CN203589021U - 360-degree light-transmitting LED lamp filament - Google Patents
360-degree light-transmitting LED lamp filament Download PDFInfo
- Publication number
- CN203589021U CN203589021U CN201320801193.1U CN201320801193U CN203589021U CN 203589021 U CN203589021 U CN 203589021U CN 201320801193 U CN201320801193 U CN 201320801193U CN 203589021 U CN203589021 U CN 203589021U
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- China
- Prior art keywords
- transparency carrier
- led chip
- led
- substrate
- printing opacity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
The utility model discloses a 360-degree light-transmitting LED lamp filament. The 360-degree light-transmitting LED lamp filament comprises a transparent substrate and a transparent jacket sleeved on the substrate; the upper and lower surfaces of the transparent substrate are provided with one column or a plurality of columns of LED chips; two sides of the transparent substrate are provided with metal electrodes; the metal electrodes protrude out from the transparent jacket; the metal electrodes are in sealed connection with the transparent jacket; the upper surface and the lower surface of the transparent substrate are both coated with a fluorescent powder layer; adjacent LED chips are connected in series with each other through a metal wire; and the interval of the LED chips is in a range of 0.5 to 4mm. The 360-degree light-transmitting LED lamp filament of the utility model has the advantages of simple structure, convenient assembly, high light-emitting efficiency, large light irradiation angle and the like.
Description
Technical field
The utility model relates to LED illumination, specifically refers to a kind of 360 degree printing opacity LED filaments.
Background technology
LED is light-emitting diode (LED, the abbreviation of Lighting emitted diode), and it is to utilize under electric field action, the bind up one's hair Sony ericsson mobile comm ab of light of PN.It has high life, environmental protection, energy-conservation feature, is the new light sources of environmental protection.Existing LED is extensively in many neighborhood application such as family, market, hotel, automobile.
Current packaging, is mainly two kinds, the one, and straight cutting LED, on metallic support, fixed L ED chip, then forms with epoxy resin encapsulated; A kind of is planar structure encapsulation, LED chip is fixed on to planar bracket or substrate, then with silica gel or resin embedding.The product lighting angle of these two kinds of structures is all less than 180 degree, and chip bottom light is all wasted, and sidepiece light also has part loss.The light utilization efficiency of above-mentioned two kinds of LED chips is quite low, particularly fails to make full use of LED chip all-round luminous.
Utility model content
The purpose of this utility model is to provide the 360 degree printing opacity LED filaments that a kind of interest rate simple in structure, easy to assembly, luminous is high, irradiation angle is wide.
To achieve these goals, the utility model is designed a kind of 360 degree printing opacity LED filaments, the transparent overcoat that comprises transparency carrier, suit substrate, the top and bottom of transparency carrier are provided with row or multiple row LED chip, in transparency carrier both sides, are provided with metal electrode, and metal electrode passes transparent overcoat, between metal electrode and transparent overcoat, be tightly connected, the top and bottom of described transparency carrier all apply phosphor powder layer, and adjacent LED chip is serially connected by gold thread, LED chip be spaced apart 0.5-4mm.
Described transparency carrier be above provided with a row LED chip, in the top and bottom of transparency carrier, all apply phosphor powder layer, adjacent LED chip is serially connected by gold thread, LED chip be spaced apart 1mm.
The top and bottom of described transparency carrier are respectively provided with a row LED chip, in the top and bottom of transparency carrier, all apply phosphor powder layer, and adjacent LED chip is serially connected by gold thread, LED chip be spaced apart 4mm.
Described transparency carrier is glass substrate or epoxy resin base plate or sapphire substrate or transparent ceramic substrate.
The thickness of described transparency carrier is less than 0.5mm.
The transparent filament encapsulation of the utility model 360 degree printing opacity LED filament LED, N low power LED chip is directly encapsulated on high temperature resistant, high-strength transparence substrate, adopts gold thread series connection conducting, and apply fluorescent material below substrate two, because substrate is very thin, it is luminous that 360 °, rear filament is lighted in energising.
accompanying drawing explanation:
Fig. 1 is the front view of the utility model 360 degree printing opacity LED filaments;
Fig. 2 is the internal structure schematic diagram of Fig. 1;
Fig. 3 is the perspective view of the utility model 360 degree printing opacity LED filaments.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with specific embodiment and accompanying drawing, structural principle of the present utility model is described in further detail.
As shown in Figure 1-Figure 3, a kind of 360 degree printing opacity LED filaments, it comprises the transparent overcoat 2 of transparency carrier 1, suit substrate 1, the top and bottom of transparency carrier 1 are provided with row or multiple row LED chip 3, in transparency carrier 1 both sides, are provided with metal electrode 4, and metal electrode 4 passes transparent overcoat 2, between metal electrode 4 and transparent overcoat 2, be tightly connected, the top and bottom of described transparency carrier 1 all apply phosphor powder layer 5, and adjacent LED chip 3 is serially connected by gold thread 6, LED chip 3 be spaced apart 0.5-4mm.
As shown in Figure 2, described transparency carrier 1 be above provided with a row LED chip 3, in the top and bottom of transparency carrier 1, all apply phosphor powder layer 5, adjacent LED chip 3 is serially connected by gold thread, LED chip 3 be spaced apart 1mm.In order to reach the requirement of illuminator level, can respectively be provided with in the top and bottom of transparency carrier 1 a row LED chip 3, in the top and bottom of transparency carrier 1, all apply phosphor powder layer 5, adjacent LED chip 3 is serially connected by gold thread, LED chip 3 be spaced apart 4mm.
Described in the utility model 360 degree printing opacity LED filaments, transparency carrier 1 is glass substrate or epoxy resin base plate or sapphire substrate or transparent ceramic substrate.
Described in the utility model 360 degree printing opacity LED filaments, the thickness of transparency carrier 1 is less than 0.5mm.
The utility model 360 degree printing opacity LED filaments adopt transparent ultra-thin material substrate, this transparency carrier includes but not limited to glass, epoxy resin, sapphire, transparent ceramic etc., thickness is less than 0.5MM, direct fixed chip on transparency carrier, wire gold thread welding for chip chamber positive and negative electrode, substrate both sides external power supply both positive and negative polarity, at substrate positive and negative, all apply fluorescent material, transparency carrier surrounding is wrapped up by fluorescent material like this, blue light light that LED chip sends is comprehensive to be absorbed by fluorescent material and excites, LED light extraction efficiency is promoted greatly, and full angle is luminous, light is more soft natural, more approach incandescent lamp light, but than incandescent lamp energy-conservation 90%.
The above, be only preferred embodiment of the present utility model, not the utility model done to any pro forma restriction; The those of ordinary skill of all industry all can be implemented the utility model with the above shown in by specification accompanying drawing swimmingly; But all those skilled in the art are not departing within the scope of technical solutions of the utility model, can utilize disclosed above technology contents and a little change, the modification of making and the equivalent variations developing, be equivalent embodiment of the present utility model; Meanwhile, the change of any equivalent variations that all foundations essence technology of the present utility model is done above embodiment, modification and differentiation etc., within all still belonging to the protection range of the technical solution of the utility model.
Claims (5)
1. spend printing opacity LED filament for one kind 360, comprise transparency carrier (1), the transparent overcoat (2) of suit substrate (1), the top and bottom of transparency carrier (1) are provided with row or multiple row LED chip (3), in transparency carrier (1) both sides, be provided with metal electrode (4), metal electrode (4) passes transparent overcoat (2), between metal electrode (4) and transparent overcoat (2), be tightly connected, it is characterized in that: the top and bottom of described transparency carrier (1) all apply phosphor powder layer (5), adjacent LED chip (3) is serially connected by gold thread, LED chip (3) be spaced apart 0.5-4mm.
2. according to claim 1 360 spend printing opacity LED filaments, it is characterized in that: above described transparency carrier (1), be provided with a row LED chip (3), in the top and bottom of transparency carrier (1), all apply phosphor powder layer (5), adjacent LED chip (3) is serially connected by gold thread, LED chip (3) be spaced apart 1mm.
3. according to claim 1 360 spend printing opacity LED filaments, it is characterized in that: the top and bottom of described transparency carrier (1) are respectively provided with a row LED chip (3), in the top and bottom of transparency carrier (1), all apply phosphor powder layer (5), adjacent LED chip (3) is serially connected by gold thread, LED chip (3) be spaced apart 4mm.
4. according to the degree of 360 described in claim 2 or 3 printing opacity LED filament, it is characterized in that: described transparency carrier (1) is glass substrate or epoxy resin base plate or sapphire substrate or transparent ceramic substrate.
5. 360 degree printing opacity LED filaments according to claim 4, is characterized in that: the thickness of described transparency carrier (1) is less than 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320801193.1U CN203589021U (en) | 2013-12-09 | 2013-12-09 | 360-degree light-transmitting LED lamp filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320801193.1U CN203589021U (en) | 2013-12-09 | 2013-12-09 | 360-degree light-transmitting LED lamp filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203589021U true CN203589021U (en) | 2014-05-07 |
Family
ID=50586889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320801193.1U Expired - Fee Related CN203589021U (en) | 2013-12-09 | 2013-12-09 | 360-degree light-transmitting LED lamp filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203589021U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282831A (en) * | 2014-09-24 | 2015-01-14 | 惠州市英吉尔光电科技有限公司 | LED packaging structure and technique |
| CN106340580A (en) * | 2016-11-19 | 2017-01-18 | 莆田莆阳照明有限公司 | Long-service-life LED lamp |
-
2013
- 2013-12-09 CN CN201320801193.1U patent/CN203589021U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104282831A (en) * | 2014-09-24 | 2015-01-14 | 惠州市英吉尔光电科技有限公司 | LED packaging structure and technique |
| CN106340580A (en) * | 2016-11-19 | 2017-01-18 | 莆田莆阳照明有限公司 | Long-service-life LED lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180209 Address after: Chen Jiang Huifeng Street West three road 516006 in Guangdong province Huizhou City Zhongkai high tech Zone No. 108 A building, third floor Patentee after: Huizhou yingjir Lighting Technology Co. Ltd. Address before: 516006 Guangdong province Huizhou City Zhongkai high tech Zone District No. 54 (Building 3) Patentee before: HUIZHOU ENGLED PHOTOELECTRIC TECHNOLOGY CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140507 Termination date: 20171209 |