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CN203707177U - 可感测温度的led陶瓷封装基板 - Google Patents

可感测温度的led陶瓷封装基板 Download PDF

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CN203707177U
CN203707177U CN201420039506.9U CN201420039506U CN203707177U CN 203707177 U CN203707177 U CN 203707177U CN 201420039506 U CN201420039506 U CN 201420039506U CN 203707177 U CN203707177 U CN 203707177U
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led
chip
power supply
ceramic
ntc
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邬若军
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Shenzhen Ampron Technology Corp
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Shenzhen Ampron Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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Abstract

本实用新型公开了一种可感测温度的LED陶瓷封装基板，该陶瓷基板包括陶瓷基板和分别丝印在陶瓷基板上的LED电源正极及LED电源负极；其特征在于，LED电源正极与LED电源负极之间丝印有用于贴装NTC芯片的芯片焊盘，NTC芯片贴装在芯片焊盘上且靠近预定贴装LED裸片的位置上，陶瓷基板上还丝印有与NTC芯片电连接的正极引出线和负极引出线。本实用新型在LED电源正极与LED电源负极之间丝印有用于贴装NTC芯片的芯片焊盘，且NTC芯片在靠近预定贴装LED裸片的位置上设置，不仅使得该LED陶瓷封装基板具有感温功能，能够输出LED裸片的温度信号，而且保证了测温的可靠性；进一步的，增设正极引出线和负极引出线，该引出线可直接与其他线路一起完成，无需另加工序。

Description

可感测温度的LED陶瓷封装基板
技术领域
 本实用新型涉及COB封装领域，尤其涉及一种可感测温度的LED陶瓷封装基板。
背景技术
COB封装（chip On board），就是将裸芯片用导电或非导电胶粘附在互连基板上，然后进行引线键合实现其电气连接，再用胶把芯片和键合引线包封起来。
陶瓷COB封装因其高密度、大功率、低成本的优势已经成为LED封装的重要模式。目前，市面上常用的陶瓷COB封装基板如图3所示，是直接在陶瓷基板20上丝印有两个弧形的银浆电极，即LED电源正极21和LED电源负极22。因LED器件具有负温度系数，需采用恒流输出的驱动电源，或者采用正温度系数补偿方案，防止LED芯片过热烧毁或者因过热而降低寿命。采用上述驱动方式不如采用电压源驱动成本低、效率高，但电压源需要根据LED芯片的温度适当调整电压以保证LED光源始终工作在安全温度以下。
发明内容
针对上述技术中存在的不足之处，本实用新型提供一种成本低、工作安全、工序简单的可感测温度的LED陶瓷封装基板，保证了测温的可靠性。
为实现上述目的，本实用新型提供一种可感测温度的LED陶瓷封装基板，
包括陶瓷基板和分别丝印在陶瓷基板上的LED电源正极及LED电源负极；所述LED电源正极与LED电源负极之间丝印有用于贴装NTC芯片的芯片焊盘，所述NTC芯片贴装在芯片焊盘上且靠近预定贴装LED裸片的位置上，所述陶瓷基板上还丝印有与NTC芯片电连接的正极引出线和负极引出线。
其中，所述正极引出线的一端焊接在芯片焊盘上；所述NTC芯片通过键合引线与负极引出线电连接。
其中，所述NTC芯片通过导电胶贴装在芯片焊盘上。
与现有技术相比，本实用新型提供的可感测温度的LED陶瓷封装基板，具有以下有益效果：在LED电源正极与LED电源负极之间丝印有用于贴装NTC芯片的芯片焊盘，且NTC芯片在靠近预定贴装LED裸片的位置上设置，不仅使得该LED陶瓷封装基板具有感温功能，能够输出LED裸片的温度信号，而且保证了测温的可靠性，简化了LED发光组件的组装，以低廉的成本提供了LED工作温度的感应信号；进一步的，增设正极引出线和负极引出线，该引出线可直接与其他线路一起完成，无需另加工序。本实用新型具有成本低、工作安全、组装便捷、工序简单、感测温度精确、实用性强、适用范围广及延长了LED裸片的使用寿命等特点。
附图说明
图1为本实用新型可感测温度的LED陶瓷封装基板的结构图；
图2为图1中贴装了LED裸片并完成引线键合后的结构图。
主要元件符号说明如下：
10、陶瓷基板             11、LED电源正极
12、LED电源负极         13、NTC芯片
14、芯片焊盘             15、LED裸片
16、正极引出线           17、负极引出线
18、键合引线
图3为现有LED陶瓷封装基板的结构图。
主要元件符号说明如下：
20、陶瓷基板             21、LED电源正极
22、LED电源负极
具体实施方式
为了更清楚地表述本实用新型，下面结合附图对本实用新型作进一步地描述。
请参阅图1，本实用新型提供的可感测温度的LED陶瓷封装基板，包括陶瓷基板10和分别丝印在陶瓷基板10上的LED电源正极11及LED电源负极12；LED电源正极11与LED电源负极12之间丝印有用于贴装NTC芯片13的芯片焊盘14，NTC芯片13贴装在芯片焊盘14上且靠近预定贴装LED裸片15的位置上，陶瓷基板10上还丝印有与NTC芯片13电连接的正极引出线16和负极引出线17。
在本实施例中，正极引出线16的一端焊接在芯片焊盘14上；NTC芯片13通过键合引线18与负极引出线17电连接。
在本实施例中，NTC芯片13通过导电胶（图未示）贴装在芯片焊盘14上。当然，本实用新型并不局限于通过导电胶实现上述两者的粘接，还可以是通过导电强力胶等其他方式，如果是对粘接方式的改变，均落入本实用新型的保护范围内。
请进一步参阅图2，本实用新型提供的可感测温度的LED陶瓷封装基板，其LED裸片15其制作方法如下：将LED裸片15贴装在陶瓷基板10上，即是将多个LED裸片15排列成矩阵，贴装于弧形的LED电源正极11与弧形的LED电源负极12之间；固化后，采用键合引线18将电极与LED裸片15之间、LED裸片15与LED裸片15之间，以及NTC芯片13的正极引出线16和负极引出线17连接起来。完成引线键合工序，并检测合格后，采用半透明的COB封装胶将LED裸片15、NTC芯片13以及键合引线18一起密封在陶瓷基板10上，至此完成了可感温的LED发光组件在陶瓷 COB封装基板上的安装。
本实用新型提供的可感测温度的LED陶瓷封装基板，具有以下优势：
1）在LED电源正极11与LED电源负极12之间丝印有用于贴装NTC芯片13的芯片焊盘14，且设置NTC芯片13，不仅使得该LED陶瓷封装基板具有感温功能，能够输出LED裸片15的温度信号，把LED裸片15的工作温度转换成电信号输出给驱动电源，使其根据LED裸片15的温度调节输出电压，保证LED光源始终工作在安全温度以下，还可补偿市电电压变化和环境温度变化的影响，确保LED光源工作的可靠性。
2）NTC芯片13在靠近预定贴装LED裸片15的位置上设置，保证了测温的可靠性，简化了LED发光组件的组装，以低廉的成本提供了LED工作温度的感应信号。
3）进一步的，增设正极引出线16和负极引出线17，该引出线可直接与其他线路一起完成，无需另加工序，NTC芯片13和LED裸片15一起完成粘贴固晶和引线键合工序，在不增加工艺成本的基础上，使LED组件具备了感温功能。 
4）本实用新型不仅可用于LED发光组件的COB封装，而且可用于其他需要温度检测的陶瓷印制电路板，以满足高功率密度电子组件的需要。
5）本实用新型具有成本低、工作安全、组装便捷、工序简单、感测温度精确、实用性强、适用范围广及延长了LED裸片15的使用寿命等特点。
以上公开的仅为本实用新型的几个具体实施例，但是本实用新型并非局限于此，任何本领域的技术人员能思之的变化都应落入本实用新型的保护范围。

Claims (3)

1.一种可感测温度的LED陶瓷封装基板，包括陶瓷基板和分别丝印在陶瓷基板上的LED电源正极及LED电源负极；其特征在于，所述LED电源正极与LED电源负极之间丝印有用于贴装NTC芯片的芯片焊盘，所述NTC芯片贴装在芯片焊盘上且靠近预定贴装LED裸片的位置上，所述陶瓷基板上还丝印有与NTC芯片电连接的正极引出线和负极引出线。
2.根据权利要求1所述的可感测温度的LED陶瓷封装基板，其特征在于，所述正极引出线的一端焊接在芯片焊盘上；所述NTC芯片通过键合引线与负极引出线电连接。
3.根据权利要求1所述的可感测温度的LED陶瓷封装基板，其特征在于，所述NTC芯片通过导电胶贴装在芯片焊盘上。
CN201420039506.9U 2014-01-22 2014-01-22 可感测温度的led陶瓷封装基板 Expired - Lifetime CN203707177U (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105258058A (zh) * 2015-11-04 2016-01-20 安徽湛蓝光电科技有限公司 一种车用led光源
CN110797268A (zh) * 2019-11-05 2020-02-14 启明星半导体技术(西安)有限公司 带ntc温度检测的二极管及其制备方法
CN111554787A (zh) * 2020-05-15 2020-08-18 珠海市宏科光电子有限公司 一种便于调光调色的cob结构封装工艺
CN112798928A (zh) * 2020-12-29 2021-05-14 中国电子科技集团公司第十四研究所 一种基于陶瓷载片的芯片测试方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105258058A (zh) * 2015-11-04 2016-01-20 安徽湛蓝光电科技有限公司 一种车用led光源
CN110797268A (zh) * 2019-11-05 2020-02-14 启明星半导体技术(西安)有限公司 带ntc温度检测的二极管及其制备方法
CN111554787A (zh) * 2020-05-15 2020-08-18 珠海市宏科光电子有限公司 一种便于调光调色的cob结构封装工艺
CN112798928A (zh) * 2020-12-29 2021-05-14 中国电子科技集团公司第十四研究所 一种基于陶瓷载片的芯片测试方法

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