CN211373895U - Induction device and robot - Google Patents

Abstract

The utility model relates to the technical field of sensors, and discloses an induction device and a robot. The sensing device includes: a substrate, a sensing layer and an elastic layer. The induction layer is arranged on the substrate, and the induction layer includes a plurality of induction element groups, and each induction element group respectively includes two induction elements arranged symmetrically; the elastic layer is arranged on the two induction elements of the induction element group to receive shearing on the elastic layer When a force acts or is pressed against an uneven surface, the elastic layer corresponding to the two sensing elements deforms differently, so that the two sensing elements in the sensing element group undergo different deformations, thereby generating different electrical signals. In the above manner, the present invention can enrich the functions of the sensing device.

Description

Induction devices and robots

technical field

The utility model relates to the technical field of sensors, in particular to an induction device and a robot.

Background technique

At present, the sensor for detecting pressure has a relatively single function and does not have the function of detecting other forces, such as shearing force.

Utility model content

In view of this, the main technical problem to be solved by the present invention is to provide an induction device and a robot, which can enrich the functions of the induction device.

In order to solve the above technical problems, a technical solution adopted by the present invention is to provide an induction device. The sensing device includes: a substrate, a sensing layer and an elastic layer. The induction layer is arranged on the substrate, and the induction layer includes several induction element groups, each induction element group respectively includes two symmetrically arranged induction elements; the elastic layer is arranged on the two induction elements of the induction element group to receive shearing on the elastic layer When a force acts or is pressed against an uneven surface, the parts of the elastic layer corresponding to the two sensing elements undergo different deformations, so that the two sensing elements in the sensing element group undergo different deformations, thereby generating different electrical signals.

In an embodiment of the present invention, the elastic layer includes elastic blocks, the two sensing elements of the sensing element group are respectively provided with different elastic blocks, and the elastic blocks on the two sensing elements of the sensing element group are symmetrically arranged to When the elastic blocks on the two sensing elements of the sensing element group are pressed against the uneven surface, the elastic blocks on the two sensing elements of the sensing element group are deformed differently, so that the two sensing elements of the sensing element group are different deformation, thereby generating different electrical signals.

In an embodiment of the present invention, the elastic layer includes elastic blocks, and an elastic block is correspondingly disposed on two sensing elements of a sensing element group, so that the elastic blocks on the two sensing elements of the sensing element group receive shearing When the force acts or receives the pressure of the uneven surface, the elastic blocks on the two sensing elements of the sensing element group corresponding to the two sensing elements will deform differently, so that the two sensing elements of the sensing element group will have different deformations. , and then generate different electrical signals.

In an embodiment of the present invention, the orthographic projection of the surface of the elastic block facing the sensing element on the substrate covers the orthographic projection of the sensing element on the substrate.

In an embodiment of the present invention, the sensing element includes alternately stacked one-dimensional material layers and two-dimensional material layers.

In an embodiment of the present invention, the induction device further includes a plurality of electrodes and a plurality of electrode leads extending on the substrate, the plurality of electrodes are arranged on the outer periphery of the induction layer, one electrode is connected to an electrode lead, and each two electrode leads are respectively connected to an inductive element.

In an embodiment of the present invention, the sensing device includes multiple sets of sensing element groups, the multiple sets of sensing element groups are sequentially arranged on the substrate along a circumferential direction, and the two sensing elements in each sensing element group are corresponding in the circumferential direction. The center of the circle is set symmetrically to the center.

In an embodiment of the present invention, the sensing element extends along the surface of the substrate from the first end to the second end in a serpentine shape, the first end and the second end are respectively connected to an electrode lead, and the sensing element is away from the center of the circle. The arc width of the part is larger than the arc width of the end near the center of the circle, forming a fan-shaped structure.

In an embodiment of the present invention, the sensing element covers a part of the two correspondingly connected electrode leads, and the part of the two electrode leads covered by the sensing element constitutes an interdigital electrode structure.

In an embodiment of the present invention, the sensing device further includes an encapsulation layer, the encapsulation layer covers the sensing element and the electrode leads connected to the sensing element are at least close to the sensing element, and the elastic layer is disposed on the side of the encapsulation layer away from the sensing layer .

In an embodiment of the present invention, the substrate is a flexible body.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a robot. The robot includes the sensing device as set forth in the above embodiments.

The beneficial effects of the utility model are: different from the prior art, the utility model provides an induction device and a robot. In the sensing device, the elastic layers arranged on the two sensing elements of the sensing element group are subjected to shear force or pressure from an uneven surface, and the elastic layer corresponding to the two sensing elements undergoes different deformations. The two sensing elements in the sensing element group undergo different deformations, thereby generating different electrical signals, that is, the sensing device of the present invention can be used to detect the shear force and the flatness of the surface of the object. In addition, the pressure can also be detected by the deformation generated by the elastic layer and the sensing element of the present invention receiving the pressing force. That is to say, the sensing device provided by the present invention not only has the function of detecting pressure, but also has the function of detecting the shear force and the flatness of the surface of the object, so that the functions of the sensing device can be enriched.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description serve to explain the principles of the invention. Furthermore, these drawings and written descriptions are not intended to limit the scope of the inventive concept in any way, but to illustrate the inventive concept to those skilled in the art by referring to specific embodiments.

1 is a schematic structural diagram of an embodiment of the sensing device of the present invention;

Fig. 2 is the top-view structure schematic diagram of the induction device shown in Fig. 1;

3 is a schematic cross-sectional structure diagram of the induction device shown in FIG. 1;

4 is a schematic cross-sectional structure diagram of the sensing device shown in FIG. 1 in a state of detecting pressure;

Fig. 5 is the sectional structure schematic diagram of the induction device shown in Fig. 1 in the state of detecting shear force;

6 is a schematic cross-sectional structure diagram of the sensing device shown in FIG. 1 in a state of detecting the surface flatness of an object;

7 is a schematic structural diagram of another embodiment of the induction device of the present invention;

8 is a schematic cross-sectional structure diagram of the sensing device shown in FIG. 7;

FIG. 9 is a schematic cross-sectional structure diagram of the sensing device shown in FIG. 7 in a state of detecting pressure;

10 is a schematic cross-sectional structure diagram of the sensing device shown in FIG. 7 in a state of detecting the surface flatness of an object;

11 is a schematic structural diagram of an embodiment of the sensing element of the present invention;

12 is a schematic flowchart of an embodiment of a method for preparing an induction device of the present invention;

13 is a schematic structural diagram of each step in the preparation method of the induction device shown in FIG. 12;

FIG. 14 is a schematic structural diagram of an embodiment of the robot of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be described clearly and completely below in conjunction with the embodiments of the present utility model. Some embodiments of the utility model, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention. The embodiments described below and features in the embodiments may be combined with each other without conflict.

In order to solve the technical problem of single sensor function in the prior art, an embodiment of the present invention provides a sensing device. The sensing device includes: a substrate, a sensing layer and an elastic layer. The induction layer is arranged on the substrate, and the induction layer includes several induction element groups, each induction element group respectively includes two symmetrically arranged induction elements; the elastic layer is arranged on the two induction elements of the induction element group to receive shearing on the elastic layer When a force acts or is pressed against an uneven surface, the parts of the elastic layer corresponding to the two sensing elements undergo different deformations, so that the two sensing elements in the sensing element group undergo different deformations, thereby generating different electrical signals. Details are described below.

Please refer to FIGS. 1-2 , FIG. 1 is a schematic structural diagram of an embodiment of the sensing device of the present invention, and FIG. 2 is a top-view structural schematic diagram of the sensing device shown in FIG. 1 . Wherein, Fig. 2 omits the encapsulation layer 5 and the elastic layer 3.

In one embodiment, the sensing device includes a substrate 1 , a sensing layer 2 and an elastic layer 3 . The sensing layer 2 is disposed on the substrate 1, and the sensing layer 2 includes a plurality of sensing element groups 21, and each sensing element group 21 includes two symmetrically arranged sensing elements 211 respectively. The elastic layer 3 is disposed on the two sensing elements 211 of the sensing element group 21 .

Optionally, the substrate 1 may be a flexible body, or a thin film made of a flexible material, so that the substrate 1 has good mechanical strength and can be allowed to bend, and the substrate 1 can match the surface topography of the installation position of the sensing device , so as to be easily attached to the installation position of the induction device, thereby facilitating the installation of the induction device. Of course, the sensing device is preferably installed on a flat surface to ensure detection accuracy. Preferably, the flexible material used for the substrate 1 may be PI (polyimide) or the like, and its thickness is preferably less than 100 μm.

The inductive element 211 may be a piezoresistive element, etc. The deformation of the inductive element 211 will cause the resistance at the deformation of the inductive element 211 to change, and the amount of change in the resistance at the deformation of the inductive element 211 is related to the degree of deformation at the deformation of the inductive element 211 , which can reflect the magnitude of the pressure on the sensing element 211 .

Different types and forms of applied forces can be detected using the piezoresistive principle of the sensing element 211 described above. The surfaces of the sensing elements 211 are generally designed to be flush with each other, and the entire sensing layer 2 is a force-bearing surface. details as follows:

When the sensing device is used to detect the pressure, the elastic layer 3 is subjected to the pressure, and the elastic layer 3 is deformed, so that the two sensing elements 211 of the sensing element group 21 corresponding to the elastic layer 3 are deformed by the same amount, and then the pressure is detected. the size of.

When the sensing device is used to detect the shearing force, the elastic layer 3 is subjected to the shearing force, and the parts of the elastic layer 3 corresponding to the two sensing elements 211 of the sensing element group 21 undergo different deformations, so that the two sensing elements in the sensing element group 21 are deformed differently. Different deformations of the sensing elements 211 generate different electrical signals, that is, the two sensing elements 211 of the sensing element group 21 generate different electrical signals respectively, thereby detecting the magnitude of the shearing force.

When the sensing device is used to detect the flatness of the surface of the object, the elastic layer 3 is pressed against the surface of the object to be detected. Different deformations occur in part, so that the two sensing elements 211 in the sensing element group 21 undergo different deformations, thereby generating different electrical signals, that is, the two sensing elements 211 in the sensing element group 21 respectively generate different electrical signals, and then detect It can detect the unevenness of the surface of the object to be detected, and at the same time can reflect the degree of unevenness of the surface of the object to be detected.

As can be seen from the above, the sensing device provided by the present invention not only has the function of detecting pressure, but also has the function of detecting shearing force and the flatness of the surface of the object, so that the functions of the sensing device can be enriched. The sensing device provided by the utility model can be applied to the tactile system of the robot to provide force feedback for the robot arm to accurately grasp the object; it can also be attached to the human skin to monitor joints and muscle activity characteristics of various parts of the human body.

Please refer to FIGS. 1 and 3 . FIG. 3 is a schematic cross-sectional structure diagram of the sensing device shown in FIG. 1 .

In one embodiment, the elastic layer 3 includes elastic blocks 31 . An elastic block 31 is correspondingly arranged on the two sensing elements 211 of a set of sensing element groups 21, so that the elastic blocks 31 on the two sensing elements 211 of the sensing element group 21 can receive shearing force or receive an uneven surface. When pressed, the elastic blocks 31 on the two sensing elements 211 of the sensing element group 21 corresponding to the two sensing elements 211 undergo different deformations, so that the two sensing elements 211 of the sensing element group 21 undergo different deformations, thereby generating different electrical signals.

1 and 3 show a situation where one elastic block 31 is correspondingly disposed on two sensing elements 211 of a set of sensing element groups 21 , and the elastic blocks 31 corresponding to different sensing element groups 21 are connected at the intersection. It should be noted that the embodiment of the present invention is described by taking the case where one elastic block 31 is correspondingly disposed on two sensing elements 211 of a set of sensing element groups 21 as an example, which is for discussion purposes only, and is not intended to be limiting.

Specifically, when the sensing device is used to detect pressure, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 are subjected to pressure, and the entire elastic block 31 is pressed down, so that the sensing element group corresponding to the elastic block 31 is pressed. The two sensing elements 211 of 21 undergo the same amount of compression, and then detect the magnitude of the pressure, as shown in FIG. 4 .

When the sensing device is used to detect the shearing force, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 are subjected to the shearing force, and the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 are subjected to the shearing force. Different deformations cause the two inductive elements 211 in the inductive element group 21 to undergo different deformations, thereby generating different electrical signals, that is, the two inductive elements 211 of the inductive element group 21 generate different electrical signals respectively, and then detect shearing. The magnitude of the shear force is shown in Figure 5.

When the sensing device is used to detect the flatness of the surface of the object, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 are pressed against the surface of the object to be detected. 31 The parts corresponding to the two sensing elements 211 of the sensing element group 21 undergo different deformations, so that the two sensing elements 211 in the sensing element group 21 undergo different deformations, thereby generating different electrical signals, that is, the two sensing elements of the sensing element group 21. The sensing elements 211 respectively generate different electrical signals, thereby detecting the unevenness of the surface of the object to be detected, and at the same time, it can reflect the degree of unevenness of the surface of the object to be detected, as shown in FIG. 6 .

Please refer to FIGS. 7-8 . FIG. 7 is a schematic structural diagram of another embodiment of the sensing device of the present invention, and FIG. 8 is a cross-sectional structural schematic view of the sensing device shown in FIG. 7 .

In an alternative embodiment, the elastic layer 3 includes elastic blocks 31 . The two sensing elements 211 of the sensing element group 21 are respectively provided with different elastic blocks 31, and the elastic blocks 31 on the two sensing elements 211 of the sensing element group 21 are symmetrically arranged, so that the two sensing elements of the sensing element group 21 are arranged symmetrically. When the elastic blocks 31 on the 211 are pressed against the uneven surface, the elastic blocks 31 on the two sensing elements 211 of the sensing element group 21 undergo different deformations, so that the two sensing elements 211 of the sensing element group 21 undergo different deformations. , and then generate different electrical signals.

Specifically, when the sensing device is used to detect pressure, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 are subjected to pressure, and each elastic block 31 is pressed down, so that the two elastic blocks 31 of the sensing element group 21 are pressed down. The sensing element 211 is compressed by the same amount, and then detects the magnitude of the pressure, as shown in FIG. 9 .

When the sensing device is used to detect the flatness of the surface of the object, the elastic blocks 31 corresponding to the two sensing elements 211 of the sensing element group 21 are pressed against the surface of the object to be detected. The elastic blocks 31 corresponding to the two sensing elements 211 of the group 21 deform differently, so that the two sensing elements 211 in the sensing element group 21 undergo different deformations, thereby generating different electrical signals, that is, the The two sensing elements 211 respectively generate different electrical signals, thereby detecting the unevenness of the surface of the object to be detected, and can also reflect the degree of unevenness of the surface of the object to be detected, as shown in FIG. 10 .

Further, the orthographic projection of the surface of the elastic block 31 facing the sensing element 211 on the substrate 1 covers the orthographic projection of the sensing element 211 on the substrate 1 , as shown in FIGS. 3 and 8 . In this way, the force received by the elastic block 31 can be better transmitted to the sensing element 211 , so that the change in the resistance value reflected by the deformation of the sensing element 211 can more accurately describe the force received by the elastic block 31 . Happening.

Please continue to refer to Figures 3 and 8. In one embodiment, the sensing element 211 includes one-dimensional material layers 2111 and two-dimensional material layers 2112 that are alternately stacked. Specifically, the sensing element 211 is formed by alternately stacking one-dimensional material layers 2111 and two-dimensional material layers 2112 one by one, and the resistance of the sensing element 211 can be changed by using the quantum tunneling effect when the sensing element 211 is subjected to different forces. In addition, the sensing element 211 of this embodiment has a stable structure, low elastic modulus, and is favorable for microscopic-scale movement and ion penetration and escape. In addition, the sensing element 211 of this embodiment is not easy to gather into bundles, has a high specific surface area, good adhesion, and a large contact area, so the sensing element 211 of this embodiment has high detection sensitivity.

Optionally, the material used in the one-dimensional material layer 2111 may be nano carbon black, single-walled or multi-walled carbon nanotubes, etc., preferably carbon nanotubes. The material used in the two-dimensional material layer 2112 may be metal carbonitride, graphene, etc., and may specifically be Nb ₂ C, V ₂ C, (Ti _0.5 Nb _0.5 ) ₂ C, Ti ₃ C ₂ , Ti ₃ CN, ( V _0.5 Cr _0.5 ) ₃ C ₂ , Ta ₄ C ₃ , Ti ₂ C, etc., among which Ti ₃ C ₂ is preferred.

Please continue to refer to Figure 2. Further, the sensing device includes multiple sets of sensing element groups 21 . The plurality of sensing element groups 21 are sequentially arranged on the substrate 1 along a circumferential direction, and the two sensing elements 211 in each sensing element group 21 are at the center of the circle corresponding to the circumferential direction (the center O as shown in FIG. 2 , the same below). ) for the center-symmetric setting. In this way, when the sensing device is applied to detect the shearing force, the sensing device can detect the direction of the shearing force. Specifically, when the inductive device accepts shearing forces in different directions, there are corresponding inductive element groups 21 corresponding to the shearing force, so as to detect the magnitude of the shearing force, and according to the inductive element groups corresponding to the shearing force The direction of the shearing force can be determined by the spacing direction of the two sensing elements 211 of 21 .

It can be understood that, the greater the number of the sensing element groups 21, the higher the determination accuracy of the shear force direction. FIG. 2 shows that the number of the sensing element groups 21 is 8, and the 8 sensing element groups 21 form a complete circle.

Please continue to refer to Figure 2. In one embodiment, the sensing device further includes a plurality of electrodes 41 and a plurality of electrode leads 42 extending on the substrate 1 . A plurality of electrodes 41 are disposed on the outer periphery of the sensing layer 2 , one electrode 41 is connected to one electrode lead 42 , and every two electrode leads 42 are respectively connected to one sensing element 211 . The two electrode leads 42 connected to the inductive element 211 are used to connect the inductive element 211 to two electrodes 41, one of the electrodes 41 is used to input electrical signals to the inductive element 211, and the other electrode 41 is used to draw out electrical signals to form a current path. In addition, the change of the resistance value of the sensing element 211 will affect the electrical signal drawn from the sensing element 211. According to the change of the electrical signal drawn from the sensing element 211, the change of the resistance value of the sensing element 211 is calculated, which is then used to detect the sensing device. The situation of the accepted force, including the detection of pressure, shear force, and the flatness of the surface of the object.

Further, the sensing element 211 extends along the surface of the substrate 1 in a serpentine shape from the first end 2113 to the second end 2114 . The first end 2113 and the second end 2114 are respectively connected to an electrode lead 42 . Specifically, the sensing element 211 covers the electrode. The lead 42 is connected to the electrode lead 42 . The arc width of the end of the sensing element 211 away from the center of the circle is larger than that of the end close to the center of the circle, forming a fan-shaped structure, so that the sensing element groups 21 of each sensing element group 21 form the above-mentioned complete circumference. Of course, in other embodiments of the present invention, the sensing element 211 may also have a rectangular structure or the like, which is not limited herein.

It should be noted that the first end 2113 and the second end 2114 can be arranged in sequence along the direction away from the above-mentioned center of the circle, specifically, the first end 2113 is closer to the center of the circle than the second end 2114, as shown in FIG. 2; or the first end 2113 and the The second ends 2114 are arranged in sequence along the above-mentioned circumferential direction, which is not limited herein. Wherein, the first end 2113 and the second end 2114 are preferably the head and tail ends of the sensing element 211 extending in a serpentine shape, so that the entire sensing element 211 can be subjected to force and applied to detect the force. In addition, the sensing element 211 extending in a serpentine shape has a significant change in piezoresistance when it is pressed, which is beneficial to improve the force sensitivity of the sensing element 211 .

See Figure 11. In an alternative embodiment, the sensing element 211 is not arranged to extend in a serpentine shape as in the above-mentioned embodiment, instead, the sensing element 211 is a complete block structure. In order to ensure that the sensing element 211 has sufficient force sensitivity, the sensing element 211 covers a part of the two correspondingly connected electrode leads 42 , and the part of the two electrode leads 42 covered by the sensing element 211 constitutes an interdigital electrode structure. The electrode lead 42 in the form of an interdigitated electrode enables the resistance change caused by any position on the sensing element 211 to be pressed back to the two electrode leads 42 connected to the sensing element 211 , thereby causing the electricity drawn from the sensing element 211 . The signal is altered to be used to detect the applied force.

Proceed to Figure 1-3. In one embodiment, the sensing device further includes an encapsulation layer 5, the encapsulation layer 5 covers the sensing element 211, and at least the portion of the electrode lead 42 connected to the sensing element 211 close to the sensing element 211 is also covered and encapsulated by the encapsulation layer 5, so that The sensing element 211 and the electrode lead 42 play a role of packaging protection. The elastic layer 3 is disposed on the side of the encapsulation layer 5 away from the sensing layer 2 . In addition, the encapsulation layer 5 is also an elastic body to ensure that the force on the elastic layer 3 can be transmitted to the sensing element 211 .

Optionally, the elastic layer 3 and the encapsulation layer 5 can be made of materials such as PDMS, silicone rubber, or other materials with the same properties, so that the elastic layer 3 and the encapsulation layer 5 have good elasticity and insulation properties. Of course, the materials of the elastic layer 3 and the encapsulation layer 5 may be the same or different, which are not limited herein.

Please refer to FIGS. 12-13 . FIG. 12 is a schematic flowchart of an embodiment of a method for preparing an induction device of the present invention, and FIG. 13 is a schematic structural diagram of each step in the preparation method of the induction device shown in FIG. 12 . It should be noted that the preparation method of the induction device described in this embodiment is based on the induction device described in the above embodiment. Moreover, the manufacturing method of the sensing device described in this embodiment is not limited to the following steps.

S101: Coating a first photoresist layer 62 with a uniform thickness on a hard base 61;

In this embodiment, the chemical properties of the hard base 61 are stable, and the surface of the hard base 61 for coating the first photoresist layer 62 is flat and clean, so as to ensure the stable progress of the subsequent process.

S102: attaching and forming the substrate 1 on the first photoresist layer 62;

In this embodiment, a film for forming the substrate 1 , such as the PI film described in the above embodiments, is attached on the first photoresist layer 62 to form the substrate 1 . Wherein, the first photoresist layer 62 can make the substrate 1 and the hard base 61 adhere more closely, and can keep the surface of the substrate 1 flat.

S103 : Coating a second photoresist layer 63 with a uniform thickness on the substrate 1 .

S104: patterning the second photoresist layer 63, and separating the substrate 1 and the hard base 61 by removing the first photoresist layer 62;

In this embodiment, the second photoresist layer 63 is patterned to form the grooves 631, and then the sensing layer 2 is subsequently formed. Specifically, a corresponding mask can be used in combination to remove part of the second photoresist layer 63 with a remover through a photolithography process, and a groove 631 is formed at the position where the removed second photoresist layer 63 is located. . In addition, in this embodiment, the first photoresist layer 62 can also be removed by a remover, so that the substrate 1 and the hard base 61 are separated. The removing agent may be acetone, alcohol, etc., which are determined according to the specific compositions of the first photoresist layer 62 and the second photoresist layer 63 .

S105: forming electrodes 41 and electrode leads 42 on the substrate 1;

In the present embodiment, the electrodes 41 and the electrode leads 42 are formed by sputtering on the substrate 1 through a magnetron sputtering process and a mask having a desired specific mask pattern. Specifically, the mask used in the above-mentioned magnetron sputtering process is hollowed out in the region corresponding to the groove 631 on the second photoresist layer 63 to allow the metal beam to pass through and reach the second photoresist layer 63, while other The area forms a shield to block the metal beam, so that the electrodes 41 and the electrode leads 42 are formed in the grooves 631 on the second photoresist layer 63 . Wherein, since the thickness of the electrode 41 and the electrode lead 42 is relatively small, usually only several hundred nanometers, the electrode 41 and the electrode lead 42 are not shown in the schematic diagrams of the subsequent steps.

S106: Alternately deposit a one-dimensional material layer 2111 and a two-dimensional material layer 2112 on the substrate 1;

In this embodiment, a one-dimensional material layer 2111 and a two-dimensional material layer 2112 are alternately deposited on the substrate 1 by vacuum filtration technology.

S107: remove the second photoresist layer 63 remaining after the patterning process and the one-dimensional material layer 2111 and the two-dimensional material layer 2112 deposited on the second photoresist layer 63, thereby forming the sensing layer 2;

In this embodiment, the second photoresist layer 63 remaining after the patterning process is removed, so that the one-dimensional material layer 2111 and the two-dimensional material layer 2112 deposited on the second photoresist layer 63 lack bottom support, resulting in The one-dimensional material layer 2111 and the two-dimensional material layer 2112 deposited on the second photoresist layer 63 are also easily removed, and then the sensing layer 2 is formed. Wherein, the second photoresist layer 63 can also be removed by a remover.

It should be noted that the sensing layer 2 includes a plurality of sensing element groups 21, and each sensing element group 21 includes two symmetrically arranged sensing elements 211, which are as described in the above-mentioned embodiments, and will not be repeated here.

S108: forming an encapsulation layer 5 on the sensing layer 2;

In this embodiment, the encapsulation layer 5 is formed on the sensing layer 2 . Specifically, the sensing layer 2 can be encapsulated with a PDMS solution, and then cured to form the encapsulation layer 5 .

S109: forming the elastic layer 3 on the encapsulation layer 5;

In this embodiment, the elastic layer 3 is formed on the encapsulation layer 5 by casting with a mold. The elastic layer 3 is formed on the two sensing elements 211 of the sensing element group 21 , so that when the elastic layer 3 is subjected to shearing force or is pressed by an uneven surface, the elastic layer 3 corresponds to the two sensing elements 211 Different deformations occur, so that the two sensing elements 211 in the sensing element group 21 undergo different deformations, thereby generating different electrical signals. The specific detection principle has been described in detail in the above embodiments, and will not be repeated here.

Please refer to FIG. 14 , which is a schematic structural diagram of an embodiment of the robot of the present invention.

In one embodiment, the robot 7 includes a sensing device 71 . The robot 7 may be a robotic arm or the like, and the sensing device 71 provides force feedback for the robotic arm to accurately grasp the object. Wherein, the sensing device 71 is the sensing device described in the above-mentioned embodiment, which will not be repeated here.

In addition, in the present invention, unless otherwise expressly specified and limited, the terms "connected", "connected", "stacked" and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection, Or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present utility model, but not to limit them; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that : it can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements to some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the various embodiments of the present utility model Scope of technical solutions.

Claims (12)

1. An induction device, characterized in that the induction device comprises:

a substrate;

the induction layer is arranged on the substrate and comprises a plurality of induction element groups, and each induction element group comprises two induction elements which are symmetrically arranged;

the elastic layer is arranged on the two sensing elements of the sensing element group, so that when the elastic layer is subjected to shearing force or is pressed by an uneven surface, parts of the elastic layer corresponding to the two sensing elements are deformed differently, and the two sensing elements in the sensing element group are deformed differently to generate different electric signals.

2. The sensing device as claimed in claim 1, wherein the elastic layer includes an elastic block, the two sensing elements of the sensing element set are respectively provided with different elastic blocks, and the elastic blocks of the two sensing elements of the sensing element set are symmetrically arranged, so that when the elastic blocks of the two sensing elements of the sensing element set are pressed by an uneven surface, the elastic blocks of the two sensing elements of the sensing element set are deformed differently, so that the two sensing elements of the sensing element set are deformed differently, and thus different electrical signals are generated.

3. The sensing device as claimed in claim 1, wherein the elastic layer includes an elastic block, and the elastic block is correspondingly disposed on the two sensing elements of the sensing element set, so that when the elastic block on the two sensing elements of the sensing element set is subjected to a shearing force or pressed by an uneven surface, portions of the elastic block on the two sensing elements of the sensing element set corresponding to the two sensing elements are deformed differently, so that the two sensing elements of the sensing element set are deformed differently, and thus different electrical signals are generated.

4. A sensing device according to claim 2 or 3, wherein an orthographic projection of the surface of the resilient block facing the sensing element on the substrate covers the orthographic projection of the sensing element on the substrate.

5. An inductive device according to claim 2 or 3, characterized in that the inductive element comprises one-dimensional material layers and two-dimensional material layers arranged alternately one above the other.

6. The inductive device of claim 2 or 3, further comprising a plurality of electrodes and a plurality of electrode leads extending from the substrate, wherein the plurality of electrodes are disposed on the periphery of the inductive layer, one of the electrodes is connected to one of the electrode leads, and each two of the electrode leads are respectively connected to one of the inductive elements.

7. The sensing device as claimed in claim 6, wherein the sensing device comprises a plurality of sensing element sets, the sensing element sets are sequentially arranged on the substrate along a circumferential direction, and the two sensing elements in each sensing element set are symmetrically arranged around a circle center corresponding to the circumferential direction.

8. The inductive device of claim 7, wherein the inductive element is disposed along the surface of the substrate in a serpentine shape extending from a first end to a second end, the first end and the second end are connected to one of the electrode leads, respectively, and a width of an arc of an end of the inductive element away from the center of the circle is greater than a width of an arc of an end of the inductive element close to the center of the circle, forming a fan-shaped structure.

9. The inductive device of claim 7, wherein the inductive element covers a portion of the two electrode leads to which it is correspondingly connected, the portion of the two electrode leads covered by the inductive element constituting an interdigitated electrode structure.

10. The inductive device of claim 6, further comprising an encapsulation layer covering the inductive element and at least a portion of the electrode leads to which the inductive element is connected that is proximate to the inductive element, and wherein the resilient layer is disposed on a side of the encapsulation layer that faces away from the inductive layer.

11. The inductive device of claim 1, wherein the substrate is a flexible body.

12. A robot, characterized in that it comprises a sensing device according to any of claims 1-11.

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