CN214644907U - Silicon carbide processing is with section device - Google Patents
Silicon carbide processing is with section device Download PDFInfo
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- CN214644907U CN214644907U CN202022852824.5U CN202022852824U CN214644907U CN 214644907 U CN214644907 U CN 214644907U CN 202022852824 U CN202022852824 U CN 202022852824U CN 214644907 U CN214644907 U CN 214644907U
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- silicon carbide
- workbench
- mounting
- cutting
- cutting mechanism
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Abstract
The utility model discloses a section device is used in carborundum processing, comprises a workbench, be provided with the cutting mechanism that can reciprocate on the workstation, correspond on the workstation the position of cutting machine one side is provided with mounting panel that can move around, be provided with the clamp splice that is used for fixed carborundum on the mounting panel. The utility model discloses a set up a mobilizable mounting panel on the workstation, and with the silicon carbide semiconductor centre gripping on the mounting panel, thereby the convenience carries out position adjustment to the silicon carbide semiconductor, once after the centre gripping location, can repeat the work of cutting into slices, bring very big facility and improved machining efficiency for processing work, and the setting of jet head can effectively blow the piece that produces after the cutting totally, thereby guarantee the level and smooth of semiconductor surface, avoid the follow-up sliced precision of piece influence.
Description
Technical Field
The utility model relates to a carborundum processing equipment technical field especially relates to a carborundum processing is with section device.
Background
In the production of semiconductor, carborundum is the most common material, the carborundum semiconductor need slice the operation to its self at the in-process of processing, thereby produce the carborundum semiconductor of equidimension not in order to satisfy the user demand, the common carborundum semiconductor section device on the market at present, all directly with the semiconductor stationary, in the cutting process, the position of semiconductor can not change, when slicing once more, still need readjust the position of semiconductor and press from both sides tight fixed work again, this processing work brings very big inconvenience, machining efficiency has been reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to avoid prior art's weak point, provide a carborundum processing is with section device to effectively solve the weak point that exists among the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a slicing device for processing silicon carbide comprises a workbench, wherein a cutting mechanism capable of moving up and down is arranged on the workbench, a mounting plate capable of moving back and forth is arranged on the workbench at a position corresponding to one side of the cutting mechanism, and a clamping block for fixing the silicon carbide is arranged on the mounting plate;
the cutting mechanism moves up and down under the driving of the cylinder, and air nozzles are arranged on the worktable at positions corresponding to the two sides of the cutting mechanism;
the mounting plate moves back and forth along the workbench under the driving of the matching of the servo motor and the rack, abutting cylinders are arranged on the left side and the right side of the mounting plate, piston rods of the abutting cylinders are arranged oppositely, and the clamping blocks are mounted on the piston rods of the abutting cylinders.
Furthermore, a U-shaped mounting frame is arranged on the workbench, the air cylinder is installed at the top of the mounting frame, a piston rod of the air cylinder vertically penetrates through the mounting frame downwards, an installation platform is arranged at the end part of the piston rod, and the cutting mechanism and the jet head are installed on the installation platform.
Further, cutting mechanism is including setting firmly motor on the mount table, the drive end of motor passes the mount table and is connected with the cutting knife on its drive end, still is provided with the protection casing on the mount table, the protection casing cover is established the upper portion of cutting knife.
Furthermore, the mounting table is provided with supports corresponding to the positions of two sides of the cutting knife, the air nozzle is mounted on the supports, and the nozzles of the air nozzle are arranged downwards and face one side of the cutting knife.
Furthermore, a vertical guide rod is arranged in the mounting frame and penetrates through the mounting table.
Further, servo motor installs the both sides of mounting panel, the rack is installed on the workstation and its position with servo motor is corresponding, and the one end that the servo motor drive shaft passed the mounting panel is provided with the gear with rack cooperation work.
Further, the workbench is provided with a slide rail, and the bottom of the mounting plate is provided with a slide block matched with the slide rail for working.
Furthermore, vertical plates are arranged on two sides of the mounting plate, the abutting air cylinder is fixedly connected with the vertical plates, and a piston rod of the abutting air cylinder penetrates through the vertical plates and is fixedly connected with the clamping blocks.
The above technical scheme of the utility model following beneficial effect has: the utility model discloses a set up a mobilizable mounting panel on the workstation, and with the silicon carbide semiconductor centre gripping on the mounting panel, thereby the convenience carries out position adjustment to the silicon carbide semiconductor, once after the centre gripping location, can repeat the work of cutting into slices, bring very big facility and improved machining efficiency for processing work, and the setting of jet head can effectively blow the piece that produces after the cutting totally, thereby guarantee the level and smooth of semiconductor surface, avoid the follow-up sliced precision of piece influence.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
fig. 2 is an enlarged view of a portion a in fig. 1.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-2, the slicing apparatus for processing silicon carbide of the present embodiment includes a table 1, a cutting mechanism 2 capable of moving up and down is disposed on the table 1, a mounting plate 3 capable of moving forward and backward is disposed on the table 1 at a position corresponding to one side of the cutting mechanism 2, and a clamping block 4 for fixing silicon carbide is disposed on the mounting plate 3;
the cutting mechanism 2 moves up and down under the driving of the cylinder 5, and the positions on the workbench 1 corresponding to the two sides of the cutting mechanism 2 are provided with air nozzles 6;
the mounting plate 3 moves back and forth along the workbench 1 under the driving of the matching of the servo motor 7 and the rack 8, the left side and the right side of the mounting plate 3 are provided with abutting cylinders 9, piston rods of the abutting cylinders 9 are oppositely arranged, and the clamping blocks 4 are mounted on the piston rods of the abutting cylinders 9.
The U-shaped mounting frame 10 is arranged on the workbench 1, the air cylinder 5 is arranged at the top of the mounting frame 10, a piston rod of the air cylinder 5 vertically penetrates through the mounting frame 10 downwards, the mounting table 11 is arranged at the end part of the piston rod, and the cutting mechanism 2 and the jet head 6 are both arranged on the mounting table 11.
Cutting mechanism 2 is including setting firmly motor 2a on mount table 11, and the drive end of motor 2a passes mount table 11 and is connected with cutting knife 2b on its drive end, still is provided with protection casing 2c on the mount table 11, and the upper portion at cutting knife 2b is established to protection casing 2c cover, and the lower extreme of cutting knife 2b exposes in the outside of protection casing 2 c.
The mount table 1 is provided with support 12 corresponding to cutting knife 2b both sides position, and jet-propelled head 6 is installed on support 12, and jet-propelled head 6's nozzle sets up downwards and all towards cutting knife one side, and spray-painted head 6 is connected with the air pump, stops through the control air pump and realizes the work of giving vent to anger of its nozzle.
A vertical guide rod 13 is arranged in the mounting frame 10, the guide rod 13 penetrates through the mounting table 11, and the guide rod 13 is used for ensuring the stability of the mounting table 11 during operation.
The servo motor 7 is arranged on two sides of the mounting plate 3, the rack 8 is arranged on the workbench 1 and corresponds to the servo motor 7 in position, a gear 14 matched with the rack 8 for working is arranged at one end, penetrating through the mounting plate 3, of a driving shaft of the servo motor 7, and the gear 14 and the racks 8 are meshed with each other.
The workbench 1 is provided with a slide rail 15, and the bottom of the mounting plate 3 is provided with a slide block 16 which is matched with the slide rail 15 for working.
The servo motors 7 on the two sides of the mounting plate 3 do synchronous motion, when the servo motors 7 are started, the gears 14 on the driving shafts rotate along the racks 8 and are matched with the slide rails 15 of the slide blocks 16, and therefore the mounting plate 3 moves back and forth.
The utility model discloses a theory of operation does: the silicon carbide semiconductor is placed on the mounting plate 3, then the abutting air cylinders 9 on the two sides start to work, piston rods of the abutting air cylinders extend out and drive the clamping blocks 4 to be clamped on the two sides of the silicon carbide semiconductor, after the clamping work is finished, the servo motor 7 starts to work and drives the mounting plate 3 to move towards one side of the cutting mechanism 2, when the mounting plate 3 conveys the silicon carbide semiconductor to the lower side of the cutting knife 2b, the servo motor 7 stops working, the piston rods of the air cylinders 5 extend out and drive the cutting mechanism 2 to move downwards, meanwhile, the motor 2a starts and drives the cutting knife 2b to rotate, along with the downward movement of the cutting mechanism 2, the cutting knife 2b can be in contact with the silicon carbide semiconductor and carry out slicing work, after the cutting, the air cylinders 5 lift the cutting mechanism 2, in the lifting process, the air jet heads 6 spray air, so as to carry out slag removal work on the silicon carbide semiconductor clamped on the mounting plate 3, blow away the sweeps of its top and can avoid influencing the sliced precision next time, cutting mechanism 2 lifts the back, and servo motor 7 restarts again and takes mounting panel 3 to cutting knife 2b one side removal to compensate the piece position, cutting mechanism 2 repeats above-mentioned cutting work once more, thereby has accomplished silicon carbide semiconductor's section work.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (8)
1. The utility model provides a carborundum processing is with section device which characterized in that: the silicon carbide cutting device comprises a workbench, wherein a cutting mechanism capable of moving up and down is arranged on the workbench, a mounting plate capable of moving back and forth is arranged on the workbench at a position corresponding to one side of the cutting mechanism, and a clamping block for fixing silicon carbide is arranged on the mounting plate;
the cutting mechanism moves up and down under the driving of the cylinder, and air nozzles are arranged on the worktable at positions corresponding to the two sides of the cutting mechanism;
the mounting plate moves back and forth along the workbench under the driving of the matching of the servo motor and the rack, abutting cylinders are arranged on the left side and the right side of the mounting plate, piston rods of the abutting cylinders are arranged oppositely, and the clamping blocks are mounted on the piston rods of the abutting cylinders.
2. The slicing apparatus for processing silicon carbide according to claim 1, wherein: the U-shaped mounting frame is arranged on the workbench, the air cylinder is arranged at the top of the mounting frame, a piston rod of the air cylinder vertically penetrates through the mounting frame downwards, an installation platform is arranged at the end part of the piston rod, and the cutting mechanism and the jet head are both arranged on the installation platform.
3. The slicing apparatus for processing silicon carbide according to claim 2, wherein: the cutting mechanism comprises a motor fixedly arranged on the mounting table, a cutting knife is connected to the driving end of the motor after the driving end of the motor penetrates through the mounting table and the driving end of the motor, a protective cover is further arranged on the mounting table, and the protective cover is arranged on the upper portion of the cutting knife.
4. The slicing apparatus for silicon carbide processing according to claim 3, wherein: the mounting table is provided with supports corresponding to the positions of two sides of the cutting knife, the air nozzle is mounted on the supports, and the nozzles of the air nozzle are arranged downwards and face one side of the cutting knife.
5. The slicing apparatus for silicon carbide processing according to claim 4, wherein: a vertical guide rod is arranged in the mounting frame and penetrates through the mounting table.
6. The slicing apparatus for processing silicon carbide according to claim 1, wherein: the servo motor is installed the both sides of mounting panel, the rack is installed on the workstation and its position with servo motor is corresponding, and the one end that the servo motor drive shaft passed the mounting panel is provided with the gear with rack cooperation work.
7. The slicing apparatus for silicon carbide processing according to claim 6, wherein: the workbench is provided with a slide rail, and the bottom of the mounting plate is provided with a slide block matched with the slide rail for working.
8. The slicing apparatus for processing silicon carbide according to claim 7, wherein: vertical plates are arranged on two sides of the mounting plate, the abutting air cylinder is fixedly connected with the vertical plates, and a piston rod of the abutting air cylinder penetrates through the vertical plates and is fixedly connected with the clamping blocks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022852824.5U CN214644907U (en) | 2020-12-02 | 2020-12-02 | Silicon carbide processing is with section device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022852824.5U CN214644907U (en) | 2020-12-02 | 2020-12-02 | Silicon carbide processing is with section device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214644907U true CN214644907U (en) | 2021-11-09 |
Family
ID=78470451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022852824.5U Active CN214644907U (en) | 2020-12-02 | 2020-12-02 | Silicon carbide processing is with section device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214644907U (en) |
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2020
- 2020-12-02 CN CN202022852824.5U patent/CN214644907U/en active Active
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