CN214080919U - Grinding repair device and silicon rod processing equipment - Google Patents

Abstract

The application discloses grind prosthetic devices and silicon rod processing equipment, wherein, grind prosthetic devices including installation main part and an at least coping portion, an at least coping portion is located in the installation main part, be used for the coping to correspond at least one grinding tool utilizes being close to and the contact of the prosthetic devices's of grinding prosthetic devices and silicon rod processing equipment's grinding tool in order to realize the coping to grinding tool, and at this moment, steerable coping portion is along the reciprocating motion of predetermined direction and the rotation of the grinding tool that corresponds the contact is in order to improve coping efficiency, is favorable to silicon rod processing equipment to carry out subsequent polished surface operation to the silicon rod.

Description

Grinding repair device and silicon rod processing equipment

Technical Field

The application relates to the technical field of silicon workpiece processing, in particular to a grinding repair device and silicon rod processing equipment.

Background

At present, with the importance and the openness of the society on the utilization of green renewable energy sources, the field of photovoltaic solar power generation is more and more valued and developed. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are fabricated on high quality silicon wafers that are cut and subsequently processed by multi-wire saw from a pulled or cast silicon ingot.

In the conventional silicon wafer manufacturing process, taking a single crystal silicon product as an example, the general working procedures may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; after the truncation is finished, performing the operation of squaring the truncated short silicon rod by using a silicon rod squaring machine to form a single crystal silicon rod; then, processing operations such as surface grinding, chamfering and the like are carried out on each silicon rod, so that the surface of each silicon rod is shaped to meet the corresponding requirements on flatness and dimensional tolerance; and subsequently, slicing the silicon rod to obtain a silicon wafer.

In general, important factors determining the grinding accuracy include the condition of the surface of the grinding tool in the grinding apparatus such as the granularity, the perpendicularity of the plane, and the like, and in the grinding work accumulated on a daily basis, the gradual change in the surface condition of the grinding tool may cause the grinding performance to deteriorate, and therefore, the grinding tool needs to be dressed to ensure the grinding effect.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned drawbacks of the related art, an object of the present application is to provide a grinding repair device and a silicon rod processing apparatus, which are used for solving the problem existing in the prior art that the surface state of a grinding tool changes after a long-term grinding operation of the silicon rod processing apparatus, so as to cause the reduction of grinding performance.

In order to achieve the above and other related objects, a first aspect of the present application discloses a grinding repair device for use in a silicon rod processing apparatus including a grinding device having at least one grinding tool; the abrasive repair device includes: mounting the main body; the grinding part is arranged on the mounting main body and is used for grinding the corresponding at least one grinding tool.

In certain embodiments of the first aspect of the present application, the mounting body is disposed on a silicon rod clamp of the silicon rod processing apparatus, and the mounting body is driven by the silicon rod clamp to reciprocate along a predetermined direction.

In certain embodiments of the first aspect of the present application, the mounting body is provided on a base of the silicon rod processing apparatus, and the grinding repair device further includes a driving unit for driving the mounting body to reciprocate in a predetermined direction.

In certain embodiments of the first aspect of the present application, the abrasive repair device includes two thinning portions provided on opposite sides of the mounting body.

In certain embodiments of the first aspect of the present application, the thinning surface of the thinning portion is circular, annular, rectangular, or regular polygonal.

In certain embodiments of the first aspect of the present application, the thinning is an oilstone.

In certain embodiments of the first aspect of the present application, the abrasive repair device further comprises at least one sensing device disposed on the mounting body for detecting the at least one abrasive article.

In certain embodiments of the first aspect of the present application, the sensing device is a contact sensor or a ranging sensor.

In certain embodiments of the first aspect of the present application, the abrasive repair device further comprises a protective cover disposed over the sensor device for covering the sensor device in a closed state and exposing the sensor device in an open state.

The present application discloses in a second aspect a silicon rod processing apparatus comprising: a machine base; the grinding device is arranged on the stand; the grinding device is provided with at least one grinding tool and is used for grinding the silicon rod; an abrasive repair device as hereinbefore described.

In certain embodiments of the second aspect of the present application, the grinding apparatus further comprises: the grinding tool rotating mechanism is used for driving the at least one grinding tool to rotate; and the grinding tool advancing and retreating mechanism is used for driving the at least one grinding tool to move in at least one direction.

In certain embodiments of the second aspect of the present application, the silicon rod processing apparatus is a silicon rod grinder or a silicon rod slicing and grinding all-in-one machine.

The application discloses grinding prosthetic devices and silicon rod processing equipment has following beneficial effect: the repairing part of the grinding repairing device is close to and in contact with a grinding tool of the silicon rod processing equipment so as to realize the grinding of the grinding tool, at the moment, the reciprocating motion of the grinding part along the preset direction and the rotation of the grinding tool in corresponding contact can be controlled so as to improve the grinding efficiency, and the silicon rod processing equipment is favorable for carrying out subsequent surface grinding operation on the silicon rod.

Drawings

The specific features of the invention to which this application relates are set forth in the appended claims. The features and advantages of the invention to which this application relates will be better understood by reference to the exemplary embodiments described in detail below and the accompanying drawings. The brief description of the drawings is as follows:

fig. 1 is a schematic structural diagram of an abrasive repair device according to an embodiment of the present disclosure.

Fig. 2 is a schematic view showing the structure of a silicon rod processing apparatus according to the first embodiment of the present application.

Fig. 3 is a simplified schematic diagram of fig. 2.

Fig. 4 shows a schematic view of the configuration of a first silicon rod clamp or a second silicon rod clamp in the silicon rod processing apparatus of fig. 2.

Fig. 5 is a simplified schematic diagram of a portion of the silicon rod processing apparatus of fig. 2.

Fig. 6 is a schematic view showing the structure of a silicon rod processing apparatus according to the present application in a second embodiment.

FIG. 7 is a schematic view of the silicon rod holder and the polishing repair device mounted thereon in FIG. 6.

Fig. 8 is a schematic view showing the structure of a silicon rod processing apparatus according to the present application in a third embodiment.

FIG. 9 is a schematic view of the silicon rod holder and the polishing repair device disposed thereon shown in FIG. 8.

Fig. 10 and 11 show a fourth exemplary embodiment of a silicon rod processing apparatus according to the present application, fig. 10 shows a first exemplary configuration of the silicon rod processing apparatus, and fig. 11 shows a second exemplary configuration of the silicon rod processing apparatus.

FIG. 12 is a schematic view of the silicon rod holder of FIG. 11 with an abrasive repair device disposed thereon.

Fig. 13 is a schematic view showing the structure of a silicon rod processing apparatus according to the present application in a fifth embodiment.

Fig. 14 is a schematic view showing the structure of a silicon rod processing apparatus according to the present application in a sixth embodiment.

Fig. 15 is an enlarged schematic view of a portion a of fig. 14.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, several embodiments of the present application are described with reference to the accompanying drawings. It is to be understood that other embodiments may be utilized and mechanical composition, structure, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first transfer device may be referred to as a second transfer device, and similarly, the second transfer device may be referred to as a first transfer device, without departing from the scope of the various described embodiments. The first transfer device and the second transfer device are both described as one transfer device, but they are not the same transfer device unless the context clearly indicates otherwise. The similar situation also comprises a first transfer guide rail and a second transfer guide rail, a first processing area and a second processing area, a first driving mechanism and a second driving mechanism, a first silicon rod clamp and a second silicon rod clamp and the like.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

Crystalline silicon is usually processed into a silicon wafer form in industrial production and then used for product manufacturing, wherein originally obtained silicon rods comprise a monocrystalline silicon rod and a polycrystalline silicon rod, the monocrystalline silicon rod is a rod-shaped monocrystalline silicon grown from a melt by using a czochralski method or a suspension zone melting method, for example, a monocrystalline silicon rod with a length specification of 5000mm or 5360mm, or a monocrystalline silicon rod with a length of about 800mm, etc., which are commonly used in silicon rod processing, and the polycrystalline silicon is a silicon rod obtained by precipitating silicon on the surface of a silicon core wire by using a precipitation technology such as a chemical vapor deposition technology.

As described in the background art, in the conventional manufacturing process of silicon wafers, a polycrystalline silicon brittle material is generally pulled to form a single crystal silicon rod, and then a squarer is used to perform squaring; at the moment, the cutting mechanism feeds along the length direction of the silicon rod and cuts four planes which are parallel in pairs along the circumferential direction of the silicon rod, so that the cross section of the silicon rod is in a similar rectangle shape; after the cutting, all the side surfaces of the silicon rod with the rectangular-like cross section are ground and chamfered at the edges, and then the cut silicon rod is sliced along the length direction by a multi-line slicing machine to obtain the required silicon wafer.

Taking the silicon rod grinding operation as an example, the silicon rod can be ground by a grinding tool in the grinding device, for example, the silicon rod can be roughly ground and finely ground by a rough grinding tool and a fine grinding tool, the grinding tool of the silicon rod grinding machine is in a fatigue state during use, uneven wear of different areas of the surface of the grinding tool causes unevenness or reduction of flatness of the surface of the grinding tool, and the surface of the grinding tool may be contaminated with silicon rod scraps or tool scraps, so that the grinding operation is performed for a long time without changing the surface state of the grinding tool, and the grinding performance is reduced. The existing solution to this problem is mainly to modify the surface of the grinding tool with tools such as grindstones, or to replace the grinding tool after the grinding tool has reached the fatigue life; when a grinding stone is used for grinding a grinding tool, the surface of the grinding stone is not flat, so that the surface state of the grinding tool is still poor after grinding.

In view of the above, the present application discloses a grinding repair device and a silicon rod processing apparatus, wherein the grinding repair device may be applied to the silicon rod processing apparatus, the silicon rod processing apparatus includes a grinding device, the grinding device has at least one grinding tool, and the grinding repair device may be used to grind and repair the grinding tool, so as to ensure that the grinding tool may achieve a required precision after being used to grind a silicon rod. The grinding repair device comprises an installation body and at least one grinding portion, wherein the at least one grinding portion is arranged on the installation body, can control the at least one grinding portion to reciprocate along a preset direction and is used for grinding a grinding tool in contact under the reciprocating motion state, and the grinding effect of the grinding tool on subsequent grinding operation of the silicon rod is facilitated.

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The application discloses grinding prosthetic devices for grind the grinding apparatus in the silicon rod processing equipment who uses and repair. The grinding repair device of this application includes: the polishing device comprises a mounting main body and at least one polishing part.

Referring to fig. 1, a schematic structural diagram of a polishing repair apparatus according to an embodiment of the present disclosure is shown. As shown in fig. 1, the grinding repair device according to the present application is used in a silicon rod processing device, which comprises at least a grinding device 9 having at least one grinding tool 91. The grinding repair device can be used for grinding the grinding tool 91 in the silicon rod processing equipment.

The grinding repair device of this application includes: the grinding device comprises an installation main body and at least one grinding part, wherein the at least one grinding part is arranged on the installation main body and is used for grinding the corresponding at least one grinding tool.

In certain embodiments, the abrasive repair device is arranged on a silicon rod clamp of the silicon rod processing apparatus. As shown in fig. 1, the silicon rod processing apparatus comprises at least one silicon rod clamp 7, wherein the silicon rod clamp 7 is used for clamping a silicon rod 101 and moving the silicon rod 101 along a predetermined transfer guide rail with the clamped silicon rod to be transferred between different processing positions. The silicon rod clamp 7 may comprise a clamp arm mount 71, at least one pair of clamp arms 73, and a clamp arm driving mechanism (not identified in the drawings). The silicon rod clamp 7 is integrally provided with a clamping arm mounting seat arranged above, the clamping arm mounting seat comprises a clamping arm 73 at the outer part and is in a downward hanging state, and the clamping arm 73 is suspended and extended from the clamping arm mounting seat 71 below the hollow part of the mounting frame, so that the silicon rod 101 clamped by the clamping arm 73 is positioned on the processing surface of the silicon rod processing platform.

The grinding repair device is arranged on at least one clamping arm of the silicon rod clamp, namely, at least one grinding repair device can be arranged on the silicon rod clamp. As shown in fig. 1, a grinding and repairing device is arranged on one of the clamping arms 73 of the silicon rod clamp 7, i.e., an installation body 801 of the grinding and repairing device is arranged on one of the clamping arms 73 of the silicon rod clamp 7, and a thinning portion 803 of the grinding and repairing device is arranged on one side of the installation body 801 facing the grinding tool.

In some embodiments, the grinding device comprises a grinding tool, and the grinding repair device comprises a grinding portion disposed on the mounting body and facing the grinding tool. In some embodiments, the grinding device includes two grinding tools disposed oppositely, and the grinding repair device includes two thinning portions disposed at opposite sides of the mounting body and facing the corresponding grinding tools respectively. As shown in fig. 1, the grinding repair device includes an installation body 801 and two thinning portions 803 disposed at two opposite sides of the installation body 801, and the installation body 801 and the thinning portions 803 thereon reciprocate in a predetermined direction by being driven by corresponding silicon rod clamps.

The grinding and repairing device is not limited to the structure shown in fig. 1, and in other embodiments, an installation body of the grinding and repairing device may be disposed on a base of the silicon rod processing equipment, a thinning portion of the grinding and repairing device may be disposed on the installation body, and the grinding and repairing device may further include a driving unit for driving the installation body and the thinning portion thereon to reciprocate in a predetermined direction.

Returning to fig. 1, in the embodiment shown in fig. 1, the grinding repair device includes two grinding portions 803 respectively located at two opposite sides of the mounting body 801, and in this arrangement, the grinding repair device can be used to simultaneously grind two grinding tools 91 in the grinding device 9 (e.g., two rough grinding tools in a rough grinding device or two finish grinding tools in a finish grinding device).

Taking a fine grinding device as an example, the fine grinding device comprises a pair of fine grinding tools, the pair of fine grinding tools arranged oppositely is moved to the outer sides of the two thinning parts 803, the silicon rod clamp 7 is driven to move along the preset direction, so that the two thinning parts 803 on the two sides of the mounting body 801 reciprocate along the preset direction, and in this state, the pair of fine grinding tools in the fine grinding device can be relatively close to the thinning parts 803 to be in contact with the surface of the thinning parts 803, so as to realize grinding.

In general, in the silicon rod grinding operation, in order to grind the side surface of the silicon rod, correspondingly, the grinding tools (e.g., two rough grinding tools in the rough grinding device or two finish grinding tools in the finish grinding device) are materials having certain hardness, such as grinding wheels, which are formed by consolidating abrasive grains and a binder, and form a surface having abrasive grains for contacting with the surface of the silicon rod to be ground and grinding the silicon rod. The grinding wheel has certain abrasive particle size and abrasive particle density, and the abrasive material of the grinding wheel can be set into abrasive particles with hardness higher than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride and the like according to the requirement of grinding a silicon rod. In some examples, the grinding repair device may further include sharpening portions 803 with different granularities, which are respectively used for grinding different types of grinding tools 91 in the grinding device, such as a rough grinding tool and a finish grinding tool.

Here, the grinding portion 803 of the grinding repair device has a surface for contacting the at least one grinding tool 91 (e.g., a rough grinding tool in a rough grinding device or a finish grinding tool in a finish grinding device), and in some embodiments, the grinding portion 803 has high adhesion, wear resistance, and hardness as a whole for grinding the grinding tool 91 (e.g., a rough grinding tool in a rough grinding device or a finish grinding tool in a finish grinding device).

In certain embodiments, the thinning 803 is an oilstone. Here, the oilstone is, for example, diamond oilstone, boron carbide oilstone, fine-ground oilstone, general oilstone, or the like. The oilstone may effect a modification of the surface of the grinding tool contacted by the oilstone by virtue of the particle size of the surface. In the coping process, the surface of the oilstone contacts the grinding tool, the surface of the grinding tool is trimmed to be uniform granularity, and the flatness and the verticality of the plane of the grinding tool are improved.

In some embodiments, when the at least one grinding portion 803 grinds the corresponding at least one grinding tool 91, the at least one grinding tool 91 is driven by a driving motor to rotate.

Compared with the traditional grinding mode, the grinding tool is usually contacted with a grinding device such as an oilstone to realize grinding in a rotating state, so that the surface of the oilstone has high and low points, and the flatness of the surface of the grinding tool after the grinding is finished is not good; in the embodiment provided by the present application, in the grinding and repairing device of the present application, the grinding portion 803, for example, the oilstone, is ground in a reciprocating motion, the plane formed by the oilstone in the reciprocating motion is different from the plane of the oilstone in a static state, and the surface of the oilstone (i.e., the plane for grinding) has no height point in the reciprocating motion, so that the surface of the grinding tool 91 can be leveled, and the grinding quality can be improved; moreover, the grinding efficiency is related to the rotation speed of the workpieces during grinding, and the reciprocating motion state of the thinning part 803 corresponds to the rotation state of the grinding tool 91, so that relative motion is generated between the grinding tool 91 and the thinning part 803, which is beneficial to realizing the grinding process and improving the grinding efficiency.

In some embodiments, the grinding surface of the grinding portion 803 is rectangular, circular, oval, annular, regular polygon or other customized shapes, and it should be understood that the grinding and repairing can be realized only when the grinding portion is made of a predetermined material meeting the grinding requirement and can realize surface contact with the grinding tool, and the above shapes are only optional examples, and the present application is not limited thereto.

In some embodiments, the abrasive repair device further comprises a sensing device disposed on the base for detecting the abrasive article of the abrasive device.

The grinding repair device is intended to repair a grinding surface of a grinding tool, and after the grinding repair is performed through a grinding portion, a surface layer of the grinding tool is ground and removed. In the subsequent surface grinding of the silicon rod, the silicon rod side is ground with a new grinding surface. It should be noted here that in the operation of grinding the silicon rod, it is necessary to control the grinding amount of the silicon rod, which may be predetermined based on the specification of the grinding device and the specification of the silicon rod, for example, the grinding tool may be generally moved in a feeding manner with respect to the silicon rod in the grinding device, and the initial position of the grinding surface of the grinding tool may be set as a known input value (or calculated from a plurality of input values) in the control system of the grinding device, whereby the feeding of the grinding tool with respect to the silicon rod may be controlled based on the preset grinding amount. However, after the grinding tool is ground by the grinding repair device, the initial position of the grinding surface is changed, so that the grinding device needs to know the specification of the grinding tool in grinding repair, so as to correct the actual position of the grinding surface, thereby controlling the grinding amount of the silicon rod according to a preset value in subsequent processing.

Here, the sensor device in the grinding repair apparatus of the example of the present application may be used to determine the size (mainly, the thickness) of the grinding tool after the grinding repair is completed. The sensing device can determine the size of the ground grinding tool after grinding by determining the distance between the sensor and the grinding surface or the distance between two grinding surfaces of a pair of grinding tools arranged oppositely, so that the silicon rod grinding machine can perform subsequent surface grinding operation on the silicon rod.

As shown in fig. 1, the sensing device is a touch sensor 805, the touch sensor 805 having a probe head for contacting the abrading surface. In a practical scenario, the grinding wheel 91 of the grinding device 9 may be moved relative to the thinning portion 803, and the feeding movement may be driven by a servo motor, for example, where the servo motor may control the feeding amount of the grinding wheel 91, but in the grinding and repairing process, the feeding amount determined by the servo motor control is not equal to the layer thickness of the grinding wheel 91 ground in the thinning process, or it may be understood that an accurate grinding amount of the grinding and repairing process cannot be obtained by the feeding control device of the grinding wheel 91, that is, an actual size specification of the grinding wheel 91 needs to be obtained through measurement.

In the case where the grinding and repairing apparatus is provided with two opposite thinning portions 803, the contact sensor 805 may be provided with a probe at each end thereof to contact two opposite grinding surfaces of the pair of grinding wheels 91. A touch sensor 805 may be provided on the mounting body 801. In the measuring process, the grinding tool 91 can be driven by the servo motor to approach the detection heads, the contact sensor 805 can acquire and record the distance between the detection heads at the two ends, the grinding tool 91 stops moving and records the position data of the servo motor when contacting the detection heads, the size of the grinding tool 91 after grinding and repairing can be determined again based on the position data of the servo motor and the detection head data of the contact sensor 805, and the grinding device 9 can use the size of the grinding tool 91 determined by measurement as input data in the control system.

In some examples, the probe of the touch sensor 805 is further provided with a retractable spring, and when the probe contacts an object, the retractable spring can be retracted under the driving of the retractable spring, so that the probe can be protected and the probe can be prevented from being damaged by touching.

In some examples, the sensing device may be configured as a probe-type displacement sensor.

In some embodiments, the sensing device may be a distance measuring sensor, and the distance detecting direction of the distance measuring sensor may be set to be parallel to the rotation axis (i.e. perpendicular to the grinding surface of the grinding tool), so as to obtain the specification of the grinding tool after grinding and repairing, and the distance measuring sensor may be, for example, an infrared distance measuring sensor, a laser distance sensor, an ultrasonic sensor, a radar sensor, or the like.

In some embodiments, the abrasive repair device includes a protective cover disposed over the sensing device for covering the sensing device in a closed state and exposing the sensing device in an open state.

The accommodating space of the protective cover groove body only needs to be used for completely covering and protecting the sensing device, and under the condition that the requirement is met, the groove body of the protective cover can be set to be in different shapes, for example, the section of the protective cover is in a convex shape, and the sensing device is covered on the long edge of the convex groove body; of course, in other realizable manners, the protective cover slot body may also be set to be rectangular, trapezoidal, and the like, which is not limited in the present application.

In one implementation, the protective cover further includes a lifting driving device (not shown) for controlling the groove body of the protective cover to move up and down along the guide post, so as to switch the protective cover or the exposure state of the sensor device. When the grinding part carries out grinding and repairing operation, the protective cover is attached to the bearing surface of the upper surface of the mounting main body, and after the grinding and repairing are completed, the protective cover groove body is driven by the lifting driving device to ascend relative to the mounting main body so that the sensing device is exposed in the external space.

In some embodiments, the bottom of the protective cover tank structure is combined with the bearing surface through a magnetic adsorption piece, for example, magnetic adsorption materials are arranged at the opening of the bearing surface and the tank structure to form the magnetic adsorption piece, and when the protective cover needs to be opened, the attraction between the magnetic adsorption pieces is overcome by the lifting driving device; in another embodiment, the protective cover is combined with the bearing surface through a buckle, the buckle can be arranged on the bearing surface or the protective cover, and when the protective cover needs to be opened, a certain separating force is applied to the buckle to enable the buckle to be converted from a connection state to a disconnection state, so that the protective cover can be driven by the lifting driving device to move up and down.

In some embodiments, the shield may be mounted on the bearing surface via a shaft (not shown), and in the closed position, the shield may be in close contact with the bearing surface, and in the event that a measurement is to be taken using the sensor device, the shield may be rotated about the shaft to achieve the open position.

Generally, the sensing device has high precision, and equipment maintenance is required to avoid damaging the sensing device and damaging the precision. By arranging the protective cover, the sensing device can be effectively maintained only by being exposed to the external space when measurement is needed. In addition, in some examples, when the grinding repair device grinds the grinding tool, the temperature of the contact surface between the grinding portion and the grinding tool is increased, and both the grinding portion and the surface of the grinding tool may be damaged by high temperature, so that the cooling liquid needs to be sprayed to cool the surface of the grinding tool.

Here, the grinding prosthetic devices that this application provided, including installation main part and at least one coping portion, at least one coping portion is located on the installation main part for the coping corresponds at least one grinding tool utilizes being close to and the contact of the prosthetic devices's of grinding prosthetic devices and the grinding tool of silicon rod processing equipment in order to realize the coping to grinding tool, and at this moment, steerable coping portion is along the reciprocating motion of predetermined direction and the rotation of the grinding tool that corresponds the contact in order to improve coping efficiency, is favorable to silicon rod processing equipment to carry out subsequent polished surface operation to the silicon rod.

The application also discloses silicon rod processing equipment for carry out the processing operation to the silicon rod, include: a machine base; the grinding device is arranged on the stand; the grinding device is provided with at least one grinding tool and is used for grinding the silicon rod; and the grinding repair device is used for grinding at least one grinding tool in the grinding device.

In certain embodiments of the present application, the silicon rod processing apparatus is a silicon rod grinding machine comprising a grinding device for grinding silicon rods. In some embodiments, the silicon rod processing equipment is a silicon rod cutting and grinding all-in-one machine, and comprises a cutting device and a grinding device, wherein the cutting device is used for performing cutting operation on the silicon rod to cut the silicon rod with a circular cross section into the silicon rod with a rectangular or quasi-rectangular cross section, and the grinding device is used for grinding the silicon rod.

In certain embodiments of the present application, the silicon rod processing apparatus may, for example, be a single-pass processing apparatus, i.e. the silicon rod processing apparatus comprises a transfer device and at least one silicon rod processing device. The transfer device includes: the silicon rod clamping device comprises a silicon rod clamp, a transfer guide rail arranged along the transfer direction, and a driving mechanism used for driving the silicon rod clamp and a silicon rod clamped by the silicon rod clamp to move along the transfer guide rail, wherein the clamping center of the silicon rod clamp corresponds to a preset central line. The at least one silicon rod processing device can be, for example, a grinding device, a cutting device and a grinding device arranged in the front and back, or a rough grinding device and an accurate grinding device arranged in the front and back, wherein the grinding device can be a rough grinding device, an accurate grinding device or a rough accurate grinding device, the rough grinding device is used for rough grinding operation of the silicon rod clamped by the silicon rod clamp, the accurate grinding device is used for accurate grinding operation of the silicon rod clamped by the silicon rod clamp, the rough accurate grinding device is used for rough grinding operation and accurate grinding operation of the silicon rod clamped by the silicon rod clamp, and the cutting device is used for cutting operation of the silicon rod opening clamped by the silicon rod clamp.

In certain embodiments of the present application, the silicon rod processing apparatus may, for example, be a multi-channel processing apparatus, i.e. the silicon rod processing apparatus comprises at least two transfer devices and at least two silicon rod processing devices.

Taking the silicon rod processing device as a dual-channel processing device as an example, the silicon rod processing device comprises a first transfer device and a second transfer device. The first transfer device comprises a first silicon rod clamp, a first transfer guide rail arranged along the transfer direction, and a first driving mechanism used for driving the first silicon rod clamp and a silicon rod clamped by the first silicon rod clamp to move along the first transfer guide rail, wherein the clamping center of the first silicon rod clamp corresponds to a preset central line. The second transfer device comprises a second silicon rod clamp, a second transfer guide rail arranged along the transfer direction, and a second driving mechanism used for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp to move along the second transfer guide rail, wherein the clamping center of the second silicon rod clamp corresponds to the preset central line.

With regard to the silicon rod processing device, in certain embodiments, the silicon rod processing device comprises a rough grinding device for rough grinding the silicon rod held by the first silicon rod clamp in the first transfer device or the silicon rod held by the second silicon rod clamp in the second transfer device, and a fine grinding device for fine grinding the silicon rod held by the first silicon rod clamp in the first transfer device or the silicon rod held by the second silicon rod clamp in the second transfer device.

In the embodiment that the silicon rod processing equipment comprises the rough grinding device and the accurate grinding device, the first transfer device, the second transfer device, the rough grinding device and the accurate grinding device are matched for operation to finish loading, rough grinding operation and accurate grinding operation of the silicon rod to be processed, so that the rough grinding device and the accurate grinding device are both in a working state at the same moment, the silicon rod grinding integrated operation is finished, and the silicon rod grinding operation efficiency is greatly improved.

In some embodiments, the silicon rod processing apparatus comprises a cutting device and a grinding device, wherein the cutting device is used for performing an open cutting operation on a silicon rod held by a first silicon rod clamp in the first transfer device or a silicon rod held by a second silicon rod clamp in the second transfer device, and the grinding device is used for performing a grinding operation on a silicon rod held by a first silicon rod clamp in the first transfer device or a silicon rod held by a second silicon rod clamp in the second transfer device.

In the embodiment that the silicon rod processing equipment comprises the cutting device and the grinding device, the first transfer device, the second transfer device, the cutting device and the grinding device are matched to complete loading, cutting and grinding operations of the silicon rod to be processed, so that the cutting device and the grinding device are in working states at the same moment, and the silicon rod processing operation efficiency is greatly improved.

In certain embodiments, the rough grinding apparatus comprises: at least one pair of rough grinding tools, which are arranged oppositely in the feeding direction, and the grinding surfaces of the rough grinding tools are positioned in opposite plumb line direction surfaces; and the rough grinding tool advancing and retreating mechanism is used for driving at least one rough grinding tool in the at least one pair of rough grinding tools to move along the feeding direction so as to switch positions between the first transfer guide rail and the second transfer guide rail. The refining apparatus comprises: at least one pair of finish grinding tools disposed in opposition in a feed direction, the grinding surfaces of the at least one pair of finish grinding tools being located in opposing plumb line direction planes; a finish grinder advancing and retreating mechanism for driving at least one finish grinder of the at least one pair of finish grinders to move in the feed direction to switch positions between the first transfer rail and the second transfer rail.

In certain embodiments, the rough grinding apparatus comprises: at least one pair of rough grinding tools which are oppositely arranged in the direction of the plumb line, and the grinding surfaces of the at least one pair of rough grinding tools are positioned in opposite horizontal planes; and the rough grinding tool switching mechanism is used for driving the at least one pair of rough grinding tools to switch positions between the first transfer guide rail and the second transfer guide rail. The refining apparatus comprises: at least one pair of finish grinding tools arranged in opposite directions in the direction of the plumb line, the grinding surfaces of the at least one pair of finish grinding tools being located in opposite horizontal planes; a refiner grinding tool switching mechanism for driving the at least one pair of refiner grinding tools to switch positions between the first transfer rail and the second transfer rail.

In certain embodiments, the rough grinding apparatus comprises: at least one pair of rough grinding tools which are oppositely arranged in the direction of the plumb line, and the grinding surfaces of the at least one pair of rough grinding tools are positioned in opposite horizontal planes; the refining apparatus comprises: at least one pair of finish grinding tools arranged in opposite directions in the direction of the plumb line, the grinding surfaces of the at least one pair of finish grinding tools being located in opposite horizontal planes; the silicon rod processing equipment further comprises a grinding tool switching mechanism which is connected with the coarse grinding device and the fine grinding device and used for driving the coarse grinding device and the fine grinding device to switch positions between the first transfer guide rail and the second transfer guide rail.

The grinding repair device comprises an installation main body and at least one grinding part, wherein the at least one grinding part is arranged on the installation main body, can control the at least one grinding part to reciprocate along a preset direction and is used for grinding a grinding tool in contact under the reciprocating motion state, and the grinding effect of the grinding tool on the subsequent surface grinding operation of the silicon rod is facilitated.

In any embodiment provided by the present application, the end surfaces of the silicon rod refer to two opposite surfaces in the direction of the length of the silicon rod, for example, the two end surfaces of the silicon rod to be cut are circular or quasi-circular, and the side surface of the silicon rod is an arc surface; the cut silicon rod has a rectangular or quasi-rectangular shape at its two ends, i.e. four sides of the silicon rod in the longitudinal direction, which are generally rectangular.

The base serves as a main body part of the silicon rod processing equipment and is used for providing a silicon rod processing platform, and in one example, the size and the weight of the base are large so as to provide a larger mounting surface and firmer overall stability. It should be understood that the machine base can serve as a base for different structures or components of the silicon rod processing device for carrying out processing operations, and the specific structure of the machine base can be changed based on different functional or structural requirements. In some examples, the machine base comprises a fixing structure or a limiting structure, such as a base, a rod body, a column body, a frame body and the like, for receiving different parts in the silicon rod processing equipment.

Meanwhile, in some examples, the base may be an integrated base, and in other examples, the base may include a plurality of independent bases.

The machine base of the silicon rod processing equipment is provided with a silicon rod processing platform, a grinding device for processing, such as grinding, the silicon rod can be arranged on the silicon rod processing platform, and the silicon rod can be conveyed to a waiting position corresponding to the silicon rod processing device through a silicon rod loading device, so that the silicon rod processing device can carry out processing operation. The shape of the silicon rod processing platform can be determined according to the machine base or can be determined according to the processing requirements of the machine base and the silicon rod processing device.

Referring to fig. 2 and fig. 3, fig. 2 is a schematic view showing a structure of the grinding repair device applied to a silicon rod processing apparatus according to a first embodiment of the present invention, and fig. 3 is a simplified schematic view of fig. 2.

In the embodiment provided by the present application, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, where the first direction, the second direction, and the third direction are all linear directions and are mutually perpendicular to each other two by two, in the embodiment shown in fig. 2, the X axis of the graphic coordinate axis is the first direction, the Y axis of the graphic coordinate axis is the second direction, and the Z axis of the graphic coordinate axis is the third direction.

In the embodiment shown in fig. 2 and 3, the silicon rod processing apparatus is a silicon rod grinding machine, and the silicon rod 101 with a rectangular-like (including square-like) cross section is ground. In certain embodiments, the silicon rod grinder is a dual channel silicon rod grinder, i.e. the silicon rod grinder comprises at least two transfer devices and at least two silicon rod processing devices.

The silicon rod grinding machine comprises a first transfer device and a second transfer device, wherein the first transfer device comprises a first silicon rod clamp, a first transfer guide rail arranged along the transfer direction, and a first driving mechanism used for driving the first silicon rod clamp and a silicon rod clamped by the first silicon rod clamp to move along the first transfer guide rail, and the clamping center of the first silicon rod clamp corresponds to a preset central line. The second transfer device comprises a second silicon rod clamp, a second transfer guide rail arranged along the transfer direction, and a second driving mechanism used for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp to move along the second transfer guide rail, wherein the clamping center of the second silicon rod clamp corresponds to the preset central line.

The silicon rod grinding machine comprises a rough grinding device and a fine grinding device, wherein the rough grinding device is used for conducting rough grinding operation on a silicon rod clamped by a first silicon rod clamp in the first transfer device or a silicon rod clamped by a second silicon rod clamp in the second transfer device, and the fine grinding device is used for conducting fine grinding operation on the silicon rod clamped by the first silicon rod clamp in the first transfer device or the silicon rod clamped by the second silicon rod clamp in the second transfer device.

As shown in fig. 2 and 3, the silicon rod grinder includes: comprises a machine base 11, a first transfer device 31, a second transfer device 41, a rough grinding device 51 and a fine grinding device 61.

As shown in fig. 2 and 3, the base 11 has a silicon rod processing platform, the first processing location and the second processing location are disposed in parallel at the front and rear positions of the silicon rod processing platform, and the first processing location and the second processing location are independent from each other, so that the corresponding silicon rods to be processed can be processed in the first processing location and the second processing location respectively and independently.

The first transfer device 31 and the second transfer device 41 are arranged above the silicon rod processing platform through an installation frame, the installation frame is arranged on the base 11 and is of a vertical frame structure, and the upper surface of the frame is higher than the silicon rod processing platform and bears the first transfer device 31 and the second transfer device 41. In an embodiment of the present application, as shown in fig. 2, the first transfer device 31 and the second transfer device 41 are disposed in parallel on the left and right sides of the mounting frame. The supporting structure of the mounting frame is arranged on the upper surface of the machine base 11, in the illustrated embodiment, the upper surface of the machine base 11 is rectangular, the supporting structure of the mounting frame is arranged on the outer edge of the rectangle, and the shape and the size of the upper surface of the mounting frame are approximately the same as those of the upper surface of the machine base 11.

With regard to the first transfer device, in the present application the first transfer device comprises a first silicon rod clamp, a first transfer rail arranged in the transfer direction, and a first drive mechanism. The first silicon rod clamp is used for clamping a silicon rod, and the silicon rod is clamped by the first silicon rod clamp and then is horizontal, namely, the axis of the silicon rod is clamped in a mode that the axis of the silicon rod is consistent with the first direction. In this embodiment, the centre of grip of the first silicon rod clamp is aligned with the predetermined centre line, i.e. the centre of grip of the first silicon rod clamp is aligned with the axis of the silicon rod. The first transfer driving mechanism is used for driving the first silicon rod clamp and the silicon rods clamped by the first silicon rod clamp to move along a first direction and transfer among the waiting area, the first processing area and the second processing area.

In certain embodiments, the first transfer device comprises a first silicon rod clamp, a first transfer rail, and a first drive mechanism. The first silicon rod clamp is borne on the first transfer guide rail, the first transfer guide rail is arranged on the upper surface of the mounting frame and arranged along a first direction, and the first silicon rod clamp on the first transfer guide rail is limited to move along the first direction. The first driving mechanism is used for driving the first silicon rod clamp and the silicon rod clamped by the first silicon rod clamp to move along the first transfer guide rail, and the first silicon rod clamp is enabled to be transferred between the first processing area and the second processing area.

The first silicon rod clamp comprises a first clamping arm mounting seat, at least one pair of first clamping arms are arranged on the first clamping arm mounting seat in an opposite mode along a first direction and used for clamping two end faces of a silicon rod, and at least one first clamping arm in the at least one pair of first clamping arms can move along the first direction through a first clamping arm driving mechanism so as to adjust a clamping distance between the at least one pair of first clamping arms.

Referring to fig. 4, a schematic view of a first silicon rod clamp or a second silicon rod clamp of the silicon rod processing apparatus of fig. 2 is shown. In certain embodiments of the present application, taking a first silicon rod clamp as an example, as shown in fig. 4, the first silicon rod clamp 310 comprises a first clamp arm mount 311, at least one pair of first clamp arms 313, and a first clamp arm driving mechanism (not shown in the drawings). The first silicon rod clamp 310 is integrally formed by arranging a first clamping arm mounting seat 311 above, wherein the first clamping arm mounting seat 311 comprises a first clamping arm 313 at the outer part thereof and is in a downward hanging state, the first clamping arm mounting seat 311 is mounted on the mounting frame, and the first clamping arm 313 is suspended and extended from the hollow part of the mounting frame where the first clamping arm mounting seat 311 is located, so that the silicon rod clamped by the first clamping arm 313 is located on the processing surface of the silicon rod processing platform.

The first clamping arm mounting seat is arranged on a first transfer guide rail, in an implementation manner of this embodiment, a guide groove structure matched with the first transfer guide rail is arranged at the bottom of the first clamping arm mounting seat, the first transfer guide rail is arranged along a first direction, and the length range of the first transfer guide rail in the first direction at least covers the positions of the first working area and the second working area in the first direction, so as to ensure that the silicon rod clamped by the first silicon rod clamp is transferred between the two working areas. In one implementation of this embodiment, the first transfer rail is disposed across a full length of the mounting frame in the first direction.

The first clamping arm mounting seat is further provided with a first guide structure along the first direction, and the at least one pair of first clamping arms are arranged on the first clamping arm mounting seat through the first guide structure and can move in the first direction. In practical applications, the first guide structure may be, for example, a first clamp arm guide rail, a first clamp arm guide groove, or a first clamp arm guide rod.

The at least one pair of first clamping arms are arranged oppositely along the first direction and used for clamping two end faces of the silicon rod.

For the silicon rod to be ground, the silicon rod is a cuboid structure (the cross section of the silicon rod is rectangular or similar to rectangular) with a certain length, the length direction of the silicon rod is placed along a first direction, and the end faces are the cross sections of two ends in the length direction.

The first clamping arm is drooping from the first clamping arm mounting seat, and a clamping part is arranged below the first clamping arm and used for directly contacting and clamping the silicon rod. As shown in fig. 4, one end of the first clamping arm 313 is connected to the first clamping arm mounting seat 311, and the other end of the first clamping arm 313 is connected to a clamping portion 314 for contacting an end surface of a silicon rod. The first clamping arm mounting seat 311 is movably disposed on the first transfer rail and is driven by the first transfer driving unit to move along the first transfer rail, so as to drive the first clamping arm 313 to move along the first transfer rail.

The first silicon rod clamp further comprises a first clamping arm driving mechanism, wherein the first clamping arm driving mechanism can drive at least one first clamping arm of the at least one pair of first clamping arms to move along the first direction so as to adjust the clamping distance between the pair of oppositely arranged first clamping arms, so that the clamping parts of the at least one pair of first clamping arms can approach or separate from each other under the action of the first clamping arm driving mechanism, and the silicon rod is clamped or released. For example, the clamping portions of two first clamping arms oppositely arranged along the first direction are driven by the first clamping arm driving mechanism to be relatively close to and clamp the silicon rod, the silicon rod is transferred among different working areas and is processed in a clamping state, and after the processing operation is finished, the silicon rod is transferred to the bearing position and then is driven by the first clamping arm driving mechanism to be mutually far away so as to release the processed silicon rod.

In certain embodiments of the present application, the first clamp arm drive mechanism includes a drive motor, a drive gear, and a pair of racks. The driving motor drives the gear to rotate, the pair of racks is meshed with two opposite ends of the driving gear, and when the driving gear rotates, the pair of racks are driven to be close to or far away from each other under the driving of linear speeds in opposite directions of two ends of the gear.

In certain embodiments of the present application, the first clamp arm driving mechanism includes a lead screw disposed in a first direction and associated with any one of the pair of first clamp arms, and a driving source connected to the lead screw for driving the lead screw to rotate so that the associated first clamp arm moves in the first direction.

In certain embodiments of the present application, the first clamp arm drive mechanism comprises: the two-way screw rod is arranged along the first direction, and two ends of the two-way screw rod are in threaded connection with the at least one pair of first clamping arms; the driving source is used for driving the screw rod to rotate so that the at least one pair of first clamping arms move towards or away from each other along the first direction.

In an embodiment of the present application, the first clamp arm is of a rotary type, for example, the first silicon rod clamp further comprises a first clamp arm rotating mechanism for driving the first clamp arm to rotate. In an implementation manner of this embodiment, any one clamping portion of the at least one pair of first clamping arms or two clamping portions of the pair of first clamping arms is provided with a rotatable structure, and the clamping portion of the first clamping arm is driven by the first clamping arm rotating mechanism to rotate around the longitudinal direction of the silicon rod, i.e., the first direction, as an axis, so that the clamped silicon rod correspondingly rotates around the first direction as an axis. For example, in some examples, the first clamping arm rotating mechanism may be, for example, a rotating motor, the clamping portions of two first clamping arms in the pair of first clamping arms are both provided with a rotatable structure, and the clamping portion of the two first clamping arms or the clamping portion of one of the two first clamping arms is connected to an output shaft of the rotating motor, for example, the clamping portions of the two first clamping arms are respectively connected to a rotating motor, and the two rotating motors respectively drive the clamping portion of the corresponding first clamping arm to rotate, or the clamping portion of one of the first clamping arms is connected to a rotating motor, and the rotating motor drives the clamping portion of the corresponding one of the first clamping arms to rotate, and the clamping portion of the other first clamping arm is also driven to rotate along with the force of friction through the conduction of the clamped silicon rod.

In certain embodiments of this embodiment, the clamping portions of the at least one pair of first clamping arms have contact surfaces for clamping the silicon rod. When the clamping ends of the silicon rod are at both end surfaces at both ends of the elongated structure, the contact surface of the clamping portion may be set to a contact surface in a direction of a plumb line or a contact surface including a plane in a direction of a plumb line.

In an embodiment of the present application, the rotatable platform may be configured as a whole hinged by a hinge device with a locking function, and may rotate along an axis in a first direction. The axis of the rotating shaft is connected with the first clamping arm rotating mechanism.

In an embodiment of the application, the clamping portion of the first clamping arm may be configured as a rotatable circular truncated cone, and a circular plane of the circular truncated cone contacts with the end surface of the silicon rod and remains relatively stationary with the end surface of the silicon rod after clinging to the end surface of the silicon rod. The clamping part also comprises a locking structure, and the clamping part is in a locking state when the silicon rod is subjected to corresponding processing operation (the processing operation can be surface grinding, chamfering and the like). In the switching of the silicon rod, for example, in the switching of the grinding surface, the clamping part is driven by the first clamping arm rotating mechanism to rotate along the circle center of the circular truncated cone.

In one embodiment, the clamping portion of the first clamping arm includes a rotatable circular table and a series of protruding contacts disposed on the circular table, each of the contacts having a contact plane. The round platform is driven by the first clamping arm rotating mechanism to rotate, in an implementation mode of the embodiment, the protruding length of the contact is adjustable in the position of the first direction, so that in the process of clamping the silicon rod, the protruding length of the contact can be adjusted according to the end face of the silicon rod for the silicon rod with lower end face flatness, and each contact face and the end face of the silicon rod are in a tight state. The protruding length is a length in a first direction from a circular plane of the circular truncated cone to a contact plane of the contact. In the embodiment shown in fig. 4, the clamping portion 314 of the first clamping arm 313 is a rotatable circular table, and a series of protruding contacts 3141 are arranged on the circular table.

In an embodiment of the present application, the clamping portion of the first silicon rod clamp is provided with a pressure sensor to adjust a protruding length of a contact based on the detected pressure state. In general, during the silicon rod clamping process, a pair of first clamping arms of the first silicon rod clamp are driven by a first clamping arm driving mechanism to approach each other along a first direction until a contact surface of the clamping portion contacts with an end surface of a silicon rod to be clamped, and when the clamping portion is provided with a plurality of contact points and a pressure value of partial contact points contacting with the end surface of the contacted silicon rod is detected to be less than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contact points (generally towards the approach direction of the end surface of the silicon rod); or each clamping portion of the pair of first clamping arms of the first silicon rod clamp is provided with a contact surface, in the process of clamping the silicon rod, the first clamping arm driving mechanism drives the end surfaces, facing the two ends of the silicon rod, of the pair of first clamping arms to approach each other so as to realize the purpose, after the clamping portions contact the end surfaces of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the first clamping arm driving mechanism controls and stops the opposite movement of the pair of first clamping arms.

The first clamping arm rotating mechanism can be arranged on one first clamping arm in the pair of first clamping arms (the other first clamping arm only has a rotating function) so as to drive the clamping parts of the pair of first clamping arms and the clamped silicon rod to rotate; or the first clamping arm rotating mechanism is arranged on each first clamping arm of the pair of first clamping arms and controls the two clamping parts of the pair of first clamping arms to rotate in the same angle and direction in a coordinated motion mode. In some implementations, the first clamp arm rotation mechanism can be configured as a drive motor.

When the silicon rod is ground by the rough grinding device or the fine grinding device, the clamping part can be driven to rotate by the first clamping arm rotating mechanism so as to realize the purpose. When the silicon rod is ground, the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90 degrees, so that one side surface or two opposite side surfaces of the silicon rod can be ground by the rough grinding device or the fine grinding device.

When different side surfaces of the silicon rod are ground or edges are chamfered by the rough grinding device or the fine grinding device, the clamping part is driven to rotate by the first clamping arm rotating mechanism so as to realize the grinding. Generally, when different sides of the cut single crystal silicon rod are ground, the first clamping arm rotating mechanism controls the clamping part to rotate by a certain angle, such as 90 degrees, and when different edges are chamfered, the first clamping arm rotating mechanism can control the clamping part to rotate by a certain angle, such as 45 degrees and 135 degrees. Under the condition that the grinding surface provided by the rough grinding device or the fine grinding device is a plane, when chamfering is carried out on the silicon rod, the first clamping arm rotating mechanism can control the clamping part to rotate for different angles with the silicon rod clamped by the clamping part, so that chamfering is carried out for multiple times, for example, after the silicon rod is ground on one side surface, chamfering can be carried out for multiple times on an edge adjacent to the side surface and an edge opposite to the edge through rotating for certain angles, such as 40 degrees, 45 degrees and 50 degrees, and the silicon rod with smoother transition at the junction of different side surfaces is obtained. The angles are all rotational angles from the initial position of grinding. For the chamfering method, refer to patent publications such as CN108942570A, etc., and the grinding tool is used to grind the edge angle by driving the silicon rod to rotate a certain angle in cooperation with the transverse feeding in the second direction.

In an embodiment of the present application, the first silicon rod clamp is an elevating silicon rod clamp. In one implementation, the first silicon rod clamp comprises a lifting guide rail and a driving device for the lifting direction, the first clamp arm of the first silicon rod clamp and the clamp arm guide rail carrying the first clamp arm on the first clamp arm mounting seat can move along the lifting guide rail in a third direction (i.e. the direction of the plumb line), and can be used for controlling the relative positions of the outer surface of the silicon rod and the rough grinding device or the finish grinding device in the direction of the plumb line, so as to select a grinding area for grinding the ground surface of the silicon rod and the rough grinding device or the finish grinding device.

With respect to the first transfer drive mechanism, the first transfer drive mechanism includes: the first transfer driving unit is used for driving the first clamping arm mounting seat and at least one pair of first clamping arms thereof to move along the first transfer guide rail.

The first transfer driving unit includes a first moving rack, a first driving gear, and a first driving source. The first moving rack is arranged along a first direction and is parallel to the first transfer guide rail. In one embodiment, the first moving rack is fixed on the upper surface, the side surface or the lower surface of the mounting frame, is arranged to be approximately the same as the first transfer guide rail in a first direction dimension, and is arranged in parallel and adjacent to the first transfer guide rail. The first driving gear is arranged on the first silicon rod clamp, is meshed with the first moving rack and is used for driving the first silicon rod clamp to move along the first transfer guide rail. The first drive source is used for driving the first drive gear.

In an embodiment of the present application, the first transfer driving unit may be disposed on the first silicon rod clamp, and include a first moving screw and a first driving source, wherein the first moving screw is disposed along a first direction and is associated with the first clamp arm mount, and the first driving source is configured to drive the first moving screw to rotate so as to move the associated first clamp arm mount and at least one pair of first clamp arms thereof along the first transfer guide rail.

In one implementation manner of this embodiment, the first driving source may be configured as a driving motor, a power output shaft of the driving motor is coupled to the first driving gear to control a motion state of the first driving gear, and then the first driving source controls the first silicon rod clamp to move in a first direction with respect to the silicon rod clamped by the first silicon rod clamp.

As for the second transfer device, in the present application, the second transfer device comprises a second silicon rod clamp, a second transfer guide provided along the transfer direction, and a second drive mechanism. The second silicon rod clamp is used for clamping a silicon rod, and the silicon rod is clamped by the second silicon rod clamp and then is horizontal, namely, the axis of the silicon rod is clamped in a mode that the axis of the silicon rod is consistent with the first direction. In this embodiment, the centre of grip of the second silicon rod clamp is aligned with the predetermined centre line, i.e. the centre of grip of the second silicon rod clamp is aligned with the axis of the silicon rod. The second transfer driving mechanism is used for driving the second silicon rod clamp and the silicon rods clamped by the second silicon rod clamp to move along the first direction and transfer among the waiting area, the second processing area and the second processing area.

In certain embodiments, the second transfer device comprises a second silicon rod clamp, a second transfer rail, and a second drive mechanism. The second silicon rod clamp is borne on the second transfer guide rail, the second transfer guide rail is arranged on the upper surface of the mounting frame and is arranged along the first direction, and the second silicon rod clamp on the second transfer guide rail is limited to move along the first direction. The second driving mechanism is used for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp to move along the second transfer guide rail, and the second silicon rod clamp is enabled to be transferred between the second processing area and the second processing area.

As shown in fig. 4, the second silicon rod clamp 410 includes a second clamp arm mount 411, at least one pair of second clamp arms 413, and a second clamp arm driving mechanism. The second silicon rod clamp 410 is integrally represented as a second clamping arm mounting seat 411 arranged above, the outer part of the second clamping arm mounting seat 411 includes a second clamping arm 413 and is in a downward suspension state, the second clamping arm mounting seat 411 is mounted on the mounting frame, and the second clamping arm 413 extends downward from the hollow part of the mounting frame where the second clamping arm mounting seat 411 is located, so that the silicon rod clamped by the second clamping arm 413 is located on the processing surface of the silicon rod processing platform. One end of the second clamping arm 413 is connected to the second clamping arm mounting seat 411, and the other end of the second clamping arm 413 is connected to a clamping portion 414 for contacting the end surface of the silicon rod. In the embodiment shown in fig. 4, the clamping portion 414 of the second clamping arm 413 is a rotatable circular table on which a series of protruding contacts 4141 are provided.

With regard to the specific implementation manner of the second silicon rod clamp 410 and the working principle thereof, the description of the first silicon rod clamp 310 may be compared, and will not be repeated herein.

In combination with the aforementioned first transfer device, the second transfer guide in the second transfer device and the first transfer guide in the first transfer device are both arranged in parallel along the first direction, and the first silicon rod clamp of the first transfer device and the second silicon rod clamp of the second transfer device move on mutually parallel paths defined by the first transfer guide and the second transfer guide, respectively. When the first silicon rod clamp and the silicon rod clamped by the first silicon rod clamp are transferred from different processing regions, the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp can also be transferred from different processing regions, and the first silicon rod clamp and the second silicon rod clamp move independently from each other, so that the first transfer guide rail and the second transfer guide rail which limit the movement ranges of the first silicon rod clamp and the second silicon rod clamp are respectively arranged at different spatial positions and are not interfered with each other.

As can be seen from the above, the first transfer device and the second transfer device are used for controlling the movement of the silicon rod, for example, the first transfer device is used for clamping the silicon rod and driving the silicon rod to move along the first direction, and the second transfer device is used for clamping the silicon rod and driving the silicon rod to move along the first direction, so that any one silicon rod can move along the first direction relative to the rough grinding device located at the first processing location or the fine grinding device located at the second processing location, so as to achieve the grinding operation of the silicon rod.

In the silicon rod grinding machine shown in fig. 2 and 3, a rough grinding device and a finish grinding device are included.

The rough grinding device is arranged at a first processing position of the silicon rod processing platform and used for conducting rough grinding operation on the silicon rod clamped by the first silicon rod clamp in the first transfer device or the silicon rod clamped by the second silicon rod clamp in the second transfer device.

Referring to fig. 3 and 5 in combination, fig. 5 is a simplified schematic diagram of a portion of the silicon rod processing apparatus shown in fig. 2. As shown in the figure, the rough grinding apparatus 51 includes a rough grinding tool mounting base 511, at least one pair of rough grinding tools 512, a rough grinding tool rotating mechanism, and a rough grinding tool advancing and retreating mechanism.

The rough grinding tool mounting seat 511 is arranged on a first processing position of the silicon rod processing platform and is used for arranging at least one pair of rough grinding tools 512.

The at least one pair of rough grinding tools 512 are disposed on the rough grinding tool mounting base 511, and the at least one pair of rough grinding tools 512 are disposed opposite to each other in the second direction. In some implementations, any of the rough grinding tools 512 can be mounted to the rough grinding tool mount 511 via a rough grinding tool mount.

In certain implementations, the rough grinding tool 512 includes a grinding wheel and a rotating shaft. The grinding wheels have certain granularity and roughness, the two grinding wheels which are oppositely arranged are respectively provided for two symmetrical grinding surfaces of the clamped silicon rod, and in certain embodiments, the grinding wheels are circular and provided with a through hole in the middle.

The rough grinding tool rotating mechanism is used for driving the at least one rough grinding tool to rotate. In certain implementations, the rough grinding tool rotation mechanism can be, for example, a drive motor having an output shaft associated with a rotational axis of the rough grinding tool 512.

The rough grinding tool advancing and retreating mechanism is used for driving at least one rough grinding tool 512 of the at least one pair of rough grinding tools 512 to move transversely along a second direction, namely the width direction of the silicon rod processing equipment defined by the direction perpendicular to the first direction. The rough grinding tool advancing and retreating mechanism controls the movement of at least one rough grinding tool 512 of the pair of rough grinding tools 512 in the second direction, so as to adjust the relative distance between the two rough grinding tools 512 of the pair of rough grinding tools 512 in the second direction, and further control the feeding amount in the grinding process, that is, determine the grinding amount. When the first transfer device and/or the second transfer device carries and transfers the silicon rod to move to the second processing position through the first processing position or when the silicon rod is transferred to move out of the processing position through the first processing position after the grinding of the silicon rod is finished, the at least one pair of rough grinding tools 512 moves in the second direction under the control of the rough grinding tool advancing and retreating mechanism to form a path for safely transferring the silicon rod, namely, the first transfer device and/or the second transfer device does not collide with the silicon rod carried by the first transfer device and the rough grinding tools 512 during the transferring process.

Referring to fig. 5, in some implementations, a rough grinding tool advancing and retreating mechanism is provided for each pair of rough grinding tools 512, and the rough grinding tool advancing and retreating mechanism includes a slide rail 514, a driving motor 513, and a ball screw (not shown). Sliding guide 514 sets up along the second direction, locates on the first processing position of frame, the bottom of corase grind grinding apparatus 512 be provided with sliding guide 514 complex along the guide slot of second direction, ball follows sliding guide 514 sets up and with driving motor 513 coupling.

In an embodiment of the present application, one of the at least one pair of rough grinding tools is configured with the driving motor and the ball screw, and the relative distance between the two rough grinding tools is changed by moving one of the pair of rough grinding tools disposed oppositely.

In an embodiment of the application, each of the at least one pair of rough grinding tools is configured with the driving motor and the ball screw, and the driving motor can individually control the position of the corresponding rough grinding tool in the second direction, or based on a certain cooperative relationship, the two rough grinding tools can move away from or close to each other at the same linear speed, for example, during grinding, the pair of rough grinding tools feed towards each other at the same speed in the second direction, and the pair of rough grinding tool grinding wheels rotate at the same linear speed for grinding.

In one embodiment of the present application, a pair of rough grinding tools are driven by the same driving motor to move in the second direction at equal and opposite speeds. In one implementation manner of this embodiment, the rough grinding tool advancing and retreating mechanism includes a driving motor, a driving gear, a pair of racks, and a guide rail. The guide rail sets up along the second direction, locates on the first processing position of frame, the bottom of corase grind grinding apparatus be provided with the guide rail complex is along the guide slot of second direction. The driving motor drives the gear to rotate, the pair of racks is meshed with two opposite ends of the driving gear, and when the driving gear rotates, the pair of racks are driven to be close to or far away from each other under the driving of linear speeds in opposite directions of two ends of the gear. In one implementation manner of this embodiment, one end of each of the pair of racks is engaged with the driving gear, and the other end of each of the pair of racks is connected to a rough grinding tool, so that the pair of rough grinding tools move away from or approach to each other along the guide rail in the second direction.

In an embodiment of the present application, the rough grinding device 51 further includes a cooling device to cool the at least one pair of rough grinding tools, so as to reduce damage to a surface layer of the silicon rod during grinding, and improve grinding efficiency and service life of the grinding wheel. In one implementation manner of this embodiment, the cooling device includes a cooling water pipe, a diversion trench, and a diversion hole.

The at least one pair of rough grinding tools corresponds to the first silicon rod clamp or the second silicon rod clamp, taking the first silicon rod clamp as an example, in the grinding process, the silicon rod is clamped by the pair of clamping arms opposite to each other in the first silicon rod clamp to move in a first direction so as to control the sequence of grinding and chamfering the side surface and the corner angle of the silicon rod, the silicon rod can be fully ground by the at least one pair of rough grinding tools in the length direction of the silicon rod through reciprocating motion, and the pair of rough grinding tools opposite to each other move in a second direction so as to determine the grinding feeding amount of the contact surface of the rough grinding tools and the silicon rod.

With continued reference to fig. 3 and 5, in the illustrated embodiment, the lapping device 61 includes a lapping tool mounting block 611, at least one pair of lapping tools 612, a lapping tool rotating mechanism, and a lapping tool advancing and retreating mechanism.

The finish grinding tool mounting seat 611 is disposed on the second processing region of the silicon rod processing platform, and is used for arranging at least one pair of finish grinding tools 612. In certain embodiments, the finish grinder mount 611 spans the width dimension of the silicon rod processing platform in the second direction.

The at least one pair of finish grinding wheels 612 is disposed on the finish grinding wheel mount 611, and the at least one pair of finish grinding wheels 612 is presented to be disposed opposite in the second direction. In certain implementations, any of the refiner abrasive tools 612 may be mounted to the refiner abrasive tool mounting 611 by a refiner abrasive tool support.

In certain implementations, the finish grinder 612 includes a grinding wheel and a rotating shaft. The grinding wheels have certain granularity and roughness, the two grinding wheels which are oppositely arranged are respectively provided for two symmetrical grinding surfaces of the clamped silicon rod, and in certain embodiments, the grinding wheels are circular and provided with a through hole in the middle.

The finish grinding tool rotating mechanism is used for driving the at least one finish grinding tool to rotate. In certain implementations, the finish grinder rotation mechanism may be, for example, a drive motor having an output shaft associated with a rotational shaft of the finish grinder 612.

The finish grinding tool advancing and retreating mechanism is used for driving at least one finish grinding tool 612 of the at least one pair of finish grinding tools 612 to transversely move along a second direction, namely the width direction of the silicon rod processing equipment defined by the direction perpendicular to the first direction. The finish grinder advancement and retraction mechanism controls movement of at least one of the pair of finish grinders 612 in the second direction to effect adjustment of the relative distance between the two finish grinders 612 of the pair of finish grinders 612 in the second direction, thereby controlling the amount of feed during grinding, i.e., determining the amount of grinding. When the first transfer device and/or the second transfer device carries and transfers the silicon rod to the first processing position through the second processing position or when the silicon rod is transferred to the second processing position to be transferred out of the processing position after the grinding of the silicon rod is finished, the at least one pair of the lapping tool 612 is moved in the second direction under the control of the lapping tool advancing and retreating mechanism to form a path for safe transfer of the silicon rod, namely, the first transfer device and/or the second transfer device and the silicon rod carried by the first transfer device and/or the second transfer device and the lapping tool 612 do not collide with each other during the transfer process.

With continued reference to fig. 5, in certain implementations, a sharpener advancing and retracting mechanism is provided for each pair of sharpeners 612, including a sliding guide rail 614, drive motor 613, ball screw (not shown). The sliding guide rail 614 is disposed along a second direction and is disposed on a second machining region of the base, a guide groove along the second direction, which is matched with the sliding guide rail 614, is disposed at the bottom of the finish grinding tool 612, and the ball screw is disposed along the sliding guide rail 614 and is coupled to the driving motor 613.

In an embodiment of the present application, one of the at least one pair of finish grinding stones is provided with the drive motor and the ball screw, and the relative distance between the two finish grinding stones is changed by moving one of the pair of finish grinding stones disposed opposite to each other.

In an embodiment of the present application, each of the at least one pair of lapping tools is provided with the driving motor and the ball screw, and the driving motor may individually control the position of the corresponding lapping tool in the second direction, or may cause the two lapping tools to move away from or close to each other at the same linear velocity based on a certain cooperative relationship, such as when the pair of lapping tools are fed toward each other at the same linear velocity in the second direction and the pair of lapping tool wheels rotate at the same linear velocity for grinding.

In one embodiment of the present application, a pair of lapping abrasive tools are moved in a second direction at equal and opposite speeds by the same drive motor. In one implementation mode of the embodiment, the finish grinding tool advancing and retreating mechanism comprises a driving motor, a driving gear, a pair of racks and a guide rail. The guide rail is arranged along a second direction and is arranged on a second processing area of the base, and the bottom of the fine grinding tool is provided with a guide groove matched with the guide rail along the second direction. The driving motor drives the gear to rotate, the pair of racks is meshed with two opposite ends of the driving gear, and when the driving gear rotates, the pair of racks are driven to be close to or far away from each other under the driving of linear speeds in opposite directions of two ends of the gear. In one implementation of this embodiment, one end of each of the pair of racks is engaged with the driving gear, and the other end is connected with a refiner grinding tool, so that the pair of refiner grinding tools move away from or approach each other along the guide rail in the second direction.

In an embodiment of the present application, the finish grinding device 61 further includes a cooling device to cool the at least one pair of finish grinding tools, so as to reduce damage to the surface layer of the silicon rod during grinding, and improve grinding efficiency and service life of the grinding wheel. In one implementation manner of this embodiment, the cooling device includes a cooling water pipe, a diversion trench, and a diversion hole.

The at least one pair of finish grinding tools corresponds to the first silicon rod clamp or the second silicon rod clamp, taking the first silicon rod clamp as an example, in the grinding process, the silicon rod is clamped by the pair of opposite clamping arms in the first silicon rod clamp to move in a first direction so as to control the sequence of grinding and chamfering the side surface and the edge angle of the silicon rod, the silicon rod can be fully ground by the at least one pair of finish grinding tools in the length direction of the silicon rod through reciprocating motion, and the pair of finish grinding tools oppositely arranged moves in a second direction so as to determine the grinding feed amount of the contact surface of the finish grinding tools and the silicon rod.

The silicon rod grinding machine disclosed by the application further comprises a grinding repair device which can be used for grinding and repairing the grinding tool so as to ensure that the required precision can be achieved after the grinding tool is used for grinding the silicon rod. The grinding repair device comprises an installation main body and at least one grinding part; the grinding part is arranged on the mounting main body and used for grinding the corresponding grinding tool.

Fig. 4 is a schematic view showing a grinding repair device of a silicon rod grinder according to an embodiment of the present invention. As shown in fig. 4, the polishing and repairing device is disposed on a silicon rod clamp of the silicon rod polishing machine, that is, a mounting body 811 of the polishing and repairing device is disposed on one clamp arm of the silicon rod clamp, and a thinning portion 813 of the polishing and repairing device is disposed on a side of the mounting body 811 facing a polishing and grinding tool. In certain embodiments, the grinding repair device is applied to a silicon rod grinding machine as shown in fig. 2, and includes a first transfer device 31, a second transfer device 41, a rough grinding device 51, and a finish grinding device 61. In certain examples, the abrasive repair device is disposed on a subsequent first clamp arm 313 (or a previous first clamp arm 313) of the first silicon rod clamp 310 in the first transfer device 31, and the abrasive repair device is disposed on a previous second clamp arm 413 (or a subsequent second clamp arm 413) of the second silicon rod clamp 410 in the second transfer device 41. Each grinding repair device comprises an installation main body 811 and two thinning parts 813 arranged on two opposite sides of the installation main body 811 along the second direction, and the installation main body 811 and the thinning parts 813 thereon are driven by the corresponding silicon rod clamp (the first silicon rod clamp 310 or the second silicon rod clamp 410) to reciprocate along the first direction.

The polishing repair device is not limited to the configuration shown in fig. 4, and in another embodiment, an installation body of the polishing repair device may be provided on a base of the silicon rod polishing machine, a thinning portion of the polishing repair device may be provided on the installation body, and the polishing repair device may further include a driving unit for driving the installation body and the thinning portion thereon to reciprocate in a predetermined direction.

Returning to fig. 4 and 5, in the embodiment shown in fig. 4 and 5, the grinding repair device includes two thinning portions 813 respectively located at opposite sides of the mounting body 811 along the second direction, for example, at left and right sides along the second direction. With this arrangement, the grinding repair device can be used to grind two grinding tools (e.g., two rough grinding tools 512 disposed right and left in the second direction in the rough grinding device 51 or two finish grinding tools 612 disposed right and left in the finish grinding device 61) in the silicon rod grinding machine at the same time. Taking the refining apparatus 61 as an example, the refining apparatus 61 includes a pair of refining grinders 612 arranged oppositely along the second direction, the pair of refining grinders 612 arranged oppositely is moved to the outer sides of the two thinning portions 813, the silicon rod clamp (the first silicon rod clamp 310 or the second silicon rod clamp 410) is driven to move along the first direction so that the two repairing portions 813 on both sides of the mounting body 811 reciprocate along the first direction, and in this state, the pair of refining grinders 612 in the refining apparatus 61 can be made to approach the thinning portions 813 to contact the surface of the thinning portions 813 to achieve grinding.

Generally, in the silicon rod grinding operation, in order to grind the side surface of the silicon rod, correspondingly, the grinding tools (e.g., the two rough grinding tools 512 in the rough grinding device 51 or the two finish grinding tools 612 in the finish grinding device 61) are materials having certain hardness, such as grinding wheels, which are formed by consolidating abrasive grains and binder, and form a surface having abrasive grains for contacting with the surface of the silicon rod to be ground and grinding the silicon rod. In some examples, the grinding repair device may further include sharpening portions 813 of different particle sizes, which are respectively used for grinding different types of grinding tools in the silicon rod grinder, such as: the rough grinding tool and the finish grinding tool perform grinding.

Here, the grinding portion 813 of the grinding repair device has a surface for contacting the at least one grinding tool (e.g., the rough grinding tool 512 in the rough grinding device 51 or the finish grinding tool 612 in the finish grinding device 61), and in some embodiments, the grinding portion 813 has high adhesion, wear resistance, hardness, and the like, for grinding the grinding tool (e.g., the rough grinding tool 512 in the rough grinding device 51 or the finish grinding tool 612 in the finish grinding device 61).

In some embodiments, the thinning 813 is oilstone. Here, the oilstone is, for example, diamond oilstone, boron carbide oilstone, fine-ground oilstone, general oilstone, or the like. The oilstone may effect a modification of the surface of the grinding tool contacted by the oilstone by virtue of the particle size of the surface. In the coping process, the surface of the oilstone contacts the grinding tool, the surface of the grinding tool is trimmed to be uniform granularity, and the flatness and the verticality of the plane of the grinding tool are improved.

In some embodiments, when the at least one grinding portion 813 grinds the corresponding at least one grinding tool, the at least one grinding tool is driven by a driving motor to rotate.

Compared with the traditional grinding mode, the grinding tool is usually contacted with a grinding device such as an oilstone to realize grinding in a rotating state, so that the surface of the oilstone has high and low points, and the flatness of the surface of the grinding tool after the grinding is finished is not good; in the embodiment provided by the present application, in the grinding and repairing device of the present application, the grinding portion 813, for example, the oilstone is ground in a reciprocating motion, a plane formed by the oilstone in the reciprocating motion is different from a plane of the oilstone in a static state, and no height point exists on the surface of the oilstone (i.e., a plane for grinding) in the reciprocating motion, so that the surface of the grinding tool can be leveled, and the grinding quality can be improved; moreover, the grinding efficiency is related to the rotating speed of the workpieces during grinding, and the reciprocating motion state of the grinding part 813 corresponds to the rotating state of the grinding tool, so that relative motion can be generated between the grinding tool and the grinding part 813, the grinding process is easy to realize, and the grinding efficiency is improved.

In some embodiments, the grinding surface of the grinding portion 813 is rectangular, circular, oval, annular, regular polygon or other customized shapes, and it should be understood that the grinding repair can be realized only when the grinding portion is made of a preset material meeting the grinding requirement and can realize surface contact with the grinding tool, and the above shapes are only optional examples, and the present application is not limited thereto.

In some embodiments, the grinding repair device further comprises a sensing device arranged on the base and used for detecting the grinding tool of the silicon rod grinding machine.

The grinding repair device is intended to repair a grinding surface of a grinding tool, and after the grinding repair is performed through a grinding portion, a surface layer of the grinding tool is ground and removed. In the subsequent surface grinding of the silicon rod, the silicon rod side is ground with a new grinding surface. It should be noted here that the grinding surface operation for the silicon rod requires control of the grinding amount for the silicon rod, which may be predetermined based on the specification of the silicon rod grinder and the specification of the silicon rod, for example, in a silicon rod grinder, the grinding tool may be generally moved relative to the silicon rod in a feeding manner, and in a control system of the silicon rod grinder, the initial position of the grinding surface of the grinding tool may be set as a known input value (or calculated from a plurality of input values), whereby the feeding of the grinding tool relative to the silicon rod may be controlled based on the preset grinding amount. However, after the grinding tool is ground by the grinding repair device, the initial position of the grinding surface is changed, so that the silicon rod grinding machine needs to know the specification of the grinding tool in grinding repair, so as to correct the actual position of the grinding surface, and thus the grinding amount of the silicon rod in subsequent processing can be controlled according to a preset value.

Here, the sensor device in the grinding repair apparatus of the example of the present application may be used to determine the size (mainly, the thickness) of the grinding tool after the grinding repair is completed. The sensor device can determine the size of the ground grinding tool after grinding by determining the distance between the sensor and the grinding surface or the distance between two grinding surfaces of a pair of oppositely arranged grinding tools.

As shown in fig. 4, the sensing device is a touch sensor 815, and the touch sensor 815 has a probe head for contacting the grinding surface. In a practical scenario, the grinding wheel of the silicon rod grinding machine may be moved relative to the dressing part 813, the feed motion may be driven by a servo motor, for example, where the servo motor may control the feed amount of the grinding wheel, but during the grinding repair process, the feed amount determined by the servo motor control is not equal to the layer thickness of the grinding wheel ground during the dressing process, or it may be understood that an accurate grinding amount of the grinding repair process cannot be obtained by the feed control device of the grinding wheel, i.e. it is necessary to obtain the actual size specification of the grinding wheel through measurement.

In the case of the grinding and repairing apparatus having two opposite thinning portions 813, the contact sensor 815 may be provided with two detecting heads at two ends thereof, respectively, for contacting two opposite grinding surfaces of a pair of grinding tools. The touch sensor 815 may be disposed on the mounting body 811, and a line connecting the probe heads at both ends of the touch sensor 815 is parallel to the second direction. In the measuring process, the servo motor can drive the grinding tool to approach the detecting heads, the contact sensor 815 can acquire and record the distance between the detecting heads at two ends, the grinding tool stops moving when contacting the detecting heads and records the position data of the servo motor, the size of the grinding tool after grinding repair can be determined again based on the position data of the servo motor and the detecting head data of the contact sensor 815, and the silicon rod grinding machine can take the measured size of the grinding tool as input data in the control system.

In some examples, the probe head of the touch sensor 815 is further provided with a retractable spring, and when the probe head contacts an object, the retractable spring can be retracted under the driving of the retractable spring, so that the probe head can be protected and prevented from being damaged by touching.

In some examples, the sensing device may be configured as a probe-type displacement sensor.

In some embodiments, the sensing device may be a distance measuring sensor, and the distance detecting direction of the distance measuring sensor may be set to be parallel to the rotation axis (i.e. perpendicular to the grinding surface of the grinding tool), so as to obtain the specification of the grinding tool after grinding and repairing, and the distance measuring sensor may be, for example, an infrared distance measuring sensor, a laser distance sensor, an ultrasonic sensor, a radar sensor, or the like.

In some embodiments, the abrasive repair device includes a protective cover disposed over the sensing device for covering the sensing device in a closed state and exposing the sensing device in an open state. By arranging the protective cover, the sensing device can be effectively maintained only by being exposed to the external space when measurement is needed. In addition, in some examples, when the grinding repair device grinds the grinding tool, the temperature of the contact surface between the grinding portion and the grinding tool is increased, and both the grinding portion and the surface of the grinding tool may be damaged by high temperature, so that the cooling liquid needs to be sprayed to cool the surface of the grinding tool.

Here, according to the grinding repair device provided by the application, the grinding tool of the silicon rod grinding machine is close to and contacts the grinding part of the grinding repair device to grind the grinding tool, at the moment, the reciprocating motion of the grinding part along the preset direction and the rotation of the grinding tool corresponding to the contact can be controlled to improve the grinding efficiency, and after the grinding is completed, the grinding repair device can measure the grinding tool through the sensing device to determine the size of the ground grinding tool after grinding, so that the silicon rod grinding machine can perform subsequent surface grinding operation on the silicon rod.

The utility model discloses silicon rod processing equipment, in the actual grinding, the corase grind device that is located first processing position department and the accurate grinding device that is located second processing position department can be in operating condition simultaneously, can carry out corase grind operation and accurate grinding operation respectively to different silicon rods. In one embodiment, a first silicon rod clamp (or a second silicon rod clamp) is used for transferring a to-be-ground single crystal silicon rod to a first processing position along a first transfer guide rail, a pair of rough grinding tools of the rough grinding device are driven by a rough grinding tool advancing and retreating mechanism to move to two sides of the silicon rod along a second direction, and the silicon rod is clamped by the first silicon rod clamp (or the second silicon rod clamp) to match with the rough grinding device for rough grinding operation; after the rough grinding operation is finished, the silicon rod after the rough grinding is transferred to a second processing position along a first transfer guide rail by a first silicon rod clamp (or a second silicon rod clamp), a finish grinding tool positioned at the second processing position is driven by a finish grinding tool advancing and retreating mechanism to move to two sides of the silicon rod along a second direction, then the silicon rod is subjected to finish grinding operation under the matching of the first silicon rod clamp (or the second silicon rod clamp) and the finish grinding tool, at the same time, another silicon rod to be ground is transferred to a first processing position along the first transfer guide rail by the second silicon rod clamp (or the first silicon rod clamp), a pair of rough grinding tools of the rough grinding device are driven by the rough grinding tool advancing and retreating mechanism to move to two sides of the silicon rod along the second direction, and the silicon rod is clamped by the second silicon rod clamp (or the first silicon rod clamp) to cooperate with the rough grinding device for operation; and when the rough grinding is finished, the silicon rod fine grinding in the second processing position is finished, the silicon rod subjected to the rough grinding is transferred to the second processing position by a second silicon rod clamp (or a first silicon rod clamp) for fine grinding, the silicon rod clamped by the first silicon rod clamp (or the second silicon rod clamp) is finely ground and transferred out of the silicon rod processing platform, and the first silicon rod clamp (or the second silicon rod clamp) continues to clamp the silicon rod which is not ground, and the process is repeated.

The application discloses silicon rod processing equipment, including frame, first transfer device, second transfer device, corase grind device and correct grinding device, wherein, through first transfer device of coordinated control, second transfer device and corase grind device, correct grinding device, make at the same moment corase grind device and correct grinding device all are in operating condition, promote grinding operation efficiency by a wide margin on the basis of the size and specification that keeps silicon rod processing equipment and cost, it is consuming time to have reduced the grinding operation, has promoted economic benefits.

Simultaneously, this application grinding prosthetic devices in silicon rod processing equipment, usable grinding prosthetic devices's prosthetic parts are through the coping with the realization to grinding tool with the contact of grinding tool.

Fig. 6 is a schematic structural view of a silicon rod processing apparatus according to a second embodiment of the present disclosure.

In the embodiment provided by the present application, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, where the first direction, the second direction, and the third direction are all linear directions and are mutually perpendicular to each other two by two, in the embodiment shown in fig. 6, the X axis of the graphic coordinate axis is the first direction, the Y axis of the graphic coordinate axis is the second direction, and the Z axis of the graphic coordinate axis is the third direction.

As shown in fig. 6, the silicon rod processing apparatus is a silicon rod grinder, and includes a base 12, a first silicon rod clamp 32, a second silicon rod clamp 42, a rough grinding device 52, and a finish grinding device 62.

The base 12 is provided with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area and a second processing area. The first processing area and the second processing area are arranged along the front-back direction (namely, the first direction) of the silicon rod processing platform, the first processing area and the second processing area are symmetrically arranged on the left side and the right side (namely, the second direction) of the silicon rod processing platform, and the single crystal silicon rods correspondingly borne can be processed on the first processing area and the second processing area respectively and independently.

The first and second silicon rod clamps 32 and 43 are disposed in parallel on the left and right sides of the silicon rod processing platform. The first silicon rod clamp 32 is configured to clamp the silicon rod 101 and drive the clamped silicon rod 101 to move along a first direction (i.e., an X-axis direction in fig. 6), the second silicon rod clamp 42 is configured to clamp the silicon rod 101 and drive the clamped silicon rod 101 to move along the first direction, and an axial line of the silicon rod 101 is parallel to the first direction.

For any silicon rod clamp, the first or second silicon rod clamp 32, 42 comprises a clamp arm mount, a movement mechanism, a pair of clamp arms, and a clamp arm drive mechanism.

The clamping arm mounting seat is arranged on the corresponding guide structure, wherein the guide structure can be a transfer guide rail, a guide pillar or a combination of the transfer guide rail and the guide pillar.

The moving mechanism is used for driving the clamping arm mounting seat to move along the corresponding guide structure.

In certain implementations, the moving mechanism may include: a moving rack, a drive gear, and a drive source. In certain implementations, the moving mechanism may include: a movable screw rod and a driving source.

The pair of clamping arms are arranged oppositely along the first direction and used for clamping two end faces of the silicon rod. The silicon rod is a slender structure which is cut, the length direction of the silicon rod is placed along the first direction, and the end faces are sections of two ends in the length direction. Wherein, any one of the pair of clamping arms is provided with a clamping part.

The clamping arm driving mechanism is used for driving at least one clamping arm in a pair of clamping arms to move along a first direction so as to adjust the clamping distance between the pair of clamping arms.

The clamping part of arm lock is the rotary type design, wherein, silicon rod anchor clamps still include clamping part slewing mechanism for the clamping part on the arm lock rotates in the drive silicon rod anchor clamps. In the actual grinding, the grinding face that the silicon rod needs to go on and the edge of chamfer at juncture between four faces and four faces of length direction, by the arm lock that this application provided, can realize the selection and the control to the different grinding faces of silicon rod and different edges.

In certain embodiments, the clamping portion has a multi-point contact type clamping head, it being understood that the contact manner between the multi-point contact type clamping head and the end surface of the silicon rod is not limited to point contact, and the clamping portion has, for example, a plurality of protrusions to contact the end surface of the silicon rod, wherein each protrusion may be in surface contact with the end surface of the silicon rod.

With respect to the rough grinding device 52 and the finish grinding device 62, the silicon rod processing apparatus further includes a grinder shifter 72 connected to the rough grinding device 52 and the finish grinding device 62 for driving the rough grinding device 52 and the finish grinding device 62 to shift positions between the first transfer rail and the second transfer rail.

In the embodiment shown in fig. 6, the shifting mechanism 72 includes a shifting shaft, and thus, the coarse grinding device 52 and the fine grinding device 62 can be shifted between the first transfer rail and the second transfer rail by driving the shifting shaft to rotate by a predetermined angle. In some embodiments, the indexing shaft is disposed in the direction of the plumb line, the first and second transfer rails are disposed on opposite sides of the indexing shaft in the second direction, and the rough grinding device 52 and the finish grinding device 62 are disposed on opposite sides of the indexing shaft, respectively, in the embodiment shown in fig. 6, the rough grinding device 52 and the finish grinding device 62 are disposed on opposite sides of the indexing shaft in a back-to-back manner, i.e., the rough grinding device 52 and the finish grinding device 62 may be separated by 180 °, such that driving the indexing shaft to rotate by a predetermined angle of 180 ° causes the rough grinding device 52 and the finish grinding device 62 to shift positions between the first and second transfer rails.

The rough grinding device is used for conducting rough grinding operation on the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp of the silicon rod processing platform. In the embodiment shown in fig. 6, the rough grinding apparatus 52 includes at least one pair of rough grinding tool and rough grinding tool advancing and retreating mechanism.

The at least one pair of rough grinding tools is disposed on one side of the transposition rotating shaft in the transposition mechanism 72, and specifically, the at least one pair of rough grinding tools is disposed opposite to the first mounting side of the transposition rotating shaft along the direction of the plumb line, that is, the at least one pair of rough grinding tools is disposed up and down, such that the grinding surfaces of the at least one pair of rough grinding tools are located in opposite horizontal planes, that is, the grinding surfaces of two rough grinding tools of the at least one pair of rough grinding tools are located in a first horizontal plane and a second horizontal plane, respectively, wherein the first horizontal plane and the second horizontal plane are parallel to each other and perpendicular to the plumb line.

With respect to the rough grinding tool, in certain implementations, the rough grinding tool includes a rough grinding wheel and a rough grinding tool rotation mechanism coupled to the rough grinding wheel. The rough grinding wheels have certain granularity and roughness, two opposite rough grinding wheels in the at least one pair of rough grinding tools are respectively provided for two symmetrical grinding surfaces of the clamped silicon rod, and in certain embodiments, the rough grinding wheels are circular and have a hollow middle. The rough grinding tool rotating mechanism can be, for example, a driving motor, and the driving motor is connected with the rough grinding wheel through an output shaft and is used for driving the rough grinding wheel to rotate at a preset rotating speed.

The rough grinding tool advancing and retreating mechanism is used for driving at least one rough grinding tool in the at least one pair of rough grinding tools to move up and down along the direction of a plumb line, and the direction of the plumb line is vertical to the horizontal plane. The rough grinding tool advancing and retreating mechanism controls at least one rough grinding tool in the at least one pair of rough grinding tools to move up and down along the direction of the plumb line, so that the relative distance between two rough grinding tools in the at least one pair of rough grinding tools in the direction of the plumb line is adjusted, and the feeding amount in the grinding process is controlled, namely the grinding amount is determined. In addition, when the first silicon rod clamp and/or the second silicon rod clamp the silicon rod and drive the clamped silicon rod to move along the first direction, the at least one pair of rough grinding tools move up and down along the direction of the plumb line under the control of the advancing and retreating mechanism of the rough grinding tool to form a path for safely moving the silicon rod, namely, the first silicon rod clamp and/or the second silicon rod clamp and the silicon rod clamped by the first silicon rod clamp and/or the second silicon rod clamp do not collide with the rough grinding tool in the moving process.

In certain implementations, each pair of rough grinding tools is configured with a rough grinding tool advancing and retreating mechanism, i.e., at least one rough grinding tool of the at least one pair of rough grinding tools is configured with a rough grinding tool advancing and retreating mechanism. The rough grinding tool advancing and retreating mechanism comprises an advancing and retreating guide rail and an advancing and retreating driving unit (not shown in the drawing), wherein the advancing and retreating guide rail is arranged along the direction of a plumb line and is arranged at the first installation side of the transposition rotating shaft, the bottom of the rough grinding tool is provided with a guide groove structure or a guide block structure which is matched with the advancing and retreating guide rail and is in the direction of the plumb line, the advancing and retreating driving unit can further comprise a ball screw and a driving motor, the ball screw is arranged along the advancing and retreating guide rail, and the ball screw is associated with the corresponding rough grinding tool and is in shaft joint with.

The at least one pair of rough grinding tools correspond to the first silicon rod clamp or the second silicon rod clamp, and in the grinding process, the silicon rod is clamped by the first silicon rod clamp or the second silicon rod clamp and the clamped silicon rod is driven to move along the first direction so as to control the side face and the edge angle of the silicon rod to grind the relative feeding between the grinding tools and the silicon rod.

The fine grinding device is used for performing fine grinding operation on the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp of the silicon rod processing platform. In the embodiment shown in fig. 6, the finish grinding apparatus 62 includes at least one pair of a finish grinding stone and a finish grinding stone advancing and retreating mechanism.

The at least one pair of finish grinders is disposed on one side of the transposition shaft in the transposition mechanism 72, and specifically, the at least one pair of finish grinders is disposed opposite to the first mounting side of the transposition shaft in the direction of the plumb line, that is, the at least one pair of finish grinders is disposed up and down, such that the grinding surfaces of the at least one pair of finish grinders are located in opposite horizontal planes, that is, the grinding surfaces of two of the at least one pair of finish grinders are located in a first horizontal plane and a second horizontal plane, respectively, wherein the first horizontal plane and the second horizontal plane are parallel to each other and perpendicular to the plumb line.

With respect to the finish grinding tool, in certain implementations, the finish grinding tool includes a finish grinding wheel and a finish grinding tool rotation mechanism coupled to the finish grinding wheel. The lapping grinding wheels have a granularity and a roughness, two lapping grinding wheels oppositely arranged in the at least one pair of lapping grinding tools are respectively provided for two grinding surfaces which are symmetrical to the clamped silicon rod, and in certain embodiments, the lapping grinding wheels are circular and have a hollow middle. The finish grinding tool rotating mechanism may be, for example, a driving motor connected to the finish grinding wheel through an output shaft for driving the finish grinding wheel to rotate at a predetermined rotation speed.

The finish grinding tool advancing and retreating mechanism is used for driving at least one finish grinding tool in the at least one pair of finish grinding tools to move up and down along the direction of a plumb line, and the direction of the plumb line is perpendicular to the horizontal plane. The fine grinding tool advancing and retreating mechanism controls at least one fine grinding tool in the at least one pair of fine grinding tools to move up and down along the direction of the plumb line, so that the relative distance between two fine grinding tools in the at least one pair of fine grinding tools in the direction of the plumb line is adjusted, and the feeding amount in the grinding process is controlled, namely the grinding amount is determined. In addition, when the first silicon rod clamp and/or the second silicon rod clamp the silicon rod and drive the clamped silicon rod to move along the first direction, the at least one pair of finish grinding tools do lifting movement along the direction of the plumb line under the control of the finish grinding tool advancing and retreating mechanism to form a path for the silicon rod to safely move, namely, the first silicon rod clamp and/or the second silicon rod clamp and the silicon rod clamped by the first silicon rod clamp and/or the second silicon rod clamp do not collide with the finish grinding tool in the moving process.

In certain implementations, each pair of finish grinders is provided with a finish grinder advancing and retreating mechanism, i.e., at least one of the at least one pair of finish grinders is provided with a finish grinder advancing and retreating mechanism. The fine grinding tool advancing and retreating mechanism comprises an advancing and retreating guide rail and an advancing and retreating driving unit (not shown in the drawing), wherein the advancing and retreating guide rail is arranged along the direction of a plumb line and is arranged at the first installation side of the transposition rotating shaft, the bottom of the fine grinding tool is provided with a guide groove structure or a guide block structure which is matched with the advancing and retreating guide rail and is in the direction of the plumb line, the advancing and retreating driving unit can further comprise a ball screw and a driving motor, the ball screw is arranged along the advancing and retreating guide rail, and the ball screw is associated with the corresponding fine grinding tool and is in shaft joint with the driving motor.

The at least one pair of finish grinding tools correspond to the first silicon rod clamp or the second silicon rod clamp, and in the grinding process, the silicon rod is clamped by the first silicon rod clamp or the second silicon rod clamp and the clamped silicon rod is driven to move along the first direction so as to control the relative feeding between the grinding tool and the silicon rod for grinding the side face and the edge angle of the silicon rod.

The silicon rod processing equipment in the embodiment further comprises a grinding repair device, wherein the grinding repair device comprises an installation main body and at least one grinding part.

The mounting main body can be arranged on the silicon rod clamp, and the at least one grinding part is arranged on the mounting main body and used for grinding the corresponding at least one grinding tool. In certain embodiments, the mounting body in the abrasive repair device is provided on at least one clamping arm of a silicon rod clamp, for example a first clamping arm of a first silicon rod clamp or a second clamping arm of a second silicon rod clamp. Referring to fig. 7, a schematic diagram of the silicon rod clamp and the polishing repair device disposed thereon in fig. 6 is shown. In the embodiment shown in fig. 7, the grinding repair device is disposed on the second silicon rod clamp 420, and the grinding repair device includes a mounting body 821 and at least one thinning portion 823. The mounting body 821 of the polishing repair apparatus is disposed in the second clamping arm 423 of the second silicon rod clamp 420, and a polishing portion 823 is disposed on each of two opposite sides of the mounting body 821 along a third direction (i.e., a plumb line direction). Taking the grinding repair device for grinding the finish grinding tools in the finish grinding device as an example, the finish grinding device comprises a pair of finish grinding tools oppositely arranged along a third direction, the pair of finish grinding tools oppositely arranged is moved to the outer side of the grinding part along the third direction, the silicon rod clamp is driven to move along a horizontal line so as to enable the two repair parts on the two sides of the mounting body to reciprocate along the first direction, and in this state, the pair of finish grinding tools in the finish grinding device can be oppositely close to (for example, along the third direction) the grinding part to be in contact with the surface of the grinding part so as to realize grinding.

The thinning may be, for example, an oilstone. Here, the oilstone is, for example, diamond oilstone, boron carbide oilstone, fine-ground oilstone, general oilstone, or the like. The oilstone may effect a modification of the surface of the grinding tool contacted by the oilstone by virtue of the particle size of the surface. In the coping process, the surface of the oilstone contacts the grinding tool, the surface of the grinding tool is trimmed to be uniform granularity, and the flatness and the verticality of the plane of the grinding tool are improved.

In some embodiments, the grinding repair device further comprises a sensing device arranged on the base and used for detecting the grinding tool of the silicon rod grinding machine. In the embodiment shown in fig. 7, the grinding repair device further includes a sensor device 825 disposed adjacent to the thinning portion 823.

With respect to the sensing device 825, reference may be made to the description of the sensing device 815 in fig. 4, which is not repeated herein.

The silicon rod processing equipment disclosed by the embodiment comprises a base, a first transfer device, a second transfer device, a coarse grinding device, a fine grinding device and a grinding repair device, wherein the first transfer device, the second transfer device, the coarse grinding device and the fine grinding device are coordinately controlled, so that the coarse grinding device and the fine grinding device are both in a working state at the same moment, the grinding operation efficiency is greatly improved on the basis of keeping the size specification and the cost of the silicon rod processing equipment, the time consumption of grinding operation is reduced, and the economic benefit is improved. Meanwhile, the repairing part of the grinding repairing device can be utilized to realize the coping of the grinding tool through the contact with the grinding tool.

Fig. 8 is a schematic structural view of a silicon rod processing apparatus according to a third embodiment of the present disclosure.

In the embodiment provided by the present application, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, where the first direction, the second direction, and the third direction are all linear directions and are mutually perpendicular to each other two by two, in the embodiment shown in fig. 8, the X axis of the graphic coordinate axis is the first direction, the Y axis of the graphic coordinate axis is the second direction, and the Z axis of the graphic coordinate axis is the third direction.

As shown in fig. 8, the silicon rod processing apparatus is a silicon rod cutting and grinding integrated machine, and includes a machine base 13, a first transfer device 33, a second transfer device 43, a cutting device 53, and a grinding device 63.

The base is provided with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area and a second processing area. The silicon rod processing platform is arranged on the upper surface of the base.

The first transfer device 33 and the second transfer device 43 are arranged above the silicon rod processing platform by means of a mounting frame. In an embodiment of the present application, as shown in fig. 8, the first transfer device 33 and the second transfer device 43 are disposed in parallel on the left and right sides of the silicon rod processing platform. The first transfer device 33 includes a first silicon rod clamp and a first transfer driving mechanism, and the second transfer device 43 includes a second silicon rod clamp and a second transfer driving mechanism, wherein, in the first transfer device 33, the silicon rod 100 is clamped by the first silicon rod clamp, the first silicon rod clamp and the silicon rod 100 clamped thereby are driven to move in a first direction (i.e., the X-axis direction in fig. 8) by the first transfer driving mechanism, in the second transfer device 43, the silicon rod 100 is clamped by the second silicon rod clamp, and the second silicon rod clamp and the silicon rod 100 clamped thereby are driven to move in the first direction (i.e., the X-axis direction in fig. 8) by the second transfer driving mechanism. The axis of the silicon rod 100 is parallel to the first direction.

In certain embodiments, the first transfer drive mechanism or the second transfer drive mechanism each comprises: a transfer guide and a transfer drive unit. In some embodiments, the transfer drive unit comprises: the movable rack is arranged along a first direction; a driving gear engaged with the moving rack; a driving source for driving the driving gear. In some embodiments, the transfer drive unit comprises: a movable screw rod and a driving source.

For any silicon rod clamp, the first silicon rod clamp or the second silicon rod clamp comprises a clamp arm mounting seat, a pair of clamp arms, and a clamp arm driving mechanism.

The clamping arm mounting seats are arranged on the corresponding transfer guide rails.

The pair of clamping arms are arranged oppositely along the first direction and used for clamping two end faces of the silicon rod. The silicon rod is a cylindrical silicon rod or a rectangular or quasi-rectangular slender structure which is cut, the length direction of the silicon rod is placed along a first direction, and the end faces are sections at two ends of the length direction. Wherein, any one of the pair of clamping arms is provided with a clamping part.

The clamping arm driving mechanism is used for driving at least one clamping arm in a pair of clamping arms to move along a first direction so as to adjust the clamping distance between the pair of clamping arms.

The clamping part of arm lock is the rotary type design, wherein, silicon rod anchor clamps still include clamping part slewing mechanism for the clamping part on the arm lock rotates in the drive silicon rod anchor clamps. In the actual grinding, the grinding face that the silicon rod needs to go on and the edge of chamfer at juncture between four faces and four faces of length direction, by the arm lock that this application provided, can realize the selection and the control to the different grinding faces of silicon rod and different edges.

In certain embodiments, the clamping portion has a multi-point contact type clamping head, it being understood that the contact manner between the multi-point contact type clamping head and the end surface of the silicon rod is not limited to point contact, and the clamping portion has, for example, a plurality of protrusions to contact the end surface of the silicon rod, wherein each protrusion may be in surface contact with the end surface of the silicon rod.

The cutting device 53 is disposed at a first processing location of the silicon rod processing platform, and is configured to perform a cutting operation on the silicon rod clamped by the first transfer device 33 on the first transfer channel or the silicon rod clamped by the second transfer device 43 on the second transfer channel.

In certain embodiments, the cutting device comprises: a cutting frame, at least one wire cutting unit, and a cutting switching mechanism; the cutting conversion mechanism is used for driving the cutting frame and the at least one wire cutting unit on the cutting frame to convert between a first transfer channel and a second transfer channel.

At least one wire cutting unit is located the cutting frame, wire cutting unit includes: the cutting wire is wound around the plurality of cutting wheels and the transition wheels to form at least one cutting wire saw.

Wherein, in certain embodiments, the cutting line is wound in an end-to-end relationship between the cutting wheel and the transition wheel to form a closed loop cutting line, i.e., the cutting line may be, for example, a closed loop cutting line.

The cutting device is provided with a cutting conversion mechanism, and the cutting conversion mechanism can be used for driving the cutting frame and at least one wire cutting unit on the cutting frame to move along a second direction so as to convert between the first transfer channel and the second transfer channel.

In one embodiment, the cut conversion mechanism comprises: a cutting conversion guide rail and a cutting conversion driving unit.

The cutting conversion guide rail is arranged along the second direction and used for arranging the cutting frame. In certain embodiments, the cutting transition rail is arranged on the silicon rod processing platform in the second direction, and the cutting frame is mounted on the cutting transition rail by means of, for example, a slide block.

And the cutting conversion driving unit is used for driving the cutting frame and at least one linear cutting unit thereof to move along the cutting conversion guide rail. In some embodiments, the cutting transition drive unit comprises: the movable rack is arranged along the second direction; the driving gear is arranged on the cutting frame and is meshed with the movable gear rack; and the driving source is used for driving the driving gear to enable the associated cutting frame and at least one wire cutting unit thereof to move along the cutting conversion guide rail. In some embodiments, the transfer drive unit comprises: a mobile screw rod arranged along a second direction and associated with the cutting frame; and the driving source is used for driving the movable screw rod to rotate so as to enable the associated cutting frame and at least one wire cutting unit to move along the cutting conversion guide rail.

In the silicon rod surely grinds all-in-one of this application, at the cutting process, the drive the line of cut is followed wire winding direction and is moved, and the silicon rod that drives the centre gripping by first silicon rod anchor clamps or second silicon rod anchor clamps is first direction removal in order to realize the feeding of relative cutting coping saw along silicon rod axial lead direction promptly, wherein, second direction or plumb line direction can be located to the cutting coping saw.

In one embodiment, the grinding apparatus includes a grinder mounting seat, at least one pair of grinding grinders, a grinder advancing and retreating mechanism, and a grinder switching mechanism.

The grinding tool mounting seat is used for arranging at least one pair of grinding tools. In the embodiment shown in fig. 8, two of the at least one pair of abrasive articles are oppositely disposed along the second direction.

The grinding tool advancing and retreating mechanism is used for driving at least one grinding tool in the at least one pair of grinding tools to move along the second direction so as to adjust the relative distance between two grinding tools in the at least one pair of grinding tools in the second direction, and further the feeding amount in the grinding process is controlled, namely the grinding amount is determined.

The grinding tool switching mechanism is used for driving the grinding tool mounting seat and at least one pair of grinding tools on the grinding tool mounting seat to switch between the first transfer guide rail and the second transfer guide rail, so that the at least one pair of grinding tools can grind the silicon rod clamped by the first silicon rod clamp on the first transfer guide rail or grind the silicon rod clamped by the second silicon rod clamp on the second transfer guide rail.

In an embodiment of the present application, any one of the at least one pair of grinding tools includes a rough grinding wheel and a finish grinding wheel nested with each other. For example, the rough grinding wheel is nested within the finish grinding wheel, or the finish grinding wheel is nested within the rough grinding wheel.

In some embodiments, the grinding tool includes a tool base, and a rough grinding wheel and a finish grinding wheel disposed on the tool base, wherein the rough grinding wheel is nested within the finish grinding wheel, the finish grinding wheel is larger than the rough grinding wheel, the finish grinding wheel is circular and hollow in the middle (i.e., circular ring structure), the rough grinding wheel can be circular structure or the rough grinding wheel can be circular and hollow in the middle (i.e., circular ring structure). The abrasive grain size of the finish grinding wheel is smaller than that of the rough grinding wheel, and the abrasive grain density of the finish grinding wheel is larger than that of the rough grinding wheel.

When the grinding tool comprises a rough grinding wheel and a finish grinding wheel, the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp can be subjected to rough grinding operation and finish grinding operation by using the grinding tool. Therefore, at least one of the rough grinding wheel and the finish grinding wheel is provided with a telescopic driving mechanism. For example, when the rough grinding wheel is nested in the finish grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, when performing rough grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to extend out and protrude out of the finish grinding wheel, so as to perform rough grinding operation on a silicon rod by using the protruding rough grinding wheel, and when performing finish grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to contract and sink into the finish grinding wheel, so as to perform finish grinding operation on the silicon rod by using the finish grinding wheel. Or when the rough grinding wheel is nested in the fine grinding wheel, the fine grinding wheel can be provided with a telescopic driving mechanism, when rough grinding operation is carried out, the telescopic driving mechanism is used for driving the fine grinding wheel to contract and recess in the rough grinding wheel so as to carry out rough grinding operation on a silicon rod by using the rough grinding wheel, and when fine grinding operation is carried out, the telescopic driving mechanism is used for driving the fine grinding wheel to extend out and protrude out of the rough grinding wheel so as to carry out fine grinding operation on the silicon rod by using the protruding fine grinding wheel.

In some embodiments, the finish grinding wheel is nested within the rough grinding wheel, the rough grinding wheel being larger than the finish grinding wheel, the rough grinding wheel being circular and hollow in the middle (i.e., an annular structure), the finish grinding wheel being either circular or hollow in the middle (i.e., an annular structure). The abrasive grain size of the finish grinding wheel is smaller than that of the rough grinding wheel, and the abrasive grain density of the finish grinding wheel is larger than that of the rough grinding wheel.

When the grinding tool comprises a rough grinding wheel and a finish grinding wheel, the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp can be subjected to rough grinding operation and finish grinding operation by using the grinding tool. Therefore, at least one of the rough grinding wheel and the finish grinding wheel is provided with a telescopic driving mechanism. For example, when the finish grinding wheel is nested in the rough grinding wheel, the rough grinding wheel may be provided with a telescopic driving mechanism, when performing rough grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to extend out and protrude out of the finish grinding wheel, so as to perform rough grinding operation on a silicon rod by using the protruding rough grinding wheel, and when performing finish grinding operation, the telescopic driving mechanism is used to drive the rough grinding wheel to contract and sink into the finish grinding wheel, so as to perform finish grinding operation on a silicon rod by using the finish grinding wheel. Or when the accurate grinding wheel is nested in the rough grinding wheel, the accurate grinding wheel can be provided with a telescopic driving mechanism, when the rough grinding operation is carried out, the telescopic driving mechanism is utilized to drive the accurate grinding wheel to contract and recess in the rough grinding wheel so as to utilize the rough grinding wheel to carry out the rough grinding operation on the silicon rod, and when the accurate grinding operation is carried out, the telescopic driving mechanism is utilized to drive the accurate grinding wheel to extend out and protrude out of the rough grinding wheel so as to utilize the protruding accurate grinding wheel to carry out the accurate grinding operation on the silicon rod.

In an embodiment of the present application, the grinder switching mechanism is configured to drive the at least one pair of grinding grinders to switch between the first transfer rail and the second transfer rail along the grinder mounting seat.

In an embodiment of the present application, the silicon rod processing platform is provided with a first processing location and a second processing location along a first direction in sequence, and the first processing location and the second processing location cross the width dimension of the silicon rod processing platform in a second direction. The first transfer device and the second transfer device are arranged in parallel along a first direction, wherein a first transfer guide rail in the first transfer device penetrates through the first processing area and the second processing area along the first direction, and a second transfer guide rail in the second transfer device penetrates through the first processing area and the second processing area along the first direction. In an embodiment of the present application, the grinding apparatus includes a grinder mounting seat and at least one pair of grinding tools provided on the grinder mounting seat, and the at least one pair of grinding tools is movable in the second direction by the grinder changeover mechanism to be changed over between the first transfer rail and the second transfer rail, for example, the at least one pair of grinding tools is driven to move on the grinder mounting seat in the second direction by the grinding changeover mechanism to be changed over from the first transfer rail to the second transfer rail, or the at least one pair of grinding tools is driven to move on the grinder mounting seat in the second direction by the grinding changeover mechanism to be changed over from the second transfer rail to the first transfer rail.

In one embodiment, the grinder transfer mechanism comprises: the grinding tool conversion guide rail and the grinding tool conversion driving unit.

The grinding tool conversion guide rail is arranged along the second direction and used for arranging the grinding tool. In certain embodiments, the abrasive tool transfer rail is disposed on the silicon rod processing platform along the second direction, and the at least one pair of grinding tools are mounted on the abrasive tool transfer rail by, for example, a slide block or the like.

And the grinding tool conversion driving unit is used for driving the at least one pair of grinding tools to move along the grinding tool conversion guide rail.

As described above, the grinder advancing-retracting mechanism is configured to drive at least one of the at least one pair of grinding grinders to move in the second direction, and the grinder switching mechanism is configured to drive the at least one pair of grinding grinders to switch between the first transfer rail and the second transfer rail in the second direction, so that, in some embodiments, the grinder advancing-retracting mechanism and the grinder switching mechanism may be integrated into one, that is, a set of driving mechanisms may be used to perform the functions of the grinder advancing-retracting mechanism and the grinder switching mechanism.

When the silicon rod at the second processing position is ground by the grinding tool, the grinding tool driving and reversing mechanism of the grinding tool drives the grinding tool in the at least one pair of grinding tools to move along the second direction so as to determine the feeding amount of the grinding tool and the grinding surface of the silicon rod, the grinding tool advancing mechanism drives the at least one pair of grinding tools to move along the horizontal line until the silicon rod passes through the whole silicon rod, if necessary, the grinding tool advancing mechanism can drive the at least one pair of grinding tools to move back and forth along the horizontal line so as to ensure that the silicon rod is fully ground in the length direction, and meanwhile, the grinding tool driving and reversing mechanism drives the at least one pair of grinding tools arranged oppositely to move in the second direction so as to determine the feeding amount of the grinding tool and the grinding surface of the silicon rod. In the embodiment shown in fig. 9, the at least one pair of grinding tools are disposed to face each other in the second direction, and the grinding surfaces of the at least one pair of grinding tools are located in opposing plumb line direction planes perpendicular to the horizontal line, and when the silicon rod is ground, at least one grinding tool of the at least one pair of grinding tools is driven by a tool advancing and retracting mechanism to move back and forth in the second direction to adjust the feeding amount, so that the left and right side surfaces of the silicon rod in the second direction are ground.

The silicon rod processing equipment in the embodiment further comprises a grinding repair device, the grinding repair device comprises an installation main body and at least one grinding portion, the installation main body can be arranged on the silicon rod clamp, and the at least one grinding portion is arranged on the installation main body and used for grinding the corresponding at least one grinding tool. Referring to fig. 9, the mounting body 831 of the polishing repair apparatus is disposed on a silicon rod clamp, taking a first silicon rod clamp 330 as an example, the first silicon rod clamp 330 includes a first clamp arm mounting seat 331, at least one pair of first clamp arms 333, and a first clamp arm driving mechanism (not shown in the drawings), taking a second silicon rod clamp 430 as an example, the second silicon rod clamp 430 includes a second clamp arm mounting seat 431, at least one pair of second clamp arms 433, and a second clamp arm driving mechanism (not shown in the drawings). For example, the mounting body 831 of the polishing repair apparatus is disposed in the first clamp arm 333 of the first silicon rod clamp 330 or the second clamp arm 433 of the second silicon rod clamp 430, and a thinning portion 833 is disposed on each of two opposite sides of the mounting body 831 along the second direction. Taking the grinding repair device for grinding the finish grinding tools in the finish grinding device as an example, the finish grinding device comprises a pair of finish grinding tools, the pair of finish grinding tools which are oppositely arranged are moved to the outer side of the grinding part along the second direction, the silicon rod clamp is driven to move along the horizontal line so as to enable the two repair parts on the two sides of the mounting body to reciprocate along the first direction, and in this state, the pair of finish grinding tools in the finish grinding device can be oppositely close to (for example, along the second direction) the grinding part until the pair of finish grinding tools contacts the surface of the grinding part, so that grinding is realized.

The thinning may be, for example, an oilstone. Here, the oilstone is, for example, diamond oilstone, boron carbide oilstone, fine-ground oilstone, general oilstone, or the like. The oilstone may effect a modification of the surface of the grinding tool contacted by the oilstone by virtue of the particle size of the surface. In the coping process, the surface of the oilstone contacts the grinding tool, the surface of the grinding tool is trimmed to be uniform granularity, and the flatness and the verticality of the plane of the grinding tool are improved.

In some embodiments, the grinding repair device further comprises a sensing device arranged on the base and used for detecting the grinding tool of the silicon rod grinding machine. In the embodiment shown in fig. 9, the grinding repair device further includes a sensor 835 disposed adjacent to the thinning portion 833.

For the sensing device 835, reference may be made to the description of the sensing device 815 in fig. 4, which is not repeated herein.

The silicon rod processing equipment disclosed by the embodiment integrates the cutting device and the grinding device, the cutting device and the grinding device are respectively arranged at the first processing position and the second processing position of the silicon rod processing platform, the first transfer device and the second transfer device which simultaneously penetrate through the first processing position and the second processing position are arranged, the silicon rod clamp and the driving mechanism are respectively arranged on the first transfer device and the second transfer device, and the first transfer device, the second transfer device, the cutting device and the grinding device are coordinately controlled to enable the cutting device located at the first processing position and the grinding device located at the second processing position to be in working states at the same moment, so that the integrated operation of silicon rod development and grinding multiple processes is completed, and the production efficiency and the product processing operation quality are improved. Meanwhile, the repairing part of the grinding repairing device can be utilized to realize the coping of the grinding tool through the contact with the grinding tool.

Referring to fig. 10 and 11, the silicon rod processing apparatus according to the present application is shown in a fourth embodiment, in which fig. 10 is a schematic structural view of the silicon rod processing apparatus at a first viewing angle, and fig. 11 is a schematic structural view of the silicon rod processing apparatus at a second viewing angle.

In the embodiments provided in the present application, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, where the first direction, the second direction, and the third direction are all linear directions and are perpendicular to each other two by two, in the embodiments shown in fig. 10 and 11, an X axis of a diagram coordinate axis is the first direction, a Y axis of the diagram coordinate axis is the second direction, and a Z axis of the diagram coordinate axis is the third direction.

As shown in fig. 10 and 11, the silicon rod processing apparatus is a silicon rod cutting and grinding all-in-one machine, and includes a base 14, a first silicon rod clamp 34, a second silicon rod clamp 44, a cutting device 54, and a grinding device 64.

The machine base 14 serves as a main body part of the silicon rod processing equipment and is used for providing an operation platform. The base is provided with a silicon rod processing platform, and a first processing area and a second processing area are arranged on the silicon rod processing platform.

The first silicon rod clamp 34 and the second silicon rod clamp 44 are clamping devices respectively corresponding to the first processing region and the second processing region, and are used for realizing motion control of a silicon rod, and the silicon rod can be driven to move along a first direction relative to the cutting device or the grinding device by clamping the silicon rod and driving the silicon rod to move along the first direction, so that preset cutting operation and grinding operation are realized. In an actual scene, at least one silicon rod clamp can be arranged on the first processing position and the second processing position so that the first processing position and the second processing position on the silicon rod processing platform can carry out silicon rod processing operation, and therefore production efficiency is improved.

For any silicon rod clamp, the first silicon rod clamp or the second silicon rod clamp comprises a clamp arm mounting seat, a moving mechanism, a pair of clamp arms, and a clamp arm driving mechanism.

The clamping arm mounting seat is arranged on the corresponding guide structure, wherein the guide structure can be a transfer guide rail, a guide pillar or a combination of the transfer guide rail and the guide pillar.

The moving mechanism is used for driving the clamping arm mounting seat to move along the corresponding guide structure.

In certain implementations, the moving mechanism may include: a moving rack, a drive gear, and a drive source. In certain implementations, the moving mechanism may include: a movable screw rod and a driving source.

The pair of clamping arms are arranged oppositely along the first direction and used for clamping two end faces of the silicon rod. The silicon rod is a slender structure which is cut, the length direction of the silicon rod is placed along the first direction, and the end faces are sections of two ends in the length direction. Wherein, any one of the pair of clamping arms is provided with a clamping part.

The clamping arm driving mechanism is used for driving at least one clamping arm in a pair of clamping arms to move along a first direction so as to adjust the clamping distance between the pair of clamping arms.

The clamping part of arm lock is the rotary type design, wherein, silicon rod anchor clamps still include clamping part slewing mechanism for the clamping part on the arm lock rotates in the drive silicon rod anchor clamps. In the actual grinding, the grinding face that the silicon rod needs to go on and the edge of chamfer at juncture between four faces and four faces of length direction, by the arm lock that this application provided, can realize the selection and the control to the different grinding faces of silicon rod and different edges.

In certain embodiments, the clamping portion has a multi-point contact type clamping head, it being understood that the contact manner between the multi-point contact type clamping head and the end surface of the silicon rod is not limited to point contact, and the clamping portion has, for example, a plurality of protrusions to contact the end surface of the silicon rod, wherein each protrusion may be in surface contact with the end surface of the silicon rod.

The cutting device 54 is used for cutting the silicon rod on the first processing location or the second processing location of the silicon rod processing platform to form a cut silicon rod. Here, the cutting device 54 is provided at a first mounting position on the silicon rod processing platform by the first conversion mechanism. The first conversion mechanism can be arranged on the base; alternatively, the first converting mechanism and the cutting device 54 may be disposed in a hollow region (or receiving space) of the housing, and in this arrangement, the first converting mechanism and the cutting device may be separate from the housing, for example, as a separate sales unit. The first switching mechanism drives the cutting device 54 to switch positions between the first processing area and the second processing area, so that any processing area can perform cutting operation.

The grinding device 64 is used for grinding the cut silicon rod at the first processing location or the second processing location of the silicon rod processing platform. The grinding device 64 is arranged at a second mounting position on the silicon rod processing platform by the second switching mechanism. Similarly, the second switching mechanism may be disposed on the housing or in the receiving space of the housing, and the second switching mechanism and the grinding device 64 may be separate from the housing, for example, as a separate sales unit. The second switching mechanism drives the polishing device 64 to switch positions between the first processing area and the second processing area, so that any processing area can perform polishing operation.

Here, the silicon rod processing apparatus may control the processing regions where the cutting device 54 and the grinding device 64 are respectively located, so that the first processing region and the second processing region may respectively perform the cutting operation and the grinding operation at the same time, thereby improving the processing efficiency.

In some embodiments, the first switching mechanism comprises a first rotating shaft along which the cutting device 54 is rotated by a preset angle to switch positions between the first processing position and the second processing position; the second switching mechanism includes a second rotating shaft, and the grinding device 64 is rotated by a predetermined angle along the second rotating shaft to switch the position between the first processing region and the second processing region.

In some embodiments, the first axis of rotation is disposed in a first direction and the second axis of rotation is disposed in a plumb line direction; the first processing area and the second processing area are arranged on two opposite sides of the second direction, wherein the first direction, the second direction and the plumb line direction are pairwise perpendicular. With this arrangement, the cutting device 54 and the grinding device 64 can be prevented from interfering with each other during the process of converting the machining area only by making a certain distance between the first mounting position and the second mounting position of the first converting mechanism and the second converting mechanism corresponding to the first converting mechanism and the second converting mechanism respectively.

The grinding device comprises at least one pair of grinding tools, wherein the grinding surfaces of the pair of grinding tools are positioned in opposite horizontal planes; and the grinding tool advancing and retreating mechanism is used for driving at least one of the pair of grinding tools to move along the direction of the plumb line.

The pair of grinding tools are oppositely arranged along the direction of the plumb line so as to form two opposite grinding surfaces along the direction of a horizontal plane. In certain implementations, the abrasive article includes a grinding wheel and a rotating shaft. In certain embodiments, the grinding wheel is circular and has a through hole disposed in the middle. The grinding wheel is connected to the rotating shaft to rotate along the rotating shaft in a controlled mode, so that the side face of the silicon rod to be cut can be contacted in a rotating state to achieve grinding. It will be appreciated that in a possible embodiment, the grinding means may also comprise a grinding wheel, but grinding takes an increased time in this arrangement.

In an embodiment of the present application, any one of the at least one pair of grinding tools includes a rough grinding wheel and a finish grinding wheel nested with each other. For example, the rough grinding wheel is nested within the finish grinding wheel, or the finish grinding wheel is nested within the rough grinding wheel.

In some embodiments, the grinding tool includes a tool base, and a rough grinding wheel and a finish grinding wheel disposed on the tool base, wherein the rough grinding wheel is nested within the finish grinding wheel, the finish grinding wheel is larger than the rough grinding wheel, the finish grinding wheel is circular and hollow in the middle (i.e., circular ring structure), the rough grinding wheel can be circular structure or the rough grinding wheel can be circular and hollow in the middle (i.e., circular ring structure). The abrasive grain size of the finish grinding wheel is smaller than that of the rough grinding wheel, and the abrasive grain density of the finish grinding wheel is larger than that of the rough grinding wheel.

In some embodiments, the finish grinding wheel is nested within the rough grinding wheel, the rough grinding wheel being larger than the finish grinding wheel, the rough grinding wheel being circular and hollow in the middle (i.e., an annular structure), the finish grinding wheel being either circular or hollow in the middle (i.e., an annular structure). The abrasive grain size of the finish grinding wheel is smaller than that of the rough grinding wheel, and the abrasive grain density of the finish grinding wheel is larger than that of the rough grinding wheel.

The grinding tool advancing and retreating mechanism is used for driving at least one grinding tool in the at least one pair of grinding tools to move along the plumb line direction so as to adjust the grinding amount of the cut silicon rod. In some embodiments, the grinder advancing-retreating mechanism includes: the advance and retreat guide rail is arranged on the first transfer mechanism along the direction of the plumb line and used for arranging the grinding tool; a driving source for driving at least one of the grinding tools to move along the advancing and retreating guide rail.

In one implementation, the grinder advancing and retracting mechanism includes a slide rail, a driving motor, and a ball screw (not shown). Sliding guide locates along the plumb line direction first conversion mechanism, grind the grinding apparatus be provided with sliding guide complex is along the guide slot of plumb line direction, ball follows sliding guide sets up and with driving motor coupling. In other possible implementations, the driving source may also be configured as an air cylinder, a hydraulic pump, etc., and the telescopic direction thereof is configured as a plumb line direction; still alternatively, the driving source may be provided as a lead screw assembly including a lead screw and a rotary driving source, wherein the lead screw is connected to the grinding stone to move the grinding stone along the slide guide under the driving of the rotary driving source.

In some embodiments, the grinding tool advancing and retreating mechanism includes a bidirectional screw rod and a driving source, wherein two sides of the bidirectional screw rod are provided with threads with opposite turning directions, the bidirectional screw rod is arranged along the direction of the plumb line, and two sides of the bidirectional screw rod are respectively connected to a grinding tool.

Generally, a grinding tool is in a fatigue state during use, uneven wear of different areas of the surface of the grinding tool causes uneven or reduced flatness of the surface of the grinding tool, and the surface of the grinding tool may be contaminated with silicon rod chips or grinding tool chips, so that the surface state of the grinding tool is not changed after long-term grinding operation, and the grinding performance is reduced. In order to prolong the service life of the grinding tool, tools such as a grinding stone and the like can be adopted to correct the surface of the grinding tool, or the grinding tool can be replaced after the grinding tool reaches the fatigue life.

The silicon rod processing equipment in the embodiment further comprises a grinding repair device, wherein the grinding repair device comprises an installation main body and at least one grinding part.

The mounting main body can be arranged on the silicon rod clamp, and the at least one grinding part is arranged on the mounting main body and used for grinding the corresponding at least one grinding tool. In certain embodiments, the mounting body in the abrasive repair device is provided on at least one clamping arm of a silicon rod clamp, for example a first clamping arm of a first silicon rod clamp or a second clamping arm of a second silicon rod clamp.

Referring to fig. 12, a schematic structural diagram of the silicon rod clamp and the polishing repair device disposed thereon in fig. 11 is shown.

The grinding repair device is configured on the silicon rod clamp of the silicon rod cutting and grinding all-in-one machine, and in the embodiment shown in fig. 12, a second silicon rod clamp in a second transfer device is taken as an example. The grinding repair device is disposed on the second silicon rod clamp 440, and includes an installation body 841 and at least one thinning portion 843. An installation body 841 of the grinding repair device is arranged on one of the second clamping arms 443 of the second silicon rod clamp 440, and thinning portions 843 are respectively arranged on two opposite sides of the installation body 841 along a third direction (i.e., a plumb line direction). With this arrangement, the grinding repair device can be used for simultaneously grinding two grinding tools in the grinding device. In the case of polishing the grinding tools in the grinding device by using the grinding and repairing device, the grinding device includes a pair of grinding tools oppositely arranged along a third direction, the pair of grinding tools oppositely arranged is moved to the outer side of the polishing portion along the third direction, the silicon rod clamp is driven to move along a horizontal line so as to make the two repairing portions on the two sides of the mounting body reciprocate along the first direction, and in this state, the pair of grinding tools in the grinding device can be oppositely close to the polishing portion (for example, along the third direction) to contact the surface of the polishing portion so as to realize grinding.

In certain embodiments, the thinning 843 is an oilstone. Here, the oilstone is, for example, diamond oilstone, boron carbide oilstone, fine-ground oilstone, general oilstone, or the like. The oilstone may effect a modification of the surface of the grinding tool contacted by the oilstone by virtue of the particle size of the surface. In the coping process, the surface of the oilstone contacts the grinding tool, the surface of the grinding tool is trimmed to be uniform granularity, and the flatness and the verticality of the plane of the grinding tool are improved.

In some embodiments, the grinding repair device further comprises a sensing device arranged on the base and used for detecting the grinding tool of the silicon rod cutting and grinding all-in-one machine. In the embodiment shown in fig. 12, the abrasive repair device further includes a sensing device 845 disposed adjacent to the thinning 843.

With respect to the sensing device 845, reference may be made to the description related to the sensing device 815 in fig. 4, and the description thereof is omitted here.

The silicon rod processing equipment disclosed by the embodiment is provided with the first processing area and the second processing area, so that silicon rod processing operation can be simultaneously carried out on the two processing areas, and the silicon rod processing efficiency is improved; meanwhile, the first conversion mechanism and the second conversion mechanism respectively drive the cutting device and the grinding device to convert the processing positions where the cutting device and the grinding device are located, so that the silicon rod clamp drives the clamped silicon rod to move along the axis direction of the silicon rod, the cutting and grinding operation can be realized at any processing position, and the transfer path of the silicon rod among different working procedures is simplified; so, the silicon rod processing equipment of this application has simplified the transfer route of silicon rod processing between different processes when realizing improving machining efficiency, has reduced the manpower loss, the time loss and the impaired risk of silicon rod of process circulation. Meanwhile, the repairing part of the grinding repairing device can be utilized to realize the coping of the grinding tool through the contact with the grinding tool.

Fig. 13 is a schematic structural view of a silicon rod processing apparatus according to a fifth embodiment of the present disclosure.

In the embodiment provided by the present application, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, where the first direction, the second direction, and the third direction are all linear directions and are mutually perpendicular to each other two by two, in the embodiment shown in fig. 13, the X axis of the graphic coordinate axis is the first direction, the Y axis of the graphic coordinate axis is the second direction, and the Z axis of the graphic coordinate axis is the third direction.

As shown in fig. 13, the silicon rod processing apparatus is a silicon rod cutting and grinding integrated machine, and includes a base 15, a first silicon rod clamp 35, a second silicon rod clamp 45, a cutting device 55, and a grinding device 65.

The machine base 15 serves as a main body part of the silicon rod processing equipment and is used for providing an operation platform. The base is provided with a silicon rod processing platform, and a first processing area and a second processing area are arranged on the silicon rod processing platform.

The first silicon rod clamp 35 and the second silicon rod clamp 45 are clamping devices respectively corresponding to the first processing region and the second processing region, and are used for realizing motion control of the silicon rod, and the silicon rod can be driven to move along a first direction by clamping the silicon rod and driving the silicon rod to move along the first direction, so that the silicon rod can move along the first direction relative to the cutting device or the grinding device, and preset cutting operation and grinding operation can be realized. In an actual scene, at least one silicon rod clamp can be arranged on the first processing position and the second processing position so that the first processing position and the second processing position on the silicon rod processing platform can carry out silicon rod processing operation, and therefore production efficiency is improved.

For any silicon rod clamp, the first silicon rod clamp or the second silicon rod clamp comprises a clamp arm mounting seat, a moving mechanism, a pair of clamp arms, and a clamp arm driving mechanism.

The clamping arm mounting seat is arranged on the corresponding guide structure, wherein the guide structure can be a transfer guide rail, a guide pillar or a combination of the transfer guide rail and the guide pillar.

The moving mechanism is used for driving the clamping arm mounting seat to move along the corresponding guide structure.

In certain implementations, the moving mechanism may include: a moving rack, a drive gear, and a drive source. In certain implementations, the moving mechanism may include: a movable screw rod and a driving source.

The pair of clamping arms are arranged oppositely along the first direction and used for clamping two end faces of the silicon rod. The silicon rod is a slender structure which is cut, the length direction of the silicon rod is placed along the first direction, and the end faces are sections of two ends in the length direction. Wherein, any one of the pair of clamping arms is provided with a clamping part.

The clamping arm driving mechanism is used for driving at least one clamping arm in a pair of clamping arms to move along a first direction so as to adjust the clamping distance between the pair of clamping arms.

The clamping part of arm lock is the rotary type design, wherein, silicon rod anchor clamps still include clamping part slewing mechanism for the clamping part on the arm lock rotates in the drive silicon rod anchor clamps. In the actual grinding, the grinding face that the silicon rod needs to go on and the edge of chamfer at juncture between four faces and four faces of length direction, by the arm lock that this application provided, can realize the selection and the control to the different grinding faces of silicon rod and different edges.

In certain embodiments, the clamping portion has a multi-point contact type clamping head, it being understood that the contact manner between the multi-point contact type clamping head and the end surface of the silicon rod is not limited to point contact, and the clamping portion has, for example, a plurality of protrusions to contact the end surface of the silicon rod, wherein each protrusion may be in surface contact with the end surface of the silicon rod.

The cutting device 55 is used for cutting the silicon rod on the first processing area or the second processing area of the silicon rod processing platform to form a cut silicon rod.

The grinding device 65 is used for grinding the cut silicon rod in the second processing area or the first processing area of the silicon rod processing platform.

In this embodiment, the cutting device 55 and the grinding device 65 are shared by a first switching mechanism by means of which the cutting device and the grinding device can be driven to switch positions between the first processing position and the second processing position.

The first conversion mechanism is connected with the cutting device and the grinding device and used for driving the cutting device and the grinding device to convert positions between a first processing area and a second processing area. For example, the cutting device is located in the first processing region and the grinding device is located in the second processing region, the cutting device can be switched to the second processing region and the grinding device can be switched to the first processing region by the first transfer mechanism, and thus the first processing region and the second processing region on the silicon rod processing platform can simultaneously perform processing operation.

The first conversion mechanism can be arranged between the first processing area and the second processing area, and the first conversion mechanism can be arranged on the base; or, the machine base is provided with an accommodating space between the first machining area and the second machining area, and the first conversion mechanism is arranged in the accommodating space of the machine base.

In some embodiments, the first switching mechanism comprises a first rotating shaft that is driven to rotate by a preset angle to switch the cutting device and the grinding device between the first processing position and the second processing position. The cutting device and the grinding device share the first rotating shaft, so that the structural layout of the silicon rod processing equipment can be more compact, and the integral equipment space can be effectively controlled while the cutting and grinding integrated multi-process processing operation is realized.

In some implementations, the cutting device and the grinding device may be connected to the same driving device, and the cutting device and the grinding device are driven by the rotary driving mechanism to simultaneously rotate along the first rotating shaft, and simultaneously realize the switching of the corresponding processing areas. It should be understood that the cutting device and the grinding device can also be connected to different drive devices to realize the position switching between the first processing area and the second processing area independently.

In one embodiment, the first conversion mechanism further comprises a rotary driving mechanism for driving the cutting device and the grinding device to rotate, and the rotary driving mechanism comprises: the driving gear is coupled to the power driving source; and the driven gear is meshed with the driving gear and is connected with the first rotating shaft.

The driving gear is driven by the driving source to rotate, so that the meshed driven gear is driven to rotate, the driven gear can be used for bearing or connecting the grinding device and the cutting device, or the driven gear can be arranged to be integrated with a shell or a cylinder for connecting the grinding device and the cutting device, for example, the gear teeth of the driven gear are arranged on the shell of the first conversion mechanism; the driven gear can drive the grinding device and the cutting device to rotate, in this example, the first rotating shaft can be a wheel axle of the driven gear, or the first rotating shaft is connected with the driven gear along the wheel axle direction of the driven gear.

In another example, the rotation driving mechanism is a driving motor coupled to the first rotating shaft, and is configured to control the first rotating shaft to rotate by a preset angle so as to switch the grinding device and the cutting device between the first processing region and the second processing region.

In some embodiments, the first rotating axis is arranged in the direction of the plumb line, and the first machining region and the second machining region are arranged on two opposite sides of the second direction; and the first direction, the second direction and the plumb line direction are pairwise perpendicular.

In this example, the grinding device and the cutting device are connected to two opposite sides of the first switching mechanism in the second direction, and the grinding device and the cutting device can be switched between the first processing area and the second processing area by rotating along the first rotating shaft by a preset angle under the driving of the first switching mechanism. When the first processing area and the second processing area are parallel and oppositely arranged, in an actual processing scene, the preset angle is 180 degrees, for example; in the top view direction, the direction of the preset angle may be clockwise or counterclockwise.

The first rotating shaft is arranged in the direction of the plumb line, so that in the process that the cutting device and the grinding device are driven to rotate to switch the machining area, the height of the center of gravity of the cutting device and the gravity of the grinding device is unchanged, the stability of the switching process can be improved, the equipment safety is benefited, and the stress of the first switching mechanism when the cutting device and the grinding device switch the machining area is reduced.

The silicon rod processing apparatus in this embodiment further includes a grinding repair device.

In certain embodiments, the grinding repair device is on a silicon rod clamp configured with the silicon rod grinder. With regard to the specific structure and the operation principle of the grinding repair device in the silicon rod processing apparatus shown in fig. 12, reference may be made to fig. 12 in combination with the foregoing description, and further description is omitted here.

The silicon rod processing equipment disclosed by the embodiment is provided with the first processing area and the second processing area, so that silicon rod processing operation can be simultaneously carried out on the two processing areas, and the silicon rod processing efficiency is improved; meanwhile, the first conversion mechanism is used for converting the processing positions where the cutting device and the grinding device are located, so that the silicon rod clamp drives the clamped silicon rod to move along the axis direction of the silicon rod, the cutting and grinding operation can be realized at any processing position, and the transfer path of the silicon rod among different processes is simplified; so, the silicon rod processing equipment of this application has simplified the transfer route of silicon rod processing between different processes when realizing improving machining efficiency, has reduced the manpower loss, the time loss and the impaired risk of silicon rod of process circulation. Meanwhile, the repairing part of the grinding repairing device can be utilized to realize the coping of the grinding tool through the contact with the grinding tool.

Referring to fig. 14, a schematic structural view of a silicon rod processing apparatus according to the present application in a sixth embodiment is shown.

As shown in fig. 14, the silicon rod processing apparatus is a silicon rod grinding machine, and includes a base 16, a silicon rod transfer device 26, a rough grinding device 36, a finish grinding device 46, and a chamfering device 56.

In the exemplary embodiment shown in fig. 14, the machine base 16 is of a generally rectangular design, and the silicon rod processing platform arranged on the machine base 16 is designed to be rectangular in conformity with the shape of the machine base 16. One or more sides of silicon rod processing platform are equipped with the processing position district, for example for first processing position district, second processing position district, and third processing position district, wherein, the third processing position is located between first processing position district and the second processing position district, specifically, first processing position district is located the first side of silicon rod processing platform, the second side of silicon rod processing platform is located to the third processing position district, the second side is adjacent to first side, the third side of silicon rod processing platform is located to the third processing position district, the third side is adjacent to the second side and just to first side, namely, first processing position differs 90 with the third processing position, third processing position differs 90 with the second processing position.

The silicon rod transfer device is arranged on the base and used for transferring the silicon rod. As shown in fig. 14, the silicon rod transfer device 26 comprises a transfer body and a plurality of silicon rod clamps 261 and an indexing mechanism provided on the transfer body.

The silicon rod transfer device 26 is intended to transfer the processed silicon rod 101 between the respective processing locations of the silicon rod processing platform, and therefore, in an embodiment of the present application, the transfer body is provided in the central region of the silicon rod processing platform, and the transfer body is designed to be rectangular in compliance with the shape of the silicon rod processing platform. Each side of the rectangular transfer body may serve as a mounting surface for mounting a plurality of silicon rod clamps 261, for example, one silicon rod clamp 261 is mounted on each of the four sides of the transfer body.

In addition, in this embodiment, the silicon rod transferring device 46 may switch the transferring body and each silicon rod fixture 261 provided therein at each processing location through the transposition mechanism to transfer the silicon rod 101 held by each silicon rod fixture 261 to the corresponding processing location for performing the corresponding processing operation.

The transposition mechanism comprises a transposition rotating shaft and a transposition driving unit used for driving the transposition rotating shaft to rotate, so that the transposition rotating shaft is driven to rotate by a preset angle, and the transferring main body and each silicon rod clamp 261 arranged on the transferring main body can be switched at each processing position. In some embodiments, the transposition shaft is located at the geometric center of the transferring body, and the transposition shaft is arranged in the direction of the plumb line.

With respect to the silicon rod clamps 261, any one of the silicon rod clamps 261 includes a pair of clamp arms and a clamp arm driving mechanism.

The pair of clamping arms are arranged oppositely along the horizontal line and used for clamping two end faces of the silicon rod. The silicon rod is a slender structure which is cut, the length direction of the silicon rod is arranged along a horizontal line, and the end faces are sections at two ends in the length direction. As shown in fig. 14, two of the pair of arms extend outwardly from one side of the transfer body. Wherein, any one of the pair of clip arms is provided with a clamping portion, that is, each clip arm is provided with a clamping portion.

In an embodiment of the present application, the clamp arm driving mechanism may include: the opening and closing guide rail and the opening and closing drive unit are arranged, wherein the opening and closing guide rail is arranged on the transfer main body along a horizontal line and is used for arranging a pair of clamping arms, and the opening and closing drive unit is used for driving at least one clamping arm in the pair of clamping arms to move along the opening and closing guide rail. The opening and closing driving unit in the clamping arm driving mechanism further comprises a bidirectional screw rod and a driving source, or the opening and closing driving unit comprises a pair of racks, a driving gear and a driving motor.

In certain embodiments, the clamping portions of the clamping arms are of a rotary design, and each silicon rod clamp further comprises a clamping portion rotating mechanism for driving the clamping portion on the clamping arm in the silicon rod clamp to rotate.

In certain embodiments, the clamping portion has a multi-point contact type clamping head, it being understood that the contact manner between the multi-point contact type clamping head and the end surface of the silicon rod is not limited to point contact, and the clamping portion has, for example, a plurality of protrusions to contact the end surface of the silicon rod, wherein each protrusion may be in surface contact with the end surface of the silicon rod.

In an embodiment of the present application, the rotatable platform may be provided as a whole hinged with a hinge device having a locking function, and may be rotatable along an axis of a horizontal line. The axis of the rotating shaft is connected to the clamping part rotating mechanism.

In an embodiment of the application, the clamping portion of the clamping arm may be configured as a rotatable circular truncated cone, and a circular plane of the circular truncated cone contacts with the end surface of the silicon rod and keeps relatively stationary with the end surface of the silicon rod after clinging to the end surface of the silicon rod. The silicon rod clamping part further comprises a locking structure, and the clamping arm clamping part is in a locking state when a selected plane is ground. In the switching of different grinding surfaces, the silicon rod clamping part is driven by the clamping part rotating mechanism to rotate along the circle center of the circular truncated cone.

In the embodiment of the present application, the silicon rod clamps 261 configured by using the silicon rod transfer device 26 can clamp the silicon rod 101 in a horizontal manner and can drive the clamped silicon rod 101 to rotate by a predetermined angle by using the axis line thereof as a rotation axis, wherein the direction of the axis line of the silicon rod 101 is consistent with the horizontal line.

The silicon rod grinding machine in the embodiment of the application further comprises a rough grinding device, an accurate grinding device and a chamfering device, wherein the rough grinding device, the accurate grinding device and the chamfering device are respectively arranged on corresponding machining areas.

As shown in fig. 14, the rough grinding device 36 is provided in a first processing location, the finish grinding device 46 is provided in a second processing location, and the chamfering device 56 is provided in a third processing location, wherein the third processing location is provided between the first processing location and the second processing location. As such, the rough grinding device 36 is located at the first location for performing rough grinding operation on the silicon rod 101 at the first location, the chamfering device 56 is located at the third location for performing chamfering operation on the silicon rod 101 after rough grinding at the third location, and the fine grinding device 46 is located at the second location for performing fine grinding operation on the silicon rod 101 after chamfering at the second location.

With respect to rough grinding device 36, in certain embodiments, rough grinding device 36 may include: the device comprises a rough grinding installation structure, at least one pair of rough grinding tools, a rough grinding tool advancing and retreating mechanism and a rough grinding tool advancing mechanism. The pair of rough grinding tools are arranged on the rough grinding mounting structure, and specifically, the pair of rough grinding tools are oppositely arranged on one mounting side of the rough grinding mounting structure along the direction of a plumb line, so that the grinding surfaces of the pair of rough grinding tools are positioned in opposite horizontal planes, namely, the grinding surfaces of two rough grinding tools in the pair of rough grinding tools are respectively positioned in a first horizontal plane and a second horizontal plane, wherein the first horizontal plane and the second horizontal plane are parallel to each other and are perpendicular to the plumb line.

With respect to the refining apparatus 46, in certain embodiments, the refining apparatus 46 may include: a finish grinding mounting structure, at least one pair of finish grinding stones, a finish grinding stone advancing and retreating mechanism, and a finish grinding stone advancing mechanism. Wherein the at least one pair of finish grinding stones is disposed on the finish mounting structure, in particular, the at least one pair of finish grinding stones is disposed opposite a mounting side on the finish mounting structure in a direction along the plumb line such that the grinding surfaces of the at least one pair of finish grinding stones are located in opposite horizontal planes, i.e., the grinding surfaces of two of the at least one pair of finish grinding stones are located in a first horizontal plane and a second horizontal plane, respectively, wherein the first horizontal plane and the second horizontal plane are parallel to each other and perpendicular to the plumb line.

With respect to the chamfer device 56, in certain embodiments, the chamfer device 56 may include: a chamfering attachment structure, at least one pair of chamfering grinders, a chamfering grinder advancing and retreating mechanism, and a chamfering grinder advancing mechanism. Wherein the at least one pair of chamfer grinders is disposed on the chamfer mounting structure, in particular, the at least one pair of chamfer grinders is disposed opposite to a mounting side on the chamfer mounting structure in a plumb line direction, such that the grinding surfaces of the at least one pair of chamfer grinders are located in opposite horizontal planes, i.e., the grinding surfaces of two of the at least one pair of chamfer grinders are located in a first horizontal plane and a second horizontal plane, respectively, wherein the first horizontal plane and the second horizontal plane are parallel to each other and perpendicular to the plumb line.

By using the silicon rod transfer device, each silicon rod clamp can clamp a silicon rod and the clamped silicon rod can be switched to a plurality of processing positions, for example, according to the process of processing operation, the silicon rod clamped by the silicon rod clamp is sequentially switched to a first processing position, a third processing position and a second processing position. Thus, in a certain state, the silicon rod clamps in the silicon rod transfer device clamp the silicon rod and are controlled to drive the silicon rod clamps and the silicon rod switching positions clamped by the silicon rod clamps, for example, one silicon rod clamp and the silicon rod to be roughly ground clamped by the silicon rod clamp are switched to a first processing position, the other silicon rod clamp and the silicon rod to be chamfered clamped by the silicon rod clamp are switched to a third processing position, the other silicon rod clamp and the silicon rod to be accurately ground clamped by the silicon rod clamp are switched to a second processing position, therefore, the rough grinding device positioned in the first processing position can perform rough grinding operation on the silicon rod to be roughly ground, the chamfering device positioned in the third processing position can perform chamfering operation on the silicon rod to be chamfered, and the accurate grinding device positioned in the second processing position can perform accurate grinding operation on the silicon rod to be accurately ground.

The silicon rod processing apparatus in this embodiment further includes a grinding repair device.

In certain embodiments, the grinding repair device is on a silicon rod clamp configured with the silicon rod grinder. Please refer to fig. 15, which is an enlarged view of a portion a in fig. 14. As shown in fig. 15, the grinding repair device is disposed on at least one silicon rod clamp 261 of the silicon rod transfer device 26, and includes a mounting body 861 and at least one thinning portion 863.

An installation body 861 in the grinding and repairing device is arranged on one clamping arm of the silicon rod clamp 261, and grinding portions 863 are respectively arranged on two opposite sides of the installation body 861 along the direction of the plumb line. With this arrangement, the grinding restoration device can be used to simultaneously dress the respective two grinding tools (e.g., two rough grinders in a rough grinding device or two finish grinders in a finish grinding device). Taking the grinding repairing device for grinding the finish grinding tools in the finish grinding device as an example, the finish grinding device comprises a pair of finish grinding tools arranged along the direction of the plumb line, the pair of finish grinding tools arranged oppositely is moved to the outer side of the grinding part along the direction of the plumb line, the silicon rod clamp is driven to move along the horizontal line, so that the two repairing parts on the two sides of the mounting body reciprocate along the direction of the plumb line, and in this state, the pair of finish grinding tools in the finish grinding device can be made to approach the grinding part oppositely (for example, along the direction of the plumb line) to be in contact with the surface of the grinding part so as to realize grinding.

In certain embodiments, the thinning 863 is an oilstone. Here, the oilstone is, for example, diamond oilstone, boron carbide oilstone, fine-ground oilstone, general oilstone, or the like. The oilstone may effect a modification of the surface of the grinding tool contacted by the oilstone by virtue of the particle size of the surface. In the coping process, the surface of the oilstone contacts the grinding tool, the surface of the grinding tool is trimmed to be uniform granularity, and the flatness and the verticality of the plane of the grinding tool are improved.

In some embodiments, the grinding repair device further comprises a sensing device arranged on the base and used for detecting the grinding tool of the silicon rod cutting and grinding all-in-one machine. In the embodiment shown in fig. 15, the grinding repair device further includes a sensor 865 disposed adjacent to the thinning portion 863.

With respect to the sensor device 865, reference can be made to the description related to the sensor device 815 in fig. 4, and further description is omitted here.

The application discloses silicon rod grinds machine, including frame, silicon rod transfer device, corase grind device and accurate grinding device, wherein, the frame has silicon rod processing platform, be equipped with first processing position and second processing position on the silicon rod processing platform, silicon rod transfer device is including transporting main part and a plurality of silicon rod anchor clamps and transposition mechanism, utilizes transposition mechanism drive a plurality of silicon rod anchor clamps and the silicon rod of centre gripping to change the position on first processing position and second processing position so that corase grind device can carry out corase grind operation and accurate grinding device to the silicon rod and can carry out the accurate grinding operation to the silicon rod, makes at same moment corase grind device and accurate grinding device in the silicon rod grinds machine all are in operating condition, can promote silicon rod grinding efficiency and reduce to grind the operation consuming time, and can promote economic benefits. Meanwhile, the repairing part of the grinding repairing device can be utilized to realize the coping of the grinding tool through the contact with the grinding tool.

In summary, the grinding repair device and the silicon rod processing equipment disclosed by the application have the following beneficial effects: the repairing part of the grinding repairing device is close to and in contact with a grinding tool of the silicon rod processing equipment so as to realize the grinding of the grinding tool, at the moment, the reciprocating motion of the grinding part along the preset direction and the rotation of the grinding tool in corresponding contact can be controlled so as to improve the grinding efficiency, and the silicon rod processing equipment is favorable for carrying out subsequent surface grinding operation on the silicon rod.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims (12)

1. The grinding repair device is characterized by being applied to silicon rod processing equipment, wherein the silicon rod processing equipment comprises a grinding device, and the grinding device is provided with at least one grinding tool; the abrasive repair device includes:

mounting the main body;

the grinding part is arranged on the mounting main body and is used for grinding the corresponding at least one grinding tool.

2. The abrasive repair device according to claim 1, wherein the mounting body is provided on a silicon rod clamp of the silicon rod processing apparatus, and the mounting body is driven by the silicon rod clamp to reciprocate in a predetermined direction.

3. The abrasive repair device according to claim 1, wherein the mounting body is provided on a base of the silicon rod processing apparatus, and the abrasive repair device further comprises a driving unit for driving the mounting body to reciprocate in a predetermined direction.

4. The abrasive repair device of claim 1, including two thinning portions disposed on opposite sides of the mounting body.

5. The abrasive repair device of claim 1, wherein the dressing surface of the dressing portion is circular, annular, rectangular, or regular polygonal.

6. The abrasive repair device of claim 1, wherein said thinning is an oilstone.

7. The abrasive repair device of claim 1, further comprising at least one sensing device disposed on said mounting body for detecting said at least one abrasive article.

8. The abrasive repair device of claim 7, wherein the sensing means is a contact sensor or a distance measuring sensor.

9. The abrasive repair device of claim 8, further comprising a shield disposed over the sensor device for shielding the sensor device in a closed state and exposing the sensor device in an open state.

10. A silicon rod processing apparatus, comprising:

a machine base;

the grinding device is arranged on the stand; the grinding device is provided with at least one grinding tool and is used for grinding the silicon rod;

an abrasive repair device as claimed in any one of claims 1 to 9.

11. The silicon rod processing apparatus as set forth in claim 10, wherein the grinding device further comprises:

the grinding tool rotating mechanism is used for driving the at least one grinding tool to rotate; and

and the grinding tool advancing and retreating mechanism is used for driving the at least one grinding tool to move in at least one direction.

12. The silicon rod processing apparatus as claimed in claim 10, characterized in that the silicon rod processing apparatus is a silicon rod grinding machine or a silicon rod slicing and grinding all-in-one machine.

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