CN219415277U - Semiconductor water chilling unit - Google Patents
Semiconductor water chilling unit Download PDFInfo
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- CN219415277U CN219415277U CN202223465952.XU CN202223465952U CN219415277U CN 219415277 U CN219415277 U CN 219415277U CN 202223465952 U CN202223465952 U CN 202223465952U CN 219415277 U CN219415277 U CN 219415277U
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- water
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- cooling plate
- heat dissipation
- water inlet
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Abstract
The utility model discloses a semiconductor water chilling unit. Comprising the following steps: the semiconductor refrigeration module consists of a heat dissipation rib, a semiconductor refrigeration sheet and a water cooling plate, wherein the semiconductor refrigeration sheet is arranged between the water cooling plate and the heat dissipation rib, the cold end of the semiconductor refrigeration sheet is clung to the water cooling plate, the heat dissipation end is clung to the heat dissipation rib, and the water inlet of the water cooling plate is connected with the water outlet of the water pump; the water tank is arranged at the front part of the unit, and the water outlet is connected with the water inlet of the water pump; the water outlet of the miniature water pump is connected with the water inlet of the water cooling plate; the four radiating fans on the unit shell are respectively positioned at the front two and the back two of the unit. The beneficial effects of the utility model are as follows: the structure is compact, the occupied space is small, no refrigerant is needed, the environment is harmless, the running load of the water chiller is automatically adjusted through the temperature sensor arranged on the water inlet pipeline, so that the water temperature is accurately controlled, and the water chiller has the advantages of low vibration and low noise compared with the vapor compression type water chiller.
Description
Technical Field
The utility model relates to a refrigerating device, in particular to a semiconductor water chilling unit.
Background
The semiconductor water chiller is a novel refrigeration device. The semiconductor element is adopted, and when the voltage of the positive electrode and the negative electrode is applied, heat flows from the low-temperature side to the high-temperature side through the Peltier effect of the semiconductor material, so that the refrigerating effect is realized. The refrigerating effect of the semiconductor water chiller mainly depends on the thermoelectric performance, the material contact area, the material thickness and other factors of the semiconductor element material.
The existing water chiller for controlling the temperature of the X-ray tube and the X-ray induction lamp is mostly a vapor compression water chiller, the circulating cooling liquid of the X-ray tube is cooled by heat exchange with low-temperature refrigerant gas, and once refrigerant leakage occurs in a medical space with precision of an X-ray tube using field Jing Duowei, even if environment-friendly refrigerant is used, certain influence is generated on patients and medical environments. And secondly, as the main components of the vapor compression type water chilling unit are mainly compressors, evaporators, condensers and the like and related pipelines are connected with each other to occupy a relatively large space, the size of the unit is relatively large, and the volume is not compact enough. And the relative movement of the moving parts inside the compressor results in greater vibration and noise.
The present utility model has been made in view of the above-mentioned circumstances.
Disclosure of Invention
The utility model aims to provide a semiconductor water chiller, which has the advantages of compact structure, small occupied space, no need of refrigerant, no harm to the environment, and low vibration and noise compared with vapor compression, and can automatically adjust the running load of the water chiller through a temperature sensor arranged on a water inlet pipeline so as to achieve the purpose of accurately controlling the water temperature.
In order to achieve the above purpose, the present utility model adopts the following technical scheme that:
the semiconductor refrigeration module consists of a heat dissipation rib, a semiconductor refrigeration sheet and a water cooling plate, wherein the semiconductor refrigeration sheet is arranged between the water cooling plate and the heat dissipation rib, the cold end of the semiconductor refrigeration sheet is clung to the water cooling plate, the heat dissipation end is clung to the heat dissipation rib, and the water inlet of the water cooling plate is connected with the water supply port of the water pump; the water tank is arranged at the front part of the unit, and the water outlet is connected with the water inlet of the water pump; the water outlet of the miniature water pump is connected with the water inlet of the water cooling plate; the four radiating fans on the unit shell are respectively positioned at the front two and the back two of the unit; the unit water inlet pipe joint and the unit water outlet pipe joint are positioned at the right rear side of the unit, one end of the water inlet pipe joint is connected with a heat source, the other end of the water inlet pipe joint is connected with a water inlet of the water tank, one end of the water outlet pipe joint is connected with the heat source, and the other end of the water outlet pipe joint is connected with a water outlet of the water cooling plate and is connected with a stainless steel hose.
Preferably, the water outlet of the water tank is connected with the water inlet of the water pump, and water in the water tank is supplied to the water pump through the action of gravity, so that the water pump is prevented from idling.
Preferably, the four heat dissipation fans are arranged in the same direction, air is taken in from the front of the unit, heat is taken away by sweeping the heat dissipation fins, and the heat is discharged from the rear of the unit.
The beneficial effects of the utility model are as follows: the structure is compact, the occupied space is small, no refrigerant is needed, the environment is harmless, the running load of the water chiller is automatically adjusted through the temperature sensor arranged on the water inlet pipeline, so that the water temperature is accurately controlled, and the water chiller has the advantages of low vibration and low noise compared with the vapor compression type water chiller.
Drawings
Fig. 1 is a structural view of a semiconductor refrigeration module according to the present utility model.
Fig. 2 is a system diagram of an inventive semiconductor chiller.
Fig. 3 is a structural diagram of the semiconductor water chiller of the present utility model.
Detailed Description
The utility model is described in further detail below with reference to the drawings to enable those skilled in the art to practice the same and to refer to the description.
It will be understood that terms, such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or other elements or groups thereof.
As shown in fig. 1-3, in order to achieve the above object, the present utility model adopts the following technical solutions, including:
in the semiconductor refrigeration module, as one preferable example, the semiconductor refrigeration sheet 112 is disposed between the water cooling plate 111 and the heat dissipation rib 113, the cold end of the semiconductor refrigeration sheet 112 is tightly attached to the water cooling plate 111, the heat dissipation end is tightly attached to the heat dissipation rib 113, and the water inlet 123 of the water cooling plate is connected with the water supply port 122 of the water pump. As a further preferred mode, when the water chiller is in operation, the cold end of the refrigerating plate 112 transfers cold energy to water flowing in the water cooling plate 111, and heat generated at the hot end of the semiconductor refrigerating plate 112 is dissipated by the heat dissipation fins 113.
In another embodiment, the method further comprises: a water tank 116 provided in the front of the unit, preferably, a water tank water outlet 120 is connected to a water pump water inlet 121, and water in the water tank 116 is supplied to the water pump 115 by gravity, thereby preventing the water pump 115 from idling.
In another embodiment, the method further comprises: the miniature water pump 115, the water pump water outlet 122 is connected with the water inlet 123 of the water cooling plate, as a preference, the miniature water pump 115 pumps the water in the water tank 116 into the water cooling plate 111 to provide enough power for water circulation;
in another embodiment, the method further comprises: the unit water inlet pipe joint 125 and the unit water outlet pipe joint 118 are positioned at the right rear side of the unit, one end of the water inlet pipe joint 125 is connected with a heat source, the other end is connected with a water inlet 119 of a water tank, one end of the water outlet pipe joint 118 is connected with the heat source, and the other end is connected with a water outlet of the water cooling plate 123, and the water outlet pipe joint are all connected by adopting stainless steel hoses.
In another embodiment, the method further comprises: the cooling fans 114, four cooling fans 114 on the unit housing are respectively located at the front two and the rear two of the unit. The four heat dissipation fans are arranged in the same direction, air is taken in from the front of the unit, and heat is taken away by sweeping the heat dissipation fins 113 and is discharged from the rear of the unit.
In summary, the semiconductor water chiller provided by the utility model has the advantages of being capable of accurately controlling water temperature, no refrigerant, no harm to environment and the like, and the running load of the water chiller is automatically adjusted by collecting the temperature of circulating water through the temperature sensor 117 arranged on the water inlet pipeline of the semiconductor water chiller, so that the semiconductor water chiller has the advantages of low vibration and low noise compared with the traditional vapor compression refrigeration.
Although embodiments of the present utility model have been disclosed above, it is not limited to the details and embodiments shown and described, it is well suited to various fields of use for which the utility model would be readily apparent to those skilled in the art, and accordingly, the utility model is not limited to the specific details and illustrations shown and described herein, without departing from the general concepts defined in the claims and their equivalents.
Claims (3)
1. A semiconductor chiller, comprising: the semiconductor refrigeration module consists of a heat dissipation fin, a semiconductor refrigeration sheet and a water cooling plate, wherein the semiconductor refrigeration sheet is arranged between the water cooling plate and the heat dissipation fin, the cold end of the semiconductor refrigeration sheet is clung to the water cooling plate, the heat dissipation end is clung to the heat dissipation fin, the water inlet of the water cooling plate is connected with the water supply port of the water pump, and the water outlet of the water cooling plate is connected with the water outlet of the unit; the water tank is arranged at the front part of the unit, the water inlet of the water tank is connected with the water inlet of the unit, and the water outlet of the water tank is connected with the water inlet of the water pump; the water outlet of the miniature water pump is connected with the water inlet of the water cooling plate; the four radiating fans on the unit shell are respectively positioned at the front two and the back two of the unit; the unit water inlet pipe joint and the unit water outlet pipe joint are positioned at the right rear side of the unit, one end of the water inlet pipe joint is connected with a heat source, the other end of the water inlet pipe joint is connected with a water inlet of the water tank, one end of the water outlet pipe joint is connected with the heat source, and the other end of the water outlet pipe joint is connected with a water outlet of the water cooling plate and is connected with a stainless steel hose.
2. The semiconductor water chiller of claim 1, further comprising: the water tank, its delivery port is connected with the water pump water inlet, and the water in the water tank passes through gravity effect and supplies water for the water pump, prevents that the water pump from taking place idle running.
3. The semiconductor water chiller of claim 1, further comprising: the four heat dissipation fans are arranged in the same direction, air is introduced from the front of the unit, and heat is taken away by sweeping the heat dissipation fins and is discharged from the rear of the unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223465952.XU CN219415277U (en) | 2022-12-26 | 2022-12-26 | Semiconductor water chilling unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223465952.XU CN219415277U (en) | 2022-12-26 | 2022-12-26 | Semiconductor water chilling unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219415277U true CN219415277U (en) | 2023-07-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223465952.XU Active CN219415277U (en) | 2022-12-26 | 2022-12-26 | Semiconductor water chilling unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219415277U (en) |
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2022
- 2022-12-26 CN CN202223465952.XU patent/CN219415277U/en active Active
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