CN216503146U - Contraposition laminating device of laser chip optical waveguide and bottom plate - Google Patents
Contraposition laminating device of laser chip optical waveguide and bottom plate Download PDFInfo
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- CN216503146U CN216503146U CN202122510898.5U CN202122510898U CN216503146U CN 216503146 U CN216503146 U CN 216503146U CN 202122510898 U CN202122510898 U CN 202122510898U CN 216503146 U CN216503146 U CN 216503146U
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Abstract
The utility model relates to the technical field of alignment equipment, in particular to an alignment and lamination device for a laser chip optical waveguide and a bottom plate. Compared with the prior art, the alignment and lamination device for the laser chip optical waveguide and the bottom plate has the advantages that the extraction precision of the chip optical waveguide is improved, the lamination precision can be effectively improved, the structure is simple, the operation is convenient, the manual interference can be effectively reduced, the welding alignment automation is improved, and the welding alignment efficiency and the welding alignment quality are improved.
Description
[ technical field ] A
The utility model relates to the technical field of alignment equipment, in particular to an alignment and bonding device for a laser chip optical waveguide and a bottom plate.
[ background of the utility model ]
In the counterpoint laminating of prior art's laser instrument (LD) and bottom plate, after the suction nozzle absorption back chip product, bottom optical camera snatchs the outline and fixes a position the product, carries out direct and bottom plate laminating, leads to laminating precision not high.
[ Utility model ] content
In order to overcome the above problems, the present invention provides an alignment and bonding apparatus for a laser chip optical waveguide and a base plate, which can effectively solve the above problems.
The utility model provides a technical scheme for solving the technical problems, which comprises the following steps: the alignment and lamination device for the laser chip optical waveguide and the bottom plate comprises a machine table main body, wherein a marble bottom plate is arranged below the machine table main body; an XY linear driving device is arranged on one side of the machine table main body, an eutectic welding table and a transfer positioning table are arranged on the XY linear driving device, and an up-and-down photographing unit is arranged above the transfer positioning table; a Z-axis linear driving device is arranged above the eutectic welding table and the transfer positioning table, a rotary driving device is arranged on one side of the Z-axis linear driving device, and a first suction nozzle and a second suction nozzle are arranged below the rotary driving device; the transfer positioning table comprises a transfer annular light source, a transparent bearing table is arranged in an annular hollow part of the transfer annular light source, a transfer bottom prism is arranged below the transfer annular light source, and a transfer bottom camera is arranged on the side of the transfer bottom prism; the upper and lower unit of shooing includes prism beam-splitting part and camera shooting part, prism beam-splitting part includes an equilateral right angle triangle beam-splitting prism, camera shooting part includes a shooting camera, shoots the camera front end and is provided with the camera lens.
Preferably, the eutectic welding platform includes the welding cavity, the welding cavity lateral part is provided with the pulse heating board, the welding cavity lateral part is respectively communicated with nitrogen gas inlet, nitrogen gas cooling blowing mouth and vacuum suction hole.
Preferably, the equilateral right-angle triangular beam splitter prism includes two perpendicular right-angle surfaces and an inclined surface connected with the two right-angle surfaces, the photographing lens vertically corresponds to the inclined surface, and the right-angle edge intersected with the two right-angle surfaces is just opposite to the center of the photographing lens.
Preferably, the outer sides of the two right-angle surfaces are plated with films.
Preferably, the prism beam-splitting part further comprises a first base and a second base, a sliding rail is fixed on one side of the first base, the second base is connected to the sliding rail in a sliding mode, and the second base can slide back and forth along the sliding rail.
Preferably, the lateral part integrated into one piece of first base has vertical prism mounting panel, equilateral right-angle triangle beam splitter prism's inclined plane laminating is fixed in on the prism mounting panel.
Preferably, an upper light source is arranged right above the equilateral right-angle triangular beam splitter prism, and a lower light source is arranged right below the equilateral right-angle triangular beam splitter prism.
Preferably, an upper light blocking sheet is arranged above the upper light source, a lower light blocking sheet is arranged below the lower light source, one end of the upper light blocking sheet is connected with an upper driving cylinder, one end of the lower light blocking sheet is connected with a lower driving cylinder, and the upper driving cylinder and the lower driving cylinder are rotating cylinders.
Preferably, an upper cover is provided at an upper side of the machine main body, and a lower cover is provided at a lower side of the machine main body.
Preferably, a material placing disc is arranged on the side of the transfer annular light source.
Compared with the prior art, the alignment and lamination device for the laser chip optical waveguide and the bottom plate respectively positions the upper surface and the lower surface of a chip product through the upper and lower photographing units and the transfer positioning table, transfers the reference to the optical waveguide with higher precision, improves the extraction precision of the chip optical waveguide, can effectively improve the lamination precision, has simple structure and convenient operation, can effectively reduce manual interference, improves the welding alignment automation, and improves the welding alignment efficiency and the welding alignment quality; the light path is simple, the cost is lower, the upper product and the lower product only need to be shot by one shooting camera, the camera calibration is simple, the image processing is simple, the laminating precision is high, the consistency is good, the compatibility is high, and different light-emitting modes and different shooting modes are provided.
[ description of the drawings ]
FIG. 1 is an overall structure diagram of the alignment and bonding apparatus for the optical waveguide and the substrate of the laser chip according to the present invention;
FIG. 2 is an internal structure diagram of the alignment and bonding apparatus for the optical waveguide and the bottom plate of the laser chip according to the present invention;
FIG. 3 is a structural diagram of an eutectic welding table of the alignment and bonding device for the optical waveguide and the bottom plate of the laser chip of the utility model;
FIG. 4 is a structural diagram of a transfer positioning table of the alignment and bonding device for the optical waveguide and the bottom plate of the laser chip of the present invention;
FIG. 5 is the whole structure of the upper and lower photographing units of the alignment and attachment device for the optical waveguide and the bottom plate of the laser chip of the present invention;
FIG. 6 is a schematic diagram of a prism beam splitting portion of an up-and-down photographing unit of the alignment and bonding apparatus for laser chip optical waveguide and base plate according to the present invention;
fig. 7 is an end view of an equilateral right-angled triangular beam splitter prism of an upper and lower photographing unit of the alignment and attachment device for a laser chip optical waveguide and a base plate according to the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
It should be noted that all directional indications (such as up, down, left, right, front, and back … …) in the embodiments of the present invention are limited to relative positions on a given view, not absolute positions.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Referring to fig. 1 to 7, the alignment and bonding device for the optical waveguide and the substrate of the laser chip of the present invention is suitable for eutectic soldering in the field of optical communication, and is particularly suitable for soldering a chip and a substrate, and includes a machine main body 100, a marble substrate 150 is disposed below the machine main body 100, and the marble substrate 150 is used for supporting the machine main body 100, so that the stability is higher, and the welding precision is favorably ensured. The XY linear driving device 200 is arranged on one side of the machine table main body 100, an eutectic welding table 400 and a transfer positioning table 500 are arranged on the XY linear driving device 200, the XY linear driving device 200 is used for adjusting the positions of the eutectic welding table 400 and the transfer positioning table 500 in the XY direction, the eutectic welding table 400 is used for welding a chip and a bottom plate, and the transfer positioning table 500 is used for acquiring the position information of the feature points on the upper surface and the lower surface of the chip.
The Z-axis linear driving device 300 is arranged above the eutectic welding table 400 and the transfer positioning table 500, a rotary driving device 700 is arranged on one side of the Z-axis linear driving device 300, a first suction nozzle 710 and a second suction nozzle 720 are arranged below the rotary driving device 700, the Z-axis linear driving device 300 can drive the rotary driving device 700 to move up and down, the rotary driving device 700 can drive the first suction nozzle 710 and the second suction nozzle 720 to rotate, and flexible position adjustment is achieved.
The upper cover 110 is disposed at the upper portion of the lateral side of the machine main body 100, and is used for shielding the Z-axis linear driving device 300, the rotational driving device 700, the first suction nozzle 710 and the second suction nozzle 720, thereby improving the integrity of the apparatus. The lower part of the side of the machine table main body 100 is provided with a lower cover 120 for shielding the XY linear driving device 200, the eutectic welding table 400 and the transfer positioning table 500, so that the integrity of the equipment is improved. The upper and lower housings 110 and 120 are each provided with an opening for serving as a transportation passage.
The upper side of the machine main body 100 is provided with a signal tower lamp 140 for prompting. An emergency stop button 160 is provided on the outer side of the upper housing 110 for emergency stop. The upper side of the lower cover 120 is provided with a monitoring meter 130 for observing data. The machine main body 100 is internally provided with a control system for overall coordination control.
The eutectic welding table 400 comprises a welding chamber 410, a pulse heating plate 420 is arranged on the side of the welding chamber 410, the side of the welding chamber 410 is respectively communicated with a nitrogen inlet 430, a nitrogen cooling blowing port 440 and a vacuum suction hole 450, and the vacuum suction hole 450 is used for vacuumizing to generate adsorption force on the welding chamber 410 to fix a product.
The transfer positioning table 500 includes a transfer ring-shaped light source 510, and a transparent carrying table is disposed in an annular hollow portion of the transfer ring-shaped light source 510 for placing a chip by vacuum adsorption. The below of transfer annular light source 510 is provided with transfer bottom prism 520, and the side of transfer bottom prism 520 is provided with transfer bottom camera 530, one side of transfer bottom camera 530 is provided with the coaxial light emitter 540 of transfer, and transfer bottom camera 530 shoots the chip bottom of placing at the plummer through transfer bottom prism 520. The lateral part of the transfer annular light source 510 is provided with a material placing disc 550 for placing products.
The prism beam-splitting part further comprises a first base 610 and a second base 620, wherein a sliding rail 611 is fixed on one side of the first base 610, the second base 620 is slidably connected to the sliding rail 611, and the second base 620 can slide back and forth along the sliding rail 611. A first cylinder 612 is fixed above the first base 610, an output end of the first cylinder 612 is connected to the second base 620, and the first cylinder 612 drives the second base 620 to slide back and forth along the sliding rail 611.
The lateral part integrated into one piece of first base 610 has vertical prism mounting panel 621, the laminating of inclined plane 6222 of equilateral right-angle triangle beam splitter prism 622 is fixed in on the prism mounting panel 621. An upper light source 623 is arranged right above the equilateral right-angle triangular beam splitter prism 622, a lower light source 624 is arranged right below the equilateral right-angle triangular beam splitter prism 622, and the upper light source 623 and the lower light source 624 are used for light supplement and can meet the image quality requirements of different products with different characteristics. An upper light blocking sheet 625 is arranged above the upper light source 623, a lower light blocking sheet 626 is arranged below the lower light source 624, one end of the upper light blocking sheet 625 is connected with an upper driving cylinder 627, one end of the lower light blocking sheet 626 is connected with a lower driving cylinder 628, and the upper driving cylinder 627 and the lower driving cylinder 628 are rotating cylinders and are used for respectively controlling the upper light blocking sheet 625 and the lower light blocking sheet 626 to rotate so as to realize the opening and closing of an upper light path and a lower light path of the equal-side right-angle triangular beam splitter prism 622. The upper driving cylinder 627 and the lower driving cylinder 628 are fixed to the second base 620. Two light source mounting plates 629 are further fixed on the second base 620, and the upper light source 623 and the lower light source 624 are respectively fixed on the light source mounting plates 629. The light source mounting plate 629 is provided with a light transmission hole 6291 in the middle for transmitting light. The upper light source 623 and the lower light source 624 are annular light sources, and the annular hollow parts of the upper light source 623 and the lower light source 624 correspond to the light-transmitting holes 6291 of the light source mounting plate 629.
The camera photographing part further includes a third base 670, and the photographing camera 630 and the photographing lens 640 are fixed to the third base 670. The rear end of the third base 670 is connected with a second cylinder 660, and the second cylinder 660 drives the third base 670 to move so as to drive the shooting lens 640 to move, thereby achieving the purpose of focusing. The coaxial light emitter 650 is arranged on one side of the shooting lens 640, the coaxial light emitter 650 emits coaxial light from the inside of the shooting lens 640, the coaxial light is emitted from the shooting lens 640, the equilateral right-angle triangular beam splitter prism 622 is divided into an upper path and a lower path, light is emitted on a product, and the two paths of incident light are uniform in illumination.
When the up-down photographing unit 600 works, after the photographing camera 630 takes a picture up and down and is positioned, the equilateral right-angle triangular beam splitter prism 622 is moved away under the driving of the first cylinder 612, and the upper product and the lower product are close to alignment. The incident upper and lower optical paths are respectively rotated by 690 degrees and pass through the lens to form an image on the shooting camera 630. The upper light blocking sheet 625 and the lower light blocking sheet 626 can be selectively opened and closed, and the brightness requirements of the upper image and the lower image are met. The product photographing can also be selectively opened one way for photographing, closed one way, or opened two ways at the same time, and the two products form overlapping images on the photographing camera 630 at the same time.
When the whole device works, the first suction nozzle 710 sucks the bottom plate from the material placing plate 550 and places the bottom plate into the welding chamber 410 of the eutectic welding table 400; the second suction nozzle 720 sucks the chip from the material placing tray 550, places the chip on the bearing table of the transfer positioning table 500, moves the transfer positioning table 500 to the lower part of the up-down photographing unit 600, photographs the upper surface of the chip by the photographing camera 630 of the up-down photographing unit 600, and calculates the top outline; a transfer bottom camera 530 of the transfer positioning table 500 shoots the lower surface of the chip, calculates the bottom outline, performs image processing to obtain the positions of the characteristic points of the lower surface and the upper surface of the chip, performs coincidence normalization processing, and calculates the position difference between the lower outline and the optical waveguide; the second suction nozzle 720 sucks the chip from the transfer positioning stage 500, moves to the upper side of the up-down photographing unit 600, moves the welding chamber 410 with the bottom plate to the lower side of the up-down photographing unit 600, the photographing camera 630 of the up-down photographing unit 600, photographs the chip above, the bottom plate below, and image processing errors, calculates the position deviation of the optical waveguide of the chip and the bottom plate, adjusts the position through the XY linear driving device 200 and the Z axis linear driving device 300, and performs alignment through positioning error compensation; the Z-axis linear driving device 300 controls the second suction nozzle 720 to descend, and the chip is attached to the bottom plate; the eutectic welding table 400 is heated, welded, insulated and cooled according to the process parameters, and the welding process is completed; after the welding is completed, the second suction nozzle 720 sucks the welded product to perform blanking.
Compared with the prior art, the alignment and bonding device for the laser chip optical waveguide and the bottom plate respectively positions the upper surface and the lower surface of a chip product through the upper and lower photographing units 600 and the transfer positioning table 500, transfers the reference to the optical waveguide with higher precision, improves the extraction precision of the optical waveguide, can effectively improve the bonding precision, has a simple structure, is convenient to operate, can effectively reduce manual interference, improves the welding automation, and improves the welding efficiency and the welding quality; the light path is simple, the cost is lower, the upper product and the lower product only need to be shot by using one shooting camera 630, the camera calibration is simple, the image processing is simple, the laminating precision is high, the consistency is good, the compatibility is high, and different light-emitting modes and different shooting modes are provided.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and any modifications, equivalents, improvements, etc. made within the spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. The alignment and lamination device for the laser chip optical waveguide and the bottom plate is characterized by comprising a machine table main body, wherein a marble bottom plate is arranged below the machine table main body;
an XY linear driving device is arranged on one side of the machine table main body, an eutectic welding table and a transfer positioning table are arranged on the XY linear driving device, and an up-and-down photographing unit is arranged above the transfer positioning table;
a Z-axis linear driving device is arranged above the eutectic welding table and the transfer positioning table, a rotary driving device is arranged on one side of the Z-axis linear driving device, and a first suction nozzle and a second suction nozzle are arranged below the rotary driving device;
the transfer positioning table comprises a transfer annular light source, a transparent bearing table is arranged in an annular hollow part of the transfer annular light source, a transfer bottom prism is arranged below the transfer annular light source, and a transfer bottom camera is arranged on the side of the transfer bottom prism;
the unit of shooing includes prism beam-splitting portion and camera shooting portion from top to bottom, prism beam-splitting portion includes an equilateral right angle triangle beam-splitting prism, camera shooting portion includes a shooting camera, shoots the camera front end and is provided with the camera lens.
2. The alignment and bonding device of the laser chip optical waveguide and the bottom plate according to claim 1, wherein the eutectic bonding stage comprises a welding chamber, a pulse heating plate is disposed on a side of the welding chamber, and the side of the welding chamber is respectively communicated with a nitrogen inlet, a nitrogen cooling blowing port and a vacuum suction hole.
3. The apparatus of claim 1, wherein the equilateral right-angled triangular beam splitter prism includes two perpendicular right-angled surfaces and an inclined surface connecting the two right-angled surfaces, the photographing lens vertically corresponds to the inclined surface, and the right-angled edge where the two right-angled surfaces intersect faces the center of the photographing lens.
4. The alignment and bonding device of the optical waveguide and the bottom plate of the laser chip as claimed in claim 3, wherein the outer sides of the two right-angle surfaces are coated with a film.
5. The alignment and bonding apparatus of the optical waveguide and the bottom plate of the laser chip according to claim 3, wherein the prism beam splitter further comprises a first base and a second base, a slide rail is fixed on one side of the first base, the second base is slidably connected to the slide rail, and the second base can slide back and forth along the slide rail.
6. The apparatus of claim 5, wherein a vertical prism mounting plate is integrally formed on a side of the first base, and the inclined surface of the equilateral right-angled triangular beam splitter prism is attached to the prism mounting plate.
7. The apparatus according to claim 5, wherein an upper light source is disposed directly above the equilateral right-angled triangular beam splitter prism, and a lower light source is disposed directly below the equilateral right-angled triangular beam splitter prism.
8. The alignment and bonding apparatus for laser chip optical waveguide and substrate as claimed in claim 7, wherein an upper light-shielding plate is disposed above the upper light source, a lower light-shielding plate is disposed below the lower light source, an upper driving cylinder is connected to one end of the upper light-shielding plate, a lower driving cylinder is connected to one end of the lower light-shielding plate, and both the upper driving cylinder and the lower driving cylinder are rotating cylinders.
9. The apparatus for aligning and bonding a laser chip optical waveguide and a base plate according to claim 1, wherein an upper cover is provided on an upper side of the machine body, and a lower cover is provided on a lower side of the machine body.
10. The alignment and bonding apparatus for optical waveguides and base plates of laser chips as claimed in claim 1, wherein a material placing plate is disposed on a side of the transfer ring-shaped light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122510898.5U CN216503146U (en) | 2021-10-18 | 2021-10-18 | Contraposition laminating device of laser chip optical waveguide and bottom plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122510898.5U CN216503146U (en) | 2021-10-18 | 2021-10-18 | Contraposition laminating device of laser chip optical waveguide and bottom plate |
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| CN216503146U true CN216503146U (en) | 2022-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122510898.5U Active CN216503146U (en) | 2021-10-18 | 2021-10-18 | Contraposition laminating device of laser chip optical waveguide and bottom plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118197937A (en) * | 2024-05-17 | 2024-06-14 | 成都汉芯国科集成技术有限公司 | FC flip-chip welding process adopted by PMU chip |
-
2021
- 2021-10-18 CN CN202122510898.5U patent/CN216503146U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118197937A (en) * | 2024-05-17 | 2024-06-14 | 成都汉芯国科集成技术有限公司 | FC flip-chip welding process adopted by PMU chip |
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