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CN221710132U - Multilayer printed PCB circuit board capable of rapidly radiating heat - Google Patents

Multilayer printed PCB circuit board capable of rapidly radiating heat Download PDF

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Publication number
CN221710132U
CN221710132U CN202420051432.4U CN202420051432U CN221710132U CN 221710132 U CN221710132 U CN 221710132U CN 202420051432 U CN202420051432 U CN 202420051432U CN 221710132 U CN221710132 U CN 221710132U
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CN
China
Prior art keywords
plate
assembly
bottom plate
middle plate
splicing
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Active
Application number
CN202420051432.4U
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Chinese (zh)
Inventor
刘家万
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Foshan Shunde Baodu Electronics Co ltd
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Foshan Shunde Baodu Electronics Co ltd
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Priority to CN202420051432.4U priority Critical patent/CN221710132U/en
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Publication of CN221710132U publication Critical patent/CN221710132U/en
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Abstract

The utility model relates to the technical field of circuit boards, in particular to a multilayer printed PCB circuit board capable of rapidly radiating heat. The circuit board comprises a top plate, wherein the bottom of the top plate is fixedly connected with a middle plate, the bottom of the middle plate is fixedly connected with a splicing assembly, screws are movably communicated between the top plate and four corners of the middle plate and the splicing assembly, and the top plate and the middle plate are integrated with the splicing assembly into a circuit board; the inside swing joint of concatenation subassembly has the subassembly of blowing, and the inside swing joint has joint subassembly with the concatenation subassembly between the subassembly of blowing. According to the utility model, the air blowing component is fixed inside the splicing component through the clamping component, the splicing components are connected with each other, the plurality of circuit boards are connected integrally, the bolts downwards penetrate through the middle plate and the splicing component from the top plate, the circuit boards formed by the top plate, the middle plate and the splicing component are assembled on the electronic component integrally, the air blowing component is used for blowing air upwards, and the middle plate is ventilated and cooled, so that the integral cooling speed of the circuit boards is accelerated.

Description

Multilayer printed PCB circuit board capable of rapidly radiating heat
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a multilayer printed PCB circuit board capable of rapidly radiating heat.
Background
The PCB printed board, also called printed circuit board, multilayer printed board refers to more than two layers of printed boards, it is made up of connecting wires on several layers of insulating base plates and bonding pads for assembling and welding electronic components, it has effects of conducting each layer of circuit, and insulating each other.
For multilayer printed PCB circuit boards, there are many prior art techniques, such as:
Chinese patent publication No. CN219087587U discloses a but quick radiating multilayer printed PCB circuit board, including base and movable mounting No. one circuit board, no. two circuit boards and No. three circuit boards on the base, be equipped with heat dissipation mechanism on base and No. one circuit board, no. two circuit boards and No. three circuit boards, heat dissipation mechanism is including fixed mounting in base upper surface and the heat dissipation mounting panel that is two in quantity, two the mounting groove that is three in quantity has all been seted up to the opposite side surface of heat dissipation mounting panel, no. one circuit board, no. two circuit boards and No. three circuit boards left surface and right surface fixed mounting have a heat conduction piece respectively. This but quick radiating multilayer printed PCB circuit board is equipped with the heat conduction piece through being equipped with on the circuit board, is equipped with the heat dissipation mounting panel on the base, is equipped with mounting groove, heating panel and radiating fin on the heat dissipation mounting panel, is equipped with the return bend in the heating panel, is equipped with the coolant liquid in the return bend, can take away the heat that produces on the circuit board fast when using, prevents that circuit board surface temperature from being too high.
Considering that the PCB circuit board needs to bear a plurality of electronic components, each electronic component can generate heat energy when working, part of heat energy is radiated through air, and part of heat energy is transmitted to the PCB circuit board and needs to radiate the PCB circuit board, but the existing PCB circuit board is poor in self heat radiation, and most of the existing PCB circuit board radiates heat through a plurality of heat radiation holes, so that the heat radiation speed is low, and meanwhile dust is easy to block inside the circuit board.
In view of the above, the utility model provides a multilayer printed PCB circuit board capable of rapidly radiating heat.
Disclosure of utility model
The utility model provides a multilayer printed PCB circuit board capable of rapidly radiating, which comprises a top plate, wherein the bottom of the top plate is fixedly connected with a middle plate, the bottom of the middle plate is fixedly connected with a splicing assembly, screws are movably communicated between the top plate and four corners of the middle plate and the splicing assembly, and the top plate, the middle plate and the splicing assembly are integrated into a circuit board;
The inside swing joint of concatenation subassembly has the subassembly of blowing, the inside joint subassembly that has of activity intercommunication between the subassembly of blowing and the concatenation subassembly.
As a further improvement of the technical scheme, a plurality of air holes are formed in the middle plate, a plurality of channels are formed in the cross section of the middle plate, the channels in the middle plate are communicated with the air holes, and the air holes and the channels in the middle plate are used for better radiating the circuit board.
As a further improvement of the technical scheme, the splicing assembly comprises a bottom plate, the bottom plate is fixedly connected to the bottom of the middle plate, a convex plate is fixedly connected to the outer wall of one side of the bottom plate, a groove is formed in the outer wall of the other side of the bottom plate, one of the convex plates on the bottom plate is movably connected to the inside of the groove of the other bottom plate, a blowing assembly is movably connected to the inside of the groove in the center of the bottom plate, and the splicing assembly is used for splicing a plurality of circuit boards.
As a further improvement of the technical scheme, the blowing component comprises a frame, the frame is movably connected inside a groove in the center of the bottom plate, a plurality of supports are fixedly connected inside the frame, fans are movably communicated between the supports, a motor is fixedly connected with the end part of the support, which is positioned in the middle of the frame, of a fan rotating shaft, a clamping component is movably connected between the inside of the frame and the inside of the bottom plate, and the blowing component is used for blowing and radiating the middle plate.
As a further improvement of the technical scheme, the clamping assembly comprises a supporting rod, the supporting rod is movably communicated between the frame and the inside of the bottom plate, an elastic piece is fixedly connected between one end part of the supporting rod and the inside of the bottom plate, and the clamping assembly is used for fixing the position between the blowing assembly and the bottom plate.
Compared with the prior art, the utility model has the beneficial effects that:
Fix the subassembly of blowing inside splice assembly through joint subassembly, through a plurality of splice assembly interconnect, conveniently connect a plurality of circuit boards are whole, pass medium plate and splice assembly downwards from the roof through with the screw, with the circuit board whole assembly that roof and medium plate and splice assembly constitute on electronic components, upwards blow through the subassembly of blowing, ventilate the heat dissipation to the centering board to accelerate the holistic radiating rate of circuit board.
Drawings
The utility model is described in more detail below, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of an exploded construction of the present utility model;
FIG. 3 is a schematic view of a midplane structure of the present utility model;
FIG. 4 is a schematic view of a buckle structure according to the present utility model;
FIG. 5 is a schematic view of the structure of FIG. 4A according to the present utility model;
Fig. 6 is a schematic diagram of a blowing structure according to the present utility model.
The meaning of each reference sign in the figure is: 1. a top plate; 10. a screw; 11. a middle plate; 12. a splice assembly; 120. a bottom plate; 121. a convex plate; 13. a blowing assembly; 130. a frame; 131. a bracket; 132. a fan; 14. a clamping assembly; 140. a support rod; 141. an elastic member.
Detailed Description
As shown in fig. 1-6, the device comprises a top plate 1, wherein the bottom of the top plate 1 is fixedly connected with a middle plate 11, the bottom of the middle plate 11 is fixedly connected with a splicing assembly 12, screws 10 are movably communicated between the top plate 1 and four corners of the middle plate 11 and the splicing assembly 12, and the top plate 1, the middle plate 11 and the splicing assembly 12 are integrated into a circuit board;
The inside of the splicing component 12 is movably connected with a blowing component 13, and a clamping component 14 is movably communicated between the inside of the blowing component 13 and the splicing component 12;
Firstly, a specific structure of a splicing assembly 12 is disclosed, the splicing assembly 12 comprises a bottom plate 120, the bottom plate 120 is fixedly connected to the bottom of a middle plate 11, a convex plate 121 is fixedly connected to the outer wall of one side of the bottom plate 120, a groove is formed in the outer wall of the other side of the bottom plate 120, the convex plate 121 on one bottom plate 120 is movably connected to the inside of the groove of the other bottom plate 120, a blowing assembly 13 is movably connected to the inside of the groove in the center of the bottom plate 120, the splicing assembly 12 is used for splicing a plurality of circuit boards, and the convex plate 121 on one bottom plate 120 is clamped in the inside of the groove on the side edge of the other bottom plate 120, so that the two bottom plates 120 are connected, and the two circuit boards are conveniently spliced;
According to the above disclosure of the specific structure of the air blowing assembly 13, the air blowing assembly 13 includes a frame 130, the frame 130 is movably connected in a groove in the center of the bottom plate 120, a plurality of brackets 131 are fixedly connected in the frame 130, a fan 132 is movably connected between the two brackets 131, a motor is fixedly connected to an end portion of the bracket 131 located in the middle of the frame 130 and penetrating through a rotating shaft of the fan 132, a clamping assembly 14 is movably connected between the inside of the frame 130 and the inside of the bottom plate 120, the air blowing assembly 13 is used for blowing and radiating the middle plate 11, the motor drives the fan 132 to rotate between the two brackets 131, and the fan 132 rotates for blowing air to enable an air body to be blown to the middle plate 11 from the inside of the frame 130, so that air circulation in the middle plate 11 is accelerated, and the radiating speed is improved;
According to the above disclosure for the specific structure of the clamping assembly 14, the clamping assembly 14 includes the supporting rod 140, the supporting rod 140 is movably connected between the frame 130 and the inside of the bottom plate 120, the elastic member 141 is fixedly connected between one end of the supporting rod 140 and the inside of the bottom plate 120, the clamping assembly 14 is used for fixing the position between the blowing assembly 13 and the bottom plate 120, the elastic member 141 is driven to shrink by pressing the supporting rod 140, so that the supporting rod 140 is conveniently shrunk into the inside of the bottom plate 120, the supporting rod 140 is driven to move into the inside of the frame 130 by elastic resilience of the elastic member 141 by clamping the frame 130 in the groove in the center of the bottom plate 120, so that the supporting rod 140 is located between the frame 130 and the bottom plate 120, and the position between the frame 130 and the bottom plate 120 is fixed.
The improvement of the embodiment is that: the supporting rod 140 is pressed to drive the elastic element 141 to retract, so that the supporting rod 140 is conveniently retracted into the bottom plate 120, the frame 130 is clamped in the groove in the center of the bottom plate 120, the elastic element 141 elastically rebounds to drive the supporting rod 140 to move into the frame 130, the supporting rod 140 is positioned between the frame 130 and the bottom plate 120, the position between the frame 130 and the bottom plate 120 is fixed, the convex plate 121 on one bottom plate 120 is clamped in the groove on the side edge of the other bottom plate 120, the two bottom plates 120 are connected, the two circuit boards are conveniently spliced, the screw 10 passes through the middle plate 11 and the splicing component 12 downwards from the top plate 1, the circuit boards formed by the top plate 1, the middle plate 11 and the splicing component 12 are integrally assembled on an electronic component, the fan 132 is driven to rotate between the two brackets 131 through a motor, the fan 132 rotates to blow, so that wind bodies are output from the inside the frame 130 to the middle plate 11, the air circulation inside the middle plate 11 is accelerated, and the heat dissipation speed is improved;
In order to facilitate accelerating the heat dissipation speed of the middle plate 11, a plurality of air holes are formed in the middle plate 11, a plurality of channels are formed in the cross section of the middle plate 11, the channels in the middle plate 11 are communicated with the air holes, the air holes and the channels of the middle plate 11 are used for better dissipating heat of the circuit board, and the heat is output to the outside of the middle plate 11 through the channels through the communication of the heat dissipation channels between the plurality of air holes of the middle plate 11, so that the heat dissipation capacity of the middle plate 11 is improved, and the overall heat dissipation performance of the circuit board is improved;
to sum up, the working principle of the scheme is as follows:
Fix the subassembly 13 of blowing inside concatenation subassembly 12 through joint subassembly 14, wherein joint subassembly 14 drives elastic component 141 through pressing branch 140 and contracts, thereby conveniently contract the bottom plate 120 inside with branch 140, through the inside recess with frame 130 card at bottom plate 120 center, inside driving branch 140 through elastic component 141 elasticity resilience moves frame 130, make branch 140 be located between frame 130 and bottom plate 120, fix the position between frame 130 and the bottom plate 120, interconnect through a plurality of concatenation subassemblies 12, the convenience is whole to be connected to a plurality of circuit boards, wherein concatenation subassembly 12 is through the boss 121 joint on one of them bottom plate 120 inside the recess of another bottom plate 120 side, thereby connect two bottom plates 120, conveniently splice two circuit boards, pass medium plate 11 and concatenation subassembly 12 downwards from roof 1 through with screw 10, the circuit board that roof 1 and medium plate 11 and concatenation subassembly 12 constitute is whole to be assembled on electronic components, through the subassembly 13 of blowing upwards, thereby the speed of accelerating circuit board is whole, wherein subassembly 13 drives fan 132 through the motor and rotates between two fans 132 at the inside the frame 11 through the rotation of a plurality of frames, the inside the heat dissipation channel is through the medium plate 11 through the heat dissipation channel is improved, the inside the ventilation channel is realized through the inside the medium plate 11, the ventilation channel is increased, the ventilation channel is realized through the inside the medium plate 11, the ventilation channel is realized through the ventilation channel is increased, the ventilation channel is realized through the inside the medium plate 11.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (5)

1. The utility model provides a but quick radiating multilayer printed PCB circuit board, includes roof (1), its characterized in that: the bottom of the top plate (1) is fixedly connected with a middle plate (11), the bottom of the middle plate (11) is fixedly connected with a splicing assembly (12), screws (10) are movably communicated between the top plate (1) and four corners of the middle plate (11) and the splicing assembly (12), and the top plate (1), the middle plate (11) and the splicing assembly (12) are integrated into a circuit board;
The splicing assembly (12) is internally and movably connected with a blowing assembly (13), and a clamping assembly (14) is movably communicated between the inside of the blowing assembly (13) and the splicing assembly (12).
2. The rapidly radiating multilayer printed PCB of claim 1 wherein: the circuit board is characterized in that a plurality of ventilation holes are formed in the middle plate (11), a plurality of channels are formed in the cross section of the middle plate (11), the channels in the middle plate (11) are communicated with the ventilation holes, and the ventilation holes and the channels in the middle plate (11) are used for better radiating the circuit board.
3. The rapidly radiating multilayer printed PCB of claim 1 wherein: the splicing assembly (12) comprises a bottom plate (120), the bottom plate (120) is fixedly connected to the bottom of the middle plate (11), a convex plate (121) is fixedly connected to the outer wall of one side of the bottom plate (120), grooves are formed in the outer wall of the other side of the bottom plate (120), one convex plate (121) on the bottom plate (120) is movably connected to the inside of the groove of the other bottom plate (120), a blowing assembly (13) is movably connected to the inside of the groove in the center of the bottom plate (120), and the splicing assembly (12) is used for splicing a plurality of circuit boards.
4. The rapidly radiating multilayer printed PCB of claim 3 wherein: the air blowing assembly (13) comprises a frame (130), the frame (130) is movably connected inside a groove in the center of the bottom plate (120), a plurality of brackets (131) are fixedly connected inside the frame (130), fans (132) are movably communicated between the brackets (131), the rotating shafts of the fans (132) penetrate through end parts of the brackets (131) positioned in the middle of the frame (130) and are fixedly connected with motors, a clamping assembly (14) is movably connected between the inside of the frame (130) and the inside of the bottom plate (120), and the air blowing assembly (13) is used for blowing and radiating the middle plate (11).
5. The rapidly radiating multilayer printed PCB of claim 4 wherein: the clamping assembly (14) comprises a supporting rod (140), the supporting rod (140) is movably communicated between the frame (130) and the inside of the bottom plate (120), an elastic piece (141) is fixedly connected between one end part of the supporting rod (140) and the inside of the bottom plate (120), and the clamping assembly (14) is used for fixing the position between the blowing assembly (13) and the bottom plate (120).
CN202420051432.4U 2024-01-09 2024-01-09 Multilayer printed PCB circuit board capable of rapidly radiating heat Active CN221710132U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202420051432.4U CN221710132U (en) 2024-01-09 2024-01-09 Multilayer printed PCB circuit board capable of rapidly radiating heat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202420051432.4U CN221710132U (en) 2024-01-09 2024-01-09 Multilayer printed PCB circuit board capable of rapidly radiating heat

Publications (1)

Publication Number Publication Date
CN221710132U true CN221710132U (en) 2024-09-13

Family

ID=92650468

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202420051432.4U Active CN221710132U (en) 2024-01-09 2024-01-09 Multilayer printed PCB circuit board capable of rapidly radiating heat

Country Status (1)

Country Link
CN (1) CN221710132U (en)

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