CN215069888U

CN215069888U - Transfer apparatus and display device

Info

Publication number: CN215069888U
Application number: CN202120361878.3U
Authority: CN
Inventors: 李维善
Original assignee: Nanchang Guangheng Electronic Center LP
Current assignee: Shenzhen Haiwei Electronic Materials Co ltd
Priority date: 2021-02-09
Filing date: 2021-02-09
Publication date: 2021-12-07
Anticipated expiration: 2031-02-09

Abstract

The embodiment of the utility model discloses transfer equipment and display device. The transfer apparatus includes: the transfer substrate is provided with light excitation components which are arranged in an array mode, and one side, far away from the transfer substrate, of each light excitation component is used for placing a component to be transferred; a light source device for generating light for exciting the light excitation member; and the light source control device is positioned on a light path of the light generated by the light source device and is used for irradiating the light generated by the light source device onto the corresponding light excitation component so as to transfer at least part of the component to be transferred on the transfer substrate to a target substrate. Compared with the prior art, the embodiment of the utility model provides an accuracy and the yield that have improved big batch and have shifted.

Description

Transfer apparatus and display device

Technical Field

The embodiment of the utility model provides a relate to and show technical field, especially relate to a transfer apparatus and display device.

Background

With the development of display technologies, a display device is gradually replaced by a Liquid Crystal Display (LCD) display mode by a Cathode Ray Tube (CRT) display mode, and recently, an Organic Light Emitting Diode (OLED) display mode, a Micro LED (Micro LED or MINI LED) display mode, and the like have been rapidly developed as a new generation display technology. Among them, Micro LEDs are called future display technologies due to their advantages of high response speed, high color gamut, high brightness, and long lifetime. The LCD can improve contrast and color gamut in cooperation with the MINI LED backlight technology, the quantum dot technology, or the high color rendering technology. This allows the LCD to reduce contrast and color gamut disadvantages compared to OLEDs while maintaining lifetime and brightness advantages.

However, Micro LEDs and MINI LEDs require the use of mass transfer technology during fabrication. At present, mechanical parts beating, stamp type, electrostatic or fluid assembly and the like are adopted in a mass transfer technology, but the existing transfer technology has the problems of low precision and low yield, and is difficult to support mass production and popularization of Micro LED and MINI LED technologies, so that the transfer technology becomes one of the bottlenecks of the Micro LED and MINI LED technologies.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a transfer apparatus and display device to improve precision and the yield that shifts in batches.

In a first aspect, an embodiment of the present invention provides a transfer device, including:

the transfer substrate is provided with light excitation components which are arranged in an array mode, and one side, far away from the transfer substrate, of each light excitation component is used for placing a component to be transferred;

a light source device for generating light for exciting the light excitation member;

and the light source control device is positioned on a light path of the light generated by the light source device and is used for irradiating the light generated by the light source device onto the corresponding light excitation component so as to transfer at least part of the component to be transferred on the transfer substrate to a target substrate.

Optionally, the light source device comprises a backlight panel for generating a surface light source; the light source control device includes a liquid crystal on silicon panel including:

the array circuit layer comprises switching devices arranged in an array manner and driving electrodes connected with the switching devices;

the liquid crystal layer is arranged on one side of the array circuit layer; the liquid crystal layer comprises liquid crystal molecules, and the liquid crystal molecules are controlled by the corresponding driving electrodes to change angles so as to control the light generated by the backlight panel to be transmitted to the corresponding light excitation component;

preferably, the array circuit layer further includes:

the gate gating module is connected with the switching device; the gate gating module is used for conducting the switching devices line by line or conducting at least part of the switching devices of the lines simultaneously;

the source gating module is connected with the switching device; the source gating module is used for simultaneously sending driving signals to the driving electrodes of at least partial columns through the switching devices so as to drive the liquid crystal molecules to deflect;

wherein the rows extend in a first direction and the columns extend in a second direction; alternatively, the rows extend in the second direction and the columns extend in the first direction; the first direction and the second direction intersect.

Optionally, the light source device includes a first light source and a beam expanding module, where the first light source emits a light source beam, and the beam expanding module is configured to diffuse the light source beam to generate a surface light source; the light source control device includes a digital micromirror, the digital micromirror comprising:

the driving array comprises switching devices arranged in an array;

the reflectors are arranged in an array and correspond to the switching devices; the reflector is adjustable in angle under the control of the driving array and is used for transmitting the light generated by the light source device to the corresponding light excitation component.

Optionally, the light source device comprises a second light source emitting a light source beam; the light source control device comprises deflectors for scanning the light source beams to the corresponding light excitation components;

preferably, the deflector includes a lens module located on an optical path of light emitted from the light source beam, the lens module being configured to adjust an angle of the light.

Optionally, the transfer device further comprises:

an optical measuring device for measuring information contained in the transfer substrate or the target substrate;

the data processing device is connected with the optical measuring device; the data processing device is used for determining the number and the positions of the components needing to be transferred on the transfer substrate according to the information;

the data processing device is also connected with the light source control device to control the light source control device, so that the light emitted by the light source device is transmitted to the corresponding light excitation component.

Optionally, the light source device comprises at least one of a laser generator, a visible light generator or a non-visible generator.

Optionally, at least one of the optical excitation components corresponds to one of the components to be transferred.

Optionally, the optical excitation component changes from a solid state or a liquid state to a gas state under the action of light;

the transfer substrate further includes: at least one via hole located at a middle portion, an edge, or a region between the middle portion and the edge of the transfer substrate, the via hole forming a negative pressure gas passage for discharging generated gas;

or, the light excitation component is mixed with a neutralization component, the neutralization component is used for neutralizing harmful substances in the gas, or the neutralization component generates a neutralization gas under the light excitation to neutralize the harmful substances.

Optionally, the transfer device further comprises: and the execution film is arranged on one side of the light excitation component far away from the transfer substrate.

In a second aspect, the embodiment of the present invention further provides a display device, including: drive backplate with set up in display chip on the drive backplate, wherein, display chip adopts if the utility model discloses arbitrary embodiment transfer device shifts to on the drive backplate.

The embodiment of the utility model provides a excite the part through setting up light on the transfer base plate to set up light source device and light source controlling means in transfer equipment, arouse the part to receive to arouse and produce thrust with arousing corresponding light, thereby make the part that treats the transfer that corresponds separate from the transfer base plate. By the arrangement, only the parts to be transferred which meet the transfer precision can be transferred in the process of one transfer, and other parts to be transferred which do not meet the transfer precision can be transferred by carrying out the alignment again. Compared with the prior art of transferring in batches, the embodiment of the utility model provides a realized treating the accurate control of the part of treating the transfer and shifted with shifting to improved and shifted the precision and shifted the yield.

Drawings

Fig. 1 is a schematic structural diagram of a transfer apparatus according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of another transfer apparatus provided in an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an array circuit layer according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of another transfer apparatus provided in an embodiment of the present invention;

fig. 5 is a schematic structural diagram of another transfer apparatus provided in an embodiment of the present invention;

fig. 6 is a schematic structural diagram of another transferring apparatus provided in an embodiment of the present invention;

fig. 7 is a schematic structural diagram of a transfer substrate according to an embodiment of the present invention;

FIG. 8 is a schematic cross-sectional view taken along line A-A of FIG. 7;

fig. 9 is a schematic structural diagram of another transfer substrate according to an embodiment of the present invention;

fig. 10 is a schematic flow chart of a transfer method according to an embodiment of the present invention;

fig. 11 is a schematic diagram of a transfer method in steps according to an embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

The embodiment of the utility model provides a transfer equipment. Fig. 1 is a schematic structural diagram of a transfer apparatus provided by an embodiment of the present invention. Referring to fig. 1, the transferring apparatus includes: a transfer substrate 100, a light source device 800, and a light source control device 600. The transfer substrate 100 is provided with optical excitation components 130 arranged in an array, and a side of the optical excitation components 130 away from the transfer substrate 100 is used for placing components to be transferred (e.g., the chips 110). The light source device 800 is used to generate light that excites the light excitation member 130. The light source control device 600 is located on the light path of the light generated by the light source device 800, and the light source control device 600 is used for irradiating the light generated by the light source device 800 onto the corresponding light excitation component 130, so that at least part of the components to be transferred on the transfer substrate 100 are transferred to the target substrate 300.

The parts to be transferred are parts that need to be transferred in large batches, for example parts with dimensions in the range of 1um-5 mm. Illustratively, the component to be transferred includes a chip, other circuit or semiconductor device, an auxiliary component for transfer, and the like. The following description will be given taking the component to be transferred as a chip, but the invention is not limited thereto. The chip 110 may be, for example, a light emitting device chip, and specifically, the chip 110 may be a Micro LED chip or a MINI LED chip, and a large number of light emitting device chips 110 are transferred, and finally, a display apparatus may be formed. The transfer substrate 100 may also be referred to as a transition carrier plate or a temporary carrier plate for pre-arranging the chips 110 according to the sizes of the chips to be transferred. In general, the position and orientation of the chips 110 placed on the transfer substrate 100 may be imprecise, or even disorganized. The light excitation part 130 is a part that is excited by specific light to generate a physical and/or chemical change. Illustratively, the optical excitation component 130 changes from a solid state or a liquid state to a gas state under the action of light, so as to generate gas expansion, and the chip 110 is transferred (knocked) from the transfer substrate 100 to the target substrate 300, and the host material of the optical excitation component 130 may include materials such as ether or an oxidant; the specific illumination includes at least one of laser, visible light or non-visible light (e.g., UV light), and correspondingly, the light source device 800 includes at least one of a laser generator, a visible light generator or a non-visible generator. The target substrate 300 may also be referred to as a target carrier plate, i.e., the transfer target location of the chip 110 is a location on the target carrier plate. Adopt the embodiment of the utility model provides a transfer equipment can make the position accuracy that shifts chip 110 on the target loading board be higher than the chip position accuracy on the transfer base plate 100. Optionally, high-precision alignment marks (Mark) are disposed on both the transfer substrate 100 and the target substrate 300 to achieve accurate alignment, so as to be beneficial for improving the transfer precision of the chip 110, for example, the precision range of the alignment marks may be 1 μm to 5 mm.

The embodiment of the present invention provides a light excitation part 130 is arranged on a transfer substrate 100, and a light source device 800 and a light source control device 600 are arranged in a transfer device, so as to excite the corresponding light excitation part 130 to generate thrust, thereby separating the corresponding chip 110 from the transfer substrate 100. In this way, only the chips 110 that satisfy the transfer accuracy can be transferred in one transfer process, and the other chips 110 that do not satisfy the transfer accuracy can be transferred by performing the alignment again. Compared with the prior art of transferring in batches, the embodiment of the utility model provides a chip 110's the accurate control and the transfer of treating the transfer has been realized to improved and transferred the precision and transferred the yield.

In each of the above embodiments, the transfer substrate 100 itself is optionally a transparent substrate, so that light can smoothly pass through the transfer substrate 100 and irradiate the light excitation member 130. The transfer substrate 100 itself may also be a colored transparent substrate or a colorless transparent substrate, wherein if the transfer substrate 100 is a colored transparent substrate, the color of the transfer substrate 100 needs to match the color of the light emitted by the light source device 800.

In the embodiment of the present invention, the light source device 800 and the corresponding light source control device 600 are disposed in various ways, as long as the light excitation component 130 on the transfer substrate 100 can be selectively excited to generate thrust, so that the chip 110 is separated from the transfer substrate 100. Several of these are described below, but the present invention is not limited to these.

Fig. 2 is a schematic structural diagram of another transfer apparatus provided in an embodiment of the present invention. Referring to fig. 2, in an embodiment of the present invention, optionally, the light source device 800 includes a backlight panel 810, and the backlight panel 810 is used for generating a surface light source. The light source control device 600 includes a liquid crystal on silicon panel 610, and the liquid crystal on silicon panel 610 includes an array circuit layer 611 and a liquid crystal layer 612. The array circuit layer 611 includes switching devices arranged in an array, and driving electrodes connected to the switching devices. The liquid crystal layer 612 is disposed on one side of the array circuit layer 611; the liquid crystal layer 612 includes liquid crystal molecules, and the liquid crystal molecules are controlled by the corresponding driving electrodes to be angularly changed so as to control light generated by the backlight panel 810 to be transmitted to the corresponding light excitation part 130.

The LCOS panel 610 includes a plurality of control elements (similar to pixels in the display panel), where a control element refers to a switching device, liquid crystal molecules corresponding to the switching device, and a driving electrode connected to the switching device. The switching device comprises a semiconductor device such as a triode or a field effect transistor, optionally comprising a gate, a source and a drain. The switching device may be a separately arranged triode or a field effect transistor, or may be a combination of semiconductor devices, such as a Complementary Metal Oxide Semiconductor (CMOS), and the like, and may be arranged as required in actual needs. The switching device may be formed as a Thin Film Transistor (TFT) to reduce the thickness of the array circuit layer 611 and the size of the transfer device. Illustratively, the thin film transistor or the field effect transistor array may be directly fabricated on the substrate of the driving array substrate 200 using a semiconductor process.

Illustratively, when the switching device is turned on, the corresponding driving electrode is energized to control the corresponding liquid crystal molecules to deflect, and light passes through or is cut off. One control element for each of the at least one optically activated feature 130 or at least one control element for each of the at least one optically activated feature 130. The backlight panel 810 generates a surface light source to irradiate the entire LCOS panel 610, and only when the control unit is turned on, the light of the corresponding region is controlled to be emitted through the LCOS panel 610 and irradiated onto the corresponding light excitation component 130. The backlight panel 810 may include, for example, at least one of an organic light emitting diode, a micro light emitting diode, or a diode. Optionally, the backlight panel 810 may further include a film layer such as a light guide layer, so that the backlight panel 810 emits light uniformly. The embodiment of the utility model provides a include backlight panel 810 through setting up light source device 800, light source controlling means 600 includes silicon-based liquid crystal display panel 610, simple structure easily realizes.

In the above embodiment, the liquid crystal on silicon panel 610 may further include a cover plate 613, a polarizer, and other structures to improve the stability of the liquid crystal on silicon panel 610 and optimize the performance of the liquid crystal on silicon panel 610.

Fig. 3 is a schematic structural diagram of an array circuit layer according to an embodiment of the present invention. Referring to fig. 3, in an embodiment of the present invention, the array circuit layer 611 optionally further includes a gate gating module 614 and a source gating module 615. The gate gating module 614 is connected to the switching device; the gate gating module 614 is used to turn on the switching devices on a row-by-row basis or to turn on at least some of the switching devices of a row simultaneously. The source gating module 615 is connected with the switching device; the source gating module 615 is configured to simultaneously send driving signals to at least some of the driving electrodes of the columns via the switching devices to drive the liquid crystal molecules to deflect.

The driving method of the gate gating module 614 is to turn on the switching devices row by row, or to turn on at least some of the switching devices in rows simultaneously, and may be selected according to actual needs. The driving mode of the source gating module 615 is to transmit a driving signal to the driving electrodes of a part of columns or transmit a driving signal to the driving electrodes of all columns through the switching device at the same time, and can be selected according to actual needs.

For example, the driving array substrate 200 may be scanned in a row/column scanning manner, at this time, the gate gating module 614 controls the switching devices to be turned on and off row by row, and at the same time, the driving signal corresponding to the column is output by the source gating module 615 and connected to the source writing of the corresponding switching device, so as to drive the liquid crystal molecules to deflect, and the excitation light excitation component 130 performs the component printing action, so that the corresponding chip 110 performs the transferring action. For example, the chips 110 in the first row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column, and the sixth row are in line with the transfer accuracy, and the source gating module 615 writes a driving signal to the switching devices of the first column when the gate gating module 614 scans the switching devices of the first row; while the gate gating module 614 scans the second row of switching devices, the source gating module 615 writes drive signals to the switching devices of the second column; … … and so on until the gate gating module 614 scans to the sixth row of switching devices, the source gating module 615 writes the drive signal to the switching devices of the sixth column.

For example, the driving array substrate 200 may also be scanned in a surface scanning manner, at this time, the gate gating module 614 controls the on and off of multiple rows of switching devices simultaneously, and at this time, the driving signal of the corresponding column is output by the source gating module 615, and is connected to the source writing of the corresponding switching device, so as to drive the liquid crystal molecules to deflect, and the excitation light technology section performs the component printing operation, so that the corresponding chip 110 performs the transferring operation. For example, the chips 110 positioned in the first three columns of the first row, the first three columns of the second row, the first three columns of the third row, and the first three columns of the fourth row meet the transfer accuracy, the gate gating module 614 simultaneously scans the switching devices of the first four rows, and the source gating module 615 simultaneously writes the driving signals to the switching devices of the first three columns.

The embodiment of the utility model provides an adopt active drive array, can realize the scanning mode of row/line scanning or face scanning for scanning and beating can be carried out fast, has improved transfer efficiency, stability, and has simplified the operation degree of difficulty.

It should be noted that, as exemplarily shown in fig. 3, the rows extend along a first direction X, the columns extend along a second direction Y, and the first direction X and the second direction Y intersect. This is not a limitation of the present invention, and in other embodiments, the row and column directions may be reversed, for example, the rows extend in the second direction Y and the columns extend in the first direction X.

Fig. 4 is a schematic structural diagram of another transfer apparatus according to an embodiment of the present invention. Referring to fig. 4, in an embodiment of the present invention, optionally, the light source apparatus 800 includes a first light source 821 and an beam expanding module 822, the first light source 821 emits a light source beam, and the beam expanding module 822 is configured to diffuse the light source beam to generate a surface light source; the light source control device 600 includes a Digital Micromirror (DMD)620, and the DMD 620 includes a mirror 621 arranged in an array and adjustable in angle for transmitting the light generated by the light source device 800 to the corresponding light excitation component 130.

The first light source 821 can generate a laser beam, the laser beam is good in stability and not prone to being affected by the environment, and therefore the transferring precision of the transferring back plate is improved. Optionally, the light source device 800 includes a collimating module for emitting the surface light source in parallel. The mirrors 621 arranged in an array in the digital micromirror 620 can be, for example, Micro Electro Mechanical System (MEMS) mirrors or the mirrors 621 can be controlled by MEMS electrical control, thereby achieving angle adjustability. By adjusting the angle of the reflector 621, on one hand, whether the light irradiated onto the reflector 621 is reflected onto the transfer substrate 100 can be adjusted; on the other hand, it is possible to adjust which of the photoexcitation members 130 of the transfer substrate 100 the light irradiated onto the reflecting mirror 621 irradiates. Therefore, the embodiment of the present invention can set up the reflector 621 and the light excitation part 130 one-to-one, also can set up at least two reflectors 621 and one light excitation part 130, and also can set up at least two light excitation parts 130 corresponding to one reflector 621, and can set up as required in practical application.

For example, if the reflective mirrors 621 correspond to the optical excitation components 130 one by one, the driving array substrate 200 may be scanned in a surface scanning manner. For example, the chips 110 located in the first row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column and the sixth row are in accordance with the transfer accuracy, and the angles of the mirrors 621 located in the first row, the second row, the third row, the fourth column, the fifth row, the fifth column and the sixth row are adjusted correspondingly, so that the light beams are irradiated onto the corresponding light excitation members 130, and the light excitation members 130 perform the bonding operation, so that the corresponding chips 110 perform the transfer operation. The angle of the mirror 621 at another position is adjusted so that the light cannot be reflected out, or the light is reflected to another area outside the transfer substrate 100.

For example, if one mirror 621 corresponds to at least two optical excitation components 130, the driving array substrate 200 may be scanned in a time-sharing scanning manner. For example, the dmd 620 only includes one reflector 621, the chips 110 in the first row, the first column, the second row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column and the sixth row meet the transfer accuracy, and the angle of the reflector 621 is adjusted to irradiate the light to the photoexcitation part 130 in the first row and the first column in the first period; in a second time period, the angle of the reflector 621 is adjusted to make the light irradiate the light excitation component 130 in the second row and the second column; … … and so on until the sixth row and column are scanned. The scanning interval periods such as the first period and the second period are required to satisfy the excitation response time of the optical excitation component 130, so as to ensure reliable excitation of the optical excitation component 130 and reliable transfer of the chip 110.

Illustratively, as the number of mirrors 621 provided on the digital micromirror 620 increases, the plurality of mirrors 621 may operate simultaneously, and thus the time to scan the copy may be reduced.

The embodiment of the utility model provides a set up light source device 800 and include first light source 821 and beam expanding module 822, light source controlling means 600 includes digital micro mirror (DMD)620, is favorable to realizing the face scanning of inciting somebody to action part 130 to be favorable to promoting transfer efficiency.

It should be noted that, in the above embodiments, the light source device 800 is exemplarily shown to generate a surface light source through the beam expanding module 822, which is not a limitation of the present invention, in other embodiments, a backlight panel may be further provided to generate a surface light source, and the light source may be set as needed in practical applications.

Fig. 5 is a schematic structural diagram of another transfer apparatus according to an embodiment of the present invention. Referring to fig. 5, in an embodiment of the present invention, optionally, the light source device 800 includes a second light source 830, the second light source 830 emitting a light source beam; the light source control device 600 comprises a deflector 630, the deflector 630 being adapted to scan the light source beam to the corresponding light excitation component 130. The second light source 830 can generate a laser beam, the laser beam is good in stability and not easily affected by the environment, and therefore the transfer precision of the transfer back plate is improved. Preferably, the deflector 630 includes a lens module 631, the lens module 631 being located on a light path of the light emitted from the light source beam, the lens module 631 being configured to adjust an angle of the light. Illustratively, the deflector 630 includes two lens modules 631, and one lens module 631 can rotate horizontally to adjust a horizontal propagation direction of light; the other lens module 631 can be vertically rotated to adjust the vertical propagation direction of light.

For example, the driving array substrate 200 may be scanned in a time-sharing scanning manner. For example, the chips 110 in the first row, the second column, the third row, the third column, the fourth row, the fourth column, the fifth row, the fifth column and the sixth row are in accordance with the transfer accuracy, and the angle of the deflector 630 is adjusted to irradiate the light to the light excitation member 130 in the first row and the first column in the first period; adjusting the angle of the deflector 630 to irradiate the light to the light excitation member 130 in the second row and the second column during the second period; … … and so on until the sixth row and column are scanned. The scanning interval periods such as the first period and the second period are required to satisfy the excitation response time of the optical excitation component 130, so as to ensure reliable excitation of the optical excitation component 130 and reliable transfer of the chip 110.

It should be noted that, in the above embodiment, the deflector 630 is set as the lens module 631 for example, but the present invention is not limited thereto, and in other embodiments, the deflector 630 may be set as an angularly adjustable mirror (for example, a MEMS mirror), and may be set as required in practical applications.

It should be noted that, in the above embodiments, the first light source and/or the second light source 830 may be a monochromatic light generator, or may be composed of a plurality of monochromatic light generators and a light combiner, and may be set according to needs in practical applications.

Fig. 6 is a schematic structural diagram of another transfer apparatus according to an embodiment of the present invention. Referring to fig. 6, on the basis of the above embodiments, optionally, the transferring apparatus further includes: an optical measurement device 400 and a data processing device 500. The optical measurement device 400 is used to measure information contained in the transfer substrate 100 or the target substrate 300. The data processing device 500 is connected with the optical measuring device and is used for determining the number and the positions of the chips 110 to be transferred on the transfer substrate 100 according to the information measured by the optical measuring device 400; and the data processing device 500 is further connected to the light source control device 600 to control the light source control device 600, so that the light emitted from the light source device 800 is transmitted to the corresponding light excitation component 130.

The optical measurement device 400 may be, for example, an automatic optical inspection device (AOI) or an X-Ray (X Ray) measurement device. The measured information of the transfer substrate 100 may be, for example, a position of the chip 110 on the transfer substrate 100, a shape of the chip 110 on the transfer substrate 100, a crack of the chip 110 on the transfer substrate 100, an orientation of the chip 110 on the transfer substrate 100, a position of an alignment mark on the transfer substrate 100, a shape of an alignment mark on the transfer substrate 100, an orientation of an alignment mark on the transfer substrate 100, a position of the chip 110 on the transfer substrate 100, a shape of the chip 110 on the transfer substrate 100, a crack of the chip 110 on the transfer substrate 100, or an orientation of the chip 110 on the transfer substrate 100. The measured position information of the target substrate 300 may be, for example, a position of an alignment mark on the target substrate 300, a shape of an alignment mark on the target substrate 300, a direction of an alignment mark on the target substrate 300, a position of a pad on the target substrate 300, a shape of a pad on the target substrate 300, or a direction of a pad on the target substrate 300. Therefore, the alignment mark detected by the optical measurement apparatus 400 can be a alignment point or an alignment point array. The information detected by the optical measurement apparatus 400 can be used to perform alignment and also can be used to determine whether the chip 110 meets the alignment requirement.

The data processing device 500 may be, for example, a chip 110 having a data processing function, such as a microprocessor, a single chip microcomputer, or a Digital Signal Processor (DSP). Specifically, the data processing device 500 can process and calculate positional information such as the position of the chip 110 on the transfer substrate 100, the position of the alignment mark on the transfer substrate 100, the shape of the alignment mark on the transfer substrate 100, or the direction of the alignment mark on the transfer substrate 100, and can obtain the position of the transfer substrate 100 and the position of each chip 110 on the transfer substrate 100. And, the data processing apparatus 500 can process and calculate the position of the alignment mark on the target substrate 300, the shape of the alignment mark on the target substrate 300, the direction of the alignment mark on the target substrate 300, the position of the pad on the target substrate 300, the shape of the pad on the target substrate 300, or the direction of the pad on the target substrate 300, and the like, and can obtain the position of the target substrate 300 and the position where each chip 110 on the target substrate 300 needs to be accurately placed. The data processing device 500 can process and calculate the shape of the chips 110 on the transfer substrate 100, cracks in the chips 110 on the transfer substrate 100, and the like, thereby obtaining the number and positions of defective chips 110. The data processing apparatus 500 combines the above information to determine whether the transfer substrate 100 and the target substrate 300 are aligned, and whether each chip 110 satisfies the transfer accuracy, thereby determining the number and position of the chips 110 to be transferred on the transfer substrate 100, and further controlling the light source control apparatus 600 such that the light emitted from the light source apparatus 800 is transmitted to the corresponding light excitation member 130.

The embodiment of the utility model provides a set up transfer equipment and still include optical measurement device and data processing apparatus, measure transfer base plate 100 and target substrate 300, further promoted the transfer precision.

In the above embodiments, the position of the target substrate 300 and the position of the transfer substrate 100 are detected by the optical detection device 400, which is not a limitation of the present invention. In other embodiments, the optical detection device 400 may not be provided, the number and the positions of the chips 110 to be transferred may be pre-stored, or the chips 110 on the transfer substrate 100 may be regularly and precisely aligned, and whether the optical detection device is provided may be selected according to the needs in practical applications.

It should be noted that, in the above embodiments, it is exemplarily shown that the arrangement density of the light excitation member 130 is the same as that of the chip 110, that is, the light excitation member 130 corresponds to the chip 110 one to one, which is not a limitation of the present invention. In other embodiments, the arrangement density of the optical excitation components 130 may be different from that of the chips 110. For example, the arrangement density of the optical excitation member 130 is n times of the arrangement density of the chips 110, and n is a positive integer such as 2, 3, 4, 5, 10, etc.

Fig. 7 is a schematic structural diagram of a transfer substrate according to an embodiment of the present invention, and fig. 8 is a schematic structural diagram of a cross section along a-a in fig. 7. Referring to fig. 7 and 8, in the embodiments, the optical excitation member 130 may be changed from a solid state or a liquid state to a gas state by light. The transfer substrate 100 further includes: at least one through hole 101, the through hole 101 is located in the middle, at the edge, or in the area between the middle and the edge of the transfer substrate 100, the through hole 101 forms a negative pressure gas passage, and the negative pressure gas passage is used for exhausting generated gas to prevent the chip 110 from being damaged due to the excessive energy of the gas (explosion gas) excited by the optical excitation component 130.

In one embodiment of the present invention, optionally, a neutralizing member is mixed in the light exciting member 130, and the neutralizing member is used for neutralizing harmful substances in the gas, or the neutralizing member generates a neutralizing gas under light excitation to neutralize the harmful substances. The harmful substance may be, for example, a toxic substance, an acidic substance, or a basic substance. The neutralizing member may be, for example, activated carbon. Neutralizing gas generated by the neutralizing component corresponds to harmful substances, and if the harmful substances are acidic, the corresponding neutralizing gas is alkaline; if the harmful substance is alkaline, the corresponding neutralized gas is acidic.

Fig. 9 is a schematic structural diagram of another transfer substrate 100 according to an embodiment of the present invention. Referring to fig. 9, in an embodiment of the present invention, optionally, the transferring apparatus further includes an actuating film 140, and the actuating film 140 is disposed on a side of the light excitation part 130 away from the transferring substrate 100. The material of the actuating membrane 140 may be, for example, a flexible material having a high tensile break ratio. Thus, after the light excitation part 130 is excited to generate gas, the deformation of the actuating film 140 is greater than that of the transfer substrate 100, and the chip 110 is separated from the actuating film 140. The arrangement of the execution film 140 can ensure that the expansion of the gas generated by the excitation of the optical excitation component 130 does not directly act on the chip 110, but acts on the chip 110 to be transferred through the execution film 140, thereby playing the roles of buffering and uniform stress and improving the transfer precision. Furthermore, the film 140 is disposed to reduce the contact between the gas generated by the optical excitation component 130 and the chip 110 to be transferred, thereby preventing the damage such as corrosion of the chip 110 to be transferred caused by the gas generated by the excitation of the excitation portion 120.

On the basis of the above embodiments, optionally, the transfer apparatus further includes an auxiliary trigger component, for example, a magnetic trigger component or the like, which can provide an additional force to the chip 110 to be transferred on the transfer substrate 100, so as to provide an auxiliary effect to the transfer of the chip 110.

In the above embodiments, optionally, the target substrate 300 is another transfer substrate 100, a backlight driving backplane or a display driving backplane. If the target substrate 300 is another transfer substrate 100, the chip transfer operation can be repeated for a plurality of times, and the accuracy of the chip 110 is higher every time the transfer is performed. Thus, each transfer operation can have more chips 110 to meet the transfer precision, thereby being beneficial to improving the transfer efficiency. The target substrate 300 may be, for example, a glass substrate or a quartz substrate, which is beneficial to improve the dimensional stability, thermal stability and chemical stability of the target substrate 300, thereby improving the transfer accuracy.

If the target substrate 300 is a backlight driving backplane, in this case, the chip 110 is a backlight chip, and after the chip 110 is completely transferred to the backlight driving backplane, the chip 110 and the bonding pads on the backlight driving backplane need to be soldered by using a hot pressing method, a UV curing method, a reflow soldering method, and the like, so as to form a backlight source in the display device. If the target substrate 300 is a display driving backplane, in this case, the chip 110 is a display chip, and after the chip 110 is completely transferred to the display driving backplane, the chip 110 and the bonding pads on the display driving backplane need to be bonded by using a hot pressing method, a UV curing method, a reflow soldering method, and the like, so as to form pixels in the display device. The driving back plates such as the backlight driving back plate or the display driving back plate are provided with driving circuits, and when the transfer substrate 100 and the driving back plate are subjected to alignment transfer, the transfer substrate 100 and the driving back plate can also play a role in supporting and protecting chips and protecting circuits on the driving back plate. The driving backplane can be made of flexible materials such as Polyimide (PI), Polycarbonate (PC) or polyethylene terephthalate (PET) as a substrate to realize flexible display. The circuit film layer in the driving backplane can adopt an Organic Thin Film Transistor (OTFT), an organic field effect transistor (OMOS) or the like. The driving back plate can be a glass substrate or a quartz substrate with a driving circuit engraved thereon, or a flexible printed circuit board (FPC), a Printed Circuit Board (PCB), or the like.

In an embodiment of the present invention, optionally, the transferring apparatus further includes a moving device for driving the transferring substrate 100 to move, so that the transferring substrate 100 is aligned with the target substrate 300. Illustratively, the driving array substrate 200 and the target substrate 300 are kept still and aligned accurately, and only the position of the transfer substrate 100 needs to be adjusted by the motion device. The embodiment of the utility model provides a set up and only shift base plate 100 and carry out the displacement counterpoint, be favorable to reducing the cost of manufacture of transfer equipment.

In an embodiment of the present invention, optionally, the transferring apparatus includes a moving device for controlling the driving of the array substrate 200, the transferring substrate 100 and the target substrate 300 to perform displacement. The moving device may be a device such as a robot arm that can control the substrate to move. Illustratively, the motion device can drive the array substrate 200 and the target substrate 300 to remain relatively stationary, and the transfer substrate 100 and the target substrate 300 are aligned during the displacement process. For example, dynamic piece beating is performed by calculating the motion advance, thereby being beneficial to further improving the transfer precision.

To sum up, the embodiment of the present invention provides a light excitation component 130 on a transfer substrate 100, and a light source device 800 and a light source control device 600 are disposed in a transfer apparatus, so as to excite the corresponding light excitation component 130 to generate a thrust, thereby separating the corresponding chip 110 from the transfer substrate 100. In this way, only the chips 110 that satisfy the transfer accuracy can be transferred in one transfer process, and the other chips 110 that do not satisfy the transfer accuracy can be transferred by performing the alignment again. Compared with the prior art of transferring in batches, the embodiment of the utility model provides a chip 110's the accurate control and the transfer of treating the transfer has been realized to improved and transferred the precision and transferred the yield. Further, the light source device 800 may be a backlight panel, and the light source control device 600 may be a liquid crystal on silicon panel to implement row/column scanning or surface scanning, thereby improving the efficiency of mass transfer. Further, the light source device 800 may include a first light source generating a light source beam and a beam expanding module, and the light source control device 600 may be a digital micromirror to implement row/column scanning or surface scanning, thereby improving the efficiency of mass transfer. Further, the light source device 800 may include a second light source generating a light source beam, and the light source control device 600 may be a deflector to implement row/column scanning. Further, by providing the optical measurement device 400, the alignment accuracy can be improved, thereby further improving the transfer accuracy.

The following describes a transfer method using the transfer apparatus provided by the embodiments of the present invention. Fig. 10 is a schematic flow chart of a transfer method according to an embodiment of the present invention, and fig. 11 is a schematic diagram of a transfer method according to an embodiment of the present invention in each step. Referring to fig. 10 and 11, the transfer method includes the steps of:

s110, providing the target substrate 300.

The target substrate 300 may also be referred to as a target carrier plate, i.e., the transfer target position of the chip 110 is a position on the target substrate 300.

S120, providing a transfer substrate 100, and aligning the transfer substrate 100 with a target substrate 300; the transfer substrate 100 is provided with optical excitation components 130 arranged in an array, and a side of the optical excitation components 130 away from the transfer substrate 100 is provided with the chips 110 to be transferred.

The transfer substrate 100 may also be referred to as a transition carrier or a temporary carrier, and is used for pre-arranging the chips 110 according to the sizes of the chips to be transferred. In general, the position and orientation of the chips 110 placed on the transfer substrate 100 may be imprecise, or even disorganized. In other embodiments, the chips 110 on the transfer substrate 100 are regularly aligned, and the number and positions of the chips 110 to be transferred may be pre-stored.

The light excitation part 130 is a part that is excited by specific light to generate a physical and/or chemical change. Illustratively, the optical excitation component 130 changes from a solid state or a liquid state to a gas state under the action of light, so as to generate gas expansion, and the chip 110 is transferred (knocked) from the transfer substrate 100 to the target substrate 300, and the host material of the optical excitation component 130 may include materials such as ether or an oxidant; the specific illumination includes at least one of laser, visible light or non-visible light (e.g., UV light), and correspondingly, the light source device 800 includes at least one of a laser generator, a visible light generator or a non-visible generator.

Alternatively, the array substrate 200 and the target substrate 300 are driven to synchronously displace and remain relatively stationary, so that the transfer substrate 100 and the target substrate 300 are aligned during the displacement. For example, dynamic piece beating is performed by calculating the motion advance, thereby being beneficial to further improving the transfer precision. Alternatively, both the driving array substrate 200 and the target substrate 300 are stationary, and both are kept absolutely stationary.

S130, providing the light source device 800 and the light source control device 600, and placing the light source control device 600 on the light path generated by the light source device 800.

The light source device 800 and the light source control device 600 cooperate to control the light signal, so as to activate the corresponding light-activated component 130. Alternatively, the light source device 800 may be a backlight panel, and the light source control device 600 may be a liquid crystal on silicon panel to implement row/column scanning or surface scanning, thereby improving the efficiency of mass transfer. Alternatively, the light source device 800 may include a first light source generating a light source beam and a beam expanding module, and the light source control device 600 may be a digital micromirror to implement row/column scanning or surface scanning, thereby improving the efficiency of mass transfer. Alternatively, the light source device 800 may comprise a second light source generating a light source beam and the light source control device 600 may be a deflector to enable row/column scanning.

S140, controlling the light source control device 600 to irradiate the light generated by the light source device 800 onto the corresponding optical excitation member 130, so as to transfer at least a part of the chips 110 on the transfer substrate 100 onto the target substrate 300.

There are multiple scanning ways for the light generated by the light source device 800 to the light excitation component 130, and optionally, the light source device 800 is controlled to generate a surface light source; the driving light source control device 600 performs surface scanning on the chip 110 satisfying the transfer accuracy. Or, alternatively, controlling the light source device 800 to generate a light source beam; the driving light source control device 600 performs single-point scanning on the chip 110 satisfying the transfer accuracy.

At least partially means a part or all of the chips 110 transferred, and if all of the chips 110 transferred satisfy the transfer accuracy, the number of chips transferred to the target substrate 300 is the total number; if only a part of the chips 110 transferred satisfies the transfer accuracy, the number of chips transferred to the target substrate 300 is a partial number. Alternatively, a method of determining whether the chip position on the transfer substrate 100 satisfies the transfer requirement is: comparing (for example, subtracting) the chip position on the transfer substrate 100 with a preset position or the chip solder foot position on the target substrate 300, determining whether the two positions are completely overlapped or partially overlapped, and if so, meeting the transfer requirement; if the minimum overlapping area is partially overlapped, the minimum overlapping area is compared with a set threshold value, and whether the threshold value requirement is met or not is determined.

Fig. 11 exemplarily shows that all chips 110 satisfy the transfer accuracy, and all chips 110 are transferred onto the target substrate 300. In another embodiment, only some of the chips 110 on the transfer substrate 100 may be configured to satisfy the transfer accuracy, and the corresponding photo-excitation members 130 may be configured to transfer the chips 110 satisfying the transfer accuracy, thereby completing the first piece-making operation. Then, the transfer substrate 100 is aligned again with the target substrate 300 so that at least a part of the remaining chips 110 can satisfy the alignment accuracy. And so on until all of the remaining chips 110 are transferred.

As can be seen from the above steps, the embodiment of the present invention excites the corresponding light excitation member 130 on the transfer substrate 100 by using the light source device 800 and the light source control device 600 to perform the component beating action, so that the corresponding chip 110 is separated from the transfer substrate 100. In this way, only the chips 110 that satisfy the transfer accuracy can be transferred in one transfer process, and the other chips 110 that do not satisfy the transfer accuracy can be transferred by performing the alignment again. Compared with the prior art of transferring in batches, the embodiment of the utility model provides a chip 110's the accurate control and the transfer of treating the transfer has been realized to improved and transferred the precision and transferred the yield.

In each of the above embodiments, optionally, the transferring method further includes the following steps:

first, the positions of the transfer substrate 100 and the target substrate 300 are measured by an optical measuring device to obtain transfer information.

Then, the data processing device processes according to the transfer information, determines whether the position of the chip 110 on the transfer substrate 100 meets the transfer accuracy, and obtains quantity information and position information; the light source control device 600 adjusts the path of the light generated by the light source device 800 according to the number information and the position information.

The embodiment of the utility model provides a still provide a display device, this display device can be the LCD display device who is equipped with Mini LED backlight, be equipped with LCD display device, Mini LED display device or the Micro LED display device of Micro LED backlight. The display device includes: drive backplate and set up the display chip (for example, Mini LED chip or Micro LED chip) on the drive backplate, wherein, the display chip adopts like the utility model discloses transfer device that arbitrary embodiment provided shifts to on the drive backplate.

The driving backplane may be made of a flexible material such as Polyimide (PI), Polycarbonate (PC), or polyethylene terephthalate (PET), for example, to realize flexible display. The circuit film layer in the driving backplane can adopt an Organic Thin Film Transistor (OTFT), an organic field effect transistor (OMOS) or the like. The driving back plate can be a glass substrate or a quartz substrate with a driving circuit engraved thereon, or a flexible printed circuit board (FPC), a Printed Circuit Board (PCB), or the like.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. A transfer apparatus, comprising:

and the light source control device is positioned on a light path of the light generated by the light source device and is used for irradiating the light generated by the light source device onto the corresponding light excitation component so as to transfer at least part of components on the transfer substrate to a target substrate.

2. The transfer apparatus according to claim 1, wherein the light source device comprises a backlight panel for generating a surface light source; the light source control device includes a liquid crystal on silicon panel including:

the liquid crystal layer is arranged on one side of the array circuit layer; the liquid crystal layer comprises liquid crystal molecules, and the liquid crystal molecules are controlled by the corresponding driving electrodes to change angles so as to control the light generated by the backlight panel to be transmitted to the corresponding light excitation component.

3. The transfer apparatus according to claim 2, wherein the array circuit layer further comprises:

4. The transfer apparatus according to claim 1, wherein the light source device comprises a first light source and a beam expanding module, the first light source emits a light source beam, and the beam expanding module is used for diffusing the light source beam to generate a surface light source; the light source control device includes a digital micromirror, the digital micromirror comprising:

the driving array comprises switching devices arranged in an array;

5. The transfer apparatus according to claim 1, wherein the light source device comprises a second light source that emits a light source beam; the light source control device comprises deflectors for scanning the light source beams to the corresponding light excitation components.

6. The transfer apparatus of claim 5 wherein the deflector comprises a lens module positioned in an optical path of light emitted by the light source beam, the lens module being configured to adjust an angle of the light.

7. The transfer apparatus according to claim 1, further comprising:

8. The transfer apparatus of claim 1, wherein the light source device comprises at least one of a laser generator, a visible light generator, or a non-visible generator.

9. The transfer apparatus according to claim 1, wherein at least one of said light-activated members corresponds to one of said members to be transferred.

10. The transfer apparatus according to claim 1, wherein the light excitation member changes from a solid state or a liquid state to a gas state by the action of light;

11. The transfer apparatus according to claim 1, further comprising: and the execution film is arranged on one side of the light excitation component far away from the transfer substrate.

12. A display device, comprising: a driving backplane and a display chip disposed on the driving backplane, wherein the display chip is transferred onto the driving backplane using the transfer apparatus of any of claims 1-11.