CN213903874U

CN213903874U - Optical module

Info

Publication number: CN213903874U
Application number: CN202023091301.XU
Authority: CN
Inventors: 刘凯; 蔚永军; 张洪浩
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-12-19
Filing date: 2020-12-19
Publication date: 2021-08-06
Anticipated expiration: 2030-12-19

Abstract

The application provides an optical module, includes: a circuit board; the optical transceiving sub-module is electrically connected with the circuit board and is used for receiving signal light and transmitting signal light from the outside of the optical module; wherein, the optical transceiver sub-assembly includes: a light-receiving housing; the light receiving and transmitting cover plate covers the light receiving and transmitting shell and forms a light receiving and transmitting cavity with the light receiving and transmitting shell; the optical fiber adapter is arranged on the light receiving and transmitting shell and used for transmitting signal light and transmitting signal light from the outside of the optical module; the optical fiber adapter comprises an optical fiber adapter body, an optical fiber inserting core and a clamping mechanism, wherein the clamping mechanism is connected to the optical fiber inserting core, one end of the clamping mechanism is connected to the optical fiber adapter body, and one end of the optical fiber inserting core is located in the optical fiber adapter body. The optical module that this application embodiment provided is convenient for carry out the centre gripping assembly of optic fibre lock pin.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

As the demand for communications increases, the optical fiber access (FTTx) is rapidly developing. An Optical fiber access technology mainly based on a Passive Optical Network (PON) technology has been widely used in various forms throughout the world. At present, PON technology falls into two broad categories: time division multiplexing-based passive optical networks (TDM-PONs) and wavelength division multiplexing-based passive optical networks (WDM-PONs). However, WDM-PON based on wavelength division multiplexing is a more advantageous multiplexing scheme. A WDM-PON is a point-to-point passive optical network that employs wavelength division multiplexing technology. The number of the two-way adopted wavelengths in the same optical fiber is more than 3, the wavelength division multiplexing technology is utilized to realize uplink access, a larger working bandwidth can be provided at a lower cost, and the optical fiber access method is an important development direction in the future.

In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals and is one of key devices in optical communication equipment, and the requirement of optical communication on the optical module is higher and higher as the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module, which is convenient for clamping and assembling an optical fiber ferrule.

The application provides an optical module, includes: a circuit board;

the optical transceiving sub-module is electrically connected with the circuit board and is used for receiving signal light and transmitting signal light from the outside of the optical module;

wherein, the optical transceiver sub-assembly includes:

a light-receiving housing;

the light receiving and transmitting cover plate covers the light receiving and transmitting shell and forms a light receiving and transmitting cavity with the light receiving and transmitting shell;

the optical fiber adapter is arranged on the light receiving and transmitting shell and used for transmitting signal light and transmitting signal light from the outside of the optical module;

the optical fiber adapter comprises an optical fiber adapter body, an optical fiber inserting core and a clamping mechanism, wherein the clamping mechanism is connected to the optical fiber inserting core, one end of the clamping mechanism is connected to the optical fiber adapter body, and one end of the optical fiber inserting core is located in the optical fiber adapter body.

In the optical module that this application provided, fixture connects on the optic fibre lock pin and fixture's one end connects the optic fibre adapter body, and the one end of optic fibre lock pin is located this internal optic fibre adapter. In the optical module that this application provided, through setting up fixture on the optic fibre lock pin, fixture is used for the centre gripping, and then makes things convenient for optic fibre lock pin centre gripping and assembly.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 4 is an exploded structural diagram of an optical module according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of an optical transceiver sub-assembly according to an embodiment of the present disclosure;

fig. 6 is a partially exploded schematic view of an optical transceiver sub-assembly according to an embodiment of the present disclosure;

fig. 7 is a schematic view of an internal structure of a first optical transceiver cavity according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram of a transmission optical path of the transmission signal light and the reception signal light in the first optical transceiving cavity according to the embodiment of the present application;

fig. 9 is a partial structural view of an optical transceiver sub-assembly according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a first wavelength screening device according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a light selective transmission device according to an embodiment of the present application;

fig. 12 is a cross-sectional view of an optical sub-transceiver module according to an embodiment of the present application;

fig. 13 is a partial structural view of an optical transceiver sub-assembly according to an embodiment of the present disclosure;

fig. 14 is a second cross-sectional view of an optical transceiver sub-assembly according to an embodiment of the present disclosure;

fig. 15 is a first schematic structural diagram of a first connector according to an embodiment of the present disclosure;

fig. 16 is a second schematic structural diagram of a first connector according to an embodiment of the present disclosure;

fig. 17 is a schematic structural diagram of an optical transceiver sub-assembly in another direction according to an embodiment of the present disclosure;

fig. 18 is an exploded view of an optical transceiver sub-assembly in another direction according to an embodiment of the present disclosure;

fig. 19 is a schematic structural diagram of another optical sub-transceiver module according to an embodiment of the present application;

fig. 20 is a partially exploded schematic view of another optical transceiver sub-assembly according to an embodiment of the present disclosure;

fig. 21 is a schematic internal structural view of a second optical transceiver cavity according to an embodiment of the present disclosure;

fig. 22 is a schematic optical path transmission diagram of a transmitting signal light and a receiving signal light in the second optical transceiving cavity according to the embodiment of the present application;

fig. 23 is a schematic diagram of a voltage boosting circuit according to an embodiment of the present application;

fig. 24 is a partially exploded schematic view of another optical sub-transceiver module according to an embodiment of the present application;

fig. 25 is a first cross-sectional view of another optical transceiver sub-assembly according to an embodiment of the present disclosure;

fig. 26 is a second cross-sectional view of another optical transceiver sub-assembly according to the present embodiment;

FIG. 27 is a schematic structural view of a second support platform according to an exemplary embodiment of the present disclosure;

FIG. 28 is a schematic structural diagram of a fiber optic adapter according to an embodiment of the present disclosure;

FIG. 29 is a first cross-sectional view of a fiber optic adapter according to an embodiment of the present application;

FIG. 30 is a second cross-sectional view of a fiber optic adapter according to an embodiment of the present application;

fig. 31 is a partial schematic structural diagram of another transceiver subassembly according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic view of an optical module according to an embodiment of the present disclosure, and fig. 4 is a schematic view of an exploded structure of an optical module according to an embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 300, and an optical transceiver sub-module 400.

The upper shell 201 is covered on the lower shell 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 205 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with the optical transceiver sub-assembly 400 inside the optical module; the circuit board 300, the optical transceiver sub-assembly 400 and other devices are located in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 300, the optical transceiver sub-module 400 and other devices can be conveniently installed in the shells, and the outermost packaging protection shell of the optical module is formed by the upper shell and the lower shell; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a laser driver chip, a limiting amplifier chip, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.

The chip on the circuit board 300 may be a multifunctional integrated chip, for example, a laser driver chip and an MCU chip are integrated into one chip, or a laser driver chip, a limiting amplifier chip and an MCU chip are integrated into one chip, and the chip is an integrated circuit, but the functions of the circuits do not disappear due to the integration, and only the circuit appears and changes, and the chip still has the circuit form. Therefore, when the circuit board is provided with three independent chips, namely, the MCU, the laser driver chip and the limiting amplifier chip, the scheme is equivalent to that when the circuit board 300 is provided with a single chip with three functions in one.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The optical transceiver sub-assembly 400 is used for transmitting and receiving optical signals, and the optical transceiver sub-assembly 400 is electrically connected to the circuit board 300. Optionally, the optical sub-transceiver module 400 is located at an end of the circuit board 300 and physically separated from the circuit board 300; the optical transceiver sub-assembly 400 is electrically connected to the circuit board 300 through a flexible circuit board.

The optical transceiver sub-module 400 provided by the embodiment of the application includes an optical fiber adapter 407, and the optical module is connected with an external optical fiber through the optical fiber adapter 407; the rosa 400 further includes a light receiving element and a light emitting element; the light receiving assembly is used for receiving signal light from the outside of the light module, and the light emitting assembly is used for emitting the signal light. In order to facilitate the packaging of the optical transceiver sub-assembly 400, the optical transceiver sub-assembly 400 includes an optical transceiver housing and an optical transceiver cover plate 402a covering the optical transceiver housing; the light receiving and transmitting shell and the light receiving and transmitting cover plate form a light receiving and transmitting cavity; signal light from the outside of the optical module is transmitted into the optical transceiving cavity through the optical fiber adapter 407 and then transmitted to the optical receiving assembly; the signal light emitted by the light emitting module is transmitted into the light transceiving cavity, and then the optical fiber adapter 407 is transmitted to the outside of the optical module. In order to be used for receiving signal light from the outside of the optical module and transmitting the signal light in the optical transceiving cavity in a transmission mode, an optical assembly is arranged in the optical transceiving cavity and used for adjusting a transmission light path from the outside of the optical module to the optical receiving assembly and a transmission light path from the optical transmitting assembly to the signal light. The optical transmitter module generally includes a laser module, a laser driver, a TEC, a backlight detector, and other devices for realizing and assisting the optical module to generate an optical signal, and the optical receiver module includes a photodetector, a transimpedance amplifier, a limiting amplifier, and other devices for receiving signal light, performing optical-to-electrical conversion, and assisting the optical-to-electrical conversion.

In some techniques for burst operation of a laser, it is usually necessary to increase the bias current applied to the laser from 0mA to a current required for normal light emission, such as 80 mA; in the whole loading process, the difference between the temperature change of the laser and the change of the current carrier causes serious wavelength drift; if the wavelength shifted light enters the optical network, there is crosstalk to the adjacent channels, so in some embodiments of the present application, the transmission optical path of the signal light emitted by the light emitting component may be generally provided with an optical selective transmission device such as an optical tunable switch, an isolator, or a combination thereof, so as to implement that the signal light output by the optical transceiver sub-assembly 400 is the signal light generated by normal light emission.

The optically tunable optical switch may be a pull first rotator. Under the action of a magnetic field, the property of the Faraday rotator for changing the polarization direction is controllable, namely, when light passes through the Faraday rotator, the polarization direction of the light can be changed; when the magnetic field outside the faraday rotator is fixed, the change of the light polarization direction is fixed, and when the magnetic field outside the faraday rotator is changed, the change of the light polarization direction is changed. In some embodiments of the present application, the faraday rotator and the isolator are disposed on a transmission optical path of the signal light emitted from the light emitting module; the polarization direction is the same with the polarization direction of isolator, and light can pass through the isolator, and is inconsistent with the polarization direction of isolator, and light is whole or partly unable to pass through the isolator, consequently transmits to Faraday rotator signal light polarization direction change through control Faraday rotator magnetic field direction, makes signal light can pass through or pass through the isolator to reach the selection that uses the realization light emission subassembly transmission signal light through the cooperation of Faraday rotator and isolator and pass through. Such as: the light emitting component emits signal light with a first polarization direction, the isolator allows the polarization direction of the transmitted signal light to be a second polarization direction, and the Faraday rotator can change the polarization direction of the signal light with the first polarization direction into the second polarization direction or a third polarization direction by controlling the power-on direction of the Faraday rotator; therefore, by controlling the power-on direction of the Faraday rotator, whether the signal light emitted by the light emitting component is allowed to pass through can be controlled. Typically the second polarization direction differs from the third polarization direction by 90 degrees.

In addition, in order to implement burst transmission and reception in an optical network, the optical module provided in the embodiment of the present application generally needs to implement tuning among several wavelengths, such as four wavelengths of transmitting tunable 1532.68nm, 1533.47nm, 1534.25nm, 1535.04nm, receiving tunable 1596.34nm, 1597.19nm, 1598.04nm, and 1598.89 nm; furthermore, in the optical transceiver cavity in the optical module provided in the embodiment of the present application, a plurality of wavelength filtering devices are further disposed, and the wavelength filtering devices may be disposed on a transmitting optical path of the light emitting module and/or a receiving optical path of the light receiving module. When the wavelength screening device is arranged on a light emitting path of the light emitting component, the wavelength screening device is used for screening signal light emitted by the light emitting component and preventing the signal light with the working wavelength of the non-optical module from being incident into an optical network; when the wavelength screening device is arranged on the receiving optical path of the optical receiving component, the wavelength screening device is used for screening the received signal light transmitted to the optical receiving component and preventing the signal light with the working wavelength of the non-optical module from being received by the optical receiving component.

In some embodiments of the present application, the wavelength filtering device may include a TEC (semiconductor thermal cooler) and a filter, where the filter is disposed on the TEC, and the filter is adjusted and controlled by controlling the direction and the magnitude of the input current in the TEC, so as to tune the refractive index of the filter, and further tune the wavelength of the signal light that the filter can transmit, that is, the filter is selectively transmitted through a specific wavelength of the signal light by controlling the direction and the magnitude of the input current in the TEC.

In some embodiments of the present application, the wavelength screening device may include a first mirror, a second mirror, and a piezoelectric ceramic device, an air cavity is formed between the first mirror and the first mirror, the piezoelectric ceramic device is disposed on the first mirror or the second mirror, a width of the air cavity between the first mirror and the second mirror is changed by applying a voltage to the piezoelectric ceramic device, that is, a length of a resonant cavity between the first mirror and the second mirror is changed, and then a wavelength of a specific signal light is transmitted by using a principle of multi-beam interference. Usually, the piezoelectric ceramic device comprises a piezoelectric ceramic body, the change of voltage difference is applied to two ends of the piezoelectric ceramic body, the adjustment of the expansion amount of the piezoelectric ceramic body can be realized, and then the piezoelectric ceramic body drives the first reflector or the second reflector to adjust the width of an air cavity between the first reflector and the second reflector, so that the signal light wavelength input to the wavelength screening device is screened and transmitted.

The specific structure of the wavelength screening device can be selected by combining the size of the light receiving and transmitting cavity, the requirements of the light receiving assembly and the size of the wavelength screening device. The wavelength selective device may also be used in the transmission path of the light emitting assembly.

The optical sub-transceiver module provided in the embodiments of the present application is described in detail below with reference to specific embodiments.

Fig. 5 is a schematic structural diagram of an optical sub-transceiver module, which is denoted as an optical sub-transceiver module 400a according to an embodiment of the present disclosure; fig. 6 is a partially exploded schematic view of an optical transceiver sub-assembly according to an embodiment of the present disclosure. As shown in fig. 5 and 6, the optical transceiver sub-module 400a provided in the embodiment of the present application includes a first optical transceiver housing 401a and a first optical transceiver cover 402a covering the first optical transceiver housing 401 a; the first light transceiving housing 401a and the first light transceiving cover plate 402a form a first light transceiving cavity 403a, and a first light emitting module 404a for emitting light signals, a first light receiving module 405a for receiving light signals, and a first light module 406a for adjusting light signal transmission paths are disposed in the first light transceiving cavity 403 a. The first optical transceiver housing 401a and the first optical transceiver cover plate 402a may be made of metal material, such as die-cast or milled metal. In the embodiment of the present application, the first light emitting assembly 404a includes a laser assembly, a laser driver, a TEC, a backlight detector, and the like for realizing and assisting the optical module to generate an optical signal, and the first light receiving assembly 405a includes a photodetector, a transimpedance amplifier, a limiting amplifier, and the like for receiving signal light, performing photoelectric conversion, and assisting the photoelectric conversion. As shown in fig. 6, the first optical receiving element 405 of the optical sub-assembly 400a is a micro-optical package structure.

As shown in fig. 5 and 6, an optical fiber adapter 407 is connected to an end of the first optical transceiver housing 401a away from the circuit board 300, where one end of the optical fiber adapter 407 communicates with the first optical transceiver cavity 403a and the other end is used for connecting an external optical fiber. The signal light emitted by the first light emitting assembly 404a is transmitted to the optical fiber adapter 407 through the first light assembly 406a, and then transmitted to the external optical fiber through the optical fiber adapter 407; signal light from an external optical fiber is transmitted into the first light transceiving cavity 403a through the optical fiber adapter 407, and is transmitted to the first light receiving component 405a through the first light component 406a, and the first light receiving component 405a receives the signal light; therefore, the signal light of the first light emitting module 404a and the signal light to be received by the first light receiving module 405a are transmitted together through the optical fiber adapter 407, and further, the transmission of the light emitted by the optical module and the reception of the light through one optical fiber is realized.

Further, in some embodiments of the present application, the first optical transmit assembly 404a includes an optical transmit chip, a metalized ceramic, and a semiconductor cooler. A common light emitting chip of the optical module is a laser chip, the laser chip is arranged on the surface of the metallized ceramic, and the surface of the metallized ceramic forms a circuit pattern which can supply power to the laser chip; meanwhile, the metallized ceramic has better heat-conducting property and can be used as a heat sink of the laser chip for heat dissipation; the semiconductor refrigerator is directly or indirectly arranged on the bottom surface of the cavity of the light emission secondary module, the metallized ceramic is arranged on the surface of the semiconductor refrigerator, and the semiconductor refrigerator is used for balancing heat to maintain the set working temperature of the laser chip, so that the temperature of the laser chip is adjusted and controlled. The laser becomes the first choice light source of optical module and even optical fiber transmission by better single wavelength characteristic and better wavelength tuning characteristic; even if a special optical communication system adopts the light source, the characteristics and chip structure of the light source are greatly different from those of laser, so that the optical module adopting laser and the optical module adopting other light sources have great technical difference, and a person skilled in the art generally does not consider that the two types of optical modules can give technical inspiration to each other.

As shown in fig. 5 and 6, one end of the first optical transceiver housing 401a near the circuit board 300 is provided with a first connector 408a, such as a ceramic connector or the like. A first connector opening 4011a is arranged at one end of the first optical transceiver housing 401a close to the circuit board 300, the first connector 408a is embedded in the first connector opening 4011a, and the first connector 408a is connected to the first connector opening 4011a in an abutting fit manner, so that one end of the first connector 408a extends into the first optical transceiver cavity 403a, the other end of the first connector 408a extends out of the first optical transceiver cavity 403a, and one end of the first connector 408a extending into the first optical transceiver cavity 403a is generally used for wire bonding and connecting electrical devices in the first optical transmitter module 404a and the first optical receiver module 405a in the first optical transceiver cavity 403 a; the surfaces of the two ends of the first connector 408a are provided with a plurality of pad pins for wire bonding with electrical devices in the first light emitting module 404a, the first light receiving module 405a, etc., or electrically connecting with a flexible circuit board. Specifically, the method comprises the following steps: the end extending out of the first light transceiving cavity 403a is generally used for electrically connecting the circuit board 300 through a flexible circuit board, and further, the electrical connection between the circuit board 300a and the electrical devices in the first light emitting module 404a, the first light receiving module 405a and the like is realized through the first connector 408 a; the first connector 408a may be electrically connected to the circuit board 300 through a flexible circuit board or a plurality of flexible circuit boards.

Fig. 7 is a schematic view of an internal structure of a first optical transceiver cavity according to an embodiment of the present disclosure; fig. 8 is a schematic diagram of a transmission optical path of the transmission signal light and the reception signal light in the first optical transceiving cavity according to the embodiment of the present application; in fig. 8, solid arrows indicate transmission optical paths of transmission signal light, and broken arrows indicate transmission optical paths of reception signal light. As shown in fig. 7 and 8, the first optical component 406a in the first optical transceiving cavity 403a includes a first lens 4061a, a first filter 4062a, a first reflector 4063a, a first collimating lens 4064a, a first focusing lens 4065a, and the like. A first collimating lens 4064a is disposed in the exit light direction of the first light emitting module 404a to convert the diverging light beam output by the first light emitting module 404a into a collimated light beam; first filter 4062a sets up in the light outgoing direction of first collimating lens 4064a, and first lens 4061a sets up in the light transmission direction of first filter 4062a, and the collimated light beam that so emits out via first collimating lens 4064a passes through first filter 4062a and first lens 4061a in proper order and transmits to fiber optic adapter 407, and first lens 4061a is used for assembling the collimated light beam of transmission first filter 4062 to fiber optic adapter 407. A first reflecting mirror 4063 is disposed in the light reflecting direction of the first filter 4062, and a first focusing lens 4065a is disposed in the light reflecting direction of the first reflecting mirror 4063 a; the received signal light is transmitted to the optical fiber adapter 407 through the external optical fiber, and transmitted to the first lens 4061a through the optical fiber adapter 407, the first lens 4061a converts the divergent light beam into a collimated light beam, the collimated light beam converted by the first lens 4061a is transmitted to the first filter 4062, the first filter 4062a reflects the collimated light beam to the first reflector 4063a, then reflects the collimated light beam to the first focusing lens 4065a through the first reflector 4063a, and is converged and transmitted to the first light receiving component 405a through the first focusing lens 4065 a.

Further, a first collimating lens 4064a, a first filter 4062a and a first lens 4061a are disposed on the optical path of the emitted signal light for ensuring transmission of the emitted signal light between the first light emitting component 404a and the optical fiber adapter 407 a; the first lens 4061a, the first filter 4062a, the first mirror 4063a, and the first focusing lens 4065a are disposed on the optical path of the received signal light, and are used to ensure transmission of the received signal light between the optical fiber adapter 407 and the first light receiving component 405 a. In some embodiments of the present application, the first filter 4062a is a 45 ° filter and the first reflector 4063a is a 45 ° reflector.

The first optical subassembly 406a that this application embodiment provided still includes second filter 4066a, and second filter 4066a sets up on first filter 4062a to the transmission light path of first speculum 4063a, and second filter 4066a is used for passing through the signal light of the wavelength that first optical receiving subassembly 405a received.

Fig. 9 is a partial structural view of an optical transceiver sub-assembly according to an embodiment of the present application. As shown in fig. 9, in the rosa 400a according to some embodiments of the present disclosure, a first wavelength selective device 4091 is disposed on an emission light path of the first light emitting assembly 404a, and a light selective transmission device 40924092 is disposed on an emission light path of the first light emitting assembly 404 a.

As shown in fig. 9, some embodiments of the present application provide an optical transceiver sub-assembly 400a including a first wavelength filtering device 4091, where the first wavelength filtering device 4091 is disposed on a transmission path from a first reflecting mirror 4063a to a first focusing lens 4065a, and is configured to filter wavelengths of light of a signal received by a first optical receiving component 405 a. Optionally, the first wavelength screening device 4091 is a wavelength screening device including a TEC and a filter or a wavelength screening device including a first mirror, a second mirror and a piezoelectric ceramic device, and may be specifically selected by combining the size of the first light transceiving cavity 403a, the requirement of the first light receiving assembly 405a and the size of the wavelength screening device 409.

As shown in fig. 9, some embodiments of the present application provide an optical transceiver sub-module 400a further including an optical selective transmission device 4092, where the optical selective transmission device 4092 is disposed on a transmission path from the first collimating lens 4064a to the first filter 4062a, and is used for selectively transmitting signal light in the first light emitting component 404 a. Optionally, the optical selective transmission device 4092 includes a faraday rotator and an isolator, which may be specifically selected in combination with the size of the first optical transceiving cavity 403a, the requirements of the first optical emission component 404a, and the size of the optical selective transmission device.

Fig. 10 is a schematic structural diagram of a first wavelength screening device according to some embodiments of the present disclosure. As shown in fig. 10, the first wavelength screening device 4091 provided in this application includes a first TEC911 and a first wavelength screening filter 912, where the first wavelength screening filter 912 is disposed on the first TEC911, the first TEC911 is disposed in the first light transceiving cavity 403a and is located between the first reflector 4063a and the first focusing lens 4065a, the first wavelength screening filter 912 is located on a transmission light path from the first reflector 4063a to the first focusing lens 4065a, and then a collimated light beam reflected by the first reflector 4063a is transmitted to the first wavelength screening filter 912, and the first wavelength screening filter 912 is subjected to temperature adjustment by the first TEC911 and is selectively transmitted according to a wavelength of a signal light transmitted to the first wavelength screening filter 912. In this embodiment of the application, a corresponding relationship between the selective transmission wavelength and the temperature of the first wavelength filtering plate 912 is set in the optical module, the temperature of the first wavelength filtering plate 912 is regulated according to the selective transmission wavelength, and finally the temperature of the first wavelength filtering plate 912 is adjusted by the first TEC911, so as to realize the filtering of the first wavelength filtering plate 912 on the wavelength of the transmission signal light.

Further, in some embodiments of the present application, the first wavelength screening device 4091 further includes a first filter support 913, a first through hole 9131 is disposed on the first filter support 913, the first filter support 913 is disposed on the first TEC911, the first wavelength screening filter 912 is disposed on the first filter support 913, the first wavelength screening filter 912 covers the first through hole 9131, so that the signal light of the specific wavelength passing through the first wavelength screening filter 912 passes through the first through hole 9131 to be transmitted to the first focusing lens 4065a, or the signal light passing through the first through hole 9131 is transmitted to the first wavelength screening filter 912.

As shown in fig. 10, in some embodiments of the present application, first filter holder 913 includes a fixing plate 9132 and a support plate 9133, and fixing plate 9132 and support plate 9133 form an "L-shaped" structure; the fixing plate 9132 is connected to the first TEC911, the supporting plate 9133 is provided with a first through hole 9131, and the supporting plate 9133 is connected to the first wavelength screening filter 912 in a supporting manner; in addition, the fixing plate 9132 may be provided with a temperature sensor for measuring the temperature of the first wavelength selective filter 912. And then first filter bracket 913 of "L type" structure not only makes things convenient for first wavelength to filter 912 fixed on first TEC911, can also conveniently set up temperature sensor in order to carry out the measurement of first wavelength screening filter 912 temperature.

Fig. 11 is a schematic structural diagram of a light selective transmission device according to some embodiments of the present application. As shown in fig. 11, the light permselective device 4092 according to the present embodiment includes a faraday rotator 921 and an isolator 922, wherein the faraday rotator 921 and the isolator 922 are disposed in the first light transceiving cavity 403a, and the faraday rotator 921 and the isolator 922 are sequentially disposed on the transmission light path from the first collimating lens 4064a to the first filter 4062 a.

In some embodiments of the present application, signal light generated by the first light emitting module 404a is transmitted to the faraday rotator 921 through the first collimating lens 4064a after being collimated, a magnetic field with a variable direction is applied to the faraday rotator 921, and the magnetic field with the variable direction can realize that the faraday rotator 921 adjusts the polarization state of the signal light according to the wavelength of the signal light generated by the first light emitting module 404a, so as to realize that the signal light is output to the outside of the optical module after being screened according to the wavelength of the signal light generated by the first light emitting module 404 a.

For example, when the polarization direction of the signal light generated by the first optical transmitter module 404a is adjusted to pass through the isolator 922, the direction of the magnetic field applied to the faraday rotator 921 is changed so that the signal light having an unspecific wavelength generated by the first optical transmitter module 404a cannot pass through the isolator 922 after passing through the faraday rotator 921 and the polarization direction is adjusted. Alternatively, the change in the direction of the applied magnetic field on the faraday rotator 921 is achieved by a change in the direction of energization. Assuming that the first light emitting module 404a emits signal light of the first polarization direction, the isolator 922 allows signal light of the second polarization direction to pass through, and the faraday rotator 921 changes the polarization direction of the signal light of the first polarization direction to the second polarization direction when the first power-on direction is applied, and the faraday rotator 921 changes the polarization direction of the signal light of the first polarization direction to the third polarization direction when the second power-on direction is applied; then the signal light emitted through the first light emitting module 404a is selected to apply electricity in the first energization direction to the faraday rotator 921, and the signal light emitted through the first light emitting module 404a is selected to block the signal light to apply electricity in the first energization direction to the faraday rotator 921. Optionally, the second polarization direction is different from the third polarization direction by 90 degrees. Therefore, when the laser chip in the first optical transmitter 404a operates suddenly, the bias current is increased from 0mA to a normal light-emitting loading process, and the direction of the applied magnetic field on the faraday rotator 921 is adjusted and controlled, so that the signal light generated by the first optical transmitter 404a after the bias current is stabilized is allowed to pass through the isolator 922 and be transmitted to the first filter 4062a, and further, the signal light with shifted wavelength can be effectively prevented from entering the optical network.

In the embodiment of the present application, the faraday rotator 921 and the isolator 922 may be directly or indirectly disposed on the bottom plate of the first optical transceiver housing 401 a; for example, a fixing groove is formed in the bottom plate of the first optical transceiver housing 401a, the faraday rotator 921 is disposed in the fixing groove, a supporting platform is disposed on the bottom plate of the first optical transceiver housing 401a, the supporting platform can be adhered to the bottom plate of the first optical transceiver housing 401a, a mounting seat is disposed on the supporting platform, the isolator 922 is connected to the mounting seat, and the isolator 922 passes through the bottom plate of the first optical transceiver housing 401a of the supporting platform.

In the embodiment of the present application, the transmission light path from the first collimating lens 4064 to the first filter 4062a may be provided with not only the light selective transmission device 4092 but also the first wavelength screening device 4091; the specific selection can be performed by selecting and combining the first wavelength screening device 4091 and the light selective transmission device 4092 according to the size of the first light transceiving cavity 403a and the requirements of the first light emitting assembly 404a and the first light receiving assembly 405 a; of course, if the size of the first light transceiving cavity 403a, the first light emitting module 404a and the first light receiving module 405a allow, a wavelength screening device including a first reflecting mirror, a second reflecting mirror and a piezoelectric ceramic device may be further used in the transmission path from the first reflecting mirror 4063a to the first focusing lens 4065a and in the transmission path from the first collimating lens 4064a to the first filter 4062 a.

Fig. 12 is a cross-sectional view of an optical sub-transceiver module according to an embodiment of the present application. As shown in fig. 12, in the first optical transceiver housing 401a provided in this embodiment of the present invention, a first supporting platform 410a is disposed on a bottom plate, a mounting seat 4101a is disposed on the first supporting platform 410a, an isolator 922 is disposed on the mounting seat 4101a, the mounting seat 4101a is used for fixing and supporting the isolator 922, and the mounting of the isolator 922 and the requirement for the mounting position of the isolator 922 are conveniently achieved through the mounting seat 4101 a; a fixing groove 4013a is formed in a bottom plate of the first light transceiving housing 401a, the bottom of the faraday rotator 921 is clamped in the fixing groove 4013a, and the faraday rotator 921 can be conveniently installed and fixed through the fixing groove 4013a, so that the installation accuracy is ensured; the first TEC911 is disposed on a bottom plate of the first optical transceiver housing 401 a.

In the optical transceiver sub-module 400a provided in the embodiment of the present application, the first lens 4061a, the first filter 4062a, the first reflector 4063a, and the second filter 4066a are disposed on the first supporting platform 410 a; in the assembling process, the first lens 4061a, the first filter 4062a, the first reflector 4063a and the second filter 4066a may be coupled and fixed on the first supporting platform 410a, and then the first supporting platform 410a is fixed on the bottom plate of the first optical transceiver housing 401 a; this facilitates ensuring the mounting accuracy of the first lens 4061a, the first filter 4062a, the first reflector 4063a and the second filter 4066 a.

Optionally, the first filter 4062a is mounted on a side surface of the mounting seat 4101a, a connection through hole 4102a is disposed inside the mounting seat 4101a, and the connection through hole 4102a communicates the first filter 4062a and the isolator 922 for transmitting the emitted signal light through the isolator 922. Optionally, the support column 4103a is disposed on the first support platform 410a, the first reflector 4063a is disposed on a side surface of the support column 4103a in a mounting manner, and the side surface of the support column 4103a is disposed according to an angle requirement of the first reflector 4063a, so that the first reflector 4063a can be conveniently coupled and assembled.

In some embodiments of the present application, the first light receiving component 405a includes a shielding case, the shielding case is disposed in the first light transceiving cavity 403a to form a shielding cavity, and a light receiving device such as a photodetector, a transimpedance amplifier, and a limiting amplifier is disposed in the shielding cavity for receiving signal light; because the photodetector in the first light receiving module 405a is sensitive to light and the transimpedance amplifier, the limiting amplifier, etc. are sensitive to electrical signals, both the signal light generated by the first light emitting module 404a and the electrical signal generated by the operation of the first light emitting module 404a can generate interference on the photodetector, the transimpedance amplifier, the limiting amplifier, etc. in the first light receiving module 405a, and the use of the shielding can effectively prevent the signal light generated by the first light emitting module 404a from generating interference on the signal light received by the photodetector in the first light receiving module 405a and shield the electrical signal generated by the operation of the first light emitting module 404a from interfering the transimpedance amplifier, the limiting amplifier, etc. Optionally, the shield includes a shield case and a shield cover plate covering the shield case, and the shield case and the shield cover plate form a shield cavity. A receiving opening is provided in the shield case, and the received signal light condensed by the first focusing lens 4065a passes through the receiving opening and enters the shield cavity.

In some embodiments of the present application, the first light receiving component 405a is disposed within the first light transceiving cavity 403a by being disposed directly or indirectly on a floor within the first light transceiving cavity 403 a. In addition, in some embodiments of the present application, a light receiving support portion is disposed on the first connector 408a, and the light receiving support portion is provided with a metal ground area and a pad pin; furthermore, the first light receiving module 405a can be fixedly supported by the light receiving supporting portion, and the positions of the grounding and electrical connection areas can be provided for parts of the devices in the first light receiving module 405a, so that the grounding and electrical connection of the parts of the devices in the first light receiving module 405a can be conveniently realized. Of course, the light receiving support portion may be used not only to support and connect the first light receiving module 405a but also to support and connect the first focusing lens 4065a and the like, i.e., the first focusing lens 4065a and the like are disposed on the light receiving support portion.

Fig. 13 is a second partial structural view of an optical transceiver sub-module according to an embodiment of the present disclosure, and fig. 14 is a second cross-sectional view of the optical transceiver sub-module according to the embodiment of the present disclosure. As shown in fig. 12, 13 and 14, the first connector 408a in the rosa 400a provided in the embodiment of the present application includes a light receiving support portion 4081a, and the first light receiving element 405a is disposed on the light receiving support portion 4081 a; the first focusing lens 4065a is disposed on the light receiving support portion 4081. As shown in fig. 12, 13 and 14, the first light receiving module 405a includes a shield housing 4051a and a shield cover plate 4052a covering the top of the shield housing 4051a, the shield housing 4051a and the shield cover plate 4052a form a shield cavity 4053 a; the bottom of the shield case housing 4051a is contact-connected with the light receiving support portion 4081 a; the side of the shield case 4051a is provided with a receiving opening 511, and the receiving opening 511 is provided on the transmission output optical path of the first focusing lens 4065a, that is, the projection of the first focusing lens 4065a in the direction of the shield case 4051a covers the receiving opening 511, and the received signal light transmitted through the first focusing lens 4065a enters the shield cavity 4053a through the receiving opening 511.

In some embodiments of the present application, a first focusing lens support plate 4065-1a is disposed on the light receiving support 4081a, a first focusing lens 4065a is disposed on the first focusing lens support plate 4065-1a, and the first focusing lens 4065a is disposed on the light receiving support 4081a through the first focusing lens support plate 4065-1 a. The first focusing lens 4065a can be easily mounted and set by the first focusing lens support plate 4065-1a, and the coupling adjustment of the first focusing lens 4065a can also be easily performed.

The first light receiving component 405a further includes light receiving electric devices such as a photodetector, a transimpedance amplifier, a limiting amplifier, and the like, which are disposed in the shielding cavity 4053 a; the surface of the light receiving support portion 4081a is provided with a metal ground area and a pad pin, and the surface of the light receiving support portion 4081 to which the light receiving electric device is attached and electrically connected is provided with a metal ground area and a pad pin. In the embodiment of the present application, by providing the light receiving supporting portion 4081a and providing the metal ground area and the pad pin on the surface of the light receiving supporting portion 4081, the high frequency crosstalk of the first light receiving module 405a is reduced, and more routing positions are provided for fixing and electrically connecting the first light receiving module 405a, so as to meet the requirement of electrically connecting the first light receiving module 405 a.

Further, in some embodiments of the present application, the first light receiving assembly 405a further includes a displacement prism 4054a, the displacement prism 4054a is disposed in the shielding cavity 4053a, and a projection of the displacement prism 4054a in the direction of the photodetector covers the photodetector or a photosensitive surface of the photodetector; specifically, the displacement prism 4054a is provided with a 45 ° or nearly 45 ° reflecting surface, such as 42 ° or the like, and the projection of the reflecting surface of the displacement prism 4054a in the direction of the photodetector covers the photodetector or the photosensitive surface of the photodetector; the received signal light that further enters the shielding cavity 4053a is reflected to the photodetector through the displacement prism 4054 a. Alternatively, one end of the displacement prism 4054a is connected to the shielding cover plate 4052a, and the arrangement of the displacement prism 4054a in the shielding cavity 4053a is realized by the shielding cover plate 4052 a. The displacement prism 4054a is disposed on the shielding cover plate 4052a, which is convenient for the installation and setting of the displacement prism 4054a in the shielding cavity 4053a on the one hand, and is convenient for the coupling adjustment of the displacement prism 4054a in the receiving optical path of the first light receiving module 405 on the other hand, which is convenient for realizing the compensation of tolerance in the assembling process of the first light receiving module 405a, avoiding the difficulty in installing and adjusting the components in the first light module 406a caused by the excessive tolerance stacking of the first light receiving module 405a, and being helpful to reduce the difficulty in installing and adjusting the components in the first light module 406a to a certain extent.

In some embodiments of the present application, the shield cover plate 4052a is provided with a shield opening 521, through which the components in the shield cavity 4053a can be viewed and the relative positions of the components can be determined; an opening cover plate 522 is arranged on the shield opening 521, and the opening cover plate 522 is used for covering the shield opening 521; when the components in the shielding cavity 4053a are assembled, the opening cover plate 522 covers the shielding case opening 521, so that the shielding effect of the shielding case is prevented from being influenced by the arrangement of the shielding case opening 521. The shield case 4051a, the shield cover plate 4052a, and the opening cover plate 522 may be made of a metallic material, such as die-cast or milled metal.

In some embodiments of the present application, the light receiving electrical devices such as the photodetector, the transimpedance amplifier, the limiting amplifier, and the like may be first fixedly disposed on the light receiving support portion 4081 and electrically connected to the metal ground area and the pad pin on the light receiving support portion 4081, then the shield case 4051a may be disposed on the light receiving support portion 4081 and the displacement prism 4054a may be fixed on the shield cover 4052a, then the shield cover 4052a may be disposed on the shield case 4051a and the coupling adjustment of the photodetector receiving optical path may be performed before the shield cover 4052a is fixed on the shield case 4051a, and finally the shield cover 4052a and the shield case 4051a may be fixed and the shield opening 521 may be closed by the opening cover 522.

Fig. 15 is a first structural diagram of a first connector according to an embodiment of the present disclosure, and fig. 16 is a second structural diagram of a first connector according to an embodiment of the present disclosure. As shown in fig. 14 and 15, the left end of the first connector 408a is used to extend into the first light-emitting module 403a for wire-bonding with the electrical devices in the first light-emitting module 404a, the first light-receiving module 405a and the like in the first light-emitting module 403a, and the first connector 408a extends out of the first light-emitting module 403a for electrically connecting the circuit board 300 through the flexible circuit board.

As shown in fig. 15 and 16, the left end of the first connector 408a includes a light receiving support portion 4081a, and further includes a first step surface 4082a, a second step surface 4083a, and a third step surface 4084a, the first step surface 4082a, the second step surface 4083a, and the third step surface 4084a are respectively provided with a plurality of pad pins, and the pad pins are arranged by providing the first step surface 4082a, the second step surface 4083a, and the third step surface 4084a at the left end of the first connector 408a, so as to meet the requirement of the number of pad pins for connecting the electrical device in the first light emitting component 404a and the first light receiving component 405a with the first connector 408 a; first step surface 4082a, second step surface 4083a and third step surface 4084a are at different heights at the left end of first connector 408a, that is, first step surface 4082a, second step surface 4083a and third step surface 4084a are at different heights from the bottom surface of first connector 408a, and first step surface 4082a, second step surface 4083a and third step surface 4084a are arranged at the left end of first connector 408a in a step-like manner, so that the routing length of the electrical devices in first light emitting module 404a and first light receiving module 405a can be controlled conveniently. Optionally, pad pins for transmitting a high-frequency signal of the first light receiving component 405a are arranged on the first step surface 4082a, pad pins for transmitting a high-frequency signal of the first light emitting component 404a are arranged on the second step surface 4083a, and pad pins for transmitting direct-current signals of the first light receiving component 405a and the first light emitting component 404a are arranged on the third step surface 4084a, so that the shortest routing for transmitting a high-frequency signal of the first light emitting component 404a is realized, and the transmission quality of the high-frequency signal is ensured. In some embodiments of the present application, the shield housing 4051a wraps the first step surface 4082 in the shielding cavity 4053a, so that the shielding effect of the shield is ensured to some extent.

As shown in fig. 15 and 16, a first boss 4085a is disposed at the right end of the first connector 408a, pad pins are disposed on the upper and lower sides of the first boss 4085a, and the pad pins on the upper and lower sides of the first boss 4085a are correspondingly connected to the pad pins on the left end of the first connector 408 a. In some embodiments of the present application, pad pins for transmitting dc signals of the first light receiving module 405a and the first light emitting module 404a are arranged on the upper side of the first boss 4085a, and the pad pins arranged on the upper side of the first boss 4085a are electrically connected to the pad pins on the third step surface 4084a at the left end of the first connector 408 a. In some embodiments of the present application, pad pins for transmitting high-frequency signals of the first light receiving module 405a and the first light emitting module 404a are arranged on the lower side of the first boss 4085a, and the pad pins arranged on the lower side of the first boss 4085a are electrically connected with the pad pins arranged on the first step surface 4082a and the second step surface 4083a at the left end of the first connector 408 a.

Optionally, the upper side surface of the first boss 4085a and the third step surface 4084a are located at the same layer of the first connector 408a, that is, the upper side surface of the first boss 4085a and the third step surface 4084a are located at the same height of the first connector 408a, and then the signal connection line between the pad pin on the third step surface 4084a and the pad pin on the upper side surface of the first boss 4085a is located at the same layer of the first connector 408a, which is convenient for avoiding increasing the number of layers of the first connector 408a and providing a via hole to realize connection of signal lines in different layers. Optionally, the lower side surface of the first boss 4085a includes a fourth step surface 851 and a fifth step surface 852, the fourth step surface 851 and the first step surface 4082a are located at the same layer of the first connector 408a, the fifth step surface 852 and the second step surface 4083a are located at the same layer of the first connector 408a, and further the fourth step surface 851 and the fifth step surface 852 are located at different heights at the right end of the first connector 408a, that is, a step is formed at the connection position of the fourth step surface 851 and the fifth step surface 852. The fourth step surface 851 and the first step surface 4082a are located at the same layer of the first connector 408a, so that a signal line between a pad pin on the first step surface 4082a for transmitting a high-frequency signal of the first light receiving component 405 and a pad pin on the fourth step surface 851 for transmitting a high-frequency signal of the first light receiving component 405 is located at the same layer of the first connector 408a, which is convenient for ensuring the performance of transmitting the high-frequency signal of the first light receiving component 405 a; the fifth step surface 852 and the second step surface 4083a are located at the same layer of the first connector 408a, so that a signal line between a pad pin on the second step surface 4083a for transmitting a high frequency signal of the first light emitting module 404a and a pad pin on the fifth step surface 852 for transmitting a high frequency signal of the first light emitting module 404a is located at the same layer of the first connector 408a, which is convenient for ensuring the performance of transmitting a high frequency signal of the first light emitting module 404 a.

In some embodiments of the present application, the first connector 408a is electrically connected to the circuit board 300 through two flexible circuit boards, one of which is used to electrically connect the upper side of the first boss 4085a to the circuit board 300, and the other of which is used to electrically connect the lower side of the first boss 4085a to the circuit board 300. Of course, in some embodiments of the present application, the lower side of the first boss 4085a and the circuit board 300 may be electrically connected by two flexible circuit boards. Optionally, when the lower side surface of the first boss 4085a is electrically connected to the circuit board 300 through a flexible circuit board, the flexible circuit board used for electrically connecting the lower side surface of the first boss 4085a to the circuit board 300 may be a special-shaped flexible circuit board, for example, a U-shaped groove is provided on the flexible circuit board, and the U-shaped groove on the flexible circuit board corresponds to the direct steps of the fourth step surface 851 and the fifth step surface 852, so that the lower side surface of the first boss 4085a is electrically connected to the circuit board 300.

In some embodiments of the present application, an opening is disposed at one end of the shield cover housing 4051a, an end surface of the opening is in contact with an end surface of the first step surface 4082a, the shield cover plate 4052a is in contact with an end surface of the third step surface 4084a or the third step surface 4084a, the shield cover plate 4052a covers the first step surface 4082a, and then a pad pin on the first step surface 4082a for transmitting a high-frequency signal of the first optical receiving component 405 is encapsulated in the shielding cavity 4053a, so as to further ensure a shielding effect of the shield cover in the first optical receiving component 405a, and ensure a performance of the first optical receiving component 405a for receiving the signal light.

Fig. 17 is a schematic structural diagram of an optical transceiver sub-module according to another direction provided in the present embodiment, and fig. 18 is an exploded schematic diagram of an optical transceiver sub-module according to another direction provided in the present embodiment. As shown in fig. 17 and 18, a notch 4012a is provided on the bottom plate of the first optical transceiver housing 401a, and the light receiving support portion 4081a covers the notch 4012 a. The unfilled corner 4012a is arranged on the bottom plate of the first optical transceiver housing 401a, so that the first optical transceiver housing 401a can be effectively prevented from being heated or cooled to generate stress to extrude the light receiving supporting part 4081a of the first connector 408a to cause deformation of the first connector 408a, thereby reducing deformation of the first connector 408a and further protecting stability of a light path in the first optical transceiver cavity 403 a; in addition, in the optical module assembly process, the unfilled corner 4012a can be filled with a heat conducting gel to contact with a heat dissipation block in the optical module or an upper shell or a lower shell of the optical module, so that the number of layers of a heat conducting path passing through the position of the first connector 408a in the first optical transceiver cavity 403a is reduced, and the heat dissipation path at the position of the first connector 408a is simple and has good heat dissipation performance.

The optical transceiver sub-assembly 400 provided in the embodiment of the present application provides an optical transceiver sub-assembly of another structural form in addition to the optical transceiver sub-assembly of the structural form of the optical transceiver sub-assembly 400 a. Fig. 19 is a schematic structural diagram of another optical transceiver sub-assembly provided in the embodiment of the present application, which is marked as 400 b; fig. 20 is a partially exploded schematic view of another optical transceiver sub-assembly according to an embodiment of the present application. As shown in fig. 19 and 20, another optical transceiver sub-module 400b provided in the embodiment of the present application includes a second optical transceiver housing 401b and a second optical transceiver cover 402b covering the second optical transceiver housing 401 b; the second light transceiving housing 401b and the second light transceiving cover plate 402b form a second light transceiving cavity 403b, and a second light emitting module 404b for emitting light signals, a second light receiving module 405b for receiving light signals, and a second light module 406b for adjusting light signal transmission paths are disposed in the second light transceiving cavity 403 b. The second optical transceiver housing 401b and the light emitting cover plate 402b may be made of metal material, such as die-cast or milled metal. In the embodiment of the present application, the second light emitting assembly 404b includes a laser assembly, a laser driver, a TEC, a backlight detector, and the like for realizing and assisting the optical module to generate the optical signal. In the embodiment of the present application, as shown in the optical sub-transceiver module 400b shown in fig. 19, the second optical receiving element 405b adopts a coaxial package structure; further, the second light receiving element 405b includes a photodetector, a transimpedance amplifier, a limiting amplifier, and the like for receiving signal light, performing photoelectric conversion, and assisting photoelectric conversion. The second light receiving component 405b of the coaxial packaging structure can adopt a receiving TO with a relatively fixed structure, so that the stability of a light path caused by accumulated tolerance in the process of assembling the light receiving component is reduced, and the stability of the receiving light path is convenient TO ensure; and then the second light receiving component 405b adopting the coaxial packaging structure is convenient for realizing the coupling assembly of the light receiving component in the second light transceiving cavity 403b on the one hand, and can also improve the stability of the receiving light path on the other hand.

As shown in fig. 19 and 20, an optical fiber adapter 407 is connected to an end of the second optical transceiver housing 401b away from the circuit board 300, where one end of the optical fiber adapter 407 communicates with the second optical transceiver cavity 403b, and the other end is used for connecting an external optical fiber. The signal light emitted by the second light emitting assembly 404b is transmitted to the optical fiber adapter 407 through the first light assembly 406a, and then transmitted to the external optical fiber through the optical fiber adapter 407; signal light from an external optical fiber is transmitted into the second light transceiving cavity 403b through the optical fiber adapter 407, and is transmitted to the second light receiving component 405b through the second light component 406b, and the second light receiving component 405b receives the signal light; therefore, the signal light of the second light emitting module 404b and the signal light to be received by the second light receiving module 405b are transmitted together through the optical fiber adapter 407, and the transmission of the light emitted by the optical module and the reception of the light through one optical fiber is realized.

In some embodiments of the present application, the structure of the second optical transmitter module 404b in the rosa 400b can be referred to the structure of the first optical transmitter module 404a in the second rosa. In the optical sub-transceiver module 400b provided in the embodiment of the present application, the second optical receiving element 405b may be directly connected to the circuit board 300 through a flexible circuit board.

In some embodiments of the second optical sub-transceiver module provided in the present application, the structure of the second optical component 406b may be as the structure of the first optical component 406a shown in the first embodiment of the second optical sub-transceiver module, but may also be changed accordingly according to actual needs.

Fig. 21 is a schematic diagram of an internal structure of a second optical transceiving cavity provided in the embodiment of the present application, fig. 22 is a schematic diagram of optical path transmission of a transmitting signal light and a receiving signal light in the second optical transceiving cavity provided in the embodiment of the present application, and in fig. 22, a solid arrow is a transmission optical path of the transmitting signal light, and a dotted arrow is a transmission optical path of the receiving signal light. As shown in fig. 21 and 22, the optical transceiver subassembly provided in the embodiment of the present application includes a second optical component 406b and a second wavelength screening device 4093; wherein the second optical assembly 406b includes a second lens 4061b, a third filter 4062b, a fourth filter 4063b, a second collimating lens 4064b, a second focusing lens 4065b, and the like.

A second collimating lens 4064b is provided in the exit light direction of the second light emitting module 404b to convert the divergent light beam output from the second light emitting module 404b into a collimated light beam; the third filter 4062b is disposed in the light exit direction of the second collimating lens 4064, the second lens 4061b is disposed in the light transmission direction of the third filter 4062b, so that the collimated light beam emitted through the second collimating lens 4064b is transmitted to the optical fiber adapter 407 through the third filter 4062b and the second lens 4061b in sequence, and the second lens 4061b is used for converging the collimated light beam transmitted through the third filter 4062b to the optical fiber adapter 407. The fourth filter 4063b is disposed in the light reflection direction of the third filter 4062b, the second wavelength filter 4093 is disposed in the transmission direction of the third filter 4062b, the second focusing lens 4065b is disposed in the light transmission direction of the second wavelength filter 4093, and the second wavelength filter 4093 filters the transmission reception signal light according to the wavelength of the reception signal light; the received signal light is transmitted to the optical fiber adapter 407 through an external optical fiber, transmitted to the first lens 4061b through the optical fiber adapter 407, the second lens 4061b converts the divergent light beam into a collimated light beam, the collimated light beam converted by the second lens 4061b is transmitted to the third filter 4062b, the third filter 4062b reflects the collimated light beam to the fourth filter 4063b, and then transmitted to the second wavelength screening device 4093 through the fourth filter 4063b, the signal light transmitted through the second wavelength screening device 4093 is transmitted to the first focusing lens 4065b, and is converged and transmitted to the second light receiving module 405b through the first focusing lens 4065 b.

In the embodiment of the present application, the second wavelength filtering device 4093 is disposed on a receiving optical path of the second optical receiving component 405b in the rosa 400b, and is used for filtering the wavelength of the signal light received by the second optical receiving component 405 b. As shown in fig. 21 and 22, the second wavelength selective device 4093 includes a first mirror 932, a second mirror 933, and a piezoelectric ceramic device including a piezoelectric ceramic block 931, an air cavity 934 being formed between the first mirror 932 and the second mirror 933, the piezoelectric ceramic block 931 being connected to the first mirror 932. The voltage applied to the two ends of the piezoelectric ceramic block 931 is controlled to change, and the expansion amount of the piezoelectric ceramic block 931 changes, so that the width of the air cavity 934 between the first reflecting mirror 932 and the second reflecting mirror 933 changes, and the signal light is selectively transmitted and input to the receiving unit.

In some embodiments of the present application, the piezoelectric ceramic device further includes a cantilever 935, one side of the cantilever 935 is connected to the first reflector 932, the other side of the cantilever 935 is connected to one end of the piezoelectric ceramic block 931, and the piezoelectric ceramic block 931 is powered up to drive the first reflector 932 to move through the cantilever 935; the cantilever 935 facilitates the positioning of the piezoelectric ceramic block 931 and drives the first mirror 932.

Since the voltage applied to the piezoelectric ceramic block 931 is usually high, a voltage boost circuit is usually required to be provided in the optical module, and the voltage boost circuit is used to provide an adjustable voltage to the piezoelectric ceramic block 931. Fig. 23 is a voltage boosting circuit diagram according to an embodiment of the present application, and the voltage boosting circuit for the piezoelectric ceramic block 931 is not limited to the circuit shown in fig. 23. In addition, in combination with the PWM-type switching power supply chip, the voltage step-up circuit can change the magnitude of the voltage applied to the piezoelectric ceramic block 931.

Correspondingly, a wavelength screening device may also be disposed in the emission light path of the second light emitting component 404b in the light transceiving sub-module 400b, and the wavelength screening device may select the second wavelength screening device 4093, or may also set the first wavelength screening device 4091 or the light selective transmission device 4092 in the first light beam transceiving sub-module provided in this embodiment of the present application; of course, by adjusting the structure of the second optical assembly 406b, the first wavelength selective filter 4091 or the light selective transmission device 4092 of the first type of optical subassembly provided by this embodiment of the present application can also be selectively used on the receiving light path of the second optical receiving assembly 405 b.

Fig. 24 is a partially exploded schematic view of another optical sub-transceiver module according to an embodiment of the present disclosure, and fig. 25 is a first cross-sectional view of another optical sub-transceiver module according to an embodiment of the present disclosure. As shown in fig. 24 and 25, one end of the second optical transceiver housing 401b near the circuit board 300 is provided with a second connector 408b, such as a ceramic connector or the like. A second connector opening 4011b is arranged at one end of the second optical transceiver housing 401b close to the circuit board 300, the second connector 408b is embedded in the second connector opening 4011b, and the second connector 408b is connected to the second connector opening 4011b in an abutting fit manner, so that one end of the second connector 408b extends into the second optical transceiver cavity 403b, the other end of the second connector 408b extends out of the second optical transceiver cavity 403b, and one end of the second connector 408b extending into the second optical transceiver cavity 403b is generally used for wire bonding and connecting electrical devices in the second optical transmitter module 404b and the like in the second optical transceiver cavity 403 b; the surfaces of the two ends of the second connector 408b are provided with a plurality of pad pins for wire bonding to the second light emitting module 404b or electrical connection to the flexible circuit board. Specifically, the method comprises the following steps: one end of the second optical transceiver cavity 403b is typically used for electrically connecting the circuit board 300 via a flexible circuit board, and thus electrically connecting the circuit board 300 to electrical devices in the second optical transmitter module 404b via the second connector 408 b; the circuit board 300 may be electrically connected through a flexible circuit board or a plurality of flexible circuit boards. Of course, in the second optical sub-transceiver module provided in the embodiments of the present application, the second optical transmitter module 404b may also be directly connected to the circuit board 300 through a flexible circuit board.

As shown in fig. 24 and 25, the second light transmitting/receiving housing 401b is provided with a light receiving opening 4101, and the second light receiving element 405b is fitted in the light receiving opening 4012 b. In the optical transceiver sub-module 400b provided in some embodiments of the present application, a light receiving accommodating cavity 4013b is further disposed on the second optical transceiver housing 401b, the light receiving accommodating cavity 4013b communicates with the light receiving opening 4012b, and a front end of the second light receiving component 405b is disposed in the light receiving accommodating cavity 4013 b. The side wall of the light receiving accommodating cavity 4013b is provided with an accommodating opening 4014b, the accommodating opening 4014b is arranged on the output light path of the second focusing lens 4065b, and a first plane light window 4015b is embedded in the accommodating opening 4014b, and the first plane light window 4015b is used for receiving signal light output by the second focusing lens 4065b while being sealed and accommodating the opening 4014 b. The first planar light window 4015b is a glass plate allowing light to pass through, and in order to enhance the transmittance of the planar light window and prevent the light reflection phenomenon from affecting the performance of the second light receiving element 405b, the first planar light window 4015b is usually disposed in the receiving opening 4014b at an angle, such as an angle of 8 °, and the like, and an additional coating film may be coated on the surface of the glass plate.

The light receiving accommodating cavity 4013b and the second light transceiving housing 401b can be integrally formed, and a metal material structural member, such as a die-cast or milled metal member, is adopted; and then seal the light receiving and accommodating cavity 4013b that holds opening 4014b through first plane light window 4015b, except can being convenient for satisfying the gas tightness requirement of second light transceiver housing 401b, can also carry out the shielding of second light receiving component 405b, avoid second light receiving component 405b to suffer the interference of non-working signal light and signal of telecommunication.

Fig. 26 is a second cross-sectional view of another optical transceiver sub-module according to an embodiment of the present application. As shown in fig. 26, the second optical component 406b provided in the embodiment of the present application further includes a second isolator 4066b, where the second isolator 4066b is disposed in the transmission optical path from the second collimating lens 4064b to the third filter 4062 b; the second isolator 4066b is used to isolate the emitted signal light reflected by the third filter 4062b, and prevent the original optical path of the emitted signal light reflected by the third filter 4062b from returning.

As shown in fig. 26, a second supporting platform 410b is disposed on a bottom plate of the second light transceiving housing 401b provided in the embodiment of the present application, the second light component 406b and the second wavelength screening device 4093 are both disposed on the second supporting platform 410b, and if the second lens 4061b, the third filter 4062b, the fourth filter 4063b, etc. are disposed on the second supporting platform 410b, the second supporting platform 410b facilitates the mounting and fixing of the second lens 4061b, the third filter 4062b, the fourth filter 4063b, etc. Further, the second supporting platform 410b is provided with a supporting column and other structures, so that the second lens 4061b, the third filter 4062b, the fourth filter 4063b, the second isolator 4066b, the second wavelength screening device 4093 and other auxiliary structures are facilitated.

Fig. 27 is a schematic structural diagram of a second supporting platform according to an embodiment of the present disclosure. As shown in fig. 26 and 27, a support side plate 4102b, a mounting groove 4103b and a second mounting seat 4101b are provided on the second support platform 410 b; one side of the supporting side plate 4102b supports the side of the piezoelectric ceramic block 931, and the mounting groove 4103b is used for accommodating and fixing the first reflecting mirror 932 and the second reflecting mirror 933; the side wall of the second mounting seat 4101b supports and connects the third filter 4062b, and the second mounting seat 4101b fixedly fits the second isolator 4066b, the second mounting seat 4101b is provided with a connecting through hole 4104b for communicating the third filter 4062b and the second isolator 4066b, and the connecting through hole 4104b communicates the third filter 4062b and the second isolator 4066 b.

Fig. 28 is a schematic structural diagram of a fiber optic adapter according to an embodiment of the present application, and fig. 29 is a first cross-sectional view of the fiber optic adapter according to the embodiment of the present application. As shown in fig. 28 and 29, the optical fiber adapter 407 in the embodiment of the present application includes an optical fiber adapter body 4071, an optical fiber stub 4072, and a clamping mechanism for facilitating the assembling and fixing of the optical fiber stub 4072 on the optical fiber adapter body 4071. In some embodiments of the present application, the clamping mechanism comprises a collar 4073. As shown in fig. 28 and 29, one end of the collar 4073 is connected to the fiber optic adapter body 4071 and the collar 4073 is sleeved on the fiber stub 4072, and one end of the fiber stub 4072 is located inside the fiber optic adapter body 4071. Of course, other forms of clamping than the collar 4073 may also be used in the fiber optic adapter provided in the embodiments of the present application.

The optical fiber is soft and is not easy to be fixed with the transmitter optical sub-module in a high-precision position, so that the optical fiber ferrule is designed. The optical fiber inserting core is formed by wrapping an optical fiber by a hard material capable of realizing high-precision processing, and the optical fiber is fixed by fixing the material. Specifically, the optical fiber ferrule can be formed by wrapping an optical fiber by a ceramic material, the optical fiber is used for transmitting light, the ceramic has high processing precision, high-precision position alignment can be realized, the optical fiber and the ceramic are combined into the optical fiber ferrule, and the optical fiber is fixed by fixing the ceramic. The ceramic material limits the fixing direction of the optical fiber in the optical fiber ferrule, generally, the ceramic is processed into a cylinder, a linear through hole is arranged in the center of the ceramic cylinder, and the optical fiber is inserted into the through hole of the ceramic cylinder to realize fixing, so that the optical fiber is fixed in the ceramic body straightly.

In the embodiment of the present application, the fiber optic adapter body 4071 is provided with a protrusion 4071a, the protrusion 4071a is located on the surface of the fiber optic adapter body 4071, and the protrusion is protruded relative to the main body side surface of the fiber optic adapter body 4071.

Fig. 30 is a second cross-sectional view of a fiber optic adapter according to an embodiment of the present application. As shown in fig. 30, an end face of the optical fiber ferrule 4072 located at one end of the optical fiber adapter body 4071 is set as an inclined end face 4072b, for example, the inclined end face 4072b inclined by 8 ° or the like, so that the optical module transmission signal light can be effectively prevented from returning to the original path when entering the external optical fiber through the optical fiber ferrule 4072.

The angled end face of the fiber stub 4072 is typically formed by grinding the end face of the fiber stub 4072. to facilitate the grinding process of the angled end face of the fiber stub 4072, a first planar group 4073a is disposed on the sidewall of the collar 4073, and the first planar group 4073a includes two oppositely disposed planes, i.e., the first planar group 4073a includes two centrosymmetric planes. When the inclined end face 4072b of the optical fiber ferrule 4072 needs to be ground, the optical fiber ferrule 4072 is fixed by the collar 4073, and then the optical fiber ferrule 4072 is clamped and fixed by the first plane group 4073a on the side wall of the collar 4073, so that the grinding of the inclined end face of the optical fiber ferrule 4072 is facilitated.

To facilitate the grinding process of the inclined end surface of the optical fiber stub 4072, the collar 4073 is disposed in the middle of the optical fiber stub 4072, so the optical fiber adapter 407 further includes a sleeve 4074, one end of the sleeve 4074 is connected to the other end of the collar 4073, the other end of the optical fiber stub 4072 is located in the sleeve 4074, and the other end of the sleeve 4074 is connected to the optical transceiver housing, so that it can be used to protect the other end of the optical fiber stub 4072.

Further, a second plane group 4071b is disposed on the protrusion 4071a, and the second plane group 4071b includes two oppositely disposed planes, that is, the second plane group 4071b includes two centrosymmetric planes; when the optical fiber adapter body 4071 and the collar 4073 are assembled and fixed, the optical fiber adapter body 4071 and the collar 4073 can be positioned by the second plane group 4071b and the first plane group 4073a, and then the inclined end surface 4072b of the optical fiber ferrule 4072 can be conveniently positioned in the optical transceiver sub-module by the second plane group 4071b and the first plane group 4073 a. Optionally, a third set of flat surfaces 4074a is disposed on the sidewall of the sleeve 4074, and the third set of flat surfaces 4074a includes two oppositely disposed flat surfaces, i.e., two centrosymmetric flat surfaces of the third set of flat surfaces 4074 a. When the collar 4073 and the sleeve 4074 are assembled and fixed with the optical transceiver housing, the collar 4073, the sleeve 4074 and the optical transceiver housing can be positioned by positioning the second plane group 4071b, the third plane group 4074a and the optical transceiver housing with each other, so that the installation and positioning of the inclined end surface 4072b of the optical fiber ferrule 4072 in the optical transceiver sub-module are further facilitated.

A second planar optical window 4074b is embedded in the sleeve 4074, and the second planar optical window 4074b is used for sealing the optical fiber adapter, so that the sealing performance of the optical transceiver sub-module 400 is ensured. The second planar optical window 4074b is a glass plate allowing light to pass through, and in order to enhance the transmittance of the planar optical window and prevent the light reflection phenomenon from affecting the optical transceiving performance of the optical transceiving sub-module 400, the second planar optical window 4074b is usually disposed in the sleeve 4074 in an inclined manner, for example, inclined by 8 °, and the like, and an additional coating film may be coated on the surface of the glass plate.

Fig. 31 is a partial schematic structural diagram of another transceiver subassembly according to an embodiment of the present application. As shown in fig. 31, the second connector 408b provided in the embodiment of the present application has a left end for extending into the first light receiving/transmitting cavity 403a for wire bonding with electrical devices in the second light emitting module 404b and the like in the second light receiving/transmitting cavity 403b, and an extended portion of the second connector 408b extending out of the second light receiving/transmitting cavity 403b for electrically connecting the circuit board 300 through the flexible circuit board.

Alternatively, as shown in fig. 31, the left end of the second connector 408b includes a sixth step surface 4081b and a seventh step surface 4082b, and the sixth step surface 4081b and the seventh step surface 4082b are located at different heights at the left end of the second connector 408b, that is, the sixth step surface 4081b and the seventh step surface 4082b are located at different heights from the bottom surface of the second connector 408 b. The sixth step surface 4081b and the seventh step surface 4082b are provided with a plurality of pad pins, respectively, and the pad pins are separately provided on the sixth step surface 4081b and the seventh step surface 4082b, so that a sufficient number of pad pins can be provided for electric devices in the second light emitting module 404b and the like in the second light transceiving cavity 403 b. In some embodiments of the present application, pad pins for transmitting a high-frequency signal of the second light emitting module 404b are arranged on the sixth step surface 4081b, and pad pins for transmitting a direct-current signal of the second light emitting module 404b and the like are arranged on the seventh step surface 4082b, so that the shortest routing for transmitting a high-frequency signal of the second light emitting module 404b is conveniently achieved, and the transmission quality of the high-frequency signal is ensured.

As shown in fig. 31, a second boss 4083b is disposed at the right end of the second connector 408b, pad pins are disposed on the upper and lower sides of the second boss 4083b, and the pad pins on the upper and lower sides of the second boss 4083b are correspondingly connected to the pad pin at the left end of the second connector 408 b. Optionally, the upper side of the second boss 4083b is configured with a pad pin for transmitting a dc signal of the second optical transmission module 404b, the lower side of the second boss 4083b is configured with a pad pin for transmitting a high frequency signal of the second optical transmission module 404b, the sixth step 4081b and the lower side of the second boss 4083b are located at the same layer of the second connector 408b, the seventh step 4082b and the upper side of the second boss 4083b are located at the same layer of the second connector 408b, the pad pin at the lower side of the second boss 4083b is correspondingly connected to the pad pin at the sixth step 4081b, the pad pin at the upper side of the second boss 4083b is correspondingly connected to the pad pin at the seventh step 4082b, so that the signal line between the pad pin at the sixth step 4081b for transmitting a high frequency signal of the second optical transmission module 404b and the pad pin at the second boss 4083b is located at the same layer of the second connector 408b, so as to ensure the performance of transmitting the high frequency signal of the second optical transmission assembly 404 b.

In some embodiments of the present application, the second connector 408a is electrically connected to the circuit board 300 via two flexible circuit boards, one of which is used to electrically connect the upper side of the second boss 4083b to the circuit board 300, and the other of which is used to electrically connect the lower side of the second boss 4083b to the circuit board 300.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A light module, comprising:

a circuit board;

wherein, the optical transceiver sub-assembly includes:

a light-receiving housing;

2. The optical module of claim 1, wherein the clamping mechanism comprises a collar, the collar is sleeved on the optical fiber ferrule, and a first plane group is disposed on a side wall of the collar.

3. The optical module of claim 2, wherein a protrusion is disposed on the fiber adapter body, a second plane group is disposed on the protrusion, and the positioning and assembling of the fiber adapter body and the collar are realized through the second plane group and the first plane group.

4. The fiber optic module of claim 1, wherein the fiber stub includes an angled end face that is located within the fiber optic adapter body.

5. A light module as claimed in claim 4, characterized in that the inclined end surface is inclined at an angle of 8 °.

6. The optical module of claim 2, wherein the optical fiber adapter further comprises a sleeve, one end of the sleeve is connected to the other end of the collar and the other end of the optical fiber ferrule is located inside the sleeve, and the other end of the sleeve is connected to the optical transceiver housing.

7. The optical module according to claim 6, wherein a third plane set is disposed on a sidewall of the sleeve, and the positioning assembly of the sleeve and the collar is realized through the third plane set and the first plane set.

8. The optical module of claim 6, wherein the sleeve has a second planar optical window embedded therein.