CN214895374U - Wheel speed sensor chip module and wheel speed sensor - Google Patents

Abstract

The utility model provides a fast sensor chip module of wheel, a serial communication port, fast sensor chip module of wheel includes the terminal and the insulating casing of chip, electric connection chip, the insulating casing cladding chip, part the terminal, the insulating casing forms through integrative injection moulding's mode. By the design, the purposes of reducing assembly processes, reducing volume and improving positioning accuracy can be achieved.

Description

Wheel speed sensor chip module and wheel speed sensor

Technical Field

The utility model relates to a fast sensor chip module of wheel and fast sensor of wheel.

Background

A typical wheel speed sensor generally includes a wheel speed sensor chip module having a lead frame-based ASIC (application specific integrated circuit) package electrically connected with a two-wire cable of a cable portion, and a cable portion attached to the wheel speed sensor chip module. Generally, customized applications suitable for vehicles are realized by means of an enclosure formed by direct injection molding or modular injection molding, through which a wheel speed sensor chip module and a cable part are assembled together.

Specifically, the wheel speed sensor chip module includes a sensing element, such as a hall IC, two terminals, two gold wires respectively connecting the two terminals with the sensing element, a capacitor or a resistor electrically connected between the two terminals, an insulating body housing the sensing element, and an insulating case encapsulating the above components, and is typically manufactured in the following manner.

Firstly, assembling a sensing element, two terminals, two gold wires, a capacitor or a resistor together; then, mounting the sensing element on the insulating body; and finally, performing integral profile injection molding on the assembly obtained through the process in a mold to form an insulating shell, and finally obtaining the wheel speed sensor chip module.

As is apparent from the above description, the conventional wheel speed sensor chip module has a complicated structure, and requires an insulating body with a built-in positioning function, which results in a large overall size of the final chip module, a large number of assembly processes, and an uncontrollable size and accuracy of the subsequent injection-molded insulating housing because the insulating body and the chip element are mechanically positioned in a manner of being inserted from one side.

Therefore, it is necessary to provide a new wheel speed sensor chip module and a wheel speed sensor.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model provides a new fast sensor chip module of wheel and the fast sensor of wheel to overcome the defects of above-mentioned prior art.

The utility model provides a technical scheme that prior art problem adopted is:

the utility model provides a fast sensor chip module of wheel, fast sensor chip module of wheel includes the terminal and the insulating casing of chip, electric connection chip, the insulating casing cladding chip, part the terminal, the insulating casing forms through integrative injection moulding's mode.

Preferably, the insulating housing comprises a plurality of side walls, at least two adjacent side walls are provided with through holes, the bottoms of the through holes are communicated with the surface of the chip, and the through holes are filled with glue.

Preferably, the insulating housing includes a first housing and a second housing, the first housing is integrally formed on the chip and a portion of the outer side of the terminal, and the second housing is injection-molded on the outer side of the first housing.

Preferably, the first casing includes a plurality of first side walls, the first side walls form a first through hole, the bottom of the first through hole is communicated with the surface of the chip, and the first through hole is filled with plastic.

Preferably, the second housing includes a plurality of second side walls, the second side walls forming a second through hole, and a bottom of the second through hole communicates with a surface of the first housing.

Preferably, the plurality of first side walls of the first housing and the plurality of second side walls of the second housing are arranged in a one-to-one correspondence manner, and the first through holes and the second through holes are arranged in a staggered manner in correspondence to the first side walls and the second side walls.

A wheel speed sensor comprises a cable module and a wheel speed sensor chip module, wherein the wheel speed sensor chip module is assembled with the cable module.

The utility model has the advantages that: form the insulating casing of cladding in the chip outside through integrative injection moulding's mode, insulating casing encapsulates the chip to prevent chip and outside air contact, at integrative injection moulding's in-process, can utilize the positioning insert to fix a position by the injection molding, the insulating casing of formation of moulding plastics has the through-hole that the positioning insert formed after extracting, and this through-hole exposes the surface of chip, consequently fills insulating casing's through-hole with glue, in order to ensure insulating casing's leakproofness. In order to avoid the sealing problem caused by the exposure of the through hole to the surface of the chip after the injection molding, the second shell outside the first shell can be coated by the injection molding for the second time, and the first shell and the second shell jointly form an insulating shell to seal the chip.

Drawings

Above utility model's purpose, technical scheme and beneficial effect can realize through following attached drawing:

fig. 1 is a schematic structural diagram of a wheel speed sensor chip module according to a first embodiment of the present invention;

FIG. 2 is an exploded perspective view of the wheel speed sensor chip module shown in FIG. 1;

fig. 3 is a schematic structural diagram of a wheel speed sensor chip module according to a second embodiment of the present invention;

FIG. 4 is an exploded perspective view of the wheel speed sensor chip module shown in FIG. 3;

FIG. 5 is a further exploded perspective view of the wheel speed sensor chip module shown in FIG. 4;

fig. 6 is a schematic structural diagram of a wheel speed sensor chip module according to a third embodiment of the present invention;

FIG. 7 is an exploded perspective view of the wheel speed sensor chip module shown in FIG. 6;

fig. 8 is a further exploded perspective view of the wheel speed sensor chip module shown in fig. 7.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

As shown in fig. 1 to 2, a wheel speed sensor chip module 100 according to a first embodiment of the present invention is a wheel speed sensor chip module 100, wherein the wheel speed sensor chip module 100 is mounted on a wheel of a vehicle for detecting a wheel speed of the vehicle in real time, and the wheel speed sensor chip module 100 includes a chip 10, a first terminal 20, a second terminal 30, a first gold wire (not shown), a second gold wire (not shown), a third electrical connector (not shown), and an insulating housing 40. The first gold wire is connected between the chip 10 and the first terminal 20 to form a first connection member, specifically, one end of the first gold wire is soldered to the chip 10, and the other end of the first gold wire is soldered to the first terminal 20. The second gold wire is connected between the chip 10 and the second terminal 30 to form a second connection member, specifically, one end of the second gold wire is soldered to the chip 10, and the other end of the second gold wire is soldered to the second terminal 30. The third electrical connector is connected between the first terminal 20 and the second terminal 30, and specifically, one end of the third electrical connector is soldered to the first terminal 20, and the other end of the third electrical connector is soldered to the second terminal 30, and the third electrical connector is a resistor or a capacitor. The first terminal 20 and the second terminal 30 are located on the same side of the chip 10, the first terminal 20 and the second terminal 30 are arranged in parallel, and both the first terminal 20 and the second terminal 30 are arranged perpendicular to the chip 10. The insulating housing 40 covers the chip 10, the first gold wire, the second gold wire, the third electrical connection member, a portion of the first terminal 20 and a portion of the second terminal 30, and the insulating housing 40 is formed by integral injection molding. The insulating housing 40 includes six side walls, wherein each of the five side walls has a first through hole 41, and the first through hole 41 is filled with glue.

The following describes in detail a production process of the wheel speed sensor chip module 100 according to the first embodiment of the present invention, including the following steps:

s11, assembling the chip 10, the first terminal 20, the second terminal 30, the first gold wire, the second gold wire, and the third electrical connector into a whole, specifically, soldering one end of the first gold wire to the chip 10, soldering the other end of the first gold wire to the first terminal 20, soldering one end of the second gold wire to the chip 10, soldering the other end of the second gold wire to the second terminal 30, soldering one end of the third electrical connector to the first terminal 20, and soldering the other end of the third electrical connector to the second terminal 30;

s12, forming the insulating housing 40 by an integral injection molding manner, specifically, the injection mold (not shown) includes five positioning inserts, before injection molding, the five positioning inserts are abutted against five sides of the chip 10 to position the chip 10, the five sides are five sides of the side where two terminals of the chip are removed, injection molding is performed after positioning is completed, the five positioning inserts are removed after injection molding is completed, the insulating housing 40 formed by injection molding has five side walls corresponding to the five sides of the chip 10, each side wall has a first through hole 41, the insulating housing 40 covers the chip 10, the first gold wires, the second gold wires, the third electrical connectors, a part of the first terminals 20 and a part of the second terminals 30, and the bottom of the first through holes 41 exposes the surface of the chip 10;

s13, filling the first through holes 41 of the above five sidewalls with glue.

In the prior art, in the technical scheme that an insulator which is in insertion fit with the chip 10 needs to be placed in an injection molding body in advance, when an insulating shell is formed by subsequent injection molding, the injection molding positioning is only suitable for two opposite surfaces (an upper surface and a lower surface) of the insulator which is in insertion fit, so that the positioning of other non-spaced open surfaces is avoided, and the thickness of an injection molding material on the side surface in the non-positioning direction cannot be controlled when the insulating shell is injected. In the invention, the injection positioning of the injection molded first shell is ineffective to avoid the open surface inserted into the chip direction, and the injection positioning of more side surfaces can be realized, so that the positioning of at least two adjacent side surfaces of the chip can be realized, and the first through holes 41 of the two adjacent side surfaces are formed, thus the thickness control of the injection molding material of more side surfaces can be improved to a greater extent, and the reduction of the whole packaging size of the chip is facilitated.

As shown in fig. 3 to 5, a wheel speed sensor chip module 100 according to a second embodiment of the present invention is provided, the wheel speed sensor chip module 100 is mounted on a wheel of a vehicle for detecting a wheel speed of the vehicle in real time, the wheel speed sensor chip module 100 includes a chip 10, a first terminal 20, a second terminal 30, a first gold wire (not shown), a second gold wire (not shown), a third electrical connector (not shown), and an insulating housing, and the insulating housing includes a first housing 40 and a second housing 50. The first gold wire is connected between the chip 10 and the first terminal 20, specifically, one end of the first gold wire is soldered to the chip 10, and the other end of the first gold wire is soldered to the first terminal 20. The second gold wire is connected between the chip 10 and the second terminal 30, specifically, one end of the second gold wire is soldered to the chip 10, and the other end of the second gold wire is soldered to the second terminal 30. The third electrical connector is connected between the first terminal 20 and the second terminal 30, and specifically, one end of the third electrical connector is soldered to the first terminal 20, and the other end of the third electrical connector is soldered to the second terminal 30, and the third electrical connector is a resistor or a capacitor. The first terminal 20 and the second terminal 30 are located on the same side of the chip 10, the first terminal 20 and the second terminal 30 are arranged in parallel, and both the first terminal 20 and the second terminal 30 are arranged perpendicular to the chip 10. The first housing 40 covers the chip 10, the first gold wire, the second gold wire, the third electrical connector, a part of the first terminal 20 and a part of the second terminal 30, the second housing 50 covers the first housing 40, and the first housing 40 and the second housing 50 are formed by integral injection molding. The first housing 40 has six first sidewalls, each of which has a first through hole 41, and the first through hole 41 is filled with plastic. The second housing 50 has six second sidewalls, each second sidewall has a second through hole 51, the second through hole 51 is filled with glue, and in other embodiments, the second through hole 51 may not be filled.

The following describes in detail a production process of a wheel speed sensor chip module 100 according to a second embodiment of the present invention, including the following steps:

s11, assembling the chip 10, the first terminal 20, the second terminal 30, the first gold wire, the second gold wire, and the third electrical connector into a whole, specifically, soldering one end of the first gold wire to the chip 10, soldering the other end of the first gold wire to the first terminal 20, soldering one end of the second gold wire to the chip 10, soldering the other end of the second gold wire to the second terminal 30, soldering one end of the third electrical connector to the first terminal 20, and soldering the other end of the third electrical connector to the second terminal 30;

s12, forming the first housing 40 by an integral injection molding, specifically, the injection mold (not shown) includes five positioning inserts, before the injection molding, the five positioning inserts abut against five sides of the chip 10 (in other embodiments, the jig abuts against at least three sides of the chip to fix the chip) to position the chip 10, the five sides are five sides of the chip 10 except for two terminals, the injection molding is performed after the positioning is completed, the five positioning inserts are removed after the injection molding is completed, at this time, the first housing 40 formed by the injection molding has five first sidewalls corresponding to the five sides of the chip 10, each first sidewall has one first through hole 41 (in other embodiments, at least three first sidewalls form corresponding first through holes 41 at the abutting positions of the jig), and the first housing 40 covers the chip 10, the first gold wires, The second gold wire, the third electrical connector, a part of the first terminal 20 and a part of the second terminal 30 are arranged outside the chip, the bottom of the first through hole 41 is communicated with the surface of the chip 10, and glue can be filled in the first through hole 41;

s13, performing two-shot molding on the outer side of the first housing 40 to form a second housing 50, specifically, the injection mold includes five positioning inserts, before injection molding, the five positioning inserts are abutted against the five first sidewalls of the first housing 40 to position the first housing 40, the five first sidewalls are the five sidewalls of the first housing 40 except the sidewalls where the two terminals are located, the positioning insert corresponding to each of the five first sidewalls of the first housing 40 is staggered from the first through hole 41 formed by the first housing 40 on the first sidewall, after positioning, injection molding is performed, after injection molding is completed, the five positioning inserts are removed, at this time, the second housing 50 formed by injection molding has five second sidewalls corresponding to the five first sidewalls of the first housing 40, each second sidewall has a second through hole 51, the second housing 50 is covered on the outer side of the first housing 40, the first through holes 41 and the second through holes 51 are arranged in a staggered manner, so that in the process of injection molding of the second shell 50, the five first through holes 41 of the first shell 40 are filled with plastic, the surface of the chip 10 is prevented from being exposed, and the chip 10 is completely wrapped in the insulating shell;

s14, the five second through holes 51 are filled with glue (this step may be omitted).

As shown in fig. 6 to 8, a wheel speed sensor chip module 100 according to a third embodiment of the present invention is provided, the wheel speed sensor chip module 100 is mounted on a wheel of a vehicle for detecting a wheel speed of the vehicle in real time, the wheel speed sensor chip module 100 includes a chip 10, a first terminal 20, a second terminal 30, a first gold wire (not shown), a second gold wire (not shown), a third electrical connector (not shown), and an insulating housing, and the insulating housing includes a first housing 40 and a second housing 50. The first gold wire is connected between the chip 10 and the first terminal 20, specifically, one end of the first gold wire is soldered to the chip 10, and the other end of the first gold wire is soldered to the first terminal 20. The second gold wire is connected between the chip 10 and the second terminal 30, specifically, one end of the second gold wire is soldered to the chip 10, and the other end of the second gold wire is soldered to the second terminal 30. The third electrical connector is connected between the first terminal 20 and the second terminal 30, and specifically, one end of the third electrical connector is soldered to the first terminal 20, and the other end of the third electrical connector is soldered to the second terminal 30, and the third electrical connector is a resistor or a capacitor. The first terminal 20 and the second terminal 30 are located on the same side of the chip 10, the first terminal 20 and the second terminal 30 are arranged in parallel, and both the first terminal 20 and the second terminal 30 are arranged perpendicular to the chip 10. The first housing 40 covers the chip 10, the first gold wire, the second gold wire, the third electrical connector, a part of the first terminal 20 and a part of the second terminal 30, the second housing 50 covers the first housing 40, and the first housing 40 and the second housing 50 are formed by integral injection molding. The first shell 40 includes six first side walls, and the surface of six first side walls all is equipped with convex hull structure 41, and the appearance and the size of convex hull structure 41 can design according to actual demand. The convex hull structure 41 facilitates the injection mold to position the first housing 40 during the two-shot molding of the second housing 50. After the second casing 50 is injection molded, the convex hull structures 41 on the six first side walls of the first casing 40 are exposed to the outer surface of the second casing 50. Each of the four first sidewalls of the first housing 40 has a first through hole 42, and the first through hole 42 is filled with plastic.

The following describes in detail a production process of a wheel speed sensor chip module 100 according to a third embodiment of the present invention, including the following steps:

s11, assembling the chip 10, the first terminal 20, the second terminal 30, the first gold wire, the second gold wire, and the third electrical connector into a whole, specifically, soldering one end of the first gold wire to the chip 10, soldering the other end of the first gold wire to the first terminal 20, soldering one end of the second gold wire to the chip 10, soldering the other end of the second gold wire to the second terminal 30, soldering one end of the third electrical connector to the first terminal 20, and soldering the other end of the third electrical connector to the second terminal 30;

s12, forming the first housing 40 by integral injection molding, specifically, the injection mold (not shown) includes four positioning inserts, before injection molding, the four positioning inserts are abutted against the four side surfaces of the chip 10 to position the chip 10, the four side surfaces are a side surface where the two terminals are located and three side surfaces adjacent to the side surface, injection molding is performed after positioning is completed, the four positioning inserts are removed after injection molding is completed, at the moment, a first shell 40 formed by injection molding is provided with four first side walls corresponding to the four side surfaces of the chip 10, each first side wall of the four first side walls is provided with a first through hole 42, the first shell 40 covers the chip 10, the first gold wires, the second gold wires, the third electric connecting pieces, the outer sides of part of the first terminals 20 and part of the second terminals 30, the first shell 40 comprises six first side walls, and the outer surfaces of the six first side walls are provided with convex bag structures 41;

s13, performing secondary injection molding on the second housing 50 outside the first housing 40, specifically, the injection mold positions the first housing 40 by using the convex hull structures 41 on the six first sidewalls of the first housing 40, performing secondary injection molding after the positioning is completed, forming the second housing 50 after the injection molding is completed, the second housing 50 is covered outside the first housing 40, the convex hull structures 41 on the six first sidewalls of the first housing 40 are all exposed out of the outer surface of the second housing 50, and in the process of injection molding the second housing 50, the four first through holes 42 of the first housing 40 are filled with plastic.

The present invention provides a wheel speed sensor (not shown) which includes a wheel speed sensor chip module 100 and a cable module (not shown) that are formed as separate units from each other and then assembled together.

In the invention, the insulating shell coated on the outer side of the chip 10 is formed in an integral injection molding mode, the chip 10 is packaged by the insulating shell to prevent the chip 10 from contacting with the outside air, in the integral injection molding process, the injection-molded part can be positioned by using the positioning insert, the injection-molded insulating shell is provided with a through hole formed after the positioning insert is pulled out, and the through hole exposes the surface of the chip, so that the through hole of the insulating shell is filled with glue to ensure the sealing property of the insulating shell. In order to avoid the sealing problem caused by the exposure of the through hole to the surface of the chip after the first injection molding, a second casing covering the outer side of the first casing can be subjected to the second injection molding, and the first casing and the second casing together form an insulating shell to seal the chip 10.

In the present invention, since the first housing 40 is directly injection-molded on the outer side of the chip 10, it is easier to control the chip 10 and the overall dimensional accuracy after injection molding, compared to a conventional method in which the chip 10 needs to be positioned in advance by an insulator first in an injection-molded body. And the positioning of each surface is directly carried out on the chip 10, compared with the existing mode that the positioning of the chip 10 is firstly carried out in advance in the injection molding body in an insulator mode, more surfaces which can directly be used as positioning references are provided (in the prior art, the insertion mode is adopted to position the chip in advance, so that two side surfaces in the insertion direction of the chip cannot be positioned during injection molding), the size of the injection molding is easier to control, and the reduction of the whole size of the chip packaging is finally facilitated.

In the present invention, the second housing 50 is formed by two-shot injection molding on the outer side of the first housing 40 formed by the first injection molding, and compared with the prior art in which the insertion positioning of the chip 10 is performed in the injection molding body by an insulator first, the second housing 50 is directly positioned on the first housing 40 formed by one-shot injection molding, and the first housing 40 is formed by injection molding, so that the injection positioning of more sides is facilitated, and the control of the size and thickness of the second housing 50 is facilitated. Generally, the design of injection molding twice can achieve the purposes of reducing the assembly process, reducing the volume and improving the positioning precision.

The over-Molding technique mentioned in the present invention refers to a technique combination manner of integral Molding, for example, the metal circuit and the insulating block can adopt Insert Molding (IM) or Molded Interconnect Device (MID) to achieve the combination manner of over-Molding.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (7)

1. The utility model provides a fast sensor chip module of wheel which characterized in that, fast sensor chip module of wheel includes chip, electric connection chip's terminal and insulating casing, the insulating casing cladding chip, part the terminal, the insulating casing forms through integrative injection moulding's mode.

2. The wheel speed sensor chip module of claim 1, wherein the insulating housing comprises a plurality of sidewalls, at least two adjacent sidewalls having through holes, the bottom of the through holes communicating with the surface of the chip, the through holes being filled with glue.

3. The wheel speed sensor chip module of claim 1, wherein the insulating housing comprises a first housing and a second housing, the first housing is integrally formed on the outer side of the chip and a portion of the terminals, and the second housing is over-molded on the outer side of the first housing.

4. The wheel speed sensor chip module of claim 3, wherein the first housing comprises a plurality of first sidewalls, the first sidewalls forming a first through hole, a bottom of the first through hole communicating with a surface of the chip, and the first through hole being filled with plastic.

5. The wheel speed sensor chip module of claim 4, wherein the second housing includes a plurality of second sidewalls, the second sidewalls forming a second through hole, a bottom of the second through hole communicating with a surface of the first housing.

6. The wheel speed sensor chip module of claim 5, wherein the first side walls of the first housing and the second side walls of the second housing are disposed in a one-to-one correspondence, and the first through holes and the second through holes are disposed in a staggered manner corresponding to the first side walls and the second side walls.

7. A wheel speed sensor characterized by comprising a cable module and the wheel speed sensor chip module according to any one of claims 1 to 6 assembled with the cable module.

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