Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.
In the description of the embodiments of the present application, it should be understood that the terms "thickness" and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, and do not imply or indicate that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
Referring to fig. 1, 2 and 3, the present application provides a vehicle glazing 100, wherein the vehicle glazing 100 comprises a laminated glass 10 and a microstrip antenna 20. The laminated glass 10 has an outer surface 11 facing the outside of the vehicle and an inner surface 12 opposite to the outer surface 11. The microstrip antenna 20 is fixed between the outer surface 11 and the inner surface 12 or attached to the inner surface 12. The laminated glass 10 is provided with an on-board unit connecting portion 13 on the inner surface 12, and the on-board unit connecting portion 13 is used for being fixedly connected with an on-board unit 30, so that the on-board unit 30 is electrically connected with the microstrip antenna 20. It is understood that the window glass 100 may be applied to a vehicle device such as an automobile, a truck, a bus, etc., and the window glass 100 may be a front windshield.
In the present embodiment, the laminated glass 10 may be formed by laminating a plurality of glass sheets. After the window glass 100 is mounted in a vehicle, the outer surface 11 is disposed toward the outside of the vehicle, and the inner surface 12 is disposed toward the inside of the vehicle. The outer surface 11 may be an outwardly convex curved surface, and the inner surface 12 is disposed substantially parallel to the outer surface 11. The laminated glass 10 may further be plated with a heat insulation film on the inner surface 12 and the outer surface 11 to increase the heat insulation performance of the laminated glass 10. The heat insulation film is provided with a film layer hollow hole in the area facing the microstrip antenna 20, and the film layer hollow hole can penetrate through the electromagnetic signal of the microstrip antenna 20, so that the microstrip antenna 20 is prevented from being interfered by the heat insulation film, and the communication performance of the microstrip antenna 20 is improved. The laminated glass 10 may also be provided with a wire mesh between the inner surface 12 and the outer surface 11, and after the wire mesh is electrified, the wire mesh can heat the laminated glass 10, so that the laminated glass 10 is not easy to frost and fog, and the laminated glass 10 can have defrosting and demisting effects. The area of the wire mesh clip facing the microstrip antenna 20 may be provided with a wire mesh hollowed-out portion, and the wire mesh hollowed-out portion may transmit an electromagnetic signal of the microstrip antenna 20, so as to prevent the microstrip antenna 20 from being interfered by the wire mesh clip, and improve the communication performance of the microstrip antenna 20.
It can be understood that, since the microstrip antenna 20 may be integrated in the laminated glass 10, an avoidance structure may be disposed in a region where the laminated glass 10 has signal interference with the microstrip antenna 20, and an electromagnetic signal of the microstrip antenna 20 may be transmitted by the avoidance structure, so as to prevent the signal of the microstrip antenna 20 from being interfered, and increase the communication performance of the microstrip antenna 20. That is, in the present embodiment, the avoiding structure is not limited to the film layer via hole, the screen via portion, and the like of the heat insulating film.
In this embodiment, the microstrip antenna 20 is close to the edge of the laminated glass 10, so as to reduce the influence of the microstrip antenna 20 on the visible range of the laminated glass 10. The position of the microstrip antenna 20 fixed on the laminated glass 10 can be adjusted according to the area of the laminated glass 10, so as to meet the structural requirements of the vehicle window glass 100, and the adjustment and setting can be performed according to various vehicle types. For example, when the visible range of the laminated glass 10 is large, the microstrip antenna 20 may be disposed at a position far from the edge of the laminated glass 10, so as to reduce the probability of signal interference of the microstrip antenna 20. When the visible range of the laminated glass 10 is small, the microstrip antenna 20 may be disposed at a position close to the edge of the laminated glass 10, so as to ensure that the visible range of the laminated glass 10 meets the requirement. When the vehicle window glass 100 is applied to a vehicle, the microstrip antenna 20 may be disposed at an edge of the laminated glass 10 close to the roof of the vehicle to increase the communication range.
Specifically, the laminated glass 10 includes a first long side 14, a second long side 15 disposed opposite to the first long side 14, and two opposite short sides 16. The two short sides 16 are connected between the first long side 14 and the second long side 15. The microstrip antenna 20 is arranged adjacent to the first long side 14. The distance from the microstrip antenna 20 to the first long side 14 can be adjusted as required, so as to reduce the influence of the microstrip antenna 20 on the visible range of the laminated glass 10 and ensure the communication requirement of the microstrip antenna 20.
In the present embodiment, the on-board unit connecting portion 13 may stabilize the on-board unit 30 so that the on-board unit 30 is fixed to the window glass 100. The position of the on-board unit connecting part 13 on the inner layer glass can be adjusted as required, so that the on-board unit 30 and the window glass 100 can be conveniently installed, and the uniform adaptability of the on-board unit 30 is ensured. The on-board unit 30 differs from a conventional on-board unit in that the on-board unit 30 is not provided with an antenna, and the on-board unit 30 only needs to receive and process signals of the microstrip antenna 20 and send out response signals through the microstrip antenna 20. By integrating the microstrip antenna 20 into the laminated glass 10, the microstrip antenna 20 can be effectively arranged aiming at the structure of the laminated glass 10, and further, the communication efficiency can be effectively improved. The vehicle-mounted unit connecting portion 13 and the vehicle-mounted unit 30 may be fixedly connected by adhesive, welded, or engaged by a fastener. Utilize window glass 100 sets up on-vehicle unit connecting portion 13, and is convenient on-vehicle unit 30 have pointed ground with window glass 100 carries out the adaptation, conveniently provides a whole set of service chain of window glass 100, vehicle, on-vehicle unit 30 and ETC (Electronic Toll Collection, electron does not shut down the system), improves communication efficiency.
It will be appreciated that the on-board unit 30 may be provided with a connector 31, a processor 32 and a circuit board 33. The connector 31 is electrically coupled to the microstrip antenna 20 to transmit an electrical signal to the microstrip antenna 20 or receive an electrical signal from the microstrip antenna 20. The connector 31 and the microstrip antenna 20 may be directly electrically connected or coupled electrically. The processor 32 is electrically connected to the connector 31 to receive the data signal from the connector 31, decode the data signal, and then send a decoding response signal. The processor 32 sends the decoded reply signal to the microstrip antenna 20.
It can be understood that, on an ETC (Electronic Toll Collection) lane, when a vehicle equipped with the window glass 100 integrated with the microstrip antenna 20 passes through the ETC lane, an RSU (Road Side Unit) of the ETC lane may send a radio frequency signal of a certain frequency to the microstrip antenna 20 of the window glass 100 through a reader/writer via an antenna, after receiving the radio frequency signal, the microstrip antenna 20 transmits the radio frequency signal to the on-board Unit 30 on the window glass 100, and after decoding the data signal by using the on-board Unit 30 on the window glass 100, the on-board Unit 30 sends a self-encoding response radio frequency signal through the microstrip antenna 20, and the encoding response radio frequency signal is acquired by the reader/writer of the RSU, and after decoding, the self-encoding response radio frequency signal is sent to a data exchange and management system for processing, so as to implement automatic identification. Of course, if the microstrip antenna 20 is a passive rf antenna, the microstrip antenna 20 may also directly send out a response rf signal after receiving the rf signal of the RSU, and the encoded response rf signal is acquired by the reader of the RSU, so as to implement automatic identification.
Further, referring to fig. 4, the laminated glass 10 includes an outer layer glass 101 and an inner layer glass 102 laminated with the outer layer glass 101, the outer surface 11 is disposed on a side of the outer layer glass 101 away from the inner layer glass 102, and the inner surface 12 is disposed on a side of the inner layer glass 102 away from the outer layer glass 101.
In the present embodiment, the outer layer glass 101 and the inner layer glass 102 are bent. The outer layer glass 101 is substantially parallel to the inner layer glass 102. The outer layer glass 101 and the inner layer glass 102 are both baking-bending glass. That is, the inner layer glass 102 and the outer layer glass 101 may be both formed by bending through a high temperature baking process. The microstrip antenna 20 may be sandwiched between the outer layer glass 101 and the inner layer glass 102, may be embedded in the outer layer glass 101 at a distance from the outer surface 11, may be embedded in the inner layer glass 102, or may be attached to the inner surface 12 of the inner layer glass 102. Of course, in other embodiments, the laminated glass 10 may further include an intermediate glass between the outer glass 101 and the inner glass 102, and the microstrip antenna 20 may also be sandwiched between the outer glass 101 and the intermediate glass, or between the inner glass 102 and the intermediate glass.
Specifically, the laminated glass 10 further includes a plastic resin layer 103 bonded between the inner layer glass 102 and the outer layer glass 101. After the plastic resin layer 103 in a solid state is laid on the outer layer glass 101, the inner layer glass 102 is attached to the plastic resin layer 103, and finally the outer layer glass 101 and the inner layer glass 102 are pressed by a hot pressing process, so that the plastic resin layer 103, the outer layer glass 101 and the inner layer glass 102 are stable in structure, and the laminated glass 10 is finally obtained. Of course, in other embodiments, a plurality of plastic resin layers 103 may be disposed between the inner glass layer 102 and the outer glass layer 101.
More specifically, the plastic resin layer 103 is 0.5mm to 1.2mm, and further 0.7mm to 1.0 mm. The thickness of the plastic resin layer 103 is increased, so that the distance between the outer layer glass 101 and the inner layer glass 102 can be increased, the microstrip antenna 20 is conveniently fixed between the outer layer glass 101 and the inner layer glass 102, the microstrip antenna 20 is protected, the production cost of the laminated glass 10 can be effectively reduced, and namely the thickness of the plastic resin layer 103 can be set to be 0.8mm or approximately 0.8 mm. Of course, the thickness of the plastic resin layer 103 may also be set to 1.0mm or 1.2mm, or approximately 1.0mm and 1.2mm, so that the distance between the outer layer glass 101 and the inner layer glass 102 is further increased, and the structure of the laminated glass 10 is more stable. Of course, when the microstrip antenna 20 is attached to the inner surface 12, the thickness of the plastic resin layer 103 may be set to 0.76mm or approximately 0.76mm, so that the laminated glass 10 is thin as a whole.
In one embodiment, the microstrip antenna 20 is fixed between the outer glass 101 and the inner glass 102. The microstrip antenna 20 is embedded in the plastic resin layer 103. Specifically, after the plastic resin layer 103 is laid on the surface of the outer glass layer 101 away from the outer surface 11, a housing hole 104 is formed in the plastic resin layer 103, the microstrip antenna 20 is placed in the housing hole 104, the inner glass layer 102 is bonded to the plastic resin layer 103, and the inner glass layer 102, the plastic resin layer 103, and the outer glass layer 101 are collectively thermocompressed. The thickness of the plastic resin layer 103 before hot pressing was 1.14 mm. The thickness of the plastic resin layer 103 after being formed on the inner layer glass 102 and the outer layer glass 101 through a hot pressing process is 0.83 mm. Of course, in other embodiments, the thickness of the plastic resin layer 103 before hot pressing may be approximately 1.14mm, and the thickness of the plastic resin layer 103 after hot pressing is approximately 0.83mm after the inner layer glass 102 and the outer layer glass 101 are formed.
In one embodiment, the microstrip antenna 20 is fixed between the outer glass 101 and the inner glass 102, and the microstrip antenna 20 is electrically coupled to the on-board unit 30. The coupling electrical connection mode of the on-board unit 30 and the microstrip antenna 20 may be coaxial cable coupling electrical connection or capacitive coupling electrical connection.
Specifically, the microstrip antenna 20 includes a substrate 21, a radiator 22, and a ground electrode 23. The radiator 22 is attached to one surface of the substrate 21, and the ground electrode 23 is attached to one surface of the substrate 21 opposite to the radiator 22. The radiator 22 may be arranged on one surface of the substrate 21 according to a predetermined pattern, so that the radiator 22 forms a desired structure. The ground electrode 23 may cover a surface of the substrate 21 opposite to the radiator 22. The radiator 22 may be a copper foil. Further, the radiator 22 may be made of ultra-low profile copper foil. The radiator 22 may also be made of an inverted copper foil. The ULP (Ultra low power) of the radiator 22 is 18/35 μm. Of course, the ULP of the radiator 22 may also be a value of approximately 18/35 μm. The ground electrode 23 may be made of the same copper foil as the radiator 22. The thickness of the radiator 22 may be 0.035mm or a value close to 0.035 mm. The thickness of the ground electrode 23 and the radiator 22 may be equal. The substrate 21 may be a high frequency laminate. The substrate 21 may be a RO3003G2 laminate. Of course, the substrate 21 may be made of the same type of RO3003G2 laminate. The thickness of the substrate 21 is limited to 0.71mm to 0.81mm, and further 0.76 mm. The thickness of the substrate 21 is 0.71mm, so that when the microstrip antenna 20 is fixed between the inner layer glass 102 and the outer layer glass 101, the substrate 21, the inner layer glass 102 and the outer layer glass 101 both have a reserved space for the radiator 22 and the copper foil to be assembled. The substrate 21 is 0.81mm, so that the stability of the microstrip antenna 20 can be improved, the microstrip antenna 20 is prevented from being damaged, and the safety of the microstrip antenna 20 is ensured.
Preferably, the thickness of the substrate 21 is 0.76mm, and the thickness of the substrate 21 is smaller than the thickness of the plastic resin layer 103, so that the microstrip antenna 20 is conveniently embedded in the plastic resin layer 103, the stability of the substrate 21 is also increased, and the safety of the microstrip antenna 20 is maintained. The dielectric constant of the substrate 21 is 2.96-3.04, and further 3.0. The loss factor of the substrate 21 is 0.001 to 0.0014, and further 0.0012. The dielectric constant and the loss factor of the substrate 21 are small, so that the electromagnetic field of the radiator 22 is less influenced by the substrate 21, and the communication efficiency of the microstrip antenna 20 is improved. The thermal expansion coefficient of the substrate 21 is 15 ppm/DEG C to 30 ppm/DEG C, and further 17 ppm/DEG C, or 18 ppm/DEG C, or 26 ppm/DEG C. Preferably, the thermal expansion coefficients of the substrate 21 in the directions of the three axes X, Y, Z (the three axes X, Y, Z are perpendicular to each other) are 17 ppm/deg.C, 18 ppm/deg.C and 26 ppm/deg.C, respectively, to ensure that the substrate 21 has a minimal effect on the dielectric constant during processing. Of course, the substrate 21 may be selected to have a value of approximately 17 ppm/deg.C, 18 ppm/deg.C, or 26 ppm/deg.C.
In one example, referring to fig. 1 and 5, the radiator 22 is disposed on the substrate 21 and includes a plurality of vibrators 221 arranged in an array. The radiator 22 includes four vibrators 221 arranged in a rectangular array, four matching lines 222 respectively connected to the four vibrators 221, and a feeding point 223 connected to the four matching lines 222. The feeding point 223 may be electrically connected or coupled in contact with the connector 31 of the on-board unit 30.
In another embodiment, referring to fig. 6, substantially the same as the embodiment shown in fig. 5, except that the radiator 22 is provided with a single vibrator 221, a single matching line 222 connected to the vibrator 221, and a feeding point 223 connected to the matching line 222.
In one embodiment, referring to fig. 1 and 7, the microstrip antenna 20 and the on-board unit 30 are electrically coupled by a coaxial cable coupling. Specifically, the vehicle window glass 100 further includes a coaxial cable 40, one end of the coaxial cable 40 penetrates through the inner layer glass 102 and is electrically connected with the microstrip antenna 20 in a contact manner, and the other end of the coaxial cable 40 is electrically connected with the on-board unit 30. The coaxial cable 40 and the on-board unit 30 may be directly or indirectly electrically connected. More specifically, the radiator 22 is attached to a surface of the substrate 21 facing the outer glass 101. The radiator 22 is attached to a surface of the inner glass 102 away from the outer surface 11. The coaxial cable 40 includes a core 41, an insulating layer 42, and a shielding layer 43. The insulating layer 42 covers the periphery of the wire core 41, and the shielding layer 43 covers the periphery of the insulating layer 42. One end of the core 41 passes through the inner glass 102 and the substrate 21 and contacts the feeding point 223 of the radiator 22. The shield layer 43 passes through the inner glass 102 and contacts the ground electrode 23. The insulation layer 42 isolates the wire core 41 from the ground electrode 23. An end of the wire core 41 away from the microstrip antenna 20 and an end of the shielding layer 43 away from the microstrip antenna 20 are both protruded with respect to the inner glass 102, and both the wire core 41 and the shielding layer 43 are in contact with the connector 31 of the on-board unit 30. The connector 31 of the on-board unit 30 may be provided with a core terminal and a ground terminal electrically connected to the circuit board 33, the core terminal and the ground terminal being in contact electrical connection with the core 41 and the ground electrode 23, respectively. Of course, in another embodiment, the radiator 22 of the microstrip antenna 20 may be attached to a surface of the substrate 21 facing the inner layer glass 102, that is, the radiator 22 may be attached to a surface of the inner layer glass 102 away from the inner surface 12.
In another embodiment, referring to fig. 1 and 8, substantially the same as the embodiment shown in fig. 7, except that the window glass 100 further includes a coupling circuit board 50, the coupling circuit board 50 is fixed to the inner surface 12 and electrically coupled to the microstrip antenna 20, and the coupling circuit board 50 is further electrically coupled to the on-board unit 30. One end of the coaxial cable 40 passes through the inner glass 102 to be electrically connected with the microstrip antenna 20 in a contact manner, and the other end of the coaxial cable is electrically connected with the coupling circuit board 50 in a contact manner. The coupling circuit board 50 includes a coupling substrate 51 and coupling ground electrodes 52 attached to opposite surfaces of the coupling substrate 51. The coupling circuit board 50 is attached to the inner surface 12 of the inner layer glass 102. The core 41 passes through the coupling substrate 51, the coupling ground electrode 52, the inner glass 102, the ground electrode 23, and the substrate 21, and contacts the feeding point 223 of the radiator 22. The shield layer 43 passes through the coupling substrate 51, the coupling ground electrode 52 and the inner glass 102, and is in contact with the ground electrode 23. The insulating layer 42 isolates the wire core 41 from the coupled ground electrode 52 and the ground electrode 23. One end of the wire core 41 away from the coupling substrate 51 protrudes relative to the coupling substrate 51 and is in contact electrical connection with the connector 31 of the on-board unit 30 to receive the electrical signal of the on-board unit 30. The shielding layer 43 electrically connects the coupling ground electrode 52 and the ground electrode 23. One end of the coupling ground electrode 52 penetrating through the coupling circuit board 50 may also be in contact with and electrically connected to the connector 31 of the on-board unit 30 to achieve connection with the common electrode of the on-board unit 30. The coupling ground electrode 52 of the coupling circuit board 50 may be in contact and electrical connection with the on-board unit 30 through a copper foil trace. The coupling circuit board 50 may be directly electrically connected to the on-board unit 30 in a contact manner, or may be electrically coupled to the on-board unit 30. The coaxial cable 40 may be electrically coupled to the on-board unit 30 in a contactless manner through one end of the coupling circuit board 50.
Specifically, the thickness of the coupling substrate 51 may be 0.75mm to 0.85mm, and further 0.80 mm. The coupling substrate 51 may be made of the same type of plate material as the substrate 21. The thickness of the coupled ground electrode 52 may be 0.35mm, or a value of approximately 0.35 mm. The coupled ground electrode 52 may be made of the same type of copper foil material as the ground electrode 23. The dielectric constant of the coupling substrate 51 may be 4.4, or approximately 4.4. The coupling substrate 51 may have a loss factor of 0.02, or approximately 0.02.
In another embodiment, referring to fig. 1 and 9, the microstrip antenna 20 is electrically coupled to the coupling circuit board 50 in a capacitive coupling manner, which is substantially the same as the embodiment shown in fig. 8. Namely, the microstrip antenna 20 and the coupling circuit board 50 are electrically connected in a capacitive coupling manner. Specifically, the coupling circuit board 50 includes a coupling substrate 51, a coupling feeding electrode 53 attached to one surface of the coupling substrate 51, and a coupling grounding electrode 52 attached to one surface of the coupling substrate 51 opposite to the coupling feeding electrode 53. The microstrip antenna 20 is provided with a ground electrode 23 and a coupling radiator 24 on a surface of the substrate 21 facing the inner glass 102. The coupled radiator 24 is isolated from the ground electrode 23. The coupling radiator 24 is electrically connected to the radiator 22 on the side of the substrate 21 facing the outer glass 101 via a conductor passing through the substrate 21. The coupling circuit board 50 is further provided with a coupling capacitor 54 on a surface of the coupling substrate 51 away from the inner glass 102, and the coupling capacitor 54 is isolated from the coupling ground electrode 52. The coupling capacitor plate 54 is conducted with the coupling feed electrode 53 through a conductor passing through the coupling substrate 51, so that a coupling capacitor is formed between the coupling feed electrode 53 and the coupling radiator 24, and the coupling radiator 24 receives an electrical signal through the coupling feed electrode 53. The coupling capacitance sheet 54 may be electrically connected in contact with the connector 31 of the in-vehicle unit 30. The coupling ground electrode 52 may also be electrically connected in contact with the connector 31 of the on-board unit 30, so as to enable the on-board unit 30 and the microstrip antenna 20 to transmit electrical signals to each other via the coupling circuit board 50. It should be noted that, in the embodiment, the microstrip antenna 20 is electrically connected to the on-board unit 30 in a non-contact manner through capacitive coupling, and compared with the embodiment shown in fig. 8, the microstrip antenna of the embodiment is electrically connected to the coaxial cable in a contact manner, and is electrically connected to the on-board unit in a contact manner by passing through the inner glass through one end of the coaxial cable, and the inner glass 102 of the embodiment does not need a through hole or a hole opening process, so that the process flow is simplified, the yield of products is improved, and the manufacturing cost is saved.
In another embodiment, please refer to fig. 1 and 10, which is substantially the same as the embodiment shown in fig. 7, except that the microstrip antenna 20 is fixed on a side of the inner glass 102 away from the outer glass 101, and the microstrip antenna 20 is electrically connected to the on-board unit 30 in a contact manner. Namely, the microstrip antenna 20 is fixed to the inner surface 12 of the laminated glass 10. Specifically, the radiator 22 is attached to the inner surface 12. The ground electrode 23 is attached to a surface of the substrate 21 remote from the inner surface 12. The connector 31 of the on-board unit 30 is electrically connected to the radiator 22 via a conductor passing through the substrate 21. The connector 31 of the vehicle-mounted unit 30 can be directly electrically connected with the grounding electrode 23 of the microstrip antenna 20 to realize that the vehicle-mounted unit 30 and the microstrip antenna 20 mutually transmit electric signals. Of course, in other embodiments, the ground electrode 23 may be attached to the inner surface 12, and the radiator 22 may be disposed away from the inner glass 102. The radiator 22 may be electrically connected to the on-board unit 30 in a non-contact manner.
Further, referring to fig. 1 and 11, the laminated glass 10 is provided with a positive conductive electrode and a negative conductive electrode attached to the inner surface 12, one end of the positive conductive electrode and the other end of the negative conductive electrode are electrically connected to the on-board unit 30, and the other end of the positive conductive electrode and the other end of the negative conductive electrode are electrically connected to a power module 60, so as to conduct an electrical signal of the power module 60 to the on-board unit 30.
In the present embodiment, the positive and negative conductive electrodes include a positive conductive electrode 61 and a negative conductive electrode 62 facing the positive conductive electrode 61. The positive conductive electrode 61 and the negative conductive electrode 62 are formed on the inner surface 12 of the inner glass layer 102 after silver paste is cured. The positive electrode 61 and the negative electrode 62 may be formed on the inner surface 12 through a printing process. The positive electrode 61 and the negative electrode 62 extend in parallel. The positive electrode 61 and the negative electrode 62 may be electrically connected to the on-board unit 30 in a contact manner or in a non-contact manner. The positive conductive electrode 61 and the negative conductive electrode 62 may be electrically connected to the power module 60 in a contact manner or in a non-contact manner. The distance between the positive electrode 61 and the negative electrode 62 may be set according to the circuit board structure of the power module 60. The power module 60 and the on-board unit 30 may be independent from each other, and the power module 60 may be fixed to a main frame of a vehicle, may be fixed to the inner surface 12 of the window glass 100, or may be integrated into a power system of the vehicle. The on-board unit 30 can obtain electric power from the power module 60 via the positive and negative conductive electrodes. The on-board unit 30 and the power module 60 are independent from each other, so that the power module 60 can be separately set to facilitate the power module 60 to conform to the vehicle specifications. The circuit board of the power module 60 may be adhered to the inner surface 12 of the inner layer glass 102 by an adhesive, and the circuit board of the power module 60 may be welded to the positive conductive electrode 61 and the negative conductive electrode 62, so as to achieve conduction between the power module 60 and the positive conductive electrode 61 and the negative conductive electrode 62.
Referring to fig. 1 and 12, the embodiment of the present application further provides a vehicle 200, where the vehicle 200 includes the window glass 100 and a vehicle body 210. The window glass 100 is fixed to the vehicle body 210. The vehicle body 210 includes a chassis 211, a wheel assembly 212, a power mechanism, a frame, and a housing 213. The wheel assembly 212 is rotatably connected to the chassis 211, and the power mechanism is mounted to the chassis 211 to output torque power to the wheel assembly 212. The frame is fixed on the chassis 211, the shell 213 is fixed on the frame, and the wheel glass and the shell 213 are jointly coated and fixed on the frame. The window glass 100 may be a front window glass of a vehicle 200. The microstrip antenna 20 may be disposed on the window glass 100 near the roof of the vehicle 200. The vehicle 200 further comprises an on-board unit 30, the on-board unit 30 is provided with a circuit board 33, the on-board unit 30 is fixed on the inner surface 12 of the laminated glass 10, and the circuit board 33 is electrically connected with the microstrip antenna 20.
Through microstrip antenna 20 is fixed in between surface 11 and the internal surface 12 of laminated glass 10 or attach and locate on the internal surface 12 of laminated glass 10, and can fix on-vehicle unit 30 on the internal surface 12 of laminated glass 10 to make on-vehicle unit 30 be connected with microstrip antenna 20 electricity, microstrip antenna 20 can set up before laminated glass 10 leaves the factory promptly, and microstrip antenna 20 can pertinence ground and laminated glass 10 carry out the adaptation, has improved microstrip antenna 20's communication performance, increases ETC communication efficiency.
The foregoing is an implementation of the embodiments of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the embodiments of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.