CN216563104U - Heat dissipation substrate and power module - Google Patents
Heat dissipation substrate and power module Download PDFInfo
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- CN216563104U CN216563104U CN202123172901.3U CN202123172901U CN216563104U CN 216563104 U CN216563104 U CN 216563104U CN 202123172901 U CN202123172901 U CN 202123172901U CN 216563104 U CN216563104 U CN 216563104U
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Abstract
The application provides a heat dissipation substrate and a power module. The lower surface of the heat dissipation substrate is provided with a plurality of pin fins, and the pin fins are one or more of the following structures: the pin fins are distributed in a high-density area with high heat dissipation requirements, have a first structure and comprise the first structure and a combination of other structures different from the first structure; therefore, the heat exchange efficiency of the area with high heat dissipation requirement is improved, and the occurrence of short heat dissipation plates is avoided; the pin fins of the first structure are arranged in a region with high heat dissipation requirements, and the pin fins of the first structure have high heat dissipation capacity, so that the region is prevented from becoming a short heat dissipation plate; the shapes of the cross sections of the pin fins in different chip mounting areas are different, so that the flow resistance of the cooling liquid is reduced on the premise that the heat dissipation performance of the module is kept.
Description
Technical Field
The utility model relates to the technical field of power module heat dissipation, in particular to a heat dissipation substrate and a power module.
Background
With the vigorous development of the new energy automobile industry, the market demand for power modules is increasing day by day. The power module is used as a core component of the new energy automobile and is related to the performance and the service life of the electric automobile. Electric automobile output power level is high, and power module generates heat greatly, but in order to satisfy the lightweight requirement of car simultaneously, need carry out good heat dissipation design in limited high density space, simply high-efficiently in time discharges away the heat to guarantee that power module work is within effective temperature range, avoid the chip temperature to rise, lead to the device to become invalid.
The power module comprises a chip, a heat dissipation substrate and a heat dissipation base, wherein a heat dissipation medium groove is formed in the heat dissipation base to accommodate heat dissipation media flowing in from an inlet and flowing out from an outlet. The lower surface of the heat dissipation substrate is provided with pin fins which are inserted into the heat dissipation medium to dissipate heat of the chip above the heat dissipation substrate.
In the prior art, the pin fins on the lower surface of the heat dissipation substrate are uniformly distributed and have the same structure.
The radiating substrate is provided with a plurality of chips, when the power consumption of each chip is close, for example, a three-phase inversion full-bridge structure, the power consumption of the U-phase, V-phase and W-phase chips is close, the U-phase chip is positioned at the inlet of a radiating medium, the W-phase chip is positioned at the outlet of the radiating medium, and the V-phase chip is positioned between the U-phase chip and the W-phase chip. Because the temperature of the heat dissipation medium at the inlet is lower than that at the outlet, the pin fins on the lower surface of the heat dissipation substrate are uniformly arranged and have the same structure, so that the junction temperature of the chip close to the water outlet is higher than that of the chip close to the water inlet, and the chip at the outlet becomes a heat dissipation short plate of the whole module. For a three-phase inverter full-bridge structure, the junction temperature of the W-phase chip is higher than that of the V-phase chip.
The heat dissipation substrate is provided with a plurality of chips, and when the power consumption of each chip is different, the pins on the lower surface of the heat dissipation substrate are uniformly distributed and have the same structure, so that the chips with high power consumption become the heat dissipation short plate of the whole module.
In summary, in the prior art, the pin fins on the lower surface of the heat dissipation substrate are uniformly arranged and have the same structure, so that the chip at the heat dissipation medium outlet or the chip with high power consumption becomes the heat dissipation short plate of the whole module.
SUMMERY OF THE UTILITY MODEL
To solve the problems in the prior art, the present application provides a heat dissipation substrate and a power module. The lower surface of the heat dissipation substrate is provided with the pin fins, wherein the pin fins are high in density in the region with high heat dissipation requirements and low in density in the region with low heat dissipation requirements, so that the heat exchange efficiency of the region with high heat dissipation requirements is improved, and the occurrence of short heat dissipation plates is avoided; or the pin fins with the oval cross sections are arranged in the area with high heat dissipation requirements, and the oval pin fins have high heat dissipation, so that the area is prevented from becoming a short heat dissipation plate; or the shapes of the pin fin cross sections of different chip mounting areas are different, so that the flow resistance of the cooling liquid is reduced on the premise that the heat dissipation performance of the module is kept.
In a first aspect, the present invention provides a heat dissipation substrate, a lower surface of which is formed with a plurality of pin fins, the pin fins being configured as one or more of: the pin fin distribution has a high density in areas where heat dissipation requirements are high, has a first structure, and includes a combination of the first structure and other structures different from the first structure. By utilizing the radiating substrate, the lower surface of the radiating substrate is provided with the pin fins, wherein the pin fins in the area with high radiating requirement have high density, and the pin fins in the area with low radiating requirement have low density, so that the heat exchange efficiency of the area with high radiating requirement is improved, and the radiating short plate is favorably avoided; the pin fins of the first structure are arranged in a region with high heat dissipation requirements, and the pin fins of the first structure have high heat dissipation capacity, so that the region is prevented from becoming a short heat dissipation plate; the shapes of the cross sections of the pin fins in different chip mounting areas are different, so that the flow resistance of the cooling liquid is reduced on the premise that the heat dissipation performance of the module is kept.
In one embodiment of the first aspect, the density of the pin fins increases gradually from the heat dissipation medium inlet to the heat dissipation medium outlet. Through this embodiment, be favorable to progressively promoting the radiating efficiency of heat dissipation base plate from the radiating medium entrance to radiating medium exit, be favorable to avoiding the chip in exit to become the heat dissipation short slab of whole module.
In one embodiment of the first aspect, the pin fins are divided into a plurality of regions from the heat medium inlet to the heat medium outlet, the density of the pin fins in each region is uniform, and the density of the pin fins in a region adjacent to the heat medium outlet in two adjacent regions is greater than the density of the pin fins in a region adjacent to the heat medium inlet. Through this embodiment, compare in the density increase gradually of the pin fin from the radiating medium entrance to radiating medium exit, be favorable to reducing the design degree of difficulty of heat dissipation base plate, also can reach the purpose that progressively promotes the radiating efficiency of heat dissipation base plate from the radiating medium entrance to radiating medium exit simultaneously to be favorable to avoiding the chip in exit to become the heat dissipation short slab of whole module.
In one embodiment of the first aspect, the pin fins are progressively reduced in size from the heat dissipation medium inlet to the heat dissipation medium outlet. By this embodiment, a gradual increase in the density of the pin fins is facilitated.
In one embodiment of the first aspect, when a plurality of chips are mounted on the heat dissipating substrate, the density of pin fins below the chip with high power consumption is large, and the density of pin fins below the chip with low power consumption is small. Through this embodiment, be favorable to avoiding the chip that the consumption is high to become the heat dissipation short slab of whole module.
In one embodiment of the first aspect, the pin fins have a circular, oval, diamond, raindrop or triangular cross-section. Through the embodiment, the pin fins in different shapes have different heat dissipation capacities, and the pin fins in different areas can be adjusted to have different shapes, so that the purpose of adjusting the heat dissipation capacities of the different areas of the heat dissipation substrate is achieved.
In one embodiment of the first aspect, when the heat dissipation substrate has a plurality of chip mounting areas, the pin fins have different cross-sectional shapes in different heat dissipation requirement areas, and the pin fins with different shapes have different heat dissipation capabilities, so that the purpose of adjusting the heat dissipation capabilities of the heat dissipation substrate in the different heat dissipation requirement areas can be achieved by adjusting the cross-sectional shapes of the pin fins.
In one embodiment of the first aspect, the pin fin having the first configuration has an elliptical cross-section. Through the implementation mode, the pin fins with the oval cross sections are arranged in the area with high heat dissipation requirements, and the area is prevented from becoming a short heat dissipation plate.
In one embodiment of the first aspect, a boss is formed on the upper surface of the heat dissipation substrate to ensure uniform solder thickness between the DCB backing plate and the heat dissipation substrate; a recess is formed in the lower surface of the heat dissipation substrate along the edge of the heat dissipation substrate, and the bottom surface of the recess is smooth and is used for at least partially accommodating the sealing ring; the heat dissipation substrate is provided with mounting holes for accommodating screws, and the screws can be connected with the heat dissipation substrate and the heat dissipation base or the heat dissipation substrate and the tube shell; the heat dissipation substrate is further provided with a positioning hole for containing a positioning column on the tube shell so as to position the tube shell and the heat dissipation substrate. By this embodiment, the bosses facilitate secure fixation of the DCB liner plate; the bottom surface of the recess is smooth, so that a gap between the sealing ring and the heat dissipation substrate is avoided, and sealing is facilitated; the mounting hole can fix the radiating substrate; the positioning hole is beneficial to limiting before installation so as to ensure that the installation position of the heat dissipation substrate is accurate.
In a second aspect, the present invention provides a power module, which includes the heat dissipation substrate according to the first aspect and any one of the embodiments thereof. By utilizing the power module, the lower surface of the radiating substrate is provided with the pin fins, wherein the pin fins in the area with high radiating requirement have high density, and the pin fins in the area with low radiating requirement have low density, so that the heat exchange efficiency of the area with high radiating requirement is improved, and the occurrence of radiating short plates is favorably avoided; the pin fins of the first structure are arranged in a region with high heat dissipation requirements, and the pin fins of the first structure have high heat dissipation capacity, so that the region is prevented from becoming a short heat dissipation plate; the shapes of the cross sections of the pin fins in different chip mounting areas are different, so that the flow resistance of the cooling liquid is reduced on the premise that the heat dissipation performance of the module is kept.
In one embodiment of the second aspect, the power module further comprises: the DCB liner plate is welded and fixed on the boss of the heat dissipation substrate, and the copper-clad layer of the DCB liner plate is bare copper, copper gold-plated or copper nickel-plated; the heat dissipation base is provided with a heat dissipation medium inlet, a heat dissipation medium outlet and a heat dissipation medium groove communicated with the heat dissipation medium inlet and the heat dissipation medium outlet; a sealing ring disposed between the heat-dissipating base and the heat-dissipating substrate; a chip fixed on the DCB liner plate; and a case made of a polymer material or other pressure-resistant and moisture-resistant material; wherein the length of the pin fin is smaller than the depth of the heat dissipation medium groove. By the embodiment, the lug boss ensures the horizontal arrangement of the DCB lining plate; the heat dissipation base provides an accommodating space for the heat dissipation medium; the sealing ring is favorable for avoiding leakage of a heat dissipation medium; the chip ensures the normal use of the power module; the tube shell protects the power module; the length of the pin fin is smaller than the depth of the heat dissipation medium groove, so that the pin fin is favorably prevented from colliding with the heat dissipation medium groove, and the efficient work of the heat dissipation substrate is favorably realized.
Compared with the prior art, the heat dissipation substrate and the power module have the following beneficial effects.
1. By utilizing the radiating substrate, the lower surface of the radiating substrate is provided with the pin fins, wherein the pin fins in the area with high radiating requirement have high density, and the pin fins in the area with low radiating requirement have low density, so that the heat exchange efficiency of the area with high radiating requirement is improved, and the radiating short plate is favorably avoided; the shapes of the cross sections of the pin fins in different chip mounting areas are different, so that the flow resistance of the cooling liquid is reduced on the premise that the heat dissipation performance of the module is kept.
2. From the heat-radiating medium entrance to the heat-radiating medium exit, the density of pin fin increases gradually, is favorable to progressively promoting the radiating efficiency of heat-radiating base plate from heat-radiating medium entrance to heat-radiating medium exit, is favorable to avoiding the chip in exit to become the heat dissipation short slab of whole module.
3. When a plurality of chips are mounted on the radiating substrate, the density of the pin fins below the chips with high power consumption is high, and the density of the pin fins below the chips with low power consumption is low, so that the chips with high power consumption are prevented from becoming radiating short plates of the whole module.
4. The cross section of the pin fin in the area with high heat dissipation requirement is oval, and the cross section of the pin fin in other areas is in other shapes, such as round, diamond, drop or triangle, so that the heat dissipation of the substrate in the area is improved, the area is prevented from becoming a short heat dissipation plate, and the flow resistance of the cooling liquid is reduced while the heat dissipation is ensured.
The features mentioned above can be combined in various suitable ways or replaced by equivalent features as long as the object of the utility model is achieved.
Drawings
The utility model will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings, in which:
fig. 1 shows a schematic perspective view of a power module according to an embodiment of the utility model;
FIG. 2 shows a schematic cross-sectional structural view of a power module according to an embodiment of the utility model;
FIG. 3 is a schematic structural diagram of a heat-dissipating substrate according to an embodiment of the utility model;
fig. 4 is a schematic structural diagram of a heat-dissipating substrate according to another embodiment of the present invention;
FIG. 5 is a schematic view of a heat-dissipating substrate according to yet another embodiment of the present invention;
fig. 6 is a schematic structural view illustrating a heat-dissipating substrate according to another embodiment of the present invention;
FIG. 7 shows an enlarged partial schematic view of a pin fin having an elliptical cross-section according to an embodiment of the present invention.
List of reference numerals:
1-a heat dissipation substrate; 2-pinwings; 3-chip; 4-mounting holes; 5-positioning holes; 6-DCB lining plate; 7-pipe shell.
In the drawings, like parts are provided with like reference numerals. The drawings are not to scale.
Detailed Description
The utility model will be further explained with reference to the drawings.
To solve the above problems in the prior art, the present application provides a heat dissipation substrate 1 and a power module. The lower surface of the heat dissipation substrate 1 is formed with a plurality of pin fins 2, and the pin fins 2 are configured as one or more of the following: the pin fins 2 are distributed in a high density in a region where the heat dissipation requirement is high, have a first structure, and include a combination of the first structure and other structures different from the first structure.
As shown in fig. 3 to 5, the present embodiment provides a heat dissipating substrate 1 in which pin fins 2 are formed on the lower surface of the heat dissipating substrate 1, and the density of the pin fins 2 is high in a region where heat dissipation is required and the density of the pin fins 2 is low in a region where heat dissipation is required.
In the prior art, the pin fins 2 on the lower surface of the heat dissipation substrate 1 are uniformly arranged and have the same structure.
One or more DCB lining plates 6 are mounted on the heat dissipation substrate 1, when the power consumption of a single chip or a plurality of chips 3 on each DCB lining plate 6 is close, for example, a three-phase inversion full-bridge structure, the power consumption of the U-phase, V-phase and W-phase chips 3 is close, the U-phase chip 3 is located at an inlet of a heat dissipation medium, the W-phase chip 3 is located at an outlet of the heat dissipation medium, and the V-phase chip 3 is located between the U-phase chip 3 and the W-phase chip 3. Because the temperature of the heat dissipation medium at the inlet is lower than that at the outlet, the pin fins 2 on the lower surface of the heat dissipation substrate 1 are uniformly arranged and have the same structure, so that the junction temperature of the chip 3 close to the water outlet is higher than that of the chip 3 close to the water inlet, and the chip 3 at the outlet becomes a heat dissipation short plate of the whole module. For a three-phase inverter full-bridge structure, the junction temperature of the W-phase chip 3 is higher than that of the V-phase chip 3.
The plurality of DCB lining plates 6 are mounted on the radiating substrate 1, and when the power consumption of a single chip or a plurality of chips 3 on each DCB lining plate 6 is different, the pins 2 on the lower surface of the radiating substrate 1 are uniformly distributed and have the same structure, so that the chip 3 with high power consumption becomes a radiating short plate of the whole module.
In summary, in the prior art, the pin fins 2 on the lower surface of the heat dissipation substrate 1 are uniformly arranged and have the same structure, so that the chip 3 at the heat dissipation medium outlet or the chip 3 with high power consumption becomes a heat dissipation short plate of the whole module.
In order to solve the above problem, in the heat dissipation substrate 1 of the present embodiment, the density of the pin fins 2 is high in the region where the heat dissipation requirement is high, and the density of the pin fins 2 is low in the region where the heat dissipation requirement is low, which is advantageous for avoiding the occurrence of short heat dissipation plates.
Specifically, the pin fins 2 with high density are arranged at the positions corresponding to the chips 3 with high power consumption at the positions of the heat dissipation medium outlets, and the pin fins 2 are high in density, so that the heat exchange area between the heat dissipation substrate 1 and the cooling liquid is favorably increased, the heat exchange efficiency is improved, and the heat dissipation short plates are favorably avoided.
The pin fins 2 may be formed integrally with the main body of the heat dissipating substrate 1, or may be fixed to the main body of the heat dissipating substrate 1 by bonding, welding, or the like.
Alternatively, as shown in fig. 6, the pin fin 2 has a first structure in a region with high heat dissipation requirement, and the first structure refers to that the cross section of the pin fin 2 is oval or other structures which are beneficial to heat dissipation.
When the cross section of the pin fin 2 is oval, the vortex effect of a heat dissipation medium is reduced, so that the pressure drop of a flow channel is reduced, and the heat exchange area of the pin fin 2 is increased, so that when the cross section of the pin fin 2 is oval, the heat dissipation efficiency of the area is high, the pin fin 2 with the oval cross section is arranged in the area with high heat dissipation requirements, the heat dissipation of the substrate in the area is improved, and the area is prevented from becoming a short heat dissipation plate.
Specifically, as shown in fig. 5, the substrate is divided into 3 regions, each region corresponds to 3 DCB liner plates 6, single or multiple chips 3 are distributed on the DCB liner plates 6, the power consumption of the chips 3 is the same, the pin fins 2 are cylindrical and have low density in the region corresponding to the chip 3 at the inlet of the heat dissipation medium, the cross section of the pin fin 2 is elliptical and has high density in the region corresponding to the chip 3 at the outlet of the heat dissipation medium, the cross section of the pin fin 2 is rhombic and has moderate density in the region corresponding to the chip 3 located between the pin fin and the chip.
As shown in fig. 3, the cross section of the pin fin 2 is elliptical and has a high density right below the mounting region corresponding to the substrate chip 3; in the transition region, i.e. directly below the non-chip mounting region, the cross section of the pin fin 2 is circular and has a low density, or the region has no pin fin.
Through the embodiment, the pin fins 2 with the oval cross sections are arranged in the area with high heat dissipation requirements, so that the area is prevented from becoming a short heat dissipation plate.
By utilizing the heat dissipation substrate 1, the pin fins 2 are formed on the lower surface of the heat dissipation substrate 1, wherein the pin fins 2 in the area with high heat dissipation requirement have high density, and the pin fins 2 in the area with low heat dissipation requirement have low density, so that the heat exchange efficiency of the area with high heat dissipation requirement is improved, and the occurrence of short heat dissipation plates is favorably avoided; or the pin fins of the first structure are arranged in a region with high heat dissipation requirements, and the pin fins of the first structure have high heat dissipation capacity, so that the region is prevented from becoming a short heat dissipation plate; or the shapes of the pin fin cross sections of different chip mounting areas are different, so that the flow resistance of the cooling liquid is reduced on the premise that the heat dissipation performance of the module is kept.
In one embodiment, the density of the pin fins 2 increases gradually from the heat dissipation medium inlet to the heat dissipation medium outlet.
As shown in fig. 4 and 5, the density of the pin fins 2 gradually increases from the heat medium inlet to the heat medium outlet, and this embodiment is applied to a case where the power consumption of the plurality of chips 3 on the respective DCB patches 6 on the heat dissipation substrate 1 approaches.
Install a plurality of DCB welts 6 on the radiating basal plate 1, install single or a plurality of chip 3 on the DCB welt 6, when the consumption of the chip 3 on each DCB welt 6 is close, for example three-phase contravariant full bridge structure, the consumption of U looks, V looks, W looks chip 3 is close, and U looks chip 3 is located the radiating medium entrance, and W looks chip 3 is located the radiating medium exit, and V looks chip 3 is located between U looks chip 3 and the W looks chip 3. Because the temperature of the heat-dissipating medium at the inlet is lower than that at the outlet, if the pin fins 2 on the lower surface of the heat-dissipating substrate 1 are uniformly arranged and have the same structure, the junction temperature of the chip 3 close to the water outlet is higher than that of the chip 3 close to the water inlet, and the chip 3 at the outlet becomes a heat-dissipating short plate of the whole module, that is, under the condition of a three-phase inversion full-bridge structure, the junction temperature of the W-phase chip 3 is higher than that of the V-phase chip 3.
In this embodiment, from the heat dissipation medium entrance to the heat dissipation medium exit, the density of pin fin 2 increases gradually to be favorable to progressively promoting the radiating efficiency of heat dissipation base plate 1 from the heat dissipation medium entrance to the heat dissipation medium exit, be favorable to avoiding chip 3 at the exit to become the heat dissipation short slab of whole module, under the condition of three-phase contravariant full-bridge structure promptly, be favorable to avoiding the junction temperature of W looks chip 3 to be higher than the junction temperature of V looks chip 3.
Through this embodiment, be favorable to promoting the radiating efficiency of heat dissipation base plate 1 gradually from the radiating medium entrance to radiating medium exit, be favorable to avoiding chip 3 in exit to become the heat dissipation short slab of whole module.
In one embodiment, from the heat dissipation medium inlet to the heat dissipation medium outlet, the pin fins 2 are divided into a plurality of regions along the heat dissipation medium inlet to the heat dissipation medium outlet, the density of the pin fins 2 in each region is consistent, and the density of the pin fins 2 in the regions of two adjacent regions close to the heat dissipation medium outlet is greater than that of the pin fins 2 in the regions close to the heat dissipation medium inlet.
Through this embodiment, compare in the density crescent from the heat dissipation medium entrance to heat dissipation medium exit pin fin 2, be favorable to reducing the design degree of difficulty of heat dissipation base plate 1, also can reach the purpose of progressively promoting the radiating efficiency of heat dissipation base plate 1 from the heat dissipation medium entrance to heat dissipation medium exit simultaneously to be favorable to avoiding chip 3 in exit to become the heat dissipation short slab of whole module.
In one embodiment, the pin fins 2 gradually decrease in size from the heat dissipation medium inlet to the heat dissipation medium outlet.
As shown in fig. 4, the size of the pin fins 2 is gradually reduced from the heat radiation medium inlet to the heat radiation medium outlet, thereby facilitating the achievement of a gradual increase in the density of the pin fins 2.
By this embodiment, it is advantageous to achieve a gradual increase in the density of the pin fins 2.
In one embodiment, when a plurality of chips 3 are mounted on the heat dissipating substrate 1, the density of the pin fins 2 below the chips 3 with high power consumption is large, and the density of the pin fins 2 below the chips 3 with low power consumption is small.
The heat dissipation substrate 1 is provided with a plurality of chips 3, and when the power consumption of each chip 3 is different, if the pin fins 2 on the lower surface of the heat dissipation substrate 1 are uniformly arranged and have the same structure, the chip 3 with high power consumption becomes a heat dissipation short plate of the whole module.
In order to solve the above technical problem, in the present embodiment, when the plurality of chips 3 are mounted on the heat dissipation substrate 1, the density of the pin fins 2 below the chip 3 with high power consumption is high, and the density of the pin fins 2 below the chip 3 with low power consumption is low, so that the heat exchange efficiency of the area where the chip 3 with high power consumption is located is improved, and the chip 3 with high power consumption is prevented from becoming a heat dissipation short plate of the whole module.
By this embodiment, it is advantageous to prevent the chip 3 with high power consumption from becoming a short heat dissipation plate of the entire module.
In one embodiment, as shown in fig. 3, the density of the pin fins 2 below the mounting region of the chip 3 of the DCB patch 6 is high, and the density of the pin fins 2 below the region between the DCB patches 6 is low. This is because the DCB backing plate 6 has a single or a plurality of chips 3 mounted thereon, and the temperature of the mounting area is higher than that of the non-chip 3 mounting area, so that the density of the pin fins 2 therebelow is high. The density of the pin fins 2 below the non-chip mounting region between the DCB backing plates 6 is small, the heat dissipation performance of the heat dissipation substrate 1 is not affected, and the flow resistance of a heat dissipation medium can be reduced in the region, so that the heat dissipation performance of the heat dissipation substrate 1 can be improved.
This embodiment is advantageous in improving the heat dissipation performance of the heat dissipation substrate 1.
In one embodiment, as shown in fig. 6, the density of pin fins 2 is high below the area of the DCB patch 6 and the density of pin fins 2 is low below the area around the DCB patch 6. This is due to the high temperature of the DCB backing plate 6 area and therefore the high density of the pin fins 2 underneath it. The density of the pin fins 2 below the area around the DCB lining plate 6 is small, so that the heat dissipation performance of the chip 3 is not influenced, and the flow resistance of a heat dissipation medium can be reduced in the area, thereby being more beneficial to improving the heat dissipation performance of the heat dissipation substrate 1.
In one embodiment, the pin fin 2 has a cross-section in the shape of a circle, oval, diamond, raindrop, or triangle.
Through the embodiment, the pin fins 2 with different shapes have different heat dissipation capacities, and the pin fins 2 in different areas can be adjusted to have different shapes, so that the purpose of adjusting the heat dissipation capacities of the different areas of the heat dissipation substrate 1 is achieved.
Alternatively, the pin fin 2 may have other shapes with smooth lines.
In one embodiment, as shown in fig. 3, the pin fins 2 below the regions of the DCB patches 6 are oval in cross-section and the pin fins 2 below the regions between the DCB patches 6 are round in cross-section. This is because the DCB backing plate 6 has a high temperature, and the elliptical pin fins 2 having a high heat dissipation capability are used for the pin fins 2 below the DCB backing plate, which is more favorable for improving the heat dissipation performance of the heat dissipation substrate 1.
In one embodiment, as shown in fig. 6, the pin fins 2 under the DCB backing 6 region have an oval cross-section and the pin fins 2 under the non-chip mounting region around the DCB backing 6 region have a circular cross-section. This is because the DCB backing plate 6 has a high temperature, and the elliptical pin fins 2 with high heat dissipation are used for the pin fins 2 below the DCB backing plate, which is more favorable for improving the heat dissipation performance of the heat dissipation substrate 1.
In one embodiment, a boss is formed on the upper surface of the heat dissipation substrate 1 to ensure uniform solder thickness between the DCB backing plate 6 and the heat dissipation substrate 1; a recess is formed on the lower surface of the heat dissipation substrate 1 along the edge of the heat dissipation substrate 1, and the bottom surface of the recess is smooth and is used for at least partially accommodating the sealing ring; as shown in fig. 3 to 5, the heat-dissipating substrate 1 is provided with mounting holes 4 for receiving screws capable of connecting the heat-dissipating substrate 1 and the heat-dissipating base or the heat-dissipating substrate 1 and the case 7; the heat dissipation substrate 1 is further provided with a positioning hole 5 for accommodating a positioning column on the tube shell 7 so as to position the tube shell 7 and the heat dissipation substrate 1.
Optionally, each DCB patch 6 corresponds to 4 bosses, and the 4 bosses are respectively located at 4 top corners of the DCB patch 6.
With this embodiment, the bosses facilitate secure fixation of the DCB backing plate 6; the bottom surface of the recess is smooth, so that a gap between the sealing ring and the heat dissipation substrate 1 is avoided, and sealing is facilitated; the mounting hole 4 can fix the heat dissipation substrate 1; the positioning hole 5 is advantageous for limiting before mounting to make the mounting position of the heat dissipation substrate 1 accurate.
The present embodiment also provides a power module, which includes the heat dissipation substrate 1 described above.
By utilizing the power module, the lower surface of the heat dissipation substrate 1 is provided with the pin fins 2, wherein the pin fins 2 in the area with high heat dissipation requirement have high density, and the pin fins 2 in the area with low heat dissipation requirement have low density, so that the heat exchange efficiency of the area with high heat dissipation requirement is improved, and the occurrence of heat dissipation short plates is favorably avoided.
In one embodiment, as shown in fig. 1 and 2, the power module further includes: a DCB liner plate 6 which is welded and fixed on the boss of the heat dissipation substrate 1, and the copper-clad layer of the DCB liner plate is bare copper, copper gold-plated or copper nickel-plated; the heat dissipation base is provided with a heat dissipation medium inlet, a heat dissipation medium outlet and a heat dissipation medium groove communicated with the heat dissipation medium inlet and the heat dissipation medium outlet; a seal ring disposed between the heat-dissipating base and the heat-dissipating substrate 1; the number of the chips 3 can be 1 or more, and the chips can be IGBTs, FRDs, or MOSFETs and other chips with larger power consumption; and a case 7 made of a polymer material or other pressure-resistant moisture-resistant material; wherein, the length of the pin fin 2 is less than the depth of the heat dissipation medium groove.
Wherein the insulation layer of the DCB liner plate 6 can be made of Al2O3、Si3N4Or a ceramic material such as AlN or other insulating material, or may be made of Al2O-doped ZrO2And the like to enhance the thermal conductivity and structural strength of the insulating layer. The upper and lower surfaces of the DCB liner plate 6 are coated with copper for circuit interconnection.
By this embodiment, the bosses ensure the horizontal arrangement of the DCB backing plate 6; the heat dissipation base provides an accommodating space for the heat dissipation medium; the sealing ring is favorable for avoiding leakage of a heat dissipation medium; the chip 3 ensures the normal use of the power module; the tube shell 7 protects the power module; the length of the pin fin 2 is smaller than the depth of the heat dissipation medium groove, so that the pin fin 2 is prevented from colliding with the heat dissipation medium groove, and the efficient work of the heat dissipation substrate 1 is facilitated.
Example one
As shown in fig. 3 to 5, the present embodiment provides a heat dissipating substrate 1, a plurality of pin fins 2 are formed on a lower surface of the heat dissipating substrate 1, and the pin fins 2 are configured as one or more of the following: the pin fins 2 are distributed in a high density in a region where the heat dissipation requirement is high, have a first structure, and include a combination of the first structure and other structures different from the first structure.
In the prior art, the pin fins 2 on the lower surface of the heat dissipation substrate 1 are uniformly arranged and have the same structure.
One or more DCB lining plates 6 are mounted on the heat dissipation substrate 1, when the power consumption of a single chip or a plurality of chips 3 on each DCB lining plate 6 is close, for example, a three-phase inversion full-bridge structure, the power consumption of the U-phase, V-phase and W-phase chips 3 is close, the U-phase chip 3 is located at an inlet of a heat dissipation medium, the W-phase chip 3 is located at an outlet of the heat dissipation medium, and the V-phase chip 3 is located between the U-phase chip 3 and the W-phase chip 3. Because the temperature of the heat dissipation medium at the inlet is lower than that at the outlet, the pin fins 2 on the lower surface of the heat dissipation substrate 1 are uniformly arranged and have the same structure, so that the junction temperature of the chip 3 close to the water outlet is higher than that of the chip 3 close to the water inlet, and the chip 3 at the outlet becomes a heat dissipation short plate of the whole module. For a three-phase inverter full-bridge structure, the junction temperature of the W-phase chip 3 is higher than that of the V-phase chip 3.
The plurality of DCB lining plates 6 are mounted on the radiating substrate 1, and when the power consumption of a single chip or a plurality of chips 3 on each DCB lining plate 6 is different, the pins 2 on the lower surface of the radiating substrate 1 are uniformly distributed and have the same structure, so that the chip 3 with high power consumption becomes a radiating short plate of the whole module.
In summary, in the prior art, the pin fins 2 on the lower surface of the heat dissipation substrate 1 are uniformly arranged and have the same structure, so that the chip 3 at the heat dissipation medium outlet or the chip 3 with high power consumption becomes a heat dissipation short plate of the whole module.
In order to solve the above problem, in the heat dissipation substrate 1 of the present embodiment, the density of the pin fins 2 is high in the region where the heat dissipation requirement is high, and the density of the pin fins 2 is low in the region where the heat dissipation requirement is low, which is advantageous for avoiding the occurrence of short heat dissipation plates.
Specifically, the pin fins 2 with high density are arranged at the positions corresponding to the chips 3 with high power consumption at the positions of the heat dissipation medium outlets, and the pin fins 2 are high in density, so that the heat exchange area between the heat dissipation substrate 1 and the cooling liquid is favorably increased, the heat exchange efficiency is improved, and the heat dissipation short plates are favorably avoided.
By utilizing the heat dissipation substrate 1, the pin fins 2 are formed on the lower surface of the heat dissipation substrate 1, wherein the pin fins 2 in the area with high heat dissipation requirements are high in density, and the pin fins 2 in the area with low heat dissipation requirements are low in density, so that the heat exchange efficiency of the area with high heat dissipation requirements is improved, and the occurrence of heat dissipation short plates is favorably avoided.
Example two
As shown in fig. 4 and 5, the density of the pin fins 2 gradually increases from the heat radiation medium inlet to the heat radiation medium outlet, and this embodiment is suitable for a case where the power consumption of the plurality of chips 3 on the respective DCB patches 6 on the heat radiation substrate 1 is close.
Install a plurality of DCB welts 6 on the radiating basal plate 1, install single or a plurality of chip 3 on the DCB welt 6, when the consumption of the chip 3 on each DCB welt 6 is close, for example three-phase contravariant full bridge structure, the consumption of U looks, V looks, W looks chip 3 is close, and U looks chip 3 is located the radiating medium entrance, and W looks chip 3 is located the radiating medium exit, and V looks chip 3 is located between U looks chip 3 and the W looks chip 3. Because the temperature of the heat-dissipating medium at the inlet is lower than that at the outlet, if the pin fins 2 on the lower surface of the heat-dissipating substrate 1 are uniformly arranged and have the same structure, the junction temperature of the chip 3 close to the water outlet is higher than that of the chip 3 close to the water inlet, and the chip 3 at the outlet becomes a heat-dissipating short plate of the whole module, that is, under the condition of a three-phase inversion full-bridge structure, the junction temperature of the W-phase chip 3 is higher than that of the V-phase chip 3.
In this embodiment, the density of the pin fins 2 is gradually increased from the heat-dissipating medium inlet to the heat-dissipating medium outlet, so that the heat-dissipating efficiency of the heat-dissipating substrate 1 is gradually improved from the heat-dissipating medium inlet to the heat-dissipating medium outlet, and the chip 3 at the outlet is prevented from becoming a heat-dissipating short plate of the entire module, that is, the junction temperature of the W-phase chip 3 is prevented from being higher than the junction temperature of the V-phase chip 3 in the case of a three-phase inverter full-bridge structure.
Through this embodiment, be favorable to promoting the radiating efficiency of heat dissipation base plate 1 gradually from the radiating medium entrance to radiating medium exit, be favorable to avoiding chip 3 at exit to become the heat dissipation short slab of whole module.
EXAMPLE III
From the heat dissipation medium inlet to the heat dissipation medium outlet, the size of the pin fin 2 is gradually reduced, thereby being beneficial to realizing the gradual increase of the density of the pin fin 2.
With this embodiment, it is advantageous to achieve a gradual increase in the density of the pin fins 2.
Example four
In the present embodiment, when a plurality of chips 3 are mounted on the heat dissipating substrate 1, the density of the pin fins 2 below the chips 3 with high power consumption is large, and the density of the pin fins 2 below the chips 3 with low power consumption is small.
The heat dissipation substrate 1 is provided with a plurality of chips 3, and when the power consumption of each chip 3 is different, if the pin fins 2 on the lower surface of the heat dissipation substrate 1 are uniformly arranged and have the same structure, the chip 3 with high power consumption becomes a heat dissipation short plate of the whole module.
In order to solve the above technical problem, in this embodiment, when the plurality of chips 3 are mounted on the heat dissipation substrate 1, the density of the pin fins 2 below the chip 3 with high power consumption is large, the density of the pin fins 2 below the chip 3 with low power consumption is small, and the heat exchange efficiency of the area where the chip 3 with high power consumption is located is improved, so that the chip 3 with high power consumption is prevented from becoming a heat dissipation short plate of the whole module.
By this embodiment, it is advantageous to avoid the chip 3 with high power consumption from becoming a heat-dissipating short plate of the entire module.
EXAMPLE five
In one embodiment, as shown in fig. 3, the density of pin fins 2 is high below the mounting area of the chips 3 of the DCB patches 6 and the density of pin fins 2 is low below the area between the DCB patches 6. This is because the DCB backing plate 6 has a single or a plurality of chips 3 mounted thereon, and the temperature of the mounting area is higher than that of the non-chip 3 mounting area, so that the density of the pin fins 2 therebelow is high. The density of the pin fins 2 below the non-chip mounting region between the DCB backing plates 6 is small, the heat dissipation performance of the heat dissipation substrate 1 is not affected, and the flow resistance of a heat dissipation medium can be reduced in the region, so that the heat dissipation performance of the heat dissipation substrate 1 can be improved.
Meanwhile, as shown in fig. 3, the cross-section of the pin fin 2 under the chip 3 mounting region of the DCB backing plate 6 is elliptical, and the cross-section of the pin fin 2 under the non-chip mounting region between the DCB backing plates 6 is circular. This is because the DCB backing plate 6 has a high temperature, and the elliptical pin fins 2 with high heat dissipation are used for the pin fins 2 below the DCB backing plate, which is more favorable for improving the heat dissipation performance of the heat dissipation substrate 1.
In one embodiment, as shown in fig. 6, the density of pin fins 2 is high below the mounting area of the chip 3 of the DCB patch 6, and the density of pin fins 2 is low below the area around the DCB patch 6. This is because the DCB backing plate 6 has a single or a plurality of chips 3 mounted thereon, and the temperature of the mounting area is higher than that of the non-chip 3 mounting area, so that the density of the pin fins 2 therebelow is high. The density of the pin fins 2 below the non-chip mounting region around the DCB backing plate 6 is small, so that the heat dissipation performance of the chip 3 is not affected, and the flow resistance of a heat dissipation medium can be reduced in the region, thereby being more beneficial to improving the heat dissipation performance of the heat dissipation substrate 1.
Meanwhile, as shown in fig. 6, the cross section of the pin fin 2 under the chip 3 mounting region of the DCB backing plate 6 is elliptical, and the cross section of the pin fin 2 under the non-chip mounting region around the DCB backing plate 6 is circular. This is because the DCB backing plate 6 has a high temperature, and the elliptical pin fins 2 with high heat dissipation are used for the pin fins 2 below the DCB backing plate, which is more favorable for improving the heat dissipation performance of the heat dissipation substrate 1.
By this embodiment, the heat dissipation performance of the heat dissipation substrate 1 is advantageously improved.
EXAMPLE six
The cross section of the pin fin 2 is round, oval, diamond, raindrop or triangle.
The pin fins 2 with different shapes have different heat dissipation capabilities, and the shapes of the pin fins 2 in different areas can be different through adjustment, so that the purpose of adjusting the heat dissipation capabilities of different areas of the heat dissipation substrate 1 is achieved.
In the present embodiment, the pin fin 2 has an elliptical cross-section in the region where the heat dissipation requirement is high.
As shown in fig. 6, when the cross section of the pin fin 2 is elliptical, the eddy effect of the heat dissipation medium is reduced, thereby reducing the pressure drop of the flow channel and increasing the heat exchange area of the pin fin 2, so that when the cross section of the pin fin 2 is elliptical, the heat dissipation efficiency of the region is high, and the pin fin 2 with the elliptical cross section is arranged in the region with high heat dissipation requirement, which is beneficial to improving the heat dissipation capability of the substrate in the region and preventing the region from becoming a short heat dissipation plate.
Specifically, as shown in fig. 5, the substrate is divided into 3 regions, each corresponding to 3 chips 3, the region corresponding to the chip 3 at the heat-dissipating medium inlet, the pin fin 2 is cylindrical and has a low density, the region corresponding to the chip 3 at the heat-dissipating medium outlet, the pin fin 2 has an elliptical cross section and a high density, the region corresponding to the chip 3 between the two regions is located, and the pin fin 2 has a diamond cross section and a moderate density.
As shown in fig. 3, in the area corresponding to the substrate DCB liner 6, the cross section of the pin fin 2 is elliptical and has a high density; in the transition area between the DCB lining plates 6, the cross section of the pin fin 2 is circular and has smaller density.
As shown in fig. 6, in the area corresponding to the substrate DCB liner 6, the cross section of the pin fin 2 is elliptical and has a high density; in the non-chip mounting region around the DCB backing plate 6, the cross section of the pin fin 2 is circular and has low density.
Alternatively, the pin fin 2 may have an elliptical cross-section, the major axis of which may be 1.7 to 4.7 mm and the minor axis of which may be 0.5 to 3.0 mm. The length of the pin fin 2 is 5.5 to 6.5 mm.
Preferably, the ellipse may have a major axis of 2.7 mm and a minor axis of 1.2 mm. The length of the pin fin 2 is 5.8 mm. The average central distances of the adjacent pin fins 2 in the transverse and longitudinal directions are 3.3 mm and 2.2 mm respectively.
Preferably, when the cross section of the pin fin 2 is elliptical, the major axis of the ellipse is parallel to the flow direction of the heat dissipation medium to reduce the flow resistance.
Through the embodiment, the pin fins 2 with the oval cross sections are arranged in the area with high heat dissipation requirements, so that the area is prevented from becoming a short heat dissipation plate.
EXAMPLE seven
In one embodiment, a boss is formed on the upper surface of the heat dissipation substrate 1 to ensure uniform solder thickness between the DCB backing plate 6 and the heat dissipation substrate 1; a recess is formed on the lower surface of the heat dissipation substrate 1 along the edge of the heat dissipation substrate 1, and the bottom surface of the recess is smooth and is used for at least partially accommodating the sealing ring; as shown in fig. 3 to 5, the heat-dissipating substrate 1 is provided with mounting holes 4 for receiving screws capable of connecting the heat-dissipating substrate 1 and the heat-dissipating base or the heat-dissipating substrate 1 and the case 7; the heat dissipation substrate 1 is further provided with a positioning hole 5 for accommodating a positioning column on the tube shell 7 so as to position the tube shell 7 and the heat dissipation substrate 1.
Optionally, each DCB patch 6 corresponds to 4 bosses, and the 4 bosses are respectively located at 4 top corners of the DCB patch 6. Optionally, the boss has a thickness of 0.1 to 0.5 millimeters; preferably, the boss has a thickness of 0.2 mm.
With this embodiment, the bosses facilitate secure fixation of the DCB patch 6; the bottom surface of the recess is smooth, so that a gap between the sealing ring and the heat dissipation substrate 1 is avoided, and sealing is facilitated; the mounting hole 4 can fix the heat dissipation substrate 1; the positioning hole 5 is advantageous for limiting before mounting to make the mounting position of the heat dissipation substrate 1 accurate.
Example eight
The embodiment also provides a power module, which includes the heat dissipation substrate 1.
By utilizing the power module, the pin fins 2 are formed on the lower surface of the radiating substrate 1, wherein the pin fins 2 in the area with high radiating requirement have high density, and the pin fins 2 in the area with low radiating requirement have low density, so that the heat exchange efficiency of the area with high radiating requirement is improved, and the occurrence of radiating short plates is favorably avoided; or the pin fins with the oval cross sections are arranged in the area with high heat dissipation requirements, and the oval pin fins have high heat dissipation capacity, so that the area is prevented from becoming a short heat dissipation plate.
In one embodiment, as shown in fig. 1 and 2, the power module further comprises: a DCB liner plate 6 which is welded and fixed on the boss of the heat dissipation substrate 1, and the copper-clad layer of the DCB liner plate is bare copper, copper gold-plated or copper nickel-plated; the heat dissipation base is provided with a heat dissipation medium inlet, a heat dissipation medium outlet and a heat dissipation medium groove communicated with the heat dissipation medium inlet and the heat dissipation medium outlet; a seal ring disposed between the heat-dissipating base and the heat-dissipating substrate 1; a chip fixed on the DCB liner plate; and a case 7 made of a polymer material or other pressure-resistant moisture-resistant material; wherein, the length of the pin fin 2 is less than the depth of the heat dissipation medium groove.
By this embodiment, the bosses ensure the horizontal arrangement of the DCB backing plate 6; the heat dissipation base provides an accommodating space for a heat dissipation medium; the sealing ring is favorable for avoiding leakage of a heat dissipation medium; the chip 3 ensures the normal use of the power module; the tube shell 7 protects the power module; the length of the pin fin 2 is smaller than the depth of the heat dissipation medium groove, so that the pin fin 2 is prevented from colliding with the heat dissipation medium groove, and the efficient work of the heat dissipation substrate 1 is facilitated.
In the utility model, when the positions of the liquid outlet and the liquid inlet of the heat-radiating medium are changed, the long axis of the pin fin is consistent with the connecting line of the liquid outlet and the liquid inlet.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
Although the utility model herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that features described in different dependent claims and herein may be combined in ways different from those described in the original claims. It is also to be understood that features described in connection with individual embodiments may be used in other described embodiments.
Claims (11)
1. A plurality of pin fins are formed on the lower surface of a heat dissipation substrate, and the pin fins are one or more of the following structures:
the pin fin distribution has a high density in areas where heat dissipation requirements are high, has a first structure, and includes a combination of the first structure and other structures different from the first structure.
2. The heat dissipating substrate according to claim 1, wherein the density of the pin fins increases gradually from the heat dissipating medium inlet to the heat dissipating medium outlet.
3. The heat dissipating substrate according to claim 2, wherein the pin fins are divided into a plurality of regions from the heat dissipating medium inlet to the heat dissipating medium outlet, the pin fins in each region have a uniform density, and the pin fins in two adjacent regions adjacent to the heat dissipating medium outlet have a density greater than that in the region adjacent to the heat dissipating medium inlet.
4. The heat dissipating substrate according to claim 2, wherein the pin fins are gradually reduced in size from the heat dissipating medium inlet to the heat dissipating medium outlet.
5. The heat dissipating substrate according to claim 1, wherein when a plurality of chips are mounted on the heat dissipating substrate, the density of pin fins under the chips with high power consumption is large, and the density of pin fins under the chips with low power consumption is small.
6. The heat dissipating substrate according to claim 1, wherein the pin fins have a circular, oval, diamond, raindrop, or triangular cross-section.
7. The heat dissipating substrate of claim 1, wherein when there are a plurality of chip mounting areas on the heat dissipating substrate, the cross-sectional shape of the pin fin is different in different heat dissipation requirement areas.
8. The heat dissipating substrate of claim 1, wherein the pin fins having the first configuration have an elliptical cross-section.
9. The heat dissipation substrate according to claim 1, wherein a projection is formed on an upper surface of the heat dissipation substrate to ensure uniform thickness of solder between the DCB backing plate and the heat dissipation substrate;
a recess is formed in the lower surface of the heat dissipation substrate along the edge of the heat dissipation substrate, and the bottom surface of the recess is smooth and is used for at least partially accommodating the sealing ring;
the heat dissipation substrate is provided with mounting holes for accommodating screws, and the screws can be connected with the heat dissipation substrate and the heat dissipation base or the heat dissipation substrate and the tube shell;
the heat dissipation substrate is further provided with a positioning hole for containing a positioning column on the tube shell so as to position the tube shell and the heat dissipation substrate.
10. A power module comprising the heat dissipating substrate according to any one of claims 1 to 9.
11. The power module of claim 10, further comprising:
the DCB liner plate is welded and fixed on the boss of the heat dissipation substrate, and the copper-clad layer of the DCB liner plate is bare copper, copper gold-plated or copper nickel-plated;
the heat dissipation base is provided with a heat dissipation medium inlet, a heat dissipation medium outlet and a heat dissipation medium groove communicated with the heat dissipation medium inlet and the heat dissipation medium outlet;
a sealing ring disposed between the heat-dissipating base and the heat-dissipating substrate;
a chip fixed on the DCB liner plate; and the number of the first and second groups,
a tube shell which is made of high polymer material or other pressure-resistant and moisture-resistant material;
wherein the length of the pin fin is smaller than the depth of the heat dissipation medium groove.
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|---|---|---|---|
| CN202123172901.3U CN216563104U (en) | 2021-12-15 | 2021-12-15 | Heat dissipation substrate and power module |
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| CN202123172901.3U CN216563104U (en) | 2021-12-15 | 2021-12-15 | Heat dissipation substrate and power module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038473A (en) * | 2023-09-19 | 2023-11-10 | 毫厘机电(苏州)有限公司 | Manufacturing method of liquid cooling radiator and liquid cooling radiator |
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- 2021-12-15 CN CN202123172901.3U patent/CN216563104U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038473A (en) * | 2023-09-19 | 2023-11-10 | 毫厘机电(苏州)有限公司 | Manufacturing method of liquid cooling radiator and liquid cooling radiator |
| CN117038473B (en) * | 2023-09-19 | 2024-01-23 | 毫厘机电(苏州)有限公司 | Manufacturing method of liquid cooling radiator and liquid cooling radiator |
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