying channel to the magazine clamping groove, and downward pressure is output through the clamping driving piece, so that the magazine is clamped by the clamping block, and a good clamping and positioning effect of the magazine can be ensured. And pushing the semiconductor substrate in the magazine to a discharge hole through a pushing plate end of the pushing plate assembly so as to convey the semiconductor substrate to downstream process equipment.

Description

Magazine loading device for semiconductor substrate and apparatus therefor

Technical Field

The disclosure relates to the technical field of semiconductors, and in particular relates to a magazine feeding device for a semiconductor substrate and equipment thereof.

Background

Along with the rapid development of science and technology, the requirements of the current electronic products on the semiconductor packaging technology are also higher and higher, and further, high requirements are made on a feeding mechanism. The loading steps of the existing semiconductor packaging line are as follows: the semiconductor substrate is manually loaded into the magazine, and then the magazine is placed on a conveyor belt of a loading device. The magazine is conveyed to the clamping assembly by the conveyor belt, then the magazine is clamped by the clamping assembly, and the semiconductor substrate in the magazine is pushed to downstream process equipment by the pushing assembly.

As disclosed in chinese patent document CN208560892U, a double-layer feeding mechanism for a magazine includes a magazine conveyor belt for horizontally conveying a carrying magazine, the front end of which has an elastic stopper; the box collecting conveyor belt is used for horizontally conveying empty boxes, is arranged at intervals up and down with the box conveying belt and has opposite conveying directions, and the two ends of the box collecting conveyor belt and the box conveying belt are flush up and down; the material box clamping jaw can horizontally move between the material pushing position and the front end of the box conveying belt or the rear end of the box collecting conveying belt and can move up and down at the material pushing position; and the pushing rod is used for sequentially horizontally pushing the material plate in the material box to the rear end of the feeding conveyor belt in the process that the material box clamping jaw drives the material box to move upwards.

However, the above-mentioned double-deck feed mechanism of magazine has the following problems:

The double-layer feeding mechanism of the material box adopts the conveying belt for conveying, and the material box is a metal piece, so that the material box is easy to rub with the conveying belt in the conveying process to cause abrasion of the conveying belt, and the material box needs to be maintained and replaced seriously, so that the production line is stopped, and the production efficiency is influenced. Further, as the lapse of live time, the clamping force of magazine clamping jaw can descend, leads to the magazine to appear rocking at centre gripping lift in-process to lead to the centre gripping location effect of magazine relatively poor, make the push rod to push the end and can not fix a position to the base plate of magazine on, and then influenced the material loading efficiency of semiconductor substrate.

In view of the foregoing, there is a need for a magazine loading device that can avoid belt wear and has good magazine clamping and positioning effects.

Disclosure of utility model

The invention aims to overcome the defects in the prior art and provide a magazine feeding device and equipment for a semiconductor substrate, which can avoid abrasion of a conveyor belt and have a good magazine clamping and positioning effect.

The aim of the disclosure is achieved by the following technical scheme:

a magazine loading mechanism for semiconductor substrates, comprising:

The machine box is provided with a feeding hole, a feeding cavity and a discharging hole, and the feeding cavity is respectively communicated with the feeding hole and the discharging hole;

The conveying assembly comprises a conveying frame, a conveying driving piece and a magazine pushing piece, wherein the conveying frame is arranged in the feeding cavity, the conveying driving piece is fixed in the conveying frame, a conveying channel and a penetrating through hole which are communicated are formed in one surface of the conveying frame, the feeding hole is communicated with one end of the conveying channel, the power output end of the conveying driving piece is connected with the magazine pushing piece, and the pushing end of the magazine pushing piece penetrates through the penetrating through hole and is in sliding connection with the conveying frame;

The clamping assembly comprises a transverse moving part, a longitudinal moving part, a clamping frame, a clamping driving part and a clamping block, wherein the transverse moving part is arranged in the feeding cavity, the longitudinal moving part is fixed at the moving end of the transverse moving part, the clamping frame is fixed at the moving end of the longitudinal moving part, the clamping driving part is arranged at one end of the clamping frame, the clamping block is arranged at the power output end of the clamping driving part, a magazine clamping groove is formed between the clamping frame and the clamping block, one end of the magazine clamping groove is movably communicated with the other end of the conveying channel, and the other end of the magazine clamping groove is movably communicated with the discharge port;

The pushing plate assembly is installed in the feeding cavity, and the pushing plate end of the pushing plate assembly faces the discharge hole, so that the pushing plate end of the pushing plate assembly is movably abutted to the semiconductor substrate in the magazine.

In one embodiment, the conveying frame is provided with a placing cavity, the number of the penetrating through holes is two, the penetrating through holes are respectively a first penetrating through hole and a second penetrating through hole, and the placing cavity is respectively communicated with the first penetrating through hole and the second penetrating through hole.

In one embodiment, the conveying driving piece is arranged in the placing cavity, the magazine pushing piece comprises a fixed block, a first rotating block, a second rotating block, a first connecting shaft and a second connecting shaft, the fixed block is fixedly arranged on the power output end of the conveying driving piece, the first rotating block and the second rotating block are sleeved on the first connecting shaft, the first rotating block and the second rotating block are both in rotating connection with the first connecting shaft, one end of the first connecting shaft is connected with the fixed block, two ends of the second connecting shaft are respectively in fixed connection with the first rotating block and the second rotating block, the pushing end of the first rotating block penetrates through the first penetrating through hole and is in sliding connection with the conveying frame, and the pushing end of the second rotating block penetrates through the second penetrating through hole and is in sliding connection with the conveying frame.

In one embodiment, the conveying assembly further comprises an empty box storage rack and a box pushing driving piece, the empty box storage rack is mounted on one face of the conveying rack, the empty box storage rack is located above the conveying rack, the box pushing driving piece is mounted on the empty box storage rack, and the power output end of the box pushing driving piece faces the box magazine clamping groove.

In one embodiment, the transverse moving member comprises a transverse driving member and a transverse moving block, the transverse driving member is arranged in the feeding cavity, so that the transverse driving member is arranged in the chassis, one end of the transverse moving block is connected with a power output end of the transverse driving member, and the other end of the transverse moving block is connected with the longitudinal moving member.

In one embodiment, the longitudinal moving member comprises a longitudinal driving member and a longitudinal moving block, wherein the longitudinal driving member is connected with the other end of the transverse moving block, one end of the longitudinal moving block is connected with the power output end of the longitudinal driving member, and the other end of the longitudinal moving block is connected with the clamping frame.

In one embodiment, the push plate assembly comprises a push plate driving member and a push plate rod, wherein the push plate driving member is arranged in the feeding cavity, so that the push plate driving member is arranged in the chassis, one end of the push plate rod is connected with the power output end of the push plate driving member, and the other end of the push plate rod is arranged towards the discharge hole.

In one embodiment, the magazine feeding device further comprises a feeding assembly, the feeding assembly comprises a feeding support, an adjusting driving piece, a first feeding driving piece and a second feeding driving piece, the feeding support is arranged in the feeding cavity, the feeding support is fixedly connected with the machine case, the adjusting driving piece is arranged on the feeding support, the first feeding driving piece and the feeding driving piece are both arranged on the feeding support, the second feeding driving piece is connected with a power output end of the adjusting driving piece, so that the second feeding driving piece is in sliding connection with the feeding support, a feeding channel is formed between a power output end of the first feeding driving piece and a power output end of the second feeding driving piece, one end of the feeding channel is movably communicated with the magazine clamping groove, and the other end of the feeding channel is communicated with the discharging port.

In one embodiment, the chassis is provided with a control panel, and the control panel is respectively in communication connection with the conveying driving piece, the pushing box driving piece, the transverse driving piece, the longitudinal driving piece, the clamping driving piece, the adjusting driving piece, the first blanking driving piece and the second blanking driving piece.

The magazine loading device for semiconductor substrates comprises the magazine loading device for semiconductor substrates according to any one of the embodiments.

Compared with the prior art, the method has at least the following advantages:

1. The magazine is conveyed to the conveying channel of the conveying frame through the feeding hole, the conveying driving piece is controlled to drive the magazine pushing piece to move, so that the magazine is conveyed on the conveying channel through the pushing end of the magazine pushing piece, and the magazine is close to the magazine clamping groove. Meanwhile, the moving end of the transverse moving piece drives the longitudinal moving piece to approach the conveying frame, and the moving end of the longitudinal moving piece drives the clamping frame to longitudinally move, so that the other end of the conveying channel is communicated with the magazine clamping groove, namely, the pushing end of the magazine pushing piece pushes the magazine from the conveying channel to the magazine clamping groove, and downward pressure is output through the clamping driving piece, so that the magazine is clamped by the clamping block, and a good clamping and positioning effect of the magazine can be ensured. And because the magazine clamping groove is movably communicated with the discharge hole, namely, the magazine clamping groove is communicated with the discharge hole through the transverse moving piece and the longitudinal moving piece, and the semiconductor substrate in the magazine is pushed to the discharge hole through the push plate end of the push plate assembly, so that the semiconductor substrate is conveyed to downstream process equipment.

2. During the whole magazine transporting process, the pushing end of the magazine pushing piece drives the magazine to move on the conveying frame, namely the magazine slides on the conveying frame. And because the conveying frame and the magazine can be made of metal materials, the contact between the conveying frame and the magazine can be smoother, and the situation that the magazine rubs with a conveying belt to cause the abrasion of the conveying belt can be avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present disclosure and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

FIG. 1 is a schematic view of a magazine loading apparatus for semiconductor substrates according to an embodiment;

FIG. 2 is a schematic view of a part of a magazine loading mechanism for the semiconductor substrate shown in FIG. 1;

FIG. 3 is a schematic view of a part of a magazine loading mechanism for the semiconductor substrate shown in FIG. 1;

FIG. 4 is a schematic view of a magazine loader for semiconductor substrates shown in FIG. 3 from another view;

FIG. 5 is a schematic view showing a partial structure of a magazine loading mechanism for the semiconductor substrate shown in FIG. 1;

FIG. 6 is a schematic view of a part of the magazine loading mechanism for semiconductor substrates shown in FIG. 5 from another perspective;

Fig. 7 is a schematic structural view of a magazine loading device for the semiconductor substrate shown in fig. 1;

Fig. 8 is a schematic view showing a partial structure of a magazine loading device for the semiconductor substrate shown in fig. 1.

Detailed Description

In order that the disclosure may be understood, a more complete description of the disclosure will be rendered by reference to the appended drawings. Preferred embodiments of the present disclosure are shown in the drawings. This disclosure may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The utility model provides a magazine loading attachment that semiconductor substrate used includes quick-witted case, conveying subassembly, clamping assembly and push pedal subassembly. The machine case is formed with feed inlet, material loading chamber and discharge gate, and the material loading chamber communicates with feed inlet and discharge gate respectively. The conveying assembly comprises a conveying frame, a conveying driving piece and a magazine pushing piece, the conveying frame is arranged in the feeding cavity, the conveying driving piece is fixed in the conveying frame, one face of the conveying frame is provided with a conveying channel which is communicated with the conveying channel and a penetrating through hole, the feeding hole is communicated with one end of the conveying channel, the power output end of the conveying driving piece is connected with the magazine pushing piece, and the pushing end of the magazine pushing piece is penetrated through the penetrating through hole and the conveying frame in a sliding mode. The clamping assembly comprises a transverse moving part, a longitudinal moving part, a clamping frame, a clamping driving part and a clamping block, wherein the transverse moving part is arranged in the feeding cavity, the longitudinal moving part is fixed at the moving end of the transverse moving part, the clamping frame is fixed at the moving end of the longitudinal moving part, the clamping driving part is arranged at one end of the clamping frame, the clamping block is arranged at the power output end of the clamping driving part, a magazine clamping groove is formed between the clamping frame and the clamping block, one end of the magazine clamping groove is movably communicated with the other end of the conveying channel, and the other end of the magazine clamping groove is communicated with the discharge hole. The push plate assembly is arranged in the feeding cavity, and the push plate end of the push plate assembly is arranged towards the discharge hole, so that the push plate end of the push plate assembly is movably abutted against the semiconductor substrate in the magazine.

Referring to fig. 1 to 8, in order to better understand the magazine loading device 10 for semiconductor substrates of the present disclosure, the following further explanation of the magazine loading device 10 for semiconductor substrates is provided:

The magazine loading device 10 for semiconductor substrates according to an embodiment includes a chassis 100, a transfer assembly 200, a clamping assembly 300, and a pusher assembly 400. The machine case 100 is formed with a feed inlet 102, a feed cavity 104 and a discharge outlet 106, and the feed cavity 104 is respectively communicated with the feed inlet 102 and the discharge outlet 106. The conveying assembly 200 comprises a conveying frame 210, a conveying driving piece 220 and a magazine pushing piece 230, wherein the conveying frame 210 is arranged in the feeding cavity 104, the conveying driving piece 220 is fixed in the conveying frame 210, one surface of the conveying frame 210 is provided with a conveying channel 212 and a penetrating through hole 214 which are communicated, the feeding hole 102 is communicated with one end of the conveying channel 212, a power output end of the conveying driving piece 220 is connected with the magazine pushing piece 230, and a pushing end of the magazine pushing piece 230 is penetrated through the penetrating through hole 214 and is in sliding connection with the conveying frame 210. The clamping assembly 300 comprises a transverse moving member 310, a longitudinal moving member 320, a clamping frame 330, a clamping driving member 340 and a clamping block 350, wherein the transverse moving member 310 is arranged in the feeding cavity 104, the longitudinal moving member 320 is fixed at the moving end of the transverse moving member 310, the clamping frame 330 is fixed at the moving end of the longitudinal moving member 320, the clamping driving member 340 is arranged at one end of the clamping frame 330, the clamping block 350 is arranged at the power output end of the clamping driving member 340, a magazine clamping groove 302 is formed between the clamping frame 330 and the clamping block 350, one end of the magazine clamping groove 302 is movably communicated with the other end of the conveying channel 212, and the other end of the magazine clamping groove 302 is communicated with the discharge port 106. The push plate assembly 400 is mounted in the loading chamber 104 with the push plate end of the push plate assembly 400 disposed toward the discharge port 106 such that the push plate end of the push plate assembly 400 movably abuts against the semiconductor substrate in the magazine.

In this embodiment, the magazine is conveyed to the conveying channel 212 of the conveying rack 210 through the feeding port 102, and the conveying driving member 220 is controlled to drive the magazine pushing member 230 to move, so that the magazine is conveyed on the conveying channel 212 through the pushing end of the magazine pushing member 230, and the magazine approaches the magazine clamping slot 302. Meanwhile, the moving end of the transverse moving member 310 drives the longitudinal moving member 320 to approach toward the conveying frame 210, and the moving end of the longitudinal moving member 320 drives the clamping frame 330 to longitudinally move, so that the other end of the conveying channel 212 is communicated with the magazine clamping groove 302, that is, the pushing end of the magazine pushing member 230 pushes the magazine from the conveying channel 212 to the magazine clamping groove 302, and then the clamping driving member 340 outputs downward pressure, so that the clamping block 350 clamps the magazine, thereby ensuring a better clamping and positioning effect of the magazine. Further, since the magazine holding groove 302 is movably connected with the discharge port 106, that is, the magazine holding groove 302 is connected with the discharge port 106 by the transverse moving member 310 and the longitudinal moving member 320, the semiconductor substrate in the magazine is pushed to the discharge port 106 by the pushing plate end of the pushing plate assembly 400, so as to be transported to the downstream process equipment.

Further, the magazine is driven to move on the conveying frame 210 by the pushing end of the magazine pushing member 230 during the whole magazine transporting process, that is, the magazine slides on the conveying frame 210. Because the conveying frame 210 and the magazine can be made of metal, the contact between the conveying frame 210 and the magazine can be smoother, and the situation that the magazine rubs against the conveying belt to cause the abrasion of the conveying belt can be avoided.

It should be noted that each magazine is formed with a plurality of substrate placement grooves, that is, each magazine is capable of placing a plurality of semiconductor substrates.

As shown in fig. 5 and 6, in one embodiment, the conveying frame 210 is formed with a placement cavity 216, and the number of the through holes 214 is two, namely, a first through hole 214a and a second through hole 214b, and the placement cavity 216 is respectively communicated with the first through hole 214a and the second through hole 214 b.

As shown in fig. 3 to 7, in one embodiment, the conveying driving member 210 is disposed in the placement cavity 216, the magazine pushing member 230 includes a fixed block 2310, a first rotating block 2320, a second rotating block 2330, a first connecting shaft 2340 and a second connecting shaft 2350, the fixed block 2310 is fixedly mounted on the power output end of the conveying driving member 220, the first rotating block 2320 and the second rotating block 2330 are both sleeved on the first connecting shaft 2340, the first rotating block 2320 and the second rotating block 2330 are both rotationally connected with the first connecting shaft 2340, one end of the first connecting shaft 2340 is connected with the fixed block 2310, two ends of the second connecting shaft 2350 are fixedly connected with the first rotating block 2320 and the second rotating block 2330 respectively, the pushing end of the first rotating block 2320 is penetrating through the first penetrating through hole 214a and the conveying frame 210, and the pushing end of the second rotating block 2330 is penetrating through the second penetrating through hole 214b and the conveying frame 210. It will be appreciated that the pushing end of the first turning block 2320 and the pushing end of the second turning block 2330 may push multiple magazines to be transported in the transport channel 212 as the magazine pusher 230 moves in the magazine transport direction. However, the magazine is continuously fed from the feeding port 102 to the conveying channel 212, that is, the magazine pusher 230 needs to be moved to the feeding port 102 along the reverse direction of the magazine conveyance, at this time, the magazine pusher 230 will encounter the magazine during the movement process, and the magazine will push the pushing end of the first rotating block 2320 and the pushing end of the second rotating block 2330 in the reverse direction, so that the first rotating block 2320 and the second rotating block 2330 rotate relative to the first connecting shaft 2340, so that a portion of the second connecting shaft 2350 of the magazine pusher 230 is tilted, and the pushing end of the first rotating block 2320 and the pushing end of the second rotating block 2330 are respectively contracted at the first penetrating through hole 214a and the second penetrating through hole 214b. When the reverse thrust of the magazine disappears, the portion of the second connecting shaft 2350 of the magazine pusher 230 will descend according to gravity, so that the pushing end of the first rotating block 2320 and the pushing of the second rotating block 2330 will shuttle again the first penetrating opening 214a and the second penetrating opening 214b, so that the magazine loading device 10 can continuously load, and the loading efficiency of the magazine loading device 10 can be effectively improved.

As shown in fig. 3 to 6, in one embodiment, the conveying assembly 200 further includes an empty magazine 240 and a pushing driving member 250, the empty magazine 240 is mounted on one surface of the conveying frame 210, the empty magazine 240 is located above the conveying frame 210, the pushing driving member 250 is mounted on the empty magazine 240, and a power output end of the pushing driving member 250 is disposed towards the magazine clamping slot 302. It can be appreciated that the push plate assembly 400 pushes the substrate in the magazine to the downstream process equipment, and then the transverse moving member 310 drives the longitudinal moving member 320 to perform the transverse displacement, and the longitudinal moving member 320 drives the clamping frame 330 to perform the longitudinal displacement, so that the clamping frame 330 abuts against one end of the empty magazine storage frame 240. Finally, the clamping block 350 is released by controlling the clamping drive 340 so that the empty magazine falls onto the empty magazine 240. By analogy, when the next empty magazine is put on the rack, the previous empty magazine is pushed to move on the empty magazine storage rack 240, the empty magazine storage rack 240 can be fully arranged through multiple times of empty magazine putting operation, and then the empty magazine is taken out from the empty magazine storage rack 240 by a worker, so that the effect of continuous feeding of the semiconductor substrate is realized, and the feeding efficiency of the magazine feeding device 10 is effectively improved. When the magazine is transferred from the transfer channel 212 to the magazine clamping groove 302, the clamping block 350 is driven by the clamping driving member 340 to clamp the magazine, and the power output end of the pushing driving member 250 acts on the magazine in the magazine clamping groove 302 to align the magazine in the magazine clamping groove 302, so as to effectively improve the magazine clamping and positioning effect of the magazine loading device 10.

Further, in other embodiments, an alarm is provided on the chassis 100, and a pressure sensor is provided at an end of the empty box storage rack 240 near the feed inlet 102, where the alarm is in communication connection with the pressure sensor. It will be appreciated that when the pressure sensor senses an empty magazine, it indicates that the empty magazine 240 is full, and a signal is transmitted to the alarm device to cause the alarm device to sound an alarm to alert the worker to remove the empty magazine.

As shown in fig. 8, in one embodiment, the lateral moving member 310 includes a lateral driving member 3110 and a lateral moving block 3120, where the lateral driving member 3110 is disposed in the feeding chamber 104, so that the lateral driving member 3110 is installed in the chassis 100, one end of the lateral moving block 3120 is connected to a power output end of the lateral driving member 3110, and the other end of the lateral moving block 3120 is connected to the longitudinal moving member 320. It will be appreciated that the lateral movement of the lateral movement block 3120 is driven by the lateral drive 3110, i.e., the clamping frame 330 can be moved closer to or farther from the transfer frame 210 for a clamping operation.

As shown in fig. 8, in one embodiment, the longitudinal moving member 320 includes a longitudinal driving member 3210 and a longitudinal moving block 3220, the longitudinal driving member 3210 is connected to the other end of the lateral moving block 3120, one end of the longitudinal moving block 3220 is connected to a power output end of the longitudinal driving member 3210, and the other end of the longitudinal moving block 3220 is connected to the clamping frame 330. It will be appreciated that the longitudinal drive 3210 drives the longitudinal motion block 3220 in a longitudinal direction, even though the carriage 330 is capable of lifting, on the one hand, the carriage 330 is lifted when the pusher plate assembly 400 is output to ensure that each substrate within the magazine is pushed to downstream processing equipment. On the other hand, empty magazines can be transported onto the empty magazine 240.

As shown in fig. 2, 3, 4 and 8, in one embodiment, the push plate assembly 400 includes a push plate driving member 400 and a push plate lever 420, where the push plate driving member 400 is disposed in the loading chamber 104, so that the push plate driving member 400 is installed in the chassis 100, one end of the push plate lever 420 is disposed on a power output end of the push plate driving member 400, and the other end of the push plate lever 420 is disposed toward the discharge port 106. It will be appreciated that the pusher bar 420 is driven toward the discharge port 106 by the power output of the pusher driver 400 to discharge the substrate within the magazine.

As shown in fig. 2 to 4, in one embodiment, the magazine loading device 10 further includes a loading assembly 500, where the loading assembly 500 includes a loading bracket 510, an adjusting driving member 520, a first loading driving member 530 and a second loading driving member 540, the loading bracket 510 is disposed in the loading cavity 104, so that the loading bracket 510 is fixedly connected with the chassis 100, the adjusting driving member 520 is mounted on the loading bracket 510, the first loading driving member 530 and the loading driving member are both disposed on the loading bracket 510, the second loading driving member 540 is connected with the power output end of the adjusting driving member 520, so that the second loading driving member 540 is slidably connected with the loading bracket 510, a loading channel is formed between the power output end of the first loading driving member 530 and the power output end of the second loading driving member 540, and one end of the loading channel is movably connected with the magazine clamping slot 302, and the other end of the loading channel is connected with the discharge port 106. It can be appreciated that the adjustment of the distance between the second blanking driving member 540 and the first blanking driving member 530 by the adjustment driving member 520 can adapt to the blanking requirements of different size substrates, thereby effectively improving the adaptability of the magazine loading device 10.

It should be noted that, the first blanking driving member 530 and the second blanking driving member 540 are belt transmission driving members, and the power output end of the first blanking driving member 530 and the power output end of the second blanking driving member 540 are both conveyor belts, that is, the two conveyor belts form a blanking channel, so that the substrate can be transferred to the downstream process equipment through the blanking channel.

As shown in fig. 1 to 8, in one embodiment, the chassis 100 is provided with a control panel 110, and the control panel 110 is respectively connected to the conveying driving member 220, the pushing driving member 250, the transverse driving member 3110, the longitudinal driving member 3210, the clamping driving member 340, the adjusting driving member 520, the first blanking driving member 530, and the second blanking driving member 540 in a communication manner. It will be appreciated that the operation of the magazine loading device 10 can be simplified by the control panel 110, so that the operational simplicity of the magazine loading device 10 is effectively improved.

The disclosure also provides magazine feeding equipment for the semiconductor substrate, which comprises the magazine feeding device for the semiconductor substrate.

In this embodiment, the magazine is conveyed to the conveying channel of the conveying frame through the feeding port, and the conveying driving member is controlled to drive the magazine pushing member to move, so that the magazine is conveyed on the conveying channel through the pushing end of the magazine pushing member, and the magazine is close to the magazine clamping groove. Meanwhile, the moving end of the transverse moving piece drives the longitudinal moving piece to approach the conveying frame, and the moving end of the longitudinal moving piece drives the clamping frame to longitudinally move, so that the other end of the conveying channel is communicated with the magazine clamping groove, namely, the pushing end of the magazine pushing piece pushes the magazine from the conveying channel to the magazine clamping groove, and downward pressure is output through the clamping driving piece, so that the magazine is clamped by the clamping block, and a good clamping and positioning effect of the magazine can be ensured. And because the magazine clamping groove is movably communicated with the discharge hole, namely, the magazine clamping groove is communicated with the discharge hole through the transverse moving piece and the longitudinal moving piece, and the semiconductor substrate in the magazine is pushed to the discharge hole through the push plate end of the push plate assembly, so that the semiconductor substrate is conveyed to downstream process equipment.

Further, the magazine is driven to move on the conveying frame by the pushing end of the magazine pushing piece in the whole magazine conveying process, namely, the magazine slides on the conveying frame. And because the conveying frame and the magazine can be made of metal materials, the contact between the conveying frame and the magazine can be smoother, and the situation that the magazine rubs with a conveying belt to cause the abrasion of the conveying belt can be avoided.

Compared with the prior art, the method has at least the following advantages:

The foregoing examples represent only a few embodiments of the present disclosure, which are described in more detail and detail, but are not to be construed as limiting the scope of the disclosure. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure. Accordingly, the scope of protection of the present disclosure should be determined by the following claims.

Claims

1. A magazine loading attachment for semiconductor substrates, characterized by comprising:

2. The magazine loading mechanism for semiconductor substrates as recited in claim 1, wherein said transfer frame defines a placement cavity, said number of through openings being two, a first through opening and a second through opening, respectively, said placement cavity being in communication with said first through opening and said second through opening, respectively.

3. The magazine loading attachment for semiconductor substrates according to claim 2, wherein the transfer drive member is disposed in the placement cavity, the magazine pushing member includes a fixed block, a first rotating block, a second rotating block, a first connecting shaft and a second connecting shaft, the fixed block is fixedly mounted on the power output end of the transfer drive member, the first rotating block and the second rotating block are both sleeved on the first connecting shaft, the first rotating block and the second rotating block are both rotatably connected with the first connecting shaft, one end of the first connecting shaft is connected with the fixed block, two ends of the second connecting shaft are respectively fixedly connected with the first rotating block and the second rotating block, the pushing end of the first rotating block is disposed through the first through hole and the transfer frame in a sliding manner, and the pushing end of the second rotating block is disposed through the second through hole and the transfer frame in a sliding manner.

4. A magazine loading mechanism for semiconductor substrates as recited in claim 3, wherein said transfer assembly further comprises an empty magazine rack and a push-magazine drive, said empty magazine rack being mounted on one side of said transfer rack, said empty magazine rack being positioned above said transfer rack, said push-magazine drive being mounted on said empty magazine rack, said push-magazine drive having its power output end disposed toward said magazine clamping slot.

5. The magazine loading mechanism for semiconductor substrates as recited in claim 4, wherein said traverse member includes a traverse driving member and a traverse block, said traverse driving member being disposed in said loading chamber such that said traverse driving member is mounted in said housing, one end of said traverse block being connected to a power output end of said traverse driving member, and the other end of said traverse block being connected to said longitudinal moving member.

6. The magazine loading mechanism for semiconductor substrates as recited in claim 5, wherein said longitudinal moving member includes a longitudinal driving member and a longitudinal moving block, said longitudinal driving member being connected to the other end of said lateral moving block, one end of said longitudinal moving block being connected to a power output end of said longitudinal driving member, and the other end of said longitudinal moving block being connected to said holding frame.

7. The device of claim 6, wherein the pusher assembly comprises a pusher driving member and a pusher bar, the pusher driving member being disposed in the loading chamber such that the pusher driving member is mounted in the housing, one end of the pusher bar being disposed on a power output end of the pusher driving member, and the other end of the pusher bar being disposed toward the discharge port.

8. The device of claim 7, further comprising a blanking assembly, wherein the blanking assembly comprises a blanking bracket, an adjusting driving member, a first blanking driving member and a second blanking driving member, the blanking bracket is disposed in the feeding cavity so that the blanking bracket is fixedly connected with the chassis, the adjusting driving member is mounted on the blanking bracket, the first blanking driving member and the blanking driving member are both disposed on the blanking bracket, the second blanking driving member is connected with a power output end of the adjusting driving member so that the second blanking driving member is slidably connected with the blanking bracket, a blanking channel is formed between the power output end of the first blanking driving member and the power output end of the second blanking driving member, one end of the blanking channel is movably communicated with the clamping groove of the magazine, and the other end of the blanking channel is communicated with the discharge port.

9. The magazine loading mechanism for semiconductor substrates of claim 8, wherein the housing is provided with a control panel in communication with the transfer drive, the push drive, the lateral drive, the longitudinal drive, the clamping drive, the adjustment drive, the first blanking drive, and the second blanking drive, respectively.

10. A magazine loading apparatus for semiconductor substrates, characterized by comprising the magazine loading device for semiconductor substrates according to any one of claims 1 to 9.