CN217774838U - Intelligent detection device for wafer surface defects - Google Patents
Intelligent detection device for wafer surface defects Download PDFInfo
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- CN217774838U CN217774838U CN202221333256.0U CN202221333256U CN217774838U CN 217774838 U CN217774838 U CN 217774838U CN 202221333256 U CN202221333256 U CN 202221333256U CN 217774838 U CN217774838 U CN 217774838U
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Abstract
The utility model discloses an intelligent detection device for wafer surface defects, which comprises a frame, and a wafer input mechanism, a wafer transfer mechanism, a delivery inspection mechanism, a detection mechanism, a non-defective product output mechanism and a defective product output mechanism which are arranged on the frame; the wafer input mechanism is used for inputting a wafer to be tested; the wafer transfer mechanism is used for grabbing wafers to be detected from the wafer input mechanism and placing the wafers to be detected on the inspection mechanism and grabbing the wafers to be detected from the inspection mechanism and placing the wafers to be detected on the non-defective product output mechanism or the defective product output mechanism; the inspection mechanism is used for bearing the wafer to move along the horizontal longitudinal direction; the detection mechanism is used for detecting the wafer borne on the inspection mechanism; the good product output mechanism is used for outputting the tested good product wafer; and the defective product output mechanism is used for outputting the tested defective product wafer.
Description
Technical Field
The utility model relates to an optical detection technical field, concretely relates to wafer surface defect intelligent detection device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit in a display module, and the raw material of the wafer is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. As an important part in a display module, the detection of the wafer is an important part in the manufacturing process of the display module, and the existing detection of the surface defects of the wafer is carried out manually, so that the detection speed is low, the efficiency is low, and the wafer is easy to damage.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer surface defect intellectual detection system device is used for solving above-mentioned problem.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
an intelligent detection device for wafer surface defects comprises a base, and a wafer input mechanism, a wafer transfer mechanism, a delivery inspection mechanism, a detection mechanism, a non-defective product output mechanism and a defective product output mechanism which are arranged on the base;
the wafer input mechanism is used for inputting a wafer to be tested;
the wafer transfer mechanism is used for grabbing wafers to be detected from the wafer input mechanism and placing the wafers to be detected on the inspection mechanism and grabbing the wafers to be detected from the inspection mechanism and placing the wafers to be detected on the non-defective product output mechanism or the defective product output mechanism;
the inspection mechanism is used for bearing the wafer and moving along the horizontal longitudinal direction;
the detection mechanism is used for detecting the wafer carried on the inspection mechanism;
the good product output mechanism is used for outputting the tested good product wafer;
and the defective product output mechanism is used for outputting the tested defective product wafer.
Preferably, the wafer transfer mechanism comprises a plurality of groups which are adjacently arranged along the horizontal longitudinal direction, the wafer input mechanism comprises a wafer input table and an input table translation module, and the input table translation module is used for driving the wafer input table to move between the lower parts of the starting ends of the plurality of groups of wafer transfer mechanisms.
Preferably, the wafer input table comprises an input bottom frame, a first supporting and adjusting frame and a second supporting and adjusting frame, wherein the first supporting and adjusting frame and the second supporting and adjusting frame are arranged on the input bottom frame in a cross shape;
the first support adjusting frame comprises a first adjusting track, a first support rod, a first drive rod and a first adjusting motor, the first adjusting track is fixedly arranged on the input chassis horizontally and transversely, the first adjusting track is provided with two first support rods in a sliding mode, the two first support rods are in mirror symmetry, first rotating bearings are arranged at two ends of the first adjusting track, the first drive rod is rotatably arranged on the first rotating bearings and is driven by the first adjusting motor, the first drive rod is provided with a first regular thread section, a first reverse thread section and a first connecting section, the first regular thread section and the first reverse thread section are in mirror symmetry, the first connecting section is used for connecting the first regular thread section and the first reverse thread section, the two first support rods are respectively provided with a first regular thread hole and a second regular thread hole, the first regular thread section and the first reverse thread section are in thread fit with each other, and the first support rod is provided with a plurality of first transfer suction nozzles;
the second supports the alignment jig and includes second regulation track, second bracing piece, second actuating lever and second accommodate motor, the second is adjusted the track and is vertically set firmly along the level on the input chassis, and its central point puts and is equipped with the confession the intersection that first regulation track passed, the second is adjusted the track and is gone up to slide and be equipped with two the second bracing piece, and two second bracing piece mirror symmetry, the orbital both ends of second regulation are equipped with second swivel bearing, the second actuating lever rotates and sets up on the second swivel bearing, and it passes through the second adjusts motor drive, be equipped with mirror symmetry's second normal thread section, second back-end thread section on the second actuating lever and be used for connecting the second normal thread section, the second connecting segment of second back-end thread section, two be equipped with respectively on the second bracing piece with second normal thread section, second back-end thread section screw thread complex second normal thread hole and second normal thread hole, be equipped with a plurality of second transfer suction nozzles on the second bracing piece.
Preferably, the wafer transfer mechanism comprises a transfer driving module, a wafer transfer frame to be tested, a tested wafer transfer frame, a to-be-tested grabbing lifting module, a to-be-tested wafer grabbing head and a tested wafer grabbing head, wherein the transfer driving module is used for driving the wafer transfer frame to be tested and the tested wafer transfer frame to horizontally and transversely move, the to-be-tested grabbing lifting module is fixedly arranged on the wafer transfer frame to be tested and drives the to-be-tested wafer grabbing head to vertically lift, the to-be-tested wafer grabbing head is used for grabbing a to-be-tested wafer from the wafer input mechanism and placing the to-be-tested wafer on the inspection mechanism, the tested grabbing lifting module is fixedly arranged on the tested wafer transfer frame and drives the tested wafer grabbing head to vertically lift, and the tested wafer grabbing head is used for grabbing a tested wafer from the inspection mechanism and placing the tested wafer on the good product output mechanism or the defective product output mechanism.
Preferably, the censorship mechanism includes censorship translation module, censorship mount table, the rotatory module of wafer, censorship platform and ionic wind machine, censorship translation module sets firmly drive on the frame the censorship mount table is along horizontal longitudinal movement, the rotatory module of wafer sets firmly the drive on the censorship mount table the censorship platform rotates, the censorship platform is used for placing the wafer, the ionic wind machine passes through the fan mounting bracket setting and is in the top of censorship platform.
Preferably, the detection mechanism comprises a detection moving module, a detection moving platform, a detection lifting module, a detection lifting frame, a detection assembly and a detection positioning camera, the detection moving module is fixedly arranged on the machine base and drives the detection moving platform to horizontally move, the detection lifting module is fixedly arranged on the detection moving platform and drives the detection lifting frame to vertically lift, the detection assembly is arranged on the detection lifting frame, the detection positioning camera is fixedly arranged on the detection moving platform through a fixed mounting frame, and the lens of the detection positioning camera faces upwards;
the detection component comprises a laser adjusting platform, a laser mounting rack, a laser emitter, a laser controller, a camera mounting rack and a detection camera, the laser adjusting platform is fixedly arranged on the detection lifting rack and used for adjusting the position of the laser mounting rack, the laser emitter is arranged on the laser mounting rack and is controlled by the laser controller, laser emitter is including the left transmission head and the right transmission head that set up in opposite directions, and launch angle all inclines upwards, it passes through to detect the camera mounting bracket sets firmly detect on the crane, the detection camera lens that detects the camera up, and be located between the below of left side transmission head and right transmission head, the detection camera lens week side that detects the camera is equipped with the bounding wall.
Preferably, the laser adjusting station includes the adjusting part of two sets of stack settings, and wherein a set of adjusting part transversely adjusts, another group along the level adjusting part adjusts along vertical lift, adjusting part includes fixed plate, regulating plate and fine setting knob, the regulating plate slides and sets up on the fixed plate, the fixed plate is equipped with the first joint along one side of slip direction, the regulating plate is equipped with the second along one side of slip direction and connects, the one end fixed connection of fine setting knob is in on the first joint, the other end is connected with the second connects.
Preferably, the good product output mechanism comprises a good product output table and a good product output translation module, and the good product output translation module is used for driving the good product output table to move between the lower parts of the tail ends of the plurality of groups of wafer transfer mechanisms.
Preferably, substandard product output mechanism sets up the below of non-defective products output platform, it includes the shifting chute, installs bed frame, belt drive roller, conveyer, driving motor and prevents falling the board, the shifting chute sets firmly on the frame, the bottom side of installation bed frame is equipped with the slip card and establishes sliding base on the shifting chute, the both ends of installation bed frame are equipped with one respectively the belt drive roller is used for the cooperation to drive conveyer conveying, driving motor's output shaft and one of them group the belt drive roller is connected, prevent falling the board and set firmly between conveyer's the upper and lower layer, whether prevent falling to be equipped with a plurality of wafer sensors along the belt direction of transfer interval on the board and be used for monitoring conveyer and placed the wafer, the one end of installation bed frame still is equipped with the handle.
After the technical scheme is adopted, compared with the background art, the utility model, have following advantage:
the utility model provides a wafer surface defect intellectual detection system device, degree of automation is high, replaces the manpower, gets rid of the artificial harmful effects who participates in the contact to the wafer, can not cause the damage to the wafer, reduces intensity of labour, saves the cost, and detection effect is accurate, and the uniformity is strong, the quality of effectual assurance product.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the wafer input stage of the present invention;
FIG. 3 is a schematic structural view of the wafer transfer mechanism, the inspection mechanism and the detection mechanism of the present invention;
FIG. 4 is a schematic view of the inspection mechanism of the present invention;
FIG. 5 is a schematic view of the structure of the detecting mechanism of the present invention;
FIG. 6 is a schematic view of the structure of the detecting assembly of the present invention;
FIG. 7 is a schematic structural view of a laser adjusting table of the present invention;
fig. 8 is the utility model discloses yields output mechanism and substandard product output mechanism schematic structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are all based on the orientation or position relationship shown in the drawings, and are only for convenience of description, but not for indication or suggestion that the device or element of the present invention must have a specific orientation, and thus cannot be understood as a limitation of the present invention.
Examples
As shown in fig. 1 to 8, the utility model discloses an intelligent detection device for surface defects of wafers, which comprises a frame, and a wafer input mechanism 1, a wafer transfer mechanism 2, a delivery inspection mechanism 3, a detection mechanism 4, a non-defective product output mechanism 5 and a defective product output mechanism 6 which are arranged on the frame;
the wafer input mechanism 1 is used for inputting a wafer to be tested;
the wafer transfer mechanism 2 is used for grabbing a wafer to be detected from the wafer input mechanism 1 and placing the wafer on the inspection mechanism 3, grabbing a detected wafer from the inspection mechanism 3 and placing the detected wafer on the good product output mechanism 5 or the defective product output mechanism 6;
the delivery mechanism 3 is used for carrying the wafer to move along the horizontal longitudinal direction;
the detection mechanism 4 is used for detecting the wafer carried on the inspection mechanism 3;
the good product output mechanism 5 is used for outputting the tested good product wafer;
the defective product output mechanism 6 is used for outputting the detected defective wafers.
The wafer transfer mechanism 2 comprises a plurality of groups of wafer transfer mechanisms which are adjacently arranged along the horizontal longitudinal direction, the wafer input mechanism 1 comprises a wafer input table 11 and an input table translation module 12, and the input table translation module 12 is used for driving the wafer input table 11 to move between the lower parts of the initial ends of the plurality of groups of wafer transfer mechanisms.
The wafer input table 11 comprises an input chassis 111, a first supporting and adjusting frame 112 and a second supporting and adjusting frame 113, wherein the first supporting and adjusting frame 112 and the second supporting and adjusting frame 113 are arranged on the input chassis 112 in a cross shape;
the first support adjusting bracket 112 includes a first adjusting track 1121, a first support rod 1122, a first driving rod 1123 and a first adjusting motor 1124, the first adjusting track 1121 is horizontally and transversely fixed on the input chassis 111, the first adjusting track 1121 is provided with two first support rods 1122 in a sliding manner, the two first support rods 1122 are in mirror symmetry, two ends of the first adjusting track 1121 are provided with first rotating bearings 1125, the first driving rod 1123 is rotatably arranged on the first rotating bearings 1125 and is driven by the first adjusting motor 1124, the first driving rod 1123 is provided with a first positive thread section, a first reverse thread section and a first connecting section for connecting the first positive thread section and the first reverse thread section, the two first support rods 1122 are respectively provided with a first positive thread hole and a second positive thread hole which are in threaded fit with the first positive thread section and the first reverse thread section, and the first support rod nozzle 1122 is provided with a plurality of first reverse thread sections 1126;
the second support adjusting frame 113 includes a second adjusting track 1131, a second support rod 1132, a second driving rod 1133 and a second adjusting motor 1134, the second adjusting track 1131 is fixedly arranged on the input chassis 111 along the horizontal longitudinal direction, and the center position thereof is provided with an intersection for the first adjusting track 1121 to pass through, two second support rods 1132 are slidably arranged on the second adjusting track 1131, and the two second support rods 1132 are mirror-symmetrical, second rotating bearings 1135 are arranged at two ends of the second adjusting track 1131, the second driving rod 1133 is rotatably arranged on the second rotating bearings 1135 and is driven by the second adjusting motor 1134, a second positive thread section, a second negative thread section and a second connecting section for connecting the second positive thread section and the second negative thread section are arranged on the second support rod 1133, a second positive thread hole and a second positive thread hole which are in threaded fit with the second positive thread section and the second negative thread section are respectively arranged on the two second support rods 1132, and a plurality of second transfer nozzles 1136 are arranged on the second support rod.
The wafer transfer mechanism 2 comprises a transfer driving module 21, a wafer transfer rack 22 to be tested, a tested wafer transfer rack 23, a grabbing lifting module 24 to be tested, a tested grabbing lifting module 25, a wafer grabbing head 26 to be tested and a tested wafer grabbing head 27, wherein the transfer driving module 21 is used for driving the wafer transfer rack 22 to be tested and the tested wafer transfer rack 23 to move horizontally and transversely, the grabbing lifting module 24 to be tested is fixedly arranged on the wafer transfer rack 22 to be tested and drives the wafer grabbing head 26 to be tested to lift along the vertical direction, the wafer grabbing head 26 to be tested is used for grabbing a wafer to be tested from the wafer input mechanism 1 and placing the wafer to be tested on the inspection mechanism 3, the tested grabbing lifting module 25 is fixedly arranged on the tested wafer transfer rack 23 and drives the tested wafer grabbing head 27 to lift along the vertical direction, and the tested wafer grabbing head 27 is used for grabbing a tested wafer from the inspection mechanism 3 and placing the wafer onto the good product output mechanism 5 or the defective product output mechanism 6.
The inspection mechanism 3 comprises an inspection translation module 31, an inspection mounting table 32, a wafer rotation module 33, an inspection table 34 and an ion fan 35, the inspection translation module 31 is fixedly arranged on the machine base and drives the inspection mounting table 32 to move along the horizontal longitudinal direction, the wafer rotation module 33 is fixedly arranged on the inspection mounting table 32 and drives the inspection table 34 to rotate, the inspection table 34 is used for placing wafers, and the ion fan 35 is arranged above the inspection table 34 through a fan mounting frame.
The detection mechanism 4 comprises a detection moving module 41, a detection moving platform 42, a detection lifting module 43, a detection lifting frame 44, a detection assembly 45 and a detection positioning camera 46, wherein the detection moving module 41 is fixedly arranged on the machine base to drive the detection moving platform 42 to horizontally move, the detection lifting module 43 is fixedly arranged on the detection moving platform 42 to drive the detection lifting frame 44 to lift along the vertical direction, the detection assembly 45 is arranged on the detection lifting frame 44, and the detection positioning camera 46 is fixedly arranged on the detection moving platform 42 through a fixing mounting frame 47 with the lens upward;
the detection assembly 45 comprises a laser adjusting platform 451, a laser mounting rack 452, a laser emitter 453, a laser controller 454, a camera mounting rack 455 and a detection camera 456, the laser adjusting platform 451 is fixedly arranged on the detection lifting rack 44 and used for adjusting the position of the laser mounting rack 452, the laser emitter 453 is arranged on the laser mounting rack 452 and controlled by the laser controller 454, the laser emitter 453 comprises a left emitting head 4531 and a right emitting head 4532 which are arranged in opposite directions, the emitting angles of the left emitting head 4531 and the right emitting head 4532 are inclined upwards, the detection camera 456 is fixedly arranged on the detection lifting rack 44 through the camera mounting rack 455, a detection lens of the detection camera 456 faces upwards and is positioned between the left emitting head 4531 and the right emitting head 4532, and a wrapping plate 457 is arranged on the periphery side of the detection lens of the detection camera 456;
the laser adjusting platform 451 comprises two sets of adjusting assemblies 4511 which are arranged in a stacked mode, wherein one set of adjusting assemblies 4511 is adjusted horizontally and transversely, the other set of adjusting assemblies 4511 is adjusted vertically and vertically, each adjusting assembly 4511 comprises a fixing plate 45111, an adjusting plate 45112 and a fine adjustment knob 45113, the adjusting plate 45112 is arranged on the fixing plate 45111 in a sliding mode, a first joint 45114 is arranged on one side, in the sliding direction, of the fixing plate 45111, a second joint 45115 is arranged on one side, in the sliding direction, of the adjusting plate 45112, one end of the fine adjustment knob 45113 is fixedly connected to the first joint 45114, the other end of the fine adjustment knob 45113 is connected with a second joint 45115, and the relative distance between the fixing plate 45111 and the adjusting plate 45112 is adjusted through the fine adjustment knob 45113.
The good product output mechanism 5 comprises a good product output table 51 and a good product output translation module 52, and the good product output translation module 52 is used for driving the good product output table 51 to move between the lower parts of the tail ends of the plurality of groups of wafer transfer mechanisms 1.
The defective product output mechanism 6 is arranged below the defective product output table 51 and comprises a movable slide rail 61, an installation base frame 62, belt driving rollers 63, a conveying belt 64, a driving motor 65 and a falling-proof plate 66, wherein the movable slide rail 61 is fixedly arranged on the base frame, a sliding base 67 is arranged on the movable slide rail 61 in a sliding clamping manner at the bottom side of the installation base frame 62, the belt driving rollers 63 are respectively arranged at two ends of the installation base frame 62 and used for driving the conveying belt 64 to convey in a matched manner, an output shaft of the driving motor 65 is connected with one group of the belt driving rollers 63, the falling-proof plate 66 is fixedly arranged between the upper layer and the lower layer of the conveying belt 64, a plurality of wafer sensors 68 are arranged on the falling-proof plate 66 at intervals along the conveying direction of the belt and used for monitoring whether wafers are placed on the conveying belt, and a handle 69 is further arranged at one end of the installation base frame 62.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. The utility model provides a wafer surface defect intellectual detection system device which characterized in that: the device comprises a base, and a wafer input mechanism, a wafer transfer mechanism, a delivery inspection mechanism, a detection mechanism, a non-defective product output mechanism and a defective product output mechanism which are arranged on the base;
the wafer input mechanism is used for inputting a wafer to be tested;
the wafer transfer mechanism is used for grabbing a wafer to be tested from the wafer input mechanism and placing the wafer in the inspection mechanism, grabbing a tested wafer from the inspection mechanism and placing the wafer in the good product output mechanism or the defective product output mechanism;
the inspection mechanism is used for bearing the wafer and moving along the horizontal longitudinal direction;
the detection mechanism is used for detecting the wafer carried on the inspection mechanism;
the good product output mechanism is used for outputting the tested good product wafer;
and the defective product output mechanism is used for outputting the tested defective product wafer.
2. The intelligent detecting device for the surface defects of the wafer as claimed in claim 1, characterized in that: the wafer transfer mechanism comprises a plurality of groups which are horizontally and longitudinally arranged adjacently, the wafer input mechanism comprises a wafer input table and an input table translation module, and the input table translation module is used for driving the wafer input table to move between the plurality of groups of starting ends and the lower sides of the wafer transfer mechanism.
3. The intelligent wafer surface defect detection device of claim 2, wherein: the wafer input table comprises an input bottom frame, a first supporting and adjusting frame and a second supporting and adjusting frame, wherein the first supporting and adjusting frame and the second supporting and adjusting frame are arranged on the input bottom frame in a cross shape;
the first support adjusting frame comprises a first adjusting track, a first support rod, a first drive rod and a first adjusting motor, the first adjusting track is fixedly arranged on the input chassis horizontally and transversely, the first adjusting track is provided with two first support rods in a sliding mode, the two first support rods are in mirror symmetry, first rotating bearings are arranged at two ends of the first adjusting track, the first drive rod is rotatably arranged on the first rotating bearings and is driven by the first adjusting motor, the first drive rod is provided with a first regular thread section, a first reverse thread section and a first connecting section, the first regular thread section and the first reverse thread section are in mirror symmetry, the first connecting section is used for connecting the first regular thread section and the first reverse thread section, the two first support rods are respectively provided with a first regular thread hole and a second regular thread hole, the first regular thread section and the first reverse thread section are in thread fit with each other, and the first support rod is provided with a plurality of first transfer suction nozzles;
the second supports the alignment jig and includes second regulation track, second bracing piece, second actuating lever and second accommodate motor, the second is adjusted the track and is vertically set firmly along the level on the input chassis, and its central point puts and is equipped with the confession the intersection that first regulation track passed, the second is adjusted the track and is gone up to slide and be equipped with two the second bracing piece, and two second bracing piece mirror symmetry, the orbital both ends of second regulation are equipped with second swivel bearing, the second actuating lever rotates and sets up on the second swivel bearing, and it passes through the second adjusts motor drive, be equipped with mirror symmetry's second normal thread section, second back-end thread section on the second actuating lever and be used for connecting the second normal thread section, the second connecting segment of second back-end thread section, two be equipped with respectively on the second bracing piece with second normal thread section, second back-end thread section screw thread complex second normal thread hole and second normal thread hole, be equipped with a plurality of second transfer suction nozzles on the second bracing piece.
4. The intelligent wafer surface defect detection device of claim 1, wherein: the wafer transfer mechanism comprises a transfer driving module, a wafer transfer frame to be detected, a measured wafer transfer frame, a to-be-detected grabbing lifting module, a measured grabbing lifting module, a to-be-detected wafer grabbing head and a measured wafer grabbing head, wherein the transfer driving module is used for driving the wafer transfer frame to be detected and the measured wafer transfer frame to horizontally and transversely move, the to-be-detected grabbing lifting module is fixedly arranged on the wafer transfer frame to be detected and drives the to-be-detected wafer grabbing head to lift along the vertical direction, the to-be-detected wafer grabbing head is used for grabbing a wafer to be detected from the wafer input mechanism and placing the wafer to be detected to the inspection mechanism, the measured grabbing lifting module is fixedly arranged on the measured wafer transfer frame and drives the measured wafer grabbing head to lift along the vertical direction, and the measured wafer grabbing head is used for grabbing the wafer from the inspection mechanism and placing the measured wafer to a non-defective product output mechanism or a defective product output mechanism.
5. The intelligent wafer surface defect detection device of claim 1, wherein: the inspection mechanism comprises an inspection translation module, an inspection mounting platform, a wafer rotation module, an inspection platform and an ion fan, wherein the inspection translation module is fixedly arranged on the machine base and drives the inspection mounting platform to move horizontally and longitudinally, the wafer rotation module is fixedly arranged on the inspection mounting platform and drives the inspection platform to rotate, the inspection platform is used for placing wafers, and the ion fan is arranged above the inspection platform through a fan mounting rack.
6. The intelligent detecting device for the surface defects of the wafer as claimed in claim 1, characterized in that: the detection mechanism comprises a detection moving module, a detection moving platform, a detection lifting module, a detection lifting frame, a detection assembly and a detection positioning camera, wherein the detection moving module is fixedly arranged on the machine base and drives the detection moving platform to horizontally and transversely move, the detection lifting module is fixedly arranged on the detection moving platform and drives the detection lifting frame to vertically lift, the detection assembly is arranged on the detection lifting frame, the detection positioning camera is fixedly arranged on the detection moving platform through a fixed mounting frame, and the lens of the detection positioning camera faces upwards;
the utility model discloses a laser detection camera, including detection assembly, camera mounting bracket, laser control frame, detection camera, camera mounting bracket, detection camera all sets up be used for adjusting on the detection crane the position of laser control frame, laser emitter sets up on the laser mounting bracket, and it passes through laser control unit control, laser emitter is including the left transmitting head and the right transmitting head that set up in opposite directions, and the equal slope of launch angle upwards, the detection camera passes through the camera mounting bracket sets firmly on the detection crane, the detection camera lens of detection camera up, and be located between the below of left side transmitting head and right transmitting head, the detection camera lens week side of detection camera is equipped with the package hoarding board.
7. The intelligent detecting device for the surface defects of the wafer as claimed in claim 6, characterized in that: the laser adjusting platform comprises two sets of adjusting components which are stacked and arranged, wherein one set of adjusting components is transversely adjusted along the horizontal direction, and the other set of adjusting components is adjusted along the vertical lifting direction, the adjusting components comprise a fixing plate, an adjusting plate and a fine adjustment knob, the adjusting plate is slidably arranged on the fixing plate, a first joint is arranged on one side of the fixing plate along the sliding direction, a second joint is arranged on one side of the adjusting plate along the sliding direction, and the other end of the fine adjustment knob is fixedly connected to the first joint and connected to the second joint.
8. The intelligent detecting device for the surface defects of the wafer as claimed in claim 1, characterized in that: the good product output mechanism comprises a good product output platform and a good product output translation module, and the good product output translation module is used for driving the good product output platform to move between the lower parts of the tail ends of the plurality of groups of wafer transfer mechanisms.
9. The intelligent wafer surface defect detection device of claim 8, wherein: substandard product output mechanism sets up the below of yields output platform, it includes movable slide rail, installation bed frame, belt drive roller, conveyer, driving motor and prevents falling the board, movable slide rail sets firmly on the frame, the bottom side of installation bed frame is equipped with the slip card and establishes sliding base on the movable slide rail, the both ends of installation bed frame are equipped with one respectively the belt drive roller is used for the cooperation to drive conveyer conveying, driving motor's output shaft and wherein a set of the belt drive roller is connected, prevent falling the board and set firmly between conveyer's the upper and lower layer, whether it has placed the wafer to prevent falling and be equipped with a plurality of wafer sensors along belt direction of transfer interval on the board and be used for monitoring conveyer, the one end of installation bed frame still is equipped with the handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221333256.0U CN217774838U (en) | 2022-05-30 | 2022-05-30 | Intelligent detection device for wafer surface defects |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221333256.0U CN217774838U (en) | 2022-05-30 | 2022-05-30 | Intelligent detection device for wafer surface defects |
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| Publication Number | Publication Date |
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| CN217774838U true CN217774838U (en) | 2022-11-11 |
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| CN202221333256.0U Active CN217774838U (en) | 2022-05-30 | 2022-05-30 | Intelligent detection device for wafer surface defects |
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2022
- 2022-05-30 CN CN202221333256.0U patent/CN217774838U/en active Active
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