CN216930670U - Liquid cooling apparatus and liquid cooling system - Google Patents
Liquid cooling apparatus and liquid cooling system Download PDFInfo
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- CN216930670U CN216930670U CN202220281940.2U CN202220281940U CN216930670U CN 216930670 U CN216930670 U CN 216930670U CN 202220281940 U CN202220281940 U CN 202220281940U CN 216930670 U CN216930670 U CN 216930670U
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Abstract
The utility model provides a liquid cooling equipment and liquid cooling system, the present disclosure relates to equipment heat dissipation refrigerated field, concretely relates to liquid cooling radiating technical field. The liquid cooling device comprises at least one liquid cooling module, a cabinet body, a main liquid supply pipe and a main liquid return pipe; the liquid cooling module comprises a cooling box, a liquid inlet branch, a liquid outlet branch and a first heating component to be cooled, the cooling box is used for accommodating a cooling medium and the first heating component, the liquid inlet branch and the liquid outlet branch are respectively communicated with the cooling box, and the position of the liquid inlet branch is higher than that of the liquid outlet branch; the liquid cooling module is arranged inside the cabinet body; the main liquid supply pipe is communicated with the liquid inlet branch of the liquid cooling module, and the main liquid return pipe is communicated with the liquid outlet branch of the liquid cooling module. Each liquid cooling module in the liquid cooling device can be a relatively independent immersion cooling system, and heat generating components adopting immersion liquid cooling can be arranged in the cabinet under the condition that the existing cabinet is not required to be greatly modified.
Description
Technical Field
The disclosure relates to the field of equipment heat dissipation and cooling, in particular to the technical field of liquid cooling heat dissipation.
Background
As the power density of the equipment increases, the need for cooling efficiency also increases, and the conventional air-cooling heat dissipation method cannot meet the heat dissipation requirements of some equipment. In order to meet the heat dissipation requirement of high-power-density equipment, heat dissipation technologies such as immersion liquid cooling and the like are applied in the industry, however, the existing equipment cabinet for deploying equipment is usually designed according to an air-cooled heat dissipation mode, and equipment for dissipating heat by using immersion liquid cooling cannot be compatible in the equipment cabinet.
SUMMERY OF THE UTILITY MODEL
The present disclosure provides a liquid cooling apparatus and a liquid cooling system.
According to a first aspect of the present disclosure, there is provided a liquid cooling apparatus comprising:
the liquid cooling module comprises a cooling box, a liquid inlet branch and a liquid outlet branch, the cooling box is used for containing a cooling medium and a first heating component, the liquid inlet branch and the liquid outlet branch are respectively communicated with the cooling box, and the position of the liquid inlet branch is higher than that of the liquid outlet branch;
the liquid cooling module is arranged inside the cabinet body;
the main liquid supply pipe is communicated with the liquid inlet branch of the liquid cooling module, and the main liquid return pipe is communicated with the liquid outlet branch of the liquid cooling module.
In an embodiment of the present disclosure, a cooling box includes a bottom plate, a top plate, and a plurality of side plates;
the placing position of the first heating component is located on the bottom plate, and the liquid inlet branch and the liquid outlet branch are arranged on the side plate of the cooling box.
In an embodiment of the disclosure, the cooling box further comprises a partition plate; the partition plate is arranged between the top plate and the bottom plate and used for partitioning the interior of the cooling box into a first cavity and a second cavity which are communicated with each other;
the first cavity is located between bottom plate and the baffle, and the second cavity is located between roof and the baffle, and the feed liquor branch road and first cavity intercommunication go out the liquid branch road and second cavity intercommunication.
In an embodiment of the present disclosure, the plurality of side panels comprises a first side panel;
the partition plate comprises a first end and a second end which are oppositely arranged;
the first end is connected with the first side plate, and the liquid inlet branch and the liquid outlet branch are arranged on the first side plate;
the communication ports of the first cavity and the second cavity are adjacent to the second end;
the main liquid supply pipe and the main liquid return pipe are positioned on one side, close to the first side plate, of the interior of the cabinet body.
In an embodiment of the present disclosure, the plurality of side panels further comprises a second side panel;
the second side plate is adjacent to the second end and is spaced by a preset distance, and the second side plate and the second end enclose to form a communication opening.
In an embodiment of the present disclosure, the plurality of side panels further comprises a second side panel;
the second end is connected in the second curb plate, and the region that is close to the second end on the baffle is provided with the intercommunication mouth.
In the disclosed embodiment, the position of the liquid outlet branch is higher than the first heating component in the same cooling module.
In the embodiment of the disclosure, an electric valve is arranged on the liquid inlet branch.
In the embodiment of the disclosure, a sensor is arranged on the liquid outlet branch.
In the embodiment of the disclosure, the liquid cooling device further comprises an air cooling device, and the air cooling device is arranged inside the cabinet body; the cabinet body is also used for arranging a second heat generating component, and the air cooling device is used for cooling the second heat generating component.
According to a second aspect of the present disclosure, there is provided a liquid cooling system comprising:
comprising at least one liquid-cooled apparatus as provided in the first aspect above;
the main liquid supply pipe and the main liquid return pipe of each liquid cooling device are respectively communicated with the condensing device; the condensing device is used for cooling the cooling medium returned by the main liquid return pipe, and the cooled cooling medium is input into the main liquid supply pipe.
In the embodiment of the disclosure, the liquid cooling device further comprises a first loop pipe, and the main liquid supply pipe of the liquid cooling device is communicated with the condensing device through the first loop pipe.
In the embodiment of the disclosure, a first power pump is arranged on the pipeline between the first loop pipe and the condensing device.
In the embodiment of the disclosure, the liquid cooling device further comprises a second loop pipe, and the main liquid return pipe of the liquid cooling device is communicated with the condensing device through the second loop pipe.
In the embodiment of the disclosure, a second power pump is arranged on the pipeline between the second loop pipe and the condensing device.
It should be understood that the statements in this section do not necessarily identify key or critical features of the embodiments of the present disclosure, nor do they limit the scope of the present disclosure. Other features of the present disclosure will become apparent from the following description.
The technical scheme provided by the disclosure has the following beneficial effects:
in the technical scheme of this disclosure, the cooling module that liquid cooling equipment contained can be with waiting the refrigerated part that generates heat encapsulation in the cooler bin, realizes the circulation process of outside cooling medium in the cooler bin through feed liquor branch and play liquid branch to cool off the part that generates heat. It is thus clear that each liquid cooling module in the above-mentioned liquid cooling equipment can be a relatively independent submergence cooling system, need not carry out under the condition of great transformation to current rack, can arrange the component that generates heat that adopts the submergence liquid cooling in this rack, helps the popularization and use of the part of high power density.
Drawings
The drawings are included to provide a better understanding of the present solution and are not to be construed as limiting the present disclosure. Wherein:
fig. 1 shows a schematic diagram of a liquid cooling apparatus provided by an embodiment of the present disclosure;
fig. 2 illustrates a schematic diagram of a liquid cooling module provided by an embodiment of the disclosure;
fig. 3 shows a schematic diagram of a liquid cooling system provided by an embodiment of the present disclosure.
The reference numerals are explained as follows:
100-liquid cooling equipment;
1-a liquid cooling module; 11-a first heat-generating component; 12-a cooling tank; 121-a bottom plate;
122-a top plate; 123-a first side plate; 124-a second side plate; 125-a separator;
126-a first cavity; 127-a second cavity; 128-a communication port;
13-a liquid inlet branch; 14-liquid outlet branch; 15-an electrically operated valve; 16-a sensor;
2-a cabinet body; 3-a main supply tube; 4-main liquid return pipe; 5-a condensing unit; 6-first ring pipe;
7-a first power pump; 8-a second collar; 9-a second power pump; 10-throttle valve.
Detailed Description
Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings, in which various details of the embodiments of the disclosure are included to assist understanding, and which are to be considered as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.
As the power density of the devices increases, their need for cooling efficiency also increases. Taking the field of computing services as an example, with the development of cloud computing, big data and chip technologies, the power of a chip of a device in some servers can reach more than 500W, so that the heat flux density is significantly increased, and the heat dissipation requirements of the devices cannot be met by the traditional air cooling heat dissipation mode. In order to meet the heat dissipation requirements of high power density equipment, heat dissipation technologies such as immersion liquid cooling and the like are beginning to be applied in the industry. The existing cabinets for deploying equipment are generally designed according to an air-cooling heat dissipation mode, and the cabinets still have a large market share, but the related art cannot be compatible with equipment adopting immersion liquid-cooling heat dissipation in the cabinets, so that the application of the equipment adopting immersion liquid-cooling heat dissipation is greatly limited.
The embodiment of the disclosure provides a liquid cooling device and a liquid cooling system, which aim to solve at least one of the above technical problems in the prior art.
The embodiment of the present disclosure provides a liquid cooling apparatus, fig. 1 shows a schematic view of the liquid cooling apparatus provided by the embodiment of the present disclosure, and as shown in fig. 1, the liquid cooling apparatus 100 includes at least one liquid cooling module 1, and further includes a cabinet 2, a main liquid supply pipe 3, and a main liquid return pipe 4. The liquid cooling module 1 comprises a cooling box 12, a liquid inlet branch 13 and a liquid outlet branch 14. Here, the first heat-generating component 11 is a component (or equipment) that needs to be cooled. The first heat-generating component 11 may be an IT device, such as a high power density server or other high power IT devices, and the specific type of the first heat-generating component 11 is not limited by the embodiments of the disclosure.
The cooling tank 12 is configured to accommodate a cooling medium and the first heat generating component 11, and specifically, the first heat generating component 11 is disposed inside the cooling tank 12 and at least partially immersed in the cooling medium, so that the first heat generating component 11 is in direct contact with the cooling medium, and the cooling medium can absorb heat of the first heat generating component 11, thereby cooling the first heat generating component 11. It is understood that the size and shape of the cooling box 12 may be customized according to the size and shape of the first heat-generating component 11. The material of the cooling box 12 may be a metal plate, such as 304 stainless steel plate. Above the cooling box 12, interfaces for power supply, monitoring, network, etc. may also be provided, which are used to connect with the first heat generating component 11 inside the cooling box 12, and which require corresponding sealing measures to ensure that the cooling medium does not leak.
In the embodiment of the present disclosure, the cooling medium may be a phase-change cooling medium or a single-phase cooling medium, and the cooling medium does not chemically react with the cooling tank 12, the first heat generating component 11, and the like. Wherein, the phase-change cooling medium can be low boiling point fluoride, etc., and the single-phase cooling medium can be high boiling point fluoride, silicon oil, etc.
The liquid inlet branch 13 and the liquid outlet branch 14 are respectively communicated with the cooling box 12, external cooling media can flow into the cooling box 12 through the liquid inlet branch 13, and the cooling media in the cooling box 12 can flow out of the cooling box 12 through the liquid outlet branch 14 after absorbing heat, so that circulation of the cooling media is realized. Particularly, liquid cooling module 1 sets up in the inside of the cabinet body 2, and main feed pipe 3 and main liquid return pipe 4 can penetrate the inside of the cabinet body 2, and main feed pipe 3 communicates with liquid inlet branch 13 of liquid cooling module 1, and main liquid return pipe 4 communicates with liquid outlet branch 14 of liquid cooling module 1. Cooling medium can flow into the liquid inlet branch 13 of each liquid cooling module 1 through the main liquid supply pipe 3 and then flow into the cooling box 12 through the liquid inlet branch 13; the cooling medium in the cooling box 12 flows into the main liquid return pipe 4 through the liquid outlet branch 14 and is discharged through the main liquid return pipe 4, so that the circulation of the cooling medium is realized.
The liquid cooling apparatus 100 provided by the embodiment of the present disclosure includes a cooling module, which can package a heat generating component to be cooled in the cooling box 12, and realize a circulation process of an external cooling medium in the cooling box 12 through the liquid inlet branch 13 and the liquid outlet branch 14, so as to cool the heat generating component. It can be seen that each liquid cooling module 1 in the above liquid cooling apparatus 100 may be a relatively independent immersion cooling system, and heat generating components using immersion liquid cooling may be arranged in the cabinet without greatly modifying the existing cabinet, which is helpful for popularization and use of components with high power density.
In the embodiment of the present disclosure, the position of the liquid inlet branch 13 may be higher than the position of the liquid outlet branch 14, so as to ensure that the inside of the cooling box 12 can always retain a certain height of the cooling medium, so that the first heat generating component 11 may be at least partially immersed in the cooling medium, and the cooling efficiency of the first heat generating component 11 is improved.
Fig. 2 is a schematic diagram of a liquid cooling module according to an embodiment of the disclosure, and as shown in fig. 2, the cooling box 12 includes a bottom plate 121, a top plate 122, and a plurality of side plates. It is to be understood that the number of side plates of the cooling box 12 may be determined based on the shape of the cooling box 12, for example, when the cooling box 12 is shaped as a rectangular parallelepiped, the cooling box 12 may include 4 side plates.
The first heat generating component 11 is placed on the bottom plate 121. Here, the first heat generating component 11 may be directly fixed on the bottom plate 121, and the first heat generating component 11 may also be disposed on the bottom plate 121 through some medium (e.g., a pad), and the embodiment of the disclosure does not specifically limit the manner in which the first heat generating component 11 is disposed on the bottom plate 121.
The liquid inlet branch 13 and the liquid outlet branch 14 are arranged on corresponding side plates in the cooling box 12, external cooling media can flow into the cooling box 12 through the liquid inlet branch 13, and the cooling media in the cooling box 12 can flow out of the cooling box 12 through the liquid outlet branch 14 after absorbing heat, so that circulation of the cooling media is realized. It should be noted that the liquid inlet branch 13 and the liquid outlet branch 14 may be disposed on the same side plate of the cooling box 12, for example, as shown in fig. 2, the side plates of the cooling box 12 include a first side plate 123, and the liquid inlet branch 13 and the liquid outlet branch 14 may be disposed on the first side plate 123. Of course, the liquid inlet branch 13 and the liquid outlet branch 14 may be disposed on different side plates of the cooling box 12, for example, as shown in fig. 2, a second side plate 124 is further included in a plurality of side plates of the cooling box 12, the liquid inlet branch 13 is disposed on the first side plate 123, and the liquid outlet branch 14 is disposed on the second side plate 124.
Alternatively, the position of the liquid outlet branch 14 may be higher than the first heat generating component 11 in the same cooling module, which may ensure that the cooling medium retained by the cooling tank 12 is higher than the first heat generating component 11, so that the first heat generating component 11 is completely immersed in the cooling medium, further improving the cooling efficiency of the first heat generating component 11.
In the disclosed embodiment, as shown in FIG. 2, the cooling box 12 further includes a partition 125. The partition 125 may guide a flow direction of the cooling medium in the cooling box 12, and specifically, the partition 125 is disposed between the top plate 122 and the bottom plate 121, the partition 125 may partition the interior of the cooling box 12 into a first cavity 126 and a second cavity 127, and the first cavity 126 and the second cavity 127 may communicate with each other. Wherein, the first cavity 126 is located between the bottom plate 121 and the partition 125, the second cavity 127 is located between the top plate 122 and the partition 125, the liquid inlet branch 13 is communicated with the first cavity 126, and the liquid outlet branch 14 is communicated with the second cavity 127, it can be understood that the first heat generating component 11 is placed inside the first cavity 126. External cooling medium can flow into the first cavity 126 of the cooling tank 12 through the liquid inlet branch 13, so that the first heating component 11 is completely immersed in the cooling medium, and after the cooling medium in the first cavity 126 absorbs heat of the first heating component 11, the cooling medium can flow into the second cavity 127, and then flows out of the cooling tank 12 through the liquid outlet branch 14, so as to realize circulation of the cooling medium.
In the disclosed embodiment, the partition 125 includes a first end and a second end disposed opposite. The first end is connected with the first side plate 123, and the liquid inlet branch 13 and the liquid outlet branch 14 are disposed on the first side plate 123. The communication port 128 of the first and second cavities 126 and 127 is adjacent the second end. The above arrangement can extend the flow path of the cooling liquid in the cooling tank 12 so that the cooling medium flows completely through the first heat generating component 11 and then flows out of the cooling tank 12. As shown in fig. 2, arrows in the cooling tank 12 of fig. 2 indicate the flow path of the cooling medium, and the liquid outlet branch 14 is communicated with the second cavity 127, it can be understood that the first heat-generating component 11 is located inside the first cavity 126. The external cooling medium can flow into the first cavity 126 of the cooling tank 12 through the liquid inlet branch 13, so that the first heating component 11 is completely immersed in the cooling medium, and the cooling medium flowing into the liquid inlet branch 13 flows into the second cavity 127 through the communication port 128 after completely flowing through the first heating component 11, so that the utilization rate of the cooling medium can be significantly improved.
As shown in fig. 1, since the liquid inlet branch 13 and the liquid outlet branch 14 of each liquid cooling module 1 are located on the same side of the cooling box 12 (both disposed on the first side plate 123), the main liquid supply pipe 3 and the main liquid return pipe 4 are located on one side of the inside of the cabinet 2 close to the first side plate 123, which can simplify the structural layout in the cabinet 2.
Optionally, in the disclosed embodiment, the second side panel 124 is further included in the plurality of side panels of the cooling box 12. The second side plate 124 is adjacent to and spaced apart from the second end of the partition 125 by a predetermined distance, and the second side plate 124 and the second end enclose a communication opening 128. Specifically, as shown in fig. 1, the first side plate 123 and the second side plate 124 of the cooling box 12 are disposed opposite to each other, and when the first end of the partition 125 is connected to the first side plate 123, the second end of the partition 125 is directed toward the second side plate 124. The distance between the first side plate 123 and the second side plate 124 is greater than the distance between the first end and the second end of the partition 125. Therefore, when the first end of the partition 125 is connected with the first side plate 123, the second end of the partition 125 cannot contact the second side plate 124, so that the second side plate 124 is spaced apart from the second end of the partition 125 by a predetermined distance, thereby forming the communication port 128 between the second side plate 124 and the second end of the partition 125.
Optionally, in the disclosed embodiment, the second side panel 124 is further included in the plurality of side panels of the cooling box 12. A first end of the partition 125 is connected to the first side plate 123, a second end of the partition 125 is connected to the second side plate 124, and a communication port 128 is provided in a region of the partition 125 near the second end. Specifically, the partition plate 125 has the same shape and the same size as the shape defined by the side plates of the cooling box 12, and each side of the partition plate 125 is hermetically connected to a corresponding side plate of the cooling box 12, so that a communication port 128 is formed in the partition plate 125 to communicate the first cavity 126 with the second cavity 127, wherein the communication port 128 is located in a region of the partition plate 125 near the second end.
Optionally, in the embodiment of the present disclosure, an electrically operated valve 15 is disposed on the liquid inlet branch 13, and the electrically operated valve 15 controls the flow rate of the cooling medium in the liquid inlet branch 13. It can be understood that the greater the flow rate of the cooling medium in the inlet branch 13, the more efficient the cooling medium cools the first heat-generating component 11 inside the cooling tank 12.
Optionally, in the embodiment of the present disclosure, a sensor 16 is disposed on the liquid outlet branch 14. The sensor 16 may include a pressure sensor, a temperature sensor, etc., and of course, the sensor 16 may include other types of sensors, which are not listed in the embodiments of the present disclosure.
In the embodiment of the present disclosure, the liquid cooling apparatus 100 further includes an air cooling device (not shown), which is disposed inside the cabinet 2. The cabinet 2 may be used to house a second heat generating component (not shown), where the second heat generating component 5 is a component (or device) that needs to be cooled. The second heat generating component may be the same as the first heat generating component 11, and the second heat generating component may be an IT device, such as a high power density server or other high power IT device. The air cooling device is used for cooling the second heat generating component, and specifically, the air cooling device is a device for dissipating heat by delivering airflow to the second heat generating component, and the air cooling device may be a device having a fan or the like.
It is understood that the cooling device provided by the embodiment of the present disclosure may arrange heat generating components using different cooling methods in the same cabinet 2, for example, the first heat generating component 11 and the second heat generating component using immersion liquid cooling may be arranged in the same cabinet 2. Under the above conditions, the cabinet 2 for arranging the second heat generating component in the air cooling mode may allow the first heat generating component 11 in the immersion liquid cooling to be continuously arranged, which facilitates the modification of the cooling mode of the heat generating component in the cabinet 2.
Based on the same inventive concept, the embodiment of the present disclosure further provides a liquid cooling system, and fig. 3 shows a schematic view of the liquid cooling system provided by the embodiment of the present disclosure, and as shown in fig. 3, the liquid cooling system includes a condensing device 5 and at least one liquid cooling apparatus 100 described above. The main liquid supply pipe 3 and the main liquid return pipe 4 of each liquid cooling apparatus 100 are respectively communicated with the condensing device 5. The condensing device 5 can provide a cooling medium for the liquid cooling device 100, and specifically, the cooling medium flows into the liquid inlet branch 13 of each liquid cooling module 1 through the main liquid supply pipe 3 after being cooled by the condensing device 5, and then flows into the cooling box 12 through the liquid inlet branch 13; the cooling medium in the cooling tank 12 flows into the main liquid return pipe 4 through the liquid outlet branch 14 and then returns to the condensing device 5 through the main liquid return pipe 4; the condensing device 5 may cool the cooling medium returned from the main liquid return pipe 4, and input the cooled cooling medium to the main liquid supply pipe 3, so that the cooled cooling medium flows into the cooling tank 12.
The condensing device 5 can be an evaporative condenser or an air-cooled condenser and the like, and comprises a set of matched equipment such as a condensing coil, an outdoor fan, a water pump, filler and the like. The fan can be a variable frequency fan, and the condensing temperature can be adjusted by adjusting the number and the frequency of the fans.
In the embodiment of the present disclosure, the liquid cooling system further comprises a first loop 6, and the main liquid supply tube 3 of each liquid cooling apparatus 100 is communicated with the condensing device 5 through the first loop 6. Specifically, the main liquid supply tube 3 of the liquid cooling apparatus 100 is connected to the first loop pipe 6, and the first loop pipe 6 is connected to the liquid outlet of the condensing device 5 through a pipeline. It is understood that the cooling medium flowing out of the main liquid supply pipe 3 of the liquid cooling apparatus 100 can flow in both directions in the first loop pipe 6, so as to avoid the unavailability of other liquid cooling apparatuses 100 due to the maintenance period of one liquid cooling apparatus 100.
In the embodiment of the present disclosure, a first power pump 7 is disposed on the pipeline between the first loop 6 and the condensing device 5, and the first power pump 7 is used for driving the cooling medium out of the condensing device 5 and into each cooling apparatus, where the first power pump 7 is typically a liquid pump.
In the embodiment of the present disclosure, the liquid cooling system further includes a second loop pipe 8, and the main liquid return pipe 4 of the liquid cooling apparatus 100 is communicated with the condensing device 5 through the second loop pipe 8. Specifically, the main liquid return pipe 4 of the liquid cooling apparatus 100 is communicated with the second loop pipe 8, and the second loop pipe 8 is communicated with the liquid return port of the condensing device 5 through a pipeline. It can be understood that the cooling medium flowing out of the main liquid return pipe 4 of the liquid cooling apparatus 100 can flow in the second loop pipe 8 in two directions, so as to avoid that the other liquid cooling apparatuses 100 are not available during the maintenance period of one liquid cooling apparatus 100.
In the embodiment of the present disclosure, a second power pump 9 is disposed on a pipeline between the second loop pipe 8 and the condensing device 5, and the second power pump 9 is used for driving the cooling medium to return to the condensing device 5 through the main liquid return pipe 4. Here, the first power pump 7 is typically a liquid pump or an air pump. Specifically, when the cooling medium may be a phase-change cooling medium and is gaseous after absorbing heat, the first power pump 7 is an air pump; when the cooling medium may be a single-phase cooling medium and still be liquid after absorbing heat, the first power pump 7 is a liquid pump.
In the embodiment of the disclosure, the liquid pump can be an oil-free fluorine pump, and the liquid pump can be provided with a bypass valve corresponding to the pipeline system, so that equipment bypass can be realized. The number of the liquid pumps may be 1 or more, and when the number of the liquid pumps may be plural, plural liquid pumps may be connected in series or in parallel.
In the embodiment of the present disclosure, the liquid pump may be an oil-free compressor, and the air pump may have a bypass valve corresponding to the pipeline system, so as to implement bypass of the device. The number of the air pumps can be 1 or more, and when the number of the liquid pumps can be more than one, the plurality of liquid pumps can be connected in series or in parallel.
Optionally, a throttle valve 10 is disposed on the pipeline between the main liquid supply pipe 3 and the first loop pipe 6, and the throttle valve 10 plays a role of throttling and depressurizing the refrigerant and can control the flow rate of the refrigerant. The throttle valve 10 may be an electronic expansion valve or a thermostatic expansion valve. When the throttle valve 10 is an electronic expansion valve, a temperature sensor 16 and a pressure sensor 16 can be arranged at the outlet of the evaporator, superheat degree signals are collected through the temperature sensor 16 and the pressure sensor 16, and the opening degree of the throttle valve 10 is controlled by adopting feedback regulation; when the throttle valve 10 may be a thermostatic expansion valve, a bulb may be provided at the outlet of the evaporator, and the opening degree of the throttle valve 10 may be mechanically controlled by the bulb.
The above detailed description should not be construed as limiting the scope of the disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.
Claims (14)
1. A liquid cooling apparatus comprising:
the liquid cooling module comprises a cooling box, a liquid inlet branch and a liquid outlet branch, the cooling box is used for containing a cooling medium and a first heating component, the liquid inlet branch and the liquid outlet branch are respectively communicated with the cooling box, and the position of the liquid inlet branch is higher than that of the liquid outlet branch;
the liquid cooling module is arranged inside the cabinet body;
the liquid cooling module comprises a main liquid supply pipe and a main liquid return pipe, wherein the main liquid supply pipe is communicated with a liquid inlet branch of the liquid cooling module, and the main liquid return pipe is communicated with a liquid outlet branch of the liquid cooling module.
2. The liquid cooling apparatus of claim 1, wherein the cooling tank comprises a bottom plate, a top plate, and a plurality of side plates;
the placing position of the first heating component is located on the bottom plate, and the liquid inlet branch and the liquid outlet branch are arranged on the side plate of the cooling box.
3. The liquid cooling apparatus of claim 2, wherein the cooling tank further comprises a partition; the partition plate is arranged between the top plate and the bottom plate and used for partitioning the interior of the cooling box into a first cavity and a second cavity which are communicated with each other;
the first cavity is located the bottom plate with between the baffle, the second cavity is located the roof with between the baffle, the feed liquor branch road with first cavity intercommunication, go out the liquid branch road with the second cavity intercommunication.
4. The liquid cooling apparatus of claim 3, wherein the plurality of side plates comprises a first side plate;
the baffle plate comprises a first end and a second end which are oppositely arranged;
the first end is connected with the first side plate, and the liquid inlet branch and the liquid outlet branch are arranged on the first side plate;
the communication port of the first cavity and the second cavity is adjacent to the second end;
the main liquid supply pipe and the main liquid return pipe are located inside the cabinet body and close to one side of the first side plate.
5. The liquid cooling apparatus of claim 4, wherein the plurality of side plates further comprises a second side plate;
the second side plate and the second end are adjacent and are spaced by a preset distance, and the second side plate and the second end enclose to form the communication opening.
6. The liquid cooling apparatus of claim 4, wherein the plurality of side plates further comprises a second side plate;
the second end is connected to the second side plate, and the area on the partition plate, which is close to the second end, is provided with the communication port.
7. The liquid cooling apparatus of claim 1, wherein the liquid outlet branch is located higher than the first heat generating component in the same liquid cooling module.
8. The liquid cooling apparatus of claim 1, wherein an electrically operated valve is disposed on the inlet branch;
and/or a sensor is arranged on the liquid outlet branch.
9. The liquid cooling apparatus of claim 1, further comprising an air cooling device disposed inside the cabinet;
the cabinet body is also used for arranging second heat generating components, and the air cooling device is used for cooling the second heat generating components.
10. A liquid cooling system comprising:
comprising at least one liquid-cooled device according to any of claims 1-9;
the main liquid supply pipe and the main liquid return pipe of each liquid cooling device are respectively communicated with the condensing device;
the condensing device is used for cooling the cooling medium returned by the main liquid return pipe, and inputting the cooled cooling medium into the main liquid supply pipe.
11. The liquid cooling system of claim 10, further comprising a first loop through which the main liquid supply of the liquid cooling apparatus communicates with the condensing device.
12. The liquid cooling system of claim 11, wherein a first powered pump is disposed on the piping between the first loop and the condensing means.
13. The liquid cooling system of claim 10, further comprising a second loop through which the main liquid return of the liquid cooling apparatus communicates with the condensing device.
14. The liquid cooling system of claim 13, wherein a second powered pump is disposed in the conduit between the second loop and the condensing means.
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| CN202220281940.2U CN216930670U (en) | 2022-02-11 | 2022-02-11 | Liquid cooling apparatus and liquid cooling system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364235A (en) * | 2022-02-11 | 2022-04-15 | 北京百度网讯科技有限公司 | Liquid cooling apparatus and liquid cooling system |
| WO2024152948A1 (en) * | 2023-01-16 | 2024-07-25 | 北京有竹居网络技术有限公司 | Liquid-cooling cabinet bearing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364235A (en) * | 2022-02-11 | 2022-04-15 | 北京百度网讯科技有限公司 | Liquid cooling apparatus and liquid cooling system |
| WO2024152948A1 (en) * | 2023-01-16 | 2024-07-25 | 北京有竹居网络技术有限公司 | Liquid-cooling cabinet bearing device |
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