CN211378399U

CN211378399U - System for forming COF fine circuit

Info

Publication number: CN211378399U
Application number: CN201921576858.7U
Authority: CN
Inventors: 黎素凡
Original assignee: Shenzhen Anyuanda Electronic Co ltd
Current assignee: Shenzhen Anyuanda Electronic Co ltd
Priority date: 2019-09-18
Filing date: 2019-09-18
Publication date: 2020-08-28
Anticipated expiration: 2029-09-18

Abstract

The utility model relates to a system for form COF fine and close circuit, the system includes UV laser processing equipment, the laser parameter of the laser head output of UV laser processing equipment is: the size of the light spot is 15-40 μm, and the moving speed of the light spot is 1-3 m/s. The UV laser processing equipment carries out laser engraving on the FCCL base material conveyed to the equipment, and directly engraves the copper foil of the FCCL base material into a fine circuit. The utility model discloses a technology and equipment are simple, and the yield is high.

Description

System for forming COF fine circuit

Technical Field

The utility model belongs to the technical field of the circuit board technique and specifically relates to a system for form COF fine and close circuit.

Background

A COF (Chip On Flex, or, Chip On Film, often called as a Chip On Film) flexible circuit board in the prior art is called as a COF, and a method for forming a circuit diagram thereof includes: covering a photosensitive layer on the substrate, exposing and imaging, developing, etching, removing the photosensitive layer to form a circuit diagram, and finally mounting a chip and an electronic component on the chip to obtain the COF. The method in the prior art has complex process and large investment on equipment and plants; the complex process steps lead to low product yield and high rejection rate of the circuit board; chemical etching also causes contamination problems. In the exposure imaging step, laser equipment is used for processing, but the laser equipment is only used for exposure imaging, and a circuit cannot be formed at one time.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the system for forming the COF fine circuit is provided, and the problems of complex system, large investment, low product yield, environmental pollution and the like of forming the COF fine circuit in the prior art are solved.

In order to solve the technical problem, the utility model adopts the following technical scheme:

a system for forming COF fine circuit comprises a UV laser processing device, wherein laser parameters output by a laser head of the UV laser processing device are as follows: the size of the light spot is 15-40 mu m, and the moving speed of the light spot is 1-3 m/s; the UV laser processing equipment carries out laser engraving on the FCCL base material conveyed to the equipment, and directly engraves the copper foil of the FCCL base material into a fine circuit.

Furthermore, the output power of the laser equipment is 1-20W.

Further, the UV laser processing equipment comprises a control center; the laser head is connected with a control center, and the control center controls the laser head to carry out 3D movement so as to directly engrave and form a 3D COF fine circuit on the FCCL base material.

Furthermore, the control center comprises a storage space for storing COF circuit diagram data; the control center controls the laser head to etch the circuit in a 3D moving mode according to the input or stored COF circuit diagram data.

Further, the control center is a main control board in the UV laser processing equipment.

Further, the system also comprises a material conveying device for conveying the FCCL substrate to the UV laser processing equipment.

Further, the material conveying device is a material conveying rolling roller, and the conveyed FCCL substrate is a coiled material.

The utility model has the advantages that:

the utility model discloses a UV laser processing equipment sets for specific output laser parameter, inputs the circuit board drawing data in laser processing equipment's control system, and the control laser head carries out 3D and removes the fine circuit of COF that takes shape that directly carves on FCCL, the utility model discloses a method step and the equipment that adopts are simple, with low costs, the product yield is high, no environmental pollution.

The present invention will be described in further detail with reference to the accompanying drawings.

Drawings

Fig. 1 is a process flow diagram for processing COFs according to an embodiment of the invention.

Fig. 2 is a schematic diagram of a system for forming a COF fine circuit according to an embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of an FCCL substrate of a COF of an embodiment of the invention, wherein fig. 3(a) and 3(b) are examples of two different structures.

Detailed Description

It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict, and the present invention is further described in detail with reference to the accompanying drawings and specific embodiments.

The embodiment of the utility model relates to a system 100 (fig. 2) of the fine and close circuit of COF of formation, including UV laser processing equipment 4 and to the feeding device of conveying FCCL substrate 1 in the laser head the place ahead of UV laser processing equipment, the laser parameter of UV laser processing equipment output is: the size of the light spot is 15-40 μm, and the moving speed of the light spot is 1-3 m/s. The output power of the laser equipment is 1-20W; the UV laser processing equipment comprises a control center; the control center comprises a storage space for storing COF circuit diagram data; the laser head is connected with a control center, and the control center controls the laser head to move in a 3D mode so as to carve copper foils of the FCCL to form a COF fine circuit.

The control center of the UV laser processing equipment controls the laser head to move in a 3D mode according to the input or stored COF circuit diagram data, so that a COF fine circuit is directly formed on the FCCL base material in an engraved mode; and a laser head of the UV laser processing equipment moves in the horizontal direction and the thickness direction of the copper foil of the FCCL to carve a circuit, and the copper foil of the FCCL base material is directly carved to form a 3D circuit structure. In a particular embodiment, the control center of the UV laser machining apparatus may be a main control board within the UV laser machining apparatus. The storage space may be RAM, ROM, flash memory, EEPROM, a hard drive, a solid state drive, or any other suitable memory or storage medium.

The embodiment of the utility model provides a still provide a method for forming COF fine and close circuit, include following step:

providing an FCCL substrate; and

directly etching a COF fine circuit on the FCCL substrate by adopting a dry process;

in the second step, the dry process is performed by using the system 100 for forming a COF fine circuit. The second step specifically comprises:

inputting circuit diagram data corresponding to COF to a control center of the UV laser processing equipment 4 or storing the circuit diagram data in the control center;

adjusting laser output parameters of UV laser processing equipment to be that the size of a light spot is 15-40 mu m, and the moving speed of the light spot is 1-3 m/s; and

and starting the UV laser processing equipment, and controlling the laser head to carry out 3D movement engraving circuit according to the input or stored COF circuit diagram data.

In the first step, the thickness of the copper foil of the FCCL substrate is 2-8 μm.

The embodiment of the utility model also relates to a method for processing COF, including the above-mentioned method that forms the fine and close circuit of COF to and step three, the paster forms the COF that has electronic components.

The embodiment of the utility model also relates to a COF, its circuit is carved by the above-mentioned method that forms the fine and close circuit of COF.

In a specific example, referring to fig. 1 to 3, the method for processing a COF of the present embodiment mainly includes:

providing an FCCL substrate 1; and

directly etching a COF fine circuit 2 on the FCCL substrate 1 by adopting a dry process;

and step three, pasting the chip to form COF 3.

Referring to fig. 2-3, in step one, the FCCL substrate 1 includes a base insulating film 10 and copper foils 11 covering both sides (fig. 3 (a)) or one side (3(b)) of the base insulating film 10, and the thickness of the copper foils 11 may be, but is not limited to, 2 to 8 μm. The copper foil 11 is processed in a subsequent step to form a COF fine circuit. In this embodiment, the FCCL substrate 1 is continuously transported to the laser processing apparatus 4 by a roll roller using the FCCL substrate 1 roll as a starting material. Of course, FCCL substrate 1 may be a slab or block that is delivered to laser machining apparatus 4 or may be delivered by other delivery means than a roller.

Referring to fig. 2, in the second step, a dry process, i.e., a laser etching process, is performed to directly etch the copper foil 11 of the FCCL substrate by a laser beam using a laser processing apparatus to form a COF fine circuit. Etching is to burn out the copper foil except for the circuit connection lines by laser and only the copper foil corresponding to the circuit pattern is remained, so that the COF fine circuit 2 is directly obtained after the laser etching process of the second step. In this step, the laser processing equipment adopts the UV laser processing equipment 4, the laser output unit of the laser processing equipment 4 is a laser head, the laser beam with high beam quality is output and focused into an extremely small light spot, a very high power density is formed at the focal point, the contacted material is instantly vaporized, thereby removing the copper foil of other areas outside the circuit diagram, and the areas of the residual copper foil form the high-precision ultrafine circuit diagram 2.

When the UV laser processing equipment engraves the circuit, its parameter adjustment does:

the size of the light spot is 15-40 μm, the moving speed of the light spot is 1-3 m/s, and the power of the laser device is 1-20W. The moving speed of the light spot is also the laser engraving speed, and the function of the laser device can use 20W selectively.

And step two, inputting corresponding COF circuit diagram data into a storage space of a control center of UV laser processing equipment according to the specific FCCL base material 1 and a circuit to be formed in the step one, adjusting or selecting the parameters of the laser processing equipment, starting the FCCL base material 1 in the step one, starting the laser processing equipment, correspondingly controlling a laser head to perform 3D moving processing by the control center of the laser processing equipment according to the input COF circuit diagram data, performing plane moving on the copper foil of the FCCL base material 1 according to a plane diagram of the circuit diagram, and simultaneously performing up-down movement in the thickness direction of the copper foil so as to perform 3D engraving, so that the rest of the copper foil except for the connection line of the FCCL is removed, and a 3D fine circuit of the COF is formed and is consistent with the circuit diagram data input into the control center of the laser processing equipment. After the FCCL substrate 1 in the first step is conveyed to laser processing equipment for engraving, a COF circuit is directly formed in a one-stop mode.

Adopt FCCL substrate coil stock to carry out the laser system of carving and form COF circuit in this embodiment, through the utility model discloses UV laser processing equipment 4 carves the system FCCL coil stock with step two, according to the COF circuit diagram data of input laser processing equipment control center, the copper foil 11 of its FCCL substrate is carved the system by laser and is corresponded the formation circuit, forms the repetitive unit of COF circuit on the coil stock, perhaps forms multiple COF circuit, or forms the large-scale COF circuit of a monoblock. A COF circuit unit of the FCCL roll after laser engraving is formed with a complicated and fine circuit pattern. The formed COF circuit comprises a group of parallel conductive connecting lines, the conductive connecting lines are copper foils reserved after laser engraving, and insulating intervals among the conductive connecting lines are formed by the copper foils removed through laser engraving. The width of the conductive connecting line at the rear end is 71 micrometers, and the insulation interval between two adjacent conductive connecting lines is 63 micrometers; the conductive connecting lines extend forwards and are dense after being bent, the width of the front ends of the conductive connecting lines is 20 micrometers, and the interval between two adjacent conductive connecting lines is 18 micrometers. The COF circuit line comprises a group of parallel conductive connecting lines, the width of each conductive connecting line is 15.8 mu m, and the insulation interval between every two adjacent conductive connecting lines is 10.6 mu m. From the above example, the COF circuit obtained by the method and system of the present invention has a fine COF circuit, and the conductive connection is conducted, so the yield of the product is high.

And in the third step, directly carrying out surface mounting on the FCCL etched by the laser in the second step to obtain a complete COF with the electronic component.

The COF fine circuit obtained in the step two has high yield, can be directly subjected to surface mounting, does not need quality inspection, and further saves manpower and material resources.

The utility model discloses the method for forming COF fine and close circuit adopts aforementioned step one and step two alright obtain.

Referring again to fig. 2, the embodiment of the present invention further provides a system 100 for forming a COF fine circuit, which includes a UV ultraviolet processing apparatus 4 for etching the FCCL substrate 1 conveyed to the apparatus 4 to form a circuit; also included is a feed device for delivering the FCCL substrate 1 to the apparatus 4, in this case a feed roller.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The use of the terms "a" or "an" and the like in the description or the claims of the present invention includes one or more than one unless explicitly stated to the contrary. Sometimes, words such as "plurality", "one or more" or "at least one" may be included in the claims and the description, however, in the absence of such a limitation, it is not meant and should not be construed as meaning, and it cannot be envisaged, that there are a plurality.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and are intended to be within the scope of the application; the scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A system for forming a COF fine circuit, comprising: the system comprises UV laser processing equipment, wherein laser parameters output by a laser head of the UV laser processing equipment are as follows: the size of the light spot is 15-40 mu m, and the moving speed of the light spot is 1-3 m/s; the UV laser processing equipment carries out laser engraving on the FCCL base material conveyed to the equipment, and directly engraves the copper foil of the FCCL base material into a fine circuit.

2. The system of claim 1, wherein: the output power of the laser equipment is 1-20W.

3. The system of claim 1, wherein: the UV laser processing equipment comprises a control center; the laser head is connected with a control center, and the control center controls the laser head to carry out 3D movement so as to directly engrave and form a 3DCOF fine circuit on the FCCL base material.

4. The system of claim 3, wherein: the control center comprises a storage space for storing COF circuit diagram data; the control center controls the laser head to etch the circuit in a 3D moving mode according to the input or stored COF circuit diagram data.

5. The system of claim 3, wherein: the control center is a main control panel in the UV laser processing equipment.

6. The system of any one of claims 1 to 5, wherein: the system also comprises a material conveying device for conveying the FCCL substrate to the UV laser processing equipment.

7. The system of claim 6, wherein: the material conveying device is a material conveying rolling roller, and the conveyed FCCL substrate is a coiled material.