CN219697986U - Heat dissipation type circuit board - Google Patents
Heat dissipation type circuit board Download PDFInfo
- Publication number
- CN219697986U CN219697986U CN202320471716.4U CN202320471716U CN219697986U CN 219697986 U CN219697986 U CN 219697986U CN 202320471716 U CN202320471716 U CN 202320471716U CN 219697986 U CN219697986 U CN 219697986U
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- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- plate
- heat
- board body
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 74
- 238000009413 insulation Methods 0.000 claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000003068 static effect Effects 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat dissipation type circuit board, comprising: a circuit board body; the periphery of the circuit board body is provided with a plurality of heat dissipation components, the heat dissipation components are arranged on the second heat dissipation plate, and the heat dissipation components and the second heat dissipation plate are made of metal; an insulating plate, comprising: the outer frame, a plurality of even edges the interval sets up the rib, form in bar through-hole between the rib and set up in the locking hole in insulation board four corners, the second heating panel sets up in the insulation board. Through the arrangement, the heat dissipation capacity of the circuit board body is effectively improved, the heat dissipation function is improved, and the service life of the circuit board is correspondingly prolonged.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a heat dissipation type circuit board.
Background
The circuit board is used as a carrier for electric connection of the electronic components, and a plurality of electronic components are arranged on the surface of the circuit board. Along with the increasing functions of various electronic devices, the number of electronic components in a unit area of a circuit board is continuously increased, and the performance is continuously improved. The problem of heat dissipation of circuit boards is becoming more and more serious.
The traditional circuit board adopts materials such as glass fiber cloth, ceramic and the like as a substrate, has lower heat conductivity coefficient and extremely limited heat dissipation performance, is unfavorable for the development of a high integrated circuit board, and can also increase the ageing speed of electronic elements.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a heat dissipation type circuit board which can effectively solve the technical problems.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
a heat dissipating circuit board, comprising:
a circuit board body;
the periphery of the circuit board body is provided with a plurality of heat dissipation components, the heat dissipation components are arranged on the second heat dissipation plate, and the heat dissipation components and the second heat dissipation plate are made of metal;
an insulating plate, comprising: the outer frame, a plurality of even edges the interval sets up the rib, form in bar through-hole between the rib and set up in the locking hole in insulation board four corners, the second heating panel sets up in the insulation board.
According to the technical scheme, the circuit board is mounted in the equipment or the machine case by using the insulating plate, the through holes which are matched with the locking holes are formed in the equipment or the machine case, the insulating plate is fixedly mounted by using the bolts or the locking pins, the second radiating plate is bonded or connected to the insulating plate by using the insulating rivets, the circuit board body is connected to the supporting plate by bonding or riveting, and corresponding riveting through holes are formed in the supporting plate, the circuit board body, the insulating plate and the second radiating plate under the condition of rivet connection.
When the circuit board works, heat generated by the circuit board body is conducted to the heat radiating assembly on the periphery, the heat radiating area is increased through the heat radiating assembly, in addition, the heat radiating assembly further conducts the second heat radiating plate, the heat radiating area is further increased through the cooperation of the second heat radiating plate and the heat radiating assembly, the heat radiating efficiency is increased, static electricity or current of equipment or a machine case can be prevented from damaging the circuit board through the arranged insulating plate, meanwhile, the insulating plate is made of insulating rubber or plastic, the buffering effect can be achieved, and the second heat radiating plate can be further used for preventing static electricity through external ground wires.
As a preferred aspect of the present utility model, the heat dissipating assembly includes: the circuit board comprises a circuit board body, a plurality of radiating gaps arranged on the periphery of the circuit board body, a first radiating plate embedded in the radiating gaps, and a support plate arranged on the first radiating plate and supported at the bottom of the circuit board, wherein a plurality of first fins are arranged on the top of the first radiating plate at intervals, and a circuit is not arranged at the radiating gaps of the circuit board body.
According to the technical scheme, heat of the circuit board is dissipated through the first heat dissipation plate and the first fins, the supporting plate and the first heat dissipation plate are integrally formed, the supporting plate is used for bearing pressure of the periphery of the circuit board body, the heat dissipation notch of the circuit board can be coated with the heat conduction metal skin, and silicone grease can be coated between the metal skin and the supporting plate to increase heat conduction performance.
As a preferable mode of the utility model, the bottom of the second heat dissipation plate is provided with second fins, and the second fins are arranged at intervals along the length direction of the second heat dissipation plate.
According to the technical scheme, the first fins and the second fins are parallel, and when the fan is arranged on the equipment or the case, air can pass through gaps between the first fins and the second fins, so that the convection heat dissipation efficiency is improved.
As a preferred solution of the present utility model, the materials of the first heat dissipation plate, the first fin, the second heat dissipation plate, the second fin and the supporting plate are: copper and copper alloy, stainless steel, or aluminum and aluminum alloy.
As a preferable scheme of the utility model, a supporting component is arranged between the circuit board body and the second radiating plate.
The technical scheme is realized, and the compression resistance of the circuit board body is improved.
As a preferred aspect of the present utility model, the support assembly includes: the expansion plate is arranged on the support column of the second heat dissipation plate, connected with the support column and supported on the circuit board body.
According to the technical scheme, when the circuit board is pressed, the circuit board is supported through the support columns, and the expansion plate is used for increasing the support area and reducing the pressure intensity.
As a preferred embodiment of the present utility model, the support column is made of a metal material, and the expansion plate is made of an insulating material.
The technical scheme is realized, the support column is a copper column, and the expansion plate is made of insulating plastic or rubber.
In summary, the utility model has the following beneficial effects:
according to the heat dissipation type circuit board, when the circuit board works, heat generated by the circuit board body is conducted to the heat dissipation assembly on the periphery, the heat dissipation area is increased through the heat dissipation assembly, in addition, the heat is conducted to the second heat dissipation plate through the heat dissipation assembly, the heat dissipation area is further increased through the cooperation of the second heat dissipation plate and the heat dissipation assembly, so that the heat dissipation efficiency is increased, static electricity or current of equipment or a machine case can be prevented from damaging the circuit board through the arranged insulating plate, meanwhile, the insulating plate is made of insulating rubber or plastic, the buffering effect can be achieved, the second heat dissipation plate can be used for preventing static electricity through the external ground wire, the effective improvement of the heat dissipation capacity of the circuit board body is achieved, the heat dissipation function is improved, and the service life of the circuit board is correspondingly prolonged.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic structural view of an insulating plate according to the present utility model.
Fig. 3 is a schematic structural diagram of a second heat dissipating plate according to the present utility model.
Fig. 4 is a schematic structural view of a heat dissipation notch portion of the present utility model.
Fig. 5 is a schematic structural view of a pallet portion according to the present utility model.
Corresponding part names are indicated by numerals and letters in the drawings:
1. an insulating plate; 2. a circuit board body; 3. a first heat dissipation plate; 4. a first fin; 5. a support column; 6. an expansion plate; 7. a second heat dissipation plate; 8. a locking hole; 9. a support pad; 10. a supporting plate; 11. an outer frame; 12. a rib; 13. a bar-shaped through hole; 14. a second fin; 15. and a heat dissipation notch.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
As shown in fig. 1-5, a heat dissipation type circuit board includes:
a circuit board body 2;
the periphery of the circuit board body 2 is provided with a plurality of heat dissipation components, the heat dissipation components are arranged on the second heat dissipation plate 7, and the heat dissipation components and the second heat dissipation plate 7 are made of metal;
an insulating plate 1, comprising: the outer frame 11, a plurality of even rib 12 that set up along outer frame 11 width direction interval, the bar through-hole 13 that forms between rib 12 and set up in the locking hole 8 in insulation board 1 four corners, the second heating panel 7 sets up in insulation board 1.
Wherein, the heat dissipation subassembly includes: the circuit board comprises a plurality of radiating gaps 15 formed in the periphery of the circuit board body 2, a first radiating plate 3 embedded in the radiating gaps 15, a supporting plate 10 arranged on the first radiating plate 3 and supported at the bottom of the circuit board, a plurality of first fins 4 arranged at the top of the first radiating plate 3 at intervals, a circuit is not arranged at the radiating gaps 15 of the circuit board body 2, heat of the circuit board is radiated through the first radiating plate 3 and the first fins 4, the supporting plate 10 and the first radiating plate 3 are integrally formed, the supporting plate 10 is used for bearing the pressure of the periphery of the circuit board body 2, the radiating gaps 15 of the circuit board can be coated with heat-conducting metal sheets, and silicone grease can be smeared between the metal sheets and the supporting plate 10 to increase heat conducting performance.
Further, the bottom of the second heat dissipation plate 7 is provided with second fins 14, the second fins 14 are arranged at intervals along the length direction of the second heat dissipation plate 7, the first fins 4 and the second fins 14 are parallel, and when the equipment or the case is provided with a fan, air can pass through gaps between the first fins 4 and the second fins 14, so that the convection heat dissipation efficiency is improved.
The materials of the first heat dissipation plate 3, the first fins 4, the second heat dissipation plate 7, the second fins 14 and the supporting plate 10 are as follows: copper and one of copper alloy, stainless steel, or aluminum and aluminum alloy is selected and used as copper in the present embodiment.
A supporting component is further arranged between the circuit board body 2 and the second heat dissipation plate 7, so that the compression resistance of the circuit board body 2 is improved.
The support assembly includes: the expansion board 6 is arranged on the support column 5 of the second heat dissipation plate 7, connected to the support column 5 and supported on the circuit board body 2, and is used for increasing the support area and reducing the pressure intensity by supporting through the support columns 5 when the circuit board is pressed.
The support column 5 is made of a metal material, the expansion plate 6 is made of an insulating material, the support column 5 is a copper column, and the expansion plate 6 is made of insulating plastic or rubber.
The circuit board is installed in the equipment or the chassis by using the insulating board 1, through holes which are matched with the locking holes 8 are formed in the equipment or the chassis, the insulating board 1 is fixedly installed by using bolts or locking pins, the second heat dissipation plate 7 is bonded or connected to the insulating board 1 by insulating rivets, the circuit board body 2 is connected to the supporting board 10 by bonding or riveting, and of course, corresponding riveting through holes are formed in the supporting board 10, the circuit board body 2, the insulating board 1 and the second heat dissipation plate 7 in the case of rivet connection, and annular supporting pads 9 are arranged on the locking holes 8 and used for protecting the insulating board 1.
At circuit board during operation, the heat conduction that circuit board body 2 produced to the radiator unit of week side, increase heat radiating area through radiator unit, in addition, radiator unit still with heat conduction second heating panel 7, thereby further increase heat radiating area through second heating panel 7 and radiator unit cooperation increases radiating efficiency, through the insulation board 1 of setting, can avoid static or the electric current damage circuit board of equipment or quick-witted case, the material of insulation board 1 is insulating rubber or plastics simultaneously, can play the effect of buffering, second heating panel 7 can also external ground wire in order to prevent static.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A heat dissipation circuit board, comprising:
a circuit board body;
the periphery of the circuit board body is provided with a plurality of heat dissipation components, the heat dissipation components are arranged on the second heat dissipation plate, and the heat dissipation components and the second heat dissipation plate are made of metal;
an insulating plate, comprising: the outer frame, a plurality of even edges the interval sets up the rib, form in bar through-hole between the rib and set up in the locking hole in insulation board four corners, the second heating panel sets up in the insulation board.
2. The heat dissipating circuit board of claim 1, wherein said heat dissipating assembly comprises: the circuit board comprises a circuit board body, a plurality of radiating gaps arranged on the periphery of the circuit board body, a first radiating plate embedded in the radiating gaps, and a supporting plate arranged on the first radiating plate and supported at the bottom of the circuit board, wherein a plurality of first fins are arranged on the top of the first radiating plate at intervals.
3. The heat dissipation circuit board according to claim 1, wherein the bottom of the second heat dissipation plate is provided with second fins, and the second fins are arranged at intervals along the length direction of the second heat dissipation plate.
4. The heat dissipation circuit board according to claim 2, wherein the first heat dissipation plate, the first fins, the second heat dissipation plate, the second fins and the supporting plate are made of: copper and copper alloy, stainless steel, or aluminum and aluminum alloy.
5. The heat dissipating circuit board of claim 4, wherein a support assembly is further disposed between the circuit board body and the second heat dissipating plate.
6. The heat dissipating circuit board of claim 5, wherein said support assembly comprises: the expansion plate is arranged on the support column of the second heat dissipation plate, connected with the support column and supported on the circuit board body.
7. The heat dissipating circuit board of claim 6, wherein said support posts are made of a metallic material and said expansion plate is made of an insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320471716.4U CN219697986U (en) | 2023-03-13 | 2023-03-13 | Heat dissipation type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320471716.4U CN219697986U (en) | 2023-03-13 | 2023-03-13 | Heat dissipation type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219697986U true CN219697986U (en) | 2023-09-15 |
Family
ID=87938321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320471716.4U Active CN219697986U (en) | 2023-03-13 | 2023-03-13 | Heat dissipation type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219697986U (en) |
-
2023
- 2023-03-13 CN CN202320471716.4U patent/CN219697986U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |