CN216976993U - Heat radiator - Google Patents

Abstract

The application relates to the technical field of air conditioning, and discloses a radiator which comprises a base and a frequency conversion module, wherein the base is used for being in heat conduction connection with the frequency conversion module; the first fin group comprises a heat conduction surface and a heat dissipation surface which are opposite, and the heat conduction surface is in heat conduction connection with the base; the first fin group comprises a plurality of fins, partial fins extend outwards along the direction vertical to the radiating surface to form a second fin group, and the second fin group and the first fin group are in a step-shaped structure; under the condition of convection heat dissipation, the airflow flows through the stepped structure and is disturbed by the second fin group, so that the heat exchange time of the airflow and the fins is prolonged. The air flow flows through the step-shaped structure and is blocked by the second fin group, the air flow fluctuates at the step-shaped structure, so that the air flow is diffused to the periphery and cannot continuously flow along the original flowing direction, and in the process of diffusing the air flow to the periphery, the heat exchange time of the air flow and the fins on the periphery is prolonged, so that the heat exchange coefficients of the air flow and the fins on the periphery are improved, and the integral heat dissipation efficiency of the radiator is improved.

Description

Heat radiator

Technical Field

The present application relates to the field of air conditioning technology, for example to a heat sink.

Background

With the development of air conditioning technology, air conditioners continuously break through the refrigeration and heating technology under the limit condition. When the air conditioner is used for high-temperature refrigeration, the temperature of power components of the outdoor unit of the air conditioner needs to be reduced so that the air conditioner can operate reliably. Therefore, the radiator is added to the power component of the outdoor unit of the air conditioner.

At present, air-cooled aluminum fins are generally adopted for heat dissipation or a compressor refrigerant plate is adopted for heat dissipation and temperature reduction of the frequency conversion module. However, under the working condition of high ambient temperature, the temperature of the frequency conversion module is rapidly increased due to the fact that high heat flow density and high power of the frequency conversion module cannot effectively dissipate heat, and the problem that the compressor is subjected to frequency reduction and even the frequency conversion module is damaged and burnt is easily caused.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: the heat dissipation capacity of the existing radiator to the frequency conversion module is insufficient under the high-temperature refrigeration working condition, so that the air conditioner is greatly reduced in frequency, the refrigeration effect of the environment in a high-temperature day is poor, and the use experience of a user is influenced.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a radiator to solve the problem of poor radiating effect of the radiator.

In some embodiments, the heat sink comprises:

the base is in heat conduction connection with the frequency conversion module so as to absorb heat of the frequency conversion module;

the first fin group comprises a heat conduction surface and a heat dissipation surface which are opposite, and the heat conduction surface is in heat conduction connection with the base so as to dissipate heat transferred by the base;

the first fin group comprises a plurality of fins, and part of the fins extend outwards along the direction vertical to the heat dissipation surface and are constructed to form a second fin group, and the second fin group and the first fin group are in a step-shaped structure; under the condition of convection heat dissipation, the airflow flows through the step-shaped structure and is disturbed by the second fin group, so that the heat exchange time of the airflow and the fins is prolonged.

In some embodiments, a plurality of step-shaped structures are formed between the first fin group and the second fin group to increase a turbulent flow range of the airflow.

In some embodiments, a plurality of the stepped structures are circumferentially arranged along the circumferential direction of the second fin group.

In some embodiments, the area of the heat dissipation side of the second fin group is greater than one-half of the area of the heat conduction surface.

In some embodiments, a ratio of a height of the second fin group to a height of the first fin group in a direction perpendicular to the heat radiating surface is less than or equal to one-half.

In some embodiments, the second fin group is configured with one or more open grooves, and the width direction symmetrical dividing line of the open grooves is perpendicular to the fins;

under the condition of convection heat dissipation, airflow flows through gaps between adjacent fins, meets the open grooves and then is divided into the gaps between the adjacent fins, so that the heat exchange time of the airflow and the fins is prolonged.

In some embodiments, the open slots extend to the first fin group;

and the depth of the open grooves is less than or equal to one half of the height of the fins along the direction perpendicular to the heat radiating surface.

In some embodiments, the heat sink further comprises:

the heat pipe is in heat conduction connection with the base and the first fin group, and a phase-changeable medium is filled in the heat pipe so as to transfer heat of the base to the first fin group through medium phase change;

wherein the heat pipe is disposed along a length direction of the base.

In some embodiments, a siphon structure is arranged in the heat pipe to drive the circulation flow of the medium.

In some embodiments, the base is stepped, comprising:

the high step part is in heat conduction connection with the heat conduction surface of the first fin group;

the low step part is in heat conduction connection with the frequency conversion module;

the low step part and the heat conducting surface of the first fin group define an accommodating space, and the accommodating space is used for accommodating the heat pipe.

The radiator provided by the embodiment of the disclosure can realize the following technical effects:

the base absorbs heat generated by the frequency conversion module and transmits the heat to the first fin group, part of fins of the first fin group extend outwards to form a second fin group, the heat of the first fin group is transmitted to the second fin group along the fins for heat dissipation, under the condition of convective heat dissipation, airflow flows through the step-shaped structures of the first fin group and the second fin group, and airflow fluctuation occurs at the step-shaped structures due to obstruction of the second fin group, so that the airflow is diffused to the periphery and cannot continue to flow along the original flow direction.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

fig. 1 is a schematic structural diagram of the heat sink provided in the embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of another view of the heat sink provided by the embodiment of the present disclosure;

FIG. 3 is a schematic view of an assembly of the fin set and the heat pipe provided by an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of the base provided by the embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of another perspective view of the base according to the embodiment of the present disclosure.

Reference numerals:

10: a base; 101: a high step portion; 102: a low step portion; 103: a first surface; 104: a second surface; 105: mounting holes; 20: a first fin group; 201: a heat conducting surface; 202: a heat dissipating surface; 203: a fin; 30: a second fin group; 301: a step-shaped structure; 302: an open slot; 40: a heat pipe.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

The terms "first," "second," and the like in the description and claims of the embodiments of the disclosure and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

In the embodiments of the present disclosure, terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and their examples and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.

The term "plurality" means two or more unless otherwise specified.

In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. E.g., a and/or B, represents: a or B, or A and B.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

With reference to fig. 1 to 5, an embodiment of the present disclosure provides a heat sink, which includes a base 10 and a first fin group 20, wherein the base 10 is used for being in heat conduction connection with a frequency conversion module to absorb heat of the frequency conversion module; the first fin group 20 comprises a heat conducting surface 201 and a heat radiating surface 202 which are opposite, and the heat conducting surface 201 is in heat conducting connection with the base 10 so as to radiate heat transferred by the base 10; the first fin group 20 comprises a plurality of fins 203, part of the fins 203 extend outwards along a direction perpendicular to the heat radiating surface 202 and are configured to form a second fin group 30, and the second fin group 30 and the first fin group 20 are in a step-shaped structure 301; under the condition of convection heat dissipation, the airflow flows through the step-shaped structure 301 and is disturbed by the second fin group 30, so that the heat exchange time between the airflow and the fins 203 is prolonged.

By adopting the radiator provided by the embodiment of the disclosure, the base 10 absorbs heat generated by the frequency conversion module and transfers the heat to the first fin group 20, part of the fins 203 of the first fin group 20 extends outwards to form the second fin group 30, the heat of the first fin group 20 is transferred to the second fin group 30 along the fins 203 for heat dissipation, under the condition of convection heat dissipation, airflow flows through the step-shaped structures 301 of the first fin group 20 and the second fin group 30, and is blocked by the second fin group 30, airflow fluctuation occurs at the step-shaped structures 301, so that the airflow cannot continue to flow along the original flow direction, the airflow is diffused to the periphery, in the process of diffusing the airflow to the periphery, the heat exchange time between the airflow and the surrounding fins 203 is prolonged, the airflow and the fins 203 perform sufficient heat exchange, thereby improving the heat exchange coefficients of the airflow and the fins 203, and further improving the overall heat dissipation efficiency of the radiator, the temperature of the frequency conversion module is reduced.

The base 10 has a plate-like structure. The base 10 is not only connected in a heat-conducting manner to the frequency conversion module, but also detachably connected. Wherein the frequency conversion module can be connected to the base 10 by a fastener, or the frequency conversion module can be connected to the base 10 by a heat conductive silicone adhesive, or the frequency conversion module can be welded to the base 10. In addition, a heat conducting fin can be arranged between the base 10 and the frequency conversion module to improve the heat transfer efficiency between the frequency conversion module and the base 10, and further improve the heat dissipation and cooling effects on the frequency conversion module.

The base 10 includes a first surface 103 and a second surface 104 opposite to each other, wherein the first surface 103 is attached to and connected to the heat conduction surface 201 of the first fin group 20. In this way, the heat of the base 10 can be quickly transferred to the first fin group 20, and the heat transfer efficiency between the base 10 and the first fin group 20 is improved. After the heat is transferred to the first fin group 20, the heat of the heat conduction surface 201 of the first fin group 20 is transferred to the heat dissipation surface 202 along the fins 203, and is heat-exchanged with the air of the surrounding environment by a convection method, thereby performing heat dissipation and temperature reduction. It should be noted that the second surface 104 of the base 10 is thermally connected to the frequency conversion module.

Optionally, the first fin group 20 includes a plurality of fins 203, and first edges of the fins 203 are bent in the first direction and connected with adjacent fins 203 to configure to form the heat conduction surface 201.

The heat conducting surface 201 is formed by connecting the first edge bending of the plurality of fins 203 with the adjacent fins 203, and the heat conducting surface 201 is attached to the base 10 for heat conducting connection, so that the heat conducting area of the first fin group 20 and the base 10 can be enlarged, and the heat transfer efficiency of the base 10 and the first fin group 20 is improved. The first fin group 20 is bent and connected through the first edges of the plurality of fins 203 to form the heat conduction surface 201, which is helpful to improve the connection stability between the first fin group 20 and the base 10.

In addition, in the form that the first fin group 20 is connected by bending the first edges of the plurality of fins 203, the distance between the adjacent fins 203 can be controlled by adjusting the bending size, so that the distance between the adjacent fins 203 can be adjusted. In the existing effective installation space, the number of the fins 203 can be increased by reducing the distance between the adjacent fins 203, and further the heat dissipation area of the heat sink is increased. Compare current crowded radiator of aluminium, this embodiment can improve the whole heat transfer efficiency of radiator and heat radiating area in effective space and under the condition that does not change the whole volume of radiator, and then improved the whole heat transfer performance of radiator, effectively solve base 10 and frequency conversion module's heat dissipation problem.

The partial fins 203 of the first fin group 20 extend outward in the direction perpendicular to the heat radiating surface 202, and are configured to form the second fin group 30, and the second fin group 30 and the first fin group 20 are in a step-like structure 301. Note that, the partial fins 203 of the first fin group 20 extend outward, and a partial region of the partial fins 203 may extend outward. Thus, the heat dissipation area of the second fin group 30 is smaller than that of the first fin group 20.

When the radiator is installed in an outdoor unit of an air conditioner, the second fin group 30 is located below the first fin group 20, that is, the second fin group 30 is formed by extending a partial region of the first fin group 20 downward. The second fin group 30 and the first fin group 20 are in a step-shaped structure 301, so that interference with adjacent parts, especially with fan blades of a fan, can be avoided when the first fin group 20 extends downwards to form the second fin group 30. The second fin group 30 not only can make full use of the space inside the outdoor unit of the air conditioner, but also can improve the heat dissipation effect of the heat sink.

Under the condition of convection heat dissipation, airflow flows through the stepped structure 301 of the first fin group 20 and the second fin group 30, and due to the obstruction of the second fin group 30, the airflow fluctuates at the stepped structure 301, so that the airflow cannot continue to flow along the original flow direction, and the airflow diffuses towards the periphery, and in the process of diffusing towards the periphery, the contact time between the airflow and the fins 203 is prolonged, so that the heat exchange time between the airflow and the surrounding fins 203 is prolonged, the airflow and the fins 203 perform sufficient heat exchange, the heat exchange coefficients of the airflow and the fins 203 are improved, the overall heat dissipation efficiency of the radiator is improved, and the temperature of the frequency conversion module is reduced.

Optionally, a plurality of stepped structures 301 are formed between the first fin group 20 and the second fin group 30 to increase a turbulent flow range of the airflow.

A plurality of step-shaped structures 301 are formed between the first fin group 20 and the second fin group 30, and under the condition of convection heat dissipation, when the airflow flows through the plurality of step-shaped structures 301, the fluctuation range of the airflow is enlarged, so that the airflow cannot continuously flow along the original flow direction, and therefore the airflow and the fins 203 perform sufficient heat exchange, and further the heat dissipation effect of the fins 203 is improved.

Alternatively, a plurality of stepped structures 301 formed between the first fin group 20 and the second fin group 30 may be provided at intervals.

Alternatively, the step heights of the plurality of stepped structures 301 formed between the first fin group 20 and the second fin group 30 are partially or entirely the same. It can be understood that, in the case where the step heights of the plurality of stepped structures 301 are not completely the same, the fluctuation range of the airflow passing through the stepped structures 301 can be further expanded, and the contact time, i.e., the heat exchange time, of the airflow with the fins 203 can be prolonged.

Alternatively, a plurality of step-like structures 301 are circumferentially provided along the circumferential direction of the second fin group 30.

The plurality of step-shaped structures 301 are circumferentially arranged along the circumferential direction of the second fin group 30, so that on one hand, when the radiator is installed, the second fin group 30 is prevented from interfering with other parts; on the other hand, in order to further increase the disturbance range of the airflow, the airflow flowing through the gap between the fins 203 can exchange heat with the airflow of the surrounding environment, and after the temperature of the airflow flowing through the fins 203 is reduced, the airflow exchanges heat with the fins 203, so that the heat dissipation effect of the fins 203 is improved, and the heat dissipation efficiency of the heat sink is improved.

The plurality of stepped structures 301 are provided along the circumferential edge of the second fin group 30, and the total length of the plurality of stepped structures 301 is at least greater than one-half of the total length in the circumferential direction of the second fin group 30.

Alternatively, the area of the heat radiation side of the second fin group 30 is larger than half of the area of the heat conduction surface 201.

The area of the heat radiation side of the second fin group 30 can be understood as the area of the heat radiation surface 202 of the second fin group 30. In this way, when the area of the heat radiating surface 202 of the second fin group 30 is larger than half of the area of the heat conducting surface 201, the heat radiating area of the fins 203 of the heat sink can be enlarged while the stepped structure 301 is secured, thereby improving the heat radiating efficiency of the heat sink.

Optionally, the ratio of the height of the second fin group 30 to the height of the first fin group 20 in the direction perpendicular to the heat dissipating surface 202 is less than or equal to one-half.

The second fin group 30 and the first fin group 20 are integrally formed. Under the condition that the ratio of the height of the second fin group 30 to the height of the first fin group 20 is less than or equal to one half, not only the disturbance effect on the air flow can be ensured, but also the heat dissipation area of the fins 203 can be ensured, thereby achieving a better heat dissipation effect.

In addition, the ratio of the height of the second fin group 30 to the height of the first fin group 20 is less than or equal to one half, which not only can prevent the second fin group 30 from extending excessively to affect the installation of other parts, but also can prevent the turbulent acting force from affecting the connection stability of the first fin group 20 and the base 10 when the airflow flows through the second fin group 30.

Optionally, the second fin group 30 is configured with one or more open slots 302, and the symmetrical dividing line of the width direction of the open slots 302 is perpendicular to the fins 203; under the condition of convection heat dissipation, the airflow flows through the gaps of the adjacent fins 203, meets at the open grooves 302, and then is divided to the gaps of the adjacent fins 203, so that the heat exchange time between the airflow and the fins 203 is prolonged.

The heat dissipating surface 202 of the second fin group 30 is configured with open grooves 302, it being understood that the open grooves 302 are formed in a recessed configuration from the heat dissipating surface 202 toward the inside of the second fin group 30. In this way, the portion of the fin 203 at the bottom of the open slot 302, i.e., the portion of the fin 203 inside the second fin group 30, can not only directly exchange heat with the surrounding environment, but also the air flow passing through the gap between the adjacent fins 203 in the second fin group 30 meets at the open slot 302. The heat exchange of the converged air flow is facilitated, the heat at the open grooves 302 is uniformly distributed, and the air flow continues to flow to the gaps of the next part of adjacent fins 203 after being converged by the open grooves 302 until flowing out of the second fin group 30, so that the purpose of convection heat dissipation is achieved.

Optionally, open slots 302 extend through the heat dissipation surface 202 of the second fin group 30. It will be appreciated that each fin 203 in the second fin group 30 is provided with a notch. The plurality of notches are sequentially combined to form the open groove 302.

Alternatively, the slots 302 are linear, and the slots 302 run crosswise to the direction of airflow. Preferably, the slots 302 run perpendicular to the direction of flow of the gas stream. Thus, on one hand, the machining is convenient, and on the other hand, the heat exchange is facilitated by the air flow intersection at the open grooves 302.

Alternatively, the symmetrical dividing line of the width direction of the open groove 302 is perpendicular to the fins 203 of the second fin group 30. That is, the vertical plane of the symmetrical dividing line in the width direction of the open groove 302 is perpendicular to the plane of the fin 203 of the second fin group 30. It will be appreciated that the open slots 302 run perpendicular to the direction of airflow through the gaps between adjacent fins 203 in the second set of fins 30.

After the air flows flowing into the open grooves 302 meet each other in the open grooves 302, a part of the air flows continue to flow along the original flow trajectory, and the other part of the air flows diffuse in the other direction of the open grooves 302, join the air flows from the gaps of the adjacent fins 203 to exchange heat, and then flow into the gaps of the other fins 203 in the flowing process. When the other directions of airflow open slot 302 diffuse, based on the trend of open slot 302 and the airflow flow direction looks perpendicular that flows through the clearance of adjacent fin 203 in second fin group 30, can avoid being located the airflow of front side open slot 302 department and flow back to the open slot 302 that is located oblique rear side, and then avoid taking place the turbulent flow, can also help the airflow evenly to converge simultaneously, improve heat exchange efficiency.

Optionally, the open slots 302 extend to the first fin group 20; wherein, along the direction perpendicular to the heat dissipation surface 202, the depth of the open grooves 302 is less than or equal to one half of the height of the fins 203. Here, the fins 203 are the fins 203 at the positions of the open grooves 302.

By extending the open slots 302 to the first fin group 20, the heat exchange time of the fins 203 of the first fin group 20 with the air flow can be prolonged. That is, the portion of the fins 203 inside the first fin group 20 can not only directly exchange heat with the surrounding environment, but also the air flows flowing through the gaps of the adjacent fins 203 in the first fin group 20 meet at the open grooves 302. The heat exchange of the converged air flow is facilitated, so that the heat at the open grooves 302 is uniformly distributed, and the air flow continues to flow to the gap of the next part of adjacent fins 203 after being converged by the open grooves 302 until flowing out of the first fin group 20, so that the heat dissipation efficiency of the first fin group 20 is improved.

Under the condition that the depth of the open slot 302 is less than one half of the height of the fin 203, not only can the strength of the fin group be ensured, but also the middle and inner fin 203 parts of the fin group can exchange heat with the surrounding environment through the open slot 302, thereby avoiding overheating of the middle part of the fin group, being beneficial to improving the heat exchange efficiency of the fin 203 of the fin group and the surrounding environment, and further improving the heat dissipation efficiency of the radiator.

Alternatively, the plurality of open grooves 302 are uniformly spaced. In this way, processing is facilitated. In addition, the plurality of open grooves 302 are evenly spaced, so that the structure of the second fin group 30 is symmetrical.

Alternatively, some or all of the open slots 302 may have the same width.

In the case where the widths of the partially opened grooves 302 are the same, the widths of the opened grooves 302 may be proportional to the local temperatures of the second fin group 30 and the first fin group 20. That is, the higher the local temperature of the second fin group 30 and the first fin group 20 is, the larger the width of the open groove 302 provided therein is. Therefore, the heat exchange efficiency between the fins 203 of the fin group and the surrounding environment can be improved, the heat dissipation efficiency of the radiator is further improved, and the temperature of the frequency conversion module is reduced.

In addition, under the condition that the widths of all the open slots 302 are the same, the fin groups are symmetrical in structure, and under the condition that the fin groups are in heat conduction connection with the base 10, based on the symmetrical structure of the fin groups, the base 10 can be guaranteed to be stressed uniformly, so that the stability of the radiator in the use process is guaranteed.

Optionally, some or all of the open slots 302 are of the same depth.

Where the depth of the partially open slots 302 is the same, the depth of the open slots 302 may be proportional to the local temperature of the fin pack. That is, the higher the local temperature of the fin group, the greater the depth of the open groove 302 provided therein. Therefore, air in the surrounding environment is fully contacted with the inside of the fin group, the heat exchange efficiency between the fins 203 of the fin group and the surrounding environment can be improved, the heat dissipation efficiency of the radiator is further improved, and the temperature of the frequency conversion module is reduced.

In addition, under the condition that the depths of all the open grooves 302 are the same, the structure of the fin group is symmetrical, and under the condition that the fin group is in heat conduction connection with the base 10, the base 10 can be uniformly stressed based on the symmetrical structure of the fin group, so that the stability of the radiator in the use process is ensured.

Optionally, the heat sink further comprises: the heat pipe 40 is in heat conduction connection with the base 10 and the first fin group 20, and a phase-changeable medium is filled in the heat pipe 40 so as to transfer heat of the base 10 to the first fin group 20 through medium phase change; wherein the heat pipe 40 is disposed along a length direction of the base 10.

The heat pipe 40 is in heat conduction connection with the base 10, and a medium on the heat conduction connection side of the heat pipe 40 and the base 10 is heated to change phase, moves to a region with lower temperature, namely moves to the first fin group 20, exchanges heat with the first fin group 20, and dissipates heat and reduces temperature through the first fin group 20.

In the heat sink provided by the embodiment of the present disclosure, the heat transferred to the base 10 by the frequency conversion module can be directly transferred to the first fin group 20, and can also be transferred to the first fin group 20 for heat dissipation through the phase change of the medium in the heat pipe 40. Wherein the heat transfer efficiency through the phase change of the medium in the heat pipe 40 is higher than the direct heat transfer efficiency of the base 10 and the first fin group 20. Compared with the prior art, the heat dissipation efficiency of the base 10 can be improved through the phase change heat transfer of the medium in the heat pipe 40, and the temperature of the frequency conversion module is reduced.

It should be noted that, the heat pipe 40 is disposed along the length direction of the base 10, which can improve the temperature uniformity of the base 10, that is, the medium in the heat pipe 40 corresponding to the region with higher temperature of the base 10 is heated to change phase, and flows to the region with lower temperature corresponding to the base 10 on one side, and flows to the side close to the first fin group 20 on the other side, thereby helping to provide the temperature uniformity of different positions of the base 10.

In addition, under the driving of high-temperature heat, the medium in the heat pipe 40 does not need to be driven by electricity, and self-circulation flow is realized by phase change, namely, density difference under different forms. And the structural design of the step-shaped structure 301 and the open slot 302 formed by combining the first fin group 20 and the second fin group 30 greatly improves the heat dissipation effect of the heat sink when forced convection heat dissipation is performed.

Optionally, the phase-changeable medium is a refrigerant.

Alternatively, the heat pipe 40 has a linear structure, which can effectively avoid temperature difference.

Optionally, the heat pipe 40 is flat, and two opposite side surfaces are in heat conduction contact with the heat conduction surface 201 of the first fin group 20 and the base 10 respectively, so as to enlarge the heat conduction area of the heat pipe 40 with the first fin group 20 and the base 10.

Two side surfaces of the flat heat pipe 40 are in heat conduction connection with the heat conduction surface 201 of the first fin group 20 and the surface of the base 10 respectively. Compared with the tubular structure, the heat conducting area between the first fin group 20 and the base 10 is enlarged, and the corresponding heat transfer efficiency is improved.

Optionally, the flat heat pipe 40 is embedded in the heat conducting surface 201 of the first fin group 20, so that the heat conducting area between the heat pipe 40 and the first fin group 20 can be further enlarged, which is beneficial to improving the heat dissipation effect of the first fin group 20 on the base 10, thereby effectively cooling the frequency conversion module.

Optionally, a siphon structure is provided in heat pipe 40 to drive the circulation of the medium.

Under the action of the siphon structure, the liquid medium in the heat pipe 40 can flow along the inner wall of the heat pipe 40 by the siphon force to the heat absorption side of the heat pipe 40, i.e. the heat conduction connection side of the heat pipe 40 and the base 10, and under the condition that the medium is heated, evaporated and changed into a gas state, the medium is driven to flow to the heat dissipation side of the heat pipe 40, i.e. the heat conduction connection side of the heat pipe 40 and the fin group. The medium is driven to circularly flow through the siphon structure, so that the medium resists gravity, and the heat dissipation efficiency of the radiator is improved.

Optionally, the wick structure includes, but is not limited to, a groove, a metal mesh, a metal powder layer. Wherein the metal powder layer may be copper powder.

Optionally, the base 10 is stepped, comprising: a high step portion 101 thermally connected to the heat-conducting surface 201 of the first fin group 20; the low step part 102 is in heat conduction connection with the frequency conversion module; the stepped portion 102 and the heat conducting surface 201 of the first fin group 20 define an accommodating space for accommodating the heat pipe 40.

The stepped part 102 is connected with the frequency conversion module in a heat conduction manner, and the heat pipe 40 is arranged in an accommodating space defined by the stepped part 102 and the heat conduction surface 201 of the first fin group 20, so that on one hand, the heat pipe 40 can receive the heat of the stepped part 102 to cool the stepped part 102; on the other hand, the stepped-down portion 102 and the stepped-up portion 101 have a stepped structure 301, which facilitates the installation of the inverter module and the base 10.

Optionally, the fins 203 of the first fin group 20 extend toward the accommodating space until being connected with the stepped portion 102 in a heat conduction manner. This can enlarge the heat transfer area between the base 10 and the first fin group 20. Optionally, the heat pipe 40 is embedded in the first fin group 20 extending to the accommodating space, and the first fin group 20 covers the heat pipe 40 in a semi-wrapping manner, so that the heat transfer area between the heat pipe 40 and the first fin group 20 can be enlarged.

Optionally, the stepped-down portion 102 is configured with a mounting hole 105 for mounting the inverter module. The installation hole 105 is disposed away from the area where the heat pipe 40 is located. Thus, interference with the heat pipe 40, which causes unnecessary loss, can be prevented.

The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A heat sink, comprising:

the base is in heat conduction connection with the frequency conversion module so as to absorb heat of the frequency conversion module;

the first fin group comprises a heat conduction surface and a heat dissipation surface which are opposite, and the heat conduction surface is in heat conduction connection with the base so as to dissipate heat transferred by the base;

the first fin group comprises a plurality of fins, and part of the fins extend outwards along the direction vertical to the heat dissipation surface and are constructed to form a second fin group, and the second fin group and the first fin group are in a step-shaped structure; under the condition of convection heat dissipation, the airflow flows through the stepped structure and is disturbed by the second fin group, so that the heat exchange time of the airflow and the fins is prolonged.

2. The heat sink of claim 1,

a plurality of step-shaped structures are formed between the first fin group and the second fin group so as to increase the turbulent flow range of airflow.

3. The heat sink of claim 2,

the plurality of step-shaped structures are arranged around the second fin group in the circumferential direction.

4. The heat sink of claim 1,

the area of the heat dissipation side of the second fin group is larger than one half of the area of the heat conduction surface.

5. The heat sink of claim 1,

the ratio of the height of the second fin group to the height of the first fin group is less than or equal to one half along the direction perpendicular to the heat radiating surface.

6. The heat sink of claim 1,

the second fin group is provided with one or more open grooves, and symmetrical dividing lines in the width direction of the open grooves are perpendicular to the fins;

under the condition of convection heat dissipation, airflow flows through gaps between adjacent fins, meets the open grooves and then is divided into the gaps between the adjacent fins, so that the heat exchange time of the airflow and the fins is prolonged.

7. The heat sink of claim 6,

the open slot extends to the first fin group;

and the depth of the open grooves is less than or equal to one half of the height of the fins along the direction perpendicular to the heat radiating surface.

8. The heat sink according to any one of claims 1 to 7, further comprising:

the heat pipe is in heat conduction connection with the base and the first fin group, and a phase-changeable medium is filled in the heat pipe so as to transfer heat of the base to the first fin group through medium phase change;

wherein the heat pipe is disposed along a length direction of the base.

9. The heat sink of claim 8,

and a siphon structure is arranged in the heat pipe to drive the medium to circularly flow.

10. The heat sink as claimed in claim 8, wherein the base is stepped, comprising:

the high step part is in heat conduction connection with the heat conduction surface of the first fin group;

the low step part is in heat conduction connection with the frequency conversion module;

the low step part and the heat conduction surface of the first fin group define an accommodating space, and the accommodating space is used for accommodating the heat pipe.

Images