CN212113700U

CN212113700U - Heat radiation structure and radiator

Info

Publication number: CN212113700U
Application number: CN202021248791.7U
Authority: CN
Inventors: 张跃
Original assignee: Huizhou Shiwei New Technology Co Ltd
Current assignee: Huizhou Shiwei New Technology Co Ltd
Priority date: 2020-06-30
Filing date: 2020-06-30
Publication date: 2020-12-08
Anticipated expiration: 2030-06-30

Abstract

The utility model discloses a heat radiation structure and radiator. The heat dissipation structure comprises a thermoelectric generation piece, a liquid cooling box and a thermoelectric refrigeration assembly, wherein the thermoelectric generation piece is abutted against the heat source and is used for receiving heat radiated by the heat source and converting the heat into electric energy; the liquid cooling box is loaded with a heat dissipation medium, the bottom of the liquid cooling box is arranged towards one end, away from the heat source, of the thermoelectric generation piece, and the maximum temperature of the heat dissipation medium is lower than the temperature of the heat source during working; the thermoelectric refrigeration assembly is electrically connected with the thermoelectric power generation sheet and faces the top of the liquid cooling box. The utility model discloses technical scheme aims at solving heat radiation structure's radiating efficiency can't guarantee and bulky technical problem.

Description

Heat radiation structure and radiator

Technical Field

The utility model relates to a heat dissipation technical field, in particular to heat radiation structure and applied this heat radiation structure's radiator.

Background

In the related art, the mainstream development trend of the chip technology is that the integration level is higher and higher, and the volume is gradually reduced, under the circumstance, the heat dissipation problem of the chip becomes more and more prominent, and if the existing chip directly adopts the heat dissipation fin to dissipate heat, the temperature of the two sides of the heat dissipation fin is easy to be different after working for a period of time, so that the heat dissipation efficiency cannot be effectively ensured, and if the heat dissipation liquid is directly adopted to dissipate heat, a very large heat dissipation area is needed to liquefy the steam of the heat dissipation liquid, so that the development requirement is not met, and therefore the heat dissipation of the chip is required to be improved.

The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a heat radiation structure aims at solving the technical problem that heat radiation structure radiating efficiency can't guarantee and bulky.

In order to achieve the above object, the utility model provides a heat radiation structure, include:

the thermoelectric generation piece is arranged towards a heat source and used for receiving heat radiated by the heat source and converting the heat into electric energy;

the liquid cooling box is loaded with a heat dissipation medium, the bottom of the liquid cooling box and one end, away from the heat source, of the thermoelectric generation piece are arranged, and the maximum temperature value of the heat dissipation medium is lower than that of the heat source; and

the thermoelectric refrigeration assembly is electrically connected with the thermoelectric power generation sheet and faces the top of the liquid cooling box, so that heat exchange between the thermoelectric refrigeration assembly and the heat dissipation medium is realized.

In an embodiment of this application, the liquid cooling case includes two butt sections and two linkage segments, two the butt section sets up relatively, two the linkage segment is connected in two the butt section to enclose and close and form the frame structure, form in the frame structure and hold the chamber, the heat-radiating medium is located hold the intracavity, one the butt section butt in thermoelectric generation piece, another the butt section butt in thermoelectric refrigeration subassembly.

In an embodiment of the application, the cross-sectional area of the connecting section is smaller than the cross-sectional area of the abutment section in the extension direction of the liquid-cooled tank.

In an embodiment of the present application, the heat dissipation medium is a water-cooling liquid;

and/or the boiling point temperature of the heat dissipation medium is lower than the temperature of the heat source.

In an embodiment of this application, thermoelectric generation piece includes first electrically conductive module and second electrically conductive module, first electrically conductive module with a surface interconnect of second electrically conductive module, first electrically conductive module orientation the heat source setting, the electrically conductive module orientation of second the liquid cooling case sets up, thermoelectric refrigeration subassembly's both electrodes end respectively with first electrically conductive module with the electrically conductive module of second is connected.

In an embodiment of the present application, the first conductive module and the second conductive module are both semiconductors, and the semiconductor materials used for the first conductive module and the second conductive module are different.

In an embodiment of the application, the thermoelectric generation piece further includes two heat conduction pads, one the heat conduction pad is pasted and located the first electrically conductive module deviates from the surface of the second electrically conductive module, the first electrically conductive module is through one the heat conduction pad with the heat source butt, another the heat conduction pad is pasted and located the second electrically conductive module deviates from the surface of the first electrically conductive module, the second electrically conductive module is through another the heat conduction pad with the bottom butt of the liquid cooling box.

In an embodiment of the present application, the thermoelectric cooling module includes an N-type semiconductor, a P-type semiconductor, and a connection module, the connection module is electrically connected to the N-type semiconductor and the P-type semiconductor, and the N-type semiconductor and the P-type semiconductor are disposed on the same side of the connection module;

the connecting module is used for receiving the electric energy that the thermoelectric generation piece produced and transmitting N type semiconductor with P type semiconductor, so that N type semiconductor with P type semiconductor deviates from the one end of connecting module forms the refrigeration end, the refrigeration end with the top butt of liquid cooling case.

In an embodiment of the application, the heat dissipation structure further includes a voltage transformation assembly, and the voltage transformation assembly is connected between the thermoelectric generation sheet and the thermoelectric refrigeration assembly, so as to convert electric energy generated by the thermoelectric generation sheet and transmit the converted electric energy to the thermoelectric refrigeration assembly.

The utility model also provides a radiator, including heat radiation structure, heat radiation structure includes:

the liquid cooling box is loaded with a heat dissipation medium, the bottom of the liquid cooling box is arranged towards one end, away from the heat source, of the thermoelectric generation piece, and the maximum temperature value of the heat dissipation medium is lower than that of the heat source; and

the thermoelectric refrigeration assembly is electrically connected with the thermoelectric power generation sheet and faces the top of the liquid cooling box.

The utility model discloses heat radiation structure's technical scheme is including the thermoelectric generation piece that sets up towards the heat source, and this thermoelectric generation piece is used for accepting the heat of heat source radiation and converts the electric energy into, still is equipped with the liquid cooling case that has the heat-dissipating medium simultaneously. The liquid cooling bottom of the case is arranged towards one end of the thermoelectric generation piece, which is far away from the heat source. The maximum temperature of the heat dissipation medium is lower than the temperature of the heat source. In addition, the thermoelectric refrigeration assembly is electrically connected with the thermoelectric power generation sheet and is arranged towards the top of the liquid cooling box.

So when the heat source steady operation, thereby the thermoelectric generation piece is close to heat source one end and can form the higher hot junction of temperature, and the one end that the thermoelectric generation piece deviates from the heat source then can form the lower cold junction of temperature. The thermoelectric generation piece makes whole temperature rise gradually after accepting the heat of heat source radiation, because the bottom of liquid cold box is towards the one end setting that the thermoelectric generation piece deviates from the heat source, and the temperature maximum value of heat-dissipating medium is less than the temperature of heat source, the cold junction temperature that can guarantee the thermoelectric generation piece can be less than the temperature of heat source always, thereby make the hot junction and the cold junction of thermoelectric generation piece ensure to have certain temperature difference value, and then the cold junction of thermoelectric generation piece can continuously absorb the heat to the hot junction, dispel the heat for the heat source, and can also ensure that the thermoelectric generation piece can effectively continuously supply with the electric energy to thermoelectric refrigeration subassembly, thermoelectric refrigeration subassembly is through receiving the electric energy that the thermoelectric generation piece produced, thereby form cold end and hot end. When steam generated after the heat dissipation medium is boiled flows to the top of the liquid cooling box, the refrigerating end is arranged towards the top of the liquid cooling box, so that the steam at the top of the liquid cooling box is quickly liquefied and flows to the bottom of the liquid cooling box again, and heat dissipation circulation is achieved.

Because the temperature maximum value of the cold junction of thermoelectric generation piece is less than the temperature of heat source, consequently make and keep certain difference in temperature between the hot junction of thermoelectric generation piece and the cold junction, and then guarantee radiating efficiency, and the refrigeration end through thermoelectric refrigerating plant simultaneously makes the steam of the heat-dissipating medium of liquid cooling case liquefy, thereby avoid needing to set up great heat radiating area, consequently, the heat radiation structure's of this application heat-sinking capability is stronger, the volume is littleer, the operation is more stable, be applicable to the heat dissipation of high-power consumption heat source.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural view of an embodiment of the heat dissipation structure of the present invention;

fig. 2 is a schematic structural view of another view angle of the heat dissipation structure of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Heat radiation structure	22	Connecting segment
10	Thermoelectric power generation piece	30	Thermoelectric refrigeration assembly
				11	First conductive module	31	N-type semiconductor
12	Second conductive module	32	P-type semiconductor
				13	Heat conducting pad	33	Connection module
20	Liquid cooling box	40	Voltage transformation assembly
				21	Abutting section	200	Heat source

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a heat radiation structure 100.

Referring to fig. 1 and 2, in the embodiment of the present invention, the heat dissipation structure 100 includes a thermoelectric generation sheet 10, a liquid cooling box 20, and a thermoelectric refrigeration assembly 30, the thermoelectric generation sheet 10 is disposed toward a heat source 200, and the thermoelectric generation sheet 10 is configured to receive heat radiated by the heat source 200 and convert the heat into electric energy; the liquid cooling box 20 is loaded with a heat dissipation medium, the bottom of the liquid cooling box 20 is arranged towards one end, away from the heat source 200, of the thermoelectric generation piece 10, and the maximum temperature at the bottom of the liquid cooling box 20 is lower than the temperature of the heat source 200; the thermoelectric refrigeration assembly 30 is electrically connected with the thermoelectric power generation sheet 10, and the thermoelectric refrigeration assembly 30 is arranged towards the top of the liquid cooling box 20, so as to realize heat exchange between the thermoelectric refrigeration assembly 30 and the heat dissipation medium.

The heat source 200 may be a chip or other electronic device with high power consumption, and the heat dissipation medium may be a heat dissipation liquid or a coolant, so that the maximum temperature value reached by the heat dissipation medium is less than the temperature of the heat source 200 during normal operation. The liquid cooling box 20 can be made of copper pipes and other heat dissipation materials, the heat conduction effect of copper is good, the heat dissipation effect is relatively good, and the liquid cooling box 20 can also be made of aluminum, steel and other materials. The thermoelectric cooling module 30 receives the electric power from the thermoelectric cooling fins to generate a cooling end and a heating end, and the cooling end may be disposed toward the top of the liquid cooling tank 20 to realize the heat exchange between the thermoelectric cooling module 30 and the heat dissipation medium. As for the heat dissipation structure 100 as a whole, a part of the heat dissipated from the heat source 200 is transferred to the heating side of the thermoelectric cooling module 30 for output, and the cooling side of the thermoelectric cooling module 30 can help to accelerate the heat cycle.

The utility model discloses heat radiation structure 100's technical scheme is including the thermoelectric generation piece 10 that sets up towards heat source 200, and this thermoelectric generation piece 10 is used for accepting the heat of heat source 200 radiation and converts into the electric energy, still is equipped with the liquid cooling case 20 that has the heat-dissipating medium simultaneously. The bottom of the liquid cooling tank 20 is disposed toward one end of the thermoelectric generation element 10 facing away from the heat source 200. The maximum temperature of the heat dissipating medium is lower than the temperature of the heat source 200. Besides, an electric connection between the thermoelectric refrigeration assembly 30 and the thermoelectric power generation sheet 10 is also provided, and the thermoelectric refrigeration assembly 30 is arranged towards the top of the liquid cooling box 20 to realize the heat exchange between the thermoelectric refrigeration assembly 30 and the heat dissipation medium.

So when heat source 200 steady operation, thereby the thermoelectric generation piece 10 is close to heat source 200 one end and can form the higher hot junction of temperature, and the one end that thermoelectric generation piece 10 deviates from heat source 200 then can form the lower cold junction of temperature. The thermoelectric generation piece 10 makes the bulk temperature rise gradually after accepting the heat of heat source 200 radiation, because the bottom of liquid cooling box 20 sets up towards the one end that thermoelectric generation piece 10 deviates from heat source 200, and the temperature maximum of heat dissipation medium is less than the temperature of heat source 200, can guarantee that the cold junction temperature of thermoelectric generation piece 10 can be less than the temperature of heat source 200 always, thereby make the hot junction and the cold junction of thermoelectric generation piece 10 ensure to have certain temperature difference value, and then the cold junction of thermoelectric generation piece 10 can last to the hot junction absorbed heat, dispel the heat for heat source 200, and can also ensure that thermoelectric generation piece 10 can effectively continuously supply with electric energy to thermoelectric refrigeration subassembly 30, thermoelectric refrigeration subassembly 30 is through receiving the produced electric energy of thermoelectric generation piece 10, thereby form cold junction and hot junction. When the steam that produces after the heat dissipation medium boils is to the top of liquid-cooled tank 20, this refrigeration end sets up towards the top of liquid-cooled tank 20 for the steam at liquid-cooled tank 20 top liquefies rapidly, flows to liquid-cooled tank 20 bottom again, with this realization heat dissipation circulation, optionally refrigeration end can be with liquid-cooled tank 20 butt.

Because the temperature maximum value of the cold junction of thermoelectric generation piece 10 is less than the temperature of heat source 200, consequently make and keep certain difference in temperature between the hot junction of thermoelectric generation piece 10 and the cold junction, and then guarantee radiating efficiency, and the refrigeration end through thermoelectric refrigerating plant simultaneously makes the steam of the coolant of liquid cooling case 20 liquefy, thereby avoid needing to set up great heat radiating area, consequently, heat radiation structure 100's of this application heat-sinking capability is stronger, the volume is littleer, the operation is more stable, be applicable to the heat dissipation of high-power consumption heat source 200.

In an embodiment of the present application, referring to fig. 1 and fig. 2 in combination, the liquid cooling tank 20 includes two abutting sections 21 and two connecting sections 22, the two abutting sections 21 are disposed oppositely, the two connecting sections 22 are connected to the two abutting sections 21 and enclose to form a frame structure, a cavity is formed in the frame structure, a heat dissipating medium flows in the cavity, one abutting section 21 abuts against the thermoelectric generation piece 10, and the other abutting section 21 abuts against the thermoelectric refrigeration component 30. Specifically, these two linkage segments 22 and two butt joint sections 21 can be structure as an organic whole to guarantee liquid cooling box 20 overall structure's support intensity, still saved the installation simultaneously, two linkage segments 22 and two butt joint sections 21 can also be connected through connected modes such as buckle certainly, easy to assemble maintenance. It should be noted that one of the abutting sections 21 is located at the bottom of the liquid cooling box 20, the other abutting section 21 is located at the top of the liquid cooling box 20, and two ends of each connecting section 22 are respectively connected to the two abutting sections 21, so as to form the frame structure. And the heat dissipation medium can pile up in the butt section 21 that is located liquid-cooling case 20 bottom because the effect of gravity down, after the heat dissipation medium boiling, the steam that the boiling produced can be through linkage segment 22 flow direction in the butt section 21 that is located the top, thereby will be located the butt section 21 at top again and carry out the butt with the refrigeration end of thermoelectric cooling assembly 30, so that vapor meets cold reliquefaction and in the butt section 21 that is located liquid-cooling case 20 bottom via linkage segment 22 flow direction, with this formation heat dissipation circulation, this two linkage segments 22 and two butt sections 21 enclose to close and form frame structure simultaneously, thereby make liquid-cooling case 20 and external area of contact increase through frame structure, and then the heat dissipation medium that liquid-cooling case 20 holds the intracavity more is dispelled the heat with the external world, thereby can cool down the heat dissipation medium effectively.

Further, the cross-sectional area of the connecting section 22 is smaller than the cross-sectional area of the abutting section 21 in the extending direction of the liquid cooling tank 20. Wherein, in the extending direction of liquid cooling box 20, can specifically follow on being the direction of height of liquid cooling box 20, through being less than the cross-sectional area of butt section 21 with the cross-sectional area of this linkage segment 22, thereby ensure two butt sections 21 respectively with the area of contact between thermoelectric generation piece 10 and the thermoelectric refrigeration subassembly 30, and then guarantee its conduction efficiency, simultaneously because linkage segment 22 mainly used communicates two butt sections 21 with the vapor through reliquefaction, consequently in order to accelerate the speed of the radiating medium backward flow of reliquefaction, the cross-sectional area of this linkage segment 22 can be reduced, in order to accelerate the velocity of flow of radiating medium backward flow.

In an embodiment of the present application, the heat dissipation medium is a water-cooling liquid. The specific heat capacity of the water-cooling liquid is large, the water-cooling liquid with the same mass can take away more heat than other liquids, the temperature rise of the absorbed heat is lower than that of other liquids, and therefore more heat of the heat source 200 can be taken away, meanwhile, the price of the water-cooling liquid is low, the heat dissipation medium can be the water-cooling liquid, certainly, the heat dissipation medium can also be ethanol and the like, and the selection can be specifically carried out according to the technical personnel in the field, and the description is omitted.

Optionally, the boiling temperature of the heat dissipation medium is lower than the temperature of the heat source 200. In order to ensure that the maximum temperature value of the heat-dissipating medium is lower than the temperature of the heat source 200, when the heat-dissipating medium is heat-dissipating liquid and the heat source 200 is a chip, the temperature of the boiling point of the heat-dissipating liquid can be selected to be lower than the temperature of the chip during operation, so that the temperature does not rise when the temperature of the heat-dissipating liquid reaches the boiling point, and the temperature is converted into steam to rise to the top of the liquid cooling box 20, so that the maximum temperature value of the heat-dissipating medium is lower than the temperature of the heat source, and thus the end, arranged towards the thermoelectric generation piece 10, of the bottom of the liquid cooling box 20 can continuously absorb heat to the thermoelectric generation piece 10, so that the cold end of the thermoelectric generation piece 10 can continuously absorb heat to the hot end to dissipate heat.

In an embodiment of the present application, referring to fig. 1 and 2 in combination, the thermoelectric generation element 10 includes a first conductive module 11 and a second conductive module 12, one surfaces of the first conductive module 11 and the second conductive module 12 are connected to each other, the first conductive module 11 is disposed toward the heat source 200, the second conductive module 12 is disposed toward the liquid cooling tank 20, and both electrode terminals of the thermoelectric refrigeration assembly 30 are connected to the first conductive module 11 and the second conductive module 12, respectively.

Specifically, in the embodiment, the first conductive module 11 and the second conductive module 12 may be selected from different metal conductors or different semiconductors, such as iron and copper, the different metal conductors have different free electron densities or carrier densities, and when the two different metal conductors are in contact with each other, electrons on the contact surface are diffused from a high concentration to a low concentration. And the diffusion rate of electron is directly proportional with the temperature of contact zone, and can set up first conductive module 11 and set up towards heat source 200 and with heat source 200 butt, second conductive module 12 sets up and with liquid cooling case 20 bottom butt dorsad heat source 200, thereby the temperature of first conductive module 11 can be higher than the temperature of second conductive module 12, and two conductive modules if there is the difference in temperature always, just can make the electron continuously diffuse, just can form stable voltage at two other endpoints of two metal conductor, thereby make thermoelectric generation piece 10 can continuously supply power for thermoelectric refrigeration subassembly 30, and then guarantee thermoelectric refrigeration subassembly 30 sustainable refrigeration, can constantly flow back with the steam of guaranteeing liquid cooling case 20, so thermal cycle accelerates, guarantee that heat radiation structure 100's heat dissipation is more reliable and more stable.

Further, the first conductive module 11 and the second conductive module 12 are both made of semiconductors, and the semiconductor materials used for the first conductive module 11 and the second conductive module 12 are different. Specifically, in order to enable the thermoelectric power generation element to function correspondingly when the difference between the temperature differences is small, the first conductive module 11 and the second conductive module 12 may be made of different semiconductor materials, such as silicon and germanium, or boron and phosphorus, so that the thermoelectric power generation sheet 10 may generate voltage even when the temperature difference is 10 ℃, thereby effectively supplying power to the thermoelectric refrigeration assembly 30 and promoting the heat dissipation cycle.

Optionally, the thermoelectric generation sheet 10 further includes two thermal pads 13, one thermal pad 13 is attached to the surface of the first conductive module 11 away from the second conductive module 12, the first conductive module 11 is abutted to the heat source 200 through one thermal pad 13, the other thermal pad 13 is attached to the surface of the second conductive module 12 away from the first conductive module 11, and the second conductive module 12 is abutted to the bottom of the liquid cooling tank 20 through the other thermal pad 13. Specifically, through setting up two heat conduction pads 13 and being located thermoelectric generation piece 10's first conductive module 11 and the 12 departments of second conductive module respectively to can guarantee when making thermoelectric generation piece 10 and heat source 200 and liquid cooling case 20 butt heat dissipation that the heat dissipation is even, and then not only can guarantee thermoelectric generation piece 10 to the radiating efficiency of heat source 200, still guarantee thermal conduction efficiency between thermoelectric generation piece 10 and the liquid cooling case 20 simultaneously. The thermal pad 13 may be fixed to the first conductive module 11 and the second conductive module 12 by adhesion or the like, and the specific connection manner may be selected by those skilled in the art and will not be described herein.

In an embodiment of the present application, referring to fig. 1 and fig. 2 in combination, the thermoelectric cooling module 30 includes an N-type semiconductor 31, a P-type semiconductor 32, and a connection module 33, the connection module 33 is electrically connected to the N-type semiconductor 31 and the P-type semiconductor 32, and the N-type semiconductor 31 and the P-type semiconductor 32 are disposed on the same side of the connection module 33; the connecting module 33 is used for receiving the electric energy generated by the thermoelectric generation sheet 10 and transmitting the electric energy to the N-type semiconductor 31 and the P-type semiconductor 32, so that one ends of the N-type semiconductor 31 and the P-type semiconductor 32 departing from the connecting module 33 form a refrigerating end, and the refrigerating end is abutted against the top of the liquid cooling box 20. The N-type semiconductor 31 is also referred to as an electronic semiconductor. The N-type semiconductor 31 is an impurity semiconductor having a free electron concentration much greater than a hole concentration. The P-type semiconductor 32 is also referred to as a hole-type semiconductor. The P-type semiconductor 32 is an impurity semiconductor having a hole concentration much greater than a free electron concentration. Specifically, the thermoelectric refrigerating device utilizes the principle of the peltier effect, which means that when current passes through a loop composed of different conductors, the peltier effect generates irreversible joule heat and heat absorption and release phenomena occur at joints of the different conductors along with different current directions. Therefore, the thermoelectric refrigeration assembly 30 is formed by combining the N-type semiconductor 31, the P-type semiconductor 32 and the connection module 33, when the thermoelectric power generation outputs stable current to supply to the thermoelectric refrigeration device, the thermoelectric refrigeration assembly 30 forms a refrigeration end and a heating end, and the steam at the top of the liquid cooling tank 20 can be liquefied through the refrigeration end, so that the heat dissipation cycle is realized. And to make the conduction more efficient, the refrigeration end may be abutted against the top of the liquid-cooled tank. Meanwhile, the whole heat dissipation structure 100 is more efficient through the thermoelectric refrigeration assembly 30, the heat dissipation capacity is enhanced, so that the area of the top of the liquid cooling box 20 for liquefied steam does not need to be increased, and the volume of the liquid cooling box 20 can be reduced, so that the volume of the heat dissipation structure 100 is reduced.

Further, the heat dissipation structure 100 further includes a transformer assembly 40, and the transformer assembly 40 is connected between the thermoelectric generation piece 10 and the thermoelectric cooling assembly 30, so as to convert the electric energy generated by the thermoelectric generation piece 10 and transmit the electric energy to the thermoelectric cooling assembly 30. In order to ensure that the electric energy generated by the thermoelectric generation element 10 can be stably supplied to the thermoelectric cooling module 30, and the voltage transformation module 40 is respectively connected to the thermoelectric generation element 10 and the thermoelectric cooling module 30, so as to stabilize the current transmitted to the thermoelectric cooling module 30, it should be noted that the voltage transformation module 40 is a stationary electrical device for transforming ac voltage and current to transmit ac electric energy. The electromagnetic induction type transformer realizes electric energy transmission according to the principle of electromagnetic induction, can be divided into an electric energy transformer, a test transformer, an instrument transformer and a transformer with special purposes according to the purposes, can be selected according to the technical personnel in the field, and is not described herein.

The utility model discloses still provide a radiator, this radiator includes heat radiation structure 100, and this heat radiation structure 100's concrete structure refers to above-mentioned embodiment, because this radiator has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A heat dissipation structure, comprising:

the thermoelectric refrigeration assembly is electrically connected with the thermoelectric generation piece and faces the top of the liquid cooling box, so that heat exchange between the thermoelectric refrigeration assembly and the heat dissipation medium is realized.

2. The heat dissipation structure of claim 1, wherein the liquid cooling tank includes two abutting sections and two connecting sections, the two abutting sections are disposed opposite to each other, the two connecting sections are connected to the two abutting sections and enclose to form a frame structure, a cavity is formed in the frame structure, the heat dissipation medium is located in the cavity, one abutting section abuts against the thermoelectric generation sheet, and the other abutting section abuts against the thermoelectric refrigeration assembly.

3. The heat dissipation structure according to claim 2, wherein a cross-sectional area of the connection section is smaller than a cross-sectional area of the abutment section in an extension direction of the liquid-cooled tank.

4. The heat dissipating structure of claim 1, wherein the heat dissipating medium is a water-cooled liquid;

5. The heat dissipation structure according to any one of claims 1 to 4, wherein the thermoelectric generation element includes a first conductive module and a second conductive module, one surfaces of the first conductive module and the second conductive module are connected to each other, the first conductive module is disposed toward the heat source, the second conductive module is disposed toward the liquid cooling tank, and both electrode terminals of the thermoelectric refrigeration module are connected to the first conductive module and the second conductive module, respectively.

6. The heat dissipation structure of claim 5, wherein the first conductive module and the second conductive module are both semiconductors, and the semiconductor materials used for the first conductive module and the second conductive module are different.

7. The heat dissipating structure of claim 5, wherein the thermoelectric generation element further comprises two thermal pads, one of the thermal pads is attached to a surface of the first conductive module facing away from the second conductive module, the first conductive module is attached to the heat source through one of the thermal pads, the other of the thermal pads is attached to a surface of the second conductive module facing away from the first conductive module, and the second conductive module is attached to a bottom of the liquid cooling tank through the other of the thermal pads.

8. The heat dissipation structure of any one of claims 1 to 4, wherein the thermoelectric cooling module comprises an N-type semiconductor, a P-type semiconductor, and a connection module, the connection module is electrically connected to the N-type semiconductor and the P-type semiconductor, and the N-type semiconductor and the P-type semiconductor are disposed on the same side of the connection module;

9. The heat dissipating structure of claim 8, further comprising a transformer assembly connected between the thermoelectric generation sheet and the thermoelectric cooling assembly for transforming the electric energy generated by the thermoelectric generation sheet and transmitting the transformed electric energy to the thermoelectric cooling assembly.

10. A heat sink comprising the heat dissipation structure as recited in any one of claims 1 to 9.