CN211126003U

CN211126003U - Antenna assembly

Info

Publication number: CN211126003U
Application number: CN201921785404.0U
Authority: CN
Inventors: 朱泽学
Original assignee: Shenzhen Sunway Communication Co Ltd
Current assignee: Shenzhen Sunway Communication Co Ltd
Priority date: 2019-10-23
Filing date: 2019-10-23
Publication date: 2020-07-28
Anticipated expiration: 2029-10-23

Abstract

The utility model discloses an antenna module, including FPC, support and PCB board, FPC fixes on the support, and the support is fixed on the PCB board, is equipped with first pad on the FPC, and FPC passes through first pad with PCB board welding is equipped with the opening on the perisporium of first pad, is equipped with on the internal face of opening and helps the welding layer. The peripheral wall of the FPC bonding pad is provided with the opening, and the inner wall surface of the opening is provided with the soldering assisting layer formed by the gold melting process, so that the welding reliability of the FPC and the PCB is effectively improved, and the structural stability and the working stability of the antenna assembly are improved.

Description

Antenna assembly

Technical Field

The utility model relates to the field of antenna technology, especially, relate to an antenna module.

Background

The antenna assembly is gradually developed from the structural form of a PCB board plus a radiating fin to the structural form of a PCB board plus a bracket plus a flexible printed circuit board (particularly suitable for a 5G base station antenna system), specifically, the bracket is fixed on the PCB board, and the FPC is adhered on the bracket and welded with the PCB board.

In order to realize stable welding between the bonding pad of the FPC and the bonding pad of the PCB, the bonding pad position of the FPC needs to be subjected to gold melting to realize soldering assistance, but the gold melting process of the bonding pad is generally realized at the final stage of the FPC manufacturing process flow, so that the peripheral wall of the bonding pad of the FPC cannot be subjected to all gold melting. If the peripheral wall of the pad of the FPC can also be metallized, the soldering reliability of the antenna assembly is further improved.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: an antenna assembly having a more stable structure is provided.

In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides an antenna module, includes FPC, support and PCB board, FPC fixes on the support, and the support is fixed on the PCB board, is equipped with first pad on the FPC, FPC passes through first pad with PCB board welding is equipped with the opening on the perisporium of first pad, is equipped with on the internal face of opening and helps the welding layer.

Furthermore, the welding-assistant layer is made of nickel gold.

Furthermore, the opening is in a semicircular hole shape.

Furthermore, the number of the openings is multiple, and the openings are uniformly distributed along the periphery of the first bonding pad.

Furthermore, the number of the first bonding pads on the FPC is two, and the two first bonding pads are arranged at intervals.

Furthermore, an isolation region is arranged on the FPC and located between the two first bonding pads.

Furthermore, the support is provided with a hot melting column, and the FPC is provided with a hot melting hole matched with the hot melting column.

Furthermore, a second bonding pad matched with the first bonding pad is arranged on the PCB.

Furthermore, a through hole is formed in the first bonding pad.

The beneficial effects of the utility model reside in that: the peripheral wall of the FPC bonding pad is provided with the opening, and the inner wall surface of the opening is provided with the soldering assisting layer formed by the gold melting process, so that the welding reliability of the FPC and the PCB is effectively improved, and the structural stability and the working stability of the antenna assembly are improved.

Drawings

Fig. 1 is an exploded view of an antenna assembly according to a first embodiment of the present invention;

Fig. 2 is a top view of an antenna assembly according to a first embodiment of the present invention.

Description of reference numerals:

1、FPC；

2. A support;

3. A PCB board;

4. A first pad;

5. A second pad;

6. Opening the gap;

7. A welding assisting layer;

8. An isolation region;

9. Hot melting the column;

10. And (7) positioning the holes.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1 and 2, an antenna assembly includes an FPC1, a bracket 2, and a PCB 3, where the FPC1 is fixed on the bracket 2, the bracket 2 is fixed on the PCB 3, a first pad 4 is disposed on the FPC1, the FPC1 is welded to the PCB 3 through the first pad 4, a gap 6 is disposed on a circumferential wall of the first pad 4, and a solder mask layer 7 is disposed on an inner wall surface of the gap 6.

The structure/working principle of the utility model is as follows: when the FPC1 pad is punched, a circle of hole grooves are punched along the periphery of the preset outline of the FPC1 pad, and then the hole grooves are cut to form the notch 6, so that the soldering assistant layer 7 can be formed on the inner wall surface of the notch 6 during the subsequent gold plating process.

From the above description, the beneficial effects of the present invention are: the peripheral wall of the FPC1 pad is provided with a notch 6, the inner wall surface of the notch 6 is provided with a soldering assistant layer 7 formed by a gold melting process, the welding reliability of the FPC1 and the PCB 3 is effectively improved, and the structural stability and the working stability of the antenna assembly are improved.

Furthermore, the material of the welding-assistant layer 7 is nickel gold.

As can be seen from the above description, the solder assistant layer 7 made of nickel-gold material has good conductivity, which is beneficial to further ensure the electrical performance of the antenna assembly.

Furthermore, the gap 6 is in a semicircular hole shape.

From the above description, semicircular hole shape opening 6 can avoid the condition of stress concentration, does benefit to the structural stability who further guarantees the antenna module.

Furthermore, the number of the gaps 6 is multiple, and the gaps 6 are uniformly distributed along the circumference of the first pad 4.

As can be seen from the above description, the gaps 6 are numerous, and the FPC1 pads are more reliably soldered to the PCB 3.

Further, the number of the first pads 4 on the FPC1 is two, and the two first pads 4 are arranged at intervals.

Further, an isolation region 8 is arranged on the FPC1, and the isolation region 8 is located between the two first pads 4.

As can be seen from the above description, the arrangement of the isolation region 8 can improve the structural strength of the first pad 4 on the FPC1, which is beneficial to further improve the structural stability of the antenna assembly. In detail, the substrate corresponding to the isolation region 8 has no copper, no cover film, and no adhesive, that is, the isolation region 8 can separate the two first pads 4 to ensure that the two first pads are not conducted.

Furthermore, a hot melting column 9 is arranged on the support 2, and a hot melting hole matched with the hot melting column 9 is arranged on the FPC 1.

As can be seen from the above description, the FPC1 is connected with the bracket 2 in a hot melting way, so that the connection is stable and the assembly is convenient.

Furthermore, a second bonding pad 5 matched with the first bonding pad 4 is arranged on the PCB 3.

Further, a through hole is formed in the first pad 4.

As can be seen from the above description, the provision of the through holes can prevent the occurrence of cold solder joints and cold solder joints, which is beneficial to further improving the reliability of the soldering between the FPC1 and the PCB 3.

Example one

Referring to fig. 1 and fig. 2, a first embodiment of the present invention is: the utility model provides an antenna module, includes FPC1, support 2 and PCB board 3, and FPC1 fixes on support 2, and support 2 fixes on PCB board 3, is equipped with first pad 4 on the FPC1, be equipped with on the PCB board 3 with 4 matched with second pads 5 of first pad, FPC1 pass through first, second pad with PCB board 3 welding switches on, is equipped with opening 6 on the perisporium of first pad 4, is equipped with on the inner wall face of opening 6 and helps welding layer 7, be equipped with the through-hole that is used for preventing rosin joint, hourglass welding on the first pad 4.

Specifically, the material of the solder mask layer 7 is nickel gold, that is, the solder mask layer 7 is formed by a nickel gold melting process.

The number of the gaps 6 is multiple, and the gaps 6 are uniformly distributed along the periphery of the first bonding pad 4.

Preferably, the gap 6 is in a semicircular hole shape. Preferably, two adjacent gaps 6 abut against each other, that is, the peripheral edge of the first pad 4 is wavy, so that the area of the peripheral wall of the first pad 4 becomes large, and most of the area of the peripheral wall of the first pad 4 can be metallized, thereby further improving the welding reliability of the FPC1 and the PCB 3.

The number of the first pads 4 on the FPC1 is two, and the two first pads 4 are arranged at intervals. Preferably, an isolation region 8 is disposed on the FPC1, and the isolation region 8 is located between two first pads 4.

In this embodiment, the support 2 is provided with a hot-melting column 9, the FPC1 is provided with a hot-melting hole matched with the hot-melting column 9, and the FPC1 is connected with the support 2 in a hot-melting manner. In detail, the FPC1 includes a planar portion and an inclined portion connected to each other, the first pad 4 is disposed on one side of the inclined portion away from the planar portion, the heat-melting hole is disposed on the planar portion, the heat-melting column 9 is disposed on the top surface of the bracket 2, one side of the bracket 2 is an inclined surface, and the inclined portion is attached to the inclined surface; the bottom of the support 2 is provided with a positioning column, and the PCB 3 is provided with a positioning hole 10 matched with the positioning column.

To sum up, the utility model provides an be equipped with the opening on the perisporium of FPC pad in the antenna module, the internal face of opening has the welding layer that helps that the gold technology formed, has improved FPC and PCB board welded reliability effectively for the structural stability and the job stabilization nature of antenna module obtain promoting.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims

1. The utility model provides an antenna module, includes FPC, support and PCB board, FPC fixes on the support, and the support is fixed on the PCB board, is equipped with first pad on the FPC, FPC passes through first pad with PCB board welding, its characterized in that: the peripheral wall of the first bonding pad is provided with an opening, and the inner wall surface of the opening is provided with a welding assisting layer.

2. The antenna assembly of claim 1, wherein: the welding-assistant layer is made of nickel and gold.

3. The antenna assembly of claim 1, wherein: the opening is in a semicircular hole shape.

4. The antenna assembly of claim 1, wherein: the quantity of opening is a plurality of, and the quantity is a plurality of opening along the week along first pad equipartition.

5. The antenna assembly of claim 1, wherein: the number of the first bonding pads on the FPC is two, and the two first bonding pads are arranged at intervals.

6. The antenna assembly of claim 5, wherein: an isolation area is arranged on the FPC and located between the two first bonding pads.

7. The antenna assembly of claim 1, wherein: the support is provided with a hot melting column, and the FPC is provided with a hot melting hole matched with the hot melting column.

8. The antenna assembly of claim 1, wherein: and a second bonding pad matched with the first bonding pad is arranged on the PCB.

9. The antenna assembly of claim 1, wherein: and the first bonding pad is provided with a through hole.