Nothing Special   »   [go: up one dir, main page]

CN203500961U - Light source structure, backlight module group and display device - Google Patents

Light source structure, backlight module group and display device Download PDF

Info

Publication number
CN203500961U
CN203500961U CN201320571190.3U CN201320571190U CN203500961U CN 203500961 U CN203500961 U CN 203500961U CN 201320571190 U CN201320571190 U CN 201320571190U CN 203500961 U CN203500961 U CN 203500961U
Authority
CN
China
Prior art keywords
heat
conducting layer
light
light source
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320571190.3U
Other languages
Chinese (zh)
Inventor
王欢
辛武根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201320571190.3U priority Critical patent/CN203500961U/en
Application granted granted Critical
Publication of CN203500961U publication Critical patent/CN203500961U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Liquid Crystal (AREA)

Abstract

The utility model provides a light source structure including a circuit board and a light source, the light source is connected with the circuit board via anode and cathode pins, a first heat conductive layer is arranged on the welding surface of the circuit board, and the anode and cathode pins penetrate through the circuit board to contact with the first heat conductive layer. Correspondingly, the utility model further provides a backlight module group including the light source structure and a display device including the backlight module group. Therefore, the light source structure can have good heat radiation effect.

Description

Light-source structure, backlight module and display unit
Technical field
The utility model relates to the back light source technique of field of liquid crystal display, relates in particular to a kind of light-source structure, comprises the backlight module of this light-source structure and comprises the display unit of this backlight module.
Background technology
At present, LED lamp has been widely used in the backlight of all kinds of tablet liquid crystal display devices, and LED lamp when the backlight, is normally arranged on a plurality of LED lamps and on a circuit board, forms LED lamp bar.
In actual applications, the phenomenon that LED lamp bar can exist temperature to raise when luminous, heats up and not only can reduce the luminous efficiency of LED lamp, can make on display panels in the local temperature near LED lamp bar compared with high and general red phenomenon occurs simultaneously, in addition, heat up and also can reduce the service life of LED lamp.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of light-source structure, comprise the backlight module of this light-source structure and comprise the display unit of this backlight module, to improve the heat dissipation characteristics of light-source structure.
For achieving the above object, the utility model provides a kind of light-source structure, comprise circuit board and light source, described light source is connected with described circuit board by both positive and negative polarity pin, on the solder side of described circuit board, be provided with the first heat-conducting layer, described both positive and negative polarity pin contacts with described the first heat-conducting layer through described circuit board.
Preferably, described circuit board component face is provided with the second heat-conducting layer, and described light source and described the second heat-conducting layer laminating.
Preferably, be provided with heat conduction via hole on described circuit board, described the first heat-conducting layer is connected by described heat conduction via hole with described the second heat-conducting layer, so that heat is passed to described the first heat-conducting layer from described the second heat-conducting layer.
Preferably, described heat conduction via hole is a plurality of.
Preferably, described light source is LED lamp.
Preferably, described the first heat-conducting layer and described the second heat-conducting layer are made by heat dissipating silicone grease.
Correspondingly, the utility model also provides a kind of backlight module, and described backlight module comprises above-mentioned light-source structure provided by the utility model.
Preferably, described backlight module also comprises backboard, and described the first heat-conducting layer contacts with described backboard.
Correspondingly, the utility model also provides a kind of display unit, and described display unit comprises above-mentioned backlight module provided by the utility model.
Visible, the utility model is by arranging the first heat-conducting layer, the heat producing while making light source luminescent spreads after can being passed to the first heat-conducting layer by both positive and negative polarity pin, simultaneously, heat conduction via hole and the second heat-conducting layer can also be set, and the heat producing while making light source luminescent spreads after can also being passed to the first heat-conducting layer by heat conduction via hole through the second heat-conducting layer.Can find out, the utility model can make light-source structure have good radiating effect.
accompanying drawing explanation
Accompanying drawing is to be used to provide further understanding of the present utility model, and forms a part for description, is used from explanation the utility model, but does not form restriction of the present utility model with the specific embodiment one below.In the accompanying drawings:
Fig. 1 is light-source structure section exemplary plot provided by the utility model;
Fig. 2 is the welding circuit board face exemplary plot of light-source structure provided by the utility model.
Description of reference numerals
1-circuit board; 2-light source; 3-both positive and negative polarity pin; 4-the first heat-conducting layer; 5-the second heat-conducting layer; 6-heat conduction via hole.
the specific embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is elaborated.Should be understood that, the specific embodiment described herein only, for description and interpretation the utility model, is not limited to the utility model.
As an aspect of the present utility model, a kind of light-source structure is provided, as shown in Figure 1, this light-source structure can comprise: circuit board 1, light source 2, the first heat-conducting layers 4.
The first heat-conducting layer 4 can be arranged on the solder side (A face) of circuit board 1, and light source 2 can be connected with circuit board 1 by both positive and negative polarity pin 3, and both positive and negative polarity pin 3 can contact with the first heat-conducting layer 4 through circuit board 1.
Above-mentioned light-source structure can the backlight for tablet liquid crystal display device in, and employing said structure can be so that the heat that light source 2 produces can be passed to the first heat-conducting layer 4 by both positive and negative polarity pin, and by the first heat-conducting layer 4 by heat diffusion, thereby make above-mentioned light-source structure there is good radiating effect.
In actual applications, can as shown in Figure 2, on the solder side (A face) of circuit board 1, for each light source 2, a first corresponding heat-conducting layer 4 be set.Or, first heat-conducting layer 4 that area is larger also can be set on the solder side of circuit board 1, making this first heat-conducting layer 4 can be a plurality of light source 2 heat radiations simultaneously.
Further, for improving radiating effect, the heat that light source 2 produces can also on the component side (B face) of circuit board 1, the second heat-conducting layer 5 be set, and can make light source 2 and the second heat-conducting layer 5 laminatings, so that can be passed to the second heat-conducting layer 5 and spread by the second heat-conducting layer 5.
Heat further, can heat conduction via hole 6 be set on circuit board 1, the first heat-conducting layer 4 is connected by heat conduction via hole 6 with the second heat-conducting layer 5, so that can be passed to the first heat-conducting layer 4 from the second heat-conducting layer 5.Adopt aforesaid way, can be so that the heat producing at light source 2 be passed to after the second heat-conducting layer 5, heat can be passed to the first heat-conducting layer 4 through heat conduction via hole 6, and by the first heat-conducting layer 4 by heat diffusion.
Further, in order to obtain better radiating effect, heat conduction via hole 6 can be set to a plurality of.
Further, light source 2 can be LED lamp.Also can be other light sources, in this no limit.
Further, the first heat-conducting layer 4 and the second heat-conducting layer 5 can be made by heat dissipating silicone grease, and can access better heat conduction and radiating effect, the packing material in heat conduction via hole 6 also can be made by heat dissipating silicone grease.
The above-mentioned description for light-source structure provided by the utility model is carried out, visible, in light-source structure provided by the utility model, the heat of light source spreads after can being passed to the first heat-conducting layer of welding circuit board face by both positive and negative polarity pin, simultaneously, the heat of light source can also be passed to the first heat-conducting layer by heat conduction via hole after the second heat-conducting layer, and by the first heat-conducting layer to external diffusion.Therefore, the utility model can make light-source structure have good radiating effect, and the light source light-emitting efficiency of having avoided light source to heat up causing reduces and the general red phenomenon of display panels, and the while can extend the service life of light source.
In actual applications, miniature light sources structure can utilize both positive and negative polarity pin to dispel the heat by the first heat-conducting layer, and large-scale light-source structure can also the second heat-conducting layer be set again when utilizing both positive and negative polarity pin by the first heat-conducting layer heat radiation and heat conduction via hole carrys out improving radiating effect.
As another aspect of the present utility model, a kind of backlight module is also provided, this backlight module comprises above-mentioned light-source structure provided by the utility model.
Further, in this backlight module, also comprise backboard, and the first heat-conducting layer in light-source structure contacts with backboard.Particularly, the back side (i.e. the one side relative with light-emitting area) that backboard can be arranged on backlight module, with fixing backlight module, adopts aforesaid way, can be so that the heat of light source can further spread by backboard after being passed to the first heat-conducting layer.
As another aspect of the present utility model, a kind of display unit is provided, this display unit comprises above-mentioned backlight module provided by the utility model.
Display unit described in the utility model can be, LCD monitor, LCD TV, mobile phone, pad, navigator or e-book etc.
Be understandable that, above embodiment is only used to principle of the present utility model is described and the illustrative embodiments that adopts, yet the utility model is not limited to this.For those skilled in the art, in the situation that not departing from spirit of the present utility model and essence, can make various modification and improvement, these modification and improvement are also considered as protection domain of the present utility model.

Claims (9)

1. a light-source structure, comprises circuit board and light source, and described light source is connected with described circuit board by both positive and negative polarity pin, it is characterized in that:
On the solder side of described circuit board, be provided with the first heat-conducting layer, described both positive and negative polarity pin contacts with described the first heat-conducting layer through described circuit board.
2. light-source structure according to claim 1, is characterized in that, described circuit board component face is provided with the second heat-conducting layer, and described light source and described the second heat-conducting layer laminating.
3. light-source structure according to claim 2, it is characterized in that, on described circuit board, be provided with heat conduction via hole, described the first heat-conducting layer is connected by described heat conduction via hole with described the second heat-conducting layer, so that heat is passed to described the first heat-conducting layer from described the second heat-conducting layer.
4. light-source structure according to claim 3, is characterized in that, described heat conduction via hole is a plurality of.
5. according to the light-source structure described in any one in claim 2 to 4, it is characterized in that, described light source is LED lamp.
6. according to the light-source structure described in any one in claim 2 to 4, it is characterized in that, described the first heat-conducting layer and described the second heat-conducting layer are made by heat dissipating silicone grease.
7. a backlight module, is characterized in that, described backlight module comprises the light-source structure described in any one in claim 1 to 6.
8. backlight module according to claim 7, is characterized in that, described backlight module also comprises backboard, and described the first heat-conducting layer contacts with described backboard.
9. a display unit, is characterized in that, described display unit comprises the backlight module described in claim 7 or 8.
CN201320571190.3U 2013-09-13 2013-09-13 Light source structure, backlight module group and display device Expired - Fee Related CN203500961U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320571190.3U CN203500961U (en) 2013-09-13 2013-09-13 Light source structure, backlight module group and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320571190.3U CN203500961U (en) 2013-09-13 2013-09-13 Light source structure, backlight module group and display device

Publications (1)

Publication Number Publication Date
CN203500961U true CN203500961U (en) 2014-03-26

Family

ID=50331937

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320571190.3U Expired - Fee Related CN203500961U (en) 2013-09-13 2013-09-13 Light source structure, backlight module group and display device

Country Status (1)

Country Link
CN (1) CN203500961U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016037432A1 (en) * 2014-09-11 2016-03-17 深圳Tcl新技术有限公司 Led module and display

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016037432A1 (en) * 2014-09-11 2016-03-17 深圳Tcl新技术有限公司 Led module and display

Similar Documents

Publication Publication Date Title
WO2009082871A1 (en) A led light source module having a heat conduction system and a heat radiation system
CN105090820A (en) Backlight source and display device
CN104267538A (en) Efficient cooling LED backlight device
CN103511991B (en) The fixed structure of reflector plate in a kind of LED-backlit module
CN203500961U (en) Light source structure, backlight module group and display device
CN103899976A (en) Light source module, backlight module and liquid crystal display device
CN101975376B (en) Luminous source heat-dissipation structure of backlight module
CN203868806U (en) Backlight module and display device
CN203641997U (en) Backlight module and liquid crystal display device
CN205248302U (en) LED photo engine structure
CN202327893U (en) LED (Light Emitting Diode) backlight module with excellent heat dissipation performance
CN205232672U (en) Heat radiator for LED display screen
CN204962678U (en) High -power LED lamp radiator unit of efficient
CN202165927U (en) Light bar structure and display device
TWI504993B (en) Backlight unit and display apparatus including the same
CN201878422U (en) Printed circuit board and backlight module using same
CN102200235A (en) Light-emitting diode (LED) light-emitting bar
CN203395840U (en) Fixing structure of reflector plate in light-emitting diode (LED) backlight module
CN206708822U (en) A kind of rapid thermal conduction LED light bar backing structure
CN105068311A (en) Backlight module group
CN204962674U (en) LED street lamp radiating device
CN202032395U (en) Back light source with light emitting diode (LED) module and LED module
CN204441322U (en) A kind of aluminium base of high-power high heat dispersion
CN203718516U (en) Heat radiator of bottom lighting type backlight module
RU103670U1 (en) SEMICONDUCTOR RADIATING MODULE

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140326