CN203992813U - For the phasing device of laser cutting system - Google Patents
For the phasing device of laser cutting system Download PDFInfo
- Publication number
- CN203992813U CN203992813U CN201420267457.4U CN201420267457U CN203992813U CN 203992813 U CN203992813 U CN 203992813U CN 201420267457 U CN201420267457 U CN 201420267457U CN 203992813 U CN203992813 U CN 203992813U
- Authority
- CN
- China
- Prior art keywords
- annular region
- radius
- laser
- circular
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model discloses a kind of phasing device for laser cutting system, comprise the substrate that light-transmitting materials is made, the one side that is right against laser beam incident bundle on described substrate is provided with concentric central circular, interior circular annular region and cylindrical annular region, and two parts of central circular and cylindrical annular region are differing as π laser beam incident bundle phase delay to laser beam incident bundle phase delay and interior circular annular region; The outward flange radius of cylindrical annular region equates with laser beam incident beam radius, the outward flange circular radius of interior circular annular region be cylindrical annular region outward flange radius 0.47-0.53 doubly, the inward flange circular radius of interior circular annular region be cylindrical annular region outward flange radius 0.17-0.23 doubly.The utility model is convenient to realize, workable, at least 2 times of the continuation of gained hot spot depth of focus, cutting section up rightness is good, increases cutting thickness, improves Quality of Laser Cutting, expanded laser light cutting machine range of application.
Description
Technical field
The utility model belongs to optical technical field, relates to a kind of device for laser cutting system, especially relates to a kind of concentric three region phasing devices for laser cutting system.
Background technology
Laser cutting is the application technology that in Laser Processing industry, amount is wanted, and owing to having various features, has been widely used in the industrial departments such as automobile, rolling stock manufacture, aviation, chemical industry, light industry, electrical equipment, electronics, oil and metallurgy.Laser cutting technique is widely used in, in the processing of metal and nonmetallic materials, can greatly reducing process time, cuts down finished cost, and improves workpiece quality.
Laser cutting is with focus lamp, laser beam to be focused on to material surface to make material fusing, uses the Compressed Gas coaxial with laser beam to blow away the material being melted simultaneously, and makes laser beam and material do relative motion along certain track, thus the joint-cutting of formation definite shape.From since nineteen seventies along with constantly the improving and development of laser instrument and Numeric Control Technology, become a kind of advanced person's of industrial plate cutting processing method at present.
In existing laser cutting machine, light beam focus characteristics, clear in optical system, considers the optical parameter regulation and control new technology at optical field in the recent period but current laser cutting machine rarely has.In prior art, there is laser cutting machine system, as United States Patent (USP), patent name: Laser cutting machine, patent No. US005093549A, Chinese utility model patent, patent name: laser cutting machine tool for precision finishing, the patent No.: ZL 200510086252.1, utilize the arc light of thing to be cut and laser focusing interaction generation as the beacon wavefront of wave front detector, or utilize simultaneously small part laser through the reflected light of retroeflector as laser self aberration beacon, and signal wave front detector being obtained by wavefront controller is through control algolithm formation control signal or through data fusion formation control signal, drive electric-control system to make deformation reflection mirror produce corresponding deformation, the thermic disturbance that the heat that compensating focusing hot spot and thing to be cut interaction produce causes, or compensate wave front aberration and spectroscopical thermal deformation aberration of laser self simultaneously, finally make the superlaser that arrives thing to be cut there is good focal beam spot quality.Although above-mentioned two online techniques have certain advantage, exist the essence not enough, reckon without the impact of Wave-front phase on laser spot, the field distribution of laser beam foucing area light is not optimized, and depth of focus is shorter, has limited laser laser and cut the use of system.
Utility model content
The utility model is in order to overcome the deficiencies in the prior art, and providing one to have can distribute by modulated incident light beam Wave-front phase, expands the phasing device for laser cutting system of depth of focus.
To achieve these goals, the utility model is by the following technical solutions: a kind of phasing device for laser cutting system, comprise the substrate that light-transmitting materials is made, the one side that is right against laser beam incident bundle on described substrate is provided with concentric central circular, interior circular annular region and cylindrical annular region, and two parts of central circular and cylindrical annular region are differing as π laser beam incident bundle phase delay to laser beam incident bundle phase delay and interior circular annular region; The outward flange radius of cylindrical annular region equates with laser beam incident beam radius, the outward flange circular radius of interior circular annular region be cylindrical annular region outward flange radius 0.47-0.53 doubly, the inward flange circular radius of interior circular annular region be cylindrical annular region outward flange radius 0.17-0.23 doubly.
Further, in described interior circular annular region, be coated with the reflectance coating that one deck reflectivity is greater than 80%.
Laser beam focuses on through object lens, focus area optical field distribution not only with Focused Optical system relating to parameters, also be subject to the parameter influence of incident beam own, and affect huge, light beam ripple strong phase and polarization state distribute can regulate and control focus area light distribution, the utility model regulates and controls laser beam incident Shu Jinhang Wave-front phase, comprise central circular, interior annular and three regions of cylindrical annular, annular internal diameter and external diameter in selecting suitably, can obtain depth of focus expansion multiple and be not less than 2 laser focal spot, can improve existing laser cutting system performance, expand usage range.
The utility model for the course of work of laser cutting system is: at existing laser cutting system, the utility model is arranged in collimated light beam light path, incident beam is after the utility model, laser beam Wave-front phase is modulated, Wave-front phase obtains laser cutting hot spot through the laser beam of ovennodulation after object lens focus on, gained hot spot depth of focus is than there not being at least 2 times of continuation of laser cutting system depth of focus of the present utility model, cutting section up rightness is good, increase cutting thickness, improve Quality of Laser Cutting, expanded laser light cutting machine range of application
In sum, the utlity model has following advantage: the utility model is convenient to realize, workable, at least 2 times of the continuation of gained hot spot depth of focus, cutting section up rightness is good, increases cutting thickness, improves Quality of Laser Cutting, expanded laser light cutting machine range of application.
Brief description of the drawings
Fig. 1 is cross sectional representation of the present utility model.
Fig. 2 is a kind of schematic diagram that uses light path of the present utility model.
Detailed description of the invention
In order to make those skilled in the art person better understand the utility model scheme, below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out to clear, complete description.
As shown in Figure 1, 2, a kind of phasing device for laser cutting system, comprise the substrate that light-transmitting materials is made, the one side that is right against laser beam incident bundle on described substrate is provided with concentric central circular, interior circular annular region and cylindrical annular region, and two parts of central circular and cylindrical annular region are differing as π laser beam incident bundle phase delay to laser beam incident bundle phase delay and interior circular annular region; The outward flange radius of cylindrical annular region equates with laser beam incident beam radius, and the outward flange of the outward flange of cylindrical annular region and laser beam incident bundle is overlapping; Between the 0.47-0.53 of the outward flange radius of the outward flange circular radius span of interior circular annular region in cylindrical annular region times, in the present embodiment, preferably 0.50 times, between the 0.17-0.23 of the outward flange radius of the inward flange circular radius span of interior circular annular region in cylindrical annular region times, in the present embodiment, preferably 0.2 times.These data are that the utility model people assembles vector demonstration theory according to the propagation of laser, go out by analytical Calculation.In the present embodiment, laser cutting system is carbon dioxide laser cutting machine.
Make two parts of central circular and cylindrical annular region to laser beam incident bundle phase delay and interior circular annular region to laser beam incident bundle phase delay differ for the method for π more, what in the present embodiment, adopt plates a layer dielectric in interior circular annular region, those skilled in the art are according to prior art, utilizing existing equipment can have multiple diverse ways to make this both phase difference is π, herein no longer burden narration.
The outward flange circular radius value that in Fig. 1, b is interior circular annular region, elects b=0.5 as; A is the inward flange circular radius value of interior circular annular region, is the outward flange circular radius value of central circular, elects a=0.2 as.
Fig. 2 is a kind of light path schematic diagram that uses of the utility model, in other embodiment, can in interior circular annular region, be coated with the reflectance coating that one deck reflectivity is greater than 80%, so the position of object lens can be placed in to front side of the present utility model.
As shown in Figure 2, this modulator 2 is placed in to collimated light beam light path 1, incident beam 1 is after this modulator 2, laser beam Wave-front phase is modulated, Wave-front phase obtains laser cutting hot spot 4 through the laser beam of ovennodulation after object lens 3 focus on, gained laser cutting hot spot 4 depths of focus are than there not being at least 2 times of continuation of laser cutting system depth of focus of the present utility model, and the expansion multiple of gained is 3 in the present embodiment, add laser cutting of the present utility model to show cutting section up rightness good, increase cutting thickness, improve Quality of Laser Cutting, expanded laser light cutting machine range of application.
Obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all should belong to the scope of the utility model protection.
Claims (2)
1. the phasing device for laser cutting system, comprise the substrate that light-transmitting materials is made, it is characterized in that: the one side that is right against laser beam incident bundle on described substrate is provided with concentric central circular, interior circular annular region and cylindrical annular region, two parts of central circular and cylindrical annular region are differing as π laser beam incident bundle phase delay to laser beam incident bundle phase delay and interior circular annular region; The outward flange radius of cylindrical annular region equates with laser beam incident beam radius, the outward flange circular radius of interior circular annular region be cylindrical annular region outward flange radius 0.47-0.53 doubly, the inward flange circular radius of interior circular annular region be cylindrical annular region outward flange radius 0.17-0.23 doubly.
2. the phasing device for laser cutting system according to claim 1, is characterized in that: in described interior circular annular region, be coated with the reflectance coating that one deck reflectivity is greater than 80%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420267457.4U CN203992813U (en) | 2013-06-07 | 2014-05-23 | For the phasing device of laser cutting system |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320327760 | 2013-06-07 | ||
| CN201320327760.4 | 2013-06-07 | ||
| CN201420267457.4U CN203992813U (en) | 2013-06-07 | 2014-05-23 | For the phasing device of laser cutting system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203992813U true CN203992813U (en) | 2014-12-10 |
Family
ID=52032877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420267457.4U Expired - Fee Related CN203992813U (en) | 2013-06-07 | 2014-05-23 | For the phasing device of laser cutting system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203992813U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109070268A (en) * | 2016-04-01 | 2018-12-21 | 浜松光子学株式会社 | Laser processing device |
-
2014
- 2014-05-23 CN CN201420267457.4U patent/CN203992813U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109070268A (en) * | 2016-04-01 | 2018-12-21 | 浜松光子学株式会社 | Laser processing device |
| CN109070268B (en) * | 2016-04-01 | 2021-11-16 | 浜松光子学株式会社 | Laser processing apparatus |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11235423B2 (en) | Laser cladding method and device for implementing same | |
| JP7119094B2 (en) | Laser processing apparatus and method | |
| US11273519B2 (en) | Method and a machine of laser processing of a metallic material | |
| US11292082B2 (en) | Method of laser processing of a metallic material with high dynamic control of the movement axes of the laser beam along a predetermined processing path, as well as a machine and a computer program for the implementation of said method | |
| WO2018093732A1 (en) | Laser apparatus for cutting brittle material with aspheric focusing means and a beam expander | |
| CN107234345B (en) | A kind of laser cutting system and its cutting method | |
| US20210162539A1 (en) | Welding method and welding apparatus | |
| CN103030266B (en) | Laser cutting method and device | |
| CN113333973B (en) | Laser beam modulation method and system for processing fiber material | |
| CN204075509U (en) | Optical beam forming apparatus | |
| Rodrigues et al. | Optimal laser beam configurations for laser cutting of metal sheets | |
| CN103692089A (en) | Laser cutting device and laser cutting method | |
| CN106808087A (en) | A kind of method of workpiece deformation quantity after reduction laser melting coating | |
| CN107824959A (en) | A kind of laser boring method and system | |
| Demir et al. | Remote cutting of Li-ion battery electrodes with infrared and green ns-pulsed fibre lasers | |
| Funck et al. | Tailored beam shaping for laser spot joining of highly conductive thin foils | |
| CN203992813U (en) | For the phasing device of laser cutting system | |
| RU2013152770A (en) | METHOD FOR PRODUCING A STEEL PIPE BY LASER WELDING | |
| CN105149797A (en) | Laser drilling machine used for drilling metal plate | |
| CN103317232A (en) | Phase modulation device for laser cutting system | |
| CN107363416A (en) | A kind of laser ring cutter device and its control method | |
| CN111515544A (en) | Calculation method for removing and processing surface material of inner wall of slot | |
| JP2020199513A (en) | Laser processing machine and control method of laser processing machine | |
| Reyes et al. | Dynamic Beam Shaper (DBS) for high-power/high-brightness direct diode laser (DDL) | |
| CN106959517A (en) | Optical beam transformation device and laser processing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20170523 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |