CN203535602U - Tempered glass structure and touch device with same - Google Patents
Tempered glass structure and touch device with same Download PDFInfo
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- CN203535602U CN203535602U CN201320647849.9U CN201320647849U CN203535602U CN 203535602 U CN203535602 U CN 203535602U CN 201320647849 U CN201320647849 U CN 201320647849U CN 203535602 U CN203535602 U CN 203535602U
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- glass
- layer
- tempered glass
- cutting part
- cutting
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- 239000005341 toughened glass Substances 0.000 title claims abstract description 81
- 238000005520 cutting process Methods 0.000 claims abstract description 160
- 238000005728 strengthening Methods 0.000 claims abstract description 143
- 239000011521 glass Substances 0.000 claims abstract description 83
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 239000000463 material Substances 0.000 claims description 60
- 239000000126 substance Substances 0.000 claims description 48
- 238000000034 method Methods 0.000 claims description 46
- 239000012780 transparent material Substances 0.000 claims description 34
- 238000005530 etching Methods 0.000 claims description 23
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- 239000000203 mixture Substances 0.000 claims description 6
- 229920000620 organic polymer Polymers 0.000 claims description 6
- 239000002861 polymer material Substances 0.000 claims description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 4
- 238000001312 dry etching Methods 0.000 claims description 4
- 230000003628 erosive effect Effects 0.000 claims description 4
- 238000001039 wet etching Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000007517 polishing process Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 19
- 230000000007 visual effect Effects 0.000 abstract description 4
- 230000010354 integration Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 218
- 238000000576 coating method Methods 0.000 description 72
- 239000011248 coating agent Substances 0.000 description 70
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 35
- 238000010586 diagram Methods 0.000 description 20
- 239000000377 silicon dioxide Substances 0.000 description 17
- 239000000499 gel Substances 0.000 description 14
- 235000012239 silicon dioxide Nutrition 0.000 description 14
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 12
- 239000001103 potassium chloride Substances 0.000 description 12
- 235000011164 potassium chloride Nutrition 0.000 description 12
- -1 silane compound Chemical class 0.000 description 12
- 238000009826 distribution Methods 0.000 description 11
- 238000005342 ion exchange Methods 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 239000002356 single layer Substances 0.000 description 11
- 238000009413 insulation Methods 0.000 description 10
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 7
- 239000002344 surface layer Substances 0.000 description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052700 potassium Inorganic materials 0.000 description 5
- 239000011591 potassium Substances 0.000 description 5
- 235000010333 potassium nitrate Nutrition 0.000 description 5
- 239000004323 potassium nitrate Substances 0.000 description 5
- 230000002787 reinforcement Effects 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- OQVYMXCRDHDTTH-UHFFFAOYSA-N 4-(diethoxyphosphorylmethyl)-2-[4-(diethoxyphosphorylmethyl)pyridin-2-yl]pyridine Chemical compound CCOP(=O)(OCC)CC1=CC=NC(C=2N=CC=C(CP(=O)(OCC)OCC)C=2)=C1 OQVYMXCRDHDTTH-UHFFFAOYSA-N 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- VEPSWGHMGZQCIN-UHFFFAOYSA-H ferric oxalate Chemical compound [Fe+3].[Fe+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O VEPSWGHMGZQCIN-UHFFFAOYSA-H 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 4
- 229910000402 monopotassium phosphate Inorganic materials 0.000 description 4
- 235000019796 monopotassium phosphate Nutrition 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- GRLPQNLYRHEGIJ-UHFFFAOYSA-J potassium aluminium sulfate Chemical compound [Al+3].[K+].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRLPQNLYRHEGIJ-UHFFFAOYSA-J 0.000 description 4
- WFIZEGIEIOHZCP-UHFFFAOYSA-M potassium formate Chemical compound [K+].[O-]C=O WFIZEGIEIOHZCP-UHFFFAOYSA-M 0.000 description 4
- UMPKMCDVBZFQOK-UHFFFAOYSA-N potassium;iron(3+);oxygen(2-) Chemical compound [O-2].[O-2].[K+].[Fe+3] UMPKMCDVBZFQOK-UHFFFAOYSA-N 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
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- 238000005516 engineering process Methods 0.000 description 3
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- KEVMYFLMMDUPJE-UHFFFAOYSA-N 2,7-dimethyloctane Chemical group CC(C)CCCCC(C)C KEVMYFLMMDUPJE-UHFFFAOYSA-N 0.000 description 2
- 239000002671 adjuvant Substances 0.000 description 2
- 230000004931 aggregating effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- IQOGQTMDKOGOOY-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C.CO[Si](OC)(OC)C=C IQOGQTMDKOGOOY-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000006384 oligomerization reaction Methods 0.000 description 2
- 150000001282 organosilanes Chemical class 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 2
- 238000012719 thermal polymerization Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- WNXTZVMMNCCZTP-UHFFFAOYSA-N 2-hydroxyethyl 2-methylprop-2-enoate 5-hydroxy-2-methylpent-2-enoic acid Chemical compound OCCC=C(C(=O)O)C.C(C(=C)C)(=O)OCCO WNXTZVMMNCCZTP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000007848 Bronsted acid Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- DJOWTWWHMWQATC-KYHIUUMWSA-N Karpoxanthin Natural products CC(=C/C=C/C=C(C)/C=C/C=C(C)/C=C/C1(O)C(C)(C)CC(O)CC1(C)O)C=CC=C(/C)C=CC2=C(C)CC(O)CC2(C)C DJOWTWWHMWQATC-KYHIUUMWSA-N 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- 208000034189 Sclerosis Diseases 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
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- 238000011049 filling Methods 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
- 108010036050 human cationic antimicrobial protein 57 Proteins 0.000 description 1
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- 150000002500 ions Chemical class 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Surface Treatment Of Glass (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model provides a tempered glass structure and touch device with the same, the tempered glass structure contains a glass cutting piece, a strengthening layer and a shielding layer. The glass cutting piece is formed by cutting a mother glass substrate and at least one cutting section is formed on the glass cutting piece. The strengthening layer is at least arranged on at least part of the cutting section of the glass cutting piece, and the shielding layer is at least arranged on at least part of the periphery of the glass cutting piece and covers at least part of the strengthening layer. Through the utility model discloses, can improve the holistic intensity of glass-cutting spare, can effectively solve the problem of marginal light leak, also can make glass substrate have the visual effect of integration in the outward appearance, still can provide the frame limit protection effect that the overlay walked the line structure, and can avoid the decorative layer to expose the quilt that causes and scrape the stab scheduling problem and can effectively improve product reliability.
Description
Technical field
The utility model is about a kind of tempered glass structure and has the contactor control device of tempered glass structure.
Background technology
Existing glass reinforced mode mainly contains two kinds, and a kind of is physical strengthening mode, and another kind is chemical enhanced mode.The mechanism of chemical enhanced mode is mainly carries out ion-exchange to produce a chemical enhanced layer on the top layer of glass, this chemical enhanced layer can derive distribution of the compressive stress layer of a correspondence, so grows up and improve the breakdown strength of glass in the compressive stress layer crack that can retrain surface layer of glass.In generally carrying out in chemical enhanced process, be to treat that by whole hardened glass substrate is dipped in high temperature potassium nitrate fused salt to carry out ion-exchange.Yet this chemical enhanced mode is difficult to glass substrate to carry out local strengthening, and the high temperature in process easily injures the coating on glass substrate.On the other hand, if the glass completing after chemical enhanced is processed again, this processing behavior may cause the strengthening layer of glass regional area to be removed, or derive the new surface that does not have strengthening layer, therefore the growth without its crack, strengthening layer overlay area of carrying out processing on glass is relatively easy, and then reduces the intensity of glass itself.
Utility model content
The utility model provides a kind of tempered glass structure and has the contactor control device of tempered glass structure, is to utilize strengthening course collocation to cover the shielding layer on it, so that the intensity that glass is good to be provided.
An embodiment of the present utility model provides a kind of tempered glass structure, comprises a glass-cutting part, a strengthening course and a shielding layer.Glass-cutting part is that a female glass substrate forms and at least all cut section in the formation of glass-cutting part via cutting.Strengthening course is at least arranged at least part of this cutting section of this glass-cutting part, and shielding layer is at least arranged at least part of periphery of this glass-cutting part, and is covered to this strengthening course of small part.
Another embodiment of the utility model provides a kind of tempered glass structure, comprises a glass-cutting part, a strengthening course and a shielding layer.Glass-cutting part is to be formed by the female glass substrate cutting through first chemical enhanced processing, at least one newly-generated surf zone that glass-cutting part comprises initial strengthening surface region and produces via machining or material removal process.Strengthening course is at least arranged at least part of this newly-generated surf zone of this glass-cutting part, and shielding layer is at least arranged at least part of periphery of this glass-cutting part, and is covered to this strengthening course of small part.
In an embodiment, user can utilize the modes such as coating, immersion that enhanced coating is added on to part or a Zone Full for the treatment of tempered glass outward, to form strengthening course, provides by this local or whole strengthening effects.For example, enhanced coating can be coated the glass baseplate surface without intensive treatment, or may still have through a tempered glass of first chemical enhanced processing the surf zone that does not form chemical enhanced layer.Or, through a tempered glass of first chemical enhanced processing, after implementing machining or material removal process process, can produce a newly-generated surf zone that does not have a chemical enhanced layer.Enhanced coating can be formed on the above-mentioned surf zone that does not form chemical enhanced layer or newly-generated surf zone so that reinforcing effect to be provided.Moreover enhanced coating carries out reinforcement except coating the part of glass substrate, can also be formed at and not pass through or passed through on the whole glass substrate of chemical enhanced processing according to actual demand.Certainly, the strengthening course that enhanced coating sclerosis forms also can be arranged at the regional area through strengthening.
By the design of above-mentioned each embodiment, utilize enhanced coating can on newly-generated surf zone, form strengthening course or reinforcement because of former thereby weakened or local original strengthening layers removing such as machining or material removal process, so the integral surface of glass-cutting part all has strengthening layer, therefore can improve the intensity of glass-cutting part integral body.Because can utilizing the mode of for example smearing, enhanced coating is formed on glass substrate, thus be easy to the regional area of glass to carry out reinforcement, and the crack that enhanced coating can be filled up surface layer of glass is further to improve strengthening effect.Moreover, because of shielding layer foldable decorative layer outer rim and the outer intermarginal gap area of strengthening course, therefore can effectively solve the problem of edge light leak, also can make glass substrate have in appearance integrated visual effect.In addition, because shielding layer is arranged at the periphery of contactor control device, thus the edge protection effect of overlay Wiring structure can be provided, and being scraped of can avoiding decorative layer to expose causing the problem such as stabbed and can effectively be improved product reliability.In addition, enhanced coating can be coated on the cutting section of glass-cutting part so that buffering, shock-absorbing and strengthening effect to be provided, and when shielding layer extends to the lateral border that covers the formed strengthening course of enhanced coating, can make intensity more obtain lifting.
Other objects of the present utility model and advantage can be further understood from the disclosed technical characterictic of the utility model.For above and other object of the present utility model, feature and advantage can be become apparent, special embodiment below also coordinates appended graphicly, is described in detail below.
Accompanying drawing explanation
Fig. 1 is the effect schematic diagram of the glass reinforced coating of the utility model one embodiment;
Fig. 2 is according to the utility model one embodiment, is illustrated in the schematic diagram that carries out machining or material removal process and the chemical enhanced processing procedure of secondary on glass substrate;
Fig. 3 is according to another embodiment of the utility model, is illustrated in the schematic diagram that carries out machining or material removal process and the chemical enhanced processing procedure of secondary on glass substrate;
Fig. 4 is according to another embodiment of the utility model, is illustrated in the schematic diagram that carries out machining or material removal process and the chemical enhanced processing procedure of secondary on glass substrate;
Fig. 5 is according to another embodiment of the utility model, is illustrated in the schematic diagram that carries out machining or material removal process and the chemical enhanced processing procedure of secondary on glass substrate;
Fig. 6 is the diagrammatic cross-section of the utility model one embodiment, shows on overlay and is provided with decorative layer and is combined into a display with touch-control sensing structure;
Fig. 7 is the schematic top plan view of the overlay of Fig. 6 and an embodiment of touch-control sensing structure;
Fig. 8 is the schematic top plan view of the overlay of Fig. 6 and another embodiment of touch-control sensing structure;
Fig. 9 is the diagrammatic cross-section of the utility model one embodiment, shows that the side of overlay is curved surface, and combination of touch control panel and display;
Figure 10 is the diagrammatic cross-section of the utility model one embodiment, on the upper substrate of demonstration one display or cap, is provided with touch-control sensing structure;
Figure 11 is the diagrammatic cross-section of the utility model one embodiment, shows that touch-control sensing structure is arranged on overlay and a substrate;
Figure 12 is the diagrammatic cross-section of the utility model one embodiment, shows that the cap of an organic light emitting diode display has touch-control sensing structure;
Figure 13 is the diagrammatic cross-section of the utility model one embodiment, shows that overlay is as the cap of organic light emitting diode display, and has touch-control sensing structure on overlay;
Figure 14 A is the contactor control device schematic diagram of the utility model one embodiment;
Figure 14 B is the contactor control device schematic diagram of another derivative embodiment of the utility model;
Figure 15 A is the contactor control device schematic diagram of the utility model one embodiment;
Figure 15 B is the contactor control device schematic diagram of another derivative embodiment of the utility model;
Figure 16 is the schematic diagram of the contactor control device of another embodiment of the utility model;
Figure 17 is the schematic diagram of the contactor control device of another embodiment of the utility model;
Figure 18 is the schematic diagram of the contactor control device of another embodiment of the utility model;
Figure 19 A to Figure 19 D is for according to embodiment of the present utility model, shows the schematic diagram of ink layer, infrared light transparent material layer and the relative distribution of strengthening course;
Figure 20 A to Figure 20 D is for according to embodiment of the present utility model, shows the schematic diagram of ink layer, infrared light transparent material layer and the relative distribution of strengthening course;
Figure 21 is the schematic diagram of the contactor control device of another embodiment of the utility model;
Figure 22 is the schematic diagram of the contactor control device of another embodiment of the utility model;
Figure 23 is the schematic diagram of the contactor control device of another embodiment of the utility model;
Figure 24 is the schematic diagram of a groove etching structure;
Figure 25 is the schematic diagram of the contactor control device of another embodiment of the utility model.
Reference numeral
10 glass substrates
12 enhanced coatings
12a strengthening course
14 cracks
The female glass substrate of 20 strengthening
20a glass-cutting part
24,45,54,64,742,744,842,844,942,944 touch-control sensing structures
22,28 chemical enhanced layers
42 grooves
43 groove etching structures
44,53 holes
41,51,61,71,81,91,1001 overlays
511 overlay side edge surface
47,52,62,72,82,1002 decorative layers
542,544 electrode tandems
545 electric conduction routing
546 button shape single-layer electrodes
548 triangular single-layer electrodes
55,75,95,1005 display units
56,964,1008 infrabasal plates
57,962 caps
58,68,88 displays
411,611 curved surfaces
50,60,70,80,90 touch control display apparatus
65 contact panels
66,86 substrates
76 displays
762 colored optical filtering substrates
96,100 organic light emitting diode display
114 insulation courses
116 decorative layers
1165 ink blocks
118 routing layers
122a the first transparency electrode
122b the second transparency electrode
124 electrical insulation layers
125 first connecting lines
126 second connecting lines
132 protective seams
134 flexible circuit boards
136 anisotropic conductives
138 shielding layers
138a ink layer
138b infrared light transparent material layer
138c light emitting diode photic zone
1381,1382,1161,1162,1163 white ink layers
1383,1164 black ink layer
142 functional retes
144 insulation courses
146 electrically conducting transparent connection pad layers
200,300 contactor control devices
The initial strengthening surface of M region
The newly-generated surf zone of N, NS
P decorative layer outer rim
Q1, Q2 outer rim
S, S1, S2 gap area
Embodiment
About aforementioned and other technology contents, feature and effect of the present utility model, in the following detailed description coordinating with reference to graphic embodiment, can clearly present.The direction term of mentioning in following examples, such as: upper and lower, left and right, front or rear etc., is only the direction with reference to annexed drawings.Therefore, the direction term of use is to be not used for limiting the utility model for illustrating.
As shown in Figure 1, the silicon dioxide molten gel (SiO2 sol-gel) of the enhanced coating 12 of the utility model embodiment for comprising sylvite.When coating enhanced coating 12 is during in a glass substrate 10 surperficial, after heating, the sodion on the potassium ion of enhanced coating 12 and glass substrate 10 top layers carries out ion-exchange and produces a chemical enhanced layer, so can make glass substrate 10 top layers form a compressive stress layer, and make glass substrate 10 inside derive suitable tension stress so that integral body reaches dynamic balance, now, enhanced coating 12 itself and this chemical enhanced layer are common forms strengthening course.When compressive stress layer is thicker, the ability of growing up in constraint surface layer of glass crack is stronger, makes the intensity of glass substrate 10 higher, to improve the ability of glass surface opposing foreign object strike.In addition, the silica coating in enhanced coating 12 can provide the effect in the crack 14 of filling up surface layer of glass.
Formulation Example 1
(1) the molten gel of silicon dioxide (SiO2sol-gel), the molten gel of silicon dioxide is through being hydrolyzed and aggregating into silicon dioxide, to be substrate by silane compound precursor, and silane compound precursor is for example tetraethoxysilane (Tetraethoxysilane), tetramethyl oxosilane (Tetramethoxysilane), vinyltrimethoxy silane (vinyltrimethoxysilane) or methyltrimethoxy silane (methyltrimethoxysilane); And
(2) sylvite that percentage by weight is 1-30%, and sylvite kind be for example potassium dihydrogen phosphate (Potassium dihydrogen phosphate), potassium manganate (Potassium manganate), potassium ferrate (Potassium ferrate), potassium nitrate (Potassium nitrate), potassium formate (Potassium formate), potassium ferric oxalate (Potassium ferric oxalate) and aluminium potassium sulfate (Aluminium potassium sulfate) at least one of them.Sylvite carries out ion-exchange to produce chemical enhanced layer except can be used to, sylvite dissolves formed ion, also can hinder intermolecular crosslinking points and produce, thereby can lengthen the naturally standing required time that becomes gel state of collosol state, namely extend the holding time of coating.
Above-mentioned raw materials can be between 1-4, to prepare enhanced coating 12 in pH value, and the hardening temperature of glass reinforced coating 12 can be 100-480 ℃.
Certainly, in other alternate embodiment, also can select not add sylvite, and only with silica coating, fill up the crack of surface layer of glass, and the effect that buffering external force is provided, now, enhanced coating forms separately strengthening course.In addition, inorganic polymeric material of the present utility model is not limited to the molten gel of silicon dioxide, and it also can, from selecting in organosilane material widely, be preferably derived from alkoxide silicon materials and sol-gal process; In addition, inorganic polymeric material also can be selected the aluminosilicate material of three-dimensional architecture, but not as limit.
Formulation Example 2
Enhanced coating is that organic/inorganic blendes together polymeric material, and it comprises:
(1) the molten gel of silicon dioxide (SiO2sol-gel), the molten gel of silicon dioxide is through being hydrolyzed and aggregating into silicon dioxide, to be substrate by silane compound precursor, and silane compound precursor is for example tetraethoxysilane (Tetraethoxysilane), tetramethyl oxosilane (Tetramethoxysilane), vinyltrimethoxy silane (vinyltrimethoxysilane) or methyltrimethoxy silane (methyltrimethoxysilane);
(2) acrylate, for example can be hydroxyethyl methylacrylate (2-hydroxyethyl methacrylate) or diisoamyl tetrol six acrylate (Dipentaerythritol hexacrylate); Acrylate can the hydrolysis program in the molten gel manufacturing process of silicon dioxide after, add together and react, to blend together formation acryl/silicon dioxide hybrid material with the molten gel of silicon dioxide, so can improve the toughness of enhanced coating to absorb impact; And
(3) sylvite that percentage by weight is 1-30%, and sylvite kind be for example potassium dihydrogen phosphate (Potassium dihydrogen phosphate), potassium manganate (Potassium manganate), potassium ferrate (Potassium ferrate), potassium nitrate (Potassium nitrate), potassium formate (Potassium formate), potassium ferric oxalate (Potassium ferric oxalate) and aluminium potassium sulfate (Aluminium potassium sulfate) at least one of them.
Above-mentioned raw materials can be between 1-4, to prepare enhanced coating 12 in pH value, and the hardening temperature of enhanced coating 12 can be 100-480 ℃.
Certainly, in other alternate embodiment, also can select not add sylvite, and only by acryl/silicon dioxide hybrid material, provide compared to the effect of the higher toughness of embodiment 1 and impact absorption, that is enhanced coating 12 itself forms separately strengthening course.In addition, also can use silicon, silane or siloxane to modify the formed organic/inorganic of various types of resins (such as PU, silica gel, epoxy resin, golden steel loop resin, PC, PE, PS etc.) and blend together polymeric material.
Formulation Example 3
Enhanced coating is organic polymer materials, is preferably the UV glue that belongs to photopolymerization resin, and UV glue kind is for example acryl system or epoxy resin.Acryl is that UV glue is consisted of acryl oligomerization zoarium or monomer, light initiator and other adjuvant, oligomerization zoarium and monomer all have acryl functional group, when light brings out initiator and produces free radical, acryl functional group can and free radical reaction, reach the object of photo-hardening.Epoxy resin UV glue is mainly being consisted of resin, light initiator, filling agent and other adjuvants, and light initiator, after absorbing light ray energy, can carry out a series of reaction, finally generates Bronsted acid, initial whole photo-hardening reaction.Should be noted that, the photopolymerization resin of some heated polymerizable of can arranging in pairs or groups also belongs to the photopolymerization resin of the utility model indication.Certainly, organic polymer materials of the present utility model also can be from selecting in thermal polymerization resin widely, such as the thermosetting resin of acrylic acid series, thermmohardening PU resin, thermosetting epoxy resin etc., so because thermal polymerization resin has been prior art, in this appearance, repeat no more.
With different embodiment, the female glass substrate of the strengthening forming through first chemical enhanced processing is described as follows, after carrying out machining or material removal process, produces newly-generated surf zone and use enhanced coating that the process of chemical enhanced effect is provided.As shown in Figure 2, a master slice technique is to carry out on the female glass substrate of strengthening (strenghened mother glass substrate) 20 that passes through first chemical enhanced processing.In this master slice technique, refer under the master slice size of tempered glass before cutting and carry out the required technique of product.For example, if tempered glass is the use as substrate or overlay (cover glass) for a contact panel, master slice technique for example can comprise and utilizes one first gold-tinted (photolithography) technique to form electric conduction routing, utilize one second gold-tinted technique definition insulation course, utilize one the 3rd gold-tinted technique to form the first electrode tandem and the second electrode tandem, and utilize a gold-tinted, wire mark or jet printing technique to form decorative layer and form a plurality of touch-control sensing structures 24 to be separated on the female glass substrate 20 of strengthening.Decorative layer for example can by pottery, class bore carbon, color ink, photoresistance or resin material at least one of them is formed, and can be formed on an overlay or a glass substrate of contact panel, display panel or other electronic product.Or, if tempered glass is the use as the transparency carrier of a display panel, master slice technique is such as being contained in the thin-film techniques such as the thin film deposition of metal that strengthening carries out on female glass substrate 20 and insulating material and gold-tinted etching to form a display unit, and display unit does not limit such as can be liquid crystal display or organic light-emitting diode display unit etc.After master slice technique completes, to strengthening female glass substrate 20, carry out cutting process again, can form and have one by one a glass-cutting part 20a of film stack structure, therefore adopt above-mentioned master slice glass technology to manufacture a product, can effectively save operation, man-hour and manufacturing cost.Moreover, because of above-mentioned cut place, comprehend and make each glass-cutting part 20a produce four newly-generated surf zone NS (i.e. four cutting sides), and the chemical enhanced layer of tool 22 not on newly-generated surf zone NS, therefore can utilize the modes such as coating that enhanced coating 12 is formed on newly-generated surf zone NS, make newly-generated surf zone NS form a chemical enhanced layer 28, that is, (the chemical enhanced layer 28 shown in figure is because coating 12 has with glass and carries out ion-exchange to the enhanced coating 12 of the present embodiment with the common formation strengthening course of chemical enhanced layer 28, therefore chemical enhanced layer 28 is positioned at inside glass, yet, as coating does not carry out ion-exchange with glass, only coating itself forms separately strengthening course, that is strengthening course is positioned at glass outer, at this, chat bright), by the formation of above-mentioned strengthening course, so the integral surface of glass-cutting part 20a all has strengthening layer, and can improve the intensity of glass-cutting part 20a integral body.As shown in Figure 3, glass-cutting part 20a produces a newly-generated surf zone NS for the chemical enhanced layer of tool or produce the newly-generated surf zone NS of the chemical enhanced layer of a residual part not in fact after the edging (grinding), after coating enhanced coating 12, can form a chemical enhanced layer 28 in newly-generated surf zone NS equally.Therefore, each embodiment of the utility model can provide a kind of glass-cutting part 20a, it is to be formed by female glass substrate 20 cuttings through first chemical enhanced processing, at least one newly-generated surf zone N that glass-cutting part 20a comprises initial strengthening surface region M and produces via machining or material removal process, and the chemical enhanced layer 28 forming because of enhanced coating 12 is at least formed at newly-generated surf zone N.In addition, except newly-generated surf zone N, enhanced coating 12 also can optionally be formed at the initial strengthening surface region M of part, for example, near the region of newly-generated surf zone N, more to strengthen the strength of glass of this selection area.If if necessary, also can be coated with enhanced coating 12 to the glass-cutting part 20a via after machining or material removal process comprehensively.Certainly, the process of machining or material removal process does not limit, only need to produce the i.e. applicable embodiment of the present utility model of newly-generated surf zone N, for example glass-cutting part 20a also can be in carrying out etching (etching groove 42 as shown in Figure 4 on glass-cutting part 20a), punching (on glass-cutting part 20a, getting out as shown in Figure 5 the hole 44 that runs through or do not run through), polishing, lead fillet etc. operation and produce newly-generated surf zone NS, enhanced coating 12 is formed on newly-generated surf zone N again, so glass-cutting part 20a integral surface all has strengthening layer, and can improve the intensity of glass-cutting part 20a integral body.In addition, glass-cutting part 20a can carry out a plurality of different machining or material removal process, then it is chemical enhanced that the newly-generated surf zone of final formation is carried out to secondary.For example, the cutting process such as glass-cutting part 20a can first cut, edging, lead angle, recycling edge slight crack (crack) etching that the etching medium such as hydrofluorite (HF) causes the mechanical processing process such as cutting, edging, lead angle removes, so for example can promote in advance counter-bending (bending) intensity of the glass after cutting, when glass is bent, can avoid or reduce the generation in crack, then be coated with again enhanced coating 12 and make glass-cutting part 20a integral surface all form strengthening layer.
Although enhanced coating 12 is to be formed at glass surface with coating method in above-described embodiment, but it does not limit, also can be according to actual demand by the local of glass substrate or be all soaked in enhanced coating 12, or utilize other modes to be formed at glass surface, such as ejection formation etc.In addition, the enhanced coating in above-described embodiment 12 has or not and carries out ion-exchange with glass and (being enhanced coating itself) or common (be enhanced coating itself and carry out the chemical enhanced layer that ion-exchange produces with glass) formation strengthening course separately depending on it.
By the design of above-mentioned each embodiment, utilize enhanced coating can on newly-generated surf zone, form strengthening course or reinforcement because of former thereby weakened or local original strengthening layers removing such as machining or material removal process, so the integral surface of glass-cutting part all has strengthening layer, therefore can improve the intensity of glass-cutting part integral body.Because the enhanced coating containing sylvite can utilize the mode of for example smearing to be formed on glass substrate and produce ion-exchange strengthening effect, for example, therefore be easy to the regional area of glass to carry out reinforcement, and the crack that the inorganic or organic polymer materials in enhanced coating (silica coating or UV glue) can be filled up surface layer of glass is further to improve strengthening effect.Moreover, because the hardening temperature containing the enhanced coating of sylvite is minimum, be down to approximately 100 ℃, therefore and the chemical enhanced process of existing immersion high temperature potassium fused salt compare, Yin Wendu is compared with low and can not injure the coating on glass substrate, therefore can improve yield and the fiduciary level of finished product.
Please refer to Fig. 6, a touch control display apparatus 50 comprises an overlay 51 and a display 58.The glass-cutting part 20a of previous embodiment is by the master slice technique before not cutting, techniques such as thin film deposition, gold-tinted, etching, wire mark or spray printing make in advance decorative layer 52 with touch-control sensing structure 54 on master slice glass baseplate, then cut into again the overlay 51 of small pieces.After cutting, overlay side edge surface 511 is carried out to selective etch and the chemical enhanced processing of secondary (being for example coated with enhanced coating 12), can obtain the overlay 51 of efficient hardening.Similarly, glass-cutting part 20a also can make display unit 55 on master slice glass baseplate in advance by aforesaid master slice technique, then cut into again the array base palte (array substrate) of small pieces as liquid crystal display (LCD) or the infrabasal plate 56 of organic light emitting diode display (OLED), then be combined into display 58 with another colored filter substrate or cap 57.Generally speaking, touch-control sensing structure is that the electrode layer by patterning forms, example touch-control sensing structure 54 is as shown in Figure 7 mainly by the first electrode tandem 542 and the second horizontal electrode tandem 544 are formed longitudinally, and the staggered place of the first electrode tandem 542 and the second electrode tandem 544 is provided with a dielectric layer, in order to electrically isolated the first electrode tandem 542 and the second electrode tandem 544; In addition, the bridging line in the first electrode tandem 542 or the second electrode tandem 544 can be arranged on dielectric layer above or below, and its material can be electrically conducting transparent thing or metal.Electric conduction routing 545 is formed on decorative layer 52 or as the bridging line in electrode tandem 542,544, and electric conduction routing 545 can be metal routing or transparent electric conduction routing.The electric conduction routing 545 of only signal part in Fig. 7, remaining omission will not be drawn.
In addition, touch-control sensing structure 54 can be also that the single-layer electrodes layer by patterning forms, and example touch-control sensing structure 54 as shown in Figure 8 is mainly comprised of button shape single-layer electrodes (button type single layer electrode) 546 and 548, triangular single-layer electrode (triangle type single layer electrode).Here so-called button shape single-layer electrodes or triangular single-layer electrode can be also the transparent electrode pattern of whole or the pattern forming as the netted lametta shown in graphic.Electric conduction routing 545 is formed on decorative layer 52, and electric conduction routing 545 can be metal routing or transparent electric conduction routing.The electric conduction routing 545 of only signal part in Fig. 8, remaining omission will not be drawn.Hole 53 is formed in the region of top decorative layer 52 of overlay 51, and for example, after etching technics and the chemical enhanced processing of secondary (being coated with enhanced coating 12), the strength of glass of hole 53 can effectively promote.In addition, the pattern that whole above-mentioned transparent electrode pattern or netted lametta form does not limit the touch-control sensing structure 54 that applies to the present embodiment, and can apply to the touch-control sensing structure of each embodiment of the present utility model or other various different shapes.
Please refer to Fig. 9, when glass-cutting part 20a of the present utility model is during as overlay, can to each glass-cutting part, carry out carrying out the chemical enhanced processing of secondary after machining processes as aforementioned.In this embodiment, adopt machining for example edging and lead angle, first the side of overlay 61 is made into curved surface 611, for curved surface 611, carry out the chemical enhanced processing of secondary (being for example coated with enhanced coating 12) more afterwards.On another surface of overlay 61, be provided with decorative layer 62.In the present embodiment, the overlay 61 completing forms the product of touch control display apparatus 60 together with a contact panel 65, display 68.Wherein, contact panel 65 is comprised of substrate 66 and touch-control sensing structure 64.Touch-control sensing structure 64 shown in Fig. 9 is the both sides that are positioned at substrate 66, but not as limit, can be also in the monolateral touch-control sensing structure 64 of substrate 66.
Please refer to Figure 10, in one embodiment, the glass-cutting part 20a of touch control display apparatus 70 is by the master slice technique before not cutting, techniques such as thin film deposition, gold-tinted, etching, wire mark or spray printing is made a decorative layer 72 and a touch-control sensing structure 742 in advance on master slice glass baseplate, then cuts into the overlay 71 of small pieces again.Be that with previous embodiment difference another touch-control sensing structure 744 is set directly on colored optical filtering substrates 762 surfaces of display 76, mode makes touch- control sensing structure 742 and 744 jointly be integrated into a touch-control sensing element by this.Touch- control sensing structure 742 and 744 can be the electrode layer of patterning.Display 76 can comprise infrabasal plate 764 and display unit 75 disposed thereon, and forms display 76 with colored optical filtering substrates 762.
In another embodiment, touch-control sensing structure 744 also can be omitted, and only with touch-control sensing structure 742, carries out sensor operation, and now touch-control sensing structure 742 can be for example the electrode of individual layer or the electrode of multilayer, is not limited.So, can form a touch-control display panel 76.Moreover, in the present embodiment, be that with previous embodiment difference colored optical filtering substrates 762 can be replaced as the cap of Organic Light Emitting Diode (OLED).Overlay 71 is combined into a touch control display apparatus 70 with tempered glass protection in conjunction with the display 76 of tool touch controllable function.All the other something in common are no longer repeated.
Please refer to Figure 11; in the present embodiment; be separately positioned on the overlay 81 and a transparency carrier 86 of touch control display apparatus 80 in touch- control sensing structure 842 and 844 with previous embodiment difference, make overlay 81 form a touch control display apparatus 80 with tempered glass protection in conjunction with substrate 86, display 88.
Please refer to Figure 12, in a touch control display apparatus 90,962 liang of surfaces of the cap of a light emitting diode indicator 96 are provided with touch-control sensing structure 942,944.One display unit 95 is arranged on an infrabasal plate 964.Cap 962, infrabasal plate 964 or overlay 91 can use glass reinforced coating and the cutting member of the utility model embodiment, and all the other and previous embodiment something in common are no longer repeated.
Please refer to Figure 13, in the present embodiment, according to the overlay 1001 after previous embodiment strengthening, can directly be used as the cap of an organic light emitting diode display (OLED) 100, and touch-control sensing structure 1004 is formed on overlay 1001.One organic light-emitting diode display unit 1005 is arranged on an infrabasal plate 1008 and with overlay 1001 and is combined into a touch control display apparatus with tempered glass protection.Decorative layer 1002 in Figure 13 is arranged on the upper surface of overlay 1001, but also can be arranged on the lower surface of overlay 1001, is not limited.In addition, the side 1006 of overlay 1001 can be plane or curved surface as shown in the previous embodiment, and decorative layer 1002 can be arranged on the surface of curved surface.
As shown in Figure 14 A, according to the contactor control device 200 of another embodiment of the utility model, by a glass-cutting part 20a and the rhythmo structure that is formed on glass-cutting part 20a, formed.It is upper to detect touch position that one touch-control sensing structure is arranged at glass-cutting part 20a, one decorative layer 116 is arranged at the periphery (only illustrate a wherein side in figure and do signal explanation) of glass-cutting part 20a, and between the outer rim Q1 of the outer rim P of decorative layer 116 and strengthening course 12a, has a gap area S.Routing layer 118 can be arranged on decorative layer 116 and comprise many cablings, and touch-control sensing structure is electrically connected to cabling.Moreover an insulation course 114 can be formed at the upper also cover glass cutting member 20a of glass-cutting part 20a, but also insulation course 114 can be set on glass-cutting part 20a in other embodiment.Decorative layer 116 can be positioned at the periphery of glass-cutting part 20a to cover cabling, and the material of decorative layer 116 can be ink material, photoresist, class is bored or stupalith forms.Touch-control sensing structure can be single layered transparent electrode structure or multi-layer transparent electrode structure, and touch-control sensing structure example is as comprised many first electrode tandems and many second electrode tandems, and those the first electrode tandems and those the second electrode tandems are spaced apart from each other.For example, as the touch-control sensing structure of Figure 14 A has lower conducting island (underground island) electrode structure, those first transparent tandems are via many first adjacent transparency electrode 122a of the first connecting line 125 series winding, and those second transparent tandems are via many second adjacent transparency electrode 122b of the second connecting line 126 series winding, and be provided with electrical insulation layer 124 to being less than the first relative connecting line 125 and 126 of the second connecting lines.These are only an embodiment wherein of touch-control sensing structure of the present utility model, touch-control sensing structure of the present utility model is not restricted to lower conducting island electrode structure, its connecting line also can be linked and be formed bridge joint shape electrode structure by top, or touch-control sensing locations of structures can be located at two side positions of substrate, and not limit a plurality of transparency electrode of the present utility model be geometric configuration or the non-specification shapes such as rhombus, triangle, straight line.One protective seam 132 can cover touch electrode structure in touch control operation district and the rhythmo structure in non-Touch Zone with the one-piece construction of protection contactor control device 200 simultaneously; and protective seam 132 can be consisted of the inorganic material of for example silicide, in the present embodiment, be transparent material.Another insulation course 144 can be formed on protective seam 132 and only be distributed in non-Touch Zone N.The thickness of insulation course 144 can be 3 to 100 times of protective seam 132 thickness, and insulation course 144 can by inorganic material or organic material form all can, in the present embodiment, be transparent material.One conductive connection pads layer 146 can be formed on decorative layer 116 and be electrically connected to the many strip metals cabling in routing layer 118.The material of conductive connection pads layer 146 for example can be ITO nesa coating, and protective seam 132 and insulation course 144 engaging zones on conductive connection pads layer 146 forms respectively an opening, with expose portion conductive connection pads layer 146.The conductive connection pads layer 146 exposing can be electrically connected to external circuit by an anisotropic conductive (ACF) 136, for example, can be electrically connected to a transfer element (for example flexible circuit board 134) or an electronic component (IC chip for example; Not shown).One shielding layer 138 can be arranged at the periphery of glass-cutting part 20a, and can at least superimposed gap area S, so shielding layer 138 covers on glass-cutting part 20a and this strengthening course 12a simultaneously.Shielding layer 138 can form an opening in the engaging zones position of corresponding conductive connection pads layer 146.In the present embodiment, shielding layer 138 can be formed and is formed on protective seam 132 and insulation course 144 by ink material.Generally speaking; because of the design of overlay (cover lens) on the market very diversified; therefore needing the techniques such as special-shaped edging processing reaches; but the special-shaped operation that is processed as outside destroy; decorative layer 116 is easily by vibrations injuries, therefore conventionally decorative layer 116 can be take not, by abnormal shape, destroyed as principle and inside contracts a segment distance.Yet, when decorative layer 116 inside contracts a segment distance by the outer rim Q2 of glass-cutting part 20a, add that glass-cutting part 20a outer rim Q2, to (that is strengthening course 12a thickness) after the distance between strengthening course 12a outer rim Q1, easily produces the problem of edge light leak.By above-described embodiment, design, because of the gap area S between shielding layer 138 at least superimposed decorative layer outer rim P and strengthening course 12a outer rim Q1, and partly or entirely cover the apical margin of strengthening course 12a, therefore can alleviate respectively or solve the problem of edge light leak.In addition; because shielding layer 138 is arranged at the periphery of contactor control device 200; for example can form in the upper area of routing layer 118 distribution of a hollow around decorative layer 116; therefore can provide the edge protection effect of overlay Wiring structure, and being scraped of can avoiding decorative layer 116 to expose causing the problem such as stabbed and can effectively be improved product reliability.Certainly, the distribution of shielding layer does not limit, and it also can only be arranged at the part periphery of glass substrate, particularly at decorative layer, is only arranged on the situation of corresponding glass substrate part periphery; In addition, the material of shielding layer 138 is not defined as ink, is only required to be semi-transparent, low light transmission or light-proof material to obtain the effect of eliminating edge light leak, for example, can be photoresistance, class brill or stupalith and form.Or shielding layer 138 also can be and allows the material that infrared light sees through form.In addition, shielding layer 138 can be single layer structure or the multi-layer compound structure that consists of identical or different material and color all can.Moreover shielding layer 138 only needs the periphery that is arranged at contactor control device for example to distribute around the hollow of decorative layer 116 with formation, can obtain the effect that improves product reliability, the distribution of shielding layer 138 does not limit superimposed gap area S.Moreover, in the present embodiment, the outer rim Q2 of glass-cutting part 20a is that a newly-generated surf zone (is cutting section in the present embodiment, but do not limit, also can be other forms of newly-generated surf zone), and aforesaid enhanced coating 12 can be coated at least part of cutting section to form strengthening course, and buffering, shock-absorbing and strengthening effect are provided by this.
Figure 14 B further discloses strengthening course 12a and more extends on the periphery that is arranged at this glass-cutting part 20a, that is strengthening course 12a extends to the side surface that glass-cutting part 20a has touch-control sensing structure, so can make intensity more obtain lifting, and equally can alleviate or solve the problem of edge exposure via the covering of shielding layer 138.In addition, strengthening course 12a also has larger region can be subject to the protection of shielding layer 138.
As shown in Figure 15 A; in another embodiment; the shielding layer 138 of contactor control device 300 can extend downward and be covered to small part strengthening course 12a, except making strengthening course 12a have more region to be subject to the protection of shielding layer 138, also can make the intensity of glass-cutting part 20a more obtain lifting.Similarly; Figure 15 B discloses strengthening course 12a and can further extend on the periphery that is arranged at this glass-cutting part; that is extend to the side surface that glass-cutting part 20a has touch-control sensing structure; so; collocation extends downward the shielding layer 138 of strengthening course 12a outer rim again; can make strengthening effect more obtain lifting, and strengthening course 12a also there is more region can be subject to the protection of shielding layer 138.
From above-mentioned each embodiment, shielding layer 138 does not limit completely with relative position and the distribution of strengthening course 12a, shielding layer 138 can contact or the local or whole side of superimposed strengthening course 12a at least partly, shielding layer 138 can a part of contact or superimposed strengthening course 12a and other parts do not contact or superimposed strengthening course 12a, and the part of shielding layer 138 contacts or superimposed strengthening course 12a is not specific.Moreover, as previously mentioned, shielding layer 138 can be single layer structure, or be the multi-layer compound structure that identical or different material, identical or different color form, therefore, in an embodiment, as shown in figure 16, shielding layer 138 can be the multi-layer compound structure that comprises an ink layer 138a and an infrared light transparent material layer 138b.Ink layer 138a can be consisted of ink material, and infrared light transparent material layer 138b can be by allowing the material that infrared light sees through be formed, and the infrared light transparent material layer 138b ink layer 138a of cover part at least.In this infrared light light transmissive material, refer to and can allow the light transmission rate of infrared light higher than the material of the light transmission rate of other wavelength light, for example, can allow the light transmission rate of infrared light higher than 75%, and allow the light transmission rate of other wavelength light lower than 20%, but not as limit.In the present embodiment, infrared light transparent material layer 138b can contact strengthening course 12a and be covered to small part strengthening course 12a, and ink layer 138a does not contact or superimposed strengthening course 12a.In another embodiment, as shown in figure 17, infrared light transparent material layer 138b and ink layer 138a can all contact strengthening course 12a and equal cover part strengthening course 12a.As shown in figure 18, in another embodiment, ink layer 138a can more past extension and is contacted strengthening course 12a, make ink layer 138a be covered to small part strengthening course 12a, though infrared light transparent material layer 138b contacts strengthening course 12a, it does not form position folded part strengthening course 12a, can make so equally infrared light transparent material layer 138b and ink layer 138a all be covered to small part strengthening course 12a.In each embodiment of the utility model, ink layer 138a, infrared light transparent material layer 138b and strengthening course 12a the relative position of each other and distribution do not limit completely.Figure 19 A to Figure 20 D shows the part embodiment of ink layer 138a, infrared light transparent material layer 138b and the relative distribution of strengthening course 12a, show part contact or superimposed formed different aspects by ink layer 138a and the relative strengthening course 12a of infrared light transparent material layer 138b, all can obtain the effect that shielding layer 138 is covered to small part strengthening course 12a.For example, in ink layer 138a, formed different the covering in aspect of the part contact of the relative strengthening course 12a of infrared light transparent material layer 138b or superimposed relationship, can only there is infrared light transparent material layer 138b contact strengthening course 12a and cover strengthening course 12a (Figure 19 A), only there is ink layer 138a contact strengthening course 12a but the superimposed part strengthening course of infrared light transparent material layer 138b 12a makes ink layer 138a and infrared light transparent material layer 138b all cover strengthening course 12a (Figure 19 B), ink layer 138a contacts strengthening course 12a (Figure 19 C) with infrared light transparent material layer 138b simultaneously, or only there is infrared light transparent material layer 138b contact strengthening course 12a but the superimposed part strengthening course of ink layer 138a 12a makes ink layer 138a and infrared light transparent material layer 138b all cover strengthening course 12a (Figure 19 D).Moreover, strengthening course 12a also can extend upward and touch part infrared light transparent material layer 138b (Figure 20 A) or touch part ink layer 138a and part infrared light transparent material layer 138b (Figure 20 B) simultaneously, makes shielding layer 138 cover the strengthening course 12a of part.Or the infrared light transparent material layer 138b (Figure 20 D) of the ink layer 138a (Figure 20 C) of part or part can extend downward the side of glass-cutting part 20a and contact strengthening course 12a, make shielding layer 138 cover the strengthening course 12a of part.
In another embodiment, as shown in figure 21, shielding layer 138 can be the multi-layer compound structure that comprises an ink layer 138a and a light emitting diode photic zone 138c.The light that light emitting diode photic zone 138c can allow light emitting diode send sees through limitedly, for example, can be consisted of trnaslucent materials.The position of the relative ink layer 138a of light emitting diode photic zone 138c and strengthening course 12a and distribute does not limit, and for example can be identical or approximate with the distribution mode of infrared light transparent material layer 138b described in aforementioned each embodiment, therefore repeat no more in this.Although should be noted that in this Figure 21 does not draw, light emitting diode photic zone 138c and infrared light transparent material layer 138b can be arranged on glass-cutting part 20a simultaneously.
Moreover, the profile of glass-cutting part 20a can be processed to form chamfering or do not have chamfering all can, and above-mentioned ink layer 138a, infrared light transparent material layer 138b or light emitting diode photic zone 138c can be distributed in the chamfering of the different profiles of tool or not have on the glass-cutting part 20a of chamfering.In addition, the profile of strengthening course 12a be also not limited to graphic shown in.
In an embodiment, as shown in figure 22, glass-cutting part 20a is provided with at least one functional rete (functional film) 142 in a side of touch-control sensing electrode structure and shielding layer 138 dorsad, functional rete 142 for example can be one can be reduced the anti-reflecting layer of dazzle or reduce the surface tension layer that finger presses impression produces, and the angle that its mode that judges whether to reduce finger presses impression is for example the water contact angle (contact angle) of a water droplet on this surface tension layer is greater than 100 degree; Or functional rete 142 can be hard conating (hard coat layer) etc.In an embodiment, functional rete 142 for example can cover part strengthening course 12a.Certainly, in other embodiments, also can be functional rete 142 and partly covered by strengthening course 12a.
As previously mentioned, decorative layer 116 and shielding layer 138 can be multi-layer compound structure, and multi-layer compound structure can be consisted of the lamination of identical or different material, identical or different color.Therefore, as shown in figure 23, in an embodiment, shielding layer 138 for example can comprise sequentially stacking white ink layer 1381, white ink layer 1382 and black ink layer 1383 and form, and decorative layer 116 for example can comprise sequentially the rhythmo structure of stacking white ink layer 1161, white ink layer 1162, white ink layer 1163 and black light resistance layer 1164, and form in abutting connection with the shading block 1165 of rhythmo structure.In detail, in decorative layer 116 and shielding layer 138 multi-layer compound structure separately, can be formed by the material layer of same color, the material layer that also can simultaneously comprise the different colours of dark layer (for example black ink, gray ink form) and non-dark layer (for example transparent ink, white ink, colored ink form), visual actual demand like this produces different visual effects and region shading characteristic.Certainly, in each embodiment of the utility model, the quantity of dark layer and non-dark layer, distributed areas and position do not limit completely.The thickness size and the relative scale relation that in this, should be noted each rete of each diagram formula of painting of this case are only signal, not represent actual size or proportionate relationship.Moreover, should be noted that coating enhanced coating 12 is to form the glass-cutting part 20a of strengthening course, do not limit by the female glass substrate cutting through first chemical enhanced processing and form, also can be formed by the female glass substrate cutting without chemical enhanced processing, and the cutting section after cutting can directly be coated with enhanced coating 12, or be coated with again enhanced coating 12 after utilizing etching medium that edge slight crack (crack) etching of cutting section is removed, or cutting section is carried out to ion-exchange after producing chemical enhanced layer, be coated with again enhanced coating 12, or first utilize etching medium all can be coated with again enhanced coating 12 after producing chemical enhanced layer again this cutting section being carried out to ion-exchange after edge slight crack (crack) the etching removal of cutting section.Similarly, the processing of the newly-generated surf zone of other forms is also so, holds and does not repeat.
As shown in figure 24, cutting section is formed with the groove etching structure 43 of a plurality of circular-arc or dentations after etching, etching medium can be dry etching medium or wet etching erosion medium, and dry etching medium for example comprises fluoro-gas or electricity slurry, and wet etching erosion medium for example comprises a hydrofluoric acid containing or fluorine-containing solvent.Moreover as discussed previously, strengthening course 12a can only be arranged on the part cutting section of glass-cutting part 20a.Therefore, as shown in figure 25, in an embodiment, glass-cutting part 20a has relative both sides, strengthening course 12a can optionally for example only be arranged at the cutting section (all or part all can) in glass-cutting part 20a left side, and for example the cutting section on right side does not arrange strengthening course 12a.In in the case, when decorative layer 116 all inside contracts a segment distance by the left side outer rim of glass-cutting part 20a and right side outer rim, decorative layer 116 outer rims in the shielding layer 138 block foldable left sides in left side and the outer intermarginal gap area S1 of strengthening course 12a, the outer intermarginal gap area S2 of decorative layer 116 outer rims on the shielding layer 138 block foldable right sides on right side and glass-cutting part 20a, and this is superimposed can be all superimposed or local superimposed all can, to alleviate respectively or to solve the problem of edge light leak.Should be noted in for example Figure 25 or aforesaid part embodiment, decorative layer 116 is all arranged at glass-cutting part 20a (being for example the distribution of hollow) in the mode around touch electrode structure with shielding layer 138, but because Figure 25 is a cross-sectional view, therefore Figure 25 only shows the block of decorative layer 116 and shielding layer 138 left and right sides.
Only as described above, it is only preferred embodiment of the present utility model, when not limiting the scope that the utility model is implemented with this, the simple equivalence of generally doing according to the utility model claim and utility model description changes and modifies, and all still belongs in the scope that the utility model patent contains.Arbitrary embodiment of the present utility model or claim must not reached the disclosed whole objects of the utility model or advantage or feature in addition.In addition, summary part and title are only for the use of auxiliary patent document search, are not used for limiting interest field of the present utility model.
Claims (53)
1. a tempered glass structure, is characterized in that, described tempered glass structure comprises:
One glass-cutting part, described glass-cutting part forms via cutting one female glass substrate and at least all cut section in described glass-cutting part formation;
One strengthening course, is at least arranged at least part of described cutting section of described glass-cutting part; And
One shielding layer, is at least arranged at least part of periphery of described glass-cutting part, and is covered to strengthening course described in small part.
2. tempered glass structure according to claim 1, is characterized in that, described tempered glass structure more comprises:
A plurality of groove etching structures, are formed at described cutting section, and described strengthening course is arranged on described a plurality of groove etching structure.
3. tempered glass structure according to claim 1, it is characterized in that, described glass-cutting part has at least one newly-generated surf zone machined or that material removal process produces, described at least one newly-generated surf zone comprises described cutting section, and described strengthening course is arranged at described newly-generated surf zone at least partly.
4. tempered glass structure according to claim 1, is characterized in that, described strengthening course more extends at least part of periphery that is arranged at described glass-cutting part.
5. tempered glass structure according to claim 1, is characterized in that, described strengthening course is to be selected from one of them that inorganic polymeric material, organic polymer materials and organic/inorganic blend together polymeric material.
6. tempered glass structure according to claim 1, is characterized in that, described shielding layer bores by ink material, photoresist, class or stupalith is formed.
7. tempered glass structure according to claim 1, is characterized in that, that described shielding layer comprises is semi-transparent, low light transmission, light tight or infrared light light transmissive material.
8. tempered glass structure according to claim 1, is characterized in that, described shielding layer comprises a multi-layer compound structure, and described multi-layer compound structure is to consist of different materials.
9. tempered glass structure according to claim 1, is characterized in that, described shielding layer comprises a multi-layer compound structure, and described multi-layer compound structure is consisted of same material.
10. tempered glass structure according to claim 1, is characterized in that, described tempered glass structure more comprises:
At least one functional rete, is arranged at a described glass-cutting part side of described shielding layer dorsad.
11. tempered glass structures according to claim 1, is characterized in that, described tempered glass structure more comprises:
One decorative layer, is arranged at least part of periphery of described glass-cutting part, and the outer intermarginal of the outer rim of described decorative layer and described strengthening course has a gap area, and at least superimposed described gap area of described shielding layer.
12. tempered glass structures according to claim 1, is characterized in that, described tempered glass structure more comprises:
One touch-control sensing structure, is formed on the surface of described glass-cutting part.
13. tempered glass structures according to claim 1, is characterized in that, described glass-cutting part is a transparency carrier of a display panel, or a substrate of a contact panel or an overlay.
14. tempered glass structures according to claim 1, is characterized in that, described tempered glass structure more comprises:
One display unit, is formed on the surface of described glass-cutting part.
15. 1 kinds of tempered glass structures, is characterized in that, described tempered glass structure comprises:
One glass-cutting part, described glass-cutting part is formed by the female glass substrate cutting through first chemical enhanced processing, and the described glass-cutting part at least one newly-generated surf zone that comprises initial strengthening surface region and produce via machining or material removal process;
One strengthening course, is at least arranged at least part of described newly-generated surf zone of described glass-cutting part; And
One shielding layer, is at least arranged at least part of periphery of described glass-cutting part, and is covered to strengthening course described in small part.
16. tempered glass structures according to claim 15, is characterized in that, described initial strengthening surface region is greater than described newly-generated surf zone.
17. tempered glass structures according to claim 15, is characterized in that, described machining or material removal process comprise cutting, edging, punching, lead angle, etching and polishing process at least one of them.
18. tempered glass structures according to claim 15, is characterized in that, are more formed with the groove etching structure of a plurality of circular-arc or dentations on the surface of described newly-generated surf zone.
19. tempered glass structures according to claim 18, it is characterized in that, described groove etching structure is to be formed by a dry etching medium or wet etching erosion medium institute etching, described dry etching medium comprises fluoro-gas or electricity slurry, and described wet etching erosion medium comprises a hydrofluoric acid containing or fluorine-containing solvent.
20. tempered glass structures according to claim 15, is characterized in that, described strengthening course more extends to form at least part of region in described initial strengthening surface region.
21. tempered glass structures according to claim 15, is characterized in that, described strengthening course is to be selected from one of them that inorganic polymeric material, organic polymer materials and organic/inorganic blend together polymeric material.
22. tempered glass structures according to claim 15, is characterized in that, described shielding layer bores by ink material, photoresist, class or stupalith is formed.
23. tempered glass structures according to claim 15, is characterized in that, that described shielding layer comprises is semi-transparent, low light transmission, light tight or infrared light light transmissive material.
24. tempered glass structures according to claim 15, is characterized in that, described shielding layer comprises a multi-layer compound structure, and described multi-layer compound structure is to consist of different materials.
25. tempered glass structures according to claim 24, is characterized in that, the described different materials that forms described multi-layer compound structure is freely at least the two in semi-transparent, low light transmission, the group that light tight and infrared light light transmissive material forms of choosing.
26. tempered glass structures according to claim 25, is characterized in that, described multi-layer compound structure comprises an ink layer and an infrared light transparent material layer.
27. tempered glass structures according to claim 26, is characterized in that, described infrared light transparent material layer at least covers on described ink layer.
28. tempered glass structures according to claim 26, is characterized in that, described ink layer and described infrared light transparent material layer at least one of them is covered to strengthening course described in small part.
29. tempered glass structures according to claim 28, is characterized in that, described ink layer and described infrared light transparent material layer at least one of them contacts described strengthening course.
30. tempered glass structures according to claim 28, is characterized in that, at least one of them superimposed at least part of described strengthening course of described ink layer and described infrared light transparent material layer.
31. tempered glass structures according to claim 24, is characterized in that, described multi-layer compound structure comprises an ink layer and a light emitting diode photic zone.
32. tempered glass structures according to claim 31, is characterized in that, described light emitting diode photic zone is semi transparent material.
33. tempered glass structures according to claim 31, is characterized in that, described light emitting diode photic zone at least covers on described ink layer.
34. tempered glass structures according to claim 31, is characterized in that, described ink layer and described light emitting diode are euphotic, and at least one of them is covered to strengthening course described in small part.
35. tempered glass structures according to claim 34, is characterized in that, described ink layer and described light emitting diode are euphotic, and at least one of them contacts described strengthening course.
36. tempered glass structures according to claim 34, is characterized in that, euphotic at least one of them the superimposed at least part of described strengthening course of described ink layer and described light emitting diode.
37. tempered glass structures according to claim 15, is characterized in that, described shielding layer comprises a multi-layer compound structure, and described multi-layer compound structure is consisted of same material.
38. according to the tempered glass structure described in claim 37, it is characterized in that, described same material is ink.
39. according to the tempered glass structure described in claim 37, it is characterized in that, described multi-layer compound structure comprises at least one dark layer and at least one non-dark layer.
40. according to the tempered glass structure described in claim 39, it is characterized in that, described non-dark layer is white ink layer or colored ink layer.
41. tempered glass structures according to claim 15, is characterized in that, described tempered glass structure more comprises:
At least one functional rete, is arranged at a described glass-cutting part side of described shielding layer dorsad.
42. according to the tempered glass structure described in claim 41, it is characterized in that, described functional rete is a surface tension layer.
43. according to the tempered glass structure described in claim 41, it is characterized in that, described functional rete and described strengthening course mutually part cover.
44. tempered glass structures according to claim 15, is characterized in that, described tempered glass structure more comprises:
One decorative layer, is arranged at least part of periphery of described glass-cutting part, and the outer intermarginal of the outer rim of described decorative layer and described strengthening course has a gap area, and at least superimposed described gap area of described shielding layer.
45. according to the tempered glass structure described in claim 44, it is characterized in that, the hollow that described shielding layer has around described decorative layer distributes.
46. according to the tempered glass structure described in claim 44, it is characterized in that, described glass-cutting part is an overlay, and a touch-control sensing structure is formed on described overlay.
47. tempered glass structures according to claim 21, is characterized in that, described organic polymer materials is UV glue.
48. tempered glass structures according to claim 15, is characterized in that, described tempered glass structure more comprises:
One touch-control sensing structure, is formed on the surface of described glass-cutting part.
49. tempered glass structures according to claim 15, is characterized in that, described glass-cutting part is a transparency carrier of a display panel, or a substrate of a contact panel or an overlay.
50. tempered glass structures according to claim 15, is characterized in that, described tempered glass structure more comprises:
One display unit, is formed on the surface of described glass-cutting part.
51. 1 kinds of contactor control devices, is characterized in that, described contactor control device comprises:
One glass-cutting part, described glass-cutting part forms via cutting one female glass substrate and at least all cut section in described glass-cutting part formation;
One touch-control sensing structure, is arranged at described glass-cutting part;
One strengthening course, is at least arranged at least part of described cutting section of described glass-cutting part;
One decorative layer, is arranged at described glass-cutting part, and the outer rim of wherein said decorative layer and described strengthening course outer intermarginal has a gap area; And
One shielding layer, is arranged at described glass-cutting part and at least superimposed described gap area.
52. 1 kinds of contactor control devices, is characterized in that, described contactor control device comprises:
One glass-cutting part, described glass-cutting part is formed by the female glass substrate cutting through first chemical enhanced processing, and the described glass-cutting part at least one newly-generated surf zone that comprises initial strengthening surface region and produce via machining or material removal process;
One touch-control sensing structure, is arranged at described glass-cutting part;
One strengthening course, is at least arranged at least part of described newly-generated surf zone of described glass-cutting part;
One decorative layer, is arranged at described glass-cutting part, and the outer rim of wherein said decorative layer and described strengthening course outer intermarginal has a gap area; And
One shielding layer, is arranged at described glass-cutting part and at least superimposed described gap area.
53. 1 kinds of contactor control devices, is characterized in that, described contactor control device comprises:
One glass-cutting part, described glass-cutting part has at least one cutting section;
One touch-control sensing structure, is arranged at described glass-cutting part;
One strengthening course, is at least arranged at least part of described cutting section of described glass-cutting part;
One decorative layer, is arranged at described glass-cutting part, and the outer rim of wherein said decorative layer and described glass-cutting part outer intermarginal has a gap area; And
One shielding layer, is arranged at described glass-cutting part and at least superimposed described gap area.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101141850 | 2012-11-09 | ||
| TW101141850 | 2012-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203535602U true CN203535602U (en) | 2014-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310491721.2A Pending CN103803811A (en) | 2012-11-09 | 2013-10-18 | Tempered glass structure and touch device with same |
| CN201320647849.9U Expired - Fee Related CN203535602U (en) | 2012-11-09 | 2013-10-18 | Tempered glass structure and touch device with same |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310491721.2A Pending CN103803811A (en) | 2012-11-09 | 2013-10-18 | Tempered glass structure and touch device with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN103803811A (en) |
| TW (1) | TWM472707U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104978060A (en) * | 2014-04-10 | 2015-10-14 | 胜华科技股份有限公司 | Decorative board and touch control board |
| CN105335005A (en) * | 2015-11-13 | 2016-02-17 | 业成光电（深圳）有限公司 | Touch panel and touch display device |
| CN105511661A (en) * | 2015-02-03 | 2016-04-20 | 宸鸿科技(厦门)有限公司 | Touch control apparatus |
| TWI582665B (en) * | 2016-02-01 | 2017-05-11 | 宸鴻科技（廈門）有限公司 | Touch panel and three-dimensional cover plate thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201537420A (en) * | 2014-03-28 | 2015-10-01 | Ghitron Technology Co Ltd | Black frame border reinforcing structure of glass substrate |
| TWI570606B (en) * | 2015-08-28 | 2017-02-11 | 廣州光寶移動電子部件有限公司 | Transparent base plate and method for manufacturing the same |
| CN106102380B (en) * | 2016-08-03 | 2024-08-20 | 安徽精卓光显技术有限责任公司 | Glass shell and electronic product with same |
| CN106774650B (en) * | 2016-11-30 | 2020-04-03 | 维沃移动通信有限公司 | Mobile terminal 3D glass cover plate and manufacturing method thereof |
| WO2019090729A1 (en) * | 2017-11-10 | 2019-05-16 | 深圳市柔宇科技有限公司 | Flexible display screen and cutting and deflashing method therefor |
| CN108983886B (en) * | 2018-08-15 | 2024-04-05 | 信利光电股份有限公司 | Cover plate and preparation method thereof |
| CN115872633A (en) * | 2021-09-29 | 2023-03-31 | 比亚迪股份有限公司 | Tempered glass, glass tempering method and electronic equipment shell |
| TWI807811B (en) * | 2022-05-05 | 2023-07-01 | 達運精密工業股份有限公司 | Touch light emitting decoration nameplate and fabrication method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008104825A1 (en) * | 2007-02-28 | 2008-09-04 | Corning Incorporated | Strengthening glass using coatings |
| CN102452789A (en) * | 2010-10-18 | 2012-05-16 | 东莞联胜液晶显示器有限公司 | Cutting method, thin film process, cut preset structure, and cut member of strengthened glass |
| JP2012088946A (en) * | 2010-10-20 | 2012-05-10 | Toppan Printing Co Ltd | Method for manufacturing touch panel and decorated cover glass integral type touch panel manufactured by the same method |
| CN202018644U (en) * | 2011-04-25 | 2011-10-26 | 富创得科技股份有限公司 | Touch panel structure |
-
2013
- 2013-10-18 CN CN201310491721.2A patent/CN103803811A/en active Pending
- 2013-10-18 CN CN201320647849.9U patent/CN203535602U/en not_active Expired - Fee Related
- 2013-10-18 TW TW102219472U patent/TWM472707U/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104978060A (en) * | 2014-04-10 | 2015-10-14 | 胜华科技股份有限公司 | Decorative board and touch control board |
| CN105511661A (en) * | 2015-02-03 | 2016-04-20 | 宸鸿科技(厦门)有限公司 | Touch control apparatus |
| CN105511661B (en) * | 2015-02-03 | 2017-08-29 | 宸鸿科技(厦门)有限公司 | Contactor control device |
| CN105335005A (en) * | 2015-11-13 | 2016-02-17 | 业成光电（深圳）有限公司 | Touch panel and touch display device |
| TWI582665B (en) * | 2016-02-01 | 2017-05-11 | 宸鴻科技（廈門）有限公司 | Touch panel and three-dimensional cover plate thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM472707U (en) | 2014-02-21 |
| CN103803811A (en) | 2014-05-21 |
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