CN214923338U - Transfer device used in silicon wafer polishing equipment and silicon wafer polishing equipment - Google Patents
Transfer device used in silicon wafer polishing equipment and silicon wafer polishing equipment Download PDFInfo
- Publication number
- CN214923338U CN214923338U CN202121497763.3U CN202121497763U CN214923338U CN 214923338 U CN214923338 U CN 214923338U CN 202121497763 U CN202121497763 U CN 202121497763U CN 214923338 U CN214923338 U CN 214923338U
- Authority
- CN
- China
- Prior art keywords
- silicon wafer
- stage
- cylindrical cover
- polishing
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 119
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 96
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 96
- 239000010703 silicon Substances 0.000 title claims abstract description 96
- 238000004140 cleaning Methods 0.000 claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 37
- 239000007921 spray Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 84
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000004372 Polyvinyl alcohol Substances 0.000 description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model discloses a transfer device and silicon chip polishing equipment that use among silicon chip polishing equipment, the transfer device includes: a stage formed with a first opening for attracting a silicon wafer to the stage by vacuum, the stage further formed with a plurality of second openings for jetting a cleaning liquid toward an outer side of the stage; a cylindrical cover body provided at a periphery of the platen, the cylindrical cover body being configured to be able to surround a polishing head of the polishing apparatus, the cylindrical cover body being provided with a plurality of nozzles for ejecting a cleaning liquid toward a radially inner side of the cylindrical cover body.
Description
Technical Field
The utility model relates to a silicon chip polishing technical field especially relates to a transfer device and silicon chip polishing equipment that use among silicon chip polishing equipment.
Background
Polishing a silicon wafer is an important process in the production process of the silicon wafer, and generally, polishing operation of the silicon wafer is completed by using silicon wafer polishing equipment.
The silicon wafer polishing apparatus generally includes a polishing head for attracting the silicon wafer and generating a relative motion with respect to the polishing pad, thereby effecting polishing of the silicon wafer. In this process, a polishing liquid is introduced between the polishing pad and the surface to be polished of the silicon wafer, and due to the movement of the polishing head and the silicon wafer relative to the polishing pad, the polishing liquid inevitably splashes to the polishing head and, after long-term accumulation, crystals are generated. In order to avoid scratches on the silicon wafer and adverse effects on polishing quality caused by crystal falling, two cleaning pipelines are usually installed on each polishing head, and cleaning liquid flows out to the polishing head in a strand-shaped manner through an outlet of each cleaning pipeline, so that polishing liquid attached to the polishing head is timely cleaned to avoid crystallization. However, since the cleaning liquid is in a strand shape, the entire polishing head cannot be completely cleaned, and thus the cleaning effect is poor.
The silicon wafer polishing apparatus also needs to load the silicon wafer to be polished and unload the polished silicon wafer, and generally, the two operations are respectively completed in a first station for loading the silicon wafer and a second station for unloading the silicon wafer in the polishing apparatus. Specifically, the method comprises the following steps: in the first station, Polyvinyl Alcohol (PVA) sponge is arranged, pure water is continuously supplied to the PVA sponge so that the pure water is kept overflowing in the PVA sponge to ensure that the surface of the sponge is wet, a silicon wafer to be polished is placed on the PVA sponge, and a polishing head presses on the silicon wafer to adsorb the silicon wafer, however, the consumption of the pure water is extremely large due to the operation mode, and the production cost is high; in the second station, a disc body is arranged, pure water is also continuously supplied to the disc body, so that the pure water keeps overflowing in the disc body, and polished silicon wafers are unloaded in the disc body through a polishing head.
SUMMERY OF THE UTILITY MODEL
For solving the technical problem, the embodiment of the utility model provides a expect to provide a transfer device and silicon chip polishing equipment that use in silicon chip polishing equipment, can realize carrying out complete washing to whole burnishing head, can realize loading and the uninstallation of silicon chip simultaneously in single station, need not supply the pure water with the saving cost continuously to can ensure that the silicon chip of polishing is in clean state when leaving polishing equipment.
The technical scheme of the utility model is realized like this:
in a first aspect, an embodiment of the present invention provides a transfer device used in a silicon wafer polishing apparatus, the transfer device includes:
a stage formed with a first opening for attracting a silicon wafer to the stage by vacuum, the stage further formed with a plurality of second openings for jetting a cleaning liquid toward an outer side of the stage;
a cylindrical cover body provided at a periphery of the platen, the cylindrical cover body being configured to be able to surround a polishing head of the polishing apparatus, the cylindrical cover body being provided with a plurality of nozzles for ejecting a cleaning liquid toward a radially inner side of the cylindrical cover body.
In a second aspect, an embodiment of the present invention provides a silicon wafer polishing apparatus, which includes a transfer device according to the first aspect.
The embodiment of the utility model provides a transfer device used in silicon wafer polishing equipment and the silicon wafer polishing equipment, the polishing head is cleaned by the cleaning liquid sprayed from the plurality of second openings of the platform and the cleaning liquid sprayed from the plurality of nozzles arranged on the cylindrical cover body, so that the whole polishing head can be completely cleaned, the loading and unloading of the silicon wafer are simultaneously realized in the transfer device without continuously supplying the cleaning liquid such as pure water but spraying the cleaning liquid as needed, so that the cost can be saved, the front surface of the silicon wafer can be cleaned by the cleaning liquid sprayed through the plurality of second openings of the platen when the polished silicon wafer is adsorbed on the polishing head, the back surface of the silicon wafer can be cleaned by the cleaning liquid injected from the plurality of nozzles provided in the cylindrical cover body when the polished silicon wafer is adsorbed on the platen, so that the polished silicon wafer can be kept in a clean state when leaving the polishing apparatus.
Drawings
Fig. 1 is a schematic view of a silicon wafer polishing apparatus using a transfer device according to the present invention.
Fig. 2 is a schematic view of a transfer device according to an embodiment of the present invention.
Fig. 3 is a schematic view of a silicon wafer to be polished when the silicon wafer is placed on a platform of a transfer device according to an embodiment of the present invention.
Fig. 4 is a schematic view of a use condition of the transfer device according to an embodiment of the present invention when the polished silicon wafer is adsorbed by the polishing head.
Fig. 5 is a schematic view of a polished silicon wafer being adsorbed by a stage of a transfer apparatus according to an embodiment of the present invention.
Fig. 6 is a schematic view of a transfer device according to another embodiment of the present invention.
Fig. 7 is a schematic view of another embodiment of the cylindrical cover of the relay unit.
Fig. 8 is a schematic view of another embodiment of a platform of the transfer device.
Detailed Description
In order to illustrate embodiments of the present invention or technical solutions in the prior art more clearly, the following description will be made in conjunction with the accompanying drawings in embodiments of the present invention to describe the technical solutions in the embodiments of the present invention clearly and completely, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The embodiment of the utility model provides a transfer device 10 that uses in silicon chip polishing equipment 1 as shown in figure 1. As shown in fig. 1, the silicon wafer polishing apparatus 1 may include four polishing heads 20, three polishing pads 30, and a transfer device 10, which are schematically shown, wherein each polishing head 20 adsorbs a silicon wafer, not shown in fig. 1, placed on the transfer device 10 and sequentially polishes the silicon wafer on the three polishing pads 30, and unloads the silicon wafer to the transfer device 10 after polishing is completed, so that three of the four polishing heads 20 correspond to the polishing pads 30 and the other one polishing head 20 corresponds to the transfer device 10 during operation of the polishing apparatus 1, and specifically, referring to fig. 2, the transfer device 10 may include:
a stage 11, the stage 11 being formed with a first opening 11A as schematically shown in fig. 2 by a solid line block on the stage 11, the first opening 11A being used to adhere a silicon wafer W (as shown in fig. 3) to the stage 11 by vacuum, the stage 11 being further formed with a plurality of second openings 11B as schematically shown in fig. 2 by a solid line ellipse on the stage 11, wherein six second openings 11B are exemplarily shown in fig. 2, the plurality of second openings 11B being used to spray a cleaning liquid CL such as pure water toward an outer side (i.e., an upper side in fig. 2) of the stage 11, wherein the cleaning liquid CL sprayed by the second openings 11B is schematically shown in fig. 2 by a broken line segment;
a cylindrical cover body 12 provided at the periphery of the platen 11, the cylindrical cover body 12 being configured to surround a polishing head 20 of the polishing apparatus 1 as shown in fig. 1, the cylindrical cover body 12 being provided with a plurality of nozzles 12A, wherein four nozzles 12A are exemplarily shown in fig. 2, the plurality of nozzles 12A being for ejecting a cleaning liquid CL toward a radially inner side of the cylindrical cover body 12, the cleaning liquid CL ejected by the nozzles 12A also being schematically shown by a broken line segment in fig. 2.
In this way, as shown in fig. 3, when it is necessary to load the silicon wafer W to be polished into the silicon wafer cleaning apparatus 1 shown in fig. 1, the silicon wafer W may be placed on the stage 11 by a robot arm not shown in the drawing, after which the first opening 11A may attract the silicon wafer W to the stage 11 by vacuum, and then the plurality of nozzles 12A provided to the cylindrical cover body 12 may eject the cleaning liquid CL to the back surface of the silicon wafer W which will come into contact with the polishing head 20, i.e., the upper surface as viewed in fig. 3, thereby facilitating the polishing head 20 to reliably attract the silicon wafer W.
For switching the adsorption of the wafer W to the platen 11 into the adsorption of the wafer W to the polishing head 20, the wafer W may be held between the platen 11 and the polishing head 20 with the wafer W adsorbed to the platen 11, after which the first port 11A releases the vacuum and the polishing head 20 generates the vacuum to adsorb the wafer W.
Thus, as shown in FIG. 4, when the polished silicon wafer W is adsorbed by the polishing head 20 and the silicon wafer W is in the space defined by the cylindrical cover 12 of the relay apparatus 10 together with the polishing head 20, the plurality of second openings 11B of the stage 11 may spray the cleaning solution CL to the front surface of the silicon wafer W opposite to the back surface, i.e., the surface adjacent to the stage 11 in fig. 4 or the surface which has been polished, thereby removing the polishing liquid adhering to the front surface of the wafer W during the polishing process, the plurality of nozzles 12A of the cylindrical cover body 12 may spray the cleaning liquid CL to the polishing head 20 which has adsorbed the silicon wafer W, thereby removing the polishing liquid adhering to the polishing head 20 during the polishing process, and the cleaning liquid CL is sprayed to the stage 11, thereby removing the polishing liquid falling from the front surface of the silicon wafer W and the polishing head 20 on the stage 11.
For switching the adsorption of the silicon wafer W to the polishing head 20 to the adsorption to the stage 11, the silicon wafer W may be held between the stage 11 and the polishing head 20 with the silicon wafer W adsorbed to the polishing head 20, after which the polishing head 20 releases the vacuum and the first aperture 11A generates the vacuum to adsorb the silicon wafer W.
In this way, as shown in fig. 5, when the polished silicon wafer W is adsorbed by the stage 11 and the polishing head 20 is in the space defined by the cylindrical cover 12 of the relay apparatus 10, the plurality of nozzles 12A of the cylindrical cover 12 may eject the cleaning liquid CL to the back surface of the silicon wafer W, thereby removing the polishing liquid remaining on the back surface of the silicon wafer W, and eject the cleaning liquid CL to the polishing head 20 that does not adsorb the silicon wafer W, thereby removing the polishing liquid remaining on the polishing head 20.
As described above, in the transfer device 10 used in the silicon wafer polishing apparatus 1 according to the embodiment of the present invention, the polishing head 20 is cleaned by the cleaning solution CL injected from the plurality of second openings 11B of the stage 11 and the cleaning solution CL injected from the plurality of nozzles 12A provided in the cylindrical cover 12, so that the entire polishing head 20 can be completely cleaned, the loading and unloading of the silicon wafer W are simultaneously performed in the transfer device 10, the cleaning solution, such as pure water, is not required to be continuously supplied but the cleaning solution is injected when needed, so that the cost can be saved, the front surface of the silicon wafer W can be cleaned by the cleaning solution CL injected from the plurality of second openings 11B of the stage 11 when the polished silicon wafer W is adsorbed to the polishing head 20, the back surface of the silicon wafer W can be cleaned by the cleaning solution CL injected from the plurality of nozzles 12A provided in the cylindrical cover 12 when the polished silicon wafer W is adsorbed to the stage 11, it is thus possible to ensure that the polished wafers W are in a clean state when they leave the polishing apparatus 1.
In a preferred embodiment of the present invention, referring to fig. 6, the transfer device 10 may further include a first driver 13, the first driver 13 being used for driving the platform 11 to rise and fall to move towards and away from the polishing head 20 of the polishing apparatus 1 as shown in fig. 6, wherein fig. 6 shows the platform 11 after being driven by the first driver 13 to move towards the polishing head 20, that is, the platform 11 may be located at a position farther away from the polishing head 20. In this way, the stage 11 can be kept at a required distance from the polishing head 20 in the vertical direction without the polishing head 20 moving in the vertical direction, so that the plurality of second orifices 11B spray the cleaning liquid CL to the polishing head 20 or to the front surface of the silicon wafer W adsorbed to the polishing head 20. In this way, the stage 11 can also be positioned at a desired position in the vertical direction with respect to the cylindrical cover body 12 so that the plurality of nozzles 12A provided in the cylindrical cover body 12 eject the washing liquid CL to the stage 11 or to the back surface of the silicon wafer W adsorbed on the stage 11.
In the preferred embodiment of the present invention, still referring to fig. 6, the transfer device 10 may further include a second driver 14, the second driver 14 is used for driving the cylindrical cover 12 to rise and fall to move towards and away from the polishing head 20 of the polishing apparatus 1, respectively, wherein fig. 6 shows the cylindrical cover 12 moving towards the polishing head 20 by the second driver 14, that is, the cylindrical cover 12 may be located at a position farther away from the polishing head 20. In this way, it is possible to keep the cylindrical cover body 12 at a required distance from the polishing head 20 in the vertical direction without generating movement of the polishing head 20 in the vertical direction, so that the plurality of nozzles 12A eject the washing liquid CL to the polishing head 20. In this way, the cylindrical cover body 12 can also be positioned at a desired position in the vertical direction with respect to the stage 11 so that the plurality of nozzles 12A provided in the cylindrical cover body 12 eject the washing liquid CL to the stage 11 or to the back surface of the silicon wafer W adsorbed on the stage 11.
In the preferred embodiment of the present invention, referring to fig. 7, the cylindrical cover 12 may further be provided with three clamping jaws 12B, the three clamping jaws 12B are configured to be capable of moving toward the radial inner side of the cylindrical cover 12 to clamp the silicon wafer W supported on the platform 11 and force the silicon wafer W to move to the target position on the platform 11, wherein fig. 7 shows a schematic diagram of the three clamping jaws 12B moving toward the radial inner side of the cylindrical cover 12 and clamping the silicon wafer W. The target position here means that, when the wafer W is moved to the target position, the wafer W can be brought into a correct position with respect to the polishing head 20 after being adsorbed by the polishing head 20 only by the vertical relative movement between the stage 11 and the polishing head 20 and without the horizontal relative movement between the stage 11 and the polishing head 20.
In a preferred embodiment of the present invention, referring to fig. 8, the stage 11 may include a body 111 and a film 112 attached to the body 111 and adapted to contact the silicon wafer W.
In a preferred embodiment of the present invention, referring back to fig. 7, the three clamping jaws 12B may be evenly distributed along the circumference of the cylindrical cover 12 so as to clamp the silicon wafer W in a more stable and precise manner.
In a preferred embodiment of the present invention, referring back to fig. 2, each of the plurality of second openings 11B and each of the plurality of nozzles 12A may spray the cleaning liquid CL in a scattered manner.
In a preferred embodiment of the present invention, the body 111 may be made of ceramic.
In a preferred embodiment of the present invention, the film 112 may be made of foamed polyurethane.
The embodiment of the utility model provides a still provide a silicon chip polishing equipment 1 as shown in figure 1, silicon chip polishing equipment 1 can include according to the utility model discloses a transfer device 10.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A transfer device used in a silicon wafer polishing apparatus is characterized in that the transfer device comprises:
a stage formed with a first opening for attracting a silicon wafer to the stage by vacuum, the stage further formed with a plurality of second openings for jetting a cleaning liquid toward an outer side of the stage;
a cylindrical cover body provided at a periphery of the platen, the cylindrical cover body being configured to be able to surround a polishing head of the polishing apparatus, the cylindrical cover body being provided with a plurality of nozzles for ejecting a cleaning liquid toward a radially inner side of the cylindrical cover body.
2. The relay device according to claim 1, further comprising a first driver for driving the stage to be raised and lowered to be moved toward and away from the polishing head of the polishing apparatus, respectively.
3. The relay device according to claim 1, further comprising a second driver for driving the cylindrical cover to be raised and lowered to be moved toward and away from the polishing head of the polishing apparatus, respectively.
4. The transfer apparatus according to claim 1, wherein said cylindrical cover is further provided with three gripping jaws configured to be movable toward a radially inner side of said cylindrical cover to grip said silicon wafer carried on said stage and to simultaneously force said silicon wafer to move to a target position on said stage.
5. The relay device according to claim 1, wherein said platform comprises a body and a film attached to said body and adapted to contact said silicon wafer.
6. The transfer device of claim 4, wherein the three clamping jaws are evenly distributed along a circumference of the cylindrical cover.
7. The relay device according to claim 1, wherein each of said plurality of second openings and each of said plurality of nozzles spray said cleaning liquid in a scattered manner.
8. The transfer device of claim 5, wherein the body is made of ceramic.
9. The transfer device of claim 5, wherein said membrane is made of foamed polyurethane.
10. A silicon wafer polishing apparatus characterized by comprising the relay device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121497763.3U CN214923338U (en) | 2021-07-02 | 2021-07-02 | Transfer device used in silicon wafer polishing equipment and silicon wafer polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121497763.3U CN214923338U (en) | 2021-07-02 | 2021-07-02 | Transfer device used in silicon wafer polishing equipment and silicon wafer polishing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214923338U true CN214923338U (en) | 2021-11-30 |
Family
ID=79076633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121497763.3U Active CN214923338U (en) | 2021-07-02 | 2021-07-02 | Transfer device used in silicon wafer polishing equipment and silicon wafer polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214923338U (en) |
-
2021
- 2021-07-02 CN CN202121497763.3U patent/CN214923338U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100412542B1 (en) | Method and device for cleaning work | |
| US11139182B2 (en) | Substrate processing apparatus and substrate processing method | |
| KR102229920B1 (en) | Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning | |
| JP2016043471A (en) | Substrate processing apparatus | |
| US20180358243A1 (en) | Brush cleaning apparatus, chemical-mechanical polishing (cmp) system and wafer processing method | |
| KR102207397B1 (en) | Wafer turning apparatus after chemical mechanical polishing process and substrate treating method using same | |
| KR101658250B1 (en) | Apparatus for polishing rear surface of substrate, system for polishing rear surface of substrate, method for polishing rear surface of substrate and recording medium having program for polishing rear surface of substrate | |
| JPH11254294A (en) | Washer device for level block correcting dresser | |
| JP6468037B2 (en) | Polishing equipment | |
| JP2007036152A (en) | Wafer cleaning/drying method and wafer cleaning/drying equipment | |
| JPH10180198A (en) | Cleaning device | |
| US11837482B2 (en) | Substrate holding and rotation mechanism and substrate processing apparatus | |
| CN214923338U (en) | Transfer device used in silicon wafer polishing equipment and silicon wafer polishing equipment | |
| US20070232201A1 (en) | Apparatus and method for polishing semiconductor wafer | |
| KR20180102022A (en) | Self-cleaning device and substrate processing apparatus | |
| KR101591957B1 (en) | Substrate treating apparatus and substrate treating method | |
| JP3550180B2 (en) | Wafer transfer method and transfer apparatus | |
| KR20070095096A (en) | Polishing head of chemical mechanical polishing apparatus | |
| JP3644706B2 (en) | Polishing device | |
| JP2022124016A (en) | Substrate cleaning apparatus, abnormality determination method of substrate cleaning apparatus, and abnormality determination program of substrate cleaning apparatus | |
| JP4037511B2 (en) | Wafer polishing apparatus and system | |
| JP3086437B2 (en) | Chemical mechanical polishing apparatus and chemical mechanical polishing method | |
| JPH11254300A (en) | Washing device for carrier in surface polishing device | |
| KR20150061105A (en) | Cleaning unit and substrate treating apparatus | |
| JP2001274123A (en) | Substrate polishing apparatus and substrate-polishing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Address before: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |