CN221669994U - Heat radiation structure for computer network switch - Google Patents
Heat radiation structure for computer network switch Download PDFInfo
- Publication number
- CN221669994U CN221669994U CN202323495916.2U CN202323495916U CN221669994U CN 221669994 U CN221669994 U CN 221669994U CN 202323495916 U CN202323495916 U CN 202323495916U CN 221669994 U CN221669994 U CN 221669994U
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- switch
- heat dissipation
- main body
- switch main
- fixedly connected
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- 230000005855 radiation Effects 0.000 title claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 238000001816 cooling Methods 0.000 claims description 12
- 230000000087 stabilizing effect Effects 0.000 claims description 5
- 238000005057 refrigeration Methods 0.000 abstract description 8
- 241000883990 Flabellum Species 0.000 abstract description 6
- 238000004891 communication Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000002411 adverse Effects 0.000 abstract 1
- 239000007787 solid Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of communication equipment, and discloses a heat dissipation structure for a computer network switch, which comprises a switch main body, wherein a heat dissipation mechanism is arranged below the switch main body; the heat dissipation mechanism comprises a fixing frame, the outer surface of the fixing frame is fixedly connected with the inner bottom wall of the switch main body, the inner wall of the fixing frame is fixedly connected with a semiconductor refrigerating sheet and a fixing ring respectively, two groups of temperature sensors are arranged in the switch main body, and the inner wall of the fixing ring is fixedly connected with a heat dissipation fan bracket. This heat radiation structure for computer network switch through being provided with switch main part, temperature sensor, heat dissipation fan support, rotation motor and the cooperation of rotating the flabellum, dispels the heat in the switch main part, and the cooperation of reuse temperature sensor and semiconductor refrigeration piece utilizes this semiconductor refrigeration piece upper surface refrigeration side, conveniently dispels the heat to the switch, plays the effect that reduces this computer network switch and damage problem in the high-order operation in adverse circumstances.
Description
Technical Field
The utility model relates to the technical field of communication equipment, in particular to a heat dissipation structure for a computer network switch.
Background
Along with the development of the era, the switch cooling cabinet types are more and more diversified, and the switch cooling cabinet is used for storing the cabinet of switch, and because the switch can give off heat in the operation process, in order to prevent that the switch is too high to make its internal parts receive the damage, the heat dissipation of switch cabinet must be high-efficient.
The utility model discloses a heat radiation structure of a computer network core switch cabinet with the prior authorized bulletin number of CN208971897U, which comprises a main body, fan blades and an electric motor, wherein the upper end of the main body is provided with a connecting plate, a bearing is arranged on the connecting plate, the base is fixed with one end of a supporting rod, the bearing is fixed on the connecting plate, the supporting rod is arranged in the main body, one end of each fan blade is fixed on a rotating rod, the electric motor is arranged above the main body, one end of a storage plate is fixed on the supporting rod, and a wire outlet hole is formed in the bottom end of the supporting rod.
By adopting the technical scheme, through installing the bearing on the connecting plate, the pivot rotates through electric motor, drive flabellum and connecting plate and rotate, the flabellum is fixed in the main part, thereby make the main part rotate around the bracing piece, the air current connecting plate both ends and the mounting groove that the flabellum produced enter into the inside in-process of main part, the air current produces acceleration effect, be favorable to the inside air of main part to dispel the heat, but above-mentioned technical scheme only utilizes the radiator fan to accelerate the inside air flow of this computer network switch, make the inside hot air of computer network switch carry out heat exchange with the cool air in the external environment, and when the air temperature in the environment is also higher, it is relatively poor to carry out radiating efficiency to the computer network switch inside through the radiator fan, thereby can make this computer network switch internal element high-order operation in comparatively abominable environment for a long time, and then not only influence the operation of this computer network switch, also can cause the inside problem of damage of this computer network switch.
Accordingly, one skilled in the art provides a heat dissipation structure for a computer network switch to solve the above-mentioned problems.
Disclosure of utility model
The present utility model is directed to a heat dissipation structure for a computer network switch, so as to solve the problems set forth in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The heat dissipation structure for the computer network switch comprises a switch main body, wherein a heat dissipation mechanism is arranged below the switch main body;
The heat dissipation mechanism comprises a fixing frame, the surface of fixing frame and the interior bottom wall fixed connection of switch main part, the inner wall of fixing frame is fixedly connected with semiconductor refrigeration piece and solid fixed ring respectively, the inside of switch main part is provided with two sets of temperature sensor, the inner wall fixedly connected with heat dissipation fan support of solid fixed ring, the interior bottom wall fixedly connected with rotation motor of heat dissipation fan support, every group temperature sensor all passes through the PLC controller and semiconductor refrigeration piece and rotates motor signal connection, rotation motor's output fixedly connected with rotation flabellum.
As still further aspects of the utility model: the left side of the switch main body is fixedly embedded with connecting joints which are arranged at equal distances, and the left side of the switch main body is fixedly connected with light emitting diodes.
As still further aspects of the utility model: the front surface of the switch main body and the back surface of the switch main body are provided with heat dissipation grooves which are arranged at equal intervals, and the number of the heat dissipation grooves is at least two.
As still further aspects of the utility model: the inside threaded connection of switch main part has two sets of supporting legs, every group the bottom of supporting leg is all fixedly connected with support chassis.
As still further aspects of the utility model: the outer surface of each group of supporting legs is fixedly connected with a torsion nut, and the upper surface of each group of torsion nuts is contacted with the bottom surface of the switch main body.
As still further aspects of the utility model: the inner wall fixedly connected with switch mainboard of switch main part, every group temperature sensor's bottom all is connected with the last fixed surface of switch mainboard, the last fixed surface of switch mainboard is connected with two sets of spliced poles, every group the top of spliced pole all is connected with the interior roof fixed connection of switch main part.
As still further aspects of the utility model: the outer surface of the rotating motor is fixedly connected with a stabilizing ring, and the bottom surface of the stabilizing ring is fixedly connected with the inner bottom wall of the cooling fan bracket.
Compared with the prior art, the utility model has the beneficial effects that:
According to the utility model, through the cooperation of the switch main body, the fixing frame, the fixing ring, the temperature sensor, the heat radiation fan support, the rotating motor and the rotating fan blades, the heat radiation fan support can be fixed in the fixing ring by utilizing the bottom surface fixing frame of the switch main body, so that the rotating motor and the rotating fan blades can be fixed in the fixing frame of the bottom surface of the switch main body by utilizing the heat radiation fan support, the temperature sensor is utilized to measure the air temperature in the switch main body, when the measured temperature is high, the rotating fan blades are driven to rotate by controlling the rotating motor, the air flow in the switch main body is accelerated, the heat radiation in the switch main body is facilitated, and the cooperation of the temperature sensor and the semiconductor cooling fins is utilized, so that when the temperature sensor measures that the air temperature in the switch main body is always high, namely, the heat radiation in the switch main body can not be realized by utilizing the ordinary ventilation heat radiation, the upper surface cooling side of the semiconductor cooling fins can be utilized by controlling the power supply of the semiconductor cooling fins, and the cooling fan is utilized to emit the cooling air into the switch main body, so that the computer network can be conveniently used for cooling the computer network, and the computer network can be conveniently damaged, and the problem of high-level operation of the switch in the severe environment is reduced.
Drawings
FIG. 1 is a schematic diagram of a heat dissipation structure for a computer network switch;
Fig. 2 is a schematic diagram of a bottom perspective view of a main body of a heat dissipating structure for a computer network switch;
FIG. 3 is a schematic perspective view of a cross-sectional view of a heat dissipation structure for a computer network switch;
fig. 4 is a schematic perspective view of a heat dissipation fan support in a heat dissipation structure for a computer network switch.
In the figure: 1. a switch body; 2. a heat dissipation mechanism; 201. a fixing frame; 202. a semiconductor refrigeration sheet; 203. a fixing ring; 204. a heat radiation fan bracket; 205. a rotating motor; 206. rotating the fan blades; 207. a temperature sensor; 3. a light emitting diode; 4. a connection joint; 5. a heat sink; 6. a support chassis; 7. support legs; 8. twisting the nut; 9. a switch motherboard; 10. a connecting column; 11. a stabilizing ring.
Detailed Description
Referring to fig. 1-4, a heat dissipation structure for a computer network switch includes a switch main body 1, a heat dissipation mechanism 2 is arranged below the switch main body 1, a connection joint 4 arranged equidistantly is fixedly embedded on the left side surface of the switch main body 1, a light emitting diode 3 is fixedly connected on the left side surface of the switch main body 1, the light emitting diode 3 is simply referred to as an LED, and is one of semiconductor diodes which are made of compounds containing gallium, arsenic, phosphorus, nitrogen and the like and can convert electric energy into light energy, and the model number of the light emitting diode 3 is 2EF302;
The heat dissipation mechanism 2 comprises a fixing frame 201, the outer surface of the fixing frame 201 is fixedly connected with the inner bottom wall of the switch main body 1, the front surface of the switch main body 1 and the back surface of the switch main body 1 are provided with heat dissipation grooves 5 which are arranged at equal intervals, at least two groups of heat dissipation grooves 5 are arranged, and heat generated by the operation in the switch main body 1 can be naturally dissipated by utilizing the heat dissipation grooves 5, so that the working environment in the computer network switch is improved.
The inner wall of the fixing frame 201 is fixedly connected with a semiconductor refrigerating sheet 202 and a fixing ring 203 respectively, the semiconductor refrigerating sheet 202 is a novel cooling device which achieves the purpose of refrigeration through the Peltier effect, the model of the semiconductor refrigerating sheet 202 is TEC1-12703, the upper side of the semiconductor refrigerating sheet 202 is a refrigerating surface, the bottom surface of the semiconductor refrigerating sheet 202 is a heating surface, heat generated by the heating surface of the semiconductor refrigerating sheet 202 exchanges heat with air on the bottom surface of the switch main body 1, the semiconductor refrigerating sheet 202 refrigerates and cools the air in the switch main body 1, two groups of supporting legs 7 are connected with internal threads of the switch main body 1, the bottom end of each group of supporting legs 7 is fixedly connected with a supporting chassis 6, and a supporting structure is formed by utilizing the two groups of supporting legs 7 and the supporting chassis 6, so that the switch main body 1 is supported at a required position.
The outer surface of every group supporting leg 7 all fixedly connected with twists reverse nut 8, the upper surface of every group twists reverse nut 8 all contacts with the bottom surface of switch main part 1, twists reverse nut 8 through utilizing the instrument, makes things convenient for the length of being connected of supporting leg 7 and switch main part 1 inside to change the distance between supporting chassis 6 and the switch main part 1 ground, and then make things convenient for the height and the leveling between this computer network switch and the ground of adjustment.
The inside of switch main part 1 is provided with two sets of temperature sensor 207, temperature sensor 207 is a sensor that changes temperature variable into the standardized output signal of transmissibility, temperature sensor 207's model is LM-400, switch main part 1's inner wall fixedly connected with switch mainboard 9, the bottom of every temperature sensor 207 of group all is connected with switch mainboard 9's upper surface fixed, switch mainboard 9's upper surface fixed connection has two sets of spliced pole 10, the top of every spliced pole 10 of group all is connected with switch main part 1's interior roof fixed connection, utilize two sets of spliced pole 10, can make switch mainboard 9 fix at switch main part 1's inner wall, thereby utilize temperature sensor 207 to detect the air temperature near switch mainboard 9.
The inner wall fixedly connected with heat dissipation fan support 204 of solid fixed ring 203, the interior bottom wall fixedly connected with rotation motor 205 of heat dissipation fan support 204, every group temperature sensor 207 all through PLC controller with semiconductor refrigeration piece 202 and rotation motor 205 signal connection, the PLC controller is a digital electronic device with microprocessor, be used for automatic control's digital logic controller, can load the control command at any time in the memory and store and carry out, the model of PLC controller is Q00JCPU-SET, the output fixedly connected with rotation flabellum 206 of rotation motor 205, the surface fixedly connected with stabilizer ring 11 of rotation motor 205, the bottom surface of stabilizer ring 11 and the interior bottom wall fixedly connected with of heat dissipation fan support 204, utilize stabilizer ring 11, fix in the junction of rotation motor 205 and heat dissipation fan support 204, thereby can improve rotation motor 205's fixed stability.
The working principle of the utility model is as follows: when the semiconductor refrigerator is used, the semiconductor refrigerator 202, the rotary motor 205 and the temperature sensor 207 are communicated with a power supply, when the heat dissipation structure is needed to dissipate heat in a computer network switch, the computer network switch is placed at a needed position manually, the supporting legs 7 are rotated in the switch main body 1 through the torsion of the torsion nut 8 by using a tool, so that the distance between the supporting chassis 6 and the bottom surface of the switch main body 1 can be adjusted, the height and the horizontal degree between the switch main body 1 and the ground can be conveniently adjusted, the computer network switch can be firmly placed at the needed position, then the heat dissipation structure is used for being inserted into the connecting joint 4 to enable the switch main body 1 to be connected with the outside, the switch main body 1 can work, meanwhile, the temperature of air in the switch main body 1 is detected by using the temperature sensor 207 fixed on the switch main board 9 in the switch main body 1, when the detected temperature of the temperature sensor 207 is higher than a set maximum value, the rotary motor 205 is controlled to drive the fan blade 206 to rotate by using a PLC controller, the air flow in the switch main body 1 is accelerated, the heat dissipation structure is convenient to adjust the height and the height between the switch main body 1 and the ground, the heat dissipation structure is convenient to enable the switch main body 1 to be connected with the outside by using the semiconductor refrigerator, and the semiconductor refrigerator is fast cooled by using the heat dissipation structure.
The foregoing description is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical solution of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (7)
1. The utility model provides a heat radiation structure for computer network switch, includes switch main part (1), its characterized in that: a heat dissipation mechanism (2) is arranged below the switch main body (1);
The heat dissipation mechanism (2) comprises a fixing frame (201), the outer surface of the fixing frame (201) is fixedly connected with the inner bottom wall of the switch main body (1), the inner wall of the fixing frame (201) is fixedly connected with a semiconductor refrigerating sheet (202) and a fixing ring (203) respectively, two groups of temperature sensors (207) are arranged in the switch main body (1), a heat dissipation fan support (204) is fixedly connected with the inner wall of the fixing ring (203), a rotating motor (205) is fixedly connected with the inner bottom wall of the heat dissipation fan support (204), each group of temperature sensors (207) is connected with the semiconductor refrigerating sheet (202) and the rotating motor (205) through a PLC (programmable logic controller), and the output end of the rotating motor (205) is fixedly connected with a rotating fan blade (206).
2. A heat dissipation structure for a computer network switch as recited in claim 1, wherein: the left side of the switch main body (1) is fixedly embedded with connecting joints (4) which are arranged at equal distances, and the left side of the switch main body (1) is fixedly connected with a light emitting diode (3).
3. A heat dissipation structure for a computer network switch as recited in claim 1, wherein: the front surface of the switch main body (1) and the back surface of the switch main body (1) are provided with radiating grooves (5) which are arranged at equal intervals, and the radiating grooves (5) are at least two groups.
4. A heat dissipation structure for a computer network switch as recited in claim 1, wherein: the switch is characterized in that two groups of supporting legs (7) are connected with the inside of the switch main body (1) through threads, and the bottom ends of the supporting legs (7) of each group are fixedly connected with a supporting chassis (6).
5. The heat dissipation structure for a computer network switch as recited in claim 4, wherein: the outer surface of each group of supporting legs (7) is fixedly connected with a torsion nut (8), and the upper surface of each group of torsion nuts (8) is contacted with the bottom surface of the switch main body (1).
6. A heat dissipation structure for a computer network switch as recited in claim 1, wherein: the inner wall fixedly connected with switch mainboard (9) of switch main part (1), every group temperature sensor's (207) bottom all with the last fixed surface of switch mainboard (9) be connected, the last fixed surface of switch mainboard (9) is connected with two sets of spliced pole (10), every group spliced pole (10) the top all with the interior roof fixed connection of switch main part (1).
7. A heat dissipation structure for a computer network switch as recited in claim 1, wherein: the outer surface of the rotating motor (205) is fixedly connected with a stabilizing ring (11), and the bottom surface of the stabilizing ring (11) is fixedly connected with the inner bottom wall of the cooling fan bracket (204).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202323495916.2U CN221669994U (en) | 2023-12-21 | 2023-12-21 | Heat radiation structure for computer network switch |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202323495916.2U CN221669994U (en) | 2023-12-21 | 2023-12-21 | Heat radiation structure for computer network switch |
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CN221669994U true CN221669994U (en) | 2024-09-06 |
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CN202323495916.2U Active CN221669994U (en) | 2023-12-21 | 2023-12-21 | Heat radiation structure for computer network switch |
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CN (1) | CN221669994U (en) |
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2023
- 2023-12-21 CN CN202323495916.2U patent/CN221669994U/en active Active
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