CN211497764U - Evaporation test substrate and evaporation test device - Google Patents
Evaporation test substrate and evaporation test device Download PDFInfo
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- CN211497764U CN211497764U CN202020219594.6U CN202020219594U CN211497764U CN 211497764 U CN211497764 U CN 211497764U CN 202020219594 U CN202020219594 U CN 202020219594U CN 211497764 U CN211497764 U CN 211497764U
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Abstract
The utility model discloses an evaporation test substrate, include: a substrate body; a plurality of evaporation units arranged on the substrate body; the evaporation units are provided with metal wires, and the metal wires between the adjacent evaporation units are electrically connected with each other. The utility model discloses can eliminate produced static between metal mask plate and the base plate body, prevent to cause fracture, the damage to metal mask plate when lifting up the base plate body after the coating by vaporization is accomplished, improve the protectiveness to metal mask plate, save certain manufacturing cost.
Description
Technical Field
The utility model relates to a show technical field. And more particularly, to an evaporation test substrate and an evaporation test apparatus.
Background
An OLED (Organic Light-Emitting Diode) is a display device which is widely used, and uses the recombination of electrons and holes to form excitons to generate Light emission, and different Light-Emitting brightness can be obtained by adjusting the magnitude of driving current. This light emission method includes: the structure is simple, self-luminous, no backlight source is needed, and the display device is light and thin; the response time is short and the speed is high; has a wide viewing angle range close to 180 degrees; low power consumption, high contrast, good temperature adaptability and the like.
At present, the main preparation method of the OLED device is a vacuum thermal evaporation method, the complexity of the preparation process of the vacuum thermal evaporation method is moderate, the service life of the prepared OLED device is long, and the prepared OLED device is widely applied, in order to ensure that the evaporation position is accurate, and the film thickness is beneficial to monitoring, therefore, blank glass can be used as an evaporation test substrate to carry out alignment and film thickness measurement before evaporation, but because corresponding electrostatic force can be generated between the blank glass and a metal mask plate in the process of carrying out the evaporation test in advance, the metal mask plate is seriously damaged when the blank glass is lifted after the evaporation is finished, and the corresponding cost is improved.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem that proposes among the background art, the utility model discloses the first aspect provides an evaporation plating test substrate, include:
a substrate body;
a plurality of evaporation units arranged on the substrate body;
the evaporation units are provided with metal wires, and the metal wires between the adjacent evaporation units are electrically connected with each other.
Optionally, a plurality of pins are disposed at an edge of the substrate body, and the metal traces of the evaporation unit located at the edge of the substrate body are electrically connected to the pins.
Optionally, the metal traces of the plurality of evaporation units located at the edge of the substrate body are electrically connected to each other through a connection line, and the connection line is electrically connected to the pin.
Optionally, the metal traces include first traces and second traces that are criss-cross with each other, where the first traces between adjacent evaporation units are electrically connected to each other, and the second traces between adjacent evaporation units are electrically connected to each other.
Optionally, a plurality of pins are disposed at an edge of the substrate body, first traces of the plurality of evaporation units at the edge of the substrate body are electrically connected to each other through a first connection line, and the first connection line is electrically connected to the pins
And
second wires of the evaporation units positioned at the edge of the substrate body are electrically connected with each other through second connecting wires, and the second connecting wires are electrically connected with the pins.
Optionally, a film thickness test area corresponding to the extending direction of the metal wire is further disposed on the evaporation unit, the film thickness test area includes a plurality of test units distributed at intervals, and the metal wires between adjacent evaporation units are electrically connected to each other through the intervals between the adjacent test units.
Optionally, the substrate body is further provided with an alignment unit.
The utility model discloses the second aspect provides an evaporation test device, include the utility model discloses the evaporation test base plate that the first aspect provided.
The utility model has the advantages as follows:
the utility model discloses an in the concrete implementation, because the metal on every coating by vaporization unit is walked the line and is all walked the line electricity with the metal on the adjacent coating by vaporization unit and be connected, therefore, at the in-process of coating by vaporization test in advance, produced static can walk the line through the metal of being connected each other electricity on every coating by vaporization unit between metal mask plate and the base plate body and carry out corresponding transmission, thereby eliminate produced static between metal mask plate and the base plate body, prevent to make the fracture to metal mask plate, damage when lifting up the base plate body after the coating by vaporization is accomplished, the protectiveness to metal mask plate has been improved, save certain manufacturing cost.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 shows a schematic structural diagram of an evaporation test substrate according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of an evaporation test substrate in a preferred implementation manner in this embodiment;
fig. 3 is a schematic structural diagram of an evaporation test substrate in a preferred implementation manner in this embodiment;
fig. 4 is a schematic structural view of the evaporation unit in this embodiment.
In the figure: 100. a substrate body; 200. an evaporation unit; 210. metal routing; 211. a first wire; 212. a second routing; 220. a connecting wire; 221. a first connecting line; 222. a second connecting line; 300. a pin; 400. a test unit; 500. and a contraposition unit.
Detailed Description
In order to make the technical solutions and advantages of the present invention clearer, the following will describe the embodiments of the present invention in further detail with reference to the accompanying drawings.
An embodiment of the present invention provides an evaporation test substrate, as shown in fig. 1, the substrate includes a substrate body 100 and a plurality of evaporation units 200 disposed on the substrate body 100.
Specifically, in the example of fig. 1, the substrate body 100 may be a glass substrate, a plurality of evaporation units 200 are disposed on the substrate body 100, when performing a pre-evaporation test, the plurality of evaporation units 200 are equivalent to a plurality of pixel units in a display panel to be evaporated, because during the pre-evaporation test, a corresponding electrostatic force is generated between a metal mask and the substrate body 100, so that the metal mask and the substrate body are attached to each other, and when the substrate body 100 is lifted up after the evaporation is completed, the metal mask is seriously damaged, therefore, in order to solve this problem, in this embodiment, each evaporation unit 200 on the substrate body 100 is disposed with a metal trace 210, where the metal traces 210 between adjacent evaporation units 200 are electrically connected to each other.
It should be understood that the metal traces 210 in this embodiment are all electrically conductive, that is, in the specific implementation of this embodiment, because the metal traces 210 on each evaporation unit 200 are electrically connected to the metal traces 210 on the adjacent evaporation units 200, in the process of the pre-evaporation test, static electricity generated between the metal mask plate and the substrate body 100 can be correspondingly transmitted through the metal traces 210 that are electrically connected to each other on each evaporation unit 200, so as to achieve the effect of eliminating static electricity, prevent the metal mask plate from being broken and damaged when the substrate body 100 is lifted up after the evaporation is completed, improve the protection performance on the metal mask plate, and save certain production cost.
In a preferred embodiment of this embodiment, a plurality of pins 300 are disposed at an edge of the substrate body 100, and the metal traces 210 of the evaporation unit 200 located at the edge of the substrate body 100 are electrically connected to the pins 300.
Specifically, as shown in fig. 2, the edge of the substrate body 100 is provided with a plurality of pins 300, and the metal traces 210 on the plurality of evaporation units 200 located at the edge of the substrate body 100 are electrically connected to the plurality of pins 300, so that in the process of the preliminary evaporation test, static electricity generated between the metal mask plate and the substrate body 100 can be sequentially transmitted to the corresponding pins 300 through the metal traces 210 electrically connected to each other to perform ground discharge, thereby improving the effect of eliminating static electricity, and further improving the protection performance of the metal mask plate.
In order to further save a certain production cost, in an optional implementation manner of this embodiment, as shown in fig. 3, the metal traces 210 of the plurality of evaporation units 200 located at the edge of the substrate body 100 are electrically connected to each other through connection lines 220, and the connection lines 220 are electrically connected to the pins 300.
That is to say, in the example of fig. 3, the metal traces 210 are electrically connected through the connecting line 220, and the connecting line 220 is electrically connected to the pins 300, so that the metal traces 210 can be electrically connected through one connecting line 220, in this way, static electricity generated between the metal mask plate and the substrate body 100 can be transmitted to the connecting line 220 through the metal traces 210, and the connecting line 220 is transmitted to the pins 300 to perform ground discharge, so as to save the number of the pins 300, and reduce the production cost and the production difficulty.
In a specific implementation of the present embodiment, the metal traces 210 include first traces 211 and second traces 212 that are criss-cross with each other, wherein the first traces 211 between adjacent evaporation units 200 are electrically connected to each other, and the second traces 212 between adjacent evaporation units 200 are electrically connected to each other.
Specifically, the metal trace 210 is set as the first trace 211 and the second trace 212 which are criss-cross with each other, so that the static electricity eliminating effect can be improved, and static electricity generated between the metal mask plate and the substrate body 100 can be transmitted to the first trace 211 and the second trace 212 on the adjacent evaporation unit 200 through the first trace 211 and the second trace 212 on the evaporation unit 200, respectively, so as to achieve the purpose of eliminating the static electricity.
Further, a plurality of pins 300 are disposed at an edge of the substrate body 100, the first wires 211 of the plurality of evaporation units 200 at the edge of the substrate body 100 are electrically connected to each other through first connection lines 221, and the first connection lines 221 are electrically connected to the pins 300
And
the second traces 212 of the plurality of evaporation units 200 at the edge of the substrate body 100 are electrically connected to each other by a second connection line 222, and the second connection line 222 is electrically connected to the pin 300.
That is, in the example of fig. 3, the plurality of first traces 211 are electrically connected by the first connection lines 221, the first connecting line 221 is electrically connected to the pin 300, so that the plurality of first traces 211 are connected through one first connecting line 221, and similarly, the plurality of second traces 212 are electrically connected through the second connecting line 222, the second connection lines 222 are electrically connected to the pins 300, so that a plurality of second traces 212 are connected through one second connection line 222, in this way, the static electricity generated between the metal mask and the substrate body 100 is transmitted to the first connection line 221 and the second connection line 222 through the first lines 211 and the second lines 212, respectively, the first connection line 221 and the second connection line 222 are transmitted to the pin 300 for ground discharge, therefore, the number of the pins 300 can be saved, and the production cost and the production difficulty are reduced.
It should be noted that the number and the setting position of the pins 300 in this embodiment may be set according to actual needs, which is not specifically limited in this embodiment, and in some implementations, multiple setting situations may be included, for example: in an evaporation test substrate, there are only a plurality of first traces 211 connected to the first connecting lines 221, or in an evaporation test substrate, there are only a plurality of second traces 212 connected to the second connecting lines 222, or in an evaporation test substrate, there may be a plurality of first traces 211 connected to the first connecting lines 221, and a plurality of second traces 212 connected to the second connecting lines 222, which all fall within the protection scope of the present embodiment.
In the example shown in fig. 4, the number of the first traces 211 on the evaporation unit 200 is three, the three first traces 211 extend in the horizontal direction, the number of the second traces 212 on the evaporation unit 200 is five, and the five second traces 212 extend in the vertical direction.
It should be noted that, in this embodiment, the number of the first traces 211 and the second traces 212 is not limited to the above example, and this embodiment does not specifically limit this.
In some optional implementation manners of this embodiment, a film thickness test area corresponding to the extending direction of the metal trace 210 is further disposed on the evaporation unit 200, the film thickness test area includes a plurality of test units 400 distributed at intervals, and the metal traces 210 between adjacent evaporation units 200 pass through the intervals between the adjacent test units 400 to be electrically connected to each other.
Specifically, as shown in fig. 4, the film thickness testing area on the evaporation unit 200 includes a plurality of testing units 400, where the testing units 400 are mainly used to perform a corresponding test on the thickness of the evaporated film layer in the process of performing a pre-evaporation test to obtain the thickness of the evaporated film layer, and since it is the prior art to use the testing units 400 to test the thickness of the evaporated film layer, this embodiment does not need to describe this, it should be noted that the specific position of the film thickness testing area in this embodiment is not limited to the two sides of the extending direction of the first trace 211 shown in fig. 4, in some implementation manners, the film thickness testing area may also be located in the extending direction of the second trace 212 or in the extending direction of the first trace 211 and the second trace 212 simultaneously, and the number of the testing units 400 included in the film thickness testing area may also be set according to actual needs, this embodiment is not particularly limited thereto.
In some optional implementations of the present embodiment, the substrate body 100 is further provided with an alignment unit 500.
Specifically, as shown in fig. 4, the alignment unit 500 on the evaporation unit 200 is located at the edge of the evaporation unit 200, and the alignment unit 500 is mainly used for aligning with a metal mask plate in a preliminary evaporation test on an evaporation test substrate, where the alignment unit 500 may be an alignment mark or other device or device for alignment, and it should be noted that the number and the installation position of the alignment units 500 in this embodiment are not limited to those shown in fig. 4, and this embodiment is not limited to this.
Another embodiment of the utility model provides an evaporation coating test device, including foretell evaporation coating test base plate.
Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it is obvious for those skilled in the art to make other variations or changes based on the above descriptions, and all the embodiments cannot be exhausted here, and all the obvious variations or changes that belong to the technical solutions of the present invention are still in the protection scope of the present invention.
Claims (9)
1. An evaporation test substrate, comprising:
a substrate body;
a plurality of evaporation units arranged on the substrate body;
the evaporation units are provided with metal wires, and the metal wires between the adjacent evaporation units are electrically connected with each other.
2. The evaporation test substrate according to claim 1, wherein a plurality of pins are disposed at an edge of the substrate body, and the metal traces of the evaporation unit at the edge of the substrate body are electrically connected to the pins.
3. The evaporation test substrate according to claim 2, wherein the metal traces of the plurality of evaporation units at the edge of the substrate body are electrically connected to each other by connection lines, the connection lines being electrically connected to the pins.
4. The evaporation test substrate according to claim 1, wherein the metal traces comprise first traces and second traces that are criss-cross with each other, wherein the first traces between adjacent evaporation units are electrically connected to each other, and the second traces between adjacent evaporation units are electrically connected to each other.
5. The evaporation test substrate according to claim 4, wherein a plurality of pins are disposed at an edge of the substrate body, first traces of the plurality of evaporation units at the edge of the substrate body are electrically connected to each other through first connection lines, and the first connection lines are electrically connected to the pins
And
second wires of the evaporation units positioned at the edge of the substrate body are electrically connected with each other through second connecting wires, and the second connecting wires are electrically connected with the pins.
6. The evaporation test substrate according to claim 4 or 5, wherein the number of the first traces on the evaporation unit is three, the three first traces extend in the horizontal direction, the number of the second traces on the evaporation unit is five, and the five second traces extend in the vertical direction.
7. The evaporation test substrate according to claim 1, wherein the evaporation units are further provided with film thickness test regions corresponding to the extending direction of the metal traces, each film thickness test region comprises a plurality of test units distributed at intervals, and the metal traces between adjacent evaporation units are electrically connected to each other through the intervals between the adjacent test units.
8. The evaporation test substrate according to claim 1, wherein the substrate body is further provided with an alignment unit.
9. An evaporation test apparatus comprising the evaporation test substrate according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020219594.6U CN211497764U (en) | 2020-02-27 | 2020-02-27 | Evaporation test substrate and evaporation test device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020219594.6U CN211497764U (en) | 2020-02-27 | 2020-02-27 | Evaporation test substrate and evaporation test device |
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| CN211497764U true CN211497764U (en) | 2020-09-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115513083A (en) * | 2022-09-29 | 2022-12-23 | 惠科股份有限公司 | Test bearing substrate and film thickness monitoring device |
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2020
- 2020-02-27 CN CN202020219594.6U patent/CN211497764U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115513083A (en) * | 2022-09-29 | 2022-12-23 | 惠科股份有限公司 | Test bearing substrate and film thickness monitoring device |
| CN115513083B (en) * | 2022-09-29 | 2023-08-25 | 惠科股份有限公司 | Test bearing substrate and film thickness monitoring device |
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