Background
Various wireless functions are widely used in electronic devices such as mobile phones, computers, MP3, MP4, and tablet computers, for example, Wlan, Bluetooth, GPRS, and 3G functions are all integrated in the devices, and the design and position of antennas of various wireless functions have a great influence on the performance of products. Most antenna designs are built-in at present, and under the condition in less mechanism space, put the space and receive serious extrusion, lead to the benefit not enough. Recently, a short-distance contactless Communication technology such as Near Field Communication (NFC) technology or Radio Frequency Identification (RFID) technology is also popular. Meanwhile, the addition of the wireless charging function increases the arrangement difficulty of the wireless charging receiving coil.
Therefore, many manufacturers set a part of antennas, coils, and the like, for example, NFC antennas, wireless charging receiving coils, and the like, inside the housing of the electronic device, so that new functions can be realized only by replacing one housing without redesigning and changing positions of components inside the device, thereby greatly saving the cost.
For example, if the RFID tag is integrated or attached to the inner side wall of the housing of the electronic device, and functions as a component of the device, the space is limited, and the RFID tag is inevitably attached to the surface of a conductive object such as metal or to a place near which a metal device is located. Therefore, the alternating electromagnetic field induced by the RFID label under the action of the signal sent by the card reader is easily subjected to the eddy current attenuation action of the metal, so that the signal intensity is greatly weakened, and the reading process fails. Therefore, in order to better read the card by using the product, a layer of ferrite material, such as a ferrite sheet, is generally covered on the RFID tag to absorb the electromagnetic waves, so as to prevent the electromagnetic waves from reaching the metal devices in the electronic device after passing through the RFID tag.
Similarly, the same problem is encountered with a wireless charging receiving coil disposed on the inside wall of the housing of the electronic device, and when the electronic device approaches the vicinity of the interaction electromagnetic field of the wireless charging device, an induced current is obtained on the wireless charging receiving coil inside the electronic device for charging. Meanwhile, some metal parts inside the electronic equipment, which are close to the wireless charging receiving coil, encounter an interaction electromagnetic field, so that an electron eddy current is generated in the metal parts, the electron eddy current generates a skin effect on the metal, heat energy is generated on the metal, the charging efficiency is reduced, and electric energy is wasted. Moreover, the interaction electromagnetic field can interfere with a circuit main board inside the electronic equipment to influence the normal operation of the whole electronic equipment. In this case, it is also generally necessary to cover the wireless charging receiving coil with a layer of ferrite material, such as a ferrite sheet, to cover the RFID tag so as to absorb the electromagnetic wave, so as to prevent the electromagnetic wave from reaching metal devices and other electronic components in the electronic device after passing through the wireless charging receiving coil.
Ferrite materials commonly used in electronic devices are generally manufactured into circular, cylindrical or sheet-shaped finished products by specialized manufacturers through an injection molding process. Electronic equipment manufacturers buy several types of ferrite sheet products in bulk and then attach them to the outside of an antenna or coil for absorbing electromagnetic waves. For example, CN102408230A discloses the composition and production process of ferrite particles suitable for injection molding process, and is incorporated herein by reference.
However, with the popularity of the personalization trend of electronic devices, the shapes of various antennas, coils and the like arranged on the housing are different, the surfaces are also uneven, and the purchased ferrite sheet is difficult to be tightly attached to the surfaces, so that the shielding effect on electromagnetic waves is poor. In order to overcome this drawback, it is often necessary to cover the antenna with a ferrite sheet having a larger area, but there is no more space on the housing of the electronic device to accommodate the extra parts, so that it is urgent to develop a ferrite material that can be manufactured individually to provide better electromagnetic shielding effect in a narrow space.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a ferrite module for an electronic device to reduce or avoid the above-mentioned problems.
In order to solve the technical problem, the utility model provides a ferrite module for electronic equipment, including a ferrite layer, the ferrite layer cover in antenna or the coil outside on the inside wall of electronic equipment's shell, the ferrite layer has a medial surface and a lateral surface, the medial surface have with the unanimous first outline surface of surface shape of antenna or coil one side, the lateral surface have with the inside wall of shell is relative the unanimous second outline surface of electronic equipment's inside shape.
Preferably, the first outer surface comprises a covering part attached to an outer surface of the antenna or coil, and an extending part attached to an inner side wall of the housing around the antenna or coil.
Preferably, the covering portion of the first outer face is concave.
Preferably, the second outer surface includes a flat portion, and a side portion connecting the flat portion and an inner side wall of the housing.
Preferably, the planar portion of the second outer surface is flush with the inner side wall of the housing.
Preferably, the second outer face has functional structure thereon associated with the housing.
Preferably, the functional structure comprises a snap structure for snapping the housing onto the electronic device.
Preferably, the functional structure comprises a snap-fit structure for mounting the other component to the housing.
The utility model provides a ferrite module for electronic equipment, it can be to the appearance of the inside wall of electronic equipment's shell, provides the ferrite layer that can individualize the antenna or coil that covers on it, has reduced the space between ferrite layer and antenna or coil, can provide better electromagnetic shield effect under narrow and small space.
Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described with reference to the accompanying drawings. Wherein like parts are given like reference numerals.
To solve the problems in the prior art, the present invention provides a ferrite module for electronic devices, which can be widely used in various electronic devices, such as mobile phones, computers, MP3, MP4, tablet computers, etc. The structure of the ferrite module and the method for manufacturing the same according to the present invention will be described in detail below with reference to the accompanying drawings by taking a mobile phone as an example.
Fig. 1 shows a ferrite module for an electronic device according to an embodiment of the present invention, in which reference numeral 1 denotes the ferrite module of the present invention, and reference numeral 2 denotes a housing of an electronic device, for example, a back housing of a mobile phone.
Specifically, the housing of the electronic device shown in the figure is a back housing 2 of a mobile phone, and an antenna or a coil 21 (shown by a dotted line in the figure), such as a Wlan antenna, an NFC antenna, an RFID tag, a wireless charging receiving coil, etc., is provided on the inner side wall of the housing 2.
The ferrite module 1 of the present invention includes a ferrite layer 11, the ferrite layer 11 covers the outside of the antenna or the coil 21.
The antenna or coil 21 is shown protruding from the inner side wall of the housing 2, and the ferrite layer 11 is closely attached to the outer side of the antenna or coil 21 to wrap the antenna or coil 21 on the inner side wall (fig. 2). Of course, it will be understood by those skilled in the art that the antenna or coil 21 may also be located in a recess in the inner side wall of the housing 2, and that the ferrite layer 11 fits closely against the outside of the antenna or coil 21 to wrap it in the recess (fig. 3), as described in further detail below.
As shown in fig. 2 and 3, wherein fig. 2 is a cross-sectional view of a ferrite module according to an embodiment of the present invention; fig. 3 shows a cross-sectional view of a ferrite module according to another embodiment of the present invention.
In the embodiment shown in fig. 2, the antenna or coil 21 protrudes from the inner side wall of the housing 2, and the ferrite layer 11 closely adheres to the outer side of the antenna or coil 21 and wraps the antenna or coil on the inner side wall. That is, the ferrite layer 11 has an inner side surface having a first outer surface 12 conforming to the shape of the outer surface of the antenna or coil 21 side and an outer side surface having a second outer surface 13 conforming to the shape of the interior of the electronic device opposite to the inner side wall of the housing.
Further, as shown in the figure, the first external surface 12 includes a covering portion 121 attached to the external surface of the antenna or coil 21, and an extending portion 122 attached to the internal side wall of the housing 2 around the antenna or coil 21. In the embodiment shown in the figures, the covering portion 121 of the first external face 12 is concave.
Further, the second outer surface 13 includes a flat portion 131, and a side portion 132 connecting the flat portion 131 and the inner side wall of the housing 2.
That is to say, ferrite layer 11 in the embodiment shown in fig. 2 is concave structure on the whole, and this concave structure can closely laminate with antenna or coil 21 surface, can also closely laminate with the inside wall of shell 2, therefore, the utility model discloses a ferrite layer 11 of ferrite module 1 can provide ferrite layer 11 that can individuation cover antenna or coil 21 above that to the appearance of the inside wall of electronic equipment's shell 2, has reduced the space between ferrite layer 11 and antenna or coil 21, can provide better electromagnetic shield effect under narrow and small space.
It will be appreciated by those skilled in the art that although the inside walls of the housing 2 are shown to appear flat and the antenna or coil 21 also appears flat, in practice, they may be uneven in surface. For example, if the antenna or coil 21 is a coil of copper wire, there may be some irregularities or gaps between the copper wires. In addition, since many pits or projections are inevitably present on the inner side wall of the housing 2, the inner side wall of the periphery of the antenna or coil 21 may also be rugged. Therefore, the first outer surface 12 of the ferrite layer 11 of the ferrite module 1 of the present invention is conformed to the outer shape of the antenna or the coil 21 and the inner side wall around them.
Similarly, as shown in figure 3, the antenna or coil 21 is located in a recess in the inner side wall of the housing 2 and the ferrite layer 11 fits closely around the outside of the antenna or coil 21 to surround it. That is, the ferrite layer 11 also has an inner side having a first outer surface 12 conforming to the shape of the outer surface of the antenna or coil 21 side and an outer side having a second outer surface 13 conforming to the shape of the interior of the electronic device opposite the inner side wall of the housing.
Further, as shown in the figure, the first external surface 12 includes a covering portion 121 attached to the external surface of the antenna or coil 21, and an extending portion 122 attached to the internal side wall of the housing 2 around the antenna or coil 21. In the embodiment shown in the figures, the covering portion 121 of the first external face 12 is concave. Of course, if the antenna or coil 21 is entirely jammed in the recess without any clearance at the periphery, then the first outer face 12 has only the cover portion 121 and no extension.
Further, the second outer surface 13 includes a flat portion 131, and a side portion 132 connecting the flat portion 131 and the inner side wall of the housing 2.
As shown, the second outer surface 13 is generally flat so as not to interfere with the arrangement of internal components, generally in order to conform to the internal shape of the electronic device opposite to the inner side wall of the housing 2, and the flat portion 131 of the second outer surface 13 is not only flat but also flush with the inner side wall of the housing 2, so that there is no protruding portion interfering with the internal components.
Ferrite layer 11 in the embodiment shown in fig. 3 is also a concave structure as a whole, and this concave structure can closely laminate with antenna or coil 21 surface, can also closely laminate with the inside wall of shell 2, therefore, the utility model discloses a ferrite layer 11 of ferrite module 1 can provide ferrite layer 11 that can individualize the antenna or coil 21 that covers on it to the appearance of the inside wall of shell 2 of electronic equipment, has reduced the space between ferrite layer 11 and antenna or coil 21, can provide better electromagnetic shield effect under narrow and small space. Of course, as described above, if the antenna or coil 21 is entirely stuck in the recess without any gap in the periphery, the ferrite layer 11 has a flat sheet-like structure as a whole, and the edge thereof closely contacts the side wall of the recess.
In addition, in a specific embodiment, the second outer surface 13 may further have a functional structure (not shown) associated with the housing, and the functional structure may include a fastening structure for fastening the housing to the electronic device, and may also include a fastening structure for mounting other components to the housing. That is to say, in the ferrite module 1 of the present invention, the inner side surface of the ferrite layer 11 is closely attached to the inner side wall of the antenna or the coil 21 and the housing 2, so that a good electromagnetic shielding effect is ensured. While the outer side of the ferrite layer 11 may have any second outer side 13 conforming to the internal shape of the electronic device, said second outer side 13 may be generally flat, may be provided in any shape that does not interfere with the arrangement of internal components, or may be adapted to the internal shape and designed to have other functions. For example, a snap structure may be designed to allow the housing 2 to be snapped onto the electronic device, i.e., the ferrite layer 11 may be used as a part of the housing 2. Alternatively, a snap structure for locking a camera, a speaker net, or the like to the housing 2 may be provided.
The structure of the ferrite module according to the present invention is described above, which is closely related to the manufacturing method to be described below, that is, the ferrite module according to the present invention can be designed into the above-mentioned shape by a manufacturing method that is customized specifically.
Specifically, the present embodiment provides a method for manufacturing a ferrite module for an electronic device, the ferrite module including a ferrite layer covering an antenna or a coil on an inner side wall of a housing of the electronic device, the ferrite layer having an inner side surface and an outer side surface, the inner side surface having a first outer surface conforming to an outer surface shape of a side of the antenna or the coil, the outer side surface having a second outer surface conforming to an inner shape of the electronic device opposite to the inner side wall of the housing, the method comprising the steps of: first providing a first mold having a first mold surface conforming to the first outer surface of the ferrite layer and a second mold having a second mold surface conforming to the second outer surface of the ferrite layer; and then after the first mold and the second mold are buckled, injecting ferrite filler in a space where the first molded surface and the second molded surface are buckled to form the ferrite layer.
That is, based on the shape of the first outer surface 12 of the antenna or coil 21, the first mold completely conforming to the shape thereof can be provided, and then based on the shape of the second outer surface 13 designed according to the internal shape of the electronic device, the second mold completely conforming to the shape thereof can be provided, and the ferrite layer 11 is formed by injection molding in the internal cavities of the two molds, so that the ferrite module 1 of the present invention can be obtained.
In a preferred embodiment, the first mould is the electronic device housing 2 itself provided with the antenna or coil 21. That is, the method of the present embodiment is completely described as follows:
a method of manufacturing a ferrite module for an electronic device, the ferrite module comprising a ferrite layer covering an antenna or coil on an inside wall of a housing of the electronic device, the ferrite layer having an inside surface and an outside surface, the inside surface having a first outer shape conforming to an outer shape of a side of the antenna or coil, the outside surface having a second outer shape conforming to an inner shape of the electronic device opposite the inside wall of the housing, the method comprising the steps of: providing a second mold having a second profile conforming to the second profile of the ferrite layer, with the electronic device housing 2 itself provided with the antenna or coil 21 as the first mold; and then after the first mold and the second mold are buckled, injecting ferrite filler in a space where the first mold and the second molded surface are buckled to form the ferrite layer.
That is, in the present embodiment, there is no need to separately manufacture one first mold, but the electronic device case 2 and the antenna or coil 21 themselves are made as a part of the mold. For example, when manufacturing, the inner side wall of the electronic device housing 2 is upward fixed on a production line through a clamp, after the electronic device housing 2 is in place, a second mold is directly covered on the inner side wall of the electronic device housing 2, and then the ferrite layer 11 is formed in a cavity formed by the second mold and the electronic device housing 2 in an injection molding mode. In this embodiment, no matter what the shape of the antenna or the coil 21 on the electronic device case 2 is, the ferrite is filled in the gap around the antenna or the coil 21 by only covering the second mold and performing injection molding, so that the ferrite layer is obtained without any gap. In particular, and as often as in the configuration shown in fig. 3, the first mold is the casing 2 itself and the second mold may be a plate covering the recess, and injection molding between the recess and the second mold results in a surface flush with the inner side wall of the casing 2.
The utility model provides a ferrite module for electronic equipment, it can be to the appearance of the inside wall of electronic equipment's shell, provides the ferrite layer that can individualize the antenna or coil that covers on it, has reduced the space between ferrite layer and antenna or coil, can provide better electromagnetic shield effect under narrow and small space.
It is to be understood by those skilled in the art that while the present invention has been described in terms of several embodiments, it is not intended that each embodiment cover a separate embodiment. The description is given for clearness of understanding only, and it is to be understood that all matters in the embodiments are to be interpreted as including all technical equivalents which are encompassed by the claims.
The above description is only exemplary of the present invention, and is not intended to limit the scope of the present invention. Any equivalent changes, modifications and combinations that may be made by those skilled in the art without departing from the spirit and principles of the invention should be considered within the scope of the invention.