CN219068633U - FPC binding type silicon-based OLED module - Google Patents

Abstract

The utility model belongs to the technical field of OLED displays, and discloses an FPC binding type silicon-based OLED module. The FPC binding type silicon-based OLED module comprises a silicon-based chip, a glass cover plate and an FPC, wherein a binding area is arranged at one edge of the first surface of the silicon-based chip; the glass cover plate is covered and attached to the outside of the binding area of the first surface, the glass cover plate extends to the outside of the edges of the other non-binding areas of the first surface, one side, close to the first surface, of the glass cover plate is coated with a first protection piece, and the first protection piece is arranged on the periphery of the silicon-based chip in a surrounding mode; the FPC is bound to the binding region, and the binding region is coated with a second protective member. According to the FPC binding type silicon-based OLED module, when the FPC binding type silicon-based OLED module is transported and used, the arrangement of the glass cover plate can effectively prevent the edges of the silicon-based chip from being knocked by external force, avoid the edges of the silicon-based chip from being broken and defective, and prevent circuits on the silicon-based chip from being damaged.

Description

FPC binding type silicon-based OLED module

Technical Field

The utility model relates to the technical field of OLED displays, in particular to an FPC binding type silicon-based OLED module.

Background

The Organic Light-Emitting Diode (OLED) display is a micro display formed by directly stacking an anode layer, an Organic Light-Emitting layer, a thin film packaging layer and a CF (Color Filter) Light-Emitting layer on a silicon wafer substrate on which a CMOS (Complementary Metal-Oxide-Semiconductor) circuit is etched, attaching a cover plate, and binding an FPC (Flexible Printed Circuit, a flexible circuit board) or a PCB (Printed Circuit Board, a printed circuit board) bonding wire. In the existing silicon-based OLED module packaging process, two common types are adopted, wherein one type is an FPC binding process, and the other type is a PCB bonding wire process.

For the FPC binding process, the OLED silicon-based chip of the module is completely exposed at the outermost side, so the following problems exist: because the silicon chip is made of monocrystalline silicon, the silicon chip is easy to have the defect of edge collapse and angle collapse in the production of the silicon-based OLED and the actual use process of subsequent products, and because the silicon chip contains a very precise CMOS module, the edge collapse is easy to damage a circuit, so that abnormal display is caused.

In the prior art, in order to reduce the defects, a protective adhesive is usually added on the side edges of the glass cover plate and the chip, but the size of the existing glass cover plate is smaller than that of the silicon-based chip, and the protective adhesive mainly protects the edge of the glass cover plate and prevents light leakage, so that the glass cover plate has a better effect of preventing breakage of the glass cover plate, but has a smaller effect of protecting the silicon-based chip; or, the whole of the silicon-based chip is externally provided with the outer frame for protection, but the outer frame is relatively difficult to assemble due to the small size of the silicon-based OLED product, the outer frame integrally wraps the edge of the silicon-based chip, and the material is hard, so that the edge of the chip is easy to collapse.

Disclosure of Invention

The utility model aims to provide an FPC binding type silicon-based OLED module, which aims to improve the protection of a silicon-based chip and prevent the edge of the silicon-based chip from being knocked by external force to break so as to avoid the damage of a circuit on the silicon-based chip.

To achieve the purpose, the utility model adopts the following technical scheme:

FPC binds type silicon-based OLED module, include:

a binding area is arranged at one edge of the first surface of the silicon-based chip;

the glass cover plate is covered and attached to the outside of the binding area of the first surface, extends to the outside of the edges of the rest of the first surface where the binding area is not arranged, is coated with a first protection piece on one side, close to the first surface, of the glass cover plate, and is surrounded on the periphery of the silicon-based chip;

and the FPC is bound to the binding area, and the binding area is coated with a second protection piece.

Optionally, the silicon-based chip and the glass cover plate are both arranged in a quadrilateral structure, and the binding area is arranged at a first edge of the first surface of the silicon-based chip.

Optionally, the silicon-based chip and the glass cover plate are bonded by an adhesive.

Optionally, the adhesive is provided as a UV curable gel.

Optionally, the adhesive member is configured in an S-shaped structure or a U-shaped structure.

Optionally, the length of the glass cover plate extending beyond the rest of the first surface where the binding region is not provided is 1.5mm-2.5mm.

Optionally, the length of the glass cover plate extending beyond the rest of the first surface where the binding region is not provided is 2mm.

Optionally, the first protection member and the second protection member are both provided as protection glue.

Optionally, the protective glue is epoxy resin glue.

Optionally, the FPC has a square structure, one end of the FPC is bound with the binding area, and the other end of the FPC extends along a direction away from the silicon-based chip.

The utility model has the beneficial effects that: according to the FPC binding type silicon-based OLED module, the glass cover plate is covered and attached to the outside of the binding area of the first surface, the glass cover plate extends to the outside of the edges of the other non-binding areas of the first surface, the FPC is bound to the binding area, and when the FPC binding type silicon-based OLED module is transported and used, the edges of the silicon-based chip can be effectively prevented from being knocked by external force by the arrangement of the glass cover plate, the edges of the silicon-based chip are prevented from being broken, and circuits on the silicon-based chip are prevented from being damaged; the glass cover plate is coated with a first protection piece on one side close to the first surface, the first protection piece is arranged on the periphery of the silicon-based chip in a surrounding mode, the periphery of the silicon-based chip is wrapped by the first protection piece, and when the glass cover plate is knocked by external force, the first protection piece can serve as a buffer to avoid the defect that edges and corners of the periphery of the silicon-based chip are broken; the binding area is coated with a second protection piece, and the second protection piece can protect the binding area from external damage and influence the connection of the FPC and the silicon-based chip.

Drawings

FIG. 1 is a schematic diagram of a structure of a glass cover plate and a silicon-based chip provided by an embodiment of the present utility model when the glass cover plate and the silicon-based chip are not bonded;

FIG. 2 is a schematic diagram of a bonded structure of a glass cover plate and a silicon-based chip according to an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of an FPC after being bound with a binding area according to an embodiment of the present utility model;

fig. 4 is a schematic structural view of a first protection member according to an embodiment of the present utility model after being coated on a glass substrate;

fig. 5 is a schematic diagram of the overall structure of the FPC binding-type silicon-based OLED module according to the embodiment of the present utility model.

In the figure:

100. a silicon-based chip; 110. a first surface; 111. binding area;

200. a glass cover plate; 300. a first protection member; 400. an FPC; 500. a second protector; 600. and an adhesive member.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

The embodiment provides an FPC binding type silicon-based OLED module, as shown in fig. 1-5, which includes a silicon-based chip 100, a glass cover plate 200 and an FPC400, wherein a binding area 111 is arranged at one edge of a first surface 110 of the silicon-based chip 100; the glass cover plate 200 is covered and attached to the outside of the binding region 111 of the first surface 110, the glass cover plate 200 extends to the outside of the edges of the other non-binding regions 111 of the first surface 110, one side of the glass cover plate 200, which is close to the first surface 110, is coated with a first protection piece 300, and the first protection piece 300 is surrounded on the peripheral side of the silicon-based chip 100; the FPC400 is bound to the binding region 111, and the binding region 111 is coated with the second protector 500.

According to the FPC binding type silicon-based OLED module provided by the utility model, the glass cover plate 200 is covered and attached to the outside of the binding area 111 of the first surface 110, the glass cover plate 200 extends to the outside of the edges of the other non-binding areas 111 of the first surface 110, the FPC400 is bound to the binding area 111, and when the FPC binding type silicon-based OLED module is transported and used, the arrangement of the glass cover plate 200 can effectively prevent the edges of the silicon-based chip 100 from being knocked by external force, avoid the edges of the silicon-based chip 100 from being broken and defective, and prevent circuits on the silicon-based chip 100 from being damaged; the glass cover plate 200 is coated with a first protection piece 300 on one side close to the first surface 110, the first protection piece 300 is arranged on the periphery of the silicon-based chip 100 in a surrounding mode, the first protection piece 300 wraps the periphery of the silicon-based chip 100, when the glass cover plate is knocked by external force, the first protection piece 300 can serve as a buffer, and the defect that edge and corner breakage occur on the periphery of the silicon-based chip 100 is avoided; the bonding area 111 is coated with a second protector 500, and the second protector 500 can protect the bonding area 111 from external damage, affecting the connection of the FPC400 and the silicon-based chip 100.

Alternatively, the silicon-based chip 100 and the glass cover plate 200 are both in a quadrilateral structure, the binding area 111 is arranged at the first edge of the first surface 110 of the silicon-based chip 100, and the silicon-based chip 100 and the glass cover plate 200 are regular in shape, so that the connection of the silicon-based chip 100 and the glass cover plate 200 is facilitated, and convenience and efficiency of assembly are improved.

In this embodiment, the silicon-based chip 100 and the glass cover plate 200 are bonded by the bonding member 600, and when assembling, the glass cover plate 200 and the silicon-based chip 100 are bonded by using a bonding machine, so that the silicon-based chip 100 and the glass cover plate 200 are bonded together, and the bonding reliability between the two is ensured.

Preferably, the adhesive 600 is set as a UV curable gel, which has a high curing speed, and can be cured in several seconds to several tens of seconds, which is advantageous for improving the production efficiency of the automatic production line.

During assembly, a certain amount of UV curing colloid is coated on the surface of the silicon-based chip 100, and the UV curing colloid can be preferably coated into an S-shaped structure or a U-shaped structure, so that the UV curing colloid is uniformly arranged on the silicon-based chip 100, and the bonding reliability of the silicon-based chip 100 and the glass cover plate 200 is improved.

Optionally, the length of the glass cover 200 extending beyond the edges of the first surface 110 where the binding region 111 is not provided is 1.5mm-2.5mm, so that the glass cover 200 has a sufficient extension length to prevent the collision of external force, so as to prevent the silicon-based chip 100 from being damaged, and then, a sufficient coating area can be reserved for the first protection member 300, so as to improve the coating and bonding effect. Preferably, the length of the glass cover plate 200 extending beyond the remaining edges of the first surface 110 where the binding region 111 is not provided is 2mm. For example, when the glass cover plate 200 and the silicon-based chip 100 are both in a quadrilateral structure, the binding region 111 is disposed at the first edge of the first surface 110 of the silicon-based chip 100, the glass cover plate 200 is covered on the silicon-based chip 100 and is attached to the outside of the binding region 111, and the three edges of the glass cover plate 200 respectively extend to the outside of the second edge, the third edge and the fourth edge of the first surface 110 by a length a of 2mm. In other embodiments, the thickness of the sheet may be set to be other than 1.5mm or 2.5mm, etc., as required.

Optionally, the first protection member 300 and the second protection member 500 are both provided with a protection adhesive, and the protection adhesive is coated on the first surface 110 of the glass cover plate 200 and surrounds the outer side of the silicon-based chip 100, so as to protect the CMOS circuit of the silicon-based chip 100 from external damage.

Optionally, the protective glue is epoxy resin glue, and the epoxy resin glue has higher adhesiveness and good electrical insulation.

Optionally, the FPC400 has a square structure, one end of the FPC400 is bound with the binding area 111, and the other end of the FPC400 extends along a direction away from the silicon-based chip 100, so that the other end of the FPC400 is connected with other parts conveniently in a reasonable layout.

As shown in fig. 1 to 5, the working process of the FPC binding type silicon-based OLED module provided in this embodiment includes:

s1, cutting out a glass cover plate 200 with a certain size according to the size requirement of the glass cover plate 200;

s2, uniformly coating the adhesive 600 on the first surface 110 of the silicon-based chip 100 by using a dispenser;

s3, using a laminating machine to laminate the glass cover plate 200 and the silicon-based chip 100, grabbing the edge of the glass cover plate 200 by a camera during lamination, aligning the edge with the edge of an operable area on the silicon-based chip 100, ensuring that the edge of the glass cover plate 200 extends to the outside of the edges of the other non-binding areas 111 of the first surface 110, and ensuring that the glass cover plate 200 covers the outside of the binding areas 111;

s4, after the glass cover plate 200 is attached to the silicon-based chip 100, the glass cover plate 200 and the silicon-based chip 100 are irradiated by using UV light so as to enable the adhesive piece 600 to be cured, and therefore the glass cover plate 200 and the silicon-based chip 100 are firmly adhered;

s5, binding the FPC400 to the binding region 111 of the silicon-based chip 100 by using a special FOG (Flexible On Glass, bonding machine), coating the second protection piece 500 on the binding region 111, and baking the second protection piece 500 to be solidified;

s6, turning the silicon-based chip 100 to enable the first surface 110 of the silicon-based chip 100 to face downwards, coating the first protection piece 300 on the glass cover plate 200, enabling the first protection piece 300 to be arranged on the periphery of the silicon-based chip 100 in a surrounding mode, and baking the first protection piece 300 to enable the first protection piece 300 to be solidified.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (10)

1. FPC binds type silicon-based OLED module, its characterized in that includes:

   a silicon-based chip (100), wherein a binding area (111) is arranged at one edge of a first surface (110) of the silicon-based chip (100);

   the glass cover plate (200) is covered and attached to the outside of the binding area (111) of the first surface (110), the glass cover plate (200) extends to the outside of the edges of the rest of the first surface (110) where the binding area (111) is not arranged, one side, close to the first surface (110), of the glass cover plate (200) is coated with a first protection piece (300), and the first protection piece (300) is arranged on the periphery of the silicon-based chip (100) in a surrounding mode;

   -an FPC (400) bound to said binding area (111), said binding area (111) being coated with a second protection (500).
2. 2. The FPC bonding type silicon-based OLED module according to claim 1, wherein the silicon-based chip (100) and the glass cover plate (200) are both provided in a quadrangular structure, and the bonding region (111) is disposed at a first edge of the first surface (110) of the silicon-based chip (100).
3. 3. The FPC-bonded silicon-based OLED module according to claim 1, characterized in that the silicon-based chip (100) and the glass cover plate (200) are bonded by an adhesive member (600).
4. 4. The FPC binding type silicon-based OLED module according to claim 3, characterized in that the adhesive (600) is provided as a UV-cured gel.
5. 5. The FPC binding type silicon-based OLED module according to claim 3, wherein the adhesive member (600) is provided in an S-shaped structure or a U-shaped structure.
6. 6. The FPC bonded silicon-based OLED module according to claim 1, characterized in that the length of the glass cover plate (200) extending beyond the edges of the first surface (110) where the bonding region (111) is not provided is 1.5mm-2.5mm.
7. 7. The FPC bonded silicon-based OLED module according to claim 6, characterized in that the length of the glass cover plate (200) extending beyond the rest of the first surface (110) where the bonding region (111) is not provided is 2mm.
8. 8. The FPC binding type silicon-based OLED module according to claim 1, wherein the first protector (300) and the second protector (500) are both provided as a protective paste.
9. 9. The FPC binding type silicon-based OLED module of claim 8, wherein the protective glue is epoxy glue.
10. 10. The FPC-bonded silicon-based OLED module according to claim 1, wherein the FPC (400) has a square structure, one end of the FPC (400) is bonded to the bonding region (111), and the other end of the FPC (400) extends in a direction away from the silicon-based chip (100).

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