CN215642580U - A high-efficient heat radiation structure for modularization computer - Google Patents
A high-efficient heat radiation structure for modularization computer Download PDFInfo
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- CN215642580U CN215642580U CN202121565331.1U CN202121565331U CN215642580U CN 215642580 U CN215642580 U CN 215642580U CN 202121565331 U CN202121565331 U CN 202121565331U CN 215642580 U CN215642580 U CN 215642580U
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Abstract
The utility model relates to the technical field of computer structures, in particular to a high-efficiency heat dissipation structure for a modular computer, which comprises a computer shell: a built-in accommodating cavity; the main control module: the data processing device is used for comprehensively processing the data of the computer and is positioned in the accommodating cavity; a heat dissipation assembly: the heat dissipation device is in contact with the main control module, dissipates heat of the main control module and is positioned in the accommodating cavity; the heat dissipation assembly comprises a heat conduction plate, a fan and a plurality of heat dissipation fins, the heat conduction plate is in contact with the main control module, the plurality of heat dissipation fins are vertically arranged on the heat conduction plate and enclose a mounting groove, and the fan is arranged in the mounting groove. In the utility model, the contact area with cold air can be increased as much as possible by vertically arranging the plurality of radiating fins on the heat conducting plate; the fan is arranged in the mounting groove, so that the radiating fins are arranged around the fan, and the radiating effect can be further improved; the whole heat dissipation structure is small in size.
Description
Technical Field
The utility model relates to the field of computer structures, in particular to a high-efficiency heat dissipation structure for a modular computer.
Background
At present, computers develop rapidly, particularly in order to improve the operation speed of a CPU or a graphics card chip of a computer, the frequency of the CPU or the graphics card chip is higher and higher, the heat productivity of the CPU or the graphics card chip is higher and higher, and the space in the computer is smaller, so that after the computer runs for a long time, the heat of the CPU or the graphics card cannot be effectively discharged, which results in a series of problems of performance reduction of the CPU or the graphics card chip, computer crash, restart and the like, and in a serious case, the CPU or the graphics card chip may be damaged, which affects the service life of the computer.
To address the above issues, the prior art discloses a computer heat sink. A computer radiator (application number 201920412540.9) comprises a radiating box body with an open top, and a supporting plate for supporting a computer, wherein the supporting plate is detachably covered on the opening at the top of the radiating box body and is provided with radiating holes; a heat radiation fan is arranged inside the heat radiation box body; a ventilating area is arranged on the supporting plate corresponding to the radiating fan, and the ventilating area is a ventilating hole; the damping device is positioned on the supporting plate, and a hole matched with the ventilation area is formed in the center of the damping device; a spring is connected between the damping device and the supporting plate; the damping device comprises wave-shaped corrugated paper, a sponge body and single wave-shaped corrugated paper which are sequentially arranged from bottom to top; the corrugated paper is composed of a U-shaped corrugated paper core. The utility model discloses a realize the heat dissipation to the computer through setting up the heat dissipation box body and setting up the radiator fan in the heat dissipation box body.
The technical scheme can solve the problem of heat dissipation of the computer. But still has the problems of complex structure, large volume, improved heat dissipation effect and the like.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, a primary object of the present invention is to provide an efficient heat dissipation structure for a modular computer, which has a good heat dissipation effect, a compact structure and a small volume.
Another object of the present invention is to provide an efficient heat dissipation structure for a modular computer, which is simple in structure and convenient for wide popularization.
A high-efficient heat radiation structure for modularized computer, the heat radiation structure comprises
A computer housing: a built-in accommodating cavity;
the main control module: the data processing device is used for comprehensively processing the data of the computer and is positioned in the accommodating cavity;
a heat dissipation assembly: the heat dissipation device is in contact with the main control module, dissipates heat of the main control module and is positioned in the accommodating cavity;
the heat dissipation assembly comprises a heat conduction plate, a fan and a plurality of heat dissipation fins, the heat conduction plate is in contact with the main control module, the plurality of heat dissipation fins are vertically arranged on the heat conduction plate and enclose a mounting groove, and the fan is arranged in the mounting groove. In the utility model, the contact area with cold air can be increased as much as possible by vertically arranging the plurality of radiating fins on the heat conducting plate; the fan is arranged in the mounting groove, so that the radiating fins are arranged around the fan, and the radiating effect can be further improved; and the space position is reasonably utilized, all the structural settings are directly completed on the heat conducting plate, and the heat dissipation is realized without arranging a multilayer structure, so that the volume of the heat dissipation assembly is reduced, and further the volume of the whole heat dissipation structure is reduced.
Furthermore, air inlets are formed in two side faces of the computer shell, an air outlet is formed in the front side face of the computer shell, and the air inlets, the heat dissipation assemblies and the air outlet are combined to form a heat dissipation air channel. The air inlet and the air outlet are arranged at positions, so that cold air can run at a vertical angle in the computer shell, all corners in the computer shell can be fully blown, and the heat dissipation effect is improved.
Furthermore, the main control module comprises a CPU assembly and a mounting assembly, wherein the CPU assembly and the heat dissipation assembly are both mounted on the mounting assembly, and the CPU assembly is clamped between the mounting assembly and the heat dissipation assembly.
Further, the installation component includes panel and mounting panel, the panel sets up on the mounting panel perpendicularly, and the two forms the installation position, CPU subassembly and radiator unit all install on the installation position, and the centre gripping of CPU subassembly is between installation position and heat-conducting plate. Preferably, the setting of panel and mounting panel can form the installation position of an L type, and CPU subassembly and radiator unit install on the installation position after just flushing with the height of panel, such structure sets up reduction product volume that on the one hand can be fine, realization radiating effect that also can be better.
Furthermore, a plurality of fixing columns are arranged on the mounting plate, a plurality of fixing holes connected with the fixing columns are formed in the heat conduction plate, the fixing columns are abutted to the heat conduction plate, and after the fixing columns are connected with the fixing holes, the heat conduction plate is in contact with the CPU assembly. The setting of fixed column can guarantee the stability of heat-conducting plate, and the fan can produce the vibration at the during operation promptly, and the fixed column can prevent to vibrate and conduct on the CPU subassembly and lead to the fact destruction in physics to the CPU subassembly.
Further, the fixed columns are four and symmetrically arranged on two sides of the mounting plate, threads are arranged on the fixed columns and the fixed holes, and the fixed columns are fixedly connected through screws. The fixed column sets up to four and the symmetry sets up in the both sides of mounting panel, can use the fixed column quantity as few as possible, realizes the stabilizing function of heat-conducting plate, prevents the fixed column to the interference of other structure settings, and fixed effectual. All be provided with the screw thread on fixed column and the fixed orifices, and can make things convenient for the dismantlement of heat-conducting plate through screw fixed connection to make things convenient for the maintenance and the replacement of product.
Compared with the prior art, the utility model has the beneficial effects that the contact area with cold air can be increased as much as possible by vertically arranging the plurality of radiating fins on the heat conducting plate; the fan is arranged in the mounting groove, so that the radiating fins are arranged around the fan, and the radiating effect can be further improved; and the space position is reasonably utilized, all the structural settings are directly completed on the heat conducting plate, and the heat dissipation is realized without arranging a multilayer structure, so that the volume of the heat dissipation assembly is reduced, and further the volume of the whole heat dissipation structure is reduced.
Drawings
Fig. 1 is a schematic view of the main control module of the present invention drawn out from a computer case.
Fig. 2 is a schematic structural diagram of the present invention with a part of the housing hidden to show the heat dissipation air duct.
Fig. 3 is a schematic structural diagram of the main control module and the heat dissipation assembly after combination.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Referring to fig. 1 to 3, the present invention provides an efficient heat dissipation structure for a modular computer, the heat dissipation structure including
Computer housing 1: a built-in accommodating cavity;
and (3) the main control module 2: the data processing device is used for comprehensively processing the data of the computer and is positioned in the accommodating cavity;
the heat dissipation assembly 3: the heat dissipation device is in contact with the main control module 2, dissipates heat of the main control module 2 and is positioned in the accommodating cavity;
the heat dissipation assembly 3 comprises a heat conduction plate 31, a fan 32 and a plurality of heat dissipation fins 33, the heat conduction plate 31 is in contact with the main control module 2, the plurality of heat dissipation fins 33 are vertically arranged on the heat conduction plate 31 and surround to form an installation groove 4, and the fan 32 is arranged in the installation groove 4. In the utility model, the plurality of radiating fins 33 are vertically arranged on the heat conducting plate 31, so that the contact area with cold air can be increased as much as possible; the fan is arranged in the mounting groove 4, so that the radiating fins 33 are arranged around the fan 32, and the radiating effect can be further improved; and the space position is reasonably utilized, all the structural settings are directly completed on the heat conducting plate 31, the heat dissipation is realized without arranging a multilayer structure, the volume of the heat dissipation assembly 3 is reduced, and further the volume of the whole heat dissipation structure is reduced.
In this embodiment, the air inlet 5 is disposed on two side surfaces of the computer housing 1, the air outlet 6 is disposed on the front side surface of the computer housing 1, and the air inlet 5, the heat dissipation assembly 3 and the air outlet 6 form a heat dissipation air duct. The air inlet 5 and the air outlet 6 are arranged, so that cold air can run at a vertical angle in the computer shell 1, all corners in the computer shell 1 can be fully blown, and the heat dissipation effect is improved.
In this embodiment, the main control module 2 includes a CPU component 21 and a mounting component 22, the CPU component 21 and the heat sink component 3 are both mounted on the mounting component 22, and the CPU component 21 is clamped between the mounting component 22 and the heat sink component 3.
In the present embodiment, the mounting component 22 includes a panel 221 and a mounting plate 222, the panel 221 is vertically disposed on the mounting plate 222, and both form a mounting position, the CPU component 21 and the heat sink component 3 are both mounted on the mounting position, and the CPU component 21 is clamped between the mounting position and the heat conducting plate 31. Preferably, the panel 22 and the mounting plate 222 are arranged to form an L-shaped mounting position, and the CPU component 21 and the heat dissipation component 3 are mounted on the mounting position and then just flush with the height of the panel 221.
In this embodiment, the mounting plate 222 is provided with a plurality of fixing posts 2221, the heat conducting plate 31 is provided with a plurality of fixing holes 311 connected to the fixing posts 2221, the fixing posts 2221 are abutted against the heat conducting plate 31, and after the fixing posts 2221 are connected to the fixing holes 311, the heat conducting plate 31 is in contact with the CPU component 21. The fixing post 2221 is provided to ensure the stability of the heat conducting plate 31, that is, the fan generates vibration during operation, and the fixing post 2221 prevents the vibration from being transmitted to the CPU component 21 and causing physical damage to the CPU component 21.
In this embodiment, the fixing posts 2221 are four and symmetrically disposed on two sides of the mounting plate 222, and the fixing posts 2221 and the fixing holes 311 are all provided with threads and are fixedly connected by screws. The fixing columns 2221 are arranged to be four and symmetrically arranged on two sides of the mounting plate 222, so that the number of the fixing columns 2221 can be reduced as much as possible, the heat conduction plate 31 is stabilized, the fixing columns 2221 are prevented from interfering with other structures, and the fixing effect is good. The fixing column 2221 and the fixing hole 311 are both provided with threads, and the heat conducting plate 31 can be conveniently detached through fixed connection of screws, so that maintenance and replacement of products are facilitated.
Compared with the prior art, the utility model has the beneficial effects that the contact area with cold air can be increased as much as possible by vertically arranging the plurality of radiating fins 33 on the heat conducting plate 31; the fan is arranged in the mounting groove 4, so that the radiating fins 33 are arranged around the fan 32, and the radiating effect can be further improved; and the space position is reasonably utilized, all the structural settings are directly completed on the heat conducting plate 31, the heat dissipation is realized without arranging a multilayer structure, the volume of the heat dissipation assembly 3 is reduced, and further the volume of the whole heat dissipation structure is reduced.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. An efficient heat dissipation structure for a modular computer, the heat dissipation structure comprising
A computer housing: a built-in accommodating cavity;
the main control module: the data processing device is used for comprehensively processing the data of the computer and is positioned in the accommodating cavity;
a heat dissipation assembly: the heat dissipation device is in contact with the main control module, dissipates heat of the main control module and is positioned in the accommodating cavity;
the heat dissipation assembly comprises a heat conduction plate, a fan and a plurality of heat dissipation fins, the heat conduction plate is in contact with the main control module, the plurality of heat dissipation fins are vertically arranged on the heat conduction plate and enclose a mounting groove, and the fan is arranged in the mounting groove.
2. The efficient heat dissipation structure for modular computers as claimed in claim 1, wherein the air inlet is disposed on two sides of the computer housing, the air outlet is disposed on the front side of the computer housing, and the air inlet, the heat dissipation assembly and the air outlet are combined to form a heat dissipation air channel.
3. The efficient heat dissipation structure for the modular computer as claimed in claim 1, wherein the main control module comprises a CPU component and a mounting component, the CPU component and the heat dissipation component are both mounted on the mounting component, and the CPU component is clamped between the mounting component and the heat dissipation component.
4. The efficient heat dissipation structure for modular computers of claim 3, wherein the mounting assembly comprises a panel and a mounting plate, the panel is vertically disposed on the mounting plate, and the panel and the mounting plate form a mounting position, the CPU assembly and the heat dissipation assembly are both mounted on the mounting position, and the CPU assembly is clamped between the mounting position and the heat conduction plate.
5. The efficient heat dissipation structure of claim 4, wherein the mounting plate has a plurality of fixing posts thereon, the heat conductive plate has a plurality of fixing holes thereon, the fixing posts are supported on the heat conductive plate, and the heat conductive plate contacts the CPU assembly after the fixing posts and the fixing holes are connected.
6. The efficient heat dissipation structure for the modular computer as claimed in claim 5, wherein the number of the fixing posts is four, the fixing posts are symmetrically disposed on two sides of the mounting plate, and the fixing posts and the fixing holes are both provided with threads and are fixedly connected through screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121565331.1U CN215642580U (en) | 2021-07-09 | 2021-07-09 | A high-efficient heat radiation structure for modularization computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121565331.1U CN215642580U (en) | 2021-07-09 | 2021-07-09 | A high-efficient heat radiation structure for modularization computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215642580U true CN215642580U (en) | 2022-01-25 |
Family
ID=79889289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121565331.1U Active CN215642580U (en) | 2021-07-09 | 2021-07-09 | A high-efficient heat radiation structure for modularization computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215642580U (en) |
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2021
- 2021-07-09 CN CN202121565331.1U patent/CN215642580U/en active Active
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