CN216246824U - Temperature sensor and electronic equipment - Google Patents
Temperature sensor and electronic equipment Download PDFInfo
- Publication number
- CN216246824U CN216246824U CN202023341424.4U CN202023341424U CN216246824U CN 216246824 U CN216246824 U CN 216246824U CN 202023341424 U CN202023341424 U CN 202023341424U CN 216246824 U CN216246824 U CN 216246824U
- Authority
- CN
- China
- Prior art keywords
- temperature sensor
- thermopile
- base
- signal conditioning
- conditioning circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 claims abstract description 4
- 230000003750 conditioning effect Effects 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 206010011409 Cross infection Diseases 0.000 description 2
- 206010029803 Nosocomial infection Diseases 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000005678 Seebeck effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Landscapes
- Radiation Pyrometers (AREA)
Abstract
The application discloses temperature sensor and electronic equipment, temperature sensor includes: a housing, a base, a thermopile, and a lens. The shell comprises a light inlet, and the base is arranged at one end, far away from the light inlet, in the shell; the thermopile is arranged on the base and is provided with a collecting surface back to the base; the lens is arranged between the thermopile and the light inlet and used for converging external infrared radiation light onto the collecting surface of the thermopile. According to the embodiment of the application, the accuracy and the efficiency of measuring the temperature of the remote object can be improved, and the temperature detection effect is optimized.
Description
Technical Field
The application belongs to the technical field of sensors, and particularly relates to a temperature sensor and an electronic device.
Background
At present, infrared temperature measuring sensors are widely used in temperature measuring equipment in civil and industrial fields.
However, when the traditional infrared temperature measuring sensor measures a measured object with a certain distance, the measured temperature is not accurate enough, and the temperature detection effect is not good.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a temperature sensor and electronic equipment, can promote and measure remote object temperature accuracy and efficiency, optimize the temperature detection effect.
In a first aspect, an embodiment of the present application provides a temperature sensor, where the temperature sensor includes:
a housing including a light inlet.
The base is arranged in the shell and is arranged at one end far away from the light inlet;
a thermopile disposed on the base, the thermopile having a collection face disposed opposite the base;
the lens is arranged between the thermopile and the light inlet and used for converging external infrared radiation light onto the collecting surface of the thermopile.
Optionally, the temperature sensor further includes:
the signal conditioning circuit is arranged on the base and electrically connected with the thermopile, and is used for processing the electric signals acquired from the thermopile and transmitting the processed electric signals to an upper computer.
Optionally, the temperature sensor further includes:
and the thermistor is arranged on the base and is electrically connected with the signal conditioning circuit.
Optionally, the signal conditioning circuit includes an NSA2300 chip.
Optionally, the temperature sensor further includes a power module, and the power module is configured to provide electric energy for the signal conditioning circuit.
Optionally, the power module includes an LDO linear regulator chip.
Optionally, the angle of view of the temperature sensor is 5 degrees.
Optionally, the temperature sensor further includes a pin, and the pin is connected to the signal conditioning circuit.
Optionally, the pins include a signal line pin and a clock line pin.
In a second aspect, an embodiment of the present application provides an electronic device, including a temperature sensor according to any one of the first aspect and the first aspect.
The temperature sensor and the electronic equipment can realize rapid and accurate measurement of the temperature of a remote object based on the thermopile. Therefore, accuracy and efficiency of measuring the temperature of the remote object are improved, and the temperature detection effect is optimized. And the risk of cross infection in the conventional close-range contact measurement can be greatly reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a temperature sensor provided by some embodiments of the present application;
FIG. 2 is a schematic diagram of a signal conditioning circuit provided in some embodiments of the present application
FIG. 3 is a schematic diagram of signal conditioning circuit data interaction provided by some embodiments of the present application;
fig. 4 is a schematic view of an angle of view of a temperature sensor provided by some embodiments of the present application.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Generally, people contact the surface of the human body at a close distance to measure the temperature of the surface of the human body, but the method of manual contact detection wastes time and labor and has certain dangerousness. Currently, certain distances can be achieved by using infrared temperature measurement.
The infrared temperature measuring sensor is a detecting device which can sense the measured information and convert the sensed information into electric signals or other required information output according to a certain rule so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like.
However, the conventional infrared thermometric sensor has some defects in measuring the temperature of the object, resulting in inaccurate measured temperature.
In order to solve the prior art problem, the embodiment of the application provides a temperature sensor and electronic equipment, can promote to measure remote object temperature accuracy and efficiency, and it is not good to optimize temperature detection effect.
A temperature sensor and an electronic device provided according to an embodiment of the present application are described below with reference to the drawings. It should be noted that these examples are not intended to limit the scope of the present disclosure.
FIG. 1 is a schematic diagram of a temperature sensor provided in some embodiments of the present application. As shown in fig. 1, in an embodiment of the present invention, a temperature sensor 100 may include a housing 101, a base 102, a thermopile 103, and a lens 104. The temperature sensor 100 may be an infrared temperature sensor.
Wherein the housing 101 of the temperature sensor comprises a light inlet. The base 102 is disposed at an end of the housing 101 away from the light inlet.
The thermopile is a core component of a multi-physical temperature sensor for remote measurement, and can convert temperature difference into voltage by utilizing the Seebeck effect.
The lens 104 is disposed between the thermopile 103 and the light inlet, and the lens is configured to converge the external infrared radiation 105 onto the collecting surface of the thermopile 103.
The lens is used for preventing the sensor from being interfered by sunlight and other visible light, so that the sensor is only sensitive to infrared rays and prevents other external interference. The lens focuses infrared rays emitted by a human body/object on the thermopile, so that the thermopile can quickly and sensitively sense and feed back an electric signal. Illustratively, the lens may be a convex lens.
In some embodiments of the present application, as shown in fig. 1, the temperature sensor 100 further includes pins 106, and the pins 106 may include a signal line pin (SDA) and a clock line pin (SDA).
In some embodiments of the present application, the pins 106 of the temperature sensor 100 may also include a VSS pin and a VDD pin.
In some embodiments of the present application, the temperature sensor 100 further comprises: signal conditioning circuitry (not shown in fig. 1).
The signal conditioning circuit is disposed on the base 102, one end of the signal conditioning circuit is electrically connected to the thermopile 103, and the other end of the signal conditioning circuit is connected to the pin 106.
The signal conditioning circuit is used for processing the electric signals acquired from the thermopile and transmitting the processed electric signals to an upper computer.
In some embodiments of the present application, the temperature sensor 100 further comprises: and the thermistor is arranged on the base 102 and is electrically connected with the signal conditioning circuit. The thermistor may be an NTC thermistor. The NTC thermistor can be used for collecting the ambient temperature and providing the ambient temperature for a rear-end collecting system, so that the temperature difference condition can be known in real time by the whole system.
In some embodiments of the present disclosure, the temperature sensor 100 may be fabricated by using a mems (micro fabrication process) process, in which polysilicon/aluminum (PolySi/Al) thermocouples are connected in series to convert the temperature difference into a measurable voltage. The temperature sensor 100 can actively sense and measure the temperature of a person/object, and display the temperature value on a display screen through lab view software, so that the maximum testing distance of 1.0m can be realized, and the precision reaches +/-0.1 ℃.
Fig. 2 is a schematic diagram of a signal conditioning circuit provided in some embodiments of the present application. As shown in fig. 2, in some embodiments of the present application, the signal conditioning circuit includes an NSA2300 chip. The NSA2300 chip is respectively connected with the pin, the thermopile and the NTC thermistor.
A filter module with a reserved low-pass filter function formed by R4/C5 and R5/C8 is further arranged between the NSA2300 chip and the thermopile, and can filter out high-frequency clutter signals. Illustratively, C8 may be 100 nanofarads (nF).
In some embodiments of the present application, for example, R3 may be 120K Ω and R6 may be 100K Ω, which provides a reasonable bias voltage for the thermopile infrared sensor. R3, R6 and resistances with temperature drift below 50 ppm/deg.C can be used. The temperature drift is the temperature drift, which is the main reason why the change of the parameters of the semiconductor device caused by the temperature change is the zero drift phenomenon.
Illustratively, R8 can be a resistor with a temperature drift below 50 ppm/deg.C, and the accuracy can be 0.1%.
For example, R7 may reserve an external NTC pad for connecting an NTC thermistor.
Illustratively, as shown in fig. 2, R1 and R2 may each be 4.7K Ω. The values of C1 can all be 1 microfarad (μ F); the values of C2, C3, C5 and C9 may all be 100 nF.
The temperature sensor further comprises a power supply module VCC, and the power supply module VCC is used for providing electric energy for the signal conditioning circuit. Illustratively, the power module includes an LDO linear regulator chip so that the power supply can be relatively clean.
The signal conditioning circuit carries out data processing on the electric signals collected from the NTC thermistor and the thermopile, converts the voltage signals input by the NTC thermistor and the thermopile into digital signals directly representing the temperature and is based on I2C communication is transmitted to an upper computer, as shown in fig. 3, fig. 3 is a schematic diagram of data interaction of a signal conditioning circuit provided in some embodiments of the present application.
In some embodiments of the present application, the temperature sensor may further include an operational amplifier chip, an analog-digital converter (ADC), and the like. The operational amplifier chip can be 1 to 128 times of programmable high-precision operational amplifier, and the ADC can be a 24-bit high-resolution ADC.
The thermopile, the NTC thermistor, the signal conditioning circuit, the operational amplifier chip and the analog-to-digital converter may constitute the overall circuit of the temperature sensor.
As shown in fig. 4, fig. 4 is a schematic view of the field angle of the temperature sensor provided in some embodiments of the present application. In some embodiments of the present application, the temperature sensor may have a field angle FOV of 5 degrees.
The problem of the temperature sensor measuring distance has a large relationship with the field angle (FOV) of the sensor. It can be known that the test distance has a large relationship with the diameter of the object to be measured and the diameter of the object to be measured, and satisfies the following formula (1):
wherein D represents the diameter of the object to be tested and S represents the testing distance.
Generally, the test result is accurate only if the detection spot or the angle of view of the sensor covers the detection object completely. If the object is not detected in full coverage, the sensor will bring other objects within the view angle into the calculation, causing measurement errors.
In conclusion, in the embodiment of the application, the temperature sensor can realize rapid and accurate measurement of the temperature of a remote object based on the thermopile. Therefore, accuracy and efficiency of measuring the temperature of the remote object are improved, and the temperature detection effect is optimized. And the risk of cross infection in the conventional close-range contact measurement can be greatly reduced.
In some embodiments of the present application, the present application further provides an electronic device including the temperature sensor 100 as described above, and the specific structure of the temperature sensor 100 refers to the foregoing embodiments. Since the electronic device adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by all the technical solutions of all the embodiments are achieved, and no further description is given here.
It is understood that the electronic device may be a thermometer, a mobile phone, a laptop, a tablet, a wearable device, an electric oven, etc.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified or some technical features may be equivalently replaced, but the modifications or the replacements do not cause the essence of the corresponding technical solutions to depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A temperature sensor, characterized in that the temperature sensor comprises:
a housing comprising a light inlet;
the base is arranged in the shell and is arranged at one end far away from the light inlet;
a thermopile disposed on the base, the thermopile having a collection face disposed opposite the base;
the lens is arranged between the thermopile and the light inlet and used for converging external infrared radiation light onto the collecting surface of the thermopile.
2. The temperature sensor of claim 1, further comprising:
the signal conditioning circuit is arranged on the base and electrically connected with the thermopile, and is used for processing the electric signals acquired from the thermopile and transmitting the processed electric signals to an upper computer.
3. The temperature sensor of claim 2, further comprising:
and the thermistor is arranged on the base and is electrically connected with the signal conditioning circuit.
4. The temperature sensor of claim 2, wherein the signal conditioning circuit comprises an NSA2300 chip.
5. The temperature sensor of any one of claims 2 to 4, further comprising a power module for providing electrical power to the signal conditioning circuit.
6. The temperature sensor of claim 5, wherein the power module comprises an LDO linear regulator chip.
7. The temperature sensor of claim 6, wherein the temperature sensor has a field angle of 5 degrees.
8. The temperature sensor of claim 7, further comprising a pin, the pin being connected to the signal conditioning circuit.
9. The temperature sensor of claim 8, wherein the pins comprise a signal line pin and a clock line pin.
10. An electronic device characterized by comprising a temperature sensor according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023341424.4U CN216246824U (en) | 2020-12-31 | 2020-12-31 | Temperature sensor and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023341424.4U CN216246824U (en) | 2020-12-31 | 2020-12-31 | Temperature sensor and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216246824U true CN216246824U (en) | 2022-04-08 |
Family
ID=80939794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023341424.4U Expired - Fee Related CN216246824U (en) | 2020-12-31 | 2020-12-31 | Temperature sensor and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216246824U (en) |
-
2020
- 2020-12-31 CN CN202023341424.4U patent/CN216246824U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106092363B (en) | A kind of temperature sensor circuit and its temp measuring method based on Pt100 | |
| CN105103205B (en) | Hazard detectors with the contactless thermal radiation sensor for establishing environment temperature | |
| Patel et al. | Introduction to sensors | |
| CN212844010U (en) | Temperature measuring device and temperature measuring system | |
| KR102176201B1 (en) | Human body detecting device | |
| CN216246824U (en) | Temperature sensor and electronic equipment | |
| EP0033328B1 (en) | Device for compensation of transfer functions | |
| Moisello et al. | A MEMS-CMOS microsystem for contact-less temperature measurements | |
| CN102283637A (en) | Infrared ear thermometer and temperature measuring method thereof | |
| CN103616080A (en) | Portable optical fiber radiation thermodetector and measuring method thereof | |
| CN112097945A (en) | Temperature detector and measuring device for detecting temperature of terminal base of electric energy meter | |
| CN113820029A (en) | PT100 temperature acquisition circuit for acquisition terminal | |
| CN103344343A (en) | Non-contact type infrared temperature detecting system based on micromachine thermopile | |
| Fischer-Cripps | Newnes interfacing companion: computers, transducers, instrumentation and signal processing | |
| CN209841347U (en) | Device for measuring astronomical site seeing degree | |
| CN203535468U (en) | Detector for temperature and humidity controller | |
| CN111947786A (en) | Infrared temperature measurement sensor device | |
| CN212320916U (en) | Mobile phone with built-in infrared thermometer function | |
| CN215262101U (en) | Non-contact temperature measuring device | |
| CN217560804U (en) | Miniature body temperature detector and wearable equipment | |
| CN210604473U (en) | Sensor of automatic test system of general intelligent incubator | |
| CN111721422A (en) | A kind of infrared human body temperature correction method | |
| CN222213186U (en) | Laser modules and laser projection equipment | |
| CN212228235U (en) | Infrared sensing device | |
| CN205037980U (en) | A wireless temperature sensor device for vacuum temperature measurement |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220408 |