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CN211264268U - Computer motherboard heat abstractor - Google Patents

Computer motherboard heat abstractor Download PDF

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Publication number
CN211264268U
CN211264268U CN202021299565.1U CN202021299565U CN211264268U CN 211264268 U CN211264268 U CN 211264268U CN 202021299565 U CN202021299565 U CN 202021299565U CN 211264268 U CN211264268 U CN 211264268U
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CN
China
Prior art keywords
air
container
pipe
heat sink
mainboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202021299565.1U
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Chinese (zh)
Inventor
江金春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi University of Technology
Original Assignee
Jiangxi University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi University of Technology filed Critical Jiangxi University of Technology
Priority to CN202021299565.1U priority Critical patent/CN211264268U/en
Application granted granted Critical
Publication of CN211264268U publication Critical patent/CN211264268U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a computer motherboard heat abstractor, include: the container is provided with an end cover, and the outside of the container is wrapped with a layer of heat insulation material; the air pipe can freely adjust the whole length, is arranged on the container, one end of the air pipe is communicated with the inside of the container, and the other end of the air pipe is abutted against a dust screen on the case; and the two air outlet devices are symmetrically arranged in the container and comprise air blowing devices and exhaust pipes for dispersedly exhausting air exhausted by the air blowing devices to the top surface of the main board. The utility model discloses in, the container outside parcel one deck thermal insulation material makes in the temperature of quick-witted incasement can not transmit the container, and the dust screen butt on trachea one end and the quick-witted case, the air-blast device during operation drives the air flow in the container and exchanges with quick-witted outer cold air, and then reaches the radiating purpose of mainboard, and the air-blast device exhaust is dispersed simultaneously and is arranged to the mainboard top surface, makes mainboard top surface border position also can be blown by wind, has improved the radiating effect to the mainboard.

Description

Computer motherboard heat abstractor
Technical Field
The utility model belongs to the technical field of the computer technology and specifically relates to a computer motherboard heat abstractor.
Background
The motherboard, also called a motherboard, is installed in a computer main chassis, is one of the most basic and important components of a computer, and plays a role in the whole computer system. The main circuit system of the computer is installed on the mainboard, and generally comprises elements such as a BIOS chip, an I/O control chip, a keyboard and panel control switch interface, an indicator light plug-in unit, an expansion slot, the mainboard and a direct current power supply plug-in unit of a plug-in card, and the elements generate heat when working, and further need to dissipate heat of the mainboard, so that the computer is prevented from malfunctioning. At present mainly dispel the heat through little fan to the mainboard, because the heat that other parts work produced in the quick-witted incasement makes the temperature rise in the quick-witted case, what the fan blew out is hot-blast, and the fan is fixed, and the mainboard is great relatively, and the mainboard is not blown the wind by the fan to the place, leads to not good to the radiating effect of mainboard, exists not enoughly.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solve the above-mentioned problems, and an object of the present invention is to provide a heat dissipation device for a motherboard of a computer.
The technical scheme of the utility model: a computer motherboard heat sink comprising:
the main board is arranged in the container with the end cover, the container is detachably arranged in the case, and a layer of heat insulation material wraps the outside of the container;
the air pipe can freely adjust the whole length, is arranged on the container, one end of the air pipe is communicated with the inside of the container, and the other end of the air pipe is abutted against a dust screen on the case;
and the two air outlet devices are symmetrically arranged in the container and comprise air blowing devices and exhaust pipes for dispersedly exhausting air exhausted by the air blowing devices to the top surface of the main board.
Preferably, the exhaust pipe includes air inlet hopper and both ends confined long tube, the air inlet hopper is provided with the bayonet socket, the long tube is provided with a plurality of air outlet, the air inlet hopper with the long tube communicates with each other.
Preferably, the air inlet hopper is provided with a sealing gasket at the bayonet.
Preferably, the air outlets of the two long pipes are arranged in a staggered manner.
Preferably, the bottom of the air outlet is flush with the top surface of the main board.
Preferably, the trachea includes outer tube and inner tube, be provided with the screw thread in the outer tube, the inner tube outside is provided with the external screw thread, the outer tube with the inner tube passes through threaded connection.
Preferably, the top of the inner pipe is funnel-shaped.
Preferably, the bottom of the container is provided with an ear plate, and the ear plate is provided with a through hole.
The utility model has the advantages that: the utility model discloses in, the mainboard is installed in the container, because the heat that other parts work of machine incasement produced makes quick-witted incasement temperature rise, the outside one deck thermal insulation material of container parcel, make in the temperature of quick-witted incasement can not transmit the container, trachea one end and the dust screen butt on the quick-witted case, the air-blast device during operation, the air that drives in the container flows and exchanges with the quick-witted outer cold air of case, and then reach the radiating purpose of mainboard, the air-blast device exhaust wind distributes and discharges to the mainboard top surface simultaneously, make mainboard top surface border position also can be blown by wind, the radiating effect to the mainboard has been improved.
Drawings
Fig. 1 is a schematic overall structure diagram of the preferred embodiment of the present invention;
fig. 2 is a schematic diagram of heat dissipation from the two air outlet devices to the main board in the preferred embodiment of the present invention;
fig. 3 is a left side view of the air inlet funnel connected with the long pipe in the preferred embodiment of the present invention.
Reference numerals: the air-conditioning device comprises a container 1, a support rod 11, an ear plate 12, a through hole 121, an air pipe 2, an outer pipe 21, an inner pipe 22, an air outlet device 3, an air blowing device 31, an exhaust pipe 32, an air inlet funnel 321, a bayonet 3211, a sealing gasket 3212, a long pipe 322, an air outlet 3221 and a connecting rod 33.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 3, a heat sink for a motherboard of a computer includes:
the main board is arranged in the container 1 with an end cover, the container 1 is detachably arranged in a case, and a layer of heat insulation material is wrapped outside the container 1;
the air pipe 2 can freely adjust the whole length, is arranged on the container 1, one end of the air pipe is communicated with the inside of the container 1, and the other end of the air pipe 2 is abutted against a dustproof net on the case;
and the two air outlet devices 3 are symmetrically arranged in the container 1 and comprise air blowing devices 31 and exhaust pipes 32 for dispersing and exhausting air exhausted by the air blowing devices 31 to the top surface of the main board. The utility model discloses in, the mainboard is installed in container 1, because the heat that other parts work of machine incasement produced makes the incasement temperature rise, 1 outside parcel one deck thermal insulation material of container, make in the temperature of machine incasement can not transmit container 1, 2 one end of trachea and the dust screen butt on the quick-witted case, air-blast device 31 during operation, the air that drives in the container 1 flows and exchanges with the outdoor cold air of machine, and then reach the radiating purpose of mainboard, air-blast device 31 exhaust wind dispersion simultaneously is discharged to the mainboard top surface, make mainboard top surface border position also can be blown by wind, the radiating effect to the mainboard has been improved. Specifically, the air outlet device 3 further comprises a connecting rod 33, and the exhaust pipe 32 is fixed on the inner wall of the container 1 through the connecting rod 33; a support rod 11 is arranged in the container 1, and the main board is fixed on the support rod 11 through the connection of a screw and the support rod 11.
As a preferred embodiment of the present invention, it may also have the following additional technical features:
in this embodiment, the exhaust duct 32 includes an air inlet funnel 321 and a long tube 322 with two closed ends, the air inlet funnel 321 is provided with a bayonet 3211, the long tube 322 is provided with a plurality of air outlets 3221, and the air inlet funnel 321 is communicated with the long tube 322. The arrangement of the air outlets 3221 enables the top surface of the main board to be blown by wind to drive the air on the top surface of the main board to flow, so that the heat dissipation purpose can be achieved at each position of the main board. Specifically, the air inlet hopper 321 is connected to the connecting rod 33.
In this embodiment, the air inlet funnel 321 is provided with a sealing gasket 3212 at the bayonet 3211. The blower 31 is mounted on the bayonet 3211, and the gasket 3212 functions to prevent air from flowing out through a gap between the blower 31 and the bayonet 3211 when the blower 31 is operated, thereby reducing the flow of air into the long tube 322.
In this embodiment, the air outlets 3221 of the two long pipes 322 are staggered with each other. The top surface of the main board can be blown by wind.
In this embodiment, the bottom of the air outlet 3221 is flush with the top surface of the main board. Mainboard top surface is provided with slot, chip, resistance, electric capacity etc. and these parts can produce the heat when using, lead to the temperature of mainboard top surface high, and air outlet 3221 is bloied to the top surface of mainboard for the flow of mainboard top surface air, and then the better dispels the heat to the mainboard.
In this embodiment, the gas pipe 2 includes an outer pipe 21 and an inner pipe 22, a thread is provided in the outer pipe 21, an external thread is provided outside the inner pipe 22, and the outer pipe 21 and the inner pipe 22 are connected by a thread. The whole length of the air pipe 2 is convenient to adjust, the inner pipe 22 can be abutted to a dust screen on the case, air in the case is prevented from exchanging with air in the container 1, and the purpose of heat dissipation of the main board cannot be achieved due to the fact that the temperature of the case is high.
In this embodiment, the top of the inner tube 22 is funnel-shaped. The area of the inner pipe 22 abutting against the dust screen on the cabinet is increased, and after the blower 31 is operated, the air flowing in the container 1 is easily exchanged with the cool air outside the cabinet.
In this embodiment, the bottom of the container 1 is provided with an ear plate 12, and the ear plate 12 is provided with a through hole 121. The screws pass through the ear plates 12 to connect with the chassis housing to secure the container 1 within the chassis.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Having shown and described embodiments of the present invention, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. A computer motherboard heat sink, comprising:
the container (1) with the end cover is provided with a main board inside, the container (1) is detachably arranged in a case, and a layer of heat insulation material wraps the outside of the container (1);
the air pipe (2) can freely adjust the whole length, is arranged on the container (1), one end of the air pipe is communicated with the inside of the container (1), and the other end of the air pipe (2) is abutted to a dust screen on the case;
and the two air outlet devices (3) are symmetrically arranged in the container (1) and comprise air blowing devices (31) and exhaust pipes (32) for dispersing and exhausting air exhausted by the air blowing devices (31) to the top surface of the main board.
2. The heat sink device of claim 1, wherein: exhaust pipe (32) are including air inlet fill (321) and both ends confined long tube (322), air inlet fill (321) are provided with bayonet socket (3211), long tube (322) are provided with a plurality of air outlet (3221), air inlet fill (321) with long tube (322) communicate with each other.
3. The heat sink device of claim 2, wherein: the air inlet hopper (321) is provided with a sealing gasket (3212) at the bayonet (3211).
4. The heat sink device of claim 2, wherein: the air outlets (3221) of the two long pipes (322) are arranged in a staggered manner.
5. The heat sink device of claim 2, wherein: the bottom of the air outlet (3221) is flush with the top surface of the main board.
6. The heat sink device of claim 1, wherein: the air pipe (2) comprises an outer pipe (21) and an inner pipe (22), threads are arranged in the outer pipe (21), external threads are arranged outside the inner pipe (22), and the outer pipe (21) is connected with the inner pipe (22) through threads.
7. The heat sink device of claim 6, wherein: the top of the inner tube (22) is funnel-shaped.
8. The heat sink device of claim 1, wherein: the bottom of the container (1) is provided with an ear plate (12), and the ear plate (12) is provided with a through hole (121).
CN202021299565.1U 2020-07-06 2020-07-06 Computer motherboard heat abstractor Expired - Fee Related CN211264268U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021299565.1U CN211264268U (en) 2020-07-06 2020-07-06 Computer motherboard heat abstractor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021299565.1U CN211264268U (en) 2020-07-06 2020-07-06 Computer motherboard heat abstractor

Publications (1)

Publication Number Publication Date
CN211264268U true CN211264268U (en) 2020-08-14

Family

ID=71957071

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021299565.1U Expired - Fee Related CN211264268U (en) 2020-07-06 2020-07-06 Computer motherboard heat abstractor

Country Status (1)

Country Link
CN (1) CN211264268U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200814

Termination date: 20210706