CN203887679U - Grinding head and grinding device - Google Patents
Grinding head and grinding device Download PDFInfo
- Publication number
- CN203887679U CN203887679U CN201420269355.6U CN201420269355U CN203887679U CN 203887679 U CN203887679 U CN 203887679U CN 201420269355 U CN201420269355 U CN 201420269355U CN 203887679 U CN203887679 U CN 203887679U
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- CN
- China
- Prior art keywords
- ring
- polishing
- limiting ring
- grinding
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001179 sorption measurement Methods 0.000 claims abstract description 30
- 238000005498 polishing Methods 0.000 claims description 97
- 239000000919 ceramic Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses a grinding head and a grinding device. The grinding head comprises a body, a limiting ring arranged on the body and an adsorption unit arranged in the limiting ring, the limiting ring comprises a first limiting ring body and a second limiting ring body connected with the first limiting ring body, and a heater is arranged inside the second limiting ring body. The heater is arranged inside the second limiting ring body to heat the limiting ring, and the grinding rate of the grinding head is adjusted by adjusting the temperature of the heater since the grinding rate is related to the temperature, so that the grinding rate of the grinding head is increased.
Description
Technical Field
The utility model relates to the field of semiconductor technology, especially, relate to a grinding head and grinder.
Background
With the decreasing size of semiconductor devices, the deposition process with a large multilayer interconnection or filling depth causes an excessive fluctuation on the wafer surface, which causes difficulty in focusing of the photolithography process, reduces the control capability of the line width, and reduces the line width uniformity on the entire wafer. In the chemical mechanical polishing process, a chemical mechanical polishing apparatus becomes one of important apparatuses in a semiconductor process.
Generally, a polishing apparatus used in the semiconductor field includes a polishing pad and a polishing head disposed on the polishing pad. When the chemical mechanical polishing is performed on the wafer, the polishing head adsorbs the wafer to be polished, the front surface of the wafer is pressed against the polishing pad, and the polishing head drives the wafer to rotate relative to the polishing pad, so that the wafer is flattened.
Specifically, as shown in fig. 1, the polishing head in the polishing apparatus mainly includes: the suction device comprises a body 101, a vent hole 12 arranged in the body 101, a limiting ring 103 arranged on the body 101, and an adsorption unit 102 arranged in the limiting ring 103. During grinding, the grinding head adsorbs the wafer 10 through the adsorption unit 102, so that the wafer 10 is adsorbed in the limit ring 103; then, the bottom surface of the polishing head with the wafer 10 is pressed on the polishing pad 11, and the wafer 10 is driven by the polishing head to rotate relative to the polishing pad 11. In order to optimize the polishing rate of the edge of the wafer 10, pressure is also applied to the retainer ring 103, so that the retainer ring 103 of the polishing head is pressed against the polishing pad 11 during polishing, and the retainer ring 103 abrades the polishing pad 11, so that the surface of the polishing pad 11 becomes smooth, and the polishing rate is reduced.
In view of the above, it is desirable to provide a new polishing head and a new polishing apparatus to solve the problem of polishing rate reduction caused by the polishing pad surface becoming smooth due to the positioning ring of the polishing head in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problem that the retaining ring of grinding head becomes smooth to the surface of grinding pad among the prior art, causes the grinding rate to reduce.
In order to solve the technical problem, the utility model provides a grinding head, the grinding head includes: the device comprises a body, a limiting ring arranged on the body and an adsorption unit arranged in the limiting ring; wherein,
the spacing ring includes: the first limiting ring and the second limiting ring are connected with the first limiting ring; and a heater is arranged in the second limiting ring.
Optionally, in the polishing head, a diversion trench is disposed at the bottom of the first limiting ring.
Optionally, in the polishing head, the first limit ring is a ceramic ring or a stainless steel ring.
Optionally, in the polishing head, the second stop collar is a rigid collar.
Optionally, in the polishing head, the second stop collar is connected to the body and the first stop collar, respectively.
Optionally, in the polishing head, a vent hole communicated with the adsorption unit is formed in the body.
Optionally, in the polishing head, the adsorption unit includes an adsorption film.
The utility model also provides a grinder, grinder includes: the polishing device comprises a polishing pad and a polishing head arranged on the polishing pad; wherein the abrading head comprises: the device comprises a body, a limiting ring arranged on the body and an adsorption unit arranged in the limiting ring; the spacing ring includes: the first limiting ring and the second limiting ring are connected with the first limiting ring; and a heater is arranged in the second limiting ring.
Optionally, in the grinding device, a diversion trench is disposed at the bottom of the first limiting ring.
Optionally, in the grinding device, the first limiting ring is a ceramic ring or a stainless steel ring.
Optionally, in the grinding device, the second limiting ring is a rigid ring.
Optionally, in the grinding device, the second limit ring is connected to the body and the first limit ring, respectively.
Optionally, in the polishing apparatus, a vent hole communicated with the adsorption unit is provided inside the body.
Optionally, in the grinding device, the adsorption unit includes an adsorption membrane.
The utility model provides an among grinding head and grinder, through at the inside heater that sets up of second spacing ring, heat the spacing ring, because the grinding rate is relevant with the temperature, utilize the grinding rate to adjust the grinding head to the regulation of heater temperature to the grinding rate of grinding head has been improved.
Drawings
FIG. 1 is a schematic view of a prior art polishing apparatus;
FIG. 2 is a schematic view of a polishing head according to an embodiment of the present invention;
FIG. 3 is a bottom view of the polishing head of an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a grinding device according to an embodiment of the present invention.
In fig. 1:
a wafer-10; a polishing pad-11; a vent-12; a body-101; an adsorption unit-102; a spacing ring-103.
In fig. 2-4:
a wafer-20; a polishing pad-21; a vent-22; a body-201; an adsorption unit-202; a stop collar-203; a first stop collar-204; a second stop collar-205; a diversion trench-206; an adsorption film-207; a heater-208.
Detailed Description
The following describes the polishing head and the polishing apparatus according to the present invention in further detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more fully apparent from the following description and appended claims. It should be noted that the drawings are in simplified form and are not to precise scale, and are provided for convenience and clarity in order to facilitate the description of the embodiments of the present invention.
Fig. 2 is a schematic structural view of a polishing head according to an embodiment of the present invention. As shown in fig. 2, the abrading head comprises: the device comprises a body 201, a limit ring 203 arranged on the body 201, and an adsorption unit arranged in the limit ring 203; wherein the stop collar 203 comprises: a first limit ring 205 and a second limit ring 204 connected with the first limit ring 205; the second limit ring 204 is provided with a heater 208 inside.
Specifically, the wafer 20 is adsorbed by the adsorption unit 202, the wafer 20 is rotated and polished with the polishing head, and during the polishing process, in order to prevent the wafer 20 from separating from the polishing head, the polishing head is provided with a retaining ring 203 for fixing the wafer 20 therein.
Further, please refer to fig. 3, which is a bottom view of the polishing head according to an embodiment of the present invention. As shown in fig. 3, a diversion trench is formed at the bottom of the first stop collar 205. The flow guide groove 206 is disposed at the bottom of the first stop collar 205, so that when the polishing head performs a polishing operation, the flow guide groove 206 at the bottom of the first stop collar 205 conveys a polishing slurry to the polishing pad 21, thereby improving the polishing effect of the surface of the wafer 20. Meanwhile, due to the arrangement of the guide grooves 206, the abrasion to the polishing pad 21 is reduced, the polishing work of the surface of the wafer 20 is facilitated, and the polishing rate is increased.
In this embodiment, the first position-limiting ring 205 is a ceramic ring or a stainless steel ring. The ceramic ring or the stainless steel ring has a strong hardness, and can better arrange the polishing pad 21 below the first retainer ring 205.
In this embodiment, the second stop collar 204 is a rigid collar. The rigid ring has better toughness and can conduct heat better, the heat emitted by the heater 208 is transferred to the first limiting ring 205, solid particles of the grinding fluid or grinding residues remained in the guide groove 206 at the bottom of the first limiting ring 205 are facilitated to be separated from the guide groove 206, the loss of the grinding fluid is reduced, and meanwhile, the grinding effect is enhanced.
Further, the second limit ring 204 is connected to the body 201 and the first limit ring 205, respectively.
Preferably, a vent hole 22 communicating with the adsorption unit 202 is provided inside the body 201.
Specifically, the first retainer ring 205 is mainly used for conditioning the polishing pad 21, and can be replaced by itself when the polishing pad is worn to a certain extent. The temperature of the second retaining ring 204 is transferred to the first retaining ring 205, so that the temperature of the entire retaining ring is raised, and since the polishing rate is temperature dependent, the polishing rate of the polishing head can be adjusted by adjusting the heater 208 in the second retaining ring 204. The heater 208 in the second limit ring 204 is integrated by a circuit to penetrate through the vent hole 22 and is communicated with a control unit of the machine table to perform operations such as temperature data display, temperature control regulation and the like; the preferred setting is that when the temperature of the heater 208 is set to 40 degrees Celsius, the polishing rate is 2000 angstroms; when the temperature of the heater 208 is set to 45 degrees celsius, the polishing rate is 2200 angstroms at this time.
Preferably, the adsorption unit 202 includes an adsorption membrane 207. Further, the wafer 20 is preferably adsorbed by the adsorption unit 202 through the adsorption film 207, and the position of the wafer 20 is fixed.
Please refer to fig. 4, which is a schematic structural diagram of a polishing apparatus according to an embodiment of the present invention. As shown in fig. 4, the grinding apparatus includes: a polishing pad 21 and the polishing head as described above disposed on the polishing pad.
Specifically, when the polishing device polishes the wafer 20, the polishing head adsorbs the wafer 20 through the adsorption unit 202, so that the wafer 20 is adsorbed in the limit ring 203; then, the bottom surface of the polishing head, on which the wafer 20 is adsorbed, is pressed against the polishing pad 21, and the wafer 20 is driven by the polishing head to rotate relative to the polishing pad 21. In order to optimize the polishing rate of the edge of the wafer 20, a heater 208 is added to the second stop collar 204 to increase the polishing rate when the heat emitted from the heater is conducted to the first stop collar 205 due to the temperature dependence of the polishing rate. In addition, because the bottom of the first limit ring is provided with the diversion trench 206, when the first limit ring 205 is pressed against the polishing pad 21, the abrasion of the limit ring 203 on the polishing pad 21 is reduced; the slurry passes through the guiding grooves 206, and the polishing effect of the wafer 20 is further improved.
To sum up, in the utility model provides an among grinding head and grinder, through at the inside heater that sets up of second spacing ring, heat the spacing ring, because the grinding rate is relevant with the temperature, utilize the regulation to the heater temperature to adjust the grinding rate of grinding head to the grinding rate of grinding head has been improved.
It will be apparent to those skilled in the art that various changes and modifications may be made to the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (14)
1. A polishing head, comprising: the device comprises a body, a limiting ring arranged on the body and an adsorption unit arranged in the limiting ring; wherein,
the spacing ring includes: the first limiting ring and the second limiting ring are connected with the first limiting ring; and a heater is arranged in the second limiting ring.
2. The polishing head of claim 1 wherein a channel is disposed in a bottom portion of the first stop collar.
3. The polishing head of claim 1, wherein the first retaining ring is a ceramic ring or a stainless steel ring.
4. The polishing head of claim 1, wherein the second stop collar is a rigid ring.
5. The polishing head of claim 1, wherein said second stop collar is coupled to said body and said first stop collar, respectively.
6. The polishing head of claim 1, wherein the interior of the body is provided with a vent in communication with the adsorption unit.
7. The polishing head of claim 1, wherein the adsorption unit comprises an adsorption membrane.
8. A grinding apparatus, comprising: the polishing device comprises a polishing pad and a polishing head arranged on the polishing pad; wherein the abrading head comprises: the device comprises a body, a limiting ring arranged on the body and an adsorption unit arranged in the limiting ring; the spacing ring includes: the first limiting ring and the second limiting ring are connected with the first limiting ring; and a heater is arranged in the second limiting ring.
9. The polishing apparatus as recited in claim 8, wherein a bottom of the first retainer ring is provided with a guide groove.
10. The abrading apparatus of claim 8, wherein the first stop collar is a ceramic ring or a stainless steel ring.
11. The abrading apparatus of claim 8, wherein the second stop collar is a rigid collar.
12. The abrading apparatus of claim 8, wherein the second stop collar is coupled to the body and the first stop collar, respectively.
13. The abrading apparatus of claim 8, wherein the body is internally provided with a vent hole communicating with the adsorption unit.
14. The abrading apparatus of any one of claims 8 to 13, wherein the adsorption unit comprises an adsorption membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420269355.6U CN203887679U (en) | 2014-05-23 | 2014-05-23 | Grinding head and grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420269355.6U CN203887679U (en) | 2014-05-23 | 2014-05-23 | Grinding head and grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203887679U true CN203887679U (en) | 2014-10-22 |
Family
ID=51714127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420269355.6U Expired - Fee Related CN203887679U (en) | 2014-05-23 | 2014-05-23 | Grinding head and grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203887679U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111531464A (en) * | 2020-05-08 | 2020-08-14 | 西安奕斯伟硅片技术有限公司 | Grinding head and grinding equipment |
| CN113579995A (en) * | 2021-08-09 | 2021-11-02 | 北京烁科精微电子装备有限公司 | Wafer holder and grinder |
| US11904429B2 (en) | 2020-10-13 | 2024-02-20 | Applied Materials, Inc. | Substrate polishing apparatus with contact extension or adjustable stop |
-
2014
- 2014-05-23 CN CN201420269355.6U patent/CN203887679U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111531464A (en) * | 2020-05-08 | 2020-08-14 | 西安奕斯伟硅片技术有限公司 | Grinding head and grinding equipment |
| CN111531464B (en) * | 2020-05-08 | 2022-04-08 | 西安奕斯伟材料科技有限公司 | Grinding head and grinding equipment |
| US11904429B2 (en) | 2020-10-13 | 2024-02-20 | Applied Materials, Inc. | Substrate polishing apparatus with contact extension or adjustable stop |
| TWI839644B (en) * | 2020-10-13 | 2024-04-21 | 美商應用材料股份有限公司 | Substrate polishing apparatus with contact extension or adjustable stop |
| CN113579995A (en) * | 2021-08-09 | 2021-11-02 | 北京烁科精微电子装备有限公司 | Wafer holder and grinder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 Termination date: 20190523 |