CN220122995U - Camera module and electronic equipment - Google Patents

Abstract

The utility model provides a camera module and electronic equipment, the electronic equipment includes: the camera module comprises a base, a motor and a lens which are positioned on a first surface of the base, and a substrate which are positioned on a second surface of the base, wherein the substrate is far away from the base, and a platform is formed in a corner area of the base opposite to the substrate; the middle frame is provided with a circuit board, a mounting hole is formed in the circuit board, the mounting hole is arranged by taking a motor as a reference, the camera module is assembled in the mounting hole, the motor and the lens are positioned on the first surface of the circuit board, and the base and the substrate are positioned on the second surface of the circuit board; the mounting clamp is arranged on the second surface of the circuit board and close to the corner of the mounting hole, and the base of the camera module is abutted against the mounting clamp; the fixed pressing sheet is pressed on the platform and is clamped with the mounting clamp. The utility model can reduce the wiring difficulty of the circuit board when the large-size camera module is applied, and does not influence the strength of the circuit board.

Description

A camera module and electronic equipment

Technical field

The present application relates to the field of electronic technology, and in particular to a camera module and electronic equipment.

Background technique

As the pixels of the cameras of mobile phones and other electronic devices are getting higher and higher, the area of the sensor is getting larger and larger, the height of the lens is getting higher and higher, and the overall height of the camera module is getting higher and higher, which leads to the problem of camera module or lens The height of the bumps on mobile phones is getting higher and higher. In order to reduce the height of the camera module, the usual method is to make holes on the substrate, add a metal substrate on the back of the substrate, and form grooves on the metal substrate. To accommodate the sensor, since the sensor is not directly installed or attached to the substrate, but is accommodated in the groove of the metal substrate on the back of the substrate, the height of the module is reduced, especially the height of the front side of the substrate, thus reducing the number of lenses Or the protruding height of the module on electronic devices such as mobile phones. However, this method requires opening holes on the substrate, so the substrate area needs to be increased to provide wiring locations, which results in the substrate and/or base at the bottom of the camera module being 1.0-1.5mm wider than the VCM motor, which brings The problem is that when installing the camera module on the circuit board of a mobile phone, a larger hole needs to be opened to install the camera module. This will affect the circuit board wiring or the strength of the circuit board for current high-density circuit boards. That is, the wiring space is reduced, the wiring difficulty is increased, and the strength of the circuit board is reduced.

Utility model content

In order to solve the above technical problems, this application provides a camera module and electronic equipment, which can reduce the wiring difficulty of the circuit board when using a large-size camera module without affecting the strength of the circuit board.

In a first aspect, this application provides an electronic device, including:

Camera module, the camera module includes a base, a motor and a lens located on the first surface of the base, and a base plate and substrate located on the second surface of the base, the second surface and the The first surface is opposite, the substrate is away from the base, and the base forms a platform in the corner area relative to the substrate and the base plate;

A middle frame, a circuit board is installed on the middle frame, a mounting hole is formed on the circuit board, the mounting hole is set based on the motor, and the camera module is assembled in the mounting hole, so The motor and lens are located on the first side of the circuit board, and the base and substrate are located on the second side of the circuit board;

A mounting clip, the mounting clip is arranged near the corner of the mounting hole on the second surface of the circuit board, and the base of the camera module is against the mounting clip;

A fixed pressing piece is pressed on the platform and engaged with the mounting clip.

According to the first aspect, this application fixes the camera module in the mounting hole of the circuit board by forming a platform in the corner area of the large-size camera module, forming a mounting clip and a fixing tab on the circuit board, so that the base and The substrate can be located on the second side of the circuit board, and the motor and lens are located on the first side of the circuit board. In this way, the mounting holes do not need to be opened based on the base, but the motor is used as the base, making the mounting holes smaller. , thereby reducing the wiring difficulty of the circuit board without affecting the strength of the circuit board.

According to the first aspect, or any implementation of the above first aspect, the shape and size of the platform correspond to the fixed pressing piece. This structure is simple and easy to assemble.

According to the first aspect, or any implementation of the above first aspect, the mounting hole is generally rectangular, and the gap between one side of the mounting hole and the motor is 0.3-0.5 mm. In this way, the mounting holes become smaller, thereby reducing the wiring difficulty of the circuit board without affecting the strength of the circuit board.

According to the first aspect, or any implementation of the above first aspect, the mounting clips are provided near at least two corners of the mounting holes on the second surface of the circuit board. By arranging mounting clips near at least two corners of the mounting hole, the circuit board can support and fix the camera module.

According to the first aspect, or any implementation of the above first aspect, two mounting clips are provided near the corners of the mounting holes on the second surface of the circuit board, and the two mounting clips are in an Right angle arrangement. This allows the base of the camera module to rest against the mounting clip, preventing the camera module from moving in the XY direction.

According to the first aspect, or any implementation of the above first aspect, one of the mounting clips is provided near the corner of the mounting hole on the second surface of the circuit board, and the mounting clip is L-shaped. This allows the base of the camera module to rest against the mounting clip, preventing the camera module from moving in the XY direction.

According to the first aspect, or any implementation of the first aspect above, the mounting clip includes a bottom surface and an inner side and an outer side connected to the bottom surface, and the inner side and the outer side are perpendicular to the bottom surface. It is arranged that a slot is formed between the inner side and the outer side. In this way, the fixed pressing piece can be connected and fixed with the mounting clip by inserting into the slot.

According to the first aspect, or any implementation of the above first aspect, the fixed pressing piece includes a top surface and two side surfaces connected to the top surface, the two side surfaces are arranged at right angles, and the top surface Press the platform and insert the side into the corresponding slot. In this way, the fixed pressing piece can press the camera module through the top surface, and can be connected and fixed with the mounting clip by inserting into the slot on the side.

According to the first aspect, or any implementation of the above first aspect, an opening is formed on the outer surface of the mounting clip, and a protrusion is formed on the side of the fixed pressing piece, and the protrusion snaps into in the opening. In this way, the engagement between the fixed pressing piece and the mounting clip can be achieved through the cooperation of the protrusion and the opening.

According to the first aspect, or any implementation of the above first aspect, the height of the fixed pressing piece relative to the circuit board is lower than the height of the substrate relative to the circuit board. This can prevent the overall thickness of the camera module and its fixing parts from increasing, thereby affecting the thickness of the electronic device.

According to the first aspect, or any implementation of the above first aspect, the distance between the middle frame and the mounting clip and the fixed pressing piece in the length direction and/or width direction is at least 0.3 mm. This ensures that there is no interference between the camera module and the middle frame during installation.

According to the first aspect, or any implementation of the above first aspect, the distance between the structure on the middle frame and the mounting clip and the fixed pressing piece in the length direction and/or width direction is 0.3mm-0.5 mm. This ensures that there is no interference between the camera module and the structural parts on the middle frame during the installation process.

In a second aspect, the application provides a camera module, including a base, a motor and a lens located on the first side of the base, and a substrate and a substrate located on the second side of the base, and the third Two surfaces are opposite to the first surface, the substrate is away from the base, and the substrate and the base form a platform in the corner area.

According to the camera module of the second aspect, smaller mounting holes can be opened in the circuit board of the electronic device when the size is large, thereby reducing the wiring difficulty of the circuit board without affecting the strength of the circuit board.

Description of the drawings

Figure 1 is a schematic structural diagram of an electronic device;

Figure 2 is a schematic structural diagram of an exemplary camera module;

Figure 3 is an exemplary assembly diagram of the camera module shown in Figure 2 on a circuit board;

Figure 4 is a schematic structural diagram of a camera module according to an embodiment of the present application;

Figure 5 is a schematic structural diagram of a mobile phone circuit board according to an embodiment of the present application;

Figure 6 is an assembly schematic diagram of the camera module shown in Figure 4 installed on the circuit board shown in Figure 5;

Figure 7 is another assembly schematic diagram of the camera module shown in Figure 4 installed on the circuit board shown in Figure 5;

Figure 8 is a diagram according to an embodiment of the present application

Figure 9 is a diagram according to an embodiment of the present application

Figure 10 is a schematic cross-sectional view of a camera module assembled on a circuit board according to an embodiment of the present application;

FIG. 11 is a partial enlarged view of the dotted area in FIG. 10 .

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.

The term "and/or" in this article is just an association relationship that describes related objects, indicating that three relationships can exist. For example, A and/or B can mean: A exists alone, A and B exist simultaneously, and they exist alone. B these three situations.

The terms “first” and “second” in the description and claims of the embodiments of this application are used to distinguish different objects, rather than to describe a specific order of objects. For example, the first target object, the second target object, etc. are used to distinguish different target objects, rather than to describe a specific order of the target objects.

In the embodiments of this application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "such as" in the embodiments of the present application is not to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the words "exemplary" or "such as" is intended to present the concept in a concrete manner.

In the description of the embodiments of this application, unless otherwise specified, the meaning of “plurality” refers to two or more. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

Embodiments of the present application provide a terminal device. The terminal device may be a mobile phone, a tablet computer, a personal digital assistant (PDA), a vehicle-mounted computer, or other electronic device with a camera module. The embodiments of the present application do not limit the specific form of the above-mentioned electronic equipment. As shown in Figure 1, for convenience of explanation, the terminal device is a mobile phone as an example.

In order to facilitate a clear description of subsequent structural features and the positional relationship of the structural features, the X-axis direction, Y-axis direction and Z-axis direction are used to define the positional relationship of each structure in the mobile phone. Among them, as shown in Figure 1, the X-axis direction is the width direction of the mobile phone, the Y-axis direction is the length direction of the mobile phone, and the Z-axis direction is the thickness direction of the mobile phone.

As shown in FIG. 1 , a mobile phone 100 includes a casing, a display screen and a camera module 101 installed on the casing. The housing includes a middle frame and a back cover. The circuit board (not shown) of the mobile phone is installed on the middle frame. The camera module is assembled on the circuit board and covered by the back cover.

Figure 2 is a schematic structural diagram of an exemplary camera module. As shown in Figure 2, the camera module 101 includes a base 11, a VCM (Voice Coil Motor) motor 12, a lens 13, a substrate 14 and a substrate (not shown in Figure 2). The base 11 has an opposite front and a back. The front of the base refers to the side on which the lens is mounted, and the back of the base refers to the side away from the lens. A VCM motor 12 and a lens 13 are installed in sequence on the front of the base. The lens 13 can move in the Z direction under the control of the VCM motor 12 . The substrate 14 is installed on the back of the base 11 , and the substrate 14 can be attached to the back of the base 11 through a glue layer or the like. In the embodiment of the present application, the base board 14 includes a main board 15 , a connector 16 and a connection board 17 . The mainboard 15 is used to arrange various circuits required by the camera module 101. The mainboard 15 is, for example, a hard board. The connector 16 is, for example, a BTB connector (board-to-board connector), which is used to connect to a circuit board of an electronic device such as a mobile phone. The connection board 17 is used to connect the main board 15 and the connector 16 . The connecting board 17 is a flexible circuit board (FPC), so the connecting board 17 can be bent.

The sensor in the camera module 101 is generally arranged on the substrate 14. However, as the pixels increase in this method, the sensor area also increases, resulting in an increase in the height of the module and serious bulging of the lens. As mentioned above, in order to reduce the height of the camera module 101, the currently adopted method is to open a hole on the substrate 14, and add a metal substrate on the back of the substrate 14, and form a groove on the metal substrate to accommodate the sensor. In this way, due to the sensor It is not directly installed or attached to the base plate 14, but is accommodated in the groove of the metal substrate on the back of the base plate 14, thus reducing the height of the camera module 101, especially the height of the front side of the base plate 14, thereby reducing the number of lenses. Or the protruding height of the module on electronic devices such as mobile phones. However, this method requires opening holes in the substrate 14, so the area of the substrate 14 needs to be increased to provide wiring locations. When the substrate area increases, the area of the base 11 also needs to be increased, resulting in a gap at the bottom of the camera module 101. The base plate 14 and the base 11 are 1.0-1.5 mm wider than the VCM motor 12 . As shown in FIG. 1 , the area of the base 11 is larger than the area of the VCM motor 12 . The problem this brings is that when the camera module 101 is installed on the circuit board of the mobile phone, a larger hole needs to be opened to install the camera module. As shown in FIG. 3 , when the camera module shown in FIG. 2 is installed on the circuit board 102 of the mobile phone 100 shown in FIG. 1 , since the areas of the base 11 and the substrate 14 of the camera module 101 are relatively large, A larger hole needs to be made in the circuit board 102. For example, in the dotted line area shown in Figure 3, compared to conventional modules where the base 11 and the motor 12 have similar or the same area, when installing the camera module 101 shown in Figure 2, at least one of them needs to be installed on the circuit board 102. Only by opening holes in the dotted line area can the installation be completed. For current high-density circuit boards, this will affect the wiring of the circuit board or the strength of the circuit board, that is, it reduces the wiring space of the circuit board 102, increases the difficulty of wiring, and reduces the strength of the circuit board 102.

Based on the above description, embodiments of the present application propose a camera module and its assembly method and electronic equipment, which can reduce the size of the opening of the camera module on the circuit board of the electronic equipment, thereby ensuring the wiring space of the circuit board and the circuit board strength.

Figure 4 is a schematic structural diagram of a camera module according to an embodiment of the present application. As shown in FIG. 4 , the camera module 101 provided by the embodiment of the present application includes a base 11 , a VCM (Voice Coil Motor) motor 12 , a lens (not shown), a substrate 14 and a substrate 18 . The base 11 has an opposite front and a back. The front of the base refers to the side on which the lens is mounted, and the back of the base refers to the side away from the lens. A VCM motor 12 and a lens are installed in sequence on the front of the base, and the lens can move in the Z direction under the control of the VCM motor 12 . The substrate 14 is installed on the back of the base 11 , and the substrate 14 can be attached to the back of the base 11 through a glue layer or the like. In the embodiment of the present application, the base board 14 includes a main board 15 , a connector 16 and a connection board 17 . The main board 15 is used to arrange various circuits required by the camera module 101. The main board 15 is, for example, a hard board, and its shape is consistent with the shape of the base. The connector 16 is, for example, a BTB connector (board-to-board connector), which is used to connect to a circuit board of an electronic device such as a mobile phone. The connection board 17 is used to connect the main board 15 and the connector 16 . The connecting board 17 is a flexible circuit board (FPC), so the connecting board 17 can be bent. A substrate 18 is installed on the back side of the substrate 14, and the substrate 18 can be attached to the back side of the substrate 14 through an adhesive layer or the like. The substrate 18 is generally made of metal material. A sensor accommodating groove (not shown) is formed in the substrate 18 and the sensor opening in the substrate 14 at a corresponding position, so that the sensor is placed in the sensor accommodating groove. Compared with the sensor being directly disposed on the substrate 14, the camera module 101 has The height is reduced, especially the height of the front side of the substrate 14 . The shape of the substrate 18 corresponds to the shape of the base 11 . For example, in the embodiment of the present application, the base 11 is in a rectangular or square shape.

As shown in FIG. 4 , in order to assemble the camera module 101 on the mobile phone circuit board without opening larger holes, in the embodiment of the present application, the substrate 18 and four of the base plate 14 (or the main board 15 ) are A portion of the corner is cut off, so that the base 11 has an extra corner area relative to the substrate 18 . Illustratively, the base 11, the main board 15 and the substrate 18 are square or rectangular. In the embodiment of the present application, the four corners of the substrate 18, the base board 14 (or the main board 15) are cut off, so that the base 11 is relatively close to the substrate. The bottom 18 and the base plate 14 have an additional triangular platform in the corner area. That is, the base 11 forms a platform in the corner area relative to the substrate 18 and the substrate 14 . The shape of the platform can be set as needed.

As shown in Figures 5 to 7, in order to assemble the camera module 101 on the mobile phone circuit board without opening a larger hole, in the embodiment of the present application, the camera module 101 is formed on the mobile phone circuit board 102. The mounting hole 21 is provided with a mounting clip 22 on the back of the mobile phone circuit board 102 close to the corner of the mounting hole 21. After the camera module 101 is installed in the mounting hole 21, it cooperates with the fixing pressing piece 23 to fix the camera. Mod 101. The back side (also called the second side) of the mobile phone circuit board 102 refers to the side away from the lens after the camera module 101 is installed on the mobile phone circuit board 102 . The front side (also called the first side) of the mobile phone circuit board 102 refers to the side where the lens is located after the camera module 101 is installed on the mobile phone circuit board 102 .

As shown in FIG. 5 , the mounting hole 21 is roughly rectangular in shape, and includes a rectangular assembly area and a wiring area. The rectangular assembly area is used to install the subject of the camera module, and the wiring area is used for the connecting plate 16 of the camera module 101 . Extend from the back of the mobile phone circuit 101 to the front of the mobile phone circuit board 102, so that the connector 16 is connected to the connector of the mobile phone circuit board 102.

As shown in Figure 6, in the embodiment of the present application, the mounting hole 21 is set based on the size of the motor 12. For example, the size of the mounting hole 21, more specifically, the size of the assembly area is relative to the length and width of the motor 12. The direction is 0.3mm-0.5mm larger, such as 0.3mm, 0.4mm or 0.5mm larger. That is, the mounting hole 21 is set to avoid 0.3mm-0.5mm on one side of the motor 12 or the gap between the mounting hole 21 and the motor on one side is 0.3mm-0.5mm. Therefore, in the embodiment of the present application, the mobile phone circuit board 102 does not need to open a larger installation hole, so that the wiring space is larger and the strength is higher. In other words, when the mobile phone circuit board 102 in the embodiment of the present application is used with a large-size camera module, the wiring difficulty is reduced, and the strength is not affected.

As shown in FIG. 5 , for example, in the embodiment of the present application, mounting clips 22 are provided on the mobile phone circuit board 102 at two positions close to the corners of the mounting holes 21 . Two mounting clips 22 are provided at each position, and the two mounting clips 22 are arranged at right angles. In this way, both sides of the corners of the camera module 101 can abut against the mounting clip, thereby preventing the camera module 101 from moving in the XY direction.

As shown in FIG. 8 , the mounting clip 22 includes a bottom surface 221 , and an inner side surface 222 and an outer side surface 223 connected to the bottom surface 221 . A slot is formed between the inner side 222 and the outer side 223 . The inner side 222 has a shape, and an opening 224 is formed on the outer side 223 .

It should be understood that, although in this embodiment, two mounting clips are provided near the corners of the mounting hole 21, in other embodiments, one mounting clip may also be provided near the corners of the mounting hole. Can be L-shaped.

It should also be understood that although in the embodiment of the present application, the mounting clips are provided near two corners of the mounting hole 21, in other embodiments, they may be provided near the four corners of the mounting hole 21, or at other two corners. Mounting clips are provided near one of the corners or three of the corners.

As shown in FIG. 9 , in the embodiment of the present application, the fixed pressing piece 23 includes a top surface 231 and two side surfaces 232 connected to the top surface 231 . The top surface 231 is triangular, and the two side surfaces 232 are arranged at right angles. A protrusion 233 is formed on the side 232 . It should be understood that the shape and size of the top surface 231 of the fixed pressing piece 23 correspond to the shape and size of the corner platform of the base 11 of the camera module 101 . Illustratively, in the embodiment of the present application, the shape of the top surface 231 and the platform is a triangle. However, in other embodiments, other suitable shapes are also possible.

As shown in Figures 7, 10 and 11, in the embodiment of the present application, the installation process of the camera module 101 is to first assemble the camera module 101 on the mounting hole 21 from the back of the mobile phone circuit board 102. At this time, the camera is The motor 12 and lens 31 in the module 101 extend to the front of the mobile phone circuit board 102, and then the fixed pressing piece 23 is inserted into the installation clip 22. At this time, the top surface of the fixed pressing piece 23 is pressed against the base 11 of the camera module 101 On the corner platform, the side of the fixed pressing piece 23 is inserted into the slot of the mounting clip 22, and the protrusion on the side of the fixed pressing piece 23 is snapped into the opening 224 on the outer side 223 of the mounting clip 22, thereby realizing the fixed pressing piece. 23 is engaged with the mounting clip 22, and the camera module 101 is fixed on the mobile phone circuit board 102, and then the connection 16 is connected to the corresponding connector on the mobile phone circuit board 102, thereby realizing the preliminary installation of the camera module 101.

As shown in FIGS. 10 and 11 , in the embodiment of the present application, the Z-direction height of the fixed pressing piece 23 relative to the mobile phone circuit board 102 is lower than the Z-direction height of the camera module 101 relative to the mobile phone circuit board 102 . That is, the fixed pressing piece 23 is lower than the substrate 18 of the camera module 101.

Furthermore, in the embodiment of the present application, for the middle frame of the mobile phone, the distance between the structural members on the middle frame and the mounting clip 22 and the fixing pressing piece 23 is, for example, 0.3mm-0.5mm. For the middle frame of the complete machine, the distance between it and the mounting clip 22 and the fixing pressing piece 23 is at least 0.3 mm. That is, the middle frame of the entire machine avoids a distance of at least 0.3 mm between the mounting clip 22 and the fixed pressing piece 23 .

As mentioned above, the above embodiments are only used to illustrate the technical solution of the present application, but not to limit it. Although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still make the foregoing technical solutions. The technical solutions described in each embodiment may be modified, or some of the technical features may be equivalently replaced; however, these modifications or substitutions do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions in each embodiment of the present application.

Claims (13)

1. An electronic device, characterized in that it includes: Camera module, the camera module includes a base, a motor and a lens located on the first surface of the base, and a base plate and substrate located on the second surface of the base, the second surface and the The first surface is opposite, the substrate is away from the base, and the base forms a platform in the corner area relative to the substrate and the base plate; A middle frame, a circuit board is installed on the middle frame, a mounting hole is formed on the circuit board, the mounting hole is set based on the motor, and the camera module is assembled in the mounting hole, so The motor and lens are located on the first side of the circuit board, and the base and substrate are located on the second side of the circuit board; A mounting clip, the mounting clip is arranged near the corner of the mounting hole on the second surface of the circuit board, and the base of the camera module is against the mounting clip; A fixed pressing piece is pressed on the platform and engaged with the mounting clip. 2. The electronic device according to claim 1, wherein the shape and size of the platform correspond to the fixed pressing piece. 3. The electronic device according to claim 1, wherein the mounting hole is substantially rectangular, and the gap between one side of the mounting hole and the motor is 0.3-0.5 mm. 4. The electronic device according to any one of claims 1 to 3, wherein the mounting clips are provided near the corners of at least two mounting holes on the second surface of the circuit board. 5. The electronic device according to claim 1, wherein two mounting clips are provided near the corners of the mounting holes on the second surface of the circuit board, and the two mounting clips are at right angles. layout. 6. The electronic device according to claim 1, wherein one mounting clip is provided near the corner of the mounting hole on the second surface of the circuit board, and the mounting clip is L-shaped. 7. The electronic device according to claim 5 or 6, wherein the mounting clip includes a bottom surface and an inner side and an outer side connected to the bottom surface, and the inner side and the outer side are opposite to the bottom surface. Set vertically, a slot is formed between the inner side and the outer side. 8. The electronic device according to claim 7, wherein the fixed pressing piece includes a top surface and two side surfaces connected to the top surface, the two side surfaces are arranged at right angles, and the top surface pressing piece Tighten the platform and insert the side into the corresponding slot. 9. The electronic device according to claim 7, characterized in that an opening is formed on the outer surface of the mounting clip, and a protrusion is formed on the side of the fixed pressing piece, and the protrusion snaps into the In the opening. 10. The electronic device according to claim 1, wherein the height of the fixed pressing piece relative to the circuit board is lower than the height of the substrate relative to the circuit board. 11. The electronic device according to claim 1, wherein the distance between the middle frame and the mounting clip and the fixed pressing piece in the length direction and/or width direction is at least 0.3 mm. 12. The electronic device according to claim 1, wherein the distance between the structure on the middle frame and the mounting clip and the fixed pressing piece in the length direction and/or width direction is 0.3mm-0.5mm. . 13. A camera module, characterized in that it includes: a base, a motor and a lens located on the first surface of the base, and a substrate and a substrate located on the second surface of the base, the third Two surfaces are opposite to the first surface, the substrate is away from the base, and the substrate and the base form a platform in the corner area.