CN219178484U

CN219178484U - Distributed flexible sensor, distributed sensing system and electronic equipment

Info

Publication number: CN219178484U
Application number: CN202320162436.5U
Authority: CN
Inventors: 王梓幸; 罗艳; 黄国伟
Original assignee: Shanghai Yudi Intelligent Technology Co ltd
Current assignee: Nanjing Yudi Intelligent Technology Co.,Ltd.
Priority date: 2023-01-18
Filing date: 2023-01-18
Publication date: 2023-06-13
Anticipated expiration: 2033-01-18

Abstract

The application discloses distributed flexible sensor, distributed sensing system and electronic equipment, wherein, distributed flexible sensor includes: at least one sensor body; the sensor body includes: a flexible substrate layer, a flexible conductive layer, and a flexible encapsulation layer; the flexible conductive layer is arranged on the flexible substrate layer in a patterning mode and is used for deforming along with the deformation of the flexible substrate layer; the electrical properties of the flexible conductive layer change along with the deformation of the flexible conductive layer, so that the electrical properties of the flexible conductive layer can map the deformation directions and the deformation degrees of a plurality of areas on the sensor body; the flexible encapsulation layer overlies the flexible conductive layer and the flexible substrate layer such that the flexible conductive layer is disposed between the flexible substrate layer and the flexible encapsulation layer. The distributed flexible sensor and the distributed sensing system can cover a larger detection area, can be well connected to a plurality of positions of an irregular object to be detected, and can acquire signals of the plurality of positions of the object to be detected at the same time.

Description

Distributed flexible sensor, distributed sensing system and electronic equipment

Technical Field

The application relates to the technical field of sensors, in particular to a distributed flexible sensor, a distributed sensing system and electronic equipment.

Background

With the development of modern technology and the popularization of intelligent terminals, the application of related fields such as virtual reality, augmented reality, digital twin and robots is becoming more and more widespread, and flexible sensors capable of being applied to the fields are also receiving attention. For example, the flexible sensor can be used in the fields of wearable human-computer interaction interfaces, wearable health monitoring equipment, soft robots, flexible skin and the like; in application, the flexible sensor can respond to the deformation state of the sensor through the acquired electric signal data, so the flexible sensor can be used as a wearable human-computer interaction interface, such as a data glove, and the like, and is used for acquiring human motion data of a user, and can also be used as a wearable health monitoring device, such as a knee joint and an elbow joint, for acquiring and monitoring joint angle data of the body of a wearer, estimating the limb motion health state of the wearer, and can be embedded into or covered on the surface of a soft robot body to monitor the driving state of the soft robot in real time, such as the bending state of a crawling soft robot body driven by feedback positive pressure and control the crawling of the soft robot.

However, the flexible sensor in the prior art can only detect a smaller area due to the conductive property of the flexible sensitive area, if the coverage area is forcibly increased to increase the detection area, on one hand, the resistance of the flexible sensor is rapidly increased and is not usable, or an external conductive circuit is required to be additionally connected to avoid the influence caused by the resistance increase, on the other hand, due to the limitation of the mechanical property, the flexible sensor is easily damaged in the stretching and/or pressing process, so that the stability of the sensor is poor. In addition, due to the above reasons, the flexible sensor in the related art is difficult to adaptively adjust according to the spatial shape characteristics of the object to be measured, so that the flexible sensor cannot be well connected to different positions on the object to be measured with irregular spatial shapes, and cannot well cover the positions where the object to be measured is easy to deform and/or be easily pressed, that is, cannot acquire signals of a plurality of key positions on the object to be measured according to the strain distribution characteristics and/or the pressure distribution characteristics of the object to be measured.

Therefore, the flexible sensor in the prior art has small detection area, is difficult to be well connected to a plurality of positions of an irregular object to be detected and acquire signals of the plurality of positions of the object to be detected, so that the flexible sensor in the prior art has single function and low precision, and cannot meet market demands.

Disclosure of Invention

In view of this, the present application is directed to providing a distributed flexible sensor, a distributed sensing system and an electronic device, which are used for solving the problems that the existing flexible sensor covers a small detection area and is difficult to adapt to an irregular object to be measured.

To achieve the above technical object, a first aspect of the present application provides a distributed flexible sensor, including: at least one sensor body;

the sensor body includes: a flexible substrate layer, a flexible conductive layer, and a flexible encapsulation layer;

the flexible conductive layer is arranged on the flexible substrate layer in a patterning mode and is used for deforming along with the deformation of the flexible substrate layer;

the electrical properties of the flexible conductive layer change along with the deformation of the flexible conductive layer, so that the electrical properties of the flexible conductive layer can map the deformation directions and the deformation degrees of a plurality of areas on the sensing body;

The flexible encapsulation layer overlies the flexible conductive layer and the flexible substrate layer such that the flexible conductive layer is located between the flexible substrate layer and the flexible encapsulation layer.

Further, the flexible conductive layer comprises a high sensitive part and a low sensitive part;

the high-sensitivity part and the low-sensitivity part are arranged on the flexible substrate layer in a patterning mode, and the sensitivity degree of the high-sensitivity part is larger than that of the low-sensitivity part, wherein the sensitivity degree is used for representing the electrical property change degree of different parts of the sensor body under the condition of same deformation.

Further, the flexible conductive layer includes a plurality of the highly sensitive portions at different positions.

Further, the electrical property is a resistive property and/or a capacitive property.

Further, the high sensitive part and the low sensitive part are formed by arranging flexible conductive circuits in a patterning mode;

the high-sensitivity part is provided with a plurality of flexible conductive circuits, and at least two flexible conductive circuits of the high-sensitivity part are arranged side by side to form an induction array;

the resistance characteristic and/or the capacitance characteristic of the induction array are used for reflecting the deformation direction and the deformation degree of the position where the induction array is located.

Further, at least two flexible conductive lines of the high-sensitivity part are arranged in parallel and adjacent to each other according to a preset sensitivity direction, and the two flexible conductive lines arranged in parallel and adjacent to each other are electrically connected to form the induction array;

the sensing array has the degree of sensitivity in the sensitive direction that is greater than the degree of sensitivity in other directions than the sensitive direction.

Further, the flexible conductive trace of the hypersensitive part includes a first conductive trace;

the first conductive lines are provided with a plurality of first conductive lines, wherein at least two first conductive lines are arranged in parallel with each other along the sensitive direction and are connected in series with each other;

the resistance characteristics of the first conductive lines connected in series are used for mapping the deformation direction and the deformation degree at the induction array.

Further, the flexible conductive trace of the hypersensitive part includes a plurality of third conductive traces;

a plurality of third conductive lines form at least one capacitor unit;

the capacitance characteristics of the capacitance units are used for mapping the deformation direction and the deformation degree of the induction array.

Further, the sensing arrays are arranged on the single high-sensitivity portion, the sensing directions of the sensing arrays are different, so that the single high-sensitivity portion has a plurality of sensing directions, and the sensing degree in the sensing direction can be adjusted by adjusting the number of the flexible conductive circuits corresponding to the same sensing direction in the single high-sensitivity portion.

Further, the flexible conductive line of the high sensitivity portion has a smaller cross-sectional area than the flexible conductive line of the low sensitivity portion, and the sensitivity degree of the high sensitivity portion or the low sensitivity portion can be adjusted by adjusting the cross-sectional area of the high sensitivity portion or the low sensitivity portion.

Further, the flexible conductive line of the high sensitivity portion has a cross-sectional area equal to that of the flexible conductive line of the low sensitivity portion, and the sensitivity degree of the high sensitivity portion or the low sensitivity portion can be adjusted by adjusting the cross-sectional area of the high sensitivity portion or the low sensitivity portion.

Further, the high sensitive portion and the low sensitive portion are electrically connected in a patterned form, thereby forming a sensing unit composed of at least one of the high sensitive portion and at least two of the low sensitive portions.

Further, the sensing unit comprises a minimum sensing unit consisting of one high-sensitivity part and two low-sensitivity parts;

in the minimum sensing unit, the high-sensitivity part is provided with two access ends, and the two low-sensitivity parts are respectively connected with the two access ends.

Further, in the minimum sensing unit, one of the low sensitivity portions includes: the first circuit, another said low sensitivity portion includes: a second circuit and a third circuit;

the first circuit and the second circuit are respectively connected with the two access ends of the high-sensitivity part;

the third circuit is in short circuit with the first circuit or the second circuit;

the first circuit, the second circuit and the third circuit are arranged in parallel and side by side.

Further, the two access ends of the high-sensitivity portion are respectively disposed at two opposite sides of the high-sensitivity portion, so as to increase the distance between the two low-sensitivity portions in the minimum sensing unit.

Further, the two access ends of the high-sensitivity portion are both disposed on the same side of the high-sensitivity portion, so as to reduce the distance between the two low-sensitivity portions in the minimum sensing unit.

Further, the sensing unit comprises a composite sensing unit consisting of a plurality of the high-sensitivity parts and a plurality of the low-sensitivity parts.

Further, each high sensitive part of the composite sensing unit is connected with two low sensitive parts respectively, and two adjacent high sensitive parts are connected with the same low sensitive part at one adjacent side.

Further, a plurality of the sensing units are provided on a single sensing body.

Further, a hollowed-out part is arranged on the sensor body;

the hollowed-out part is used for improving the tensile property of the sensor body.

Further, a signal connection is also included, which is electrically connected to the flexible conductive layer of each sensor body to collect electrical signals from each sensor body.

Further, the signal connection includes an electrode;

one end of the electrode is buried in the sensor body and is electrically connected with the flexible conductive layer, and the other end of the electrode is arranged outside the sensor body.

Further, the flexible packaging layer is provided with a first through hole, and the first through hole is used for electrically connecting the flexible conductive layer with the signal connecting piece.

Further, the signal connection member includes a flexible circuit board;

the flexible circuit board is provided with a signal acquisition contact, the signal acquisition contact is electrically connected with the flexible conductive layer through the first through hole, and at least a part of each sensing body is connected with the flexible circuit board through the flexible packaging layer.

Further, the flexible conductive layer is provided with a plurality of layers;

a flexible isolation layer is arranged between two adjacent flexible conductive layers.

Further, the flexible isolation layer is provided with a second through hole, and two adjacent flexible conductive layers are electrically connected through the second through hole.

Further, the flexible isolation layer is provided with a third through hole;

and the third through holes on the two adjacent flexible isolation layers are communicated with each other to form a connecting hole, so that the two non-adjacent flexible conductive layers can be electrically connected through the connecting holes.

Further, the flexible packaging layer is provided with a first through hole;

the first through hole and the connection hole are communicated, so that the flexible conductive layer which is not adjacent to the flexible packaging layer can be connected with a signal connecting piece through the first through hole and the connection hole.

Further, the flexible conductive layer comprises a stretchable conductor material;

the stretchable conductor material is selected from one or more of the following: a liquid metal stretchable conductor, a silver nanowire stretchable conductor, a carbon nanomaterial stretchable conductor, and a lamellar silver stretchable conductor;

the flexible substrate layer and the flexible encapsulation layer are of a material selected from one or more of the following: polydimethyl siloxane, natural rubber, polyurethane, polyethylene, polyvinyl alcohol, polytetrafluoroethylene, polyimide, polystyrene, polyethylene terephthalate, polylactic acid, polyglycolic acid, polylactic acid-glycolic acid copolymer, polylactic acid-caprolactone, poly L-lactide-caprolactone, polyvinyl chloride, and polycaprolactone.

Further, the liquid metal stretchable conductor comprises any one or a combination of at least two of gallium indium alloy, gallium indium tin zinc alloy or gallium zinc alloy.

Further, the flexible conductive layer further comprises an organic polymer material for adjusting permittivity and/or permeability;

the organic polymeric material is selected from one or more of the following: hydroxy-terminated polydimethyl siloxane, amino-terminated polydimethyl siloxane, alkoxy-terminated polydimethyl siloxane, and carboxy-terminated polydimethyl siloxane.

A second aspect of the present application provides a distributed sensing system comprising a distributed flexible sensor as claimed in any one of the preceding claims;

the distributed flexible sensor is used for connecting an object to be detected to detect strain distribution characteristic information of the object to be detected;

the distributed flexible sensor further comprises a body module;

the body module includes: the device comprises an acquisition component, a processing component and a communication component;

the acquisition component is electrically connected with the flexible conductive layer of the distributed flexible sensor and is used for acquiring an electric signal from the flexible conductive layer;

the processing component is electrically connected with the acquisition component and is used for obtaining the strain distribution characteristic information of the object to be detected according to the electric signals acquired by the acquisition component;

the communication component is electrically connected with the processing component and is used for sending the strain distribution characteristic information from the processing component to a terminal.

Further, the main body module is provided with a plurality of;

the collection assemblies of each of the body modules are respectively electrically connected with the flexible conductive layers on one or more sensing bodies.

Further, the flexible conductive layer of the distributed flexible sensor includes a high sensitivity portion and a low sensitivity portion;

The high sensitive part and the low sensitive part are distributed on the flexible substrate layer of the distributed flexible sensor in a patterning mode;

the high sensitive part and the low sensitive part are electrically connected in a patterning mode to form a sensing unit consisting of at least one high sensitive part and at least two low sensitive parts;

the main body module is provided with a plurality of acquisition assemblies, and each main body module is electrically connected with different sensing units on one or more sensing bodies.

Further, the system also comprises a space sensing component for acquiring space positioning information;

the space sensing assembly is electrically connected with the processing assembly;

the processing component is also used for determining the spatial position of the object to be detected according to the spatial positioning information and controlling the communication component to send the spatial position of the object to be detected to the outside or controlling the communication component to forward the spatial positioning information to the outside.

Further, the spatial sensing assembly comprises a gyroscope, an accelerometer and a geomagnetic meter;

the gyroscope, the accelerometer and the geomagnetic meter are all electrically connected with the processing component.

Further, the main body module is provided with a plurality of;

The communication component is also used for receiving a time synchronization signal from the outside so as to send the corresponding space positioning information or the space position of the object to be detected obtained according to the space positioning information to the outside based on the time synchronization signal.

Further, an optical identification assembly coupled to the body module;

the optical identification component is used for providing an optical signal capable of representing the spatial position of the object to be detected.

A third aspect of the present application provides an electronic device comprising a distributed flexible sensor or a distributed sensing system as described in any of the above.

From the above technical solution, the present application provides a distributed flexible sensor, a distributed sensing system and an electronic device, wherein the distributed flexible sensor includes: at least one sensor body; the sensor body includes: a flexible substrate layer, a flexible conductive layer, and a flexible encapsulation layer; the flexible conductive layer is arranged on the flexible substrate layer in a patterning mode and is used for deforming along with the deformation of the flexible substrate layer; the electrical properties of the flexible conductive layer change along with the deformation of the flexible conductive layer, so that the electrical properties of the flexible conductive layer can map the deformation directions and the deformation degrees of a plurality of areas on the sensing body; the flexible encapsulation layer overlies the flexible conductive layer and the flexible substrate layer such that the flexible conductive layer is located between the flexible substrate layer and the flexible encapsulation layer.

The flexible substrate layer, the flexible conductive layer and the flexible packaging layer in the scheme all have excellent tensile properties, so that the sensor can adapt to the space shape characteristics of an object to be measured and can be well connected to the object to be measured; moreover, as the single distributed flexible sensor can comprise a plurality of sensing bodies, the distributed flexible sensor of the scheme can be better connected to a plurality of positions of an object to be measured with irregular space shape, and the contact area with the object to be measured can be reduced so as to avoid the situation that the deformation performance of the object to be measured is greatly influenced due to overlarge contact area between the sensing bodies and the object to be measured.

In addition, as the flexible conductive layer can deform along with the deformation of the flexible substrate layer, and the electrical property of the flexible conductive layer can change along with the deformation of the flexible conductive layer, the electrical property of the flexible conductive layer can map the deformation direction and the deformation degree of the sensor body, and as the flexible conductive layer is arranged on the flexible substrate layer in a patterning manner, the distribution mode of the flexible conductive layer on the flexible substrate layer can be adjusted to adapt to the position where an object to be measured is easy to deform and/or be pressed; in addition, as a plurality of sensing bodies can be arranged, the distributed flexible sensor provided by the scheme can obtain signals of a plurality of key positions on the object to be measured in a targeted manner according to the strain distribution characteristics and/or the pressure distribution characteristics of the object to be measured, so that the spatial shape characteristics of the object to be measured, which are obtained according to the signals of the distributed flexible sensor, can be more accurate; in addition, the position of the sensor body to be connected to the object to be detected can be reduced under the condition of ensuring the detection precision, so that the deformation of the object to be detected, which is influenced by the sensor body connected to the object to be detected, can be avoided.

Meanwhile, the flexible conductive layer can map deformation directions of a plurality of positions on the sensor body and deformation degrees in different deformation directions, so that the spatial shape characteristics of the object to be measured, which are obtained according to signals of the distributed flexible sensor, can be more accurate; and because the flexible conductive layer is arranged on the flexible substrate layer in a patterning mode, different patterns of the flexible substrate layer can be adjusted according to one position or a plurality of positions on the object to be detected, so that signals obtained through the flexible conductive layer can be mapped to deformation directions and deformation degrees of a single position on the object to be detected, and also can be mapped to a set of deformation directions and deformation degrees of a plurality of positions on the object to be detected, thereby ensuring the precision and simultaneously detecting more flexibly.

In sum, the distributed flexible sensor and the distributed sensing system provided by the scheme can cover a larger detection area, can be well connected to a plurality of positions of an irregular object to be detected and can simultaneously acquire signals of the plurality of positions of the object to be detected, so that the distributed flexible sensor has higher detection precision and wide application scene, and is effectively used for solving the problems that the detection area covered by the conventional flexible sensor is small and is difficult to adapt to the irregular object to be detected.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive faculty for a person skilled in the art.

FIG. 1 is a sensor body deployment configuration diagram of a distributed flexible sensor provided in one embodiment of the present application;

FIG. 2 is a schematic diagram of a patterned shape of a flexible conductive layer provided in one embodiment of the present application;

FIG. 3 is a schematic diagram of a patterned shape of a flexible conductive layer provided in accordance with another embodiment of the present application;

FIG. 4A is a schematic view of a portion of a plurality of sensing bodies according to one embodiment of the present application;

FIG. 4B is a schematic view of a portion of a plurality of sensing bodies according to another embodiment of the present application;

FIG. 5 is a schematic diagram of a patterned shape of a flexible conductive layer provided in one embodiment of the present application;

FIG. 6A is a schematic diagram of a flexible conductive layer with an inductive array provided in one embodiment of the present application;

FIG. 6B is a schematic diagram of a flexible conductive layer with an inductive array according to another embodiment of the present application;

FIG. 7A is a partial block diagram of a distributed flexible sensor provided in one embodiment of the present application;

FIG. 7B is a schematic view of the distributed flexible sensor of FIG. 7A after being mounted to a sphere;

FIG. 7C is a partial block diagram of a distributed flexible sensor provided in accordance with another embodiment of the present application;

FIG. 7D is a schematic view of the distributed flexible sensor of FIG. 7C after being mounted to a sphere;

FIG. 8A is a schematic diagram of an induction array according to one embodiment of the present application;

FIG. 8B is a schematic diagram of an induction array according to another embodiment of the present application;

FIG. 9A is a schematic view of a portion of a sensor body according to one embodiment of the present disclosure;

FIG. 9B is a schematic view of a portion of a sensor body according to another embodiment of the present disclosure;

FIG. 10 is a schematic diagram of a resistive flexible conductive layer provided in one embodiment of the present application;

FIG. 11 is a schematic diagram of a hypersensitive part provided in one embodiment of the present application;

FIG. 12 is a schematic diagram of the connection of a minimum sensing unit provided in one embodiment of the present application;

FIG. 13 is a schematic diagram of a minimum sensing unit provided in one embodiment of the present application;

FIG. 14 is a schematic diagram of a distributed flexible sensor application with a composite sensing unit provided in one embodiment of the present application;

FIG. 15A is a schematic diagram of a distributed flexible sensor application with minimal sensing units provided in one embodiment of the present application;

FIG. 15B is an exemplary diagram of a distributed flexible sensor application with a composite sensing unit provided in accordance with another embodiment of the present application;

FIG. 16 is a schematic illustration of an application of a distributed flexible sensor provided in one embodiment of the present application;

FIG. 17 is a cross-sectional view of a sensor body and electrode connection provided in one embodiment of the present application;

FIG. 18A is an exploded view of a sensor body with first and second through holes according to one embodiment of the present disclosure;

FIG. 18B is an exploded view of a sensor body with first and second through holes according to one embodiment of the present disclosure;

FIG. 19 is a cross-sectional view of a flexible circuit board according to one embodiment of the present application after being connected to a sensor body;

FIG. 20 is a cross-sectional view of a sensor body provided with a multi-layer flexible conductive layer according to one embodiment of the present application;

FIG. 21A is an exploded schematic view of a sensor body with multiple flexible conductive layers patterned differently according to one embodiment of the present application;

FIG. 21B is an exploded schematic view of a sensor body with multiple flexible conductive layers patterned differently according to one embodiment of the present application;

FIG. 22 is a schematic view of a sensor body provided with different flexible conductive layers according to one embodiment of the present application;

FIG. 23 is a schematic diagram of the connection of a distributed flexible sensor to a body module in a distributed sensing system provided in one embodiment of the present application;

FIG. 24 is a schematic diagram of a distributed sensing system provided in one embodiment of the present application;

FIG. 25 is a schematic diagram of a distributed sensing system provided in accordance with another embodiment of the present application;

FIG. 26A is a schematic diagram of a distributed sensing system applied to a human body according to one embodiment of the present application;

FIG. 26B is a schematic diagram of a distributed sensing system applied to a human body according to another embodiment of the present application;

FIG. 27 is a schematic diagram of a body module including a spatial sensing assembly provided in one embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the embodiments of the present application, are within the scope of the claimed invention.

In the description of the embodiments of the present application, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the embodiments of the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, interchangeably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or in communication between two elements. The specific meaning of the terms in the embodiments of the present application will be understood by those of ordinary skill in the art in a specific context.

Referring to fig. 1, a first aspect of an embodiment of the present application provides a distributed flexible sensor, including: at least one sensing body 100. The sensor body 100 includes: flexible substrate layer 130, flexible conductive layer 120, and flexible encapsulation layer 110; the flexible conductive layer 120 is disposed on the flexible substrate layer 130 in a patterned manner, and is configured to deform following the deformation of the flexible substrate layer 130; the electrical properties of the flexible conductive layer 120 change following its own deformation, so that the electrical properties of the flexible conductive layer 120 can map the deformation direction and degree of deformation of the plurality of regions on the sensor body 100; flexible encapsulation layer 110 overlies flexible conductive layer 120 and flexible substrate layer 130 such that flexible conductive layer 120 is positioned between flexible substrate layer 130 and flexible encapsulation layer 110.

In this embodiment, the flexible substrate layer 130, the flexible conductive layer 120 and the flexible packaging layer 110 all have excellent tensile properties capable of being elastically deformed, so that the sensor body 100 can be adapted to the spatial shape characteristics of different objects to be tested and laid on the objects to be tested. Also, since a single distributed flexible sensor may contain a plurality of sensing bodies 100, the distributed flexible sensor can be connected to a plurality of positions of an object to be measured whose spatial shape is irregular. Meanwhile, by arranging the sensor body 100 at the position of the object to be measured, which is easy to deform and/or be pressed, compared with the mode that the distributed flexible sensor entirely covers the object to be measured, the contact area between the distributed flexible sensor and the object to be measured can be reduced so as to avoid greatly influencing the tensile property of the object to be measured due to overlarge contact area between the sensor body 100 and the object to be measured.

In addition, since the flexible conductive layer 120 can be deformed according to the deformation of the flexible substrate layer 130, and the electrical properties of the flexible conductive layer 120 can be changed according to the deformation of the flexible conductive layer 120, the electrical properties exhibited by the flexible conductive layer 120 can map the deformation direction and the deformation degree of the sensor body 100; because the flexible conductive layer 120 is disposed on the flexible substrate layer 130 in a patterned manner, the position where the sensor body 100 needs to be connected to the object to be measured can be adapted to the position where the object to be measured is easy to deform and/or be easily pressed by adjusting the distribution manner of the flexible conductive layer 120 on the flexible substrate layer 130, and because the sensor body 100 can be provided with a plurality of sensors, the distributed flexible sensor provided in this embodiment can obtain signals of a plurality of key positions on the object to be measured according to the strain distribution characteristics and/or the pressure distribution characteristics of the object to be measured, so that the spatial shape characteristics of the object to be measured obtained according to the signals of the distributed flexible sensor are more accurate.

Meanwhile, the flexible conductive layer 120 can map deformation directions of a plurality of positions on the sensor body and deformation degrees in different deformation directions, so that the spatial shape characteristics of the object to be measured obtained according to the signals of the distributed flexible sensor can be more accurate; in application, different patterns of the flexible substrate layer 120 may also be adjusted for one or more positions on the object to be measured; the signals obtained by the flexible conductive layer 120 can be mapped to the deformation direction and the deformation degree of a single position on the object to be detected, and can also be mapped to the set of the deformation directions and the deformation degrees of a plurality of positions on the object to be detected, so that the detection can be more flexibly performed while the precision is ensured.

In summary, the distributed flexible sensor provided in this embodiment can cover a larger detection area, and can be better connected to multiple positions of an irregular object to be detected, and can simultaneously acquire signals of multiple positions of the object to be detected, so that the distributed flexible sensor has higher detection precision and wide application scenarios.

More specifically, referring to fig. 1, fig. 1 is a sensor body expansion structure diagram of a distributed flexible sensor according to the present embodiment; providing flexible conductive layer 120 in a patterned form on flexible substrate layer 130 means that flexible conductive layer 120 is not integrally covered on flexible substrate layer 130 as a single unitary body, but is provided on flexible substrate layer 130 in a pre-set pattern; thus, a portion of the upper surface of flexible substrate layer 130 is covered by flexible conductive layer 120, while another portion is uncovered by flexible conductive layer 120; the flexible encapsulation layer 110 covering the flexible substrate layer 130 and the flexible conductive layer 120 can play a role in protecting the flexible conductive layer 120 on one hand, and can play a role in fixing the flexible conductive layer 120 to maintain the pattern presented by the flexible conductive layer 120 on the other hand; in addition, the pattern formed by the flexible conductive layer 120 may be a connected whole or may be a plurality of portions which are not connected to each other; methods of patterning flexible conductive layer 120 on flexible substrate layer 130 include, but are not limited to, one or more of, drawing, spraying, screen printing, ink jet printing, and micro-fluidic patterning.

In application, the distributed flexible sensor may be used to connect the flexible distributed flexible sensor 200 to the object to be measured by attaching the flexible base layer 130 of the sensor body 100 to the surface of the object to be measured.

Specifically, since the flexible base layer 130, the flexible conductive layer 120 and the flexible packaging layer 110 are connected with each other, after the object to be measured is deformed, the flexible base layer 130 connected with the object to be measured is deformed along with the deformation of the object to be measured, so that the flexible conductive layer 120 and the flexible packaging layer 110 connected with the flexible base layer 130 are deformed along with the deformation of the object to be measured; because the electrical property of the flexible conductive layer 120 can change along with the deformation direction and the deformation degree of the flexible conductive layer 120, the electrical property of the flexible conductive layer 120 can map the deformation direction and the deformation degree generated by the flexible conductive layer 120, and further can map the deformation direction and the deformation degree generated by the sensor body 100 at the position of the object to be measured corresponding to the flexible conductive layer 120; in addition, since the sensor body 100 is connected to the object to be measured, when the object to be measured deforms to cause the deformation of the sensor body 100, the deformation of the object to be measured can be mapped by the change of the electrical property of the flexible conductive layer 120 of the sensor body 100. Therefore, the flexible distributed flexible sensor of this embodiment may be used as a strain sensor to detect strain generated by an object, may also be used as a strain pressure sensor to detect pressure applied to the sensor itself, or may detect the size of an object to be measured by the degree of change in electrical properties caused by deformation generated after the sensor itself is attached to the object to be measured.

In one embodiment, flexible conductive layer 120 comprises a stretchable conductor material; the stretchable conductor material may be selected from one or more of the following: a liquid metal stretchable conductor, a silver nanowire stretchable conductor, a carbon nanomaterial stretchable conductor, and a lamellar silver stretchable conductor;

the materials of flexible substrate layer 130 and flexible encapsulation layer 110 may be selected from one or more of the following: polydimethyl siloxane, natural rubber, polyurethane, polyethylene, polyvinyl alcohol, polytetrafluoroethylene, polyimide, polystyrene, polyethylene terephthalate, polylactic acid, polyglycolic acid, polylactic acid-glycolic acid copolymer, polylactic acid-caprolactone, poly L-lactide-caprolactone, polyvinyl chloride, and polycaprolactone.

Specifically, the liquid metal stretchable conductor used for the stretchable conductor material includes any one or a combination of at least two of gallium indium alloy, gallium indium tin alloy, or gallium zinc alloy. The flexible conductive layer 120 has excellent stretching performance and conductivity by adopting any one or a combination of at least two of gallium indium alloy, gallium indium tin zinc alloy or gallium zinc alloy as the material of the liquid metal stretchable conductor, for example, compared with DuPont elastic conductive ink (Dupont Intexar PE 874), the liquid metal stretchable conductive material and the DuPont elastic conductive ink adopted in the embodiment have conductivity less than 50mΩ/sq/mil, and the liquid metal stretchable material and the DuPont elastic conductive ink in the stretchable conductive material adopted in the embodiment of the utility model are found to lose conductivity when stretched to 200% of the original length after the stretching test under the same initial conditions, but the liquid metal stretchable material of the embodiment still has better conductivity under the same stretching rate. Therefore, the distributed flexible sensor of the present embodiment can have a larger detection area than similar sensors in the related art, and further, the liquid metal stretchable material of the present embodiment supports the distributed detection characteristics of the distributed flexible sensor 200 of the present embodiment, so that it can detect strains at a plurality of different positions at the same time.

In one embodiment, the electrical property of the flexible conductive layer 120 that can change as it deforms itself can be a resistive property and/or a capacitive property.

Taking the electrical property of the flexible conductive layer 120 that can change along with the deformation of the flexible conductive layer 120 as an example, please refer to fig. 2, fig. 2 is a schematic diagram of the patterned shape of the flexible conductive layer according to the present embodiment. In fig. 2, the flexible conductive layer 120 is patterned to form a resistive strain sensing structure; wherein the flexible conductive layer 120 comprises two end points 121; when the flexible conductive layer 120 is stretched in the up-down direction in fig. 2, the stretchable conductor constituting the flexible conductive layer 120 grows by being stretched, so that the resistance between the two terminals 121 of the flexible conductive layer 120 increases; when the flexible conductive layer 120 is stretched in the left-right direction in fig. 2, the stretchable conductor constituting the flexible conductive layer 120 is shortened by the stretching, so that the resistance between the two terminals 121 of the flexible conductive layer 120 is reduced. Thus, the magnitude of the increase or decrease in resistance between the two end points 121 of the flexible conductive layer 120 shown in fig. 2 can map the deformation direction and the degree of deformation of the flexible conductive layer 120.

Taking the electrical property of the flexible conductive layer 120 that can be changed along with the deformation of the flexible conductive layer 120 as an example, please refer to fig. 3, fig. 3 is a schematic diagram of the patterning shape of the flexible conductive layer 120 according to another embodiment. In fig. 3, the flexible conductive layer 120 is patterned to form a capacitive strain sensing structure; wherein the flexible conductive layer 120 includes two terminals 121 and a plurality of capacitor units 122; when the flexible conductive layer 120 is stretched in the up-down direction in fig. 3, the facing area between the capacitance units 122 formed by patterning the flexible conductive layer 120 is reduced and the distance is increased, thus resulting in a reduction in capacitance between the two terminals 121 of the flexible conductive layer 120; when the flexible conductive layer 120 is stretched in the left-right direction in fig. 3, the facing area between the capacitance units 122 formed by patterning the flexible conductive layer 120 increases and the distance decreases, thus resulting in an increase in capacitance between the two terminals 121 of the flexible conductive layer 120; accordingly, the magnitude of the increase or decrease in capacitance between the two end points 121 of the flexible conductive layer 120 shown in fig. 3 can map the deformation direction and the degree of deformation of the flexible conductive layer 120. In application, the flexible conductive layer 120 may include a plurality of capacitor units 122, and the plurality of capacitor units 122 are arranged in an interdigital capacitor manner.

It should be noted that, the terminal 121 shown in fig. 2 and 3 is intended to illustrate a position where connection is required when the flexible conductive layer 120 shown in fig. 2 and 3 is electrically connected to obtain an electrical signal; thus, the terminal 121 shown in fig. 2 and 3 is merely an example of an electrical connection location of the flexible conductive layer 120, and is not a specific structural limitation of the flexible conductive layer 120; similarly, the end point 121 in the following embodiment is also merely an example of an electrical connection position, and is not a specific limitation of the structure.

In addition, the flexible conductive layer 120 disposed on the single sensor body 100 in this embodiment may be a whole body connected to each other, or may be a plurality of separated portions, for example, in the example of fig. 4A, the flexible conductive layer 120 on the same sensor body 100 is a whole body, and in the example of fig. 4B, the flexible conductive layer 120 on the same sensor body 100 is a plurality of separated portions.

Further, the flexible conductive layer 120 may have a combination of the two structures, as shown in fig. 2 or 3, in addition to the resistive strain detection structure or the capacitive strain detection structure, as shown in fig. 5, and since the resistive strain structure and the capacitive strain structure in fig. 5 are both represented by the flexible conductive layer 120 in a connected whole and share the two end points 121, the electrical signals obtained by the two end points 121 in fig. 5 are combined with the electrical signals provided by the two different structures, and since the electrical signals provided by the two structures have different characteristics, the electrical signals obtained by the two end points 121 in fig. 5 can be directly mapped to the strain generated by the two different structures as a connected whole area, and the two electrical signals corresponding to the resistive strain detection structure and the capacitive strain detection structure can be obtained by analyzing the electrical signals obtained by the two end points 121 in fig. 5, and the two electrical signals corresponding to the two areas where the two different structures are located can be mapped respectively. Therefore, the signals obtained by the flexible conductive layer 120 can be used to map the deformation directions and deformation degrees of the different areas on the object to be measured independently, and can also be used to map the set of deformation directions and deformation degrees of the positions on the object to be measured.

In one embodiment, referring to fig. 6A and 6B, the flexible conductive layer 120 includes a high sensitive portion 500 and a low sensitive portion 501. The high sensitive portion 500 and the low sensitive portion 501 are both disposed on the flexible substrate layer 130 in a patterned manner, and the sensitivity of the high sensitive portion 500 is greater than that of the low sensitive portion 501, where the sensitivity is used to characterize the electrical property variation degree of different portions of the sensor body 100 under the condition of the same deformation.

Specifically, although the electrical signal obtained through the flexible conductive layer 120 can map the set of strains of all the regions to which the flexible conductive layer 120 is distributed, since the strain generated at the highly sensitive portion 500 has a large influence weight on the signal obtained through the flexible conductive layer 120, it can be regarded as the electrical signal obtained through the flexible conductive layer 120 that maps the strain generated at the highly sensitive portion 500 of the flexible conductive layer 120. For example, the flexible conductive layer 120 shown in fig. 6A and 6B has a high-sensitivity portion and a low-sensitivity portion each capable of changing resistance according to deformation occurring at the position thereof, but the high-sensitivity portion changes more than the low-sensitivity portion in resistance with the same deformation.

It should be noted that, although the electrical signal obtained through the flexible conductive layer 120 can map the set of strains of all the regions distributed to the flexible conductive layer 120, since the high-sensitivity portion 500 has a greater sensitivity degree, the electrical signal obtained through the flexible conductive layer 120 can also map the strains of the regions where the high-sensitivity portion 500 is located separately. For example, the electrical signal obtained through the two end points 121 of the flexible conductive layer 120 in fig. 2 can actually map the deformation of the high sensitive portion 500 and the low sensitive portion 501 together, but since the high sensitive portion 500 has a greater sensitivity degree, the mapping relationship with the deformation of the region where the high sensitive portion 500 is located can also be directly established by the electrical signal alone.

In one embodiment, the flexible conductive layer 120 includes a plurality of highly sensitive portions 500 located at different locations.

In particular, the distributed flexible sensor may have a plurality of sensor bodies 100 and thus a plurality of highly sensitive portions 500. In the case of the distributed flexible sensor of the present utility model having a plurality of sensing bodies 100, by providing a plurality of sensing bodies 100 and adjusting the shape of each different sensing body 100, the pattern of the flexible conductive layer 120, and the position attached to the object to be measured, it is possible to better connect to a plurality of positions of the object to be measured having an irregular spatial shape, and to reduce the contact area with the object to be measured so as to avoid greatly affecting the deformation performance of the object to be measured due to the excessively large contact area between the sensing body 100 and the object to be measured, and to increase the detection area of the distributed flexible sensor 200.

In this embodiment, by providing a plurality of high-sensitivity portions 500, on one hand, each sensor body 100 can be distributed at different positions of the object to be measured, so that the distributed flexible sensor can measure the strain of different areas at the same time; on the other hand, the highly sensitive portions 500 of the flexible conductive layer 120 on the single sensor body 100 are distributed in different areas on the sensor body 100, so that the strain of different areas on the sensor body 100 can be measured simultaneously by the flexible conductive layer 120 on the single sensor body 100.

Referring to fig. 7A, fig. 7A is a schematic view of a part of a structure of a distributed flexible sensor provided in this embodiment, in which a distributed flexible sensor 200 composed of a sensor body 100 may be used to attach to a spherical object to detect strain of the spherical object, and the distributed flexible sensor 200 has only one sensor body 100, and the sensor body 100 has a plurality of protruding portions 124 and a concentration portion 123 for detecting strain of different areas of the spherical object, and each protruding portion 124 is connected to the concentration portion 123; the hub 123 may have signal connectors 700 attached thereto, the signal connectors 700 being disposed within the interface region 210 of the hub 123 such that the signal connectors 700 are capable of simultaneously connecting the flexible conductive layers 120 distributed across the respective protrusions 124.

As shown in fig. 7B, fig. 7B is a schematic view of the distributed flexible sensor of fig. 7A after being mounted on a sphere such as a rubber hollow sphere. As shown in fig. 7B, the tensile properties of the rubber material at the covering of the concentrated portion 123 are greatly affected; therefore, after the distributed flexible sensor 200 is installed, the deformation generated by the whole hollow sphere after being stressed at a certain position can drive the distributed flexible sensor 200 to generate deformation, and the deformation generated by the whole hollow sphere after being stressed at a certain position is greatly different from that generated before the distributed flexible sensor 200 is installed.

Referring to fig. 7C, fig. 7C is a schematic view of a part of a distributed flexible sensor according to another embodiment of the present application. In the example of fig. 7C, the distributed flexible sensor 200 may be used to attach to a spherical object to detect strain of the spherical object, and the distributed flexible sensor 200 has a plurality of sensing bodies 100, each sensing body 100 being used to detect strain of a different region of the spherical object, at least a portion of each sensing body 100 being disposed within the interface region 210 so that the signal connection 700 connects the flexible conductive layers 120 of each sensing body 100.

As shown in fig. 7D. Fig. 7D is a schematic view of the distributed flexible sensor of fig. 7C after being mounted on a sphere such as a hollow sphere made of rubber. In the example of fig. 7D, compared to fig. 7B, the distributed flexible sensor 200 of fig. 7D has a plurality of sensor bodies 100, and thus the hollow sphere surface covered with the whole-sheet concentration portion 123 in fig. 7B is covered with a plurality of sensor bodies 100 separated from each other in fig. 7D; the distributed flexible sensor 200 in fig. 7D can reduce the contact area with the hollow sphere compared to the distributed flexible sensor 200 in fig. 7B to avoid greatly affecting the deformation performance of the hollow sphere due to the excessively large contact area of the sensor body 100 with the hollow sphere.

In one embodiment, please refer to fig. 8A and 8B; the high sensitive part 500 and the low sensitive part 501 are formed by arranging flexible conductive circuits 600 in a patterning manner; the high-sensitivity portion 500 is provided with a plurality of flexible conductive lines 600, and at least two flexible conductive lines 600 of the high-sensitivity portion 500 are arranged side by side to form the induction array 400; the resistive and/or capacitive characteristics of the sensor array 400 are used to reflect the direction and degree of deformation of the location where the sensor array 400 is located. Wherein, the flexible conductive circuit 600 is arranged in a patterned form, which means that the flexible conductive circuit 600 may be a continuous pattern or a discontinuous pattern; similarly, the flexible conductive trace 600 may be a serpentine complex pattern or a single straight line pattern.

Specifically, the plurality of flexible conductive lines 600 arranged side by side form the resistive or capacitive sensing array 400, and when the sensing body 100 generates the same deformation, the plurality of flexible conductive lines 600 are arranged side by side, so that the resistance or capacitance generated by the sensing array 400 can be changed more greatly, and the sensitivity and accuracy of the distributed flexible sensor 200 can be improved.

It should be noted that, the deformation direction of the sensor body 100 may be an arc direction, and the sensing array 400 formed by the plurality of flexible conductive lines 600 disposed side by side and having an arc shape may be used to detect the deformation of a specific shape more sensitively; specifically, as shown in fig. 9A, fig. 9A is a schematic diagram of a part of a structure of a sensor body provided in this embodiment, in the example of fig. 9A, a fan-shaped resistive sensing array 401 is disposed on a fan-shaped sensor body 100, and when the sensor body 100 generates a fan-shaped deformation along the deformation direction in the drawing, the stretching degree of a flexible conductive line of the fan-shaped resistive sensing array 401 is greater than that of other arrangements, so that the sensing array shown in fig. 9A can detect the fan-shaped deformation more sensitively; similarly, as shown in fig. 9B, fig. 9B is a schematic diagram of a portion of a structure of another sensor body 100 according to the present embodiment, in the example of fig. 9B, a sector capacitive sensing array 402 is disposed on a sector-shaped sensor body 100, and when the sector-shaped capacitive sensing array 402 generates a sector-shaped deformation along the illustrated deformation direction of the sensor body 100, the degree of change of capacitance of the sector-shaped capacitive sensing array is greater than that of other arrangements, so that the sector-shaped capacitive sensing array 402 shown in fig. 9B can detect the sector-shaped deformation more sensitively.

In addition, as shown in fig. 8A and 8B, the flexible conductive lines 600 forming the sensing array 400 may be arranged in a wavy line along one direction, so that the flexible conductive lines 600 have sensitive sensing strength in multiple directions compared to the manner of arranging the flexible conductive lines 600 in a straight line.

Further, at least two flexible conductive lines 600 of the high-sensitivity portion 500 are disposed adjacent to each other in parallel according to a preset sensitivity direction, and the two flexible conductive lines 600 disposed adjacent to each other in parallel are electrically connected to form the induction array 400; the sense array 400 has a degree of sensitivity in a sense direction that is greater than that in other directions than the sense direction.

Specifically, the sensing array 400 formed by the plurality of flexible conductive lines 600 with radian and arranged side by side can detect deformation of a specific shape more sensitively, but not necessarily has an obvious sensitive direction, and in general, in order to improve the universality of the distributed flexible sensor 200 so as to be suitable for different objects to be tested, the plurality of flexible conductive lines 600 in the sensing array 400 are arranged in parallel so that the sensing array 400 has an obvious sensitive direction, so that a user can estimate the main deformation direction of the object to be tested and overlap the sensitive direction of the sensing array when connecting the distributed flexible sensor 200 to the object to be tested, and the sensitivity of the distributed flexible sensor 200 to the object to be tested is improved as much as possible.

It should be noted that, the single sensing array 400 may have multiple sensing directions, and the sensing direction of the sensing array 400 does not necessarily refer to one direction with the greatest sensitivity corresponding to the sensing array 400, but may refer to a single direction or a set of multiple directions with a sensitivity significantly greater than other directions.

In another embodiment, the flexible conductive layer 120 may be provided as a monolithic structure in addition to individually including the flexible conductive traces 600 arranged in a patterned form. The monolithic flexible conductive layer 120 includes an insulating region and a conductive region; the conductive regions may also be arranged in the insulating region in a patterned manner, so that the flexible conductive layer 120 may follow the deformation of the flexible substrate layer to generate the electrical property change.

In one embodiment, referring to fig. 8A, the flexible conductive trace 600 of the hypersensitive part 500 includes a first conductive trace 601; the first conductive lines 601 are provided with a plurality of first conductive lines 601, wherein at least two first conductive lines 601 are arranged in parallel with each other along the sensitive direction and are connected in series with each other; the resistive characteristics of the first conductive traces 601 in series with each other are used to map the direction and degree of deformation at the sense array 400.

Further, the flexible conductive trace 600 of the high sensitivity portion 500 further includes a second conductive trace 602; two first conductive traces 601 disposed adjacent in parallel are connected in series by a second conductive trace 602.

That is, in the present embodiment, the first conductive trace 601 and the second conductive trace 602 together form the resistive sensing array 400.

In another embodiment, referring to fig. 8B, the flexible conductive traces 600 of the hypersensitive part 500 include a plurality of third conductive traces 603; a plurality of third conductive traces 603 form at least one capacitor unit 122; wherein, each capacitor unit 122 may include two third conductive lines 603 arranged in parallel and spaced apart; the capacitive element 122 capacitive characteristics are used to map the direction and extent of deformation at the sense array 400.

Further, the flexible conductive trace 600 of the high sensitivity portion 500 may further include a fourth conductive trace 604; the fourth conductive lines 604 may include two, and a plurality of third conductive lines 603 may be disposed on each fourth conductive line 604 in parallel at intervals; the two fourth conductive traces 604 cross each other to form a plurality of capacitor cells 122 having an interdigital capacitance.

In one embodiment, referring to fig. 11, a single high-sensitivity portion 500 may be provided with a plurality of sensing arrays 400, and the sensing directions of the sensing arrays 400 are different, so that the single high-sensitivity portion 500 has a plurality of sensing directions, and the degree of sensitivity in the sensing directions can be adjusted by adjusting the number of flexible conductive traces 600 corresponding to the same sensing direction in the single high-sensitivity portion 500.

In other embodiments, the flexible conductive line 600 of the high sensitivity portion 500 has a smaller cross-sectional area than the flexible conductive line 600 of the low sensitivity portion 501, and the sensitivity degree of the high sensitivity portion 500 or the low sensitivity portion 501 can be adjusted by adjusting the cross-sectional area of the high sensitivity portion 500 or the low sensitivity portion 501.

Specifically, referring to fig. 6A, fig. 6A is a schematic view of a flexible conductive layer with an inductive array according to an embodiment of the present application; in fig. 6A, the flexible conductive layer 120 with the resistive sensing array 400 can set more flexible conductive lines side by side in the sensing array of unit area by increasing the cross-sectional area of the flexible conductive lines of the low sensitive portion 501 and decreasing the cross-sectional area of the flexible conductive lines of the high sensitive portion 500, so that the flexible conductive lines of the sensing array are stretched more than the flexible conductive lines of the low sensitive portion 501 under the condition of the same deformation, and therefore the degree of resistance change of the sensing array when the same deformation is generated can be improved, and the sensitivity of the sensing array is improved. In addition, referring to fig. 6B, fig. 6B is a schematic view of another flexible conductive layer 120 with an inductive array according to an embodiment of the present application; in fig. 6B, the flexible conductive layer 120 is provided with the capacitive sensing array 400, and by increasing the cross-sectional area of the flexible conductive line of the low sensitivity portion 501 and decreasing the cross-sectional area of the flexible conductive line of the high sensitivity portion 500, more pairs of the capacitive units 122 can be disposed in the sensing array per unit area, so that the degree of capacitance change of the sensing array when the sensing array is deformed identically can be increased, thereby increasing the sensitivity of the sensing array.

It should be noted that, although the electrical signal obtained through the flexible conductive layer 120 can map the set of strains generated by the flexible conductive layer 120 in all the areas distributed on the sensor body 100, the strain generated by the highly sensitive portion 500 of the flexible conductive layer 120 can be regarded as the electrical signal obtained through the flexible conductive layer 120 because the strain generated by the highly sensitive portion 500 of the flexible conductive layer 120 has a larger influence weight; also, the high sensitive portion 500 needs to have a greater degree of sensitivity than the low sensitive portion 501 so that the resulting electrical signal through the flexible conductive layer 120 can be considered as a separate map of strain in the region where the high sensitive portion 500 is located. Therefore, the sensing array can improve the sensitivity of the sensing array by arranging a plurality of flexible conductive lines side by side, and making the cross-sectional area of the flexible conductive lines constituting the sensing array smaller than that of the flexible conductive lines of the low sensitivity portion 501.

Specifically, the degree of sensitivity in the sensitive direction can be adjusted by adjusting the number of flexible conductive traces 600 corresponding to the same sensitive direction in a single high sensitive portion 500; the more data of the corresponding flexible conductive traces in the same sensitive direction, the greater the sensitivity of the highly sensitive portion 500 in the sensitive direction.

In another embodiment, the flexible conductive line 600 of the high sensitivity portion 500 has a cross-sectional area equal to that of the flexible conductive line 600 of the low sensitivity portion 501, and the sensitivity degree of the high sensitivity portion 500 or the low sensitivity portion 501 can be adjusted by adjusting the cross-sectional area of the high sensitivity portion 500 or the low sensitivity portion 501.

In an embodiment, referring to fig. 6A and 6B, the high sensitive portion 500 and the low sensitive portion 501 are electrically connected in a patterned manner, so as to form a sensing unit 101 composed of at least one high sensitive portion 500 and at least two low sensitive portions 501.

Since the electrical signal obtained through the flexible conductive layer 120 can map the set of strains generated by the flexible conductive layer 120 in all regions distributed on the sensor body 100, the electrical signal obtained through the flexible conductive layer 120 can be regarded as the strain generated by the highly sensitive portion 500 of the flexible conductive layer 120 because the strain generated by the highly sensitive portion 500 has a large influence weight on the signal obtained through the flexible conductive layer 120 after the strain is generated by the highly sensitive portion 500, and therefore the strain generated by the highly sensitive portion 500 of the sensor unit 101 can be calculated from the electrical signal obtained by the low sensitive portion 501 of the sensor unit 101.

Specifically, referring to fig. 12, fig. 12 is a schematic connection diagram of a minimum sensing unit provided in an embodiment of the present application, where the sensing unit 101 includes a minimum sensing unit composed of one high-sensitivity portion 500 and two low-sensitivity portions 501; in the minimum sensing unit, the high sensitive part 500 is provided with two access terminals 502, and the two low sensitive parts 501 are respectively connected with the two access terminals 502.

Since both the resistive sense array 400 and the capacitive sense array 400 for strain detection need to be connected to both of their end points 121 to be able to operate, the minimum sensing unit capable of strain detection in a single area needs to use two low sensitivity portions 501 to connect two access terminals 502 of the sensing array of a single high sensitivity portion 500.

Taking a resistive strain detection structure as an example, please refer to fig. 10, fig. 10 is a schematic diagram of a resistive flexible conductive layer according to an embodiment of the present application. In fig. 10, the flexible conductive lines 600 of the two low sensitive portions 501 of the minimum sensing unit include a first line a1 and a second line a2, respectively, and in the minimum sensing unit, one low sensitive portion 501 includes a third line a3; the first line a1, the second line a2 and the third line a3 are all arranged in parallel and side by side. The two ends of the flexible conductive circuit 600 of the high-sensitivity part 500 are respectively connected with the first circuit a1 and the second circuit a2; the second line a2 or the first line a1 is shorted with the third line a 3. The signal connector 700 can obtain the line resistance R of the first line a1 and the second line a2 by connecting the first line a1 and the second line a2 _{Wire 1} Resistance R with high sensitivity portion 500 _{High height} The method comprises the steps of carrying out a first treatment on the surface of the The signal connector 700 connects the second circuit a2 and the third circuit a3 to obtain the resistances R of the second circuit a2 and the third circuit a3 _{Wire 2} . Since the first line a1, the second line a2 and the third line a3 are arranged in parallel and in parallel, it can be considered that the resistances of the lines a1, a2 and a3 are uniform before and after the deformation, and R can be obtained _{Wire 1} ＝R _{Wire 2} And then can solve the resistance R _{High height} Is a resistance value of (a). That is, in the present embodiment, the cross-sectional areas of the flexible conductive lines 600 of the high-sensitivity portion 500 and the flexible conductive lines 600 of the low-sensitivity portion 501 are equal, and at least two sensing lines and auxiliary lines need to be connected to the flexible conductive lines 600 of the high-sensitivity portion 500. In this embodiment, the first circuit a1 and the second circuit a2 are respectively connected to two ends of the flexible conductive circuit 600 of the high-sensitivity portion 500 as two sensing circuits, and the third circuit a3 is short-circuited with the first circuit a1 or the second circuit a2 as an auxiliary circuit, so thatThe resistance values of the high sensitive part 500 and the low sensitive part 501 are obtained by respectively connecting the sensing circuit and the auxiliary circuit, so that the whole deformation condition of the flexible conductive layer 120 is more accurately obtained, and the size change condition of the coverage object is calculated by the deformation condition of the low sensitive part 501.

In one embodiment, as shown in fig. 6A and 6B, two access ends of the high sensitive portion 500 are respectively disposed on two opposite sides of the high sensitive portion 500, so as to increase the space between two low sensitive portions 501 in the minimum sensing unit.

In another embodiment, as shown in fig. 13, both access ends of the high sensitive portion 500 are disposed on the same side of the high sensitive portion 500 to reduce the space between the two low sensitive portions 501 in the minimum sensing unit.

Specifically, fig. 13 is a schematic structural diagram of a minimum sensing unit provided in the present embodiment. The minimum sensing unit shown in fig. 13, in which the high-sensitivity portion 500 is provided with the resistive sensing array 400, and two access ends 502 of the high-sensitivity portion 500 are disposed on the same side of the high-sensitivity portion 500, so that the space between the two low-sensitivity portions 501 is smaller.

In other embodiments, the sensing unit 101 includes a composite sensing unit consisting of a plurality of high sensitivity portions 500 and a plurality of low sensitivity portions 501 in addition to a minimum sensing unit having only one high sensitivity portion 500 and two low sensitivity portions 501.

Specifically, referring to fig. 14, fig. 14 is a schematic diagram of a distributed flexible sensor application with a composite sensing unit provided in an embodiment of the present application. In the example of fig. 14, the sensing body 100 attached to a human hand is used for detecting the opening motion of the index finger and the middle finger of the human hand through the strain generated during the motion of the human hand, wherein, the sensing body 100 is provided with a composite sensing unit, two high sensitive parts 500 of the composite sensing unit are connected in series with each other through a low sensitive part 501, and two low sensitive parts 501 are respectively connected to two ends of the two high sensitive parts 500 after being connected in series, so that the sum of the strains generated at the positions of the two high sensitive parts 500 in the composite sensing unit can be mapped by the electric signals obtained through the two low sensitive parts 501. Taking the example that the composite sensing unit comprises two high-sensitivity parts 500, the two high-sensitivity parts 500 can be respectively and correspondingly arranged at the positions between the root parts of the index finger and the middle finger, and the access ends 502 on the near sides of the two high-sensitivity parts are connected in series through the low-sensitivity parts 501; in addition, when the index finger and the middle finger of the hand make the opening motion, the skin between the index finger and the middle finger of the hand can be obviously stretched, so that the opening motion of the index finger and the middle finger of the hand can be effectively detected by attaching the two high-sensitivity parts 500 of the sensing body 100 between the index finger and the middle finger of the hand in a Y-shaped arrangement.

Specifically, referring to fig. 14, at least a portion of the low sensitive portions 501 connected at both ends of the two high sensitive portions 500 connected in series are disposed in the interface region 210 so as to connect the two low sensitive portions 501 to the data interface, respectively, thereby enabling to obtain electrical signals corresponding to the two high sensitive portions 500 connected in series through the data interface.

In one embodiment, each high sensitive part 500 of the composite sensing unit is connected to two low sensitive parts 501, respectively, and two adjacent high sensitive parts 500 are connected to the same low sensitive part 501 at adjacent sides.

Specifically, since both the resistive sensing array 400 and the capacitive sensing array 400 for implementing strain detection need to be connected to the two end points 121 to be able to operate, similar to the minimum sensing unit, if an electrical signal of a single high-sensitivity portion 500 in the composite sensing unit is to be obtained to solve the strain of the high-sensitivity portion 500, the high-sensitivity portion 500 needs to be connected to two low-sensitivity portions 501 respectively and both the low-sensitivity portions 501 connected thereto are connected to a data interface, so that the electrical signal corresponding to the high-sensitivity portion 500 can be obtained through the data interface, however, if too many high-sensitivity portions 500 are provided, a large number of low-sensitivity portions 501 need to be correspondingly provided, and the acquisition circuit for obtaining the electrical signal to perform the solution occupies a large number of detection channels; therefore, by connecting the two adjacent high-sensitivity portions 500 with the same low-sensitivity portion 501 on one side of the adjacent high-sensitivity portions and connecting the sensitive portions with the data interface, the two adjacent high-sensitivity portions 500 can share the same low-sensitivity portion 501 to connect the data interface, so that the number of the low-sensitivity portions 501 is reduced, the processing requirements are reduced, the material cost is saved, and meanwhile, the occupied detection channels are reduced.

Specifically, refer to fig. 15A and 15B; FIG. 15A is a schematic diagram of a distributed flexible sensor application with a minimum sensing unit provided in an embodiment of the present application; in fig. 15A, the sensing body 100 attached to a human hand is used for detecting bending and straightening actions made by the fingertip joint of the thumb and the proximal fingertip joint of the index finger of the human hand through strain generated during movement of the human hand, wherein the two minimum sensing units have high sensitivity portions 500 attached to the fingertip joint of the thumb and the proximal fingertip joint of the index finger respectively, and the two high sensitivity portions 500 are connected with two low sensitivity portions 501, so four low sensitivity portions 501 are provided in total, and in order to detect electrical signals of the two high sensitivity portions 500, at least a part of the four low sensitivity portions 501 are disposed in the interface region 210 to connect the four low sensitivity portions 501 to the data interface respectively, so that an acquisition circuit for acquiring the electrical signals through connection of the data interface with the low sensitivity portions 501 for resolving will occupy four acquisition channels.

Referring to FIG. 15B, FIG. 15B is an exemplary diagram of a distributed flexible sensor application with a composite sensing unit provided in accordance with another embodiment of the present application; in fig. 15B, the sensing body 100 attached to a human hand is used for detecting bending and straightening actions made by the fingertip joint of a human hand thumb and the proximal fingertip joint of an index finger through strain generated during movement of the human hand, wherein the composite sensing unit has two highly sensitive portions 500 attached to the fingertip joint of the thumb and the proximal fingertip joint of the index finger, respectively, and the two highly sensitive portions 500 share one low sensitive portion 501 on the adjacent side, so the composite sensing unit is provided with three low sensitive portions 501 in total, at least a part of the three low sensitive portions 501 are disposed in the interface region 210 to connect the three low sensitive portions 501 to the data interface, respectively. It can be seen that the technical solution shown in fig. 15B reduces the number of low sensitivity portions 501 compared with the technical solution shown in fig. 15A, reduces the processing requirements, saves the material cost, and reduces the occupied detection channels.

It should be noted that a plurality of sensor units 101 may be provided on a single sensor body 100. Specifically, a plurality of minimum sensing units, a plurality of compound sensing units, and a plurality of minimum sensing units and a plurality of compound sensing units may be disposed on a single sensing body 100, which is not particularly limited in this embodiment of the present utility model, and by disposing a plurality of sensing units 101, more positions on the object to be detected may be covered according to the detection requirement.

In an embodiment, referring to fig. 6, the sensor body 100 is provided with a hollow portion 125; the hollowed-out portion 125 is used for improving the tensile property of the sensor body 100.

Specifically, fig. 16 is an application schematic diagram of a distributed flexible sensor provided in an embodiment of the present application. In fig. 16, the sensor body 100 is provided with the hollowed-out portions 125 in a patterned manner, and the shape, number and positions of the hollowed-out portions 125 are set in a patterned manner, so that the flexible conductive layer 120 can be stretched in a preset stretching direction to improve the stretching performance, and the sensor body 100 can be lifted to fit with an object to be measured.

In this embodiment, the distributed flexible sensor 200 may be used to attach to a spherical object to detect the strain of the spherical object, and the distributed flexible sensor 200 has only one sensor body 100, and the sensor body 100 has a plurality of protrusions 124 and a concentration portion 123 for detecting the strain of different areas of the spherical object; the concentration portion 123 may be connected to the signal connection 700. Each of the protruding portions 124 is connected to the concentrated portion 123. Moreover, the concentration portion 123 is further provided with a plurality of hollow portions 125 with central symmetry, so that the distributed flexible sensor 200 shown in fig. 16 has less influence on the surface tensile property of the spherical object due to the concentration portion 123 compared with the distributed flexible sensor 200 shown in fig. 7A after the distributed flexible sensor 200 is attached to the spherical object.

As in the embodiments of the application described above, the distributed flexible strain sensor provided herein further includes a signal connector 700, the signal connector 700 being electrically connected to the flexible conductive layer 120 of each sensor body 100 to collect electrical signals from each sensor body 100.

Specifically, in order to acquire the signals from the flexible conductive layers 120, an acquisition circuit electrically connected to the distributed flexible sensor 200, that is, an acquisition circuit electrically connected to the flexible conductive layers 120 of the respective sensor bodies 100 of the distributed flexible sensor 200 needs to be provided, and therefore, in order to achieve the electrical connection between the flexible conductive layers 120 of the respective sensor bodies 100 of the distributed flexible sensor 200 and the acquisition circuits, the distributed flexible sensor 200 of the present embodiment further includes a signal connector 700 for collecting the electrical signals from the respective sensor bodies 100.

It should be noted that the single distributed flexible sensor 200 may be provided with a single signal connector 700 or a plurality of signal connectors 700, which is not limited.

Specifically, since the signal connectors 700 need to collect the electrical signals from the respective sensor bodies 100, in the case where the distributed flexible sensor 200 is provided with only a single signal connector 700, at least a portion of all the sensor bodies 100 of the distributed flexible sensor 200 are distributed within a range in which the signal connector 700 can be electrically connected to the sensor bodies 100; in the case where the distributed flexible sensor 200 is provided with a plurality of signal interfaces, at least a part of each sensor of the distributed flexible sensor 200 is distributed in a range where the signal interface corresponding to the sensor can be electrically connected to the sensor body 100.

Specifically, since the electrical signal obtained through the flexible conductive layer 120 can map the set of strains generated by the flexible conductive layer 120 in all the areas distributed on the sensor body 100, the electrical signal obtained through the flexible conductive layer 120 can be regarded as the strain generated by the highly sensitive portion 500 of the flexible conductive layer 120 after the strain is generated by the highly sensitive portion 500, so that the strain of the highly sensitive portion 500 of the sensor unit 101 can be calculated from the electrical signal obtained by the low sensitive portion 501 of the sensor unit 101; based on this, the sensor body 100 of the present embodiment can consider the low sensitive portion 501 as a wire for transmitting the electrical signal from the high sensitive portion 500, and since, in the case where the distributed flexible sensor 200 is provided with only a single signal interface, at least a portion of the sensor body 100 of the distributed flexible sensor 200 is distributed in a range where the signal connector 700 can make electrical connection with the sensor body 100, and in the case where the distributed flexible sensor 200 is provided with a plurality of signal connectors 700, at least a portion of the sensor body 100 of the distributed flexible sensor 200 is distributed in a range where the signal connector 700 corresponding to itself can make electrical connection with the sensor body 100, at least a portion of the low sensitive portion 501 of the sensor body 100 of the distributed flexible sensor 200 is distributed in a range where the signal interface corresponding to the sensor body 100 where it is located can make electrical connection with it.

In one embodiment, referring to fig. 17, signal connection 700 includes an electrode 710; one end of the electrode 710 is buried inside the sensor body 100 and electrically connected to the flexible conductive layer 120, and the other end of the electrode 710 is disposed outside the sensor body 100.

Specifically, fig. 17 is a cross-sectional view of a connection between a sensor body and an electrode according to an embodiment of the present application; as shown in fig. 17, one end of the motor 710 extends into the sensor body 100, abuts against the flexible conductive layer 120 to be electrically connected with each other, and the other end extends out of the sensor body 100 to be electrically connected with the signal acquisition device, so that the external signal acquisition device can acquire the electrical property change condition of the flexible sensor body 120 through the electrode 710.

In a further improved embodiment, referring to fig. 18A, the flexible packaging layer 110 is provided with a first through hole 111, and the first through hole 111 is used for electrically connecting the flexible conductive layer 120 and the signal connection member 700.

Specifically, fig. 18A is a schematic exploded view of a sensor body with a first through hole and a second through hole according to an embodiment of the present application. Wherein, the position of the first through hole 111 corresponds to the position where the flexible conductive layer 120 is disposed on the flexible substrate layer 130. By providing the first via 111, the electrode 710 may be electrically connected with the flexible conductive layer 120 through the flexible encapsulation layer 110.

In another embodiment, referring to fig. 19, the signal connector 700 includes a flexible circuit board 720 (Flexible Printed Circuit, FPC); the flexible circuit board 720 is provided with signal collection contacts 721, the signal collection contacts 721 are electrically connected with the flexible conductive layer 120 through the first through holes 111, and at least a part of the flexible encapsulation layer 110 of each sensor body 100 is connected with the flexible circuit board 720. By connecting the flexible conductive layer 120 with the flexible circuit board 720, the overall flexibility of the distributed flexible sensor 200 can be maintained while signal acquisition is realized, so that the bending performance of the distributed flexible sensor 200 at the signal interface is prevented from being greatly influenced.

Specifically, fig. 19 is a cross-sectional view of a flexible circuit board according to an embodiment of the present application after being connected to a sensor body. The board body of the flexible circuit board 720 is attached to the flexible packaging layer 110, the signal collection contact 721 of the flexible circuit board 720 is disposed in the first through hole 111, and the signal collection contact 721 is connected with the flexible conductive layer 120 located in the first through hole 111, so as to realize electrical connection between the signal interface and the flexible conductive layer 120.

Specifically, the flexible circuit board 720 is further provided with signal output contacts corresponding to the signal collecting contacts 721 one by one, and the signal output contacts are used for being electrically connected with external signal collecting equipment.

It should be noted that, the electrode 710 extends into the flexible packaging layer 110 and is connected with the flexible conductive layer 120, on one hand, the contact area between the electrode 710 and the flexible conductive layer 120 is smaller, and on the other hand, the thickness of the electrode 710 is easy to jack up the flexible packaging layer 110, so that the surface of the flexible packaging layer 110 forms a bump, and the bump is more easy to damage the flexible conductive layer 120 when pressed. In this embodiment, by arranging a flexible circuit board 720 and simultaneously connecting a plurality of stretchable conductor lines of the flexible conductive layer 120, on one hand, the contact area between the flexible circuit board 720 and both the flexible packaging layer 110 and the flexible substrate layer 130 can be increased, and on the other hand, a plurality of stretchable conductor lines can be connected without adopting a plurality of different electrodes 710, so that the flexible circuit board 720 can be more firmly fixed between the flexible packaging layer 110 and the flexible substrate layer 130 and is not easy to form a bulge, and the situation of poor contact, abnormal signals and pressed damage caused by relative sliding between the flexible circuit board 720 and the flexible conductive layer 120 is not easy to occur, and meanwhile, because the flexible circuit board 720 is fixed more firmly, the overall waterproof performance is also improved and more stable.

Further, referring to fig. 20, the flexible conductive layer 120 is provided with a plurality of layers; a flexible isolation layer 140 is disposed between two adjacent flexible conductive layers 120. Fig. 20 is a cross-sectional view of a sensor body provided with a plurality of flexible conductive layers according to an embodiment of the present application.

As shown in fig. 18A, the flexible isolation layer 140 is provided with a second through hole 141, and two adjacent flexible conductive layers 120 are electrically connected through the second through hole 141.

In one embodiment, the flexible barrier layer 140 is provided with a third through hole 142; the third through holes 142 on the adjacent flexible isolation layers 140 are communicated with each other to form connection holes, so that the non-adjacent flexible conductive layers 120 can be electrically connected through the connection holes.

It should be noted that, conductors are disposed in the second through hole 141 and the third through hole 142 to realize electrical connection; the conductors in the second through holes 141 and the third through holes 142 may be stretchable conductor materials consistent with the material of the flexible conductive layer 120, conductive adhesive, or metal materials, which is not particularly limited in the embodiment of the present utility model.

In this embodiment, the flexible encapsulation layer 110 may be provided with the first through hole 111 as well; the first through hole 111 and the connection hole communicate such that the flexible conductive layer 120 not adjacent to the flexible encapsulation layer 110 can be connected with the signal connection 700 through the first through hole 111 and the connection hole.

In the above-described embodiments, the multiple flexible conductive layers 120 may be patterned in the same manner, thereby enhancing the sensitivity of the distributed flexible sensor 200.

Specifically, referring to fig. 18A, the sensor body 100 of the distributed flexible sensor 200 is provided with two flexible conductive layers 120 in the same patterning manner. Specifically, the two flexible conductive layers 120 of the distributed flexible sensor 200 shown in fig. 18A are all represented as the minimum sensing units of resistive strain detection in a patterned manner, and the low sensitive portions 501 corresponding to the two minimum sensing units are electrically connected through the second through holes 141, two first through holes 111 corresponding to the low sensitive portions 501 are provided on the flexible packaging layer 110, and the low sensitive portions 501 are electrically connected with the signal connection member 700 through the first through holes 111. Accordingly, the electrical signal obtained through the signal connection 700 corresponds to the sum of the electrical signals obtained by strain detecting the two highly sensitive portions 500 for the same position, and thus the sensitivity of the distributed flexible sensor 200 is improved.

Specifically, referring to fig. 18B, fig. 18B is a schematic exploded view of another sensor body provided with a first through hole and a second through hole according to an embodiment of the present application. In the example of fig. 18B, the sensor body 100 of the distributed flexible sensor 200 is provided with two flexible conductive layers 120 in the same patterning manner. Specifically, the two flexible conductive layers 120 of the distributed flexible sensor 200 shown in fig. 18B are all presented as the minimum sensing units of capacitive strain detection in a patterned manner, and the low sensitive portions 501 corresponding to the two minimum sensing units are electrically connected through the second through holes 141, two first through holes 111 corresponding to the low sensitive portions 501 are provided on the flexible packaging layer 110, and the low sensitive portions 501 are electrically connected with the signal connection member 700 through the first through holes 111. Accordingly, the electrical signal obtained through the signal connection 700 corresponds to the sum of the electrical signals obtained by strain detecting the two highly sensitive portions 500 for the same position, and thus the sensitivity of the distributed flexible sensor 200 is improved.

In another embodiment, the multiple flexible conductive layers 120 may be patterned differently, so that the distributed flexible sensor 200 can have more sensitive directions at the same position by using different patterning manners for different flexible conductive layers 120, and the high sensitive portions 500 with different detection principles can be combined at the same position of the sensor body 100, for example, the high sensitive portions 500 of two flexible conductive layers 120 are arranged at the same position of the sensor body 100, and the high sensitive portions 500 of two flexible conductive layers 120 respectively have a resistive sensing array and a capacitive sensing array, so that two electrical signals capable of mapping the strain at the same position of the sensor body 100 can be acquired through the two flexible conductive layers 120 respectively, and the detection accuracy can be improved by combining the two electrical signals.

Specifically, referring to fig. 21A, fig. 21A is an exploded schematic view of a sensor body with multiple flexible conductive layers patterned in different manners according to an embodiment of the present application. In the example of fig. 21A, the sensor body 100 of the distributed flexible sensor 200 is provided with two flexible conductive layers 120 in different patterning manners. Specifically, the two flexible conductive layers 120 of the distributed flexible sensor 200 shown in fig. 21A are each presented as a minimum sensing unit for resistive strain detection in a patterned manner, and the sensitivity directions of the high sensitive portions 500 of the two minimum sensing units are different, so that by setting the high sensitive portions 500 of different sensitivity directions at the same position of the multi-layer flexible conductive layer 120, the distributed flexible sensor 200 can have more different sensitivity directions at the same position, thereby improving the detection accuracy of the distributed flexible sensor 200.

Specifically, referring to fig. 21B, another exploded schematic view of a sensor body with a different patterning manner for the multi-layer flexible conductive layer according to the embodiment of the present application is provided in fig. 21B. In the example of fig. 21B, the sensor body 100 of the distributed flexible sensor 200 is provided with two flexible conductive layers 120 in different patterning manners. Specifically, the two flexible conductive layers 120 of the distributed flexible sensor 200 shown in fig. 21B are respectively presented as a minimum sensing unit for resistive strain detection and a minimum sensing unit for capacitive strain detection in a patterned manner, so that two kinds of electrical signals capable of mapping strain at the same position of the sensor body 100 can be obtained through the two flexible conductive layers 120, respectively, and detection accuracy can be improved by combining the two kinds of electrical signals.

In one embodiment, the stretchable conductive materials used for the plurality of flexible conductive layers 120 are different, so that different flexible conductive layers 120 exhibit different electrical properties, and thus the composite electrical properties exhibited by the sensor body 100 can meet the detection requirement by combining flexible conductive layers 120 of different materials.

Specifically, referring to fig. 22, fig. 22 is a schematic view of a sensor body provided with different flexible conductive layers according to an embodiment of the present application. In the example of fig. 22, the sensor body 100 has three flexible conductive layers 120, a first flexible conductive layer 1201, a second flexible conductive layer 1202, and a third flexible conductive layer 1203, respectively; wherein, a first flexible isolation layer 1401 is arranged between the first flexible conductive layer 1201 and the second flexible conductive layer 1202, and a second flexible isolation layer 1402 is arranged between the second conductive layer and the third flexible conductive layer 1203. The first flexible conductive layer 1201 is provided with a high sensitivity portion 500 having a capacitive strain sensing array, the second flexible conductive layer 1202 is provided with a high sensitivity portion 500 having a resistive strain sensing array, and the third flexible conductive layer 1203 is provided with only a low sensitivity portion 501 for transferring electrical signals from the first flexible conductive layer 1201 and the second flexible conductive layer 1202 to a signal interface. For different roles of the three flexible conductive layers 120, the stretchable conductor materials adopted by the three flexible conductive layers 120 are different, the adopted stretchable conductor material of the first flexible conductive layer 1201 can enable the capacitive strain sensing array to have a larger sensitivity degree after being manufactured into the capacitive strain sensing array, and similarly, the stretchable conductor material adopted by the second flexible conductive layer 1202 can enable the resistive strain sensing array to have a larger sensitivity degree after being manufactured into the resistive strain sensing array; the stretchable conductor material used for the third flexible conductive layer 1203 has a smaller resistance so that it can better transmit electric signals and reduce power consumption.

Further, referring to fig. 22, both the first flexible barrier layer 1401 and the second flexible barrier layer 1402 are provided with third through holes 142; the two third through holes 142 communicate with each other to form a connection hole so that the first flexible conductive layer 1201 and the third flexible conductive layer 1203 can be electrically connected through the connection hole; the second flexible isolation layer 1402 is provided with a second via 141 so that the second flexible conductive layer 1202 and the third flexible conductive layer 1203 can be electrically connected through the second via 141.

Further, referring to fig. 22, the flexible encapsulation layer 110 is provided with first through holes 111 corresponding to the respective bottom sensitive portions 501 of the third flexible conductive layer 1203, and the respective bottom sensitive portions 501 of the third flexible conductive layer 1203 are electrically connected to the signal connector 700 through the first through holes 111, so that the signal connector 700 can collect electrical signals from the high sensitive portions 500 of the first flexible conductive layer 1201 and the second flexible conductive layer 1202.

In an embodiment, the flexible conductive layer 120 further comprises an organic polymer material for adjusting permittivity and/or permeability; wherein the organic polymeric material is selected from one or more of the following: hydroxy-terminated polydimethyl siloxane, amino-terminated polydimethyl siloxane, alkoxy-terminated polydimethyl siloxane, and carboxy-terminated polydimethyl siloxane. By adding the organic polymer material to the liquid metal stretchable conductor comprising one or more of gallium indium alloy, gallium indium tin alloy or gallium zinc alloy, the liquid metal stretchable conductor in the embodiment of the utility model can exhibit excellent electromagnetic wave absorption characteristics, and the permittivity of the liquid metal stretchable conductor is improved, so that the performance of a capacitor and a capacitive sensor prepared based on the liquid metal stretchable conductor can be improved.

In an application, for example, a material such as polydimethylsiloxane may be disposed between two adjacent third conductive traces 603 on the capacitor unit 122, so that the capacitance value of the capacitor unit 122 can be increased by increasing the dielectric constant of the medium between the two third conductive traces 603.

According to the distributed flexible sensor 200 provided by the embodiment of the utility model, as the flexible substrate layer 130, the flexible conductive layer 120 and the flexible packaging layer 110 of the sensor body 100 all have excellent tensile properties, the sensor body 100 can adapt to the spatial shape characteristics of an object to be measured, and can be better connected with the object to be measured; in addition, since the single distributed flexible sensor 200 may include a plurality of sensing bodies 100, the distributed flexible sensor 200 provided in the embodiment of the present utility model can be better connected to a plurality of positions of an object to be measured with irregular space shape, and can reduce the contact area with the object to be measured, so as to avoid greatly affecting the tensile performance of the object to be measured due to the overlarge contact area between the sensing bodies 100 and the object to be measured, and increase the detection area of the distributed flexible sensor 200; in addition, because the flexible conductive layer 120 can deform along with the deformation of the flexible substrate layer 130, and the electrical property of the flexible conductive layer 120 can change along with the deformation of the flexible conductive layer 120, the electrical property of the flexible conductive layer 120 can map the deformation direction and the deformation degree of the object to be measured 100, and because the flexible conductive layer 120 is arranged on the flexible substrate layer 130 in a patterning manner, the position of the object to be measured, which is easy to deform and/or be easily pressed, can be adapted by adjusting the distribution mode of the flexible conductive layer 120 on the flexible substrate layer 130, and because the sensor 100 can be provided with a plurality of positions, the distributed flexible sensor 200 provided by the embodiment of the utility model can obtain signals of a plurality of key positions on the object to be measured according to the strain distribution characteristics and/or the pressure distribution characteristics of the object to be measured, so that the spatial shape characteristics of the object to be measured, which are obtained according to the signals of the distributed flexible sensor 200, can be more accurate, can be reduced, and the position of the object to be measured, which is easy to be connected to the object to be measured, can be prevented from influencing the deformation of the object to be measured 100, under the condition that the detection accuracy is ensured; in addition, since the flexible conductive layer 120 can map deformation directions of a plurality of positions on the sensor body 100 and deformation degrees in different deformation directions, spatial shape characteristics of the object to be measured obtained according to signals of the distributed flexible sensor 200 can be more accurate; in addition, since the flexible conductive layer 120 is disposed on the flexible base layer 130 in a patterned manner, by adjusting different patterns of the flexible base layer 130 to respectively aim at one position or a plurality of positions on the object to be detected, the deformation direction and the deformation degree of a single position on the object to be detected can be mapped through the signals obtained by the flexible conductive layer 120, and the set of the deformation directions and the deformation degrees of a plurality of positions on the object to be detected can be mapped, so that the detection can be more flexibly performed while the precision is ensured; in summary, the distributed flexible sensor 200 and the distributed sensing system according to the embodiments of the present utility model can cover a larger detection area, can be better connected to multiple positions of an irregular object to be detected, and can simultaneously acquire signals of multiple positions of the object to be detected, thereby having higher detection precision and wide application scenarios.

It will be appreciated by those skilled in the art that the topology of the flexible conductive layer 120 and the sensor body 100 shown above is not limiting of embodiments of the utility model and may include more or fewer components than shown, or certain components in combination, or a different arrangement of components.

The patterned shape and application scenario of the flexible conductive layer 120 described in the embodiment of the present utility model are for more clearly describing the technical solution of the embodiment of the present utility model, and do not constitute a limitation on the technical solution provided by the embodiment of the present utility model; those skilled in the art can know that, with the evolution of the distributed flexible sensor 200 and the appearance of new application scenarios, the technical solution provided by the embodiment of the present utility model is also applicable to similar technical problems.

In addition to the distributed flexible strain sensor described above, referring to fig. 1-25, a second aspect of the present application provides a distributed sensing system comprising a distributed flexible sensor 200 as described in any of the above; the distributed flexible sensor 200 is used for connecting an object to be measured to detect strain distribution characteristic information of the object to be measured. The strain distribution characteristic information is used for representing the position, the direction and the size of strain generated by the object to be measured.

Referring to fig. 23, the distributed flexible sensor 200 further includes a body module 220; the body module 220 includes: an acquisition component 221, a processing component 222, and a communication component 223; the acquisition component 221 is electrically connected with the flexible conductive layer 120 of the distributed flexible sensor 200, and is used for acquiring an electrical signal from the flexible conductive layer 120; the processing component 222 is electrically connected with the acquisition component 221, and is used for obtaining strain distribution characteristic information of the object to be measured according to the electric signals acquired by the acquisition component 221; the communication component 223 is electrically connected to the processing component 222 for transmitting strain distribution characteristic information from the processing component 222 to the terminal.

The acquisition component 221 is capable of acquiring an electrical signal of the flexible conductive layer 123 by electrically connecting with the flexible conductive layer 123; the processing component 222 electrically connected to the acquisition component 221 is capable of acquiring an electrical signal from the flexible conductive layer 120 from the acquisition component 221 and deriving strain distribution characteristic information based on the electrical signal; the communication component 223 can send the strain distribution characteristic information to the outside, so that an external device receiving the strain distribution characteristic information can calculate the spatial characteristic of the object to be measured and the deformation generated by the object to be measured or the pressure applied to the object to be measured according to the strain distribution characteristic information.

In a more specific embodiment, the flexible conductive layer 120 of the distributed flexible sensor 200 includes a high sensitivity portion 500 and a low sensitivity portion 501; high sensitivity 500 and low sensitivity 501 are both distributed in a patterned fashion on flexible substrate layer 130 of distributed flexible sensor 200; the high sensitive part 500 and the low sensitive part 501 are electrically connected in a patterned form to form a sensing unit consisting of at least one high sensitive part 500 and at least two low sensitive parts 501; the main body module 220 is provided in plurality, and the acquisition component 221 of each main body module 220 is electrically connected with different sensing units 101 on one or more sensing bodies 100.

The high sensitive portion 500 and the low sensitive portion 501 can change resistance according to the deformation of the position where the high sensitive portion 500 and the low sensitive portion 501 are located, but the resistance of the high sensitive portion 500 changes more than that of the low sensitive portion 501 under the condition of the same deformation. By arranging the plurality of main body modules 220, after the external signal acquisition equipment is connected with the plurality of main body modules 220, the electrical property change condition of the plurality of sensing units 101 on the plurality of sensing bodies 100 can be obtained simultaneously; after the plurality of sensing units 101 are respectively arranged at different positions of the human body and different positions of the object to be detected, the change condition of the electrical performance of the whole system formed by the plurality of sensing units 101 can be obtained. For example, the plurality of sensing units 101 may be respectively provided on the arm, wrist, back, knee, leg, and soccer ball of the human body, so that when the user kicks the ball, the stretching of muscles from the user himself to the ball, the movement condition, and the deformation condition of the ball can be obtained.

In an embodiment, the acquisition component 221 of the distributed sensing system is connected with the signal acquisition member 700 of the distributed flexible sensor 200 to achieve an electrical connection of the acquisition component 221 with the flexible conductive layer 120, i.e. the acquisition component 221 with the sensing unit 101.

Specifically, the main body module 220 and the distributed flexible sensor 200 are detachably connected, that is, the acquisition module 221 and the signal acquisition member 700 are detachably connected, so that the main body module 220 is mounted on the distributed flexible sensor 200 or the main body module 220 is dismounted from the distributed flexible sensor 200.

In one embodiment, the body module 220 is provided with a plurality of; the acquisition components 221 of each of the body modules 220 are each electrically connected to the flexible conductive layer 120 on one or more of the sensing bodies 100. By providing a plurality of body modules 220 on a single distributed flexible sensor 200, it is possible to expand the detection channels that a distributed sensing system can have, on the one hand, so that a greater number of sensing units 101 can be supported on a single sensing body 100, and on the other hand, the distance that the sensing units 101 are connected to the corresponding body modules 220 can be reduced, so that the size of the low sensitive portion 501 in the sensing unit 101 can be reduced, and thus the resistance of each sensing unit 101 can be reduced, so that the sensing unit can support a greater size.

In an embodiment, the distributed flexible sensor is provided with a plurality of signal interfaces. The plurality of signal interfaces can correspond to one or more different sensing units 101 on the same sensing body.

Specifically, referring to fig. 24, fig. 24 is a schematic diagram of a distributed sensing system according to an embodiment of the present application. In the example of fig. 24, the distributed sensing system is provided with a single sensing body 100 and two body modules 220, the two body modules 220 being a first body module 2201 and a second body module 2202, respectively. The sensing body 100 is provided with three sensing units 101, namely, a first sensing unit 1011, a second sensing unit 1012 and a third sensing unit 1013, wherein the first sensing unit 1011 and the second sensing unit 1012 are respectively electrically connected with the first main body module 2201 through a first signal connection member 701, the third sensing unit 1013 is electrically connected with the second main body module 2202 through a second signal connection member 702, so that the first main body module 2201 can collect and analyze the electrical signals of the first sensing unit 1011 and the second sensing unit 1012, the second main body module 2202 can collect and analyze the electrical signals of the third sensing unit 1013, and when the distance between the first sensing unit 1011, the second sensing unit 1012 and the third sensing unit 1013 is far, two main body modules 220 are arranged, compared with the two main body modules 220, the length of the lower sensitive part 501 side, which is required to be arranged by the three sensing units 101, of the sensing unit 101, can be shortened, namely, the distance between the sensing units 101 and the corresponding main body modules 220 can be shortened, so that the size of the lower sensitive part of the sensing unit 220 can be collected and analyzed, and the sensing unit 501 can be further reduced, and the sensing unit can support the size can be further reduced.

It should be noted that, the main body modules 220 and the signal connectors 700 do not correspond to each other one by one, and a single main body module 220 may be connected to one signal connector 700 or may be connected to a plurality of signal connectors 700; the single signal connector 700 may connect one body module 220, or may connect a plurality of body modules 220, without limitation.

In one embodiment, the sensing body 100 and the main body module 220 are provided in plurality, and the collection component 221 of each main body module 220 is electrically connected to the flexible conductive layer 120 on a different one or more sensing bodies 100. Through setting up a plurality of sensing bodies 100 and adjusting the shape of each different sensing body 100, the pattern of flexible conducting layer 120 and laminating in the position on the object that awaits measuring, can connect in the multiple position of the irregular object that awaits measuring of space shape better, and can reduce the area of contact with the object that awaits measuring in order to avoid influencing the deformation performance of object that awaits measuring by a wide margin because of the area of contact of sensing body 100 and object that awaits measuring is too big, also make the detection position of distributed sensing system can set up more nimble simultaneously.

In one embodiment, a single signal acquisition member 700 can be electrically connected to the sensing units 101 on different sensing bodies 100.

Specifically, referring to fig. 25, fig. 25 is a schematic diagram of a distributed sensing system provided by another specific example of the present utility model, in the example of fig. 24, the distributed sensing system is provided with two sensing bodies 100 and two body modules 220, the two body modules 220 being a third body module 2203 and a fourth body module 2204, respectively; one of the two sensing bodies 100 is provided with a fourth sensing unit 1014, and the other is provided with a fifth sensing unit 1015 and a sixth sensing unit 1016; the third main body module 2203 is electrically connected to the fourth sensing unit 1014 through the third signal connection 703, and the fourth main body module 2204 is electrically connected to the fifth sensing unit 1015 and the sixth sensing unit 1016 through the fourth signal acquisition member 704, respectively.

Specifically, referring to fig. 26A, fig. 26A is a schematic diagram of a distributed sensing system applied to a human body according to an embodiment of the present application. The distributed sensing system shown in fig. 26A has one sensing body 100 and one body module 220; the sensing body 100 is simultaneously attached to the knee joints of both legs of the person to detect the bending angle of the knee joints of the legs of the person by the strain of the sensing body 100 in the knee joint region; since only one sensing body 100 and one main body module 220 are provided, a single sensing body 100 needs to cover knee joints of both legs of a person at the same time, resulting in an excessively large area of the sensing body 100.

Referring to fig. 26B, fig. 26B is a schematic diagram of another distributed sensing system applied to a human body according to an embodiment of the present application. In the example of fig. 26B, the distributed sensing system has two sensing bodies 100 and two body modules 220, the two body modules 220 are respectively connected with the two sensing bodies 100, and the two sensing bodies 100 are respectively attached at the knee joints of both legs of the person to detect the movement angle of the knee joints. As can be seen from fig. 26B, by providing two main body modules 220 to connect two sensing bodies 100 respectively to replace a single larger sensing body 100, the sensor can be better connected to multiple positions of an irregular space shape of the object to be measured, and the contact area between the sensor and the object to be measured can be reduced to avoid greatly influencing the deformation performance of the object to be measured due to the overlarge contact area between the sensing body 100 and the object to be measured, and meanwhile, the detection position of the distributed sensing system can be more flexibly set.

In an embodiment, the distributed sensing system further includes a spatial sensing component 224 for acquiring spatial positioning information, where the spatial sensing component is electrically connected to the processing component 222, and the processing component 222 is further configured to determine a spatial position of the object to be measured according to the spatial positioning information and control the communication component to send the spatial position of the object to be measured to the outside, or control the communication component to forward the spatial positioning information to the outside.

In a specific example, the distributed sensing system includes the distributed flexible sensor 200 shown in fig. 7A, and after the distributed sensing system is mounted to the rubber hollow sphere 300, the spatial position thereof can be confirmed by the spatial sensing assembly 224 of the distributed sensing system body module 220, in addition to being able to detect the surface strain of the rubber hollow sphere 300 to confirm the deformation thereof. For example, after the distributed sensing system is installed on the football, the distributed sensing system can acquire strain distribution characteristic information corresponding to the football, so that the position of the football when the football is kicked can be measured according to the strain distribution characteristic information, and the spatial position of the football can be confirmed according to the spatial positioning information obtained by the spatial sensing component 224 of the distributed sensing system main body module 220.

As shown in fig. 27, fig. 27 is a schematic view of a body module including a space sensing assembly according to an embodiment of the present application. In the example of fig. 27, the distributed sensing system further includes a spatial sensing component 224, where the spatial sensing component 224 is electrically connected to the processing component 222, and the processing component 222 is further configured to determine a spatial position of the object to be measured according to the spatial positioning information and control the communication component to send the spatial position of the object to be measured to the outside, or control the communication component to forward the spatial positioning information to the outside.

In a further improved embodiment, the spatial sensing assembly 224 includes gyroscopes, accelerometers, and geomagnetisms; the gyroscope, accelerometer, and geomagnetic meter are all electrically connected to the processing component 222.

The difference between the current spatial position of the main body module and the spatial position of the pre-calibrated initial position of the main body module 220 can be calculated through the gyroscope and the accelerometer; thus, the spatial location information available through the spatial sensing assembly 224, including gyroscopes and accelerometers, is based on the relative values of the pre-calibrated initial positions.

Specifically, in an embodiment, the spatial sensing assembly includes a gyroscope, an accelerometer, and a geomagnetic meter at the same time, and by using the geomagnetic meter, an absolute spatial position reference system can be provided, so that the position of the main body module in the spatial position reference system can be calculated by the gyroscope, the accelerometer, and the geomagnetic meter; thus, the spatial location information that can be obtained by the spatial sensing assembly including gyroscopes, accelerometers, and geomagnetisms is an absolute value in a spatial location reference frame determined based on the geomagnetisms.

In one embodiment, the body module 220 is provided with a plurality of; the communication component 223 is further configured to receive a time synchronization signal from the outside, so as to send corresponding spatial positioning information or a spatial position of the object to be measured obtained according to the spatial positioning information to the outside based on the time synchronization signal.

It should be noted that, the spatial positioning information is used to characterize a spatial position of the spatial sensing component 224, that is, a spatial position corresponding to at least a portion of the object to be measured; the processing component 222 of the main body module 220 may forward the spatial location information to the external device by controlling the communication component 223 to calculate the spatial location information through the external device to obtain the spatial location of the object to be measured, or the processing component 222 of the main body module 220 may directly calculate the spatial location information to obtain the spatial location of the object to be measured, and control the communication component 223 to transmit the spatial location of the object to be measured to the outside.

It should be noted that, because the spatial positioning information characterizes a spatial position corresponding to at least a portion of the object to be measured, the plurality of body modules 220 may be configured to be connected to the object to be measured, so as to obtain spatial positions corresponding to a plurality of different portions of the body modules 220, so that movement and deformation of the object to be measured generated in space can be more accurately calculated according to spatial position changes of different portions of the object to be measured in combination with strain distribution information.

In particular, the spatial positioning information includes quaternions defined based on the attitude reference system (Attitude and Heading Reference System, AHRS), as well as acceleration directions and corresponding acceleration values.

In one embodiment, an optical identification component coupled to the body module 220; the optical identification component is used for providing an optical signal capable of representing the spatial position of the object to be measured.

In particular, the optical identification component comprises a reflective sphere for passively reflecting the optical signal to enable positioning of the optical identification component based on the optical signal reflected by the reflective sphere.

Further, the optical identification component comprises a light emitting device for actively transmitting an optical signal, so that the positioning of the optical identification component can be realized according to the optical signal transmitted by the light emitting device.

In summary, in the distributed sensing system provided by the embodiment of the present utility model, because the flexible substrate layer 130, the flexible conductive layer 120 and the flexible packaging layer 110 of the distributed flexible sensor adopted by the distributed sensing system have excellent tensile properties, the sensor body 100 can adapt to the spatial shape characteristics of the object to be measured, so that the distributed sensing system can be better connected to the object to be measured, and because the single distributed flexible sensor can comprise a plurality of sensor bodies 100; therefore, the distributed flexible sensor provided by the embodiment of the utility model can be better connected to a plurality of positions of the object to be measured with irregular space shape, and the contact area between the sensor and the object to be measured can be reduced so as to avoid greatly influencing the tensile property of the object to be measured due to overlarge contact area between the sensor body and the object to be measured, and meanwhile, the detection area of the distributed flexible sensor is increased; in addition, because the flexible conductive layer 120 can deform along with the deformation of the flexible substrate layer 130, and the electrical property of the flexible conductive layer 120 can change along with the deformation of the flexible conductive layer 120, the electrical property of the flexible conductive layer 120 can map the deformation direction and the deformation degree of the sensor body, and because the flexible conductive layer 120 is arranged on the flexible substrate layer 130 in a patterning manner, the position, which is easy to deform and/or be pressed, of the object to be detected can be adapted by adjusting the distribution mode of the flexible conductive layer 120 on the flexible substrate layer 130, and because the sensor body 100 can be provided with a plurality of positions, the distributed flexible sensor 200 provided by the embodiment of the utility model can obtain signals of a plurality of key positions on the object to be detected according to the strain distribution characteristics and/or the pressure distribution characteristics of the object to be detected, so that the spatial shape characteristics of the object to be detected, which is obtained according to the signals of the distributed flexible sensor 200, can be more accurate, can be reduced, and the position, which is required to be connected to the object to be detected, of the sensor body 100 to be connected to the object to be detected can be avoided under the condition that the detection accuracy is ensured; in addition, since the flexible conductive layer 120 can map deformation directions of a plurality of positions on the sensor body 100 and deformation degrees in different deformation directions, spatial shape characteristics of the object to be measured obtained according to signals of the distributed flexible sensor 200 can be more accurate; in addition, since the flexible conductive layer 120 is disposed on the flexible base layer 130 in a patterned manner, by adjusting different patterns of the flexible base layer 130 to respectively aim at one position or a plurality of positions on the object to be detected, the deformation direction and the deformation degree of a single position on the object to be detected can be mapped through the signals obtained by the flexible conductive layer 120, and the set of the deformation directions and the deformation degrees of a plurality of positions on the object to be detected can be mapped, so that the detection can be more flexibly performed while the precision is ensured; in summary, the distributed sensing system of the embodiment of the utility model can cover a larger detection area, can be better connected to a plurality of positions of an irregular object to be detected, and can simultaneously acquire signals of the plurality of positions of the object to be detected, thereby having higher detection precision and wide application scenes.

A third aspect of the present application also provides an electronic device comprising the distributed flexible sensor of any of the embodiments described above or the distributed sensing system of any of the embodiments. The electronic device may be a device with a transmission interface, and after the transmission interface is connected by a wired connection or a wireless connection, the electrical signal of the flexible conductive layer 120 may be obtained. The electronic device may further include a display screen, through which the electrical signal change condition of the flexible conductive layer 120 may be visually displayed and deformation conditions of the flexible substrate layer 110 and/or the object covered by the flexible substrate layer 110 may be displayed, which may be simulated according to the electrical signal change condition of the flexible conductive layer 120.

The apparatus embodiments described above are merely illustrative, in which modules, components, and units illustrated as separate parts may or may not be physically separate, i.e., may be located in one place, or may be distributed over multiple network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

Those of ordinary skill in the art will appreciate that all or a portion of the disclosure above may be implemented as software, firmware, hardware, and any suitable combination thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.

While the present utility model has been described in detail with reference to the examples, it will be apparent to those skilled in the art that the foregoing examples can be modified or equivalents substituted for some of the features thereof, and any modifications, equivalents, improvements and substitutions made therein are intended to be within the spirit and principles of the present utility model.

Claims

1. A distributed flexible sensor, comprising: at least one sensor body;

2. The distributed flexible sensor of claim 1, wherein the flexible conductive layer comprises a high sensitivity portion and a low sensitivity portion;

3. The distributed flexible sensor of claim 2, wherein the flexible conductive layer comprises a plurality of the highly sensitive portions at different locations.

4. A distributed flexible sensor according to claim 2, characterized in that the electrical properties of the sensor body are resistive and/or capacitive properties.

5. The distributed flexible sensor of claim 4, wherein the high sensitive portion and the low sensitive portion are each composed of flexible conductive traces arranged in a patterned form;

6. The distributed flexible sensor according to claim 5, wherein at least two of the flexible conductive lines of the high sensitivity portion are disposed adjacent to each other in parallel according to a preset sensitivity direction, and the two flexible conductive lines disposed adjacent to each other in parallel are electrically connected to form the sensing array;

7. The distributed flexible sensor of claim 6, wherein the flexible conductive trace of the highly sensitive portion comprises a first conductive trace;

8. The distributed flexible sensor of claim 5, wherein the flexible conductive trace of the highly sensitive portion comprises a plurality of third conductive traces;

A plurality of third conductive lines form at least one capacitor unit;

9. The distributed flexible sensor of claim 5, wherein a single high sensitive portion is provided with a plurality of said sense arrays, and the sense directions of each of said sense arrays are different such that a single high sensitive portion has a plurality of said sense directions.

10. The distributed flexible sensor of claim 5, wherein the flexible conductive trace of the high sensitivity portion has a cross-sectional area that is smaller than a cross-sectional area of the flexible conductive trace of the low sensitivity portion, and the degree of sensitivity of the high sensitivity portion or the low sensitivity portion is adjustable by adjusting the cross-sectional area of the high sensitivity portion or the low sensitivity portion.

11. The distributed flexible sensor of claim 5, wherein the high sensitive portion and the low sensitive portion are electrically connected in a patterned form to form a sensing unit comprised of at least one of the high sensitive portion and at least two of the low sensitive portions.

12. The distributed flexible sensor of claim 11, wherein the sensing unit comprises a minimum sensing unit consisting of one of the high sensitivity portion and two of the low sensitivity portions;

13. The distributed flexible sensor of claim 12, wherein the flexible conductive line of the high sensitivity portion has a cross-sectional area equal to a cross-sectional area of the flexible conductive line of the low sensitivity portion, and the degree of sensitivity of the high sensitivity portion or the low sensitivity portion is adjustable by adjusting the cross-sectional area of the high sensitivity portion or the low sensitivity portion.

14. The distributed flexible sensor of claim 13, wherein one of the low sensitivity portions of the minimum sensing unit comprises: the first circuit, another said low sensitivity portion includes: a second circuit and a third circuit;

15. The distributed flexible sensor of claim 12, wherein the two access ends of the high sensitivity portion are disposed on opposite sides of the high sensitivity portion, respectively, to increase a spacing between the two low sensitivity portions in the minimum sensing unit.

16. The distributed flexible sensor of claim 12, wherein both of the access ends of the high sensitivity portion are disposed on a same side of the high sensitivity portion to reduce a spacing between the two low sensitivity portions in the minimum sensing unit.

17. The distributed flexible sensor of claim 11, wherein the sensing unit comprises a composite sensing unit consisting of a plurality of the high sensitivity portions and a plurality of the low sensitivity portions.

18. The distributed flexible sensor of claim 17, wherein each of the high sensitive portions of the composite sensing unit is connected to two of the low sensitive portions, respectively, and adjacent two of the high sensitive portions are connected to the same low sensitive portion on adjacent sides.

19. A distributed flexible sensor according to claim 11, wherein a plurality of said sensing units are provided on a single said sensor body.

20. The distributed flexible sensor according to claim 1, wherein the sensor body is provided with a hollowed-out portion;

21. The distributed flexible sensor of claim 1, further comprising signal connections electrically connected to the flexible conductive layer of each of the sensing bodies to collect electrical signals from each of the sensing bodies.

22. The distributed flexible sensor of claim 21, wherein the signal connection comprises an electrode;

23. A distributed flexible sensor according to claim 21, wherein the flexible encapsulation layer is provided with a first via for electrically connecting the flexible conductive layer with the signal connection.

24. The distributed flexible sensor of claim 23, wherein the signal connection comprises a flexible circuit board;

25. The distributed flexible sensor of claim 21, wherein the flexible conductive layer is provided with multiple layers;

26. A distributed flexible sensor according to claim 25, wherein the flexible isolation layer is provided with a second via through which two adjacent flexible conductive layers are electrically connected.

27. The distributed flexible sensor of claim 25, wherein the flexible isolation layer is provided with a third through hole;

28. The distributed flexible sensor of claim 27, wherein the flexible encapsulation layer is provided with a first through hole;

29. The distributed flexible sensor of any of claims 1 to 28, wherein the flexible conductive layer comprises a stretchable conductor material;

30. The distributed flexible sensor of claim 29, wherein the liquid metal stretchable conductor comprises any one or a combination of at least two of gallium indium alloy, gallium indium tin zinc alloy, or gallium zinc alloy.

31. The distributed flexible sensor of claim 30, wherein the flexible conductive layer further comprises an organic polymer material for adjusting permittivity and/or permeability.

32. A distributed sensing system comprising a distributed flexible sensor according to any one of claims 1 to 28;

the distributed flexible sensor further comprises a body module;

33. The distributed sensing system of claim 32, wherein the body module is provided with a plurality of;

34. The distributed sensing system of claim 33, wherein the flexible conductive layer of the distributed flexible sensor comprises a high sensitivity portion and a low sensitivity portion;

35. The distributed sensing system of claim 32, further comprising a spatial sensing component for acquiring spatial location information;

36. The distributed sensing system of claim 35, wherein the spatial sensing component comprises a gyroscope, an accelerometer, and a geomagnetic meter;

37. The distributed sensing system of claim 36, wherein the body module is provided with a plurality of;

38. The distributed sensing system of claim 32, further comprising an optical identification component coupled to the body module;

39. An electronic device comprising the distributed flexible sensor of any one of claims 1 to 28 or the distributed sensing system of any one of claims 32 to 38.