CN221141938U - Water electroplating anode mechanism and water electroplating device - Google Patents

Abstract

The utility model relates to a water electroplating anode mechanism, which comprises a plurality of insoluble anode pipes, wherein each two insoluble anode pipes are in a group and are respectively arranged on the upper side surface and the lower side surface of a film; holes are formed in one side, facing the film, of the insoluble anode tube, so that plating solution in the insoluble anode tube sprays the film surface of the film through the holes; also relates to a water electroplating device comprising the anode mechanism. The anode mechanism of the water plating device adopts the insoluble anode tube, the insoluble anode tube is provided with holes, and the plating solution is sprayed to the film in a spraying mode, and the plating solution is sprayed from the insoluble anode tube, so that the stability of the concentration of copper ions can be ensured more than the traditional mode that the titanium basket contains copper balls; the insoluble anode tubes on the front side and the back side of the film are in one-to-one correspondence and spray at the same time, so that the pressure on the film surfaces on the two sides of the same position of the film is guaranteed to be similar, the deformation of the film is avoided, and the uniformity and consistency of plating layers on the two sides of the film are also guaranteed.

Description

Water electroplating anode mechanism and water electroplating device

Technical Field

The utility model relates to the technical field of film hydropower plating, in particular to a hydropower plating anode mechanism and a hydropower plating device.

Background

The film water electroplating process is one kind of ion depositing process, and is to utilize electrode to pass current to make metal adhere to the film surface for altering the film surface characteristic, for example, the film has conductivity and may be used as current collector for lithium cell.

In the existing water electroplating device, when the anode adopts a soluble anode, for example, the anode is in a mode of containing copper balls by a titanium basket, anode mud or copper slag is easy to generate. When anode slime or copper slag falls on the film, the film can be pierced, and the film product is scrapped.

Disclosure of utility model

In order to solve the problems that anode mud is easy to generate and a film is punctured in the process of hydropower plating due to the fact that a titanium basket is used for containing copper balls in an anode mechanism of the conventional hydropower plating device, the utility model provides a hydropower plating anode mechanism and a hydropower plating device.

The technical scheme of the utility model is as follows:

The water electroplating anode mechanism comprises a plurality of insoluble anode pipes, wherein each two insoluble anode pipes are in a group and are respectively arranged on the upper side surface and the lower side surface of the film; holes are formed in one side, facing the film, of the insoluble anode tube, so that plating solution in the insoluble anode tube sprays the film surface of the film through the holes.

According to the present utility model of the above-described aspect, the perpendicular distances between the two insoluble anode pipes of the same group and the film surface of the film are equal, and the flow rate of plating solution of the two insoluble anode pipes of the same group is equal.

According to the utility model of the scheme, the insoluble anode tube is made of titanium, lead, carbon, platinum, graphite, nickel, stainless steel, platinized titanium, lead alloy or magnetic iron oxide.

According to the present utility model of the above aspect, the surface of the insoluble anode tube is coated with an electrocatalytic layer.

According to the scheme, the anode tube further comprises a conductive copper plate, the insoluble anode tube is connected with the conductive copper plate, and the conductive copper plate is electrified.

The utility model also provides a hydropower plating device which comprises an unreeling area, a plurality of electroplating areas and a reeling area, wherein the electroplating areas comprise a plating solution tank, a spray tank is arranged at the rear end of the plating solution tank, the spray tank is provided with a plurality of press rolls and a plurality of first conductive rolls, the first conductive rolls are connected with a cathode, and the plating solution tank is provided with the hydropower plating anode mechanism in the scheme.

According to the utility model of the scheme, the plating solution tank is further provided with the edge clamping wheel, and the edge clamping wheel is used for clamping the film edge of the film.

Further, the electroplating area further comprises a first transition groove positioned at the front end of the plating solution tank and a second transition groove positioned at the rear end of the plating solution tank; the first transition groove and the second transition groove are both provided with a first squeeze roller.

Further, the front groove edge and the rear groove edge of the plating solution groove are respectively provided with a second squeeze roller, and the second squeeze rollers and the first squeeze rollers are arranged side by side.

Preferably, the press roller and the first conductive roller are arranged in pairs, and the press roller and the first conductive roller of the same pair respectively contact and press two sides of the film.

Furthermore, the spraying groove is also provided with a spraying pipe for spraying and washing the film.

Preferably, the spray pipes comprise a first spray pipe and a second spray pipe, the first spray pipe is arranged beside the press roll, and the pipe orifice of the first spray pipe faces the press roll; the second spray pipe is arranged at the inlet of the spray groove, and the pipe orifice of the second spray pipe faces the film surface of the film, which is close to one side of the first conductive roller.

According to the utility model of the above scheme, the water plating device further comprises a slitting groove which is arranged between the plating area and the winding area and is used for cutting off the slitter edges on two sides of the width direction of the film; the output end of the slitting tank is also provided with a reverse plating tank and a slitter edge rolling air expansion shaft, the reverse plating tank is used for electrolyzing the plating layer of the slitter edge, and the slitter edge rolling air expansion shaft is used for rolling the slitter edge after the plating layer is removed.

Further, the reverse plating tank comprises a second conductive roller and a cathode part, wherein the second conductive roller is connected with the positive electrode of the power supply, and the cathode part is connected with the negative electrode of the power supply, so that the plating layer on the waste edge is deposited on the cathode part after electrolysis.

According to the utility model of the scheme, the water plating device further comprises a washing tank and an oxidation resisting tank, wherein the washing tank is arranged between the electroplating area and the slitting tank, and the oxidation resisting tank is arranged between the slitting tank and the winding area; the washing tank is used for cleaning the film, the slitting tank is used for cutting off waste edges on two sides of the width direction of the film, and the antioxidation tank is used for forming an antioxidation layer on the film surface of the film.

The utility model according to the scheme has the beneficial effects that:

The anode mechanism of the water plating device adopts the insoluble anode tube, the insoluble anode tube is provided with holes, and the plating solution is sprayed to the film in a spraying mode, and the plating solution is sprayed from the insoluble anode tube, so that the stability of the concentration of copper ions can be ensured more than the traditional mode that the titanium basket contains copper balls;

Further, the insoluble anode tubes on the front side and the back side of the film are in one-to-one correspondence and spray at the same time, so that the pressure on the film surfaces on the two sides of the same position of the film is guaranteed to be similar, the deformation of the film is avoided, and the uniformity and consistency of plating layers on the two sides of the film are also guaranteed.

Drawings

FIG. 1 is a schematic view of a hydropower plating apparatus according to the present utility model;

FIG. 2 is a schematic view of a plating section unit in the water plating apparatus;

FIG. 3 is a schematic view of the water rinse tank, the reverse plating tank and the slitting tank sections of the water plating apparatus;

FIG. 4 is a schematic view of a portion of the plating section of a hydropower plating apparatus employing a vertical arrangement of thin films.

In the drawing of the figure,

1. A film unreeling roller;

2. an electroplating area;

201. A first transition groove; 202. a plating solution tank; 203. a second transition groove; 204. a spray tank;

21. A first squeeze roll; 22. a second squeeze roll; 23. an insoluble anode tube; 24. conductive copper plate; 25. edge clamping wheels; 26. a first conductive roller; 27. a press roller; 28. a first shower; 29. a second shower;

3. A washing tank;

31. Washing the spray pipe;

4. dividing grooves;

401. a thin film output end; 402. the output end of the slitter edge;

41. a cutter; 42. a water spray pipe;

5. A reverse plating tank;

51. A second conductive roller; 52. copper particles; 53. a slitter edge wind-up roll;

6. an antioxidant tank;

7. Film wind-up roll.

Detailed Description

For a better understanding of the objects, technical solutions and technical effects of the present utility model, the present utility model will be further explained below with reference to the drawings and examples. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, it is stated that the embodiments described below are only for explaining the present utility model and are not intended to limit the present utility model.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present, and when an element is referred to as being "connected" to the other element, it may be directly connected to the other element or intervening elements may also be present.

The direction or position relationship is based on the direction or position relationship shown in the drawings, or the direction or position relationship which is commonly put when the application product is used, or the direction or position relationship which is commonly understood by those skilled in the art, or the direction or position relationship which is commonly put when the application product is used, only for the convenience of describing the application and simplifying the description, but does not indicate or imply that the device or element in question must have a specific direction, be configured and operated in a specific direction, and therefore should not be construed as limiting the application.

The terms "first," "second," and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a number" is two or more, unless specifically defined otherwise.

As shown in fig. 1 to 3, a water plating apparatus includes:

The unreeling area is provided with a film unreeling roller 1, and the untreated film to be electroplated is discharged and conveyed to an electroplating area 2 at the rear end.

The electroplating areas 2 sequentially comprise a first transition groove 201, a plating solution groove 202, a second transition groove 203 and a spray groove 204; it can be seen that the water electroplating production line of this embodiment has the function of multiple water electroplating, and multiple electroplating areas 2 are circularly arranged: the first transition groove 201, the plating solution groove 202, the second plating solution groove 202, the spray groove 204, the first transition groove 201, the plating solution groove 202, the second transition groove 203 and the spray groove 204 … … enable the plating layer on the film to be full and uniform, and the quality of the film is improved.

And the winding area is provided with a film winding roller 7 for receiving the film with the front end being subjected to water electroplating and winding the film finished product attached with the coating.

As shown in fig. 2, in this embodiment, the first transition groove 201 and the second transition groove 203 are both provided with a first squeeze roller 21, where the first squeeze roller 21 includes a first upper squeeze roller and a first lower squeeze roller, when the film passes through the first squeeze roller 21, the film can squeeze out the excessive plating solution or other spraying solution on the film, and the excessive liquid is left in the first transition groove 201, so as to prevent the liquid from flowing to the next plating zone 2, and the liquid in the first transition groove 201 can be discharged and can be recycled after being processed.

The front end tank side and the rear end tank side of the plating solution tank 202 are respectively provided with a second squeeze roller 22, the first squeeze roller 21 and the second squeeze roller 22 are arranged side by side, and the second squeeze roller 22 comprises a second upper squeeze roller and a second lower squeeze roller, and the second squeeze roller 22 and the first squeeze roller 21 form a secondary squeeze structure, so that squeeze liquid is more thorough, liquid in a front end area is ensured to flow into a rear end area, and the quality of a plated film is influenced.

A water plating anode mechanism is provided in the plating bath 202 for providing the film with the anode required for water plating. Specifically, the water-electrolytic plating anode mechanism comprises a plurality of insoluble anode pipes 23, wherein each two insoluble anode pipes 23 are in a group and are respectively arranged on the upper side surface and the lower side surface of the film; one side of the insoluble anode tube 23 is provided with a hole, the hole is opposite to the film, and a plating solution (such as a copper sulfate solution) is introduced into the insoluble anode tube 23, so that the plating solution can be sprayed on the film surface of the film by means of the insoluble anode tube 23. Therefore, compared with the traditional titanium basket mode, the plating solution is directly sprayed on the film, and the stability of the concentration of copper ions can be ensured.

The insoluble anode tube 23 is made of titanium, lead, carbon, platinum, graphite, nickel, stainless steel, platinized titanium, lead alloy or magnetic iron oxide, and the embodiment adopts a titanium tube as the insoluble anode tube 23, so that the titanium tube is not dissolved when current passes through, and anode mud or copper slag is avoided.

The plating solution tank 202 is also provided with a conductive copper plate 24, the insoluble anode tube 23 is connected with the conductive copper plate 24, and the conductive copper plate 24 is electrified with anode electricity, so that the insoluble anode tube 23 is electrified with anode electricity, and the plating solution is electrified with anode. In addition, the first conductive roller 26 in the spraying groove 204 is communicated with cathode electricity, so that the film is electrified with the cathode electricity, and the film electroplating is realized.

In a preferred embodiment, the vertical distance between the two insoluble anode tubes 23 of the same group and the film surface of the film is equal, that is, the distance between the insoluble anode tubes 23 on the front surface of the film and the insoluble anode tubes 23 on the back surface of the corresponding film are the same, and the plating solution flow of the two insoluble anode tubes 23 of the same group is equal, so that the plating solution spraying amount and the spraying pressure of the insoluble anode tubes 23 on the two surfaces of the film on the film are equal or similar, the plating layer thicknesses of the upper side surface and the lower side surface of the film are basically consistent, and the quality of the electroplated film is further improved.

In a preferred embodiment, the surface of the insoluble anode tube 23 is coated with an electrocatalytic layer. Specifically, an electrocatalytic layer is provided on the lower surface of the insoluble anode tube 23 above the membrane, and an electrocatalytic layer is provided on the upper surface of the insoluble anode tube 23 below the membrane, so that the insoluble anode tube 23 is not easy to form an oxide layer under pure oxygen conditions. When the oxide layer is formed on the orifice of the insoluble anode tube 23, the electron flow is blocked, which results in uneven discharge of the insoluble anode tube 23 to the cathode film, and thus poor uniformity and compactness of the coating on the film. Therefore, the present preferred embodiment can ensure uniform discharge of the insoluble anode tube 23 and thus uniform thin film plating by coating the surface of the insoluble anode tube 23 with an electrocatalytic layer.

In a preferred embodiment, a pinch roller 25 is provided in the plating bath tank 202, the pinch roller 25 being a common arrangement in electroplating for pinching at the edges in the width direction of the film to flatten the film. The film surface may be wrinkled due to a certain impact of the plating solution sprayed from the insoluble anode tube 23, and the edge clamping wheel 25 is arranged to flatten the film and keep the film flat.

In this embodiment, the edge clamping wheel 25 is disposed in the middle of the plating solution tank 202, and two sets of insoluble anode tubes 23 are disposed at the front end and the rear end of the edge clamping wheel 25, and symmetrically disposed on two sides of the edge clamping wheel 25.

In a preferred embodiment, the number of insoluble anode tubes 23 in the plating zone 2 at the front end of the water plating apparatus may be smaller, and the number of insoluble anode tubes 23 in the plating zone 2 further may be set larger. Since the plating layer becomes thicker as the plating proceeds, the current density can be made larger to consume more copper ions, so that the plating efficiency can be improved.

Therefore, compared with the titanium basket mode, the plating solution tank does not have effusion in the plating tank, so that the plating tank is not required to have larger storage capacity and the cost is lower.

As shown in fig. 2, the spray tank 204 in the electroplating area 2 is provided with a press roller 27 and a spray pipe in addition to the first conductive roller 26, and the press roller 27 and the first conductive roller 26 form a cathode conductive mechanism of the water electroplating device to provide cathode electricity for the film. Specifically, the pressing roller 27 and the first conductive roller 26 are provided in pairs, and the pressing roller 27 and the first conductive roller 26 of the same pair are located on both sides of the film and contact the film surface of the film, respectively. The first conductive roller 26 communicates with the cathode electricity to realize cathode electricity supply for the thin film. The press roller 27 is matched with the first conductive roller 26, so that the film is fully contacted with the first conductive roller 26, and the conductive stability of the first conductive roller 26 to the film is further enhanced.

In a specific embodiment, two first conductive rollers 26 and two pressing rollers 27 are disposed in the spraying groove 204, the two first conductive rollers 26 are disposed in a staggered manner up and down, one pressing roller 27 is disposed on the upper side of the first conductive roller 26 above, and one pressing roller 27 is disposed on the lower side of the first conductive roller 26 below. Preferably, the first conductive roller 26 at the front end is higher than the first conductive roller 26 at the rear end, so that the film is inverted "V" shaped after entering the spraying groove 204, which is beneficial to increasing the wrap angle between the film and the first conductive roller 26, and enhancing the conductive stability to a certain extent.

The film passing through the plating solution tank 202 and entering the spraying tank 204 will be adhered with a certain amount of plating solution, and when the film contacts with the first conductive roller 26, the plating solution will also contact with the first conductive roller 26; the first conductive roller 26 as the cathode has a certain temperature rise due to the electrification, which inevitably causes the evaporation of part of the plating solution, and further causes the solute in the plating solution to precipitate a small amount of crystals on the first conductive roller 26 and adhere to the first conductive roller 26, so that the plating solution on the film at the first conductive roller 26 needs to be cleaned to reduce the adhesion of the plating solution to the first conductive roller 26. Therefore, one side of the press roller 27 is provided with a first spray pipe 28 for spraying sulfuric acid solution, and the pipe orifice of the first spray pipe 28 is opposite to the press roller. When the first shower pipe 28 works, the cleaning liquid (sulfuric acid solution) is directly sprayed to the pressing roller 27, and has two functions: one is to cool the press roller 27, thereby cooling the film and the first conductive roller 26, and reducing the formation of metal copper crystals on the first conductive roller 26 by the plating solution; secondly, the cleaning liquid sprayed onto the press roller 27 will contact the film, so that the film will remain wet and the plating liquid can be washed away. Moreover, the cleaning mode is mild, the film surface can not be directly sprayed and washed, and deformation of the film surface can be prevented.

In a preferred embodiment, the first shower 28 is disposed on a side of the pressure roller remote from the first conductive roller 26, such that the first shower 28 is remote from the film, avoiding direct spraying of the film.

In a preferred embodiment, the shower tank 204 is provided with a second shower pipe 29 in addition to the first shower pipe 28 at the front end of the first conductive roller 26, and the nozzle of the second shower pipe 29 faces the film surface (the lower surface of the film in the example shown in the figure) on the side close to the first conductive roller 26 of the film. The second shower pipe 29 is matched with the first shower pipe 28, so that a better effect can be achieved, because when the film passes through the first conductive roller 26 of the shower groove 204, the plating solution possibly exists on the lower surface of the film, and the plating solution just contacts with the first conductive roller 26, and the second shower pipe 29 is arranged in the position, so that the plating solution on the film can be timely and effectively washed out.

If the arrangement of the first conductive rollers 26 of the shower tank 204 adopts the structure described above: the first conductive roller 26 at the front end is higher than the first conductive roller 26 at the rear end, so that the film is discharged from the plating solution tank 202, and enters the spraying tank 204 to move upwards, the cleaning solution in the spraying tank 204 flows forwards along the film, and the second transition tank 203 between the plating solution tank 202 and the spraying tank 204 can stop the cleaning solution in the spraying tank 204 at the second transition tank 203, so that the cleaning solution cannot flow to the plating solution tank 202, and the purity of the plating solution in the plating solution tank 202 is affected. The second transition groove 203 also has a function of preventing the cleaning liquid from flowing to the plating tank 202 toward the front end between the plating tank 202 and the shower tank 204.

In the present utility model, the shower tank 204 may be provided with a circulation system through which the cleaning liquid is sprayed from the shower pipes (the first shower pipe 28 and the second shower pipe 29) and returned to the shower pipes for reuse. The cleaning liquid is sulfuric acid or a liquid containing sulfuric acid.

In the present utility model, as shown in fig. 3, the water plating apparatus further comprises a rinsing bath 3, and after passing through a plurality of plating areas 2, the film enters the rinsing bath 3 to be rinsed in the final stage for rinsing off the residual excessive plating solution on the film. The washing tank 3 is provided with a plurality of uniform washing spray pipes 31, the washing spray pipes 31 are positioned at the top of the washing tank 3 and have a certain distance from the film, and the washing spray pipes 31 can spray clean water to clean the film. The liquid level of the rinsing bath 3 does not exceed the height of the position where the film is located.

It is known that in the film plating process, the metal layers are not easily plated on both sides of the film in the width direction, and the metal layers are waste edges to be cut off, and only the middle area can be used as a conductive film product. Therefore, the hydropower plating device is provided with the slitting groove 4 in front of the winding area, slitters on two sides of the film are cut at the slitting groove 4, the film passing through the slitting groove 4 is divided into two parts, one part is a finished film in the middle, and the finished film is conveyed to the winding area; the other path is the slitter edges at two sides, and the slitter edges are conveyed to a slitter edge recycling area. The previous slitter edge slitting is that after the antioxidation treatment, chromium exists on the edge surface of the film after the antioxidation treatment, so that the recycling is inconvenient.

As shown in fig. 3, in order to solve the problem that the existing device is inconvenient to recycle the waste edges of the film, the water plating device of the utility model is characterized in that a slitting groove 4 is arranged at the front end of an oxidation resisting groove 6, the slitting groove 4 is provided with a film output end 401 and a waste edge output end 402, and the film is conveyed to the oxidation resisting groove 6 by the film output end 401 after the waste edges are cut off by a cutter 41 of the slitting groove 4; the slitter edge output end 402 is provided with a reverse plating tank 5 and a slitter edge winding roller 53, the reverse plating tank 5 is used for electrolyzing the plating layer of the slitter edge, and the slitter edge winding roller 53 is used for winding the slitter edge after the plating layer is removed.

In one embodiment, the slitter edge wrap 53 is an inflatable shaft. The reverse plating tank 5 comprises a second conductive roller 51 and a cathode part, the cathode part adopts copper particles 52, the second conductive roller 51 is connected with the positive electrode of the power supply, the copper particles 52 are connected with the negative electrode of the power supply, when the waste edges are soaked in the reverse plating tank 5, the plating metal ions on the waste edges are deposited on the copper particles 52 after electrolysis, the metal plating on the waste edges is clear, and the waste edge winding roller 53 winds up clean waste edges, so that the waste edges of the film are efficiently recovered. The second conductive roller 51 may be a passive roller or an active roller.

Therefore, the hydropower plating device disclosed by the utility model can be used for turning back the slitter edges of the film for reverse plating after slitting the film, so that the overlapping and mutual interference of reverse plating waste film (i.e. slitter edges) rolling and finished film rolling are avoided.

In an alternative embodiment, two cutters 41 are provided in the slitting tank 4, and the two cutters 41 are provided at both end edges in the width direction of the film, respectively, from 5cm to 10cm from the edge of the film, so that the width of a single slitter edge is 5cm to 10cm, for example 5cm, 6cm, 7cm, 8cm, 9cm or 10cm.

In a preferred embodiment, the film output end 401 of the slitting tank 4 is provided with a water spray pipe 42, and the water spray pipe 42 is used for spraying water to the middle film after slitting the slitter edge to prevent the film from being oxidized in the air. And then inputting the intermediate film finished product into an antioxidation tank 6, wherein an antioxidation layer is formed on two surfaces of the film, a drying device can be arranged at the output end of the antioxidation tank 6 to accelerate drying of the film, and finally the film enters a winding area and is wound by a film winding roller 7.

As shown in fig. 4, in addition to the horizontal through-structure design of the membrane adopted by the water plating apparatus in the above embodiment, the water plating apparatus may be provided as a vertical through-structure design. In an alternative embodiment, the film is arranged vertically, so that the plating solution can drop downwards by self gravity, the extrusion force of the first extrusion roller and the second extrusion roller can be reduced, the first transition groove and the second transition groove are not needed, the film is sprayed from the plating solution tank to the spray tank at the rear end of the film, the structure of upward film running is not needed, and therefore the second transition groove is not needed, and the liquid in the spray tank does not need to enter the plating solution tank. The view in fig. 1 is a front view of the hydropower plating apparatus, and the view in fig. 4 is a top view of the hydropower plating apparatus.

The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. The water electroplating anode mechanism is characterized by comprising a plurality of insoluble anode pipes, wherein each two insoluble anode pipes are in a group and are respectively arranged on the upper side surface and the lower side surface of the film; holes are formed in one side, facing the film, of the insoluble anode tube, so that plating solution in the insoluble anode tube sprays the film surface of the film through the holes.

2. The water-electrolytic anode plating mechanism according to claim 1, wherein the perpendicular distances between the two insoluble anode pipes of the same group and the film surface are equal, and the plating liquid flows of the two insoluble anode pipes of the same group are equal.

3. The water-electroplating anode mechanism according to claim 1, wherein the insoluble anode tube is made of titanium, lead, carbon, platinum, graphite, nickel, stainless steel, platinized titanium, lead alloy or magnetic iron oxide.

4. The water-electroplating anode mechanism of claim 1, wherein the surface of the insoluble anode tube is coated with an electrocatalytic layer.

5. The water-electroplating anode mechanism of any one of claims 1 to 4, further comprising a conductive copper plate, wherein the insoluble anode tube is connected to the conductive copper plate and the conductive copper plate is anodically energized.

6. A hydropower plating device, includes unreeling district, a plurality of electroplating district, rolling district, its characterized in that, electroplating district includes the plating bath groove, plating bath groove rear end is equipped with sprays the groove, spray the groove and be equipped with a plurality of compression rollers and a plurality of first conductive roller, just first conductive roller switch-on cathode electricity, plating bath groove is equipped with the hydropower plating anode mechanism of any one of claims 1 to 5.

7. The plating apparatus according to claim 6, wherein the plating bath is further provided with a pinch roller for pinching a film edge of the thin film.

8. The plating apparatus according to claim 6, wherein said plating section further comprises a first transition groove at a front end of said plating solution tank and a second transition groove at a rear end of said plating solution tank, said first transition groove and said second transition groove each being provided with a first squeeze roller.

9. The plating apparatus according to claim 8, wherein the plating bath tank has second squeeze rolls provided on both front and rear tank sides thereof, and the second squeeze rolls are arranged side by side with the first squeeze rolls.

10. A hydropower plating device according to any one of claims 6-9, wherein the spray tank is further provided with a spray pipe for spraying the thin film.