CN217140462U - Temperature control experimental device based on semiconductor refrigeration piece - Google Patents
Temperature control experimental device based on semiconductor refrigeration piece Download PDFInfo
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- CN217140462U CN217140462U CN202221085607.0U CN202221085607U CN217140462U CN 217140462 U CN217140462 U CN 217140462U CN 202221085607 U CN202221085607 U CN 202221085607U CN 217140462 U CN217140462 U CN 217140462U
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Abstract
The utility model discloses a control by temperature change experimental apparatus based on semiconductor refrigeration piece belongs to the semiconductor field, and its technical scheme main points include the temperature control box, the bottom fixedly connected with control box of temperature control box, the inside of temperature control box is provided with the temperature-sensing module, the inside of temperature control box is provided with the temperature and gives off the subassembly, the inside of temperature control box is provided with first heat-conducting plate, the front surface of control box is provided with the display screen, aims at having solved current partial temperature control experimental apparatus, and when using, the temperature can not be quick spread evenly, leads to the experimental efficiency to reduce, can not be fine the problem of satisfying the user demand.
Description
Technical Field
The utility model relates to a semiconductor field, in particular to control by temperature change experimental apparatus based on semiconductor refrigeration piece.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and has applications in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device made of the semiconductor, the importance of the semiconductor is very great from the viewpoint of science and technology or economic development, and most electronic products, such as computers, mobile phones or core units in digital recorders, are closely related to the semiconductor.
At present, when daily experiment in laboratory or carry out temperature regulation to article, need use temperature control device, and carry out temperature control through the semiconductor refrigeration piece is a means commonly used, however, current partial temperature control experimental apparatus, when using, the temperature can not be quick spread evenly, lead to experimental efficiency to reduce, can not be fine satisfy the user demand, consequently need one kind make the temperature can be quick spread evenly, improve the temperature control experimental apparatus based on the semiconductor refrigeration piece of experimental efficiency to a certain extent and satisfy the user's demand.
SUMMERY OF THE UTILITY MODEL
The utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece aims at solving current partial control by temperature change experimental apparatus, and when using, the temperature can not be quick spread evenly, leads to the experimental efficiency to reduce, the problem of satisfying the user demand that can not be fine.
The utility model discloses a realize like this, a control by temperature change experimental apparatus based on semiconductor refrigeration piece, including the temperature control box, the bottom fixedly connected with control box of temperature control box, the inside of temperature control box is provided with the temperature-sensing module, the inside of temperature control box is provided with the temperature and gives off the subassembly, the inside of temperature control box is provided with first heat-conducting plate, the front surface of control box is provided with the display screen.
In order to reach and make the temperature can evenly distribute fast in temperature control incasement portion, make the temperature control object can accomplish temperature control's effect fast simultaneously, conduct the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, it is preferred, the temperature distributes the subassembly and includes standing groove, first through-hole and first fan, the standing groove has been seted up to temperature control incasement's inside, first through-hole has been seted up to temperature control incasement's inside, the first fan of one side fixedly connected with of temperature control incasement wall.
In order to reach when semiconductor refrigeration piece body refrigerates the control by temperature change object, start the second fan, the second fan can accelerate the air flow speed between baffle and the control by temperature change case for under the effect of control by temperature change object cooling rate, the effect, as the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, it is preferred, the inside fixedly connected with baffle of control by temperature change case, one side fixedly connected with second fan of baffle.
In order to reach the effect that the lower air of second fan drive temperature can be carried to the control by temperature change object side through the second through-hole, conduct the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, it is preferred, the second through-hole has been seted up to the inside of control by temperature change case, the bottom of first heat-conducting plate is provided with semiconductor refrigeration piece body.
In order to reach and refrigerate at semiconductor refrigeration piece body top, when the operation is heated to the bottom, radiating effect can be accelerated to the fin, does the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, it is preferred, the bottom of semiconductor refrigeration piece body is provided with the second heat-conducting plate, the bottom of second heat-conducting plate is provided with the fin.
In order to reach the effect that the staff of being convenient for carries out control to the temperature of control by temperature change object through control button, conduct the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, it is preferred, the front surface of control box is provided with control button, the bottom of control box inner chamber is provided with control module.
In order to reach the temperature that the temperature sensing module surveyed the control by temperature change object, can carry to data processing module for under data processing module's effect that temperature data shows in display screen department, as the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, it is preferred, the bottom of control box inner chamber is provided with data processing module, data processing module's electrical input end and temperature sensing module's electrical output end electric connection, control module's electrical input end and data processing module's electrical output end electric connection, the bottom of control box inner chamber is provided with the battery.
In order to reach and rotate the dwang, the dwang can drive the effect of removing the cover motion, as the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, it is preferred, the front surface and the rear surface of control by temperature change case all rotate and are connected with the dwang, the outside threaded connection of dwang has the removal cover.
In order to reach when removing the cover motion, can drive the connecting plate motion, and then the connecting plate can drive the effect of adjusting the pole motion, as the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, it is preferred, remove the equal fixedly connected with connecting plate in both sides of cover, one side fixedly connected with who removes the cover is kept away from to the connecting plate adjusts the pole.
In order to reach when adjusting the pole motion, drive the curb plate motion for the curb plate can carry out the effect of fixing to the control by temperature change object, conduct the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, it is preferred, the one end fixedly connected with curb plate of pole is adjusted, the rear surface of curb plate is provided with the heat insulating board.
Compared with the prior art, the beneficial effects of the utility model are that:
the temperature control experimental device based on the semiconductor refrigeration sheet has the advantages that through the arrangement of the temperature emission component, when refrigeration operation needs to be carried out on a temperature control object after the temperature control object is fixed, the semiconductor refrigeration sheet body can be supplied with power through the storage battery, so that heat absorption refrigeration operation is carried out on the top of the semiconductor refrigeration sheet body, meanwhile, heating operation is carried out on the bottom of the semiconductor refrigeration sheet body, the second fan is started, the second fan accelerates the air flow speed of a space formed by the partition board and the temperature control box, air enters the side face of the temperature control object through the second through hole, the temperature of the temperature control object is further accelerated to be reduced, meanwhile, the temperature emission is uniform, the experimental efficiency is improved, the first fan is started, the first fan accelerates the air flow speed of the space where the radiating fins are located, the heat radiation is accelerated, when temperature rise operation needs to be carried out on the temperature control object by a worker, through the control button, control semiconductor refrigeration piece body top heats the operation, and the operation refrigerates in the bottom, under the effect of second fan, equally can be so that the temperature control object can rapid heating up, improves experimental efficiency, has solved current partial temperature control experimental apparatus, and when using, the temperature can not be quick spread evenly, leads to the experimental efficiency to reduce, the problem of satisfying the user demand that can not be fine.
Drawings
FIG. 1 is an overall structure diagram of the temperature control experimental device based on the semiconductor refrigeration sheet of the utility model;
FIG. 2 is a schematic structural view of the card temperature emitting assembly of the present invention;
FIG. 3 is a schematic view illustrating the structural connection between the first heat-conducting plate and the heat sink according to the present invention;
FIG. 4 is a schematic view of the internal structure of the cassette control box of the present invention;
fig. 5 is a schematic view of the structural connection between the movable sleeve and the side plate of the present invention.
In the figure, 1, a temperature control box; 2. a control box; 3. a temperature sensing module; 4. a temperature emitting assembly; 41. a placement groove; 42. a first through hole; 43. a first fan; 5. a first heat-conducting plate; 6. a display screen; 7. a control button; 8. rotating the rod; 9. a partition plate; 10. a second fan; 11. a second through hole; 12. a semiconductor chilling plate body; 13. a second heat-conducting plate; 14. a heat sink; 15. a control module; 16. a data processing module; 17. A storage battery; 18. moving the sleeve; 19. a connecting plate; 20. adjusting a rod; 21. a side plate; 22. an insulating panel.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, includes temperature control box 1, and the bottom fixedly connected with control box 2 of temperature control box 1, the inside of temperature control box 1 is provided with temperature-sensing module 3, and the inside of temperature control box 1 is provided with the temperature and gives off subassembly 4, and the inside of temperature control box 1 is provided with first heat-conducting plate 5, and the front surface of control box 2 is provided with display screen 6.
In this embodiment: by arranging the temperature emission component 4, after the temperature control object is fixed, when the temperature control object needs to be refrigerated, the semiconductor refrigeration sheet body 12 can be powered by the storage battery 17, so that the top of the semiconductor refrigeration sheet body 12 can absorb heat for refrigeration, meanwhile, the bottom of the semiconductor refrigeration sheet body 12 can be heated, the second fan 10 is started, the second fan 10 accelerates the air flow speed of the space formed by the partition board 9 and the temperature control box 1, air enters the side surface of the temperature control object through the second through hole 11, the temperature of the temperature control object is further accelerated to be cooled, meanwhile, the temperature emission is uniform, the experimental efficiency is improved, the first fan 43 is started, the first fan 43 accelerates the air flow speed of the space where the radiating fins 14 are located, the heat emission is accelerated, when a worker needs to heat the temperature control object, through the control button 7, control semiconductor refrigeration piece body 12 top and heat the operation, the operation of refrigerating is carried out to the bottom, under the effect of second fan 10, equally can be so that the temperature control object can rapid heating up, improves experimental efficiency, has solved current part control by temperature change experimental apparatus, and when using, the temperature can not be quick spread evenly, leads to the experimental efficiency to reduce, the problem of satisfying the user demand that can not be fine.
As a technical optimization scheme of the utility model, the temperature gives off subassembly 4 includes standing groove 41, first through-hole 42 and first fan 43, and standing groove 41 has been seted up to temperature control box 1's inside, and first through-hole 42 has been seted up to temperature control box 1's inside, the first fan 43 of one side fixedly connected with of temperature control box 1 inner wall.
In this embodiment: starting first fan 43, first fan 43 can be through first through-hole 42 with outside air transport to the inside of temperature control box 1, and then accelerate the heat and give off.
As a technical optimization scheme of the utility model, the inside fixedly connected with baffle 9 of temperature control box 1, one side fixedly connected with second fan 10 of baffle 9.
In this embodiment: through setting up second fan 10, under the effect of second fan 10 for the air can give off through second through-hole 11, makes the air flow speed accelerate simultaneously, increases the speed that the temperature gived off.
As a technical optimization scheme of the utility model, second through-hole 11 has been seted up to the inside of temperature control box 1, and the bottom of first heat-conducting plate 5 is provided with semiconductor refrigeration piece body 12.
In this embodiment: through setting up semiconductor refrigeration piece body 12, under the effect of first heat-conducting plate 5 for semiconductor refrigeration piece body 12 can be more smooth when carrying out heat absorption or refrigeration operation.
As a technical optimization scheme of the utility model, the bottom of semiconductor refrigeration piece body 12 is provided with second heat-conducting plate 13, and the bottom of second heat-conducting plate 13 is provided with fin 14.
In this embodiment: when the heating operation is performed at the bottom of the semiconductor chilling plate body 12, the heat dissipation speed can be increased.
As a technical optimization scheme of the utility model, the front surface of control box 2 is provided with control button 7, and the bottom of 2 inner chambers of control box is provided with control module 15.
In this embodiment: by arranging the control module 15, the working personnel can control the work of the semiconductor refrigeration piece body 12 through the control button 7.
As a technical optimization scheme of the utility model, the bottom of 2 inner chambers of control box is provided with data processing module 16, data processing module 16's electrical input end and temperature-sensing module 3's electrical output end electric connection, control module 15's electrical input end and data processing module 16's electrical output end electric connection, and the bottom of 2 inner chambers of control box is provided with battery 17.
In this embodiment: through setting up data processing module 16, can handle the temperature data of temperature-sensing module 3 transmission to show through display screen 6, the staff of being convenient for controls the work of semiconductor refrigeration piece body 12.
As a technical optimization scheme of the utility model, the front surface and the rear surface of temperature control box 1 all rotate and are connected with dwang 8, and the outside threaded connection of dwang 8 has the removal cover 18.
In this embodiment: through setting up dwang 8, rotating dwang 8, dwang 8 can drive and remove the 18 motion of cover.
As a technical optimization scheme of the utility model, the equal fixedly connected with connecting plate 19 in both sides of removing cover 18, one side fixedly connected with that connecting plate 19 kept away from and removed cover 18 adjusts pole 20.
In this embodiment: when the moving sleeve 18 moves, the adjusting rod 20 can be driven to move through the connecting plate 19, so that a worker can conveniently control the movement of the adjusting rod 20.
As a technical optimization scheme of the utility model, adjust the one end fixedly connected with curb plate 21 of pole 20, the rear surface of curb plate 21 is provided with heat insulating board 22.
In this embodiment: through setting up curb plate 21, when adjusting pole 20 motion, can drive curb plate 21 motion to can fix or take out the control by temperature change object.
The working principle is as follows: when the device is used by a worker, the device is placed stably, a temperature control object is placed inside the temperature control box 1, the rotating rod 8 is rotated, the rotating rod 8 drives the moving sleeve 18 to move, the moving sleeve 18 drives the connecting plate 19 to move, the connecting plate 19 drives the side plate 21 to move through the adjusting rod 20, so that the front surface and the rear surface of the temperature control object can be clamped by the side plate 21, the temperature control object can be fixed, when the worker needs to cool the temperature control object, the semiconductor refrigerating sheet body 12 can be powered by the storage battery 17, the top of the semiconductor refrigerating sheet body 12 can absorb heat for refrigerating, meanwhile, the bottom of the semiconductor refrigerating sheet body 12 can be heated, the second fan 10 is started, and the second fan 10 accelerates the air flow speed at a space formed by the partition plate 9 and the temperature control box 1, air enters the side surface of the temperature control object through the second through hole 11, so that the temperature reduction operation of the temperature control object is further accelerated, meanwhile, the temperature is uniformly diffused, the experimental efficiency is improved, the first fan 43 is started, the air flow speed of the space where the radiating fins 14 are located is increased by the first fan 43, the heat dissipation is increased, when the temperature of the temperature control object is required to be raised by the operator, the top of the semiconductor refrigerating sheet body 12 is controlled by the control button 7 to carry out heating operation, the bottom is controlled to carry out refrigerating operation, under the action of the second fan 10, the temperature of the temperature-controlled object can be rapidly raised, and the temperature sensing module 3 can measure the temperature of the temperature-controlled object, and then transmit the data to the data processing module 16, after the data processing module 16 finishes processing, the temperature of the temperature control object is displayed through the display screen 6, thereby facilitating the control of the work of the semiconductor chilling plate body 12 by the staff through the control button 7.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a control by temperature change experimental apparatus based on semiconductor refrigeration piece, includes temperature control box (1), its characterized in that: the bottom fixedly connected with control box (2) of temperature control case (1), the inside of temperature control case (1) is provided with temperature-sensing module (3), the inside of temperature control case (1) is provided with temperature and gives off subassembly (4), the inside of temperature control case (1) is provided with first heat-conducting plate (5), the front surface of control box (2) is provided with display screen (6).
2. The temperature control experimental device based on the semiconductor chilling plate according to claim 1, wherein: the temperature emitting assembly (4) comprises a placing groove (41), a first through hole (42) and a first fan (43), the placing groove (41) is formed in the temperature control box (1), the first through hole (42) is formed in the temperature control box (1), and the first fan (43) is fixedly connected to one side of the inner wall of the temperature control box (1).
3. The temperature control experimental device based on the semiconductor chilling plate according to claim 1, wherein: the inside fixedly connected with baffle (9) of temperature control case (1), one side fixedly connected with second fan (10) of baffle (9).
4. The temperature control experimental device based on the semiconductor chilling plate according to claim 1, wherein: a second through hole (11) is formed in the temperature control box (1), and a semiconductor chilling plate body (12) is arranged at the bottom of the first heat conduction plate (5).
5. The temperature control experimental device based on the semiconductor chilling plate according to claim 4, wherein: the bottom of semiconductor refrigeration piece body (12) is provided with second heat-conducting plate (13), the bottom of second heat-conducting plate (13) is provided with fin (14).
6. The temperature control experimental device based on the semiconductor chilling plate according to claim 1, wherein: the front surface of control box (2) is provided with control button (7), the bottom of control box (2) inner chamber is provided with control module (15).
7. The temperature control experimental device based on the semiconductor chilling plate according to claim 6, wherein: the bottom of control box (2) inner chamber is provided with data processing module (16), the electrical property input of data processing module (16) and the electrical property output electric connection of temperature-sensing module (3), the electrical property input of control module (15) and the electrical property output electric connection of data processing module (16), the bottom of control box (2) inner chamber is provided with battery (17).
8. The temperature control experimental device based on the semiconductor chilling plate according to claim 1, wherein: the front surface and the rear surface of the temperature control box (1) are both rotatably connected with a rotating rod (8), and the outer side of the rotating rod (8) is in threaded connection with a movable sleeve (18).
9. The temperature control experimental device based on the semiconductor chilling plate according to claim 8, wherein: both sides of the movable sleeve (18) are fixedly connected with connecting plates (19), and one side, far away from the movable sleeve (18), of each connecting plate (19) is fixedly connected with an adjusting rod (20).
10. The temperature control experimental device based on the semiconductor chilling plate according to claim 9, wherein: one end of the adjusting rod (20) is fixedly connected with a side plate (21), and a heat insulation plate (22) is arranged on the rear surface of the side plate (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221085607.0U CN217140462U (en) | 2022-05-07 | 2022-05-07 | Temperature control experimental device based on semiconductor refrigeration piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221085607.0U CN217140462U (en) | 2022-05-07 | 2022-05-07 | Temperature control experimental device based on semiconductor refrigeration piece |
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| Publication Number | Publication Date |
|---|---|
| CN217140462U true CN217140462U (en) | 2022-08-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221085607.0U Active CN217140462U (en) | 2022-05-07 | 2022-05-07 | Temperature control experimental device based on semiconductor refrigeration piece |
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| Country | Link |
|---|---|
| CN (1) | CN217140462U (en) |
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- 2022-05-07 CN CN202221085607.0U patent/CN217140462U/en active Active
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