CN219915446U - Test fixture for heat conduction performance of heat conduction interface material of optical module - Google Patents

Abstract

The utility model relates to the technical field of thermal testing, in particular to a testing fixture for the thermal conductivity of a thermal conduction interface material of an optical module, which comprises the following components: the device comprises a heating table, a simulated heat source, a first heat sensor, a simulated tube shell and a second heat sensor; the upper surface of the heating table is provided with a first boss, the upper surface of the first boss is provided with a first straight line slot, and the lower surface of the heating table is provided with a first groove; the upper surface of the simulation tube shell is provided with a second linear slot; the simulated heat source is placed in a first groove below the heating table, the first heat sensor is arranged on the first boss, a sample to be measured is filled in a gap between the lower surface of the simulated tube shell and the upper surface of the first boss, and the second heat sensor is arranged on the upper surface of the simulated tube shell.

Description

Test fixture for heat conduction performance of heat conduction interface material of optical module

Technical Field

The utility model relates to the technical field of thermal testing, in particular to a testing fixture for the thermal conductivity of a thermal conduction interface material of an optical module.

Background

In the optical module, a very fine rugged gap exists between the surface of the heating element and the radiating element, if the heating element and the radiating element are directly installed, the actual contact area is only 10% of the bottom area of the radiating element, and the rest is an air gap, so that the contact thermal resistance between the heating element and the radiating element is very large, the heat conduction of the heating element is seriously hindered, and finally the element is invalid.

The heat conduction interface material is widely applied to the heat management design of the optical module, the heat conduction interface material is used for filling the gap between the heating element and the heat dissipation tube shell, air in the gap is removed, a high-efficiency heat conduction channel is established, the contact thermal resistance is greatly reduced, the heat of the heating element is maximally conducted out, and the optical module is ensured not to fail due to overhigh temperature.

The thermal performance test of the conventional heat conducting material is generally to test the heat conductivity coefficient of the material, and the higher the heat conductivity coefficient is, the better the heat conductivity is. However, in practical application, the heat conduction performance of the heat conduction interface material is also affected by parameters such as thermal resistance, hardness, thickness and the like, and the heat conduction performance of the material cannot be comprehensively reflected by a single heat conduction coefficient.

In view of this, how to overcome the defects existing in the prior art, how to reproduce the application environment of the thermal interface material in the actual optical module, and accurately and effectively test the thermal performance of the thermal interface material of the optical module is a problem to be solved in the technical field.

Disclosure of Invention

The utility model aims to solve the problem of how to simulate the application environment of the heat conduction interface material in the actual optical module and accurately and effectively test the thermal performance of the heat conduction interface material of the optical module.

The utility model is realized in the following way:

the utility model provides a test fixture for the heat conduction performance of a heat conduction interface material of an optical module, which comprises: a heating table 1, a simulated heat source 2, a first thermal sensor 3, a simulated tube shell 4 and a second thermal sensor 5;

the upper surface of the heating table 1 is provided with a first boss 10, the upper surface of the first boss 10 is provided with a first straight line slot 11, and the lower surface of the heating table 1 is provided with a first groove 12;

the upper surface of the simulation tube shell 4 is provided with a second linear slot 40;

the simulated heat source 2 is placed in the first groove 12 below the heating table 1, the first heat sensor 3 is arranged in the first linear slot 11, the sample to be measured is filled in a gap between the lower surface of the simulated tube shell 4 and the upper surface of the first boss 10, and the second heat sensor 5 is arranged in the second linear slot 40.

Preferably, the test fixture further comprises a scale heat insulation block 6, a heat insulation plate 7 and a bottom plate 8, wherein the heat insulation plate 7 is arranged on the bottom plate 8, and the heating table 1 is arranged on the heat insulation plate 7;

the scale heat insulation block 6 is arranged between the heating table 1 and the simulation tube shell 4, and the heat insulation plate 7 is arranged between the heating table 1 and the bottom plate 8.

Preferably, the scale heat insulation block 6 is square annular in shape.

Preferably, the upper surface of the heat insulation plate 7 is provided with a second boss 70.

Preferably, two opposite edges of the first groove 12 are provided with a second groove 13 extending to the first end surface of the heating table 1, so as to accommodate a lead wire for supplying power to the tail of the simulated heat source 2.

Preferably, the simulated heat source 2 is a ceramic heating plate.

Preferably, the first thermal sensor 3 is a wire type T-type thermocouple, and the first thermal sensor 3 is embedded into the first linear slot 11 by using a curing glue special for the thermocouple.

Preferably, the second thermal sensor 5 is a wire-type T-type thermocouple, and the second thermal sensor 5 is embedded in the second linear slot 40 by using a curing glue dedicated to the thermocouple.

Preferably, the simulation tube shell 4 adopts No. 3 zinc alloy, the empty height of the simulation tube shell is equal to the assembly height of the heating table 1 and the heat insulation plate 7, and the surface roughness requirement of the top of the inner wall of the tube shell reaches Ra1.6.

Compared with the prior art, the embodiment of the utility model has the beneficial effects that: through the heating table 1, the simulated heat source 2 and the simulated tube shell 4, the interface material to be tested is arranged between the heating table 1 and the simulated tube shell 4, so that the test environment is more close to the application environment of the actual heat conduction interface material in the optical module; through the two thermal sensors, the temperature difference of the two thermal sensors is read to compare the heat conduction performance of the heat conduction interface materials with the same specification, so that the test result is more accurate, the test is rapid and quick, and the result is visual and clear.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is an assembly schematic diagram of a test fixture for heat conduction performance of a heat conduction interface material of an optical module according to an embodiment of the present utility model;

fig. 2 is an exploded view of a test fixture for thermal conductivity of a thermal interface material of an optical module according to an embodiment of the present utility model;

fig. 3 is a schematic diagram of a first groove on the lower surface of a heating table of a test fixture for heat conduction performance of a heat conduction interface material of an optical module according to an embodiment of the present utility model.

Detailed Description

In the description of the present utility model, the directions or positional relationships indicated by the terms "inner", "outer", "upper", "lower", etc. are based on the directions or positional relationships shown in the drawings, only for convenience of describing the present utility model, and do not require that the present utility model must be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model.

The terms "first," "second," and the like herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The embodiment of the utility model provides a test fixture for the heat conduction performance of a heat conduction interface material of an optical module, as shown in fig. 1 and 2, comprising: a heating table 1, a simulated heat source 2, a first thermal sensor 3, a simulated tube shell 4 and a second thermal sensor 5;

the upper surface of the heating table 1 is provided with a first boss 10, the upper surface of the first boss 10 is provided with a first straight line slot 11, and the lower surface of the heating table 1 is provided with a first groove 12;

specifically, the first thermal sensor 3 is a wire type T-shaped thermocouple, and the first thermal sensor 3 is buried in the first linear slot 11 through the special curing glue for the thermocouple; as shown in fig. 3, two opposite edges of the first groove 12 are provided with a second groove 13 extending to the first end surface of the heating table 1, so as to accommodate a lead wire for supplying power to the tail of the simulated heat source 2.

The upper surface of the simulation tube shell 4 is provided with a second linear slot 40; specifically, the second thermal sensor 5 is a wire-type T-type thermocouple, and the second thermal sensor 5 is embedded into the second linear slot 40 by using a curing glue dedicated for the thermocouple.

The simulated heat source 2 is placed in the first groove 12 below the heating table 1, the first heat sensor 3 is arranged in the first linear slot 11, the sample to be measured is filled in a gap between the lower surface of the simulated tube shell 4 and the upper surface of the first boss 10, and the second heat sensor 5 is arranged in the second linear slot 40.

In use, the simulated heat source 2 is used for heating to generate heat, the first heat sensor 3 is used for measuring the temperature of the lower surface of the interface material, the second heat sensor 5 is used for measuring the temperature of the upper surface of the interface material, and the heat conduction performance of the heat conduction interface materials with the same specification is compared according to the temperature difference value of the two heat sensors.

The test environment is more close to the application environment of the actual heat conduction interface material in the optical module through the heating table 1, the simulated heat source 2 and the simulated tube shell 4; through the two thermal sensors, the temperature difference of the two thermal sensors is read to compare the heat conduction performance of the heat conduction interface materials with the same specification, so that the test result is more accurate, the test is rapid and quick, and the result is visual and clear.

In order to further improve the accuracy of the test, the test fixture further comprises a scale heat insulation block 6, a heat insulation plate 7 and a bottom plate 8, wherein the heat insulation plate 7 is arranged on the bottom plate 8, and the heating table 1 is arranged on the heat insulation plate 7; the scale heat insulation block 6 is arranged between the heating table 1 and the simulation tube shell 4, and the heat insulation plate 7 is arranged between the heating table 1 and the bottom plate 8.

Wherein, the scale heat insulation block 6 is square and annular in shape, which is understood that the middle area of the scale heat insulation block 6 is hollow, and the interface material to be measured is filled in the hollow middle area of the scale heat insulation block 6; the upper surface of the heat insulating plate 7 is provided with a second boss 70, the simulated heat source 2 is arranged on the second boss 70, the second boss 70 corresponds to the first groove 12, wherein the size of the first groove 12 is slightly larger than that of the second boss 70, and the first groove 12 is used for accommodating the simulated heat source 2 and the second boss 70.

In the test of the heat conduction performance of the material of the heat conduction interface of the optical module, a certain requirement is provided for the heat conduction performance of the material of the heating platform 1, the heat conduction coefficient is a physical quantity for measuring the heat conduction performance of the material, the heat conduction coefficient is expressed by the heat conduction capacity of the material in unit area in unit time, the larger heat conduction material coefficient means that the material can transfer heat more effectively, so that the heat can be quickly transferred from one area to another area, the larger heat conduction coefficient of the heat conduction material means that the material can transfer heat more effectively, and the material can transfer more heat under the same temperature difference.

Therefore, in a specific application scenario, the heat conducting material of the heating table 1 is a material with a heat conducting coefficient greater than 401W/(m·k).

In the test of the heat conduction performance of the heat conduction interface material of the optical module, common materials for simulating the heat source 2 are a metal heating plate, a hot air gun, a hot plate, a constant temperature tank, a ceramic heating plate and the like, and according to the test requirements, the temperature range, the heating power, the stability, the control performance and other factors of the scheme provided by the embodiment of the utility model, the ceramic heating plate is the best choice. Therefore, the simulated heat source 2 is a square ceramic heating plate.

The use of ceramic heating plates as the heat source for the simulated heat source 2 has the following advantages:

1. high temperature stability: the ceramic heating plate can provide stable heating performance in a high-temperature environment. Ceramic materials are generally resistant to high temperatures, have good heat resistance and thermal cycling properties, and are excellent in high temperature heating applications.

2. And (3) uniformly heating: the ceramic heater chip can provide a relatively uniform heating profile. The surface design and the heating element layout can realize uniform heat distribution, so that the heated object can obtain uniform temperature distribution, and local overheating or cooling caused by heat concentration is avoided.

3. Fast response: the ceramic heating plate has lower thermal inertia and can quickly respond to heating requirements. They can quickly reach the desired operating temperature and remain stable, providing efficient heating performance.

4. Corrosion resistance: ceramic materials generally have good corrosion resistance and are resistant to attack by many chemicals. This makes ceramic heating plates advantageous in certain environments where corrosion resistance is required, such as heating applications in chemical laboratories or corrosive gas environments.

5. High insulation: the ceramic heating plate has good insulating property, can effectively isolate a heat source from the external environment, and reduces energy loss and electromagnetic interference.

6. Customizable: the ceramic heater chip is relatively flexible in design and manufacture and can be customized according to specific requirements. This means that the custom design can be tailored to meet the needs of a particular application, depending on the size, shape and power requirements of the heating needs.

In the test of the heat conduction performance of the heat conduction interface material of the optical module, the roughness of the inner wall of the appliance has a certain influence on the test result, and the roughness of the inner wall can cause extra heat resistance, thereby influencing the accuracy of heat conduction. When placed in a test fixture, the thermally conductive interface material has a slight gap or air layer between it and the internal walls of the fixture, which gap can cause additional thermal resistance that impedes heat transfer from the thermally conductive interface material to the test fixture. If the inner wall of the appliance is very rough, the air in the gap will more easily stay on the irregular surface, forming a heat conduction barrier, which will lead to a higher contact resistance in the test results, thus underestimating the actual heat conducting properties of the heat conducting interface material. To reduce this effect, the inner walls of the test fixture are often required to have a certain smoothness and surface quality to ensure as complete and intimate a contact between the thermally conductive interface material and the fixture as possible. The smoother inner wall surface can reduce the air gap, reduce the contact thermal resistance and improve the accuracy of the test.

In addition, the rough inner wall may also cause uneven contact pressure distribution, resulting in poor contact or localized gaps between the thermally conductive interface material and the appliance, further affecting the reliability of the test results. Therefore, for the thermal conductivity testing device of the thermal conductivity interface material, the inner wall is required to have moderate smoothness and surface quality so as to ensure accurate measurement of the thermal conductivity of the material.

In a specific application scene, the simulation tube shell 4 adopts No. 3 zinc alloy, the hollow height of the simulation tube shell is equal to the assembly height of the heat insulation plate 7 and the heating table 1, and the surface roughness requirement of the top of the inner wall of the tube shell reaches Ra1.6. Where the smaller the Ra value, the smoother the surface, the larger the Ra value, and the rougher the surface, generally Ra1.6 can be considered a relatively smooth surface, suitable for applications where a higher surface quality is required.

In addition, in the test of the heat conduction performance of the heat conduction interface material of the optical module, the heat insulation performance of the bottom plate 8 and the scale heat insulation block 6 is also one of important factors influencing the test. The lower the thermal conductivity of the base plate 8 and the scale insulation block 6 is, the following functions can be better achieved:

1. the lower the thermal conductivity of the insulating material of the bottom plate 8 of the test device, which means the poorer its ability to conduct thermal energy, reduces the thermal energy loss. Therefore, the condition that heat energy is lost from the bottom plate 8 of the testing device in the testing process can be reduced, the heat energy is concentrated in the testing area, and the testing accuracy is improved.

2. Ensuring accurate thermal resistance measurements, in thermal performance testing, the thermal conductivity of a material is typically assessed by measuring its thermal resistance. If the thermal insulation material of the bottom plate 8 of the test device has a high thermal conductivity, an additional thermal path is introduced, resulting in a deviation of the test result, which affects the accuracy of the measurement. Therefore, the thermal insulation material with lower thermal conductivity is selected to better ensure the accuracy of thermal resistance measurement.

3. Avoiding interference effects: the high thermal conductivity of the insulating material of the test device chassis 8 may introduce disturbing effects. In thermal performance testing, we typically focus on the thermal conductivity between the materials to be tested, and do not want the material of the test device chassis 8 to interfere with the test results. By selecting a thermally insulating material with a low thermal conductivity, the interference of the base plate 8 with the test results can be reduced.

Therefore, the thermal conductivity of the thermal insulation material of the bottom plate 8 is not more than 0.175W/(m·k), the thermal insulation material is square, the thermal insulation material of the scale thermal insulation block 6 is a rigid thermal insulation material, the thermal conductivity of the thermal insulation material is also not more than 0.175W/(m·k), and the thermal insulation material with lower thermal conductivity is selected as the bottom plate 8 of the testing device, so that the thermal energy loss can be reduced, the accuracy of thermal resistance measurement can be ensured, the interference effect can be avoided, and the reliability and the accuracy of the thermal conductivity test of the thermal conduction interface material can be improved.

In order to ensure the stability of the heat conduction interface material heat conduction performance test and protect each structure of the testing device, in the preferred scheme, the testing fixture further comprises an outer cover, the outer cover is made of transparent glass, a plurality of uniform steady flow small holes are formed in the upper wall surface of the outer cover, and the purpose of the steady flow small holes is to design:

1. and a cooling medium (such as gas or liquid) can be introduced to cool the heat source or the thermal interface material under test through the small holes formed in the upper wall surface of the outer cover. These apertures allow the cooling medium to enter and contact the heat source or thermal interface material to absorb and remove heat therefrom, thereby achieving effective cooling.

2. Constant flow, by designing appropriate orifice shapes and arrangements, can create a uniform and stable flow of cooling fluid, which helps ensure that the cooling medium passes through the heat source or thermal interface material at a uniform and stable rate throughout the test process, thereby providing repeatable and reliable test results.

3. The small holes may help to reduce the temperature of the heat source or thermal interface material by introducing a cooling fluid to reduce the thermal interface temperature. This is important for temperature control and thermal management in thermal performance testing, and can prevent overheating of the heat source and maintain stable test conditions.

4. The heat transfer efficiency is improved, and the small holes help to improve the heat transfer efficiency by circulating and transferring the cooling fluid. The cooling fluid enters the contact area through the small holes to exchange heat with the heat source or the thermal interface material, so that heat conduction and dispersion are accelerated, and the heat conduction effect is improved.

In summary, the design of forming the uniform flow stabilizing small holes on the outer cover can effectively cool the heat source or the thermal interface material, provide stable cooling fluid, and promote the heat conduction process so as to realize accurate and reliable thermal performance test.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims (10)

1. The utility model provides a test fixture of optical module heat conduction interface material heat conductivility which characterized in that includes: the device comprises a heating table (1), a simulated heat source (2), a first heat sensor (3), a simulated tube shell (4) and a second heat sensor (5);

the upper surface of the heating table (1) is provided with a first boss (10), the upper surface of the first boss (10) is provided with a first linear slot (11), and the lower surface of the heating table (1) is provided with a first groove (12);

the upper surface of the simulation tube shell (4) is provided with a second linear slot (40);

the simulated heat source (2) is arranged in a first groove (12) below the heating table (1), the first heat sensor (3) is arranged in the first linear thin groove (11), a sample to be measured is filled in a gap between the lower surface of the simulated tube shell (4) and the upper surface of the first boss (10), and the second heat sensor (5) is arranged in the second linear thin groove (40).

2. The test fixture for the heat conduction performance of the heat conduction interface material of the optical module according to claim 1, further comprising a scale heat insulation block (6), a heat insulation plate (7) and a bottom plate (8), wherein the heat insulation plate (7) is arranged on the bottom plate (8), and the heating table (1) is arranged on the heat insulation plate (7);

the scale heat insulation block (6) is arranged between the heating table (1) and the simulation tube shell (4), and the heat insulation plate (7) is arranged between the heating table (1) and the bottom plate (8).

3. The clamp for testing the heat conduction performance of the heat conduction interface material of the optical module according to claim 2, wherein the scale heat insulation block (6) is square annular in shape.

4. The clamp for testing the heat conduction performance of the heat conduction interface material of the optical module according to claim 2, wherein a second boss (70) is arranged on the upper surface of the heat insulation plate (7).

5. The fixture for testing the thermal conductivity of the thermal interface material of the optical module according to any one of claims 1 to 4, wherein the upper surface roughness of the first boss (10) is smaller than ra1.6.

6. The fixture for testing the thermal conductivity of the thermal interface material of the optical module according to any one of claims 1 to 4, wherein two opposite edges of the first groove (12) are provided with a second groove (13) extending to the first end face of the heating table (1) for accommodating a lead wire for supplying power to the tail of the simulated heat source (2).

7. The fixture for testing the heat conduction performance of the heat conduction interface material of the optical module according to any one of claims 1 to 4, wherein the simulated heat source (2) is a ceramic heating plate.

8. The fixture for testing the heat conduction performance of the heat conduction interface material of the optical module according to any one of claims 1 to 4, wherein the first heat sensor (3) is a wire type T-type thermocouple, and the first heat sensor (3) is buried in the first linear slot (11) through a special curing glue for the thermocouple.

9. The fixture for testing the thermal conductivity of the thermal interface material of the optical module according to any one of claims 1 to 4, wherein the second thermal sensor (5) is a wire-type T-type thermocouple, and the second thermal sensor (5) is embedded into the second linear slot (40) by using a curing glue dedicated for the thermocouple.

10. The fixture for testing the heat conduction performance of the heat conduction interface material of the optical module according to claim 2, wherein the simulation tube shell (4) is made of zinc alloy No. 3, the empty height of the simulation tube shell is equal to the assembly height of the heating table (1) and the heat insulation plate (7), and the surface roughness of the top of the inner wall of the tube shell is smaller than Ra1.6.