CN210120239U - Feed structure and antenna - Google Patents
Feed structure and antenna Download PDFInfo
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- CN210120239U CN210120239U CN201920732300.7U CN201920732300U CN210120239U CN 210120239 U CN210120239 U CN 210120239U CN 201920732300 U CN201920732300 U CN 201920732300U CN 210120239 U CN210120239 U CN 210120239U
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Abstract
The utility model relates to a feed structure and an antenna, the feed structure of the utility model comprises a substrate with a first surface and a second surface which are opposite; the substrate includes: the first surface and the second surface are provided with a plurality of dielectric layers in a stacked mode, and the metalized through holes penetrate through the plurality of dielectric layers and the first surface and the second surface; a plurality of conductive layers surrounding the metalized through holes and keeping a preset distance from the metalized through holes among the plurality of dielectric layers; and a plurality of metallized buried holes penetrating part of the dielectric layer and electrically connected with the conductive layer; wherein the plurality of metalized buried vias are arranged circumferentially around the metalized through-holes. Implement the utility model discloses simple structure, easily conformal, it is with low costs, it is extensive to use the scene.
Description
Technical Field
The utility model relates to an antenna feed technical field, more specifically say, relate to a feed structure and antenna.
Background
In a high-speed communication system, the beam forming is carried out on the array antenna, the large airspace coverage and wide-angle scanning are realized, the communication capacity of the system can be obviously increased, and the anti-interference capability is improved. The existing array antenna feed structure has the defects of narrow working frequency band, large occupied space of a feed network, low integration level and the like, and can not simultaneously meet the application requirements of broadband and low-profile integration conformality. In array antenna applications, therefore, a reasonable design of the feed structure is of great importance.
The existing array antenna feed structure has three main schemes: the first is a series-side feed structure; the second is a shunt-side feed structure; the third is a shunt-coaxial backfeed configuration.
The disadvantages of the series-side feed structure include: 1) the directional diagram changes with the frequency, and the working bandwidth is narrow; 2) the excitation amplitude of each array element is designed by an iteration method, the size of each array element needs to be adjusted, and the design complexity is high.
The parallel feed-side feed structure has the defects that the feed network occupies a large space, the array element array interval is large, and grating lobes are easy to appear in a directional diagram.
The parallel feed-coaxial back feed structure has the defects of low integration level and poor welding repeatability of the coaxial connector due to the adoption of two PCBs.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to the above-mentioned prior art defect of prior art, a feed structure and antenna are provided.
The utility model provides a technical scheme that its technical problem adopted is: constructing a feed structure comprising a substrate having opposed first and second surfaces; the substrate includes: the first surface and the second surface are provided with a plurality of dielectric layers in a stacked mode, and the metalized through holes penetrate through the plurality of dielectric layers and the first surface and the second surface; a plurality of conductive layers surrounding the metalized through holes and keeping a preset distance from the metalized through holes among the plurality of dielectric layers; and a plurality of metallized buried holes penetrating part of the dielectric layer and electrically connected with the conductive layer;
wherein the plurality of metalized buried vias are arranged circumferentially around the metalized via.
Preferably, the circumferential arrangement is centered around the metallized through hole.
Preferably, the plurality of metalized buried vias includes nine metalized buried vias equally circumferentially arranged around the metalized via.
Preferably, the plurality of dielectric layers include a first dielectric layer clinging to the first surface, a second dielectric layer clinging to the second surface, and a third dielectric layer arranged between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive layer arranged between the first dielectric layer and the third dielectric layer and a second conductive layer arranged between the second dielectric layer and the third dielectric layer;
the metallized buried hole penetrates through the third dielectric layer.
Preferably, the first dielectric layer, the second dielectric layer and the third dielectric layer are made of the same or different materials.
Preferably, the first dielectric layer, the second dielectric layer and the third dielectric layer are made of one or more of Rogers4350, FR4 and TLY-5.
Preferably, the thicknesses of the first dielectric layer, the second dielectric layer and the third dielectric layer are the same or different.
Preferably, the thickness of the first dielectric layer is greater than the thickness of the second dielectric layer.
The utility model discloses still construct an antenna, including the antenna radiation piece, the merit divides the network, and above-mentioned arbitrary one feed structure, feed structure the metallization through-hole is in it the first surface with antenna radiation piece electric connection, feed structure the metallization through-hole is in it the second surface with the merit divides network electric connection.
Optionally, the antenna radiation patch, the power division network, and the feed structure are integrated on the same PCB board.
Implement the utility model discloses a feed structure and antenna has following beneficial effect: the structure is simple, the conformal is easy, the cost is low, and the application scene is wide.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
fig. 1 is a schematic longitudinal sectional structure diagram of an embodiment of a feed structure of the present invention;
fig. 2 is a schematic cross-sectional view of an embodiment of a feed structure of the present invention;
fig. 3 is a diagram illustrating a test result of a circuit characteristic of the first embodiment of the antenna of the present invention;
fig. 4 is a graph of the gain simulation, i.e., test result, of the first embodiment of the antenna of the present invention;
fig. 5 is a schematic diagram of beam forming of a first embodiment of the antenna of the present invention;
fig. 6 is a diagram illustrating a result of a circuit characteristic test of a second embodiment of the antenna of the present invention;
fig. 7 is a graph of the gain simulation, i.e., test result, of a second embodiment of the antenna of the present invention;
fig. 8 is a schematic diagram of beamforming of a second embodiment of the antenna of the present invention.
Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
As shown in fig. 1 and fig. 2, in an embodiment of a feeding structure of the present invention, the feeding structure includes a substrate 100 having a first surface and a second surface opposite to each other; the substrate 100 includes: a plurality of dielectric layers stacked between the first surface and the second surface, and a metalized via 110 penetrating the plurality of dielectric layers and the first surface and the second surface; a plurality of conductive layers between the plurality of dielectric layers, surrounding the metalized via 110 and maintaining a predetermined distance from the metalized via 110; and a plurality of metallized buried vias 140 that pass through a portion of the dielectric layer and are electrically connected to the conductive layer; wherein a plurality of buried metallization holes 140 are arranged circumferentially around the metallization via 110. Specifically, the metalized through holes 110 penetrating through the entire substrate 100 are connected to external operating circuits on the first surface and the second surface, respectively, to transmit rf signals, thereby forming signal paths, and the metalized buried holes 140 circumferentially arranged around the metalized through holes 110 are electrically connected to the reference ground, thereby forming paths corresponding to the signal paths. It will be appreciated that the conductive layer is disposed around the metalized via 110 and is spaced apart from the metalized via 110, i.e., the conductive layer is in insulating relation to the metalized via 110, so that the signal from the metalized via 110 does not leak or attenuate to the useful signal due to radiation to the conductive layer, and the metalized buried via 140 is primarily shielding the signal transmitted through the metalized via 110 according to the antenna operation principle. The conductive layer connected to the metalized buried via 140 is here the reference formation.
Optionally, the circumferential arrangement is centered around the metalized via 110. In a specific design, the metalized buried via 140 may be designed with the metalized via 110 as a center to improve the design uniformity.
Optionally, the plurality of metalized buried vias 140 includes nine metalized buried vias 140, and the nine metalized buried vias are equally circumferentially arranged around the metalized through holes. Specifically, in a common design, the plurality of buried metallization holes 140 may be designed as nine buried metallization holes 140 uniformly arranged around the circumference of the metallization via 110 to ensure the shielding effect on the metallization via 110, and at this time, the center of the adjacent metallization surface holes is substantially 40 degrees relative to the center of the metallization via 110. It is understood that the number of the buried metallization holes 140 is not strictly limited in the specific use, and the number may be adjusted as needed, for example, the signal shielding of the metallization through holes 110 may be implemented by reasonably adjusting the size of the aperture of the buried metallization hole 140 and the distance between the buried metallization hole and the metallization through hole 110.
Optionally, the plurality of dielectric layers include a first dielectric layer 121 tightly attached to the first surface, a second dielectric layer 122 tightly attached to the second surface, and a third dielectric layer 123 disposed between the first dielectric layer 121 and the second dielectric layer 122, and the conductive layer includes a first conductive layer 131 disposed between the first dielectric layer 121 and the third dielectric layer 123 and a second conductive layer 132 disposed between the second dielectric layer 122 and the third dielectric layer 123; the buried metallization hole 140 extends through the third dielectric layer 123. Specifically, the substrate 100 may include a first dielectric layer 121, a first conductive layer 131, a third dielectric layer 123, a second conductive layer 132 and a second dielectric layer 122 in sequence from the first surface to the second surface, where the first conductive layer 131 and the second conductive layer 132 are both kept at a certain distance from the metalized via 110, and here, the distance between the first conductive layer 131 and the metalized via 110 and the distance between the second conductive layer 132 and the metalized via 110 may be equal or different. The distance between the edge of each conductive layer and the metalized through hole 110 may be equal or different, and when equal, it can be understood that the conductive layers are arranged around the metalized through hole 110 by taking the metalized through hole 110 as a circle center. The third dielectric layer 123 with the metalized buried via 140 disposed therein penetrates through the third dielectric layer 123 and is electrically connected to the conductive layer near the third dielectric layer 123.
Optionally, the materials of the first dielectric layer 121, the second dielectric layer 122 and the third dielectric layer 123 are the same or different. The dielectric layers can be made of the same material or different materials, and the materials can be selected according to the design requirements of products. The material of each dielectric layer can be one or more selected from Rogers4350, FR4 and TLY-5. For example, when the materials are the same, one of the materials may be selected, and when the materials are different, a plurality of the above materials may be selected to be combined.
Optionally, the thicknesses of the first dielectric layer 121, the second dielectric layer 122 and the third dielectric layer 123 are the same or different. Specifically, the thicknesses of the dielectric layers may be the same or different, and may be designed as required. When the dielectric layer thicknesses are different, the thickness of the first dielectric layer 121 may be greater than that of the second dielectric layer 122.
Additionally, the utility model discloses an antenna, including antenna radiation piece 200, the merit divides network 300 to and the feed structure of above arbitrary one, feed structure's metallized through-hole 110 is at its first surface and antenna radiation piece 200 electric connection, feed structure's metallized through-hole 110 divides network 300 electric connection at its second surface and merit. It is understood that in an array antenna application, a plurality of antenna radiation pieces 200 and a plurality of feeding structures may be included, the plurality of antenna radiation pieces 200 are electrically connected to the plurality of feeding structures, and the plurality of feeding structures are electrically connected to different connection terminals of the power dividing network 300.
Further, the antenna radiation patch 200, the power division network 300 and the feed structure are integrated on the same PCB board. On the basis of the front, the whole array antenna can be integrated into a PCB, so that the low-profile design is realized, and the array antenna is easy to conform. The method has more advantages in vehicle-mounted and airborne applications.
Taking the C-band array antenna as a specific embodiment, the C-band array antenna has 4 rows of subarrays, each subarray shares one power division network, each subarray includes 16 array elements, each array element is connected with a corresponding power division network node through one above-described feed structure, in the feed structure adopted here, the dielectric layer is made of Rogers4350 material with thickness of 1.508mm, FR4 material with thickness of 0.508mm and Rogers4350 material with thickness of 0.508mm in sequence from near to far from the array elements. The metalized through holes 110 are metalized through holes 110 with the radius of 0.3mm and the metalized buried holes 140 are 9 metalized buried holes 140 with the radius of 0.4mm, wherein the distance between the conductive layer and the circle center of the metalized through holes 110 is 1.5mm, the distance between the centers of the metalized buried holes 140 and the metalized through holes 110 is 2.0mm, and the central angle between the adjacent metalized buried holes 140 is 40 degrees. The vector network analyzer is utilized to test the circuit characteristics of the array antenna, namely the return loss of an input end and the isolation between two adjacent columns of sub-arrays, the test result of the circuit characteristics of the C-band array antenna of the embodiment is shown in figure 3, the relative bandwidth of S11< -10dB reaches 18%, and the isolation between two adjacent columns of sub-arrays is more than 20 dB; the single-row subarray radiation gain test is performed on the antenna of the embodiment by using a comparative gain method, and the results of simulation and actual measurement of the single-row subarray gain of the C-band array antenna of the embodiment are shown in fig. 4, where the difference between the actual measurement value and the simulated value is less than 1.2dB, and the flatness of the actual in-band gain is less than ± 0.6 dB. The phase weighting is carried out on the array antenna to realize beam forming, and the array antenna can meet +/-45-degree beam scanning under the condition of meeting the side lobe level SLL < -20dB, thereby realizing large airspace coverage and wide-angle scanning. Wherein fig. 5 is the beamforming result of the C-band array antenna of this embodiment.
Taking Ku-band array antenna as a specific embodiment, there are 6 columns of sub-arrays, and each column of sub-array includes 12 array elements. Each array element is connected with a corresponding power division network node through the feed structure, and in the feed structure, the dielectric layers are sequentially made of TLY-5 materials with the thickness of 1.508mm, TLY-5 materials with the thickness of 0.508mm and TLY-5 materials with the thickness of 0.13mm from the array element from near to far. The metalized through holes 110 are metalized through holes 110 with the radius of 0.4mm and the metalized buried holes 140 are 9 metalized buried holes 140 with the radius of 0.5mm, wherein the distance between the conductive layer and the circle center of the metalized through holes 110 is 1.4mm, the distance between the metalized buried holes 140 and the metalized through holes 110 is 1.8mm, and the central angle between the adjacent metalized buried holes 140 is 40 degrees. The vector network analyzer is used for testing the circuit characteristics of the array antenna, namely the return loss of an input end and the isolation between two adjacent columns of sub-arrays, the Ku-band array antenna circuit characteristic test of the embodiment is shown in figure 6, the relative bandwidth of S11< -10dB reaches 30%, and the isolation between two adjacent columns of sub-arrays is more than 19 dB. The antenna of the embodiment is subjected to a single-row subarray radiation gain test by using a comparative gain method, and the results of simulation and actual measurement of the single-row subarray gain of the Ku-band array antenna of the embodiment are shown in fig. 7, where the difference between an actual measurement value and an simulation value is less than 2dB, and the flatness of the actual in-band gain is less than ± 0.8 dB. The two array antennas are subjected to phase weighting to realize beam forming, and the antenna can meet +/-45-degree beam scanning under the condition of meeting the side lobe level SLL < -20dB, so that large airspace coverage and wide-angle scanning are realized. FIG. 8 shows the beamforming result of the Ku-band array antenna of this embodiment
It can be known that both types of array antennas implement a broadband design.
It is to be understood that the foregoing examples merely represent preferred embodiments of the present invention, and that the description thereof is more specific and detailed, but not intended to limit the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (10)
1. A feed structure comprising a substrate having opposed first and second surfaces; the substrate includes: the first surface and the second surface are provided with a plurality of dielectric layers in a stacked mode, and the metalized through holes penetrate through the plurality of dielectric layers and the first surface and the second surface; a plurality of conductive layers surrounding the metalized through holes and keeping a preset distance from the metalized through holes among the plurality of dielectric layers; and a plurality of metallized buried holes penetrating part of the dielectric layer and electrically connected with the conductive layer;
wherein the plurality of metalized buried vias are arranged circumferentially around the metalized via.
2. The feed structure of claim 1, wherein the circumferential arrangement is centered around the metallized via.
3. The feed structure of claim 2, wherein the plurality of metalized buried vias comprises nine metalized buried vias equally circumferentially arranged around the metalized via.
4. The feed structure of claim 1, wherein the plurality of dielectric layers include a first dielectric layer proximate to the first surface, a second dielectric layer proximate to the second surface, and a third dielectric layer disposed between the first dielectric layer and the second dielectric layer, and the conductive layers include a first conductive layer disposed between the first dielectric layer and the third dielectric layer and a second conductive layer disposed between the second dielectric layer and the third dielectric layer;
the metallized buried hole penetrates through the third dielectric layer.
5. The feed structure of claim 4, wherein the first dielectric layer, the second dielectric layer and the third dielectric layer are made of the same or different materials.
6. The feed structure of claim 5, wherein the first dielectric layer, the second dielectric layer and the third dielectric layer are made of one or more of Rogers4350, FR4 and TLY-5.
7. The feed structure of claim 4, wherein the thicknesses of the first dielectric layer, the second dielectric layer, and the third dielectric layer are the same or different.
8. The feed structure of claim 7, wherein the thickness of the first dielectric layer is greater than the thickness of the second dielectric layer.
9. An antenna comprising an antenna radiating patch, a power dividing network, and a feed structure according to any of claims 1-8, wherein the metalized via of the feed structure is electrically connected to the antenna radiating patch at the first surface thereof, and the metalized via of the feed structure is electrically connected to the power dividing network at the second surface thereof.
10. The antenna of claim 9, wherein the antenna radiating patch, the power splitting network and the feeding structure are integrated on a same PCB board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920732300.7U CN210120239U (en) | 2019-05-21 | 2019-05-21 | Feed structure and antenna |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920732300.7U CN210120239U (en) | 2019-05-21 | 2019-05-21 | Feed structure and antenna |
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| CN210120239U true CN210120239U (en) | 2020-02-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540773A (en) * | 2020-04-15 | 2021-10-22 | 苹果公司 | Electronic device with compact ultra-wideband antenna |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113540773A (en) * | 2020-04-15 | 2021-10-22 | 苹果公司 | Electronic device with compact ultra-wideband antenna |
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