CN219533742U - Auxiliary radiator for power supply main board - Google Patents

Abstract

The utility model relates to the technical field of computer main board accessories, in particular to an auxiliary radiator for a power supply main board, which comprises a radiator, radiating fins, a radiating fan and a plurality of connecting fixing pieces, wherein the radiator is of an inverted unsealed conical structure, the lower end of the radiator is connected to the main board, the radiating fins are arranged on the inner side of the radiator, the radiating fins are led out from the lower end to the inner side obliquely upwards to form a plurality of connecting fixing pieces to a plurality of corners of the radiating fins, the radiating fan is fixedly arranged on the upper end of the inner side of the radiator, and the radiating fan is electrically connected with a power supply of a computer. The utility model provides an auxiliary radiator for a power supply main board, which increases the air flow rate by arranging a conical structure, adopts the combination of a radiator body and radiating fins for radiating, has good radiating effect, compact structure and small occupied space, can still radiate when an external fan fails, and has strong practicability.

Description

Auxiliary radiator for power supply main board

Technical Field

The utility model relates to the technical field of computer main board accessories, in particular to an auxiliary radiator of a power supply main board.

Background

With the development of modern technology and the increasing functions of computer mainboards, the heating problem is more and more serious under high-load operation, such as the problem that computer crashes, blue screens or burned parts are easily caused by overheating.

According to chinese patent publication No. CN217543780U, publication No. 2022, 10 and 04, which discloses a computer motherboard radiator convenient to detach, the length of the radiator is changed to accommodate different size motherboards by providing a fan, a connection post and a connection sleeve, and by splicing a plurality of radiating boxes together, but the problem of radiating individual components on the motherboard, such as the problem of radiating mos devices (MOSFET metal-oxide semiconductor field effect transistors), is not considered, so we propose a power motherboard auxiliary radiator.

Disclosure of Invention

In order to solve the above technical problems, an objective of the present utility model is to provide an auxiliary radiator for a power motherboard.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a power supply main board auxiliary radiator, its includes radiator, fin, heat dissipation fan and a plurality of connection mounting, the radiator is for the non-closed toper structure of inversion and lower extreme connection on the mainboard, the radiator inboard is provided with the fin, the radiator is followed the lower extreme and is inwards drawn forth a plurality of connection mounting to a plurality of angle of fin to inboard oblique upward, the heat dissipation fan is fixed to be set up at the inboard upper end of radiator, and the heat dissipation fan carries out electric connection with the power of computer.

Further, a heat conduction silica gel pad is arranged on the lower side of the radiating fin.

Further, a plurality of upper radiating fins are arranged on the upper side of the radiating fin.

Further, the plurality of radiating fins are equidistantly arranged.

Further, a plurality of vent holes are formed in the side face of the heat radiation body.

Further, the heat radiator and the heat radiating fin are made of aluminum.

Further, the heat radiation body is provided with a mounting hole, and the heat radiation fan is mounted in the mounting hole.

Further, the heat radiation body is arranged to be of a cavity structure penetrating up and down.

The utility model has the beneficial effects that: the utility model provides an auxiliary radiator for a power supply main board, which increases the air flow rate by arranging a conical structure, adopts the combination of a radiator body and radiating fins for radiating, has good radiating effect, compact structure and small occupied space, can still radiate when an external fan fails, and has strong practicability.

Drawings

Fig. 1 is a side view of the present utility model.

Fig. 2 is a top view of the present utility model.

Reference numerals illustrate:

1. a heat sink; 2. a heat sink; 3. connecting a fixing piece; 4. a heat dissipation fan; 5. a main board; 6. a thermally conductive silicone pad; 7. a heat radiation fin; 8. a vent hole; 9. mos devices.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-2, the auxiliary radiator for a power supply main board provided by the utility model comprises a radiator 1, a radiating fin 2, a radiating fan 4 and a plurality of connecting fixing pieces 3, wherein the radiator 1 is of an inverted unsealed conical structure, the lower end of the radiator is welded on a main board 5, when the flow rate is the same, the flow rate and the flow cross section area of the bottom of the conical structure are opposite, so that the flow rate can be increased, the radiating effect is better, the unsealed structure is convenient for quick outflow of gas, the radiating fin 2 is arranged on the inner side of the radiator 1, the heat dissipation can be further increased, the radiator 1 is led out from the lower end to the inner side obliquely upwards to four corners of the radiating fin 2, so that the radiating fin 2 is fixed, and when the radiator 2 is fixed along with the radiator 2 contacts with a mos device 9, the radiating fan 4 is fixed on the inner side upper end of the radiator 1, the radiating fan 4 is electrically connected with a power supply of a computer, the computer is started along with the starting of the computer, the heat generated during use is conducted through the radiating fin 2 and the radiating fan 1, the heat is blown out of the radiator 2 and the radiator fan 4 along with the time, and the heat is blown out of the inside of the main board is stable, and the main board is blown out of the radiator through the radiator, and the inside the main board is stable.

Referring to fig. 1, a radiator 1 with an inverted unsealed tapered structure means that the radiator 1 is tapered, and a notch is disposed along an axial extension of the radiator 1.

Referring to fig. 1, a heat-conducting silica gel pad 6 is installed on the lower side of the heat sink 2, and the heat-conducting silica gel pad 6 is located between the heat sink 2 and the mos device 9, so that on one hand, the mos device 9 on the computer motherboard 5 can be buffered and protected, and on the other hand, the heat-conducting speed can be increased, and the heat dissipation efficiency can be improved.

Referring to fig. 1, a plurality of upper heat dissipation fins 7 are disposed on the upper side of the heat dissipation plate 2, and the heat dissipation fins 7 increase the heat dissipation surface area, so that the heat dissipation effect is better.

Referring to fig. 1, the heat dissipation fins 7 are equidistantly arranged, so as to be beneficial to uniformly dissipating heat and avoid local overheating.

Referring to fig. 1, a plurality of ventilation holes 8 are punched on the side of the heat sink 1, so as to effectively improve ventilation and exhaust effects.

Referring to fig. 1, the heat sink 1 and the heat sink 2 are preferably made of aluminum, which has light weight, good heat conduction and oxidation resistance, and can dissipate heat better.

Referring to fig. 1, the heat dissipating body 1 is provided with a mounting hole, and the heat dissipating fan 4 is mounted in the mounting hole, so that the heat dissipating fan 4 is fixed on the heat dissipating body 1 to work.

Referring to fig. 1-2, the heat dissipation body 1 is configured as a cavity structure penetrating from top to bottom, so that the external cool air of the heat dissipation body 1 is easier to enter, and heat dissipation is accelerated.

All technical features in the embodiment can be freely combined according to actual needs.

The foregoing embodiments are preferred embodiments of the present utility model, and in addition, the present utility model may be implemented in other ways, and any obvious substitution is within the scope of the present utility model without departing from the concept of the present utility model.

Claims (8)

1. The utility model provides a power motherboard auxiliary radiator which characterized in that: the heat sink is of an inverted non-closed conical structure, the lower end of the heat sink is connected to the main board, the heat sink is arranged on the inner side of the heat sink, the heat sink obliquely upwards leads out a plurality of connecting fixing pieces to a plurality of corners of the heat sink from the lower end to the inner side, the heat sink fan is fixedly arranged on the upper end of the inner side of the heat sink, and the heat sink fan is electrically connected with a power supply of a computer.

2. The auxiliary radiator for a power supply motherboard according to claim 1, wherein: and a heat conduction silica gel pad is arranged on the lower side of the radiating fin.

3. The auxiliary radiator for a power supply motherboard according to claim 1, wherein: the upper side of the radiating fin is provided with a plurality of upper radiating fins.

4. A power motherboard auxiliary heat sink as recited in claim 3 wherein: the heat dissipation fins are equidistantly arranged.

5. A power motherboard auxiliary heat sink as recited in claim 3 wherein: the side surface of the heat radiation body is provided with a plurality of ventilation holes.

6. The auxiliary radiator for a power supply motherboard according to claim 1, wherein: the heat radiator and the heat radiating fin are made of aluminum.

7. The auxiliary radiator for a power supply motherboard according to claim 1, wherein: the radiator is provided with a mounting hole, and the radiating fan is mounted in the mounting hole.

8. The auxiliary radiator for a power supply motherboard according to claim 1, wherein: the heat radiation body is arranged to be of a cavity structure penetrating up and down.